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TWI693002B - Additive manufacturing device and manufacturing method - Google Patents

Additive manufacturing device and manufacturing method Download PDF

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TWI693002B
TWI693002B TW107145771A TW107145771A TWI693002B TW I693002 B TWI693002 B TW I693002B TW 107145771 A TW107145771 A TW 107145771A TW 107145771 A TW107145771 A TW 107145771A TW I693002 B TWI693002 B TW I693002B
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module
metal
additive
metal wiring
unit
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TW107145771A
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TW201929626A (en
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李會麗
唐世弋
李志丹
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大陸商上海微電子裝備(集團)股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • B29C64/141Processes of additive manufacturing using only solid materials
    • B29C64/153Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00Processes of additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00Apparatus for additive manufacturing; Details thereof or accessories therefor
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00Coating starting from inorganic powder
    • C23C24/08Coating starting from inorganic powder by application of heat or pressure and heat
    • H10W99/00

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Powder Metallurgy (AREA)
  • Laser Beam Processing (AREA)

Abstract

本發明提供了一種增材製造裝置,包括:工件台模組;殼體增材模組,配置為在所述工件台模組上形成殼體;金屬布線模組,配置為在所述殼體上設置金屬布線;布線修復模組,配置為檢測所述金屬布線的缺陷並修補所述缺陷;其中,所述殼體增材模組還配置為修補所述缺陷後在所述殼體上形成殼蓋。本發明增材製造裝置無需卸載工件台模組及基材就可對內嵌電路進行在線修補,節約設備購置成本和產線空間,且能減少製造時間和縮短製造鏈,提升了基材的後續加工精度。The invention provides an additive manufacturing device, which includes: a workpiece table module; a shell additive module configured to form a shell on the workpiece table module; a metal wiring module configured to be arranged in the shell Metal wiring is provided on the body; a wiring repair module is configured to detect the defects of the metal wiring and repair the defects; wherein, the shell additive module is also configured to repair the defects in the A shell cover is formed on the shell. The additive manufacturing device of the present invention can repair the embedded circuit online without unloading the workpiece stage module and the base material, saving equipment purchase cost and production line space, and can reduce manufacturing time and shorten the manufacturing chain, and improve the follow-up of the base material Precision.

Description

一種增材製造裝置和製造方法Additive manufacturing device and manufacturing method

本發明係關於一種內嵌入電路增材製造領域,尤其是一種增材製造裝置和製造方法。The invention relates to the field of additive manufacturing of embedded circuits, in particular to an additive manufacturing device and a manufacturing method.

隨著電子設備集成度的提高,設備體積也越來越小,這時電子組件對於整個設備就顯得過大,因此需要減小自身尺寸。通過在注塑成型的曲面塑料殼體上製作電氣以及傳感功能的導線、圖形來製造和安裝元器件,可將普通的電路板具有的電氣互連功能、支撐元器件功能和塑料殼體的支撐、防護等功能結合,並且將機械實體和導電圖形相結合而產生的屏蔽、天線、傳感等功能集成於一體。With the improvement of the integration of electronic devices, the volume of devices is getting smaller and smaller. At this time, the electronic components appear to be too large for the entire device, so it is necessary to reduce its size. Manufacturing and installing components by making wires and graphics for electrical and sensor functions on an injection-molded curved plastic shell, the electrical interconnection function of the ordinary circuit board, the function of supporting components and the support of the plastic shell , Protection and other functions are combined, and the functions of shielding, antennas, sensing and the like resulting from the combination of mechanical entities and conductive patterns are integrated into one.

目前有多種方式可以實現該結構的製造,但都存在其局限性和不足。目前主流的製作工藝為LDS(Laser Direct Structure,雷射光直接成型)工藝。LDS的工藝流程是對一種含有金屬組織的合成物塑料顆粒採用注塑的方式製作成塑料殼體。由於該合成物的金屬成份能夠通過雷射光進行激活,所以可通過專用雷射光設備在殼體表面按照規定的路徑進行雷射光掃描,被激活的金屬部分作為種子層,可通過電鍍或者化學鍍的方式在殼體表面沉積金屬,形成所需要的電路圖形。There are many ways to achieve the manufacture of this structure, but they all have their limitations and shortcomings. The current mainstream production process is LDS (Laser Direct Structure) process. The process of LDS is to make a plastic shell of a plastic particle containing a metal structure by injection molding. Since the metal component of the composite can be activated by laser light, it can be scanned by a dedicated laser device on the surface of the housing according to a prescribed path. The activated metal part serves as a seed layer, which can be electroplated or chemically plated. The metal is deposited on the surface of the casing to form the required circuit pattern.

在現有技術中,還公開了一種內嵌入立體電路增材製造裝置與形成方法,提出了一種對殼體材料沒有限制,可根據產品需求在殼體表面或內部完成金屬互連層的製作,不需要進行化學鍍(電鍍)等工藝,整個製造工藝可全部完成的一種裝置。解決了金屬導電層只能製作在殼體表面,容易破損和氧化的問題,同時解決了工藝複雜以及塑料基材受限等問題。In the prior art, an additive manufacturing device and forming method for an embedded three-dimensional circuit are also disclosed, and there is no restriction on the material of the housing, and the production of the metal interconnection layer can be completed on the surface or inside of the housing according to product requirements. A device that requires electroless plating (electroplating) and other processes, and the entire manufacturing process can be completed. It solves the problem that the metal conductive layer can only be made on the surface of the casing, which is easy to be damaged and oxidized, and at the same time solves the problems of complicated process and limited plastic substrate.

目前由於各種天線和傳感器的精密度越來越高,電路線寬越來越精細至微米級,很多已在5um以下。尤其隨著增材製造產品附加值的升高,良品率顯得尤為重要,內嵌金屬電路製作完成後,要對其電路檢查和修補以提升良率,中途取下做線下修補再裝回載台的方式,極易引起對位誤差以及產生應力,讓後續加工精度和良率無法保證。At present, due to the increasingly higher precision of various antennas and sensors, the circuit line width is getting finer to the micron level, and many are below 5um. Especially as the added value of the additive manufacturing products increases, the yield rate becomes more important. After the built-in metal circuit is completed, the circuit must be inspected and repaired to improve the yield rate. It is removed midway for offline repair and then reloaded. The way of the table is very easy to cause alignment errors and stress, so that the accuracy and yield of subsequent processing cannot be guaranteed.

本發明的目的在於提供一種增材製造裝置和製造方法,以解決現有修補過程需要移動基材進行線下修補而耗時、誤差大且加工精度差的問題。An object of the present invention is to provide an additive manufacturing apparatus and manufacturing method to solve the problems of time-consuming, large errors, and poor processing accuracy in the existing repair process that requires moving the substrate for offline repair.

為了達到上述目的,本發明提供了一種增材製造裝置,包括:工件台模組;殼體增材模組,配置為在所述工件台模組上形成殼體;金屬布線模組,配置為在所述殼體上設置金屬布線;布線修復模組,配置為檢測所述金屬布線的缺陷並修補所述缺陷;其中,所述殼體增材模組還配置為修補所述缺陷後在所述殼體上形成殼蓋。In order to achieve the above object, the present invention provides an additive manufacturing apparatus, including: a workpiece table module; a housing additive module configured to form a housing on the workpiece table module; a metal wiring module, configured To provide metal wiring on the housing; a wiring repair module configured to detect defects of the metal wiring and repair the defects; wherein, the housing additive module is also configured to repair the After the defect, a shell cover is formed on the shell.

進一步地,所述殼體增材模組包括供料系統和增材加工模組,所述增材加工模組配置為在所述工件台模組上加工所述供料系統提供的物料以形成殼體。Further, the casing additive module includes a feeding system and an additive processing module, the additive processing module is configured to process the material provided by the feeding system on the workpiece stage module to form case.

進一步地,所述供料系統配置為提供塑料粉,所述增材加工模組包括雷射光燒結單元和舖粉裝置,所述舖粉裝置包括第一振鏡和第一雷射光源,配置為在所述工件台模組上舖設所述塑料粉,所述雷射光燒結單元配置為加工所述物料以獲得所述殼體。Further, the feeding system is configured to provide plastic powder. The additive processing module includes a laser sintering unit and a powder spreading device. The powder spreading device includes a first galvanometer and a first laser light source, which are configured as Lay the plastic powder on the workpiece stage module, and the laser sintering unit is configured to process the material to obtain the housing.

進一步地,所述殼體增材模組還包括用於回收雷射光燒結後多餘塑料粉的回收系統。Further, the shell additive module further includes a recovery system for recovering excess plastic powder after laser sintering.

進一步地,所述供料系統配置為提供塑料絲,所述增材加工模組包括塑料絲打印頭。Further, the feeding system is configured to provide plastic filament, and the additive processing module includes a plastic filament print head.

進一步地,所述金屬布線模組包括金屬漿料承載腔、連桿機構、金屬沉積噴頭、過濾系統和加熱模組,所述金屬漿料承載腔通過所述連桿機構和所述金屬沉積噴頭連接,所述過濾系統連接在所述連桿機構上,所述加熱模組配置為固化所述金屬布線。Further, the metal wiring module includes a metal paste bearing cavity, a connecting rod mechanism, a metal deposition nozzle, a filtering system, and a heating module, and the metal paste bearing cavity passes through the connecting rod mechanism and the metal deposition A spray head is connected, the filter system is connected to the link mechanism, and the heating module is configured to solidify the metal wiring.

進一步地,所述布線修復模組包括圖像傳感器、雷射光單元和化學氣相沉積單元,所述圖像傳感器檢測所述金屬布線的所述缺陷,所述雷射光單元和所述化學氣相沉積單元根據所述圖像傳感器檢測的情況修復所述缺陷。Further, the wiring repair module includes an image sensor, a laser light unit and a chemical vapor deposition unit, the image sensor detects the defects of the metal wiring, the laser light unit and the chemical The vapor deposition unit repairs the defect according to the situation detected by the image sensor.

進一步地,所述圖像傳感器固定在所述雷射光單元上並隨所述雷射光單元的雷射光頭同步運動,或者所述圖像傳感器固定在所述金屬布線模組上並隨所述金屬布線模組同步運動。Further, the image sensor is fixed on the laser light unit and moves synchronously with the laser head of the laser light unit, or the image sensor is fixed on the metal wiring module and follows the The metal wiring module moves synchronously.

進一步地,所述雷射光單元包括第二振鏡、第二雷射光源和雷射光頭,所述第二雷射光源與所述雷射光頭連接。Further, the laser light unit includes a second galvanometer, a second laser light source, and a laser head, and the second laser light source is connected to the laser head.

進一步地,所述化學氣相沉積單元包括儲氣單元、連接管路、氣體噴嘴、氣體抽排裝置、惰性氣體單元和保護罩,所述氣體抽排裝置用於排放修復過程中產生的廢氣,所述儲氣單元通過所述連接管路和所述氣體噴嘴連接,以提供反應氣體,所述惰性氣體單元提供的惰性氣體通過所述保護罩出射,所述保護罩設置在所述氣體噴嘴外圈。Further, the chemical vapor deposition unit includes a gas storage unit, a connecting pipe, a gas nozzle, a gas extraction device, an inert gas unit, and a protective cover, and the gas extraction device is used to exhaust the waste gas generated during the repair process, The gas storage unit is connected to the gas nozzle through the connecting pipe to provide a reaction gas, and the inert gas provided by the inert gas unit exits through the protective cover, and the protective cover is provided outside the gas nozzle ring.

進一步地,所述保護罩上設置有氣體流量調節裝置,以調節所述保護罩流通的氣體流量。Further, a gas flow adjustment device is provided on the protective cover to adjust the gas flow rate of the protective cover.

本發明還提供了一種增材製造方法,包括: 步驟1:通過殼體增材模組在工件台模組上構建殼體; 步驟2:通過金屬布線模組在所述殼體上設置金屬布線; 步驟3:通過布線修復模組檢測所述金屬布線的缺陷並修復所述缺陷; 步驟4:通過殼體增材模組在布線後的殼體上形成殼蓋。The invention also provides an additive manufacturing method, including: Step 1: Build a shell on the workpiece table module through the shell additive module; Step 2: Set metal wiring on the housing through a metal wiring module; Step 3: Detect the defects of the metal wiring through the wiring repair module and repair the defects; Step 4: A shell cover is formed on the wired shell through the shell additive module.

進一步地,所述步驟1具體包括:Further, the step 1 specifically includes:

提供一目標加工模型;Provide a target processing model;

將所述殼體增材模組根據所述目標加工模型加工獲得所述殼體。The shell additive module is processed according to the target processing model to obtain the shell.

進一步地,所述步驟1還包括:通過供料系統提供物料,通過增材加工模組加工所述物料以獲得所述殼體。Further, the step 1 further includes: providing materials through a feeding system, and processing the materials through an additive processing module to obtain the housing.

進一步地,所述步驟1還包括:通過所述供料系統提供塑料粉,通過舖粉裝置在工件台模組上舖設所述塑料粉,通過雷射光燒結單元加工所述物料以獲得所述殼體。Further, the step 1 further includes: providing plastic powder through the feeding system, laying the plastic powder on the workpiece table module through a powder spreading device, and processing the material through a laser sintering unit to obtain the shell body.

進一步地,所述步驟1還包括:通過所述舖粉裝置將燒結產生的多餘塑料粉回收至回收系統。Further, the step 1 further includes: recovering excess plastic powder generated by sintering to the recovery system through the powder spreading device.

進一步地,通過供料系統提供物料,通過增材加工模組加工所述物料以獲得所述殼體還包括:通過所述供料系統提供塑料絲,通過塑料絲打印頭加工所述物料以獲得所述殼體。Further, supplying materials through a feeding system, processing the materials through an additive processing module to obtain the housing further includes: providing a plastic wire through the feeding system, and processing the material through a plastic wire print head to obtain The housing.

進一步地,所述步驟2包括:通過金屬漿料承載腔提供金屬漿料,並經過連桿機構傳輸至金屬沉積噴頭後在殼體上設置所述金屬布線。Further, the step 2 includes: providing metal paste through a metal paste bearing cavity, and transmitting the metal paste to the metal deposition nozzle through a link mechanism, and then setting the metal wiring on the housing.

進一步地,所述步驟2還包括:在所述連桿機構上設置過濾系統,以過濾從所述金屬漿料承載腔提供至所述金屬沉積噴頭的金屬漿料,在通過所述金屬沉積噴頭在所述殼體上沉積所述金屬布線後,還通過加熱模組固化所述金屬布線。Further, the step 2 further includes: setting a filtering system on the link mechanism to filter the metal slurry supplied from the metal slurry bearing cavity to the metal deposition nozzle, and passing the metal deposition nozzle After depositing the metal wiring on the casing, the metal wiring is also cured by a heating module.

進一步地,所述步驟3具體包括:通過圖像傳感器檢測所述金屬布線模組的金屬布線缺陷,通過雷射光單元和化學氣相沉積單元根據所述圖像傳感器檢測情況修復所述缺陷。Further, the step 3 specifically includes: detecting a metal wiring defect of the metal wiring module through an image sensor, and repairing the defect according to the detection situation of the image sensor through a laser light unit and a chemical vapor deposition unit .

進一步地,通過圖像傳感器檢測所述金屬布線模組的金屬布線缺陷的步驟包括:Further, the step of detecting the metal wiring defect of the metal wiring module through the image sensor includes:

設置一與所述金屬布線模組同步運動的圖像傳感器;Providing an image sensor that moves synchronously with the metal wiring module;

在布線過程中,通過所述圖像傳感器記錄並追蹤所述金屬布線模組的金屬布線情況。During the wiring process, the image sensor records and tracks the metal wiring of the metal wiring module.

進一步地,通過雷射光單元和化學氣相沉積單元根據所述圖像傳感器檢測情況修復所述缺陷的步驟包括:獲取所述圖像傳感器記錄的金屬布線情況,並獲得所述金屬布線模組布線產生的布線缺陷;根據所述布線缺陷控制雷射光單元和化學氣相沉積單元分別運動,使得雷射光單元的雷射光照射所述化學氣相沉積單元提供的反應氣體以修復所述缺陷。Further, the step of repairing the defect according to the detection condition of the image sensor by the laser light unit and the chemical vapor deposition unit includes: acquiring the metal wiring condition recorded by the image sensor, and obtaining the metal wiring pattern Wiring defects generated by group wiring; controlling the movement of the laser light unit and the chemical vapor deposition unit separately according to the wiring defects, so that the laser light of the laser light unit irradiates the reaction gas provided by the chemical vapor deposition unit to repair the Described defect.

本發明提供了一種增材製造裝置和製造方法, 解決了現有線下修補方式耗時、誤差大且加工精度差的問題,無需卸載工件台模組及基材就可對內嵌電路進行在線修補,節約設備購置成本和產線空間,且能減少製造時間和縮短製造鏈,提升了基材的後續加工精度。The invention provides an additive manufacturing device and manufacturing method, which solves the problems of time-consuming, large error and poor processing accuracy of the existing offline repair method, and can online repair the embedded circuit without unloading the workpiece table module and the substrate , Save equipment purchase cost and production line space, and can reduce manufacturing time and shorten the manufacturing chain, and improve the subsequent processing accuracy of the substrate.

下面將結合示意圖對本發明的具體實施方式進行更詳細的描述。根據下列描述和申請專利範圍,本發明的優點和特徵將更清楚。需說明的是,附圖均採用非常簡化的形式且均使用非精准的比例,僅用以方便、明晰地輔助說明本發明實施例的目的。The specific embodiments of the present invention will be described in more detail below with reference to schematic diagrams. The advantages and features of the present invention will be clearer from the following description and patent application scope. It should be noted that the drawings are in a very simplified form and all use inaccurate proportions, which are only used to conveniently and clearly assist the purpose of explaining the embodiments of the present invention.

實施例一Example one

如圖1所示,結合圖4-7,本發明實施例提供了一種增材製造裝置,包括:工件台模組1;殼體增材模組2,配置為在所述工件台模組1上形成殼體101;金屬布線模組3,配置為在所述殼體101上設置金屬布線102;布線修復模組4,配置為檢測布線缺陷並修補該缺陷形成已修補缺陷103;其中,所述殼體增材模組2還配置為修補所述缺陷後在所述殼體101上形成殼蓋104,殼蓋104可以作為殼體101的保護層,並具有穩固金屬布線結構、防止金屬布線氧化的效果。As shown in FIG. 1 and in conjunction with FIGS. 4-7, an embodiment of the present invention provides an additive manufacturing apparatus, including: a workpiece table module 1; a housing additive module 2, which is configured on the workpiece table module 1 Forming a housing 101 on top; a metal wiring module 3 configured to provide metal wiring 102 on the housing 101; a wiring repair module 4 configured to detect wiring defects and repair the defects to form a repaired defect 103 ; Wherein, the shell additive module 2 is further configured to form a shell cover 104 on the shell 101 after repairing the defect, the shell cover 104 can be used as a protective layer of the shell 101, and has a stable metal wiring Structure, the effect of preventing oxidation of metal wiring.

進一步地,所述殼體增材模組2包括供料系統21和增材加工模組,所述增材加工模組配置為在所述工件台模組1上加工所述供料系統21提供的物料以形成殼體101。在本實施例中,所述供料系統21配置為提供塑料粉,所述增材加工模組包括雷射光燒結單元22和舖粉裝置23,雷射光燒結單元22可以採用雷射光掃描振鏡系統,具體包括第一振鏡201和第一雷射光源202。Further, the shell additive module 2 includes a feeding system 21 and an additive processing module, the additive processing module is configured to process the feeding system 21 on the workpiece table module 1 to provide Of materials to form the housing 101. In this embodiment, the feeding system 21 is configured to provide plastic powder. The additive processing module includes a laser sintering unit 22 and a powder spreading device 23. The laser sintering unit 22 may use a laser scanning galvanometer system , Specifically including the first galvanometer 201 and the first laser light source 202.

優選地,所述殼體增材模組2還包括用於回收雷射光燒結後多餘塑料粉的回收系統24。在本實施例中,可以將供料系統21、工件台模組1和回收系統24均設置為能夠在Z方向上下移動,通過舖粉裝置23在X方向完成舖粉和粉末回收。Preferably, the shell additive module 2 further includes a recovery system 24 for recovering excess plastic powder after laser sintering. In this embodiment, the feeding system 21, the workpiece table module 1 and the recovery system 24 can be set to move up and down in the Z direction, and the powder spreading device 23 completes the powder spreading and powder recovery in the X direction.

在本實施例中,對塑料粉進行分層燒結,燒結路徑和圖形根據目標加工模型而定,每完成一層燒結後,工件台模組1向下移動,移動距離與燒結層厚度相當。工件台模組1在Z向下移後,通過舖粉裝置23從供料系統21中將塑料粉平舖到工件台模組1上。工件台模組1上多餘的塑料粉將通過舖粉裝置23轉移到回收系統24上,回收系統24完成一層塑料粉回收後,將Z向下移動,最後舖粉裝置23回到起始位置。反復操作以形成所述的殼體101。In this embodiment, the plastic powder is layered and sintered, and the sintering path and pattern are determined according to the target processing model. After each layer of sintering is completed, the workpiece stage module 1 moves downward by a distance equivalent to the thickness of the sintered layer. After the workpiece table module 1 moves downward in Z, the plastic powder is laid out on the workpiece table module 1 from the feeding system 21 by the powder spreading device 23. The excess plastic powder on the workpiece table module 1 will be transferred to the recovery system 24 through the powder spreading device 23. After the recovery system 24 completes the recovery of a layer of plastic powder, Z is moved downward, and finally the powder spreading device 23 returns to the starting position. Repeat the operation to form the casing 101 as described above.

進一步地,所述金屬布線模組3包括金屬漿料承載腔31、連桿機構32、金屬沉積噴頭33和過濾系統34,所述金屬漿料承載腔31通過所述連桿機構32和金屬沉積噴頭33連接,所述過濾系統34連接在所述連桿機構32上。優選地,連桿機構32可以在X、Y和Z三方向運動,金屬沉積噴頭33可以六自由度運動,所述金屬布線模組3形成的金屬線條寬度例如為5~150um。Further, the metal wiring module 3 includes a metal paste bearing cavity 31, a link mechanism 32, a metal deposition nozzle 33, and a filtering system 34. The metal paste bearing cavity 31 passes through the link mechanism 32 and the metal A deposition nozzle 33 is connected, and the filter system 34 is connected to the link mechanism 32. Preferably, the link mechanism 32 can move in three directions of X, Y, and Z, the metal deposition nozzle 33 can move in six degrees of freedom, and the width of the metal line formed by the metal wiring module 3 is, for example, 5 to 150 um.

具體地,所述金屬布線模組3還包括加熱模組(圖中未標注),所述加熱模組配置為固化金屬布線,加熱模組例如可以設置在工件台模組1上,加熱溫度例如可以為100~200℃。Specifically, the metal wiring module 3 further includes a heating module (not shown in the figure). The heating module is configured to solidify metal wiring. The heating module may be provided on the workpiece table module 1 for heating, for example. The temperature may be, for example, 100 to 200°C.

在本實施例中,所述布線修復模組4包括圖像傳感器41、雷射光單元42和化學氣相沉積單元43,所述圖像傳感器41檢測所述金屬布線模組3的金屬布線缺陷,圖像傳感器41例如可以安裝在金屬布線模組3中的連桿機構32上,並隨著金屬沉積噴頭33一起運動,圖像傳感器41也可以固定在雷射光單元42的雷射光頭(未圖示)上,並隨雷射光頭一起運動,所述雷射光單元42和所述化學氣相沉積單元43根據所述圖像傳感器41檢測情況修復所述缺陷。In this embodiment, the wiring repair module 4 includes an image sensor 41, a laser unit 42 and a chemical vapor deposition unit 43, and the image sensor 41 detects the metal cloth of the metal wiring module 3 Line defects, the image sensor 41 can be mounted on the link mechanism 32 in the metal wiring module 3, and moves with the metal deposition nozzle 33, the image sensor 41 can also be fixed to the laser light of the laser light unit 42 On the head (not shown), and moves together with the laser head, the laser unit 42 and the chemical vapor deposition unit 43 repair the defect according to the detection condition of the image sensor 41.

請繼續參考圖1,化學氣相沉積單元43包括儲氣單元403、連接管路404、氣體噴嘴405和氣體抽排裝置407,儲氣單元403通過連接管路404和氣體噴嘴405連接,以提供反應氣體。優選地,雷射光單元42的雷射光頭可以六自由度運動,連接管路404可以在X、Y和Z三方向運動,氣體噴嘴405可以六自由度運動。Please continue to refer to FIG. 1, the chemical vapor deposition unit 43 includes a gas storage unit 403, a connecting pipe 404, a gas nozzle 405, and a gas extraction device 407, and the gas storage unit 403 is connected to the gas nozzle 405 through the connecting pipe 404 to provide Reactive gas. Preferably, the laser head of the laser light unit 42 can move in six degrees of freedom, the connecting pipe 404 can move in three directions of X, Y, and Z, and the gas nozzle 405 can move in six degrees of freedom.

為了在修復過程中提供保護,所述化學氣相沉積單元43還包括惰性氣體單元,所述惰性氣體單元提供的惰性氣體通過所述保護罩出射,所述保護罩設置在所述氣體噴嘴外圈,以使得惰性氣體能夠包圍反應氣體,形成相對隔絕的反應環境,避免反應過程受到干擾。在本實施例中,所述保護罩上設置有氣體流量調節裝置(未圖示),以調節所述保護罩流通的氣體流量,氣體噴嘴405連同保護罩406也可以六自由度運動。如圖2a和圖2b所示,保護罩可以控制半圓部分的孔開通而另半圓部分關閉,開通的孔噴出氮氣或其它惰性氣體,用以隔離反應氣體在反應區而不跑到外部區域。在雷射光照射的同時,通入金屬反應氣體,進行化學氣相沉積,修補斷線電路缺陷,修補過程產生的廢氣由氣體抽排裝置407抽排。In order to provide protection during the repair process, the chemical vapor deposition unit 43 further includes an inert gas unit, the inert gas provided by the inert gas unit exits through the protective cover, and the protective cover is provided on the outer ring of the gas nozzle , So that the inert gas can surround the reaction gas, forming a relatively isolated reaction environment, to avoid interference of the reaction process. In this embodiment, a gas flow adjustment device (not shown) is provided on the protective cover to adjust the flow of gas flowing through the protective cover. The gas nozzle 405 and the protective cover 406 can also move in six degrees of freedom. As shown in FIGS. 2a and 2b, the protective cover can control the opening of the semi-circular part and the other semi-circular part to close. The opened hole sprays nitrogen or other inert gas to isolate the reaction gas in the reaction zone without running to the outside area. Simultaneously with the laser light irradiation, metal reaction gas is introduced to perform chemical vapor deposition to repair the broken circuit defects. The exhaust gas generated during the repair process is exhausted by the gas exhaust device 407.

在本實施例中,增材製造裝置還包括用於實現增材製造的成型腔5,可以將成型腔5的內部設置為真空,以保護金屬布線過程中的不同金屬材料。優選地,成型腔5包括雷射光保護鏡51。在本實施例中,可以將雷射光燒結單元22和雷射光單元42均設置為雷射光掃描振鏡系統,雷射光單元42包括第二振鏡401、第二雷射光源402和雷射光頭(未圖示),可以僅採用一套雷射光掃描振鏡系統實現雷射光燒結單元22和雷射光單元42的功能,也可以採用兩套雷射光掃描振鏡系統分別實現雷射光燒結單元22和雷射光單元42的功能。In this embodiment, the additive manufacturing apparatus further includes a forming cavity 5 for implementing additive manufacturing. The inside of the forming cavity 5 may be set to a vacuum to protect different metal materials in the metal wiring process. Preferably, the molding cavity 5 includes a laser light protection mirror 51. In this embodiment, both the laser sintering unit 22 and the laser light unit 42 can be configured as a laser scanning galvanometer system. The laser light unit 42 includes a second galvanometer 401, a second laser light source 402, and a laser head ( (Not shown), only one set of laser scanning galvanometer system can be used to realize the functions of laser sintering unit 22 and laser unit 42, or two sets of laser scanning galvanometer system can be used to realize laser sintering unit 22 and laser respectively The function of the light emitting unit 42.

本發明實施例還提供了一種增材製造方法,包括: 步驟1:通過殼體增材模組2在工件台模組1上構建殼體101; 步驟2:通過金屬布線模組3在殼體101上設置金屬布線102; 步驟3:通過布線修復模組4對布線進行檢測並修復缺陷; 步驟4:通過殼體增材模組2在布線後殼體上增覆殼蓋104。An embodiment of the present invention also provides an additive manufacturing method, including: Step 1: Construct the housing 101 on the workpiece stage module 1 through the housing additive module 2; Step 2: Set the metal wiring 102 on the casing 101 through the metal wiring module 3; Step 3: Detect and repair the wiring through the wiring repair module 4; Step 4: Add the housing cover 104 on the housing after wiring through the housing additive module 2.

進一步地,所述步驟1具體包括: 步驟1.1:提供一目標加工模型; 步驟1.2:將所述殼體增材模組2根據所述目標加工模型加工獲得所述殼體101。Further, the step 1 specifically includes: Step 1.1: Provide a target processing model; Step 1.2: Process the shell additive module 2 according to the target processing model to obtain the shell 101.

進一步地,通過供料系統21提供物料,通過增材加工模組加工所述物料以獲得所述殼體101。在本實施例中,通過所述供料系統21提供塑料粉,通過舖粉裝置23在工件台模組上舖設所述塑料粉,通過雷射光燒結單元22加工所述物料以獲得所述殼體101。Further, the material is provided through the feeding system 21, and the material is processed through the additive processing module to obtain the housing 101. In this embodiment, the plastic powder is provided by the feeding system 21, the plastic powder is laid on the workpiece table module by the powder spreading device 23, and the material is processed by the laser sintering unit 22 to obtain the housing 101.

優選地,通過所述舖粉裝置23將燒結產生的多餘塑料粉回收至回收系統24。在本實施例中,可以將供料系統21、工件台模組1和回收系統24均設置為能夠在z方向上下移動,通過舖粉裝置23完成舖粉和粉末回收。Preferably, the powder spreading device 23 recovers the excess plastic powder generated by sintering to the recovery system 24. In this embodiment, the feeding system 21, the workpiece table module 1 and the recovery system 24 can be set to be able to move up and down in the z direction, and the powder spreading device 23 can complete powder spreading and powder recovery.

進一步地,所述步驟2具體包括:Further, the step 2 specifically includes:

通過金屬漿料承載腔31提供金屬漿料,並經過連桿機構32傳輸至金屬沉積噴頭33後在在殼體101上設置金屬布線102,在所述連桿機構32上設置過濾系統34,以過濾從金屬漿料承載腔提供至金屬沉積噴頭的金屬漿料。The metal slurry is provided through the metal slurry bearing cavity 31, and is transmitted to the metal deposition nozzle 33 through the link mechanism 32. A metal wiring 102 is provided on the housing 101, and a filter system 34 is provided on the link mechanism 32. To filter the metal slurry supplied from the metal slurry carrying cavity to the metal deposition nozzle.

具體地,在通過所述金屬沉積噴頭33在所述殼體101上沉積金屬布線102後,還通過加熱模組固化所述金屬布線。Specifically, after the metal wiring 102 is deposited on the housing 101 by the metal deposition nozzle 33, the metal wiring is also cured by the heating module.

進一步地,所述步驟3具體包括:Further, the step 3 specifically includes:

通過圖像傳感器41檢測所述金屬布線模組3的金屬布線缺陷,通過雷射光單元42和化學氣相沉積單元43根據所述圖像傳感器41檢測情況修復所述缺陷。The metal wiring defect of the metal wiring module 3 is detected by the image sensor 41, and the defect is repaired by the laser light unit 42 and the chemical vapor deposition unit 43 according to the detection situation of the image sensor 41.

進一步地,通過圖像傳感器41檢測所述金屬布線模組3的金屬布線缺陷的步驟包括:Further, the step of detecting the metal wiring defect of the metal wiring module 3 by the image sensor 41 includes:

設置一與所述金屬布線模組同步運動的圖像傳感器;Providing an image sensor that moves synchronously with the metal wiring module;

在布線過程中,通過所述圖像傳感器41記錄並追蹤所述金屬布線模組3的金屬布線情況。During the wiring process, the image sensor 41 records and tracks the metal wiring of the metal wiring module 3.

進一步地,通過雷射光單元和化學氣相沉積單元根據所述圖像傳感器41檢測情況修復所述缺陷的步驟包括:Further, the step of repairing the defect according to the detection condition of the image sensor 41 by the laser light unit and the chemical vapor deposition unit includes:

獲取所述圖像傳感器41記錄的金屬布線情況,並獲得所述金屬布線模組3布線產生的布線缺陷;Obtain the metal wiring condition recorded by the image sensor 41, and obtain wiring defects generated by the wiring of the metal wiring module 3;

根據所述布線缺陷控制雷射光單元和化學氣相沉積單元43分別運動,使得雷射光單元的雷射光照射所述化學氣相沉積單元提供的反應氣體以修復所述缺陷。The laser light unit and the chemical vapor deposition unit 43 are controlled to move respectively according to the wiring defects, so that the laser light of the laser light unit irradiates the reaction gas provided by the chemical vapor deposition unit to repair the defect.

請繼續參考圖1,化學氣相沉積單元43包括儲氣單元403、連接管路404、氣體噴嘴405和氣體抽排裝置407,儲氣單元403通過連接管路404和氣體噴嘴405連接。為了在修復過程中提供保護,所述化學氣相沉積單元43還包括惰性氣體單元,惰性氣體單元通過保護罩406控制噴射,修補過程中,雷射光單元42的雷射光頭(未圖示)可以六自由度運動,氣體噴嘴405連同保護罩406也可以六自由度運動。如圖2a和圖2b所示,保護罩可以控制半圓部分的孔開通而另半圓部分關閉,開通的孔噴出氮氣或其它惰性氣體,用以隔離反應氣體在反應區而不跑到外部區域。在雷射光照射的同時,通入金屬反應氣體,進行化學氣相沉積,修補斷線電路缺陷,修補過程產生的廢氣由氣體抽排裝置407抽排。1, the chemical vapor deposition unit 43 includes a gas storage unit 403, a connecting pipe 404, a gas nozzle 405, and a gas extraction device 407, and the gas storage unit 403 is connected to the gas nozzle 405 through the connecting pipe 404. In order to provide protection during the repair process, the chemical vapor deposition unit 43 further includes an inert gas unit. The inert gas unit controls spraying through the protective cover 406. During the repair process, the laser head (not shown) of the laser light unit 42 may be With six degrees of freedom, the gas nozzle 405 and the protective cover 406 can also move with six degrees of freedom. As shown in FIGS. 2a and 2b, the protective cover can control the opening of the semi-circular part and the other semi-circular part to close. The opened hole sprays nitrogen or other inert gas to isolate the reaction gas in the reaction zone without running to the outside area. Simultaneously with the laser light irradiation, metal reaction gas is introduced to perform chemical vapor deposition to repair the broken circuit defects. The exhaust gas generated during the repair process is exhausted by the gas exhaust device 407.

在本實施例中,增材製造裝置還包括用於實現增材製造的成型腔5,可以將成型腔5的內部設置為真空,以保護金屬布線過程中的不同金屬材料。優選地,成型腔5包括雷射光保護鏡51。In this embodiment, the additive manufacturing apparatus further includes a forming cavity 5 for implementing additive manufacturing. The inside of the forming cavity 5 may be set to a vacuum to protect different metal materials in the metal wiring process. Preferably, the molding cavity 5 includes a laser light protection mirror 51.

請參考圖3,本實施例提供的增材加工的具體實施方法包括: 一、採用三維立體模型分層切片的STL格式文件作為目標加工模型; 二、舖粉裝置23根據分層厚度從供料系統21中將塑料粉平舖到工件台模組1上; 三、雷射光燒結單元22燒結工件台模組1上的塑料粉; 四、通過重複步驟二和步驟三,形成基礎塑料殼體101; 五、根據STL格式文件的分層,採用金屬布線模組3在殼體101對應的位置上沉積金屬線條102,並加熱固化; 六、根據金屬沉積布線時圖像傳感器41記錄和追蹤到的電路缺陷,採用雷射光照射反應氣體進行化學氣相沉積進行修補,沉積金屬斷線缺陷; 七、根據STL格式文件的分層,採用舖粉裝置23根據分層厚度從供料系統21中將塑料粉平舖到工件台模組1上; 八、雷射光燒結單元22燒結工件台模組1上的塑料粉; 九、重複步驟七和步驟八形成用於作為塑料殼體覆蓋層的殼蓋104。Please refer to FIG. 3, the specific implementation method of the additive processing provided in this embodiment includes: 1. Use the STL format file of the three-dimensional three-dimensional model layered slice as the target processing model; 2. The powder spreading device 23 flattens the plastic powder from the feeding system 21 on the workpiece table module 1 according to the layer thickness; 3. The laser powder sintering unit 22 sinters the plastic powder on the workpiece table module 1; 4. By repeating steps 2 and 3, the basic plastic casing 101 is formed; 5. According to the layering of the STL format file, the metal wiring module 3 is used to deposit the metal line 102 on the corresponding position of the casing 101, and heat and solidify; Sixth, according to the circuit defects recorded and tracked by the image sensor 41 when the metal is deposited and wired, the laser gas is used to irradiate the reactive gas for chemical vapor deposition to repair, and the metal breakage defect is deposited; 7. According to the layering of the STL format file, the powder spreading device 23 is used to flatten the plastic powder from the feeding system 21 to the workpiece table module 1 according to the layer thickness; 8. The laser powder sintering unit 22 sinters the plastic powder on the workpiece table module 1; 9. Repeat steps 7 and 8 to form the cover 104 for the plastic cover.

實施例二Example 2

請參考圖8,與實施例一不同,實施例二中的供料系統21配置為提供塑料絲,所述增材加工模組包括塑料絲打印頭。進一步地,通過所述供料系統21提供塑料絲,增材製造裝置還包括運動機構26,通過運動機構26帶動塑料絲打印頭25運動以加工所述物料以獲得所述殼體,運動機構26能夠帶動塑料絲打印頭25 在X、Y、Z向運動,塑料絲打印頭25能夠進行六自由度運動,運動機構26帶動所述金屬沉積噴頭33運動以實現金屬布線,例如六自由度運動。Please refer to FIG. 8. Unlike the first embodiment, the feeding system 21 in the second embodiment is configured to provide plastic filaments, and the additive processing module includes a plastic filament print head. Further, the plastic wire is provided through the feeding system 21, and the additive manufacturing device further includes a moving mechanism 26, which drives the plastic wire printing head 25 to move to process the material to obtain the housing, and the moving mechanism 26 It can drive the plastic wire print head 25 to move in X, Y, and Z directions. The plastic wire print head 25 can perform six-degree-of-freedom movement. The movement mechanism 26 drives the metal deposition nozzle 33 to realize metal wiring, such as six-degree-of-freedom movement. .

請參考圖9,本實施例提供的增材加工的具體實施方法包括: 一、採用三維立體模型分層切片的STL格式文件作為目標加工模型; 二、根據STL格式文件的分層,通過運動機構26控制塑料絲打印頭25實現六自由度運動,增材製造塑料殼體; 三、通過重複步驟二,形成製造基礎塑料殼體101; 四、根據STL格式文件的分層,通過運動機構26控制金屬沉積噴頭33實現六自由度運動,在對應的位置上沉積金屬線條102,並通過加熱固化; 五、根據金屬沉積時圖像傳感器記錄和追蹤到的電路缺陷,採用雷射光照射反應氣體進行化學氣相沉積進行修補,沉積金屬斷線缺陷103; 六、根據STL格式文件的分層,通過運動機構26控制塑料絲打印頭25實現六自由度運動,形成用於作為塑料殼體覆蓋層的殼蓋104。Please refer to FIG. 9, the specific implementation method of the additive processing provided in this embodiment includes: 1. Use the STL format file of the three-dimensional three-dimensional model layered slice as the target processing model; 2. According to the layering of the STL format file, the plastic thread print head 25 is controlled by the motion mechanism 26 to achieve six degrees of freedom movement, and the plastic shell is manufactured by additive manufacturing; 3. By repeating step two, the basic plastic casing 101 is formed; Fourth, according to the layering of the STL format file, the metal deposition nozzle 33 is controlled by the movement mechanism 26 to achieve six degrees of freedom movement, the metal line 102 is deposited at the corresponding position, and cured by heating; 5. According to the circuit defects recorded and tracked by the image sensor during metal deposition, the laser gas is used to irradiate the reactive gas for chemical vapor deposition to repair, and the metal wire defect 103 is deposited; 6. According to the layering of the STL format file, the plastic printing head 25 is controlled by the movement mechanism 26 to achieve six degrees of freedom movement, forming a shell cover 104 that is used as a plastic shell cover layer.

圖8中示意了雷射光燒結單元22,未示意雷射光單元42,本領域技術人員在實施例一基礎上可以直接毫無疑義獲知本實施例二中其他內容,故在此不再贅述。In FIG. 8, the laser sintering unit 22 is illustrated, and the laser sintering unit 42 is not illustrated. Those skilled in the art can directly learn other contents of this second embodiment without any doubt based on the first embodiment, so they will not be described here.

本發明實施例提供了一種增材製造裝置和製造方法, 解決了現有線下修補方式耗時、誤差大且加工精度差的問題,無需卸載工件台模組及基材就可對內嵌電路進行在線修補,節約設備購置成本和產線空間,且能減少製造時間和縮短製造鏈,提升了基材的後續加工精度。The embodiment of the present invention provides an additive manufacturing device and manufacturing method, which solves the problems of time-consuming, large error and poor processing accuracy of the existing offline repair method, and can perform embedded circuit without unloading the workpiece table module and the substrate Online repairs save equipment purchase costs and production line space, and can reduce manufacturing time and shorten the manufacturing chain, improving the subsequent processing accuracy of the substrate.

上述僅為本發明的優選實施例而已,並不對本發明起到任何限制作用。任何所屬技術領域的技術人員,在不脫離本發明的技術方案的範圍內,對本發明揭露的技術方案和技術內容做任何形式的等同替換或修改等變動,均屬未脫離本發明的技術方案的內容,仍屬於本發明的保護範圍之內。The above are only preferred embodiments of the present invention and do not limit the present invention in any way. Any person skilled in the art in the art, without departing from the scope of the technical solution of the present invention, makes any form of equivalent replacement or modification of the technical solution and technical content disclosed by the present invention, which are all within the technical solution of the present invention. The content still falls within the protection scope of the present invention.

1‧‧‧工件台模組 2‧‧‧殼體增材模組 3‧‧‧金屬布線模組 4‧‧‧布線修復模組 5‧‧‧成型腔 101‧‧‧殼體 102‧‧‧金屬布線 103‧‧‧已修補缺陷 104‧‧‧殼蓋 21‧‧‧供料系統 22‧‧‧雷射光燒結單元 201‧‧‧第一振鏡 202‧‧‧第一雷射光源 23‧‧‧舖粉裝置 24‧‧‧回收系統 25‧‧‧塑料絲打印頭 26‧‧‧運動機構 31‧‧‧金屬漿料承載腔 32‧‧‧連桿機構 33‧‧‧金屬沉積噴頭 34‧‧‧過濾系統 41‧‧‧圖像傳感器 42‧‧‧雷射光單元 401‧‧‧第二振鏡 402‧‧‧第二雷射光源 43‧‧‧化學氣相沉積單元 403‧‧‧儲氣單元 404‧‧‧連接管路 405‧‧‧氣體噴嘴 406‧‧‧保護罩 407‧‧‧氣體抽排裝置 51‧‧‧雷射光保護鏡1‧‧‧Workbench module 2‧‧‧Shell Additive Module 3‧‧‧Metal wiring module 4‧‧‧Wiring repair module 5‧‧‧Molding cavity 101‧‧‧Housing 102‧‧‧Metal wiring 103‧‧‧ Defect repaired 104‧‧‧Shell cover 21‧‧‧Feeding system 22‧‧‧Laser sintering unit 201‧‧‧First galvanometer 202‧‧‧First laser light source 23‧‧‧Powder spreading device 24‧‧‧Recycling system 25‧‧‧plastic filament print head 26‧‧‧Sports agency 31‧‧‧ Metal paste bearing cavity 32‧‧‧Link mechanism 33‧‧‧ metal deposition nozzle 34‧‧‧ Filter system 41‧‧‧Image sensor 42‧‧‧Laser unit 401‧‧‧Second galvanometer 402‧‧‧Second laser light source 43‧‧‧ Chemical Vapor Deposition Unit 403‧‧‧Gas storage unit 404‧‧‧ connection pipeline 405‧‧‧ gas nozzle 406‧‧‧Protection cover 407‧‧‧Gas extraction device 51‧‧‧Laser protection lens

圖1為本發明實施例一提供的增材製造裝置的結構示意圖; 圖2a為本發明實施例一提供的氣體噴頭和保護罩處的主視圖; 圖2b為本發明實施例一提供的氣體噴頭和保護罩處的仰視圖; 圖3為本發明實施例一提供的增材製造方法的流程圖; 圖4為本發明實施例一提供的殼體增材模組製造的殼體的結構示意圖; 圖5為本發明實施例一提供的金屬布線模組在殼體上製造金屬布線的結構示意圖; 圖6為本發明實施例一提供的布線修復模組修復布線缺陷的原理圖; 圖7為本發明實施例一提供的殼體增材模組在殼體上形成殼蓋的結構示意圖; 圖8為本發明實施例二提供的增材製造裝置的主視圖; 圖9為本發明實施例二提供的增材製造方法的流程圖。1 is a schematic structural diagram of an additive manufacturing apparatus provided in Embodiment 1 of the present invention; 2a is a front view of a gas nozzle and a protective cover provided in Embodiment 1 of the present invention; 2b is a bottom view of the gas nozzle and the protective cover provided in Embodiment 1 of the present invention; FIG. 3 is a flowchart of an additive manufacturing method provided by Embodiment 1 of the present invention; 4 is a schematic structural diagram of a shell manufactured by a shell additive module provided in Embodiment 1 of the present invention; 5 is a schematic structural diagram of manufacturing a metal wiring on a casing by a metal wiring module according to Embodiment 1 of the present invention; 6 is a schematic diagram of a wiring repair module provided by Embodiment 1 of the present invention to repair wiring defects; 7 is a schematic structural view of the shell additive module provided in Embodiment 1 of the present invention to form a shell cover on the shell; 8 is a front view of an additive manufacturing apparatus provided by Embodiment 2 of the present invention; 9 is a flowchart of an additive manufacturing method provided by Embodiment 2 of the present invention.

1‧‧‧工件台模組 1‧‧‧Workbench module

2‧‧‧殼體增材模組 2‧‧‧Shell Additive Module

3‧‧‧金屬布線模組 3‧‧‧Metal wiring module

4‧‧‧布線修復模組 4‧‧‧Wiring repair module

5‧‧‧成型腔 5‧‧‧Molding cavity

21‧‧‧供料系統 21‧‧‧Feeding system

22‧‧‧雷射光燒結單元 22‧‧‧Laser sintering unit

201‧‧‧第一振鏡 201‧‧‧First galvanometer

202‧‧‧第一雷射光源 202‧‧‧First laser light source

23‧‧‧舖粉裝置 23‧‧‧Powder spreading device

24‧‧‧回收系統 24‧‧‧Recycling system

31‧‧‧金屬漿料承載腔 31‧‧‧ Metal paste bearing cavity

32‧‧‧連桿機構 32‧‧‧Link mechanism

33‧‧‧金屬沉積噴頭 33‧‧‧ metal deposition nozzle

34‧‧‧過濾系統 34‧‧‧ Filter system

41‧‧‧圖像傳感器 41‧‧‧Image sensor

42‧‧‧雷射光單元 42‧‧‧Laser unit

401‧‧‧第二振鏡 401‧‧‧Second galvanometer

402‧‧‧第二雷射光源 402‧‧‧Second laser light source

43‧‧‧化學氣相沉積單元 43‧‧‧ Chemical Vapor Deposition Unit

403‧‧‧儲氣單元 403‧‧‧Gas storage unit

404‧‧‧連接管路 404‧‧‧ connection pipeline

405‧‧‧氣體噴嘴 405‧‧‧ gas nozzle

406‧‧‧保護罩 406‧‧‧Protection cover

407‧‧‧氣體抽排裝置 407‧‧‧Gas extraction device

51‧‧‧雷射光保護鏡 51‧‧‧Laser protection lens

Claims (20)

一種增材製造裝置,其特徵在於包括:工件台模組;殼體增材模組,配置為在所述工件台模組上形成殼體;金屬布線模組,配置為在所述殼體上設置金屬布線;布線修復模組,配置為檢測所述金屬布線的缺陷並修補所述缺陷;其中,所述殼體增材模組還配置為修補所述缺陷後在所述殼體上形成殼蓋;以及所述殼體增材模組包括供料系統和增材加工模組,所述增材加工模組配置為在所述工件台模組上加工所述供料系統提供的物料以形成所述殼體。 An additive manufacturing device, characterized by comprising: a workpiece table module; a housing additive module configured to form a housing on the workpiece table module; a metal wiring module configured to be located in the housing Metal wiring is provided on the wiring; a wiring repair module is configured to detect defects of the metal wiring and repair the defects; wherein, the shell additive module is also configured to repair the defects in the shell A shell cover is formed on the body; and the shell additive module includes a feeding system and an additive processing module, the additive processing module is configured to process the feeding system provided on the workpiece table module To form the housing. 如請求項1所述的增材製造裝置,其中所述供料系統配置為提供塑料粉,所述增材加工模組包括雷射光燒結單元和舖粉裝置,所述舖粉裝置包括第一振鏡和第一雷射光源,配置為在所述工件台模組上舖設所述塑料粉,所述雷射光燒結單元配置為加工所述物料以獲得所述殼體。 The additive manufacturing device according to claim 1, wherein the feeding system is configured to provide plastic powder, the additive processing module includes a laser sintering unit and a powder spreading device, and the powder spreading device includes a first vibration The mirror and the first laser light source are configured to lay the plastic powder on the workpiece stage module, and the laser sintering unit is configured to process the material to obtain the housing. 如請求項2所述的增材製造裝置,其中所述殼體增材模組還包括用於回收雷射光燒結後多餘塑料粉的回收系統。 The additive manufacturing device according to claim 2, wherein the shell additive module further includes a recovery system for recovering excess plastic powder after laser sintering. 如請求項1所述的增材製造裝置,其中所述供料系統配置為提供塑料絲,所述增材加工模組包括塑料絲打印頭。 The additive manufacturing apparatus according to claim 1, wherein the feeding system is configured to provide plastic filaments, and the additive processing module includes a plastic filament print head. 如請求項1所述的增材製造裝置,其中所述金屬布線模組包括金屬漿料承載腔、連桿機構、金屬沉積噴頭、過濾系統和加熱模組,所述金屬漿料承載腔通過所述連桿機構和所述金屬沉積噴頭連接,所述過濾系統連接在所述連桿機構上,所述加熱模組配置為固化所述金屬布線。 The additive manufacturing apparatus according to claim 1, wherein the metal wiring module includes a metal paste bearing cavity, a link mechanism, a metal deposition nozzle, a filtration system, and a heating module, and the metal paste bearing cavity passes through The link mechanism is connected to the metal deposition nozzle, the filter system is connected to the link mechanism, and the heating module is configured to solidify the metal wiring. 如請求項1所述的增材製造裝置,其中所述布線修復模組包括圖像傳感器、雷射光單元和化學氣相沉積單元,所述圖像傳感器檢測所述金屬布線的所述缺陷,所述雷射光單元和所述化學氣相沉積單元根據所述圖像傳感器檢測的情況修復所述缺陷。 The additive manufacturing apparatus according to claim 1, wherein the wiring repair module includes an image sensor, a laser light unit, and a chemical vapor deposition unit, and the image sensor detects the defect of the metal wiring , The laser light unit and the chemical vapor deposition unit repair the defect according to the situation detected by the image sensor. 如請求項6所述的增材製造裝置,其中所述圖像傳感器固定在所述雷射光單元上並隨所述雷射光單元的雷射光頭同步運動,或者所述圖像傳感器固定在所述金屬布線模組上並隨所述金屬布線模組同步運動。 The additive manufacturing apparatus according to claim 6, wherein the image sensor is fixed on the laser light unit and moves synchronously with the laser head of the laser light unit, or the image sensor is fixed on the The metal wiring module moves synchronously with the metal wiring module. 如請求項6所述的增材製造裝置,其中所述雷射光單元包括第二振鏡、第二雷射光源和雷射光頭,所述第二雷射光源與所述雷射光頭連接。 The additive manufacturing apparatus according to claim 6, wherein the laser light unit includes a second galvanometer, a second laser light source, and a laser head, and the second laser light source is connected to the laser head. 如請求項6所述的增材製造裝置,其中所述化學氣相沉積單元包括儲氣單元、連接管路、氣體噴嘴、氣體抽排裝置、惰性氣體單元和保護罩,所述氣體抽排裝置用於排放修復過程中產生的廢氣,所述儲氣單元通過所述連接管路和所述氣體噴嘴連接,以提供反應氣體,所述惰性氣體單元提供的惰性氣體通過所述保護罩出射,所述保護罩設置在所述氣體噴嘴外圈。 The additive manufacturing apparatus according to claim 6, wherein the chemical vapor deposition unit includes a gas storage unit, a connecting pipe, a gas nozzle, a gas extraction device, an inert gas unit, and a protective cover, the gas extraction device It is used to discharge the exhaust gas generated during the repair process. The gas storage unit is connected to the gas nozzle through the connecting pipe to provide a reaction gas. The inert gas provided by the inert gas unit is emitted through the protective cover. The protective cover is provided on the outer ring of the gas nozzle. 如請求項9所述的增材製造裝置,其中所述保護罩上設置有氣體流量調節裝置,以調節所述保護罩流通的氣體流量。 The additive manufacturing apparatus according to claim 9, wherein a gas flow adjustment device is provided on the protective cover to adjust the gas flow rate of the protective cover. 一種增材製造方法,其特徵在於,包括:步驟1:通過殼體增材模組在工件台模組上構建殼體;步驟2:通過金屬布線模組在所述殼體上設置金屬布線;步驟3:通過布線修復模組檢測所述金屬布線的缺陷並修復所述缺陷;步驟4:通過殼體增材模組在布線後的殼體上形成殼蓋;其中所述步驟1包括: 提供一目標加工模型;將所述殼體增材模組根據所述目標加工模型加工獲得所述殼體。 An additive manufacturing method, characterized in that it includes: step 1: constructing a shell on a workpiece stage module through a shell additive module; step 2: setting a metal cloth on the shell through a metal wiring module Wire; Step 3: detect the defects of the metal wiring through the wiring repair module and repair the defects; Step 4: form a shell cover on the wired housing through the shell additive module; wherein the Step 1 includes: A target processing model is provided; the shell additive module is processed according to the target processing model to obtain the shell. 如請求項11所述的增材製造方法,其中所述步驟1還包括:通過供料系統提供物料,通過增材加工模組加工所述物料以獲得所述殼體。 The additive manufacturing method according to claim 11, wherein the step 1 further comprises: providing a material through a feeding system, and processing the material through an additive processing module to obtain the housing. 如請求項12所述的增材製造方法,其中所述步驟1還包括:通過所述供料系統提供塑料粉,通過舖粉裝置在工件台模組上舖設所述塑料粉,通過雷射光燒結單元加工所述物料以獲得所述殼體。 The additive manufacturing method according to claim 12, wherein the step 1 further comprises: providing plastic powder through the feeding system, laying the plastic powder on the workpiece table module through a powder spreading device, and sintering through laser light The unit processes the material to obtain the housing. 如請求項13所述的增材製造方法,其中所述步驟1還包括:通過所述舖粉裝置將燒結產生的多餘塑料粉回收至回收系統。 The additive manufacturing method according to claim 13, wherein the step 1 further comprises: recovering excess plastic powder generated by sintering to the recovery system through the powder spreading device. 如請求項12所述的增材製造方法,其中通過供料系統提供物料,通過增材加工模組加工所述物料以獲得所述殼體還包括:通過所述供料系統提供塑料絲,通過塑料絲打印頭加工所述物料以獲得所述殼體。 The additive manufacturing method according to claim 12, wherein the material is provided through a feeding system, and the material is processed through an additive processing module to obtain the housing, further comprising: providing a plastic wire through the feeding system, through A plastic silk print head processes the material to obtain the housing. 如請求項11所述的增材製造方法,其中所述步驟2包括:通過金屬漿料承載腔提供金屬漿料,並經過連桿機構傳輸至金屬沉積噴頭後在殼體上設置所述金屬布線。 The additive manufacturing method according to claim 11, wherein the step 2 includes: providing metal slurry through a metal slurry bearing cavity, and transmitting the metal slurry to the metal deposition nozzle through a link mechanism, and then setting the metal cloth on the housing line. 如請求項16所述的增材製造方法,其中所述步驟2還包括:在所述連桿機構上設置過濾系統,以過濾從所述金屬漿料承載腔提供至所述金屬沉積噴頭的金屬漿料,在通過所述金屬沉積噴頭在所述殼體上沉積所述金屬布線後,還通過加熱模組固化所述金屬布線。 The additive manufacturing method according to claim 16, wherein the step 2 further includes: providing a filter system on the link mechanism to filter the metal supplied from the metal slurry bearing cavity to the metal deposition nozzle After depositing the metal wiring on the casing by the metal deposition nozzle, the metal wiring is also cured by the heating module. 如請求項11所述的增材製造方法,其中所述步驟3包括:通過圖像傳感器檢測所述金屬布線模組的金屬布線缺陷,通過雷射光單元和化學氣相沉積單元根據所述圖像傳感器檢測情況修復所述缺陷。 The additive manufacturing method according to claim 11, wherein the step 3 includes: detecting a metal wiring defect of the metal wiring module through an image sensor, and using a laser light unit and a chemical vapor deposition unit according to the The image sensor detects the situation and repairs the defect. 如請求項11所述的增材製造方法,其中通過圖像傳感器檢測所述金屬布線的缺陷的步驟包括:設置一與所述金屬布線模組同步運動的圖像傳感器;在布線過程中,通過所述圖像傳感器記錄並追蹤所述金屬布線的情況。 The additive manufacturing method according to claim 11, wherein the step of detecting the defect of the metal wiring through the image sensor includes: providing an image sensor that moves in synchronization with the metal wiring module; during the wiring process In the image sensor, the condition of the metal wiring is recorded and tracked. 如請求項19所述的增材製造方法,其中通過雷射光單元和化學氣相沉積單元根據所述圖像傳感器檢測的情況修復所述缺陷的步驟包括:獲取所述圖像傳感器記錄的所述金屬布線情況,並獲得所述金屬布線模組布線產生的所述缺陷;根據所述布線缺陷控制雷射光單元和所述化學氣相沉積單元分別運動,使得雷射光單元的雷射光照射所述化學氣相沉積單元提供的反應氣體以修復所述缺陷。The additive manufacturing method according to claim 19, wherein the step of repairing the defect according to the condition detected by the image sensor by the laser light unit and the chemical vapor deposition unit includes: acquiring the record recorded by the image sensor The situation of metal wiring, and obtain the defects generated by the wiring of the metal wiring module; according to the wiring defects, control the laser unit and the chemical vapor deposition unit to move separately, so that the laser light of the laser unit The reaction gas provided by the chemical vapor deposition unit is irradiated to repair the defect.
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