TW201926454A - Substrate processing apparatus including a scribe line forming apparatus, breaking devices and a transport device - Google Patents

Abstract

An object of the present invention is to improve the ability of a substrate processing apparatus for cutting a substrate. In a substrate processing apparatus 1, a scribe line forming apparatus 3 forms a plurality of first scribe lines S1 and a plurality of second scribe lines S2 which are orthogonal to each other on a substrate 100. A first breaking device 7 divides the substrate 100 along the plurality of first scribe lines S1 into a plurality of short strip substrates 111. An adsorption rotating device 8 rotates the plurality of short strip substrates 111 by 90 degrees in a perspective view. A second breaking device 9 is disposed on the downstream side in a conveying direction of the first breaking device 7. The second breaking device 9 divides the plurality of short strip substrates 111 along the plurality of second scribe lines S2 into a plurality of unit substrates 113. A transport device 29 transports the plurality of short strip substrates 111 from the first breaking device 7 to the second breaking device 9.

Description

Substrate processing device

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus that cuts a substrate twice.

In the previous method of dividing a brittle material substrate (hereinafter simply referred to as a substrate) into a plurality of unit substrates, a knife wheel (also referred to as a scribing wheel) or a fixed blade, or a laser beam was used to scribe on the surface of the substrate The mechanism forms a scribe line in the X direction and the Y direction which are orthogonal to each other, and thereafter, an external force is applied along the scribe line to perform rupture (for example, refer to Patent Document 1).

The substrate breaking device described in Patent Document 1 includes a platform 2 and a breaking rod 10. The platform 2 can mount and rotate the substrate W to be processed, and can move in the Y direction along the horizontal rail 3. A beam (horizontal frame) 7 extending horizontally in the X direction is provided above the platform 2. A plate-shaped splitting rod 10 extending in the X direction parallel to the beam is installed on the beam 7. The breaking rod 10 can be raised and lowered through a lifting shaft 12 driven by a fluid cylinder 11.

In the scribing step, a plurality of scribing lines S1 and S2 orthogonal to each other are formed on the surface with respect to the rectangular substrate W by a scribing mechanism.
In the substrate cutting step, first, the substrate W is placed on the stage 2 so that the scribe lines S1 and S2 become the lower surface. Next, the breaking bar 10 is lowered from above the substrate W toward the scribe line S1 and the substrate is pressed to bend the substrate into a slightly V shape, and the crack of the scribe line S1 is extended to break the substrate W. After breaking all the scribe lines S1, the platform 2 is rotated 90 degrees with the scribe line S2 in the X direction. In the same manner as described above, the breaking rod 10 is lowered and the scribe line S2 is broken.
[Prior technical literature]
[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2016-120725

[Problems to be solved by the invention]

In the above-mentioned substrate cutting device, since the first scribe is performed and then the second scribe is performed, the substrate breaking ability is not sufficiently high.

An object of the present invention is to improve a substrate breaking ability in a substrate processing apparatus.
[Technical means to solve the problem]

Hereinafter, a plurality of aspects will be described as a method for solving the problem. These aspects can be arbitrarily combined as required.

A substrate processing apparatus according to one aspect of the present invention includes a scribing forming device, a first breaking device, a rotating device, a second breaking device, and a transfer device.
The scribe forming device forms a plurality of first scribe lines and a plurality of second scribe lines orthogonal to each other on the substrate.
The first breaking device divides the substrate along a plurality of first scribe lines to form a plurality of short strip-shaped substrates.
The rotating device rotates the plurality of short strip-shaped substrates by 90 degrees in a plan view.
The second breaking device is disposed on the downstream side in the conveying direction of the first breaking device, and divides a plurality of short strip substrates along a plurality of second scribe lines to form a plurality of unit substrates.
The transfer device transfers the plurality of short strip substrates from the first breaking device to the second breaking device.

In this device, when a plurality of short strip substrates are formed in the first breaking device, at the same time, a plurality of unit substrates are formed in the second breaking device. Therefore, the ability of the substrate processing apparatus to form a unit substrate is improved as compared with the prior art. Furthermore, the simultaneous formation of the short strip-shaped substrate and the unit substrate means that the two steps are performed overlapping at least part of the time.

The first breaking device may also have a first breaking rod, which extends in parallel along the plurality of first scribe lines and repeatedly moves / breaks along the plurality of first scribe lines.
In this device, the first breaking rod is moved to repeatedly perform the breaking operation.

The second breaking device may also have a second splitting bar that extends in parallel along the plurality of second scribe lines and repeatedly moves / breaks in alignment with the plurality of second scribe lines.
In this device, the second breaking rod is moved to repeatedly perform the breaking operation.

The rotating device may further include: a suction section that sucks a plurality of short strip-shaped substrates together; a lifting section that lifts the suction section; and a rotating section that rotates the suction section 90 degrees around the vertical axis.
In this device, the adsorption section adsorbs a plurality of short strip substrates, the adsorption section rises, the adsorption section rotates 90 degrees, the adsorption section descends, and the adsorption section releases the adsorption of the plurality of short strip substrates. As a result, the plurality of short strip substrates can be rotated 90 degrees in a plan view.
[Effect of the invention]

The substrate breaking ability of the substrate processing apparatus of the present invention is improved.

1. First embodiment
(1) Outline Description of Substrate Processing Apparatus A substrate processing apparatus 1 will be described with reference to FIGS. 1 to 3. FIG. 1 is a schematic plan view of a substrate processing apparatus according to a first embodiment of the present invention. Fig. 2 is a schematic perspective view of a substrate breaking device. Fig. 3 is a schematic side view of a substrate cutting device. In FIG. 1, the up-down direction of the figure is the first direction (arrow X), and the left-right direction of the figure is the second direction (arrow Y).

The substrate processing apparatus 1 is a device for forming a plurality of unit substrates 113 from the bonded substrate 100. In FIG. 1, a plurality of devices described later are arranged from left to right in the second direction. That is, the conveyance direction of the substrate to be processed is the second direction, and the substrate is processed while being conveyed from left to right in the second direction. Therefore, the left side in the second direction in FIG. 1 is the upstream side in the transport direction, and the right side in the second direction in FIG. 1 is the downstream side in the transport direction.
The substrate processing apparatus 1 includes a scribe formation apparatus 3. The scribe formation device 3 forms a plurality of first scribe lines S1 and a plurality of second scribe lines S2 on the surface of the bonding substrate 100. The first scribe line S1 and the second scribe line S2 are orthogonal to each other. The substrate after the scribing process is referred to as a bonded substrate 100A.

The scribing forming device 3 specifically includes a scribing unit 51, a conveying device 53, which conveys the bonded substrate 100 downstream of the conveying direction, and a chuck mechanism 55, which holds and adheres the bonded substrate 100 to the conveying direction. Move on both sides. The scribing unit 51 includes a scribing beam 51a extending along the first direction, a scribing head 51b (FIG. 7) that can be moved in the first direction along the scribing beam 51a, and a scribing head moving device 51c ( Figure 7). The conveying device 53 is a belt conveyor. The chuck mechanism 55 includes a chuck beam 55a provided on the conveying device 53 so as to be movable forward and backward along the second direction; a chuck beam moving device 55b (FIG. 7); and a chuck 55c formed on the chuck. One side of the beam 55 a holds the bonded substrate 100. The chuck beam 55a is moved to both sides of the scribe unit 51 in the first direction by the chuck beam 55a, and the bonding substrate 100 held by the chuck 55c passes through the underside of the scribe head 51b (FIG. 7).

The substrate processing apparatus 1 includes a substrate cutting device 5. The substrate breaking device 5 divides the bonded substrate 100A along the plurality of first scribe lines S1 and the plurality of second scribe lines S2 to form a unit substrate 113. The substrate cutting device 5 is disposed on the downstream side in the conveyance direction of the scribe forming device 3.

The substrate breaking device 5 includes a first breaking device 7. The first breaking device 7 divides the bonded substrate 100A along the plurality of first scribe lines S1 to form a plurality of short strip-shaped substrates 111. The first breaking device 7 extends in parallel in the first direction, and is aligned with the plurality of first scribe lines S1 of the bonded substrate 100A to repeatedly move / break in the conveying direction. The first breaking device 7 will be described later.
As shown in FIG. 2, the substrate breaking device 5 includes a suction rotation device 8. The suction rotation device 8 rotates the plurality of short strip-shaped substrates 111 by 90 degrees in a plan view. The suction rotation device 8 includes a suction portion 8a that suctions a plurality of short strip substrates 111, a lifting portion 8b that moves the suction portion 8a up and down, and a rotation portion 8c that rotates the suction portion 8a about a vertical axis as a center 90 degree. As a series of actions, the adsorption section 8a adsorbs the plurality of short strip substrates 111, the adsorption section 8a rises, the adsorption section 8a rotates 90 degrees, the adsorption section 8a descends, and the adsorption section 8a releases the adsorption of the plurality of short strip substrates 111. The substrate breaking device 5 is arranged above the first jumper unit 35 and the second jumper unit 37 described later.

The substrate breaking device 5 includes a second breaking device 9. The second breaking device 9 is disposed downstream of the first breaking device 7 in the conveying direction, and cuts a plurality of short strip-shaped substrates 111 along a second scribe line S2 to form a plurality of unit substrates 113. The second breaking device 9 extends in parallel in the first direction and is aligned with the plurality of second scribe lines S2 of the plurality of short strip-shaped substrates 111 and repeatedly moves / breaks in the conveying direction. The second breaking device 9 will be described later.
The substrate processing apparatus 1 includes a pickup device 11. The pickup device 11 picks up a plurality of unit substrates 113 and transfers them to another device 13.

Next, a transfer device 29 for transferring a substrate will be described. The transfer device 29 transfers the substrate in the order of the scribe forming device 3, the first cutting device 7, the second cutting device 9, and the pick-up device 11.
Specifically, the transfer device 29 includes a first transfer device 41, a second transfer device 43, and a third transfer device 45. The first conveying device 41 extends between the scribe forming device 3 and the first breaking device 7. The second conveying device 43 extends between the first breaking device 7 and the second breaking device 9. The third conveying device 45 extends between the second breaking device 9 and the pickup device 11.

As shown in FIG. 9, the first conveying device 41 includes a first belt 41 a, a plurality of rollers 41 b, and a first motor 41 c (FIG. 7). The plurality of rollers 41 b can move forward and backward in the conveying direction within a specific range in the conveying direction upstream and the conveying direction downstream.
As shown in FIG. 9, the second conveying device 43 includes a second belt 43 a (an example of a conveying device), a plurality of rollers 43 b, and a second motor 43 c (FIG. 7). The plurality of rollers 43b can move forward and backward in the conveying direction within a specific range in the upstream direction and the downstream direction in the conveying direction.

As shown in FIG. 9, the third conveying device 45 includes a third belt 45 a (an example of a conveying device), a plurality of rollers 45 b, and a third motor 45 c (FIG. 7). The plurality of rollers 45b can be moved forward and backward in the conveyance direction within a specific range from the upstream side in the conveyance direction and the downstream side in the conveyance direction.
As shown in FIG. 9, the downstream end in the conveying direction of the upper surface portion of the first belt 41 a and the upstream end in the conveying direction of the upper surface portion of the second belt 43 a are approached with a slight gap therebetween. The downstream-side end in the conveying direction of the upper surface portion of the second belt 43a and the upstream-side end of the conveying direction in the upper surface portion of the third belt 45a are approached with a slight gap therebetween.

With the above-mentioned configuration, in the substrate processing apparatus 1, when the first breaking device 7 divides the bonded substrate 100A to form a plurality of short strip substrates 111, the second breaking device 9 can divide a plurality of short substrates 111 at the same time. The strip substrate 111 forms a plurality of unit substrates 113. Therefore, the capability of forming the unit substrate 113 of the substrate processing apparatus 1 is improved as compared with the previous one.

(2) Detailed description of substrate processing equipment
(2-1) First breaking device As shown in FIG. 3, the first breaking device 7 includes a first pre-breaking device 7a and a first impact breaking device 7b. The first pre-breaking device 7a has a function of pressing the bonding substrate 100A to hold it at the first breaking device 7 during breaking, and a function of breaking the first scribe line S1 below the bonding substrate 100A. The first impact breaking device 7b has a function of pulling the corner material or the substrate away from the remaining portion by breaking the first scribe line S1 on the upper side of the bonded substrate 100A.
When the substrate is broken, the first pre-breaking device 7a moves toward the upstream side in the conveying direction while holding the downstream side end in the conveying direction of the upper surface portion of the first belt 41a. When the substrate is broken, the first impact breaking device 7b moves while holding the upstream end in the conveying direction of the upper surface portion of the second belt 43a, while moving toward the upstream end in the conveying direction.

The first pre-breaking device 7a and the first impact breaking device 7b will be described in more detail with reference to Figs. 4 to 6. Fig. 4 is a perspective view of a pre-split breaking rod of the first breaking device. Fig. 5 is a perspective view of an impact cracking rod of the first breaking device. FIG. 6 is an enlarged view of a part of FIG. 5.
The first pre-breaking device 7a includes a pre-breaking bar 21 (an example of the first breaking bar). As shown in FIG. 4, the pre-split breaking rod 21 extends in parallel in the first direction, and is supported by a first lifting device 22 (FIG. 7) under a beam that can be moved in the conveying direction. As shown in FIG. 3, the first pre-breaking device 7 a further includes an impact body 25. The impact body 25 is locked to the beam, and in a state in which the pre-splitting rod 21 is lowered to a position in contact with the upper surface of the substrate, the locking with the beam is released by the lock release device 26 (FIG. 7), and the The breaking rod 21 imparts an impact.

The first impact breaking device 7b includes an impact breaking rod 23 (an example of the first breaking rod). As shown in FIG. 5 and FIG. 6, the impact cracking rod 23 extends in parallel in the first direction and is supported by the second lifting device 24 (FIG. 7) under the beam that can be moved in the conveying direction. The impact cracking rod 23 includes a rod body 23a, a corner material contact portion 23b, and a substrate contact portion 23c.
In addition, since a mechanism for moving the beam in the conveying direction while supporting the pre-split broken rod 21 and the impact split broken rod 23 is well known, description thereof is omitted.

(2-2) Second breaking device As shown in FIG. 9, the second breaking device 9 includes a second pre-breaking device 9 a and a second impact breaking device 9 b. The second pre-breaking device 9a has a function of pressing the plurality of short strip-shaped substrates 111 and holding them on the second breaking device 9 at the time of breaking, and the first 2 Line S2 function. The second impact breaking device 9b has a function of pulling off the corner material or the substrate from the remaining portion by breaking the second scribe line S2 on the upper side of the plurality of short strip-shaped substrates 111. When the substrate is broken, the second pre-breaking device 9a moves toward the upstream side in the conveying direction while holding the downstream end of the upper surface portion of the second belt 43a in the conveying direction. When the substrate is broken, the second impact breaking device 9b moves toward the upstream side in the conveying direction while holding the upstream side end in the conveying direction of the upper surface portion of the third belt 45a.
The structures and functions of the second pre-breaking device 9a and the second impact breaking device 9b are the same as the structures and functions of the first pre-breaking device 7a and the first impact breaking device 7b, and therefore description thereof is omitted.

(2-3) As shown in FIG. 1 to FIG. 3, the jumping unit is provided with a first jumping unit 35 on the first belt 41 a. A second jumper 37 is disposed on the second belt 43a. A third jumping unit 39 is arranged on the third belt 45a. The first jumper unit 35, the second jumper unit 37, and the third jumper unit 39 adjust the lengths of the belts by pressing down the first belt 41a, the second belt 43a, and the third belt 45a, respectively. The structure and function of these devices are well known, so descriptions are omitted.

(3) Control Structure of Substrate Processing Apparatus A control structure of the substrate processing apparatus 1 will be described with reference to FIG. 7. Fig. 7 is a block diagram showing a control structure of a substrate processing apparatus.
The substrate processing apparatus 1 includes a controller 50. The controller 50 is a computer system having a processor (for example, a CPU (Central Processing Unit)), a memory device (for example, ROM (Read Only Memory), and RAM (Random Access Memory: Random Access Memory) Memory), HDD (Hard Disk Drive), SSD (Solid State Drive), etc.), and various interfaces (such as A / D (analog to digital) converter, D / A (digital to analog, digital-to-analog) converter, and communication interface, etc.). The controller 50 executes various control operations by executing programs stored in the memory (corresponding to a part or all of the memory area of the memory device).
The controller 50 may be constituted by a single processor, or may be constituted by a plurality of processors independent for each control.
A part or all of the functions of the elements of the controller 50 may also be implemented as a program that can be executed in a computer system constituting the controller 50. In addition, a part of the functions of each element of the controller 50 may be constituted by a custom IC (Integrated Circuit).

As shown in FIG. 7, a scribing unit 51 (scribing head 51b, scribing head moving device 51c), a chuck mechanism 55 (chuck beam moving device 55b, chuck 55c), and a first The first motor 41c of the conveying device 41, the second motor 43c of the second conveying device 43, and the third motor 45c of the third conveying device 45, the first jumping unit 35, the second jumping unit 37, and the third jumping unit 39 . The controller 50 is further connected with a first breaking device 7 (the first lifting device 22, a second lifting device 24, and a lock release device 26) and a second breaking device 9 (the first lifting device 22, the second The lifting device 24 and the lock release device 26) and the suction rotation device 8 (the suction portion 8a, the lifting portion 8b, and the rotation portion 8c).
Although not shown, the controller 50 is connected with a sensor for detecting the size, shape, and position of the substrate, a sensor for detecting the status of each device, a switch, and an information input device.

(4) Substrate breaking device The substrate breaking operation of the substrate breaking device 5 will be described using FIGS. 8 to 15. FIG. 8, FIG. 10, FIG. 13 and FIG. 14 are schematic plan views showing one state of the breaking operation of the substrate breaking device. FIG. 9, FIG. 11, FIG. 12, and FIG. 15 are schematic side views showing one state of the breaking operation of the substrate breaking device.

(4-1) The substrate breaking operation of the first breaking device is shown in FIG. 8 and FIG. 9. At the initial stage of the substrate breaking, the first jumping unit 35 and the second jumping unit 37 are disposed with the first The downstream portion of the belt 41a in the conveying direction and the upstream end of the second belt 43a in the conveying direction (only shown in FIG. 9). At this time, the bonded substrate 100A is placed on the downstream portion of the first belt 41a in the conveying direction.
As shown in FIG. 10 and FIG. 11, in the operation stage of substrate breaking, the first breaking device 7 moves upstream in the conveying direction, and cuts the first scribe line S1 to produce a short strip substrate 111. In the above operation, the first belt 41a, the second belt 43a, and the third belt 45a stop the conveyance operation.

In the above-mentioned substrate breaking operation, the following operations a) to c) are performed simultaneously.
a) A plurality of short strip substrates 111 may be placed on the second belt 43a.
b) As shown in FIG. 11, the corner material 111A drops downward from between the first belt 41 a and the second belt 43 a. The corner material 111A is placed on a lower surface than the conveyance surface of the first belt 41a.
c) Between the first jumper unit 35 and the second jumper unit 37, the area occupied by the first belt 41a becomes smaller (the conveying direction length of the first belt 41a becomes shorter), and the area occupied by the second belt 43a becomes larger (The length in the conveying direction of the second belt 43a becomes longer.) This is because the upper-side conveyance part of the 1st belt 41a moves to an upstream side in a conveyance direction.
As shown in FIG. 12, at the end stage of the substrate breaking, the first breaking device 7 reaches a position close to the downstream side of the first jumping unit 35 in the conveying direction. In this state, all the divisions of the first scribe line S1 of the bonded substrate 100A are completed.

After the above-mentioned breaking, the suction rotation device 8 sucks a plurality of short strip-shaped substrates 111, rises and rotates 90 degrees, and then descends to release the suction. As a result, as shown in FIG. 13, the plurality of short strip-shaped substrates 111 are arranged on the second belt 43 a in a posture extending in the second direction.
Next, as shown in FIGS. 14 and 15, the first breaking device 7 moves to the downstream side in the conveyance direction, and further drives the second motor 43 c and the second belt 43 a conveys the plurality of short strip substrates 111 to the downstream side in the conveyance direction. As a result, the plurality of short strip-shaped substrates 111 are moved further from the second jumping unit 37 to the downstream side in the conveying direction.
Further, as shown in FIG. 15, during the above operation, the second motor 43 c (FIG. 7) drives the second belt 43 a, whereby the corner material 113 is stored in the second recovery box 73. Further, the first belt 41a is driven by the first motor 41c (FIG. 7), and the corner material 111A is stored in the first recovery box 71.

(4-2) Substrate breaking operation of the second breaking device The following operations are performed simultaneously with the substrate breaking operation of the first breaking device 7 described above.
As shown in FIGS. 8 and 9, at the beginning of the substrate breaking, a downstream portion of the second belt 43 a in the conveying direction and a third belt 45 a are disposed between the second jump unit 37 and the third jump unit 39. The upstream end in the conveying direction (only shown in Fig. 9). At this time, the plurality of short strip-shaped substrates 111 are placed on the downstream side portion in the conveying direction of the second belt 43a.

As shown in FIG. 10 and FIG. 11, during the substrate breaking operation stage, the second breaking device 9 moves upstream in the conveying direction, and cuts the second scribe line S2 of the plurality of short strip substrates 111 to produce a unit substrate 113 . In the above operation, the first belt 41a, the second belt 43a, and the third belt 45a stop the conveyance operation.

In the above-mentioned substrate breaking operation, the following operations a) to c) are performed simultaneously.
a) The unit substrate 113 may be placed on the third belt 45a.
b) As shown in FIG. 11, the corner material 113A drops downward from between the second belt 43 a and the third belt 45 a. The corner material 113A is disposed on a portion lower than the conveyance surface of the second belt 43a.
c) Between the second jumping unit 37 and the third jumping unit 39, the area occupied by the second belt 43a becomes smaller (the conveying direction length of the second belt 43a becomes shorter), and the area occupied by the third belt 45a becomes larger (The length in the conveying direction of the third belt 45a becomes longer.) This is because the upper-side conveyance part of the 2nd belt 43a is moved to the conveyance direction upstream side.
As shown in FIG. 12 and FIG. 13, at the end stage of the substrate breaking, the second breaking device 9 reaches a position close to the downstream side of the second jumping unit 37 in the conveying direction. In this state, the division of the second scribe lines S2 of the plurality of short strip-shaped substrates 111 is all completed.

Next, as shown in FIGS. 14 and 15, the second breaking device 9 moves to the downstream side in the conveying direction, and further drives the third belt 45 a to convey the unit substrate 113 to the downstream side in the conveying direction. Thereby, the plurality of unit substrates 113 are moved further from the third jumping unit 39 to the downstream side in the conveying direction.

2. Other Embodiments Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various changes can be made without departing from the gist of the invention. In particular, a plurality of embodiments and variations described in this specification can be arbitrarily combined as necessary.
[Industrial availability]

The present invention can be widely applied to a substrate processing device that cuts a substrate twice.

1‧‧‧ basic processing equipment

3‧‧‧ scribing forming device

5‧‧‧ Substrate breaking device

7‧‧‧The first breaking device

7a‧‧‧The first pre-breaking device

7b‧‧‧The first impact breaking device

8‧‧‧ Adsorption rotating device

8a‧‧‧Adsorption Department

8b‧‧‧ Lifting Department

8c‧‧‧Rotating part

9‧‧‧ 2nd breaking device

9a‧‧‧Second pre-breaking device

9b‧‧‧Second impact breaking device

11‧‧‧ short strip substrate

13‧‧‧ Other devices

21‧‧‧Pre-splitting broken rod

22‧‧‧The first lifting device

23‧‧‧ Impact Crack

23a‧‧‧ stick body

23b‧‧‧Corner material contact

23c‧‧‧Substrate contact

24‧‧‧The second lifting device

25‧‧‧Impact body

26‧‧‧Lock release device

29‧‧‧ transport device

35‧‧‧1st beating unit

37‧‧‧Second beating unit

39‧‧‧3rd beating unit

41‧‧‧The first conveying device

41a‧‧‧1st belt

41b‧‧‧roller

41c‧‧‧The first motor

43‧‧‧Second conveyor

43a‧‧‧Second Belt

43b‧‧‧roller

43c‧‧‧The second motor

45‧‧‧3rd conveying device

45a‧‧‧3rd belt

45b‧‧‧roller

45c‧‧‧3rd motor

50‧‧‧controller

51‧‧‧ scribing unit

51a‧‧‧ crossed beam

51b‧‧‧Scribe

51c‧‧‧Screw head moving device

53‧‧‧Conveying device

55‧‧‧Chuck mechanism

55a‧‧‧chuck beam

55b‧‧‧ chuck beam moving device

55c‧‧‧chuck

71‧‧‧The first collection box

73‧‧‧2nd recovery box

100‧‧‧ substrate

100A‧‧‧laminated substrate

111‧‧‧ short strip substrate

111A‧‧‧ Corner material

113‧‧‧Unit substrate

113A‧‧‧Corner material

S1‧‧‧line 1

S2‧‧‧ 2nd line

X‧‧‧ arrow (first direction)

Y‧‧‧ Arrow (2nd direction)

FIG. 1 is a schematic plan view of a substrate processing apparatus according to a first embodiment of the present invention.

Fig. 2 is a schematic perspective view of a substrate breaking device.

Fig. 3 is a side view of a substrate cutting device.

Fig. 4 is a perspective view of a pre-split breaking rod of the first breaking device.

Fig. 5 is a perspective view of an impact cracking rod of the first breaking device.

FIG. 6 is an enlarged view of a part of FIG. 5.

Fig. 7 is a block diagram showing a control structure of a substrate processing apparatus.

FIG. 8 is a schematic plan view showing one state of the breaking operation of the substrate breaking device.

Fig. 9 is a schematic side view showing one state of a breaking operation of the substrate breaking device.

FIG. 10 is a schematic plan view showing one state of a breaking operation of the substrate breaking device.

FIG. 11 is a schematic side view showing one state of a breaking operation of the substrate breaking device.

Fig. 12 is a schematic side view showing one state of a breaking operation of the substrate breaking device.

FIG. 13 is a schematic plan view showing one state of the breaking operation of the substrate breaking device.

FIG. 14 is a schematic plan view showing one state of a breaking operation of the substrate breaking device.

Fig. 15 is a schematic side view showing one state of a breaking operation of the substrate breaking device.

Claims (4)

A substrate processing device includes: A scribe forming device for forming a plurality of first scribe lines and a plurality of second scribe lines orthogonal to each other on the substrate; A first breaking device for forming a plurality of short strip-shaped substrates by breaking along the plurality of first scribe lines of the substrate; A rotating device that rotates the plurality of short strip-shaped substrates by 90 degrees in a plan view; A second breaking device is disposed downstream of the first breaking device in the conveying direction, and divides the plurality of short strip-shaped substrates along the plurality of second scribe lines to form a plurality of unit substrates. ;and A transfer device transfers a plurality of short strip substrates from the first breaking device to the second breaking device. The substrate processing apparatus of claim 1, wherein The first breaking device includes a first breaking bar, which extends in parallel along the plurality of first scribe lines, and repeatedly moves / breaks along the plurality of first scribe lines. The substrate processing apparatus of claim 1, wherein The second breaking device includes a second splitting bar that extends in parallel along the plurality of second scribe lines and repeatedly moves / breaks in alignment with the plurality of second scribe lines. The substrate processing apparatus according to any one of claims 1 to 3, wherein The rotating device includes an adsorption unit that collectively adsorbs the plurality of short strip-shaped substrates, a lifting unit that raises and lowers the upper adsorption unit, and a rotating unit that rotates the adsorption unit by 90 degrees around a vertical axis.