TWI740971B - Substrate breaking device - Google Patents

Abstract

The present invention provides a substrate breaking device that can use a simple structure to break a substrate.

The substrate cutting device 1 has a first dividing unit 17. The first dividing unit 17 has: a pair of first support bars 25 arranged on the side of the first substrate W1 and arranged on both sides of the substrate conveying direction of the second scribe line S2 when the second substrate W2 is divided; and the first The rupture plate 27 is relatively movably disposed between the pair of first support bars 25, and is disposed in a manner corresponding to the first scribe line S1 when the first substrate W1 is divided. The first dividing unit 17 has: a first moving mechanism, which is installed on a pair of first supporting bars 25, so that the pair of supporting bars 25 and the first rupture plate 27 are moved in the approach/away direction relative to the first substrate W1; And a second moving mechanism, which is installed between the pair of support bars 25 and the first rupture plate 27, relative to the pair of support bars 25, the first rupture plate 27 is from a pair of front ends of the first rupture plate 27 It moves between the action position where the front end of the support bar 25 protrudes and the non-action position where the front end of the support bar 25 retracts.

Description

Substrate breaking device

The present invention relates to a substrate cutting device, in particular to a substrate cutting of a bonded substrate formed by bonding a first substrate formed with a first scribe line and a second substrate formed with a second scribe line Device.

Previously, the separation of the substrate was performed by forming scribing lines on both sides of the substrate, and breaking the substrate by applying a specific force to the upper and lower surfaces of the substrate along the formed scribing lines (for example, refer to Patent Document 1).

The substrate cutting device described in Patent Document 1 has: a conveying unit that conveys a substrate from upstream to downstream; a first breaking unit that breaks the lower substrate along a scribe line formed on the lower surface; and a scribe along the upper surface. Line cracks the second cracking unit of the upper substrate. Any one of the first fracturing unit and the second fracturing unit has a rupture plate and a supporting bar disposed at positions opposite to each other in the up and down direction.

[Prior Technical Literature] [Patent Literature]

[Patent Document 1] JP 2014-200940 A

However, in the substrate cutting device described in the above-mentioned patent document, the first breaking unit and the second breaking unit are arranged side by side with an interval in the substrate conveying direction. Therefore, there is a problem that the size of the device becomes larger and the structure becomes complicated.

The object of the present invention is to provide a substrate cutting device that can use a simple structure to break the substrate.

The following describes a plurality of aspects as a means to solve the problem. These aspects can be combined arbitrarily as needed.

A substrate cutting device according to an aspect of the present invention is a device for cutting a bonded substrate formed by bonding a first substrate on which a first scribe line is formed and a second substrate on which a second scribe line is formed.

The first dividing unit has: a pair of first receiving members arranged on the side of the first substrate, and arranged on both sides of the substrate conveying direction of the second scribing line when the second substrate is divided; and a first breaking member, which It is relatively movably arranged between a pair of first receiving members, and arranged to correspond to the first scribe line when the first substrate is divided.

The first dividing unit has: a first moving mechanism that is mounted on a pair of first receiving members to move the pair of first receiving members and the first breaking member in the approaching/away direction relative to the first substrate; and second The moving mechanism is installed between the pair of first receiving members and the first breaking member, so that the first breaking member is from the pair of first receiving members at the front end of the first breaking member with respect to the pair of first receiving members Move between the action position where the front end protrudes and the non-action position where the front ends of the pair of first receiving members retract.

The substrate cutting device may further include a second dividing unit.

The second dividing unit has: a pair of second receiving members, which are arranged on the side of the second substrate, and are arranged on both sides of the substrate conveying direction of the first scribe line when the first substrate is divided; and the second fracture The member is relatively movably arranged between the pair of second receiving members, and is arranged to correspond to the second scribe line when the second substrate is divided.

The second dividing unit has: a second moving mechanism, which is mounted on a pair of second receiving members so that one The second receiving member and the second breaking member move together with respect to the third substrate in the approach/away direction; and the fourth moving mechanism, which is installed between a pair of the second receiving member and the second breaking member, facing each other In the pair of second receiving members, the operating position where the second breaking member protrudes from the front end of the pair of second receiving members at the front end of the second breaking member and the non-operating position where the front ends of the pair of second receiving members are retracted Move between.

It is possible to apply a load to the first scribe line of the first substrate by the first breaking member of the first dividing unit in a state where one of the second dividing units supports the second receiving member Instead of pressing against it, the second dash is broken.

It is possible to apply a load to the second scribe line of the second substrate by the second breaking member of the second dividing unit in a state where one of the first dividing units supports the first receiving member Instead of pressing against it, the first dash is broken.

According to the substrate cutting device of the present invention, the substrate can be broken with a simple structure.

1: Substrate breaking device

3: The first transfer unit

5: Fracture unit

7: The second transport unit

11a: Roll

11b: Roll

13: belt

17: The first division unit

19: The second division unit

21: Conveying noodles

25: Support Article 1

27: The first cracked plate

29: Support Article 2

31: The second fractured board

34: Conveying noodles

35a: Roll

35b: Roll

37: belt

51: The first moving mechanism

53: The second moving mechanism

55: 3rd moving mechanism

57: 4th moving mechanism

71: 1st drive motor

72: 2nd drive motor

81: Controller

S1: Scribe 1

S2: Scribe 2

W: Laminated substrate

W1: The first substrate

W2: The second substrate

X: Arrow

Y: Arrow

Fig. 1 is a schematic perspective view of a substrate cutting device according to an embodiment of the present invention.

Fig. 2 is a schematic diagram showing the principle structure of the first dividing unit.

Fig. 3 is a block diagram showing the control structure of the substrate cutting device.

The figure is the flow chart of the fracture control action.

FIG. 5 is a schematic diagram showing the arrangement of the first dividing unit and the second dividing unit for explaining the dividing operation of the first substrate.

6 is a schematic diagram showing the arrangement of the first dividing unit and the second dividing unit for explaining the dividing operation of the first substrate.

Fig. 7 is a display of the first division unit and the second division unit for explaining the division operation of the second substrate Schematic diagram of Yuan Zhi's configuration.

FIG. 8 is a schematic diagram showing the arrangement of the first dividing unit and the second dividing unit for explaining the dividing operation of the second substrate.

1. The first embodiment (1) Outline of the substrate breaking device

The substrate cutting device 1 (an example of the substrate cutting device) will be described with reference to FIG. 1. Fig. 1 is a schematic perspective view of a substrate cutting device according to an embodiment of the present invention. In addition, the left-right direction in FIG. 1 is the substrate transport direction (arrow X), the left side is the upstream side, and the right side is the downstream side.

The substrate cutting device 1 is a device for breaking the bonded substrate along the scribe line S formed on both surfaces of the bonded substrate W (hereinafter referred to as "substrate W"). The substrate breaking device 1 is a device for breaking the substrate W. The substrate W is formed by bonding the first substrate W1 on which the first scribe line S1 is formed and the second substrate W2 on which the second scribe line S2 is formed.

The substrate cutting device 1 has a first conveying unit 3, a breaking unit 5, and a second conveying unit 7 in this order from upstream. In addition, the units can be moved toward the upstream side or the downstream side in such a way that the interval between them can be changed.

The substrate W constitutes, for example, a liquid crystal layer between the second substrate W2 and the first substrate W1. In addition, a plurality of sealing members (not shown) of the substrate W are arranged between the second substrate W2 and the first substrate W1, and the liquid crystal layer is surrounded by the sealing members. The sealing member is configured to be the number of bonded substrates after rupture.

The substrate W is transported in a state where the second substrate W2 is arranged on the upper side and the first substrate W1 is arranged on the lower side. On the upper surface of the substrate W (the surface on the second substrate W2 side), a plurality of second scribing lines S2 are formed at predetermined intervals in the substrate conveying direction. In addition, in this embodiment, the extending direction of the first scribing line S1 and the second scribing line S2 is in the direction orthogonal to the substrate conveying direction (arrow Y), but the direction of the scribing line There is no specific restriction on the direction. In addition, the substrate W has a plurality of first scribe lines S1 formed on the lower surface (the surface on the side of the first substrate W1). The first scribing line S1 and the second scribing line S2 are formed at positions corresponding to each other.

The first conveying unit 3 is a device for conveying the substrate W to the downstream side in the substrate conveying direction, and is constituted by, for example, a belt conveyor. Specifically, the first conveying unit 3 has a pair of rollers 11a and 11b and a belt 13 wound around the rollers. The first drive motor 71 (FIG. 3) rotates and drives the respective rollers 11 a and 11 b clockwise, and the belt 13 conveys the substrate W toward the downstream side in the substrate conveyance direction.

The breaking unit 5 is provided on the downstream side of the first conveying unit 3 in the substrate conveying direction. The breaking unit 5 has a first dividing unit 17 and a second dividing unit 19. The first dividing unit 17 and the second dividing unit 19 are arranged at opposing positions in the vertical direction. In more detail, the first dividing unit 17 and the second dividing unit 19 are arranged at opposite positions across the conveyance path of the substrate W, the first dividing unit 17 is arranged below the conveying path, and the second dividing unit 19 is arranged at Above the conveying path.

The first dividing unit 17 has a pair of first support bars 25 (an example of a pair of first receiving members). The pair of first support bars 25 are arranged on the side of the first substrate W1, and are arranged so as to be located on both sides of the second scribe line S2 in the substrate conveying direction when the second substrate W2 is divided. Each first support bar 25 extends in a direction parallel to the conveying surface 21 of the first conveying unit 3 and orthogonal to the substrate conveying direction. The upper portion of each first support bar 25 is formed in a triangular column shape extending in a direction parallel to the conveying surface 21 and orthogonal to the substrate conveying direction. In addition, the upper portion of each first support bar 25 has a tapered shape that becomes thinner toward the tip. The ridge portion at the front end of each first support bar 25 is a support portion that is in contact with the substrate W.

The first division unit 17 has a first rupture plate 27 (an example of a first rupture member). The first rupture plate 27 is arranged to be relatively movable in the vertical direction between the pair of first support bars 25, and is arranged to correspond to the first scribe line S1 when the first substrate W1 is divided. The first rupture plate 27 extends in a direction parallel to the transport surface 21 of the first transport unit 3 and orthogonal to the substrate transport direction. The lower part of the first rupture plate 27 is formed to extend in a direction parallel to the conveying surface 21 and perpendicular to the substrate conveying direction. It stretches into a triangular column shape, and has a tapered shape that becomes thinner toward the tip. The ridge portion at the front end of each first rupture plate 27 is a pressing portion that comes into contact with the substrate W during the rupture operation.

The first rupture plate 27 is provided so as to be able to rise and fall between the operating position and the non-operating position with respect to the pair of first support bars 25. The front end of the first rupture plate 27 at the operating position is more protruding than the front ends of the pair of first support bars 25. When the first rupture plate 27 is in the non-operating position, its front end is retracted relative to the front end of the pair of first support bars 25.

The second dividing unit 19 has a pair of second support bars 29 (an example of a pair of second receiving members). A pair of second support bars 29 are arranged on the side of the second substrate W2, and are arranged so as to be located on both sides of the first scribe line S1 in the substrate conveying direction when the first substrate W1 is divided. Each second support bar 29 extends in a direction parallel to the transport surface 21 of the first transport unit 3 and orthogonal to the substrate transport direction. The upper portion of each second support bar 29 is formed in a triangular column shape extending in a direction parallel to the conveying surface 21 and orthogonal to the substrate conveying direction. In addition, the upper portion of each second support bar 29 has a tapered shape that becomes thinner toward the tip. The ridge portion at the front end of each second support bar 29 is a support portion that is in contact with the substrate W.

The second division unit 19 has a second rupture plate 31 (an example of a second rupture member). The second rupture plate 31 is arranged to be relatively movable in the vertical direction between the pair of second support bars 29, and is arranged to correspond to the second scribe line S2 when the second substrate W2 is divided. The second rupture plate 31 extends in a direction parallel to the conveying surface 21 of the first conveying unit 3 and orthogonal to the substrate conveying direction. The upper portion of the second rupture plate 31 is formed in a triangular column shape extending in a direction parallel to the conveying surface 21 and perpendicular to the substrate conveying direction, and has a tapered shape that becomes thinner toward the tip. The ridge portion at the front end of the second rupture plate 31 is a pressing portion that contacts the substrate W during the rupture operation.

The second rupture plate 31 is installed relative to the pair of second support bars 29 and can be raised and lowered between the operating position and the non-operating position. When the second rupture plate 31 is in the operating position, its front end is more protruding than the front end of the pair of second support bars 29. When the second rupture plate 31 is in the non-operating position, its front end is opposite to the pair of second Support bar 29 retreats at the front end.

The second transport unit 7 transports the divided substrate placed on the transport surface 34 downstream. The second conveyance unit 7 has a pair of rollers 35a and 35b, a belt 37 wound around the rollers, and a second drive motor 72 (FIG. 3). Since the second conveying unit 7 has the same configuration as the first conveying unit 3 described above, a detailed description thereof will be omitted.

(2) Details of the first division unit and the second division unit

The first dividing unit 17 and the second dividing unit 19 will be further described using FIG. 2. Fig. 2 is a schematic diagram showing the principle structure of the first dividing unit.

The first dividing unit 17 has a first moving mechanism 51. The first moving mechanism 51 is mainly attached to the pair of first support bars 25 and moves the pair of first support bars 25 together with the first rupture plate 27 in the vertical direction. Thereby, the pair of first support bars 25 can move between the position away from the substrate W at the front end and the contact position where the front end abuts against the substrate W. The first moving mechanism 51 is a well-known device such as a ball screw mechanism and an air cylinder.

The first dividing unit 17 has a second moving mechanism 53. The second moving mechanism 53 is installed between the pair of first support bars 25 and the first rupture plate 27, and relative to the pair of first support bars 25, the first rupture plate 27 is between the operating position and the non-operating position Move in the up and down direction. In this embodiment, the second moving mechanism 53 is a ball screw mechanism. The second moving mechanism 53 may also be another device.

The second dividing unit 19 has the same structure as the first dividing unit 17. Therefore, the description of the use of the diagrams is omitted.

The second dividing unit 19 has a third moving mechanism 55 (FIG. 3 ). The third moving mechanism 55 is mainly attached to a pair of second support bars 29 and moves the pair of second support bars 29 together with the second rupture plate 31 in the vertical direction. Thereby, the pair of second support bars 29 can move between the position away from the substrate W where the front end is away from the substrate W and the contact position where the front end abuts against the substrate W.

The second dividing unit 19 has a fourth moving mechanism 57 (FIG. 3 ). The fourth moving mechanism 57 is installed between the pair of second support bars 29 and the second rupture plate 31, and relative to the pair of second support bars 29, the second rupture plate 31 is between the operating position and the non-operating position Move in the up and down direction.

(3) The control structure of the fracture unit

The control structure of the substrate cutting device 1 will be described using FIG. 3. Fig. 3 is a block diagram showing the control structure of the substrate cutting device.

The substrate cutting device 1 has a controller 81. The controller 81 is a computer system having a processor (such as a CPU), a memory device (such as ROM, RAM, HDD, SSD, etc.), and various interfaces (such as an A/D converter, a D/A converter, a communication interface, etc.). The controller 81 performs various control actions by executing programs stored in the memory portion (corresponding to part or all of the memory area of the memory device).

The controller 81 may be composed of a single processor, or may be composed of a plurality of independent processors for various controls.

A part or all of the functions of each element of the controller 81 can be implemented in a program executable in the computer system constituting the controller 81. In addition, part of the function of each element of the control unit can also be formed by a customized IC.

The first drive motor 71, the second drive motor 72, the first movement mechanism 51, the second movement mechanism 53, the third movement mechanism 55, and the fourth movement mechanism 57 are connected to the controller 81. The controller 81 can drive these devices.

Although not shown in the figure, the controller 81 is connected with a sensor for detecting the size, shape and position of the substrate W, sensors and switches for detecting the state of each device, and an information input device.

(4) Fracture action

The breaking action of the substrate W of the substrate breaking device 1 will be explained using FIGS. 4 to 8. Figure 4 Series fracture Flow chart of control action. 5 and 6 are schematic diagrams showing the arrangement of the first dividing unit and the second dividing unit for explaining the dividing operation of the first substrate. 7 and 8 are schematic diagrams showing the arrangement of the first dividing unit and the second dividing unit for explaining the dividing operation of the second substrate.

The control flow chart described below is an example, and each step can be omitted and replaced as needed. In addition, a plurality of steps may be executed at the same time, and some or all of them may be executed overlapped.

Furthermore, each block of the control flowchart is not limited to a single control action, and can be replaced with a plurality of control actions represented by a plurality of blocks.

Initially, the substrate W with scribe lines formed on both sides by a scribing device not shown is placed on the conveying surface 21 of the first conveying unit 3.

In step S1, the first transport unit 3 transports the substrate W toward the downstream side in the substrate transport direction. Specifically, the controller 81 drives the first drive motor 71 to move the belt 13 a certain distance (the distance between the scribe lines). Thereby, the first scribe line S1 and the second scribe line S2 of the substrate W are arranged at the breaking position of the breaking unit 5.

At this time, the first dividing unit 17 and the second dividing unit 19 are both separated from the substrate W in the vertical direction. In addition, the first rupture plate 27 and the second rupture plate 31 are both located in the non-operating position.

In step S2, as shown in FIG. Specifically, the controller 81 drives the third moving mechanism 55 to make the pair of second support bars 29 abut on the second substrate W2 of the substrate W. At this time, the front ends of the pair of second support bars 29 abut on both sides of the second scribe line S2 in the substrate conveying direction.

In Step S3, as shown in FIG. Specifically, the controller 81 drives the second moving mechanism 53 so that the first rupture plate 27 abuts on the first scribe line S1 of the first substrate W1 of the substrate W. Thereby, the first substrate W1 is broken along the first scribe line S1. In addition, during the breaking action, the substrate W is The second support article 29 is supported from the upper side.

In step S4, in the first dividing unit 17, the first rupture plate 27 moves to the non-operating position. Specifically, the controller 81 drives the second moving mechanism 53 to move the first rupture plate 27 to the non-operating position.

In step S5, as shown in FIG. Specifically, the controller 81 drives the third moving mechanism 55 to move the pair of second support bars 29.

In step S6, as shown in FIG. Specifically, the controller 81 drives the first moving mechanism 51 so that the pair of first support bars 25 abut the first substrate W1 of the substrate W. At this time, the front ends of the pair of first support bars 25 abut on both sides of the first scribe line S1 in the substrate conveying direction.

In step S7, as shown in FIG. 8, in the second dividing unit 19, the second rupture plate 31 moves to a position where it abuts against the second substrate W2 of the substrate W. Specifically, the controller 81 drives the fourth moving mechanism 57 so that the second rupture plate 31 abuts on the second scribe line S2 of the second substrate W2 of the substrate W. Thereby, the first substrate W1 is broken along the first scribe line S1. In addition, during this breaking operation, the substrate W is supported by the pair of first support bars 25 from the lower side.

In step S8, in the second dividing unit 19, the second rupture plate 31 moves to the non-operating position. Specifically, the controller 81 drives the fourth moving mechanism 57 to move the second rupture plate 31 to the non-operating position.

In step S9, in the first dividing unit 17, the pair of first support bars 25 are moved to a position away from the substrate W. Specifically, the controller 81 drives the first moving mechanism 51 to move the pair of first support bars 25.

As described above, as shown in FIGS. 5 and 6, in the operation of dividing the first scribing line S1, the 2 In a state where the front end of the split plate 31 is in a retracted position with respect to the front end of the pair of second support bars 29, the front end of the pair of second support bars 29 abuts against the second substrate W2. Moreover, as the front end of the first rupture plate 27 protrudes with respect to the front ends of the pair of first support bars 25, the front end of the first rupture plate 27 applies a load to the first scribe line S1 of the first substrate W1. Abut.

As shown in FIGS. 7 and 8, in the action of dividing the second scribing line S2, in the state where the front end of the first rupture plate 27 is at a retracted position relative to the front end of the pair of first support bars 25, one The front end of the first support bar 25 abuts on the first substrate W1. Moreover, as the front end of the second rupture plate 31 protrudes relative to the front ends of the pair of second support bars 29, the front end of the second rupture plate 31 applies a load to the second scribe line S2 of the second substrate W2. Abut.

To sum up the above, in the substrate cutting device 1, in the operation of dividing the second scribing line S2, one of the second dividing units 19 functions as a supporting bar for the second supporting bar 29, and the first dividing unit 17 is the first supporting bar. The rupture plate 27 is in contact with the first scribe line S1 as a rupture plate.

In the movement of dividing the first scribing line S1, one of the first dividing units 17 functions as a supporting bar for the first supporting bar 25, and the second splitting plate 31 of the second dividing unit 19 abuts against the first splitting plate as a splitting plate. 2 Underline S2.

In this way, since each of the first dividing unit 17 and the second dividing unit 19 has a split plate and a support bar, the first dividing unit 17 and the second dividing unit 19 can be used to separate the first scribe line S1 and The second scribe line S2. As a result, the size of the substrate conveying direction of the substrate cutting device 1 becomes shorter, so that the substrate W can be broken with a simple structure.

2. Other implementation forms

The above has described one embodiment of the present invention, but the present invention is not limited to the above-mentioned embodiment, and various changes can be made without departing from the spirit of the invention. In particular, the plural embodiments and modifications described in this specification can be combined arbitrarily as needed.

In the above-mentioned embodiment, the bonded substrate is ruptured by raising and lowering the rupture plate at the operating position, but it is not particularly limited to this. For example, the substrate can be broken for the lifting of the support bar, or the substrate can be broken by the simultaneous lifting of the rupture plate and the support bar.

In the above-mentioned embodiment, the rupture plate abuts against the substrate W by relative movement with respect to the pair of support bars, but it is not particularly limited to this. For example, the rupture plate may also abut against the substrate W by moving integrally with the supporting bar in a state where it protrudes from the supporting bar.

[Industrial availability]

The present invention can be widely applied to a substrate cutting device for cutting a bonded substrate formed by bonding a first substrate formed with a first scribe line and a second substrate formed with a second scribe line.

17: The first division unit

25: Support Article 1

27: The first cracked plate

51: The first moving mechanism

53: The second moving mechanism

X: Arrow

Claims (3)

A substrate cutting device is a device for cutting a bonded substrate formed by bonding a first substrate formed with a first scribe line and a second substrate formed with a second scribe line, and is provided with a first dividing unit, It has: a pair of first receiving members, which are arranged on the side of the first substrate, and are arranged on both sides of the substrate conveying direction of the second scribe line when the second substrate is divided; and a first fracture The member is relatively movably arranged between the pair of first receiving members, and is arranged in a manner corresponding to the first scribe line when the first substrate is divided; and the first dividing unit has: a first A moving mechanism, which is mounted on the pair of first receiving members, so that the pair of first receiving members and the first breaking member move relative to the first substrate in the approach/away direction; and a second moving mechanism, which Installed between the pair of first receiving members and the first breaking member, with respect to the pair of first receiving members, the first breaking member is located at the front end of the first breaking member from the pair of first The moving position where the front end of the receiving member protrudes and the non-operating position retracted from the front end of the pair of first receiving members are moved. The substrate cutting device of claim 1, further comprising a second dividing unit having: a pair of second receiving members arranged on the side of the second substrate and positioned at the first substrate when the first substrate is separated 1 is arranged on both sides of the substrate conveying direction of the scribe line; and the second breaking member, which is relatively movably arranged between the pair of second receiving members, corresponds to the aforementioned when the second substrate is divided The second scribing method is arranged; and the second dividing unit has: a third moving mechanism installed on the pair of second receiving members so that the pair of second receiving members and the second breaking member are opposed to each other together The second substrate moves in the approach/away direction; and the fourth moving mechanism, which is mounted on the pair of second receiving structures Between the second breaking member and the second breaking member, relative to the pair of second receiving members, the operation position where the second breaking member protrudes from the front end of the pair of second receiving members at the front end of the second breaking member It moves between the non-operating position retracted from the front ends of the pair of second receiving members. The substrate cutting device of claim 2, wherein in a state where the pair of second receiving members of the second dividing unit supports the second substrate, the first breaking member of the first dividing unit is aligned The load is applied to the first scribe line of the first substrate and the second scribe line is divided by pressing against it; in the state where the pair of first receiving members of the first dividing unit supports the first substrate, The second breaking member of the second dividing unit is pressed against the second scribing line of the second substrate by applying a load to the second scribing line, thereby breaking the first scribing line.

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