JP2018083309A - Substrate cutting device - Google Patents

Abstract

Provided is a substrate cutting device capable of breaking a bonded substrate with a simple configuration. A first division unit is disposed on a first substrate W1 side, and a pair of first receiving members 25 disposed on both sides of a second scribe line S2 in a substrate transport direction when the second substrate W2 is divided. A first break bar 27 is disposed between the pair of first receiving members 25 so as to be relatively movable, and is arranged to correspond to the first scribe line S1 when the first substrate W1 is cut. The first split unit 17 is exclusively attached to the pair of first receiving members 25, and moves the pair of receiving members 25 and the first break bar 27 toward and away from the first substrate W1. The mechanism is exclusively attached to the pair of first receiving members 25, and the non-operating position is such that the distal ends of the first break bars 27 project from the distal ends of the pair of receiving members 25 and are retracted from the distal ends of the pair of receiving members 25. And a second moving mechanism for moving between the positions. [Selection diagram] Fig. 1

Description

  The present invention relates to a substrate cutting apparatus, and more particularly to a substrate cutting apparatus that cuts a bonded substrate formed by bonding a first substrate on which a first scribe line is formed and a second substrate on which a second scribe line is formed.

Conventionally, the substrate is divided by forming a scribe line on both sides of the substrate and then breaking the substrate by applying a predetermined force to the upper and lower surfaces of the substrate along the formed scribe line (for example, , See Patent Document 1).
The substrate cutting apparatus described in Patent Document 1 includes a transport unit that transports a substrate from upstream to downstream, a first break unit that breaks the lower substrate along a scribe line formed on the lower surface, and a scribe formed on the upper surface. And a second break unit that breaks the upper substrate along the line. Each of the first break unit and the second break unit has a break bar and a backup bar arranged at positions facing each other in the vertical direction.

JP 2014-200940 A

  However, in the substrate cutting apparatus described in the above-mentioned patent document, the first break unit and the second break unit are arranged so as to be spaced apart in the substrate transport direction. For this reason, there exists a problem that an apparatus enlarges and a structure becomes complicated.

  An object of the present invention is to provide a substrate cutting apparatus that can break a substrate with a simple configuration.

  Hereinafter, a plurality of modes will be described as means for solving the problems. These aspects can be arbitrarily combined as necessary.

A substrate cutting device according to an aspect of the present invention is a device that cuts a bonded substrate formed by bonding a first substrate on which a first scribe line is formed and a second substrate on which a second scribe line is formed.
The first divided unit is disposed on the first substrate side, and is relatively between the pair of first receiving members and the pair of first receiving members disposed on both sides of the second scribe line in the substrate transport direction when the second substrate is divided. A first break member that is movably disposed and disposed to correspond to the first scribe line when the first substrate is divided.
A first moving unit that is exclusively attached to the pair of first receiving members and moves the pair of first receiving members and the first break member toward and away from the first substrate; The first break member is interposed between the pair of first receiving members and the first break member, and the tip of the first break member is the tip of the pair of first receiving members. And a second moving mechanism for moving between the operating position protruding from the front end and the non-operating position retracted from the tip of the pair of first receiving members.

The substrate cutting apparatus may further include a second division unit.
The second division unit is disposed on the second substrate side, and a pair of second receiving members and a pair of second receivers disposed so as to be positioned on both sides of the first scribe line in the substrate transport direction when the first substrate is divided. And a second break member disposed so as to be relatively movable between the members and disposed so as to correspond to the second scribe line when the second substrate is divided.
A second moving unit that is exclusively attached to the pair of second receiving members and moves both the pair of second receiving members and the second break member toward and away from the second substrate; The second break member is interposed between the pair of second receiving members and the second break member, and the tip of the second break member is a pair of second receiving members with respect to the pair of second receiving members. And a fourth moving mechanism that moves between an operating position protruding from the tip and a non-operating position retracted from the tip of the pair of second receiving members.

In a state where the pair of second receiving members of the second division unit supports the second substrate, the first break member of the first division unit hits the first scribe line of the first substrate so as to apply a load. The scribe line may be divided.
When the pair of first receiving members of the first divided unit supports the first substrate, the second break member of the second divided unit hits the second scribe line of the second substrate so as to apply a load, so that the first The scribe line may be divided.

  In the substrate cutting apparatus according to the present invention, the substrate can be broken with a simple configuration.

1 is a schematic perspective view of a substrate cutting apparatus according to an embodiment of the present invention. The schematic diagram which shows the principle structure of a 1st division | segmentation unit. The block diagram which shows the control structure of a board | substrate cutting device. The flowchart of a break control operation. The schematic diagram which shows arrangement | positioning of the 1st division | segmentation unit and 2nd division | segmentation unit for demonstrating the division | segmentation operation | movement of a 1st board | substrate. The schematic diagram which shows arrangement | positioning of the 1st division | segmentation unit and 2nd division | segmentation unit for demonstrating the division | segmentation operation | movement of a 1st board | substrate. The schematic diagram which shows arrangement | positioning of the 1st division | segmentation unit and 2nd division | segmentation unit for demonstrating the division | segmentation operation | movement of a 2nd board | substrate. The schematic diagram which shows arrangement | positioning of the 1st division | segmentation unit and 2nd division | segmentation unit for demonstrating the division | segmentation operation | movement of a 2nd board | substrate.

1. First Embodiment (1) Outline of Substrate Cutting Device A substrate cutting device 1 (an example of a substrate cutting device) will be described with reference to FIG. FIG. 1 is a schematic perspective view of a substrate cutting apparatus according to an embodiment of the present invention. 1 is the substrate transport direction (arrow X), the left side is the upstream side, and the right side is the downstream side.

The substrate cutting device 1 is a device for breaking a bonded substrate along a scribe line S formed on both surfaces of a bonded substrate W (hereinafter referred to as “substrate W”). The substrate cutting device 1 is a device that cuts the substrate W. The substrate W is formed by bonding a first substrate W1 on which a first scribe line S1 is formed and a second substrate W2 on which a second scribe line S2 is formed.
The substrate cutting apparatus 1 includes a first transport unit 3, a break unit 5, and a second transport unit 7 in order from the upstream. Each of these units can be moved upstream or downstream so that the interval between them can be changed.

The substrate W constitutes, for example, a liquid crystal layer between the second substrate W2 and the first substrate W1. The substrate W includes a plurality of sealing members (not shown) disposed between the second substrate W2 and the first substrate W1, and surrounds the liquid crystal layer by the sealing members. This seal member is arranged by the number of bonded substrates after the break.
The substrate W is transported in a state where the second substrate W2 is disposed on the upper side and the first substrate W1 is disposed on the lower side. In the substrate W, a plurality of second scribe lines S2 are formed on the upper surface (the surface on the second substrate W2 side) at a predetermined pitch in the substrate transport direction. In the present embodiment, the extending direction of the first scribe line S1 and the second scribe line S2 is a direction (arrow Y) orthogonal to the substrate transport direction, but the direction of the scribe line is not particularly limited. The substrate W has a plurality of first scribe lines S1 formed on the lower surface (the surface on the first substrate W1 side). The first scribe line S1 and the second scribe line S2 are formed at positions corresponding to each other.

The 1st conveyance unit 3 is an apparatus for conveying the board | substrate W toward the board | substrate conveyance direction downstream, for example, is comprised by the belt conveyor. Specifically, the first transport unit 3 has a pair of rollers 11a and 11b and a belt 13 wound around them. The first drive motor 71 (FIG. 3) drives the rollers 11a and 11b to rotate clockwise, whereby the belt 13 transports the substrate W downstream in the substrate transport direction.
The break unit 5 is installed downstream of the first transport unit 3 in the substrate transport direction. The break unit 5 includes a first divided unit 17 and a second divided unit 19. The 1st division unit 17 and the 2nd division unit 19 are arranged in the position which counters in the up-and-down direction. More specifically, the first division unit 17 and the second division unit 19 are arranged at positions facing each other through the conveyance path of the substrate W, and the first division unit 17 is arranged below the conveyance path, The second division unit 19 is disposed above the conveyance path.

  The first division unit 17 has a pair of first backup bars 25 (an example of a pair of first receiving members). The pair of first backup bars 25 are disposed on the first substrate W1 side, and are disposed on both sides of the second scribe line S2 in the substrate transport direction when the second substrate W2 is divided. Each first backup bar 25 extends in a direction parallel to the transport surface 21 of the first transport unit 3 and perpendicular to the substrate transport direction. The upper part of each first backup bar 25 is formed in a triangular prism shape extending in a direction parallel to the transport surface 21 and perpendicular to the substrate transport direction. Further, the upper part of each first backup bar 25 has a tapered shape that becomes thinner toward the tip. The ridge line portion at the tip of each first backup bar 25 is a support portion that contacts the substrate W.

The first division unit 17 has a first break bar 27 (an example of a first break member). The first break bar 27 is disposed between the pair of first backup bars 25 so as to be relatively movable in the vertical direction, and is disposed so as to correspond to the first scribe line S1 when the first substrate W1 is divided. The first break bar 27 extends in a direction parallel to the transport surface 21 of the first transport unit 3 and perpendicular to the substrate transport direction. The lower portion of the first break bar 27 is formed in a triangular prism shape extending in a direction parallel to the transport surface 21 and orthogonal to the substrate transport direction, and has a tapered shape that becomes thinner toward the tip. The ridge line portion at the tip of each first break bar 27 is a pressing portion that comes into contact with the substrate W during the break operation.
The first break bar 27 is installed so as to be movable up and down between the operating position and the non-operating position with respect to the pair of first backup bars 25. The first break bar 27 protrudes from the tips of the pair of first backup bars 25 at the operating position. The first break bar 27 is retracted with respect to the front ends of the pair of first backup bars 25 in the non-operating position.

  The second division unit 19 has a pair of second backup bars 29 (an example of a pair of second receiving members). The pair of second backup bars 29 are disposed on the second substrate W2 side, and are disposed on both sides of the first scribe line S1 in the substrate transport direction when the first substrate W1 is divided. Each second backup bar 29 extends in a direction parallel to the transport surface 21 of the first transport unit 3 and perpendicular to the substrate transport direction. The upper part of each second backup bar 29 is formed in a triangular prism shape extending in a direction parallel to the transport surface 21 and orthogonal to the substrate transport direction. Further, the upper part of each second backup bar 29 has a tapered shape that becomes thinner toward the tip. The ridge line portion at the tip of each second backup bar 29 is a support portion that contacts the substrate W.

The second division unit 19 has a second break bar 31 (an example of a second break member). The second break bar 31 is disposed between the pair of second backup bars 29 so as to be relatively movable in the vertical direction, and is disposed so as to correspond to the second scribe line S2 when the second substrate W2 is divided. The second break bar 31 extends in a direction parallel to the transport surface 21 of the first transport unit 3 and perpendicular to the substrate transport direction. The upper part of the second break bar 31 is formed in a triangular prism shape extending in a direction parallel to the transport surface 21 and perpendicular to the substrate transport direction, and has a tapered shape that becomes thinner toward the tip. The ridge line portion at the tip of the second break bar 31 is a pressing portion that comes into contact with the substrate W during the break operation.
The second break bar 31 is installed so as to be movable up and down between the operating position and the non-operating position with respect to the pair of second backup bars 29. The second break bar 31 protrudes from the tips of the pair of second backup bars 29 at the operating position. The second break bar 31 is retracted with respect to the tips of the pair of second backup bars 29 in the non-operating position.

  The second transport unit 7 transports the divided substrate placed on the transport surface 34 toward the downstream. The second transport unit 7 includes a pair of rollers 35a and 35b, a belt 37 wound around them, and a second drive motor 72 (FIG. 3). Since the 2nd conveyance unit 7 is the structure similar to the 1st conveyance unit 3 mentioned above, the detailed description is abbreviate | omitted.

(2) Details of First Dividing Unit and Second Dividing Unit The first dividing unit 17 and the second dividing unit 19 will be further described with reference to FIG. FIG. 2 is a schematic diagram showing the principle configuration of the first division unit.
The first division unit 17 has a first moving mechanism 51. The first moving mechanism 51 is exclusively attached to the pair of first backup bars 25 and moves the pair of first backup bars 25 and the first break bar 27 together in the vertical direction. Thus, the pair of first backup bars 25 can move between a separation position where the tip is separated from the substrate W and a contact position where the tip is in contact with the substrate W. The first moving mechanism 51 is a known device such as a ball screw mechanism or an air cylinder.
The first division unit 17 has a second moving mechanism 53. The second moving mechanism 53 is interposed between the pair of first backup bars 25 and the first break bar 27, and moves the first break bar 27 to the operating position with respect to the pair of first backup bars 25. Move up and down between positions. In this embodiment, the second moving mechanism 53 is a ball screw mechanism. The second moving mechanism 53 may be another device.

The second divided unit 19 has the same structure as the first divided unit 17. Therefore, the description using figures is omitted.
The second division unit 19 has a third moving mechanism 55 (FIG. 3). The third moving mechanism 55 is exclusively attached to the pair of second backup bars 29 and moves the pair of second backup bars 29 and the second break bar 31 together in the vertical direction. Thereby, the pair of second backup bars 29 can move between a separation position where the tip is separated from the substrate W and a contact position where the tip is in contact with the substrate W.
The second division unit 19 has a fourth moving mechanism 57 (FIG. 3). The fourth moving mechanism 57 is interposed between the pair of second backup bars 29 and the second break bar 31, and moves the second break bar 31 from the operating position to the pair of second backup bars 29. Move up and down between positions.

(3) Control configuration of break unit The control configuration of the substrate cutting apparatus 1 will be described with reference to FIG. FIG. 3 is a block diagram showing a control configuration of the substrate cutting apparatus.
The substrate cutting apparatus 1 has a controller 81. The controller 81 is a computer having a processor (eg, CPU), a storage device (eg, ROM, RAM, HDD, SSD) and various interfaces (eg, A / D converter, D / A converter, communication interface, etc.). System. The controller 81 performs various control operations by executing a program stored in the storage unit (corresponding to a part or all of the storage area of the storage device).
The controller 81 may be composed of a single processor, but may be composed of a plurality of independent processors for each control.
Some or all of the functions of each element of the controller 81 may be realized as a program that can be executed by a computer system that constitutes the controller 81. In addition, some of the functions of each element of the control unit may be configured by a custom IC.

A first drive motor 71, a second drive motor 72, a first movement mechanism 51, a second movement mechanism 53, a third movement mechanism 55, and a fourth movement mechanism 57 are connected to the controller 81. The controller 81 can drive these devices.
Although not shown, the controller 81 is connected with sensors for detecting the size, shape and position of the substrate W, sensors and switches for detecting the state of each device, and an information input device.

(4) Break Operation The break operation of the substrate W by the substrate cutting apparatus 1 will be described with reference to FIGS. FIG. 4 is a flowchart of the break control operation. 5 and 6 are schematic views showing the arrangement of the first division unit and the second division unit for explaining the division operation of the first substrate. 7 and 8 are schematic views showing the arrangement of the first division unit and the second division unit for explaining the division operation of the second substrate.
The control flowchart described below is an example, and each step can be omitted or replaced as necessary. Also, a plurality of steps may be executed simultaneously, or some or all of them may be executed in an overlapping manner.

Furthermore, each block of the control flowchart is not limited to a single control operation, and can be replaced with a plurality of control operations represented by a plurality of blocks.
First, the substrate W on which scribe lines are formed on both surfaces by a scribe device (not shown) is placed on the transport surface 21 of the first transport unit 3.

In step S1, the first transport unit 3 transports the substrate W downstream in the substrate transport direction. Specifically, the controller 81 drives the first drive motor 71 to move the belt 13 by a predetermined distance (distance between scribe lines). Thus, the first scribe line S1 and the second scribe line S2 of the substrate W are arranged at the dividing position of the break unit 5.
At this time, both the first division unit 17 and the second division unit 19 are separated from the substrate W in the vertical direction. Further, both the first break bar 27 and the second break bar 31 are in the inoperative position.

In step S <b> 2, as shown in FIG. 5, in the second divided unit 19, the pair of second backup bars 29 are moved to contact positions where they contact the substrate W. Specifically, the controller 81 drives the third moving mechanism 55 to bring the pair of second backup bars 29 into contact with the second substrate W2 of the substrate W. At this time, the tips of the pair of second backup bars 29 abut on both sides of the second scribe line S2 in the substrate transport direction.
In step S3, as shown in FIG. 6, in the first division unit 17, the first break bar 27 is moved to a position where the substrate W contacts the first substrate W1. Specifically, the controller 81 drives the second moving mechanism 53 to bring the first break bar 27 into contact with the first scribe line S1 of the first substrate W1 of the substrate W. As a result, the first substrate W1 is broken along the first scribe line S1. During the break operation, the substrate W is supported from above by the pair of second backup bars 29.

In step S4, in the first division unit 17, the first break bar 27 moves to the non-operating position. Specifically, the controller 81 drives the second moving mechanism 53 to move the first break bar 27 to the inoperative position.
In step S <b> 5, as shown in FIG. 7, in the second division unit 19, the pair of second backup bars 29 moves to a separation position away from the substrate W. Specifically, the controller 81 drives the third moving mechanism 55 to move the pair of second backup bars 29.

In step S <b> 6, as shown in FIG. 7, in the first division unit 17, the pair of first backup bars 25 are moved to positions where they contact the substrate W. Specifically, the controller 81 drives the first moving mechanism 51 to bring the pair of first backup bars 25 into contact with the first substrate W1 of the substrate W. At this time, the tips of the pair of first backup bars 25 are in contact with both sides of the first scribe line S1 in the substrate transport direction.
In step S7, as shown in FIG. 8, in the second division unit 19, the second break bar 31 is moved to the contact position where the substrate W contacts the second substrate W2. Specifically, the controller 81 drives the fourth moving mechanism 57 to bring the second break bar 31 into contact with the second scribe line S2 of the second substrate W2 of the substrate W. As a result, the first substrate W1 is broken along the first scribe line S1. In this break operation, the substrate W is supported from below by the pair of first backup bars 25.

In step S8, in the second divided unit 19, the second break bar 31 moves to the inoperative position. Specifically, the controller 81 drives the fourth moving mechanism 57 to move the second break bar 31 to the inoperative position.
In step S <b> 9, in the first division unit 17, the pair of first backup bars 25 moves to a separation position away from the substrate W. Specifically, the controller 81 drives the first moving mechanism 51 to move the pair of first backup bars 25.

As described above, as shown in FIGS. 5 and 6, in the operation of dividing the first scribe line S <b> 1, the tip of the second break bar 31 is retracted with respect to the tips of the pair of second backup bars 29. In the position, the ends of the pair of second backup bars 29 abut on the second substrate W2. And the front-end | tip of the 1st break bar 27 protrudes with respect to the front-end | tip of a pair of 1st backup bar 25, and the front-end | tip of the 1st break bar 27 applies a load to 1st scribe line S1 of the 1st board | substrate W1. Abut.
As shown in FIGS. 7 and 8, in the operation of dividing the second scribe line S <b> 2, the pair of the first break bar 27 is in a position where the tip of the pair of first backup bars 25 is retracted. The tip of the first backup bar 25 comes into contact with the first substrate W1. The tip of the second break bar 31 protrudes from the tip of the pair of second backup bars 29 so that the tip of the second break bar 31 applies a load to the second scribe line S2 of the second substrate W2. Abut.

In summary, in the substrate cutting apparatus 1, in the operation of dividing the second scribe line S <b> 2, the pair of second backup bars 29 of the second division unit 19 function as backup bars, and the first division unit 17 has the second division bar 17. One break bar 27 abuts on the first scribe line S1 as a break bar.
In the operation of dividing the first scribe line S1, the pair of first backup bars 25 of the first division unit 17 functions as a backup bar, and the second break bar 31 of the second division unit 19 serves as the second scribe as a break bar. It contacts the line S2.
Thus, since each of the first divided unit 17 and the second divided unit 19 has the break bar and the backup bar, only the first divided unit 17 and the second divided unit 19 are connected to the first scribe line S1 and the second divided unit 19. The scribe line S2 can be divided. As a result, the dimension of the substrate cutting apparatus 1 in the substrate transport direction is shortened, so that the substrate W can be broken with a simple configuration.

2. Other Embodiments Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the invention. In particular, a plurality of embodiments and modifications described in this specification can be arbitrarily combined as necessary.

In the above embodiment, the bonded substrate is broken by raising and lowering the break bar to the operating position, but the invention is not particularly limited to this. For example, the backup bar may be raised and lowered to break the substrate, or both the break bar and the backup bar may be raised and lowered simultaneously to break the substrate.
In the embodiment described above, the break bar moves relative to the pair of backup bars to come into contact with the substrate W, but is not particularly limited thereto. For example, the break bar may come into contact with the substrate W by moving integrally with the backup bar while protruding from the backup bar.

  The present invention can be widely applied to a substrate cutting apparatus for cutting a bonded substrate formed by bonding a first substrate on which a first scribe line is formed and a second substrate on which a second scribe line is formed.

1: Substrate cutting device 3: 1st conveyance unit 5: Break unit 7: 2nd conveyance unit 17: 1st division unit 19: 2nd division unit 25: 1st backup bar 27: 1st break bar 29: 2nd backup Bar 31: Second break bar 51: First moving mechanism 53: Second moving mechanism 55: Third moving mechanism 57: Fourth moving mechanism 71: First driving motor 72: Second driving motor 81: Controller S1: First Scribe line S2: Second scribe line W: Bonded substrate W1: First substrate W2: Second substrate

Claims (3)

An apparatus for cutting a bonded substrate formed by bonding a first substrate on which a first scribe line is formed and a second substrate on which a second scribe line is formed,
A pair of first receiving members disposed on the first substrate side and disposed on both sides of the second scribe line in the substrate transport direction when the second substrate is divided, and between the pair of first receiving members And a first break unit that is disposed so as to be relatively movable and has a first break member that is disposed so as to correspond to the first scribe line when the first substrate is divided.
The first division unit is exclusively attached to the pair of first receiving members, and moves the pair of first receiving members and the first break member in the approaching / separating direction with respect to the first substrate. One moving mechanism, the pair of first receiving members, and the first breaking member, and the first breaking member with respect to the pair of first receiving members, the first breaking member of the first breaking member A substrate cutting apparatus comprising: a second moving mechanism that moves between an operating position in which a front end protrudes from a front end of the pair of first receiving members and a non-operating position retracted from the front end of the pair of first receiving members. A pair of second receiving members disposed on the second substrate side and disposed so as to be positioned on both sides of the first scribe line in the substrate transport direction when the first substrate is divided, and between the pair of second receiving members And a second break unit that is disposed so as to be relatively movable and has a second break member that is disposed so as to correspond to the second scribe line when the second substrate is divided.
The second divided unit is exclusively attached to the pair of second receiving members, and moves the pair of second receiving members and the second break member together in the approaching / separating direction with respect to the second substrate. A third moving mechanism, interposed between the pair of second receiving members and the second break member, the second break member with respect to the pair of second receiving members, and the second break member And a fourth moving mechanism for moving between an operating position in which the front end of the pair of second receiving members protrudes from a front end of the pair of second receiving members and a non-operating position retracted from the front ends of the pair of second receiving members. 2. The substrate cutting apparatus according to 1. With the pair of second receiving members of the second divided unit supporting the second substrate, the first break member of the first divided unit applies a load to the first scribe line of the first substrate. So that the second scribe line is divided,
The second break member of the second divided unit applies a load to the second scribe line of the second substrate in a state where the pair of first receiving members of the first divided unit supports the first substrate. The substrate cutting apparatus according to claim 1, wherein the first scribe line is divided by hitting in such a manner.