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TW201929626A - Additive manufacturing mechanism and additive manufacturing method - Google Patents

Additive manufacturing mechanism and additive manufacturing method Download PDF

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Publication number
TW201929626A
TW201929626A TW107145771A TW107145771A TW201929626A TW 201929626 A TW201929626 A TW 201929626A TW 107145771 A TW107145771 A TW 107145771A TW 107145771 A TW107145771 A TW 107145771A TW 201929626 A TW201929626 A TW 201929626A
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module
laser light
metal wiring
additive manufacturing
additive
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TW107145771A
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Chinese (zh)
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TWI693002B (en
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李會麗
唐世弋
李志丹
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大陸商上海微電子裝備(集團)股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • B29C64/141Processes of additive manufacturing using only solid materials
    • B29C64/153Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00Processes of additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00Apparatus for additive manufacturing; Details thereof or accessories therefor
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00Coating starting from inorganic powder
    • C23C24/08Coating starting from inorganic powder by application of heat or pressure and heat
    • H10W99/00

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Powder Metallurgy (AREA)
  • Laser Beam Processing (AREA)

Abstract

An additive manufacturing device, comprising: a workpiece platform module; a shell additive module configured to form a shell on the workpiece platform module; a metal wiring module configured to provide a metal wiring on the shell; and a wiring repair module configured to detect a defect of the metal wiring and repair the defect to form a repaired defect. The shell additive module is further configured to form a cover on the shell after the defect is repaired. The additive manufacturing device can perform online repair on an embedded circuit without unloading the workpiece platform module and base materials, thereby saving device costs and production line space, shortening the manufacturing time and a manufacturing chain, and improving subsequent machining accuracy of the base material.

Description

一種增材製造裝置和製造方法Additive manufacturing device and manufacturing method

本發明係關於一種內嵌入電路增材製造領域,尤其是一種增材製造裝置和製造方法。The invention relates to the field of additive manufacturing of embedded circuits, in particular to an additive manufacturing device and manufacturing method.

隨著電子設備集成度的提高,設備體積也越來越小,這時電子組件對於整個設備就顯得過大,因此需要減小自身尺寸。通過在注塑成型的曲面塑料殼體上製作電氣以及傳感功能的導線、圖形來製造和安裝元器件,可將普通的電路板具有的電氣互連功能、支撐元器件功能和塑料殼體的支撐、防護等功能結合,並且將機械實體和導電圖形相結合而產生的屏蔽、天線、傳感等功能集成於一體。With the increase in the integration of electronic equipment, the size of the equipment is getting smaller and smaller. At this time, the electronic components appear too large for the entire equipment, so it is necessary to reduce its size. Manufacture and install components by making electrical and sensing function wires and graphics on an injection-molded curved plastic case, which can connect the electrical interconnection function of ordinary circuit boards, support component functions, and support of plastic cases , Protection, and other functions, and the combination of mechanical entities and conductive graphics, shielding, antenna, sensing and other functions are integrated into one.

目前有多種方式可以實現該結構的製造,但都存在其局限性和不足。目前主流的製作工藝為LDS(Laser Direct Structure,雷射光直接成型)工藝。LDS的工藝流程是對一種含有金屬組織的合成物塑料顆粒採用注塑的方式製作成塑料殼體。由於該合成物的金屬成份能夠通過雷射光進行激活,所以可通過專用雷射光設備在殼體表面按照規定的路徑進行雷射光掃描,被激活的金屬部分作為種子層,可通過電鍍或者化學鍍的方式在殼體表面沉積金屬,形成所需要的電路圖形。There are currently many ways to make the structure, but all have their limitations and deficiencies. The current mainstream manufacturing process is the Laser Direct Structure (LDS) process. The process of LDS is to make a plastic shell by injection molding a synthetic plastic particle containing a metal structure. Since the metal component of the composition can be activated by laser light, the laser light can be scanned on the surface of the casing by a special path using a special laser light device. The activated metal part can be used as a seed layer, which can be electroplated or chemically plated. The method deposits metal on the surface of the shell to form the required circuit pattern.

在現有技術中,還公開了一種內嵌入立體電路增材製造裝置與形成方法,提出了一種對殼體材料沒有限制,可根據產品需求在殼體表面或內部完成金屬互連層的製作,不需要進行化學鍍(電鍍)等工藝,整個製造工藝可全部完成的一種裝置。解決了金屬導電層只能製作在殼體表面,容易破損和氧化的問題,同時解決了工藝複雜以及塑料基材受限等問題。In the prior art, an additive manufacturing device and forming method for an embedded three-dimensional circuit are also disclosed, and there is no restriction on the material of the casing, and the production of the metal interconnection layer can be completed on the surface or inside of the casing according to product requirements. A device that requires electroless plating (plating) and other processes, and the entire manufacturing process can be completed. It solves the problem that the metal conductive layer can only be made on the surface of the shell, which is easy to be damaged and oxidized, and also solves the problems of complicated technology and limited plastic substrate.

目前由於各種天線和傳感器的精密度越來越高,電路線寬越來越精細至微米級,很多已在5um以下。尤其隨著增材製造產品附加值的升高,良品率顯得尤為重要,內嵌金屬電路製作完成後,要對其電路檢查和修補以提升良率,中途取下做線下修補再裝回載台的方式,極易引起對位誤差以及產生應力,讓後續加工精度和良率無法保證。At present, due to the increasing precision of various antennas and sensors, the line width of circuits is more and more fine to the micron level, many of which are below 5um. Especially with the increase in the added value of additive manufacturing products, the yield rate is particularly important. After the production of the embedded metal circuit is completed, the circuit must be inspected and repaired to improve the yield rate, and it must be removed for offline repair and then reloaded. The table method can easily cause alignment errors and stresses, making the subsequent processing accuracy and yield impossible to guarantee.

本發明的目的在於提供一種增材製造裝置和製造方法,以解決現有修補過程需要移動基材進行線下修補而耗時、誤差大且加工精度差的問題。The purpose of the present invention is to provide an additive manufacturing device and a manufacturing method, so as to solve the problems that the existing repairing process requires moving the substrate for offline repair, which is time-consuming, large error and poor processing accuracy.

為了達到上述目的,本發明提供了一種增材製造裝置,包括:工件台模組;殼體增材模組,配置為在所述工件台模組上形成殼體;金屬布線模組,配置為在所述殼體上設置金屬布線;布線修復模組,配置為檢測所述金屬布線的缺陷並修補所述缺陷;其中,所述殼體增材模組還配置為修補所述缺陷後在所述殼體上形成殼蓋。In order to achieve the above object, the present invention provides an additive manufacturing device, including: a workpiece table module; a housing additive module configured to form a shell on the workpiece table module; a metal wiring module, configured To provide metal wiring on the casing; a wiring repair module configured to detect a defect of the metal wiring and repair the defect; wherein the housing additive module is further configured to repair the After the defect, a shell cover is formed on the shell.

進一步地,所述殼體增材模組包括供料系統和增材加工模組,所述增材加工模組配置為在所述工件台模組上加工所述供料系統提供的物料以形成殼體。Further, the housing additive module includes a feeding system and an additive processing module, and the additive processing module is configured to process materials provided by the feeding system on the workpiece table module to form case.

進一步地,所述供料系統配置為提供塑料粉,所述增材加工模組包括雷射光燒結單元和舖粉裝置,所述舖粉裝置包括第一振鏡和第一雷射光源,配置為在所述工件台模組上舖設所述塑料粉,所述雷射光燒結單元配置為加工所述物料以獲得所述殼體。Further, the feeding system is configured to provide plastic powder, the additive processing module includes a laser light sintering unit and a powder coating device, and the powder coating device includes a first galvanometer and a first laser light source, and is configured to The plastic powder is laid on the workpiece table module, and the laser light sintering unit is configured to process the material to obtain the casing.

進一步地,所述殼體增材模組還包括用於回收雷射光燒結後多餘塑料粉的回收系統。Further, the housing additive module further includes a recovery system for recovering excess plastic powder after laser light sintering.

進一步地,所述供料系統配置為提供塑料絲,所述增材加工模組包括塑料絲打印頭。Further, the feeding system is configured to provide a plastic wire, and the additive processing module includes a plastic wire print head.

進一步地,所述金屬布線模組包括金屬漿料承載腔、連桿機構、金屬沉積噴頭、過濾系統和加熱模組,所述金屬漿料承載腔通過所述連桿機構和所述金屬沉積噴頭連接,所述過濾系統連接在所述連桿機構上,所述加熱模組配置為固化所述金屬布線。Further, the metal wiring module includes a metal slurry carrying cavity, a connecting rod mechanism, a metal deposition nozzle, a filtering system, and a heating module, and the metal slurry carrying cavity passes through the connecting rod mechanism and the metal deposition. The nozzle is connected, the filtering system is connected to the link mechanism, and the heating module is configured to solidify the metal wiring.

進一步地,所述布線修復模組包括圖像傳感器、雷射光單元和化學氣相沉積單元,所述圖像傳感器檢測所述金屬布線的所述缺陷,所述雷射光單元和所述化學氣相沉積單元根據所述圖像傳感器檢測的情況修復所述缺陷。Further, the wiring repair module includes an image sensor, a laser light unit, and a chemical vapor deposition unit, the image sensor detects the defect of the metal wiring, the laser light unit and the chemical The vapor deposition unit repairs the defect according to a condition detected by the image sensor.

進一步地,所述圖像傳感器固定在所述雷射光單元上並隨所述雷射光單元的雷射光頭同步運動,或者所述圖像傳感器固定在所述金屬布線模組上並隨所述金屬布線模組同步運動。Further, the image sensor is fixed on the laser light unit and moves synchronously with the laser head of the laser light unit, or the image sensor is fixed on the metal wiring module and follows the laser light unit. The metal wiring module moves synchronously.

進一步地,所述雷射光單元包括第二振鏡、第二雷射光源和雷射光頭,所述第二雷射光源與所述雷射光頭連接。Further, the laser light unit includes a second galvanometer, a second laser light source, and a laser head, and the second laser light source is connected to the laser head.

進一步地,所述化學氣相沉積單元包括儲氣單元、連接管路、氣體噴嘴、氣體抽排裝置、惰性氣體單元和保護罩,所述氣體抽排裝置用於排放修復過程中產生的廢氣,所述儲氣單元通過所述連接管路和所述氣體噴嘴連接,以提供反應氣體,所述惰性氣體單元提供的惰性氣體通過所述保護罩出射,所述保護罩設置在所述氣體噴嘴外圈。Further, the chemical vapor deposition unit includes a gas storage unit, a connection pipeline, a gas nozzle, a gas extraction device, an inert gas unit, and a protective cover, and the gas extraction device is used to discharge exhaust gas generated during the repair process, The gas storage unit is connected to the gas nozzle through the connection pipe to provide a reactive gas. The inert gas provided by the inert gas unit is emitted through the protective cover, and the protective cover is disposed outside the gas nozzle. ring.

進一步地,所述保護罩上設置有氣體流量調節裝置,以調節所述保護罩流通的氣體流量。Further, a gas flow regulating device is provided on the protective cover to adjust the gas flow flowing through the protective cover.

本發明還提供了一種增材製造方法,包括:
步驟1:通過殼體增材模組在工件台模組上構建殼體;
步驟2:通過金屬布線模組在所述殼體上設置金屬布線;
步驟3:通過布線修復模組檢測所述金屬布線的缺陷並修復所述缺陷;
步驟4:通過殼體增材模組在布線後的殼體上形成殼蓋。
The invention also provides an additive manufacturing method, including:
Step 1: Construct the shell on the workpiece table module through the shell additive module;
Step 2: Set up metal wiring on the casing through a metal wiring module;
Step 3: Detect the defects of the metal wiring and repair the defects through a wiring repair module;
Step 4: Form a shell cover on the wired shell through the shell additive module.

進一步地,所述步驟1具體包括:Further, the step 1 specifically includes:

提供一目標加工模型;Provide a target processing model;

將所述殼體增材模組根據所述目標加工模型加工獲得所述殼體。The shell additive module is processed to obtain the shell according to the target processing model.

進一步地,所述步驟1還包括:通過供料系統提供物料,通過增材加工模組加工所述物料以獲得所述殼體。Further, the step 1 further includes: providing a material through a feeding system, and processing the material through an additive processing module to obtain the shell.

進一步地,所述步驟1還包括:通過所述供料系統提供塑料粉,通過舖粉裝置在工件台模組上舖設所述塑料粉,通過雷射光燒結單元加工所述物料以獲得所述殼體。Further, the step 1 further comprises: providing plastic powder through the feeding system, laying the plastic powder on a workpiece table module through a powder coating device, and processing the material through a laser light sintering unit to obtain the shell body.

進一步地,所述步驟1還包括:通過所述舖粉裝置將燒結產生的多餘塑料粉回收至回收系統。Further, the step 1 further comprises: recycling the excess plastic powder generated by the sintering to the recycling system through the powder spreading device.

進一步地,通過供料系統提供物料,通過增材加工模組加工所述物料以獲得所述殼體還包括:通過所述供料系統提供塑料絲,通過塑料絲打印頭加工所述物料以獲得所述殼體。Further, providing the material through a feeding system, and processing the material through an additive processing module to obtain the shell further includes: providing a plastic wire through the feeding system, and processing the material through a plastic wire print head to obtain The housing.

進一步地,所述步驟2包括:通過金屬漿料承載腔提供金屬漿料,並經過連桿機構傳輸至金屬沉積噴頭後在殼體上設置所述金屬布線。Further, the step 2 includes: providing the metal paste through the metal paste bearing cavity, and setting the metal wiring on the casing after transmitting the metal paste to the metal deposition nozzle through the link mechanism.

進一步地,所述步驟2還包括:在所述連桿機構上設置過濾系統,以過濾從所述金屬漿料承載腔提供至所述金屬沉積噴頭的金屬漿料,在通過所述金屬沉積噴頭在所述殼體上沉積所述金屬布線後,還通過加熱模組固化所述金屬布線。Further, the step 2 further comprises: providing a filtering system on the link mechanism to filter the metal slurry provided from the metal slurry bearing cavity to the metal deposition nozzle, and passing the metal deposition nozzle through the metal deposition nozzle After the metal wiring is deposited on the casing, the metal wiring is also cured by a heating module.

進一步地,所述步驟3具體包括:通過圖像傳感器檢測所述金屬布線模組的金屬布線缺陷,通過雷射光單元和化學氣相沉積單元根據所述圖像傳感器檢測情況修復所述缺陷。Further, the step 3 specifically includes: detecting a metal wiring defect of the metal wiring module by an image sensor, and repairing the defect by a laser light unit and a chemical vapor deposition unit according to a detection condition of the image sensor. .

進一步地,通過圖像傳感器檢測所述金屬布線模組的金屬布線缺陷的步驟包括:Further, the step of detecting a metal wiring defect of the metal wiring module by an image sensor includes:

設置一與所述金屬布線模組同步運動的圖像傳感器;Setting an image sensor that moves synchronously with the metal wiring module;

在布線過程中,通過所述圖像傳感器記錄並追蹤所述金屬布線模組的金屬布線情況。During the wiring process, the metal wiring of the metal wiring module is recorded and tracked by the image sensor.

進一步地,通過雷射光單元和化學氣相沉積單元根據所述圖像傳感器檢測情況修復所述缺陷的步驟包括:獲取所述圖像傳感器記錄的金屬布線情況,並獲得所述金屬布線模組布線產生的布線缺陷;根據所述布線缺陷控制雷射光單元和化學氣相沉積單元分別運動,使得雷射光單元的雷射光照射所述化學氣相沉積單元提供的反應氣體以修復所述缺陷。Further, the step of repairing the defect according to the detection condition of the image sensor by the laser light unit and the chemical vapor deposition unit includes: obtaining a metal wiring situation recorded by the image sensor, and obtaining the metal wiring mode. Wiring defects generated by group wiring; controlling the laser light unit and the chemical vapor deposition unit to move separately according to the wiring defects, so that the laser light of the laser light unit irradiates the reaction gas provided by the chemical vapor deposition unit to repair the Mentioned defect.

本發明提供了一種增材製造裝置和製造方法, 解決了現有線下修補方式耗時、誤差大且加工精度差的問題,無需卸載工件台模組及基材就可對內嵌電路進行在線修補,節約設備購置成本和產線空間,且能減少製造時間和縮短製造鏈,提升了基材的後續加工精度。The invention provides an additive manufacturing device and manufacturing method, which solves the problems of time-consuming, large error and poor processing accuracy of the existing offline repair method, and can perform online repair of embedded circuits without unloading the workbench module and substrate. , Saving equipment purchase costs and production line space, and can reduce manufacturing time and shorten the manufacturing chain, and improve the subsequent processing accuracy of the substrate.

下面將結合示意圖對本發明的具體實施方式進行更詳細的描述。根據下列描述和申請專利範圍,本發明的優點和特徵將更清楚。需說明的是,附圖均採用非常簡化的形式且均使用非精准的比例,僅用以方便、明晰地輔助說明本發明實施例的目的。The specific embodiments of the present invention will be described in more detail below with reference to the schematic diagrams. The advantages and features of the invention will become clearer from the following description and the scope of the patent application. It should be noted that the drawings are in a very simplified form and all use inaccurate proportions, which are only used to facilitate and clearly assist the description of the embodiments of the present invention.

實施例一Example one

如圖1所示,結合圖4-7,本發明實施例提供了一種增材製造裝置,包括:工件台模組1;殼體增材模組2,配置為在所述工件台模組1上形成殼體101;金屬布線模組3,配置為在所述殼體101上設置金屬布線102;布線修復模組4,配置為檢測布線缺陷並修補該缺陷形成已修補缺陷103;其中,所述殼體增材模組2還配置為修補所述缺陷後在所述殼體101上形成殼蓋104,殼蓋104可以作為殼體101的保護層,並具有穩固金屬布線結構、防止金屬布線氧化的效果。As shown in FIG. 1, in conjunction with FIGS. 4-7, an embodiment of the present invention provides an additive manufacturing device, which includes: a workpiece table module 1 and a housing additive module 2 configured to be located on the workpiece table module 1. A casing 101 is formed thereon; a metal wiring module 3 configured to provide a metal wiring 102 on the casing 101; a wiring repair module 4 configured to detect a wiring defect and repair the defect to form a repaired defect 103 ; Wherein the housing additive module 2 is further configured to form a shell cover 104 on the housing 101 after repairing the defect, and the shell cover 104 can serve as a protective layer of the housing 101 and has a stable metal wiring Structure, the effect of preventing metal wiring from oxidation.

進一步地,所述殼體增材模組2包括供料系統21和增材加工模組,所述增材加工模組配置為在所述工件台模組1上加工所述供料系統21提供的物料以形成殼體101。在本實施例中,所述供料系統21配置為提供塑料粉,所述增材加工模組包括雷射光燒結單元22和舖粉裝置23,雷射光燒結單元22可以採用雷射光掃描振鏡系統,具體包括第一振鏡201和第一雷射光源202。Further, the housing additive module 2 includes a feeding system 21 and an additive processing module, and the additive processing module is configured to process the feeding system 21 on the workpiece table module 1 to provide Material to form the casing 101. In this embodiment, the feeding system 21 is configured to provide plastic powder, and the additive processing module includes a laser light sintering unit 22 and a powder spreading device 23. The laser light sintering unit 22 may adopt a laser light scanning galvanometer system Specifically, the first galvanometer 201 and the first laser light source 202 are included.

優選地,所述殼體增材模組2還包括用於回收雷射光燒結後多餘塑料粉的回收系統24。在本實施例中,可以將供料系統21、工件台模組1和回收系統24均設置為能夠在Z方向上下移動,通過舖粉裝置23在X方向完成舖粉和粉末回收。Preferably, the housing additive module 2 further includes a recovery system 24 for recovering excess plastic powder after laser light sintering. In this embodiment, the feeding system 21, the workpiece table module 1, and the recovery system 24 can be set to be able to move up and down in the Z direction, and the powder coating and powder recovery can be completed in the X direction by the powder coating device 23.

在本實施例中,對塑料粉進行分層燒結,燒結路徑和圖形根據目標加工模型而定,每完成一層燒結後,工件台模組1向下移動,移動距離與燒結層厚度相當。工件台模組1在Z向下移後,通過舖粉裝置23從供料系統21中將塑料粉平舖到工件台模組1上。工件台模組1上多餘的塑料粉將通過舖粉裝置23轉移到回收系統24上,回收系統24完成一層塑料粉回收後,將Z向下移動,最後舖粉裝置23回到起始位置。反復操作以形成所述的殼體101。In this embodiment, the plastic powder is sintered in layers, and the sintering path and pattern are determined according to the target processing model. After each layer of sintering is completed, the workpiece table module 1 is moved downward by a distance equivalent to the thickness of the sintered layer. After the workpiece table module 1 is moved downward in Z, the plastic powder is spread on the workpiece table module 1 from the feeding system 21 through the powder coating device 23. The excess plastic powder on the workpiece table module 1 will be transferred to the recycling system 24 through the powder coating device 23. After the recycling system 24 finishes recovering one layer of plastic powder, Z is moved downward, and finally the powder coating device 23 returns to the starting position. The operation is repeated to form the casing 101.

進一步地,所述金屬布線模組3包括金屬漿料承載腔31、連桿機構32、金屬沉積噴頭33和過濾系統34,所述金屬漿料承載腔31通過所述連桿機構32和金屬沉積噴頭33連接,所述過濾系統34連接在所述連桿機構32上。優選地,連桿機構32可以在X、Y和Z三方向運動,金屬沉積噴頭33可以六自由度運動,所述金屬布線模組3形成的金屬線條寬度例如為5~150um。Further, the metal wiring module 3 includes a metal slurry carrying cavity 31, a connecting rod mechanism 32, a metal deposition nozzle 33, and a filtering system 34. The metal slurry carrying cavity 31 passes through the connecting rod mechanism 32 and metal The deposition nozzle 33 is connected, and the filtering system 34 is connected to the link mechanism 32. Preferably, the link mechanism 32 can move in three directions of X, Y and Z, the metal deposition nozzle 33 can move in six degrees of freedom, and the width of the metal lines formed by the metal wiring module 3 is, for example, 5 to 150um.

具體地,所述金屬布線模組3還包括加熱模組(圖中未標注),所述加熱模組配置為固化金屬布線,加熱模組例如可以設置在工件台模組1上,加熱溫度例如可以為100~200℃。Specifically, the metal wiring module 3 further includes a heating module (not shown in the figure). The heating module is configured to solidify the metal wiring. The heating module may be provided on the work table module 1 for heating, for example. The temperature may be, for example, 100 to 200 ° C.

在本實施例中,所述布線修復模組4包括圖像傳感器41、雷射光單元42和化學氣相沉積單元43,所述圖像傳感器41檢測所述金屬布線模組3的金屬布線缺陷,圖像傳感器41例如可以安裝在金屬布線模組3中的連桿機構32上,並隨著金屬沉積噴頭33一起運動,圖像傳感器41也可以固定在雷射光單元42的雷射光頭(未圖示)上,並隨雷射光頭一起運動,所述雷射光單元42和所述化學氣相沉積單元43根據所述圖像傳感器41檢測情況修復所述缺陷。In this embodiment, the wiring repair module 4 includes an image sensor 41, a laser light unit 42, and a chemical vapor deposition unit 43, and the image sensor 41 detects a metal cloth of the metal wiring module 3. Line defect, for example, the image sensor 41 can be installed on the link mechanism 32 in the metal wiring module 3 and moves with the metal deposition nozzle 33, and the image sensor 41 can also be fixed to the laser light of the laser light unit 42 The laser light unit 42 and the chemical vapor deposition unit 43 repair the defect according to the detection situation of the image sensor 41.

請繼續參考圖1,化學氣相沉積單元43包括儲氣單元403、連接管路404、氣體噴嘴405和氣體抽排裝置407,儲氣單元403通過連接管路404和氣體噴嘴405連接,以提供反應氣體。優選地,雷射光單元42的雷射光頭可以六自由度運動,連接管路404可以在X、Y和Z三方向運動,氣體噴嘴405可以六自由度運動。Please continue to refer to FIG. 1. The chemical vapor deposition unit 43 includes a gas storage unit 403, a connection pipe 404, a gas nozzle 405, and a gas extraction device 407. The gas storage unit 403 is connected through the connection pipe 404 and the gas nozzle 405 to provide Reactive gas. Preferably, the laser head of the laser light unit 42 can move in six degrees of freedom, the connecting pipeline 404 can move in three directions of X, Y, and Z, and the gas nozzle 405 can move in six degrees of freedom.

為了在修復過程中提供保護,所述化學氣相沉積單元43還包括惰性氣體單元,所述惰性氣體單元提供的惰性氣體通過所述保護罩出射,所述保護罩設置在所述氣體噴嘴外圈,以使得惰性氣體能夠包圍反應氣體,形成相對隔絕的反應環境,避免反應過程受到干擾。在本實施例中,所述保護罩上設置有氣體流量調節裝置(未圖示),以調節所述保護罩流通的氣體流量,氣體噴嘴405連同保護罩406也可以六自由度運動。如圖2a和圖2b所示,保護罩可以控制半圓部分的孔開通而另半圓部分關閉,開通的孔噴出氮氣或其它惰性氣體,用以隔離反應氣體在反應區而不跑到外部區域。在雷射光照射的同時,通入金屬反應氣體,進行化學氣相沉積,修補斷線電路缺陷,修補過程產生的廢氣由氣體抽排裝置407抽排。In order to provide protection during the repair process, the chemical vapor deposition unit 43 further includes an inert gas unit. The inert gas provided by the inert gas unit is emitted through the protective cover, and the protective cover is disposed on the outer ring of the gas nozzle. So that the inert gas can surround the reaction gas and form a relatively isolated reaction environment to avoid interference with the reaction process. In this embodiment, a gas flow adjustment device (not shown) is provided on the protective cover to adjust the gas flow rate flowing through the protective cover. The gas nozzle 405 and the protective cover 406 can also move in six degrees of freedom. As shown in FIG. 2a and FIG. 2b, the protective cover can control the opening of the semi-circular part and close the other semi-circular part. The opened hole sprays nitrogen or other inert gas to isolate the reaction gas from the reaction zone without running to the outside area. While the laser light is irradiating, a metal reaction gas is passed in for chemical vapor deposition to repair defects in the disconnected circuit, and the exhaust gas generated during the repair process is exhausted by the gas extraction device 407.

在本實施例中,增材製造裝置還包括用於實現增材製造的成型腔5,可以將成型腔5的內部設置為真空,以保護金屬布線過程中的不同金屬材料。優選地,成型腔5包括雷射光保護鏡51。在本實施例中,可以將雷射光燒結單元22和雷射光單元42均設置為雷射光掃描振鏡系統,雷射光單元42包括第二振鏡401、第二雷射光源402和雷射光頭(未圖示),可以僅採用一套雷射光掃描振鏡系統實現雷射光燒結單元22和雷射光單元42的功能,也可以採用兩套雷射光掃描振鏡系統分別實現雷射光燒結單元22和雷射光單元42的功能。In this embodiment, the additive manufacturing apparatus further includes a molding cavity 5 for implementing additive manufacturing, and the inside of the molding cavity 5 can be set to a vacuum to protect different metal materials in the metal wiring process. Preferably, the molding cavity 5 includes a laser light protection lens 51. In this embodiment, the laser light sintering unit 22 and the laser light unit 42 may both be configured as a laser scanning galvanometer system. The laser light unit 42 includes a second galvanometer 401, a second laser light source 402, and a laser light head ( (Not shown), the functions of the laser light sintering unit 22 and the laser light unit 42 can be implemented by using only one laser light scanning galvanometer system, or the laser light sintering unit 22 and the laser can be realized by two laser light scanning galvanometer systems respectively The function of the light emitting unit 42.

本發明實施例還提供了一種增材製造方法,包括:
步驟1:通過殼體增材模組2在工件台模組1上構建殼體101;
步驟2:通過金屬布線模組3在殼體101上設置金屬布線102;
步驟3:通過布線修復模組4對布線進行檢測並修復缺陷;
步驟4:通過殼體增材模組2在布線後殼體上增覆殼蓋104。
An embodiment of the present invention also provides an additive manufacturing method, including:
Step 1: Construct a housing 101 on the workpiece table module 1 through the housing additive module 2;
Step 2: Set the metal wiring 102 on the casing 101 through the metal wiring module 3;
Step 3: Detect wiring and repair defects through wiring repair module 4;
Step 4: Adding the shell cover 104 to the rear shell through the shell additive module 2.

進一步地,所述步驟1具體包括:
步驟1.1:提供一目標加工模型;
步驟1.2:將所述殼體增材模組2根據所述目標加工模型加工獲得所述殼體101。
Further, the step 1 specifically includes:
Step 1.1: Provide a target processing model;
Step 1.2: The shell additive module 2 is processed according to the target processing model to obtain the shell 101.

進一步地,通過供料系統21提供物料,通過增材加工模組加工所述物料以獲得所述殼體101。在本實施例中,通過所述供料系統21提供塑料粉,通過舖粉裝置23在工件台模組上舖設所述塑料粉,通過雷射光燒結單元22加工所述物料以獲得所述殼體101。Further, the material is provided through the feeding system 21, and the material is processed by the additive processing module to obtain the casing 101. In this embodiment, the plastic powder is provided by the feeding system 21, the plastic powder is laid on the workpiece table module by the powder spreading device 23, and the material is processed by the laser light sintering unit 22 to obtain the shell 101.

優選地,通過所述舖粉裝置23將燒結產生的多餘塑料粉回收至回收系統24。在本實施例中,可以將供料系統21、工件台模組1和回收系統24均設置為能夠在z方向上下移動,通過舖粉裝置23完成舖粉和粉末回收。Preferably, the excess plastic powder generated by the sintering is recovered to the recovery system 24 through the powder spreading device 23. In this embodiment, the feeding system 21, the work table module 1 and the recovery system 24 can be set to be able to move up and down in the z direction, and the powder coating and powder recovery are completed by the powder coating device 23.

進一步地,所述步驟2具體包括:Further, the step 2 specifically includes:

通過金屬漿料承載腔31提供金屬漿料,並經過連桿機構32傳輸至金屬沉積噴頭33後在在殼體101上設置金屬布線102,在所述連桿機構32上設置過濾系統34,以過濾從金屬漿料承載腔提供至金屬沉積噴頭的金屬漿料。The metal slurry is provided through the metal slurry bearing cavity 31, and is transmitted to the metal deposition nozzle 33 through the link mechanism 32. A metal wiring 102 is provided on the casing 101, and a filtering system 34 is provided on the link mechanism 32. The metal slurry supplied from the metal slurry carrying cavity to the metal deposition nozzle is filtered.

具體地,在通過所述金屬沉積噴頭33在所述殼體101上沉積金屬布線102後,還通過加熱模組固化所述金屬布線。Specifically, after the metal wiring 102 is deposited on the casing 101 through the metal deposition nozzle 33, the metal wiring is cured by a heating module.

進一步地,所述步驟3具體包括:Further, the step 3 specifically includes:

通過圖像傳感器41檢測所述金屬布線模組3的金屬布線缺陷,通過雷射光單元42和化學氣相沉積單元43根據所述圖像傳感器41檢測情況修復所述缺陷。The metal wiring defects of the metal wiring module 3 are detected by the image sensor 41, and the defects are repaired by the laser light unit 42 and the chemical vapor deposition unit 43 according to the detection conditions of the image sensor 41.

進一步地,通過圖像傳感器41檢測所述金屬布線模組3的金屬布線缺陷的步驟包括:Further, the step of detecting a metal wiring defect of the metal wiring module 3 through the image sensor 41 includes:

設置一與所述金屬布線模組同步運動的圖像傳感器;Setting an image sensor that moves synchronously with the metal wiring module;

在布線過程中,通過所述圖像傳感器41記錄並追蹤所述金屬布線模組3的金屬布線情況。During the wiring process, the metal wiring of the metal wiring module 3 is recorded and tracked by the image sensor 41.

進一步地,通過雷射光單元和化學氣相沉積單元根據所述圖像傳感器41檢測情況修復所述缺陷的步驟包括:Further, the step of repairing the defect by the laser light unit and the chemical vapor deposition unit according to the detection condition of the image sensor 41 includes:

獲取所述圖像傳感器41記錄的金屬布線情況,並獲得所述金屬布線模組3布線產生的布線缺陷;Acquiring the metal wiring conditions recorded by the image sensor 41, and acquiring wiring defects generated by the wiring of the metal wiring module 3;

根據所述布線缺陷控制雷射光單元和化學氣相沉積單元43分別運動,使得雷射光單元的雷射光照射所述化學氣相沉積單元提供的反應氣體以修復所述缺陷。The laser light unit and the chemical vapor deposition unit 43 are respectively controlled to move according to the wiring defect, so that the laser light of the laser light unit irradiates the reaction gas provided by the chemical vapor deposition unit to repair the defect.

請繼續參考圖1,化學氣相沉積單元43包括儲氣單元403、連接管路404、氣體噴嘴405和氣體抽排裝置407,儲氣單元403通過連接管路404和氣體噴嘴405連接。為了在修復過程中提供保護,所述化學氣相沉積單元43還包括惰性氣體單元,惰性氣體單元通過保護罩406控制噴射,修補過程中,雷射光單元42的雷射光頭(未圖示)可以六自由度運動,氣體噴嘴405連同保護罩406也可以六自由度運動。如圖2a和圖2b所示,保護罩可以控制半圓部分的孔開通而另半圓部分關閉,開通的孔噴出氮氣或其它惰性氣體,用以隔離反應氣體在反應區而不跑到外部區域。在雷射光照射的同時,通入金屬反應氣體,進行化學氣相沉積,修補斷線電路缺陷,修補過程產生的廢氣由氣體抽排裝置407抽排。Please continue to refer to FIG. 1. The chemical vapor deposition unit 43 includes a gas storage unit 403, a connection pipe 404, a gas nozzle 405, and a gas extraction device 407. The gas storage unit 403 is connected through the connection pipe 404 and the gas nozzle 405. In order to provide protection during the repair process, the chemical vapor deposition unit 43 further includes an inert gas unit. The inert gas unit controls the spray through the protective cover 406. During the repair process, the laser head (not shown) of the laser light unit 42 may With six degrees of freedom, the gas nozzle 405 together with the protective cover 406 can also move with six degrees of freedom. As shown in FIG. 2a and FIG. 2b, the protective cover can control the opening of the semi-circular part and close the other semi-circular part. The opened hole sprays nitrogen or other inert gas to isolate the reaction gas from the reaction zone without running to the outside area. While the laser light is irradiating, a metal reaction gas is passed in for chemical vapor deposition to repair defects in the disconnected circuit, and the exhaust gas generated during the repair process is exhausted by the gas extraction device 407.

在本實施例中,增材製造裝置還包括用於實現增材製造的成型腔5,可以將成型腔5的內部設置為真空,以保護金屬布線過程中的不同金屬材料。優選地,成型腔5包括雷射光保護鏡51。In this embodiment, the additive manufacturing apparatus further includes a molding cavity 5 for implementing additive manufacturing, and the inside of the molding cavity 5 can be set to a vacuum to protect different metal materials in the metal wiring process. Preferably, the molding cavity 5 includes a laser light protection lens 51.

請參考圖3,本實施例提供的增材加工的具體實施方法包括:
一、採用三維立體模型分層切片的STL格式文件作為目標加工模型;
二、舖粉裝置23根據分層厚度從供料系統21中將塑料粉平舖到工件台模組1上;
三、雷射光燒結單元22燒結工件台模組1上的塑料粉;
四、通過重複步驟二和步驟三,形成基礎塑料殼體101;
五、根據STL格式文件的分層,採用金屬布線模組3在殼體101對應的位置上沉積金屬線條102,並加熱固化;
六、根據金屬沉積布線時圖像傳感器41記錄和追蹤到的電路缺陷,採用雷射光照射反應氣體進行化學氣相沉積進行修補,沉積金屬斷線缺陷;
七、根據STL格式文件的分層,採用舖粉裝置23根據分層厚度從供料系統21中將塑料粉平舖到工件台模組1上;
八、雷射光燒結單元22燒結工件台模組1上的塑料粉;
九、重複步驟七和步驟八形成用於作為塑料殼體覆蓋層的殼蓋104。
Please refer to FIG. 3, the specific implementation method of the additive processing provided by this embodiment includes:
1. Use the STL format file of the three-dimensional slice of the three-dimensional model as the target processing model;
2. The powder spreading device 23 spreads the plastic powder from the feeding system 21 onto the workpiece table module 1 according to the layer thickness;
3. The laser light sintering unit 22 sinters the plastic powder on the workpiece table module 1;
Fourth, by repeating steps 2 and 3, a basic plastic casing 101 is formed;
5. According to the layering of the STL format file, the metal wiring module 3 is used to deposit the metal lines 102 on the corresponding positions of the casing 101 and heat-cured;
6. According to the circuit defects recorded and tracked by the image sensor 41 during metal deposition wiring, laser light is irradiated to the reaction gas for chemical vapor deposition to repair the metal disconnection defects;
7. According to the layering of the STL format file, the powder coating device 23 is used to flatten the plastic powder from the feeding system 21 to the workpiece table module 1 according to the layering thickness;
8. The laser light sintering unit 22 sinters the plastic powder on the workpiece table module 1;
Nine, repeat steps 7 and 8 to form a shell cover 104 for a plastic shell cover.

實施例二Example two

請參考圖8,與實施例一不同,實施例二中的供料系統21配置為提供塑料絲,所述增材加工模組包括塑料絲打印頭。進一步地,通過所述供料系統21提供塑料絲,增材製造裝置還包括運動機構26,通過運動機構26帶動塑料絲打印頭25運動以加工所述物料以獲得所述殼體,運動機構26能夠帶動塑料絲打印頭25 在X、Y、Z向運動,塑料絲打印頭25能夠進行六自由度運動,運動機構26帶動所述金屬沉積噴頭33運動以實現金屬布線,例如六自由度運動。Referring to FIG. 8, unlike the first embodiment, the feeding system 21 in the second embodiment is configured to provide a plastic wire, and the additive processing module includes a plastic wire print head. Further, the plastic wire is provided through the feeding system 21, and the additive manufacturing device further includes a movement mechanism 26, which drives the plastic wire print head 25 to move to process the material to obtain the casing, and the movement mechanism 26 It can drive the plastic wire print head 25 to move in the X, Y, and Z directions. The plastic wire print head 25 can perform six-degree-of-freedom movements. The movement mechanism 26 drives the metal deposition nozzle 33 to implement metal wiring, such as six-degree-of-freedom movement. .

請參考圖9,本實施例提供的增材加工的具體實施方法包括:
一、採用三維立體模型分層切片的STL格式文件作為目標加工模型;
二、根據STL格式文件的分層,通過運動機構26控制塑料絲打印頭25實現六自由度運動,增材製造塑料殼體;
三、通過重複步驟二,形成製造基礎塑料殼體101;
四、根據STL格式文件的分層,通過運動機構26控制金屬沉積噴頭33實現六自由度運動,在對應的位置上沉積金屬線條102,並通過加熱固化;
五、根據金屬沉積時圖像傳感器記錄和追蹤到的電路缺陷,採用雷射光照射反應氣體進行化學氣相沉積進行修補,沉積金屬斷線缺陷103;
六、根據STL格式文件的分層,通過運動機構26控制塑料絲打印頭25實現六自由度運動,形成用於作為塑料殼體覆蓋層的殼蓋104。
Please refer to FIG. 9, the specific implementation method of the additive processing provided in this embodiment includes:
1. Use the STL format file of the three-dimensional slice of the three-dimensional model as the target processing model;
2. According to the layering of the STL format file, the plastic wire print head 25 is controlled by the movement mechanism 26 to realize six-degree-of-freedom movement, and the plastic casing is additively manufactured;
Third, by repeating step two, a basic plastic casing 101 is formed;
4. According to the layering of the STL format file, the metal deposition nozzle 33 is controlled by the movement mechanism 26 to realize a six-degree-of-freedom movement, and the metal line 102 is deposited on the corresponding position and cured by heating;
5. According to the circuit defects recorded and tracked by the image sensor during metal deposition, the reaction gas is irradiated with laser light for chemical vapor deposition to repair the metal disconnection defect 103;
6. According to the layering of the STL format file, the plastic wire print head 25 is controlled by the movement mechanism 26 to realize a six-degree-of-freedom movement to form a shell cover 104 used as a plastic shell covering layer.

圖8中示意了雷射光燒結單元22,未示意雷射光單元42,本領域技術人員在實施例一基礎上可以直接毫無疑義獲知本實施例二中其他內容,故在此不再贅述。FIG. 8 illustrates the laser light sintering unit 22, but does not illustrate the laser light unit 42. Those skilled in the art can directly know the other contents of the second embodiment without any doubt based on the first embodiment, and will not be repeated here.

本發明實施例提供了一種增材製造裝置和製造方法, 解決了現有線下修補方式耗時、誤差大且加工精度差的問題,無需卸載工件台模組及基材就可對內嵌電路進行在線修補,節約設備購置成本和產線空間,且能減少製造時間和縮短製造鏈,提升了基材的後續加工精度。Embodiments of the present invention provide an additive manufacturing device and manufacturing method, which solves the problems of time-consuming, large errors, and poor processing accuracy of the existing offline repair methods, and can perform embedded circuits without unloading the workbench module and substrate. Online repair can save equipment purchase cost and production line space, and can reduce manufacturing time and shorten the manufacturing chain, and improve the subsequent processing accuracy of the substrate.

上述僅為本發明的優選實施例而已,並不對本發明起到任何限制作用。任何所屬技術領域的技術人員,在不脫離本發明的技術方案的範圍內,對本發明揭露的技術方案和技術內容做任何形式的等同替換或修改等變動,均屬未脫離本發明的技術方案的內容,仍屬於本發明的保護範圍之內。The above are only preferred embodiments of the present invention, and do not play any limiting role on the present invention. Any person skilled in the art, within the scope not departing from the technical solution of the present invention, make any equivalent replacement or modification to the technical solution and technical content disclosed in the present invention without departing from the technical solution of the present invention. The content still falls within the protection scope of the present invention.

1‧‧‧工件台模組1‧‧‧Workbench module

2‧‧‧殼體增材模組 2‧‧‧ Housing Additive Module

3‧‧‧金屬布線模組 3‧‧‧Metal wiring module

4‧‧‧布線修復模組 4‧‧‧Wiring repair module

5‧‧‧成型腔 5‧‧‧forming cavity

101‧‧‧殼體 101‧‧‧shell

102‧‧‧金屬布線 102‧‧‧Metal wiring

103‧‧‧已修補缺陷 103‧‧‧ Defects fixed

104‧‧‧殼蓋 104‧‧‧shell cover

21‧‧‧供料系統 21‧‧‧feeding system

22‧‧‧雷射光燒結單元 22‧‧‧laser light sintering unit

201‧‧‧第一振鏡 201‧‧‧The first galvanometer

202‧‧‧第一雷射光源 202‧‧‧The first laser light source

23‧‧‧舖粉裝置 23‧‧‧ powder spreading device

24‧‧‧回收系統 24‧‧‧ Recovery System

25‧‧‧塑料絲打印頭 25‧‧‧Plastic wire print head

26‧‧‧運動機構 26‧‧‧Sports Agency

31‧‧‧金屬漿料承載腔 31‧‧‧ metal slurry bearing cavity

32‧‧‧連桿機構 32‧‧‧ connecting rod mechanism

33‧‧‧金屬沉積噴頭 33‧‧‧ metal deposition nozzle

34‧‧‧過濾系統 34‧‧‧filtration system

41‧‧‧圖像傳感器 41‧‧‧Image Sensor

42‧‧‧雷射光單元 42‧‧‧laser light unit

401‧‧‧第二振鏡 401‧‧‧Second galvanometer

402‧‧‧第二雷射光源 402‧‧‧second laser light source

43‧‧‧化學氣相沉積單元 43‧‧‧ chemical vapor deposition unit

403‧‧‧儲氣單元 403‧‧‧Gas storage unit

404‧‧‧連接管路 404‧‧‧connection pipeline

405‧‧‧氣體噴嘴 405‧‧‧gas nozzle

406‧‧‧保護罩 406‧‧‧Protective cover

407‧‧‧氣體抽排裝置 407‧‧‧Gas extraction device

51‧‧‧雷射光保護鏡 51‧‧‧laser light protection lens

圖1為本發明實施例一提供的增材製造裝置的結構示意圖;FIG. 1 is a schematic structural diagram of an additive manufacturing apparatus according to Embodiment 1 of the present invention; FIG.

圖2a為本發明實施例一提供的氣體噴頭和保護罩處的主視圖; FIG. 2a is a front view of a gas nozzle and a protective cover according to the first embodiment of the present invention; FIG.

圖2b為本發明實施例一提供的氣體噴頭和保護罩處的仰視圖; 2b is a bottom view of a gas spray head and a protective cover provided in Embodiment 1 of the present invention;

圖3為本發明實施例一提供的增材製造方法的流程圖; 3 is a flowchart of an additive manufacturing method provided by Embodiment 1 of the present invention;

圖4為本發明實施例一提供的殼體增材模組製造的殼體的結構示意圖; 4 is a schematic structural diagram of a shell manufactured by a shell additive module according to Embodiment 1 of the present invention;

圖5為本發明實施例一提供的金屬布線模組在殼體上製造金屬布線的結構示意圖; FIG. 5 is a schematic structural diagram of manufacturing a metal wiring on a case by the metal wiring module provided in Embodiment 1 of the present invention; FIG.

圖6為本發明實施例一提供的布線修復模組修復布線缺陷的原理圖; 6 is a schematic diagram of a wiring repair module for repairing wiring defects according to the first embodiment of the present invention;

圖7為本發明實施例一提供的殼體增材模組在殼體上形成殼蓋的結構示意圖; FIG. 7 is a schematic structural diagram of a shell additive module forming a shell cover on a shell according to the first embodiment of the present invention; FIG.

圖8為本發明實施例二提供的增材製造裝置的主視圖; FIG. 8 is a front view of the additive manufacturing apparatus provided by Embodiment 2 of the present invention; FIG.

圖9為本發明實施例二提供的增材製造方法的流程圖。 FIG. 9 is a flowchart of an additive manufacturing method according to a second embodiment of the present invention.

Claims (22)

一種增材製造裝置,其特徵在於包括: 工件台模組; 殼體增材模組,配置為在所述工件台模組上形成殼體; 金屬布線模組,配置為在所述殼體上設置金屬布線; 布線修復模組,配置為檢測所述金屬布線的缺陷並修補所述缺陷; 其中,所述殼體增材模組還配置為修補所述缺陷後在所述殼體上形成殼蓋。An additive manufacturing device, comprising: Workbench module; A housing additive module configured to form a housing on the workpiece table module; A metal wiring module configured to provide metal wiring on the casing; A wiring repair module configured to detect a defect of the metal wiring and repair the defect; Wherein, the shell additive module is further configured to form a shell cover on the shell after repairing the defect. 如請求項1所述的增材製造裝置,其中所述殼體增材模組包括供料系統和增材加工模組,所述增材加工模組配置為在所述工件台模組上加工所述供料系統提供的物料以形成所述殼體。The additive manufacturing device according to claim 1, wherein the housing additive module includes a feeding system and an additive processing module, and the additive processing module is configured to process on the workpiece table module The material provided by the feeding system to form the casing. 如請求項2所述的增材製造裝置,其中所述供料系統配置為提供塑料粉,所述增材加工模組包括雷射光燒結單元和舖粉裝置,所述舖粉裝置包括第一振鏡和第一雷射光源,配置為在所述工件台模組上舖設所述塑料粉,所述雷射光燒結單元配置為加工所述物料以獲得所述殼體。The additive manufacturing device according to claim 2, wherein the feeding system is configured to provide plastic powder, the additive processing module includes a laser light sintering unit and a powder coating device, and the powder coating device includes a first vibration The mirror and the first laser light source are configured to lay the plastic powder on the workpiece table module, and the laser light sintering unit is configured to process the material to obtain the housing. 如請求項3所述的增材製造裝置,其中所述殼體增材模組還包括用於回收雷射光燒結後多餘塑料粉的回收系統。The additive manufacturing device according to claim 3, wherein the housing additive module further includes a recovery system for recovering excess plastic powder after laser light sintering. 如請求項2所述的增材製造裝置,其中所述供料系統配置為提供塑料絲,所述增材加工模組包括塑料絲打印頭。The additive manufacturing apparatus according to claim 2, wherein the feeding system is configured to provide a plastic wire, and the additive processing module includes a plastic wire print head. 如請求項1所述的增材製造裝置,其中所述金屬布線模組包括金屬漿料承載腔、連桿機構、金屬沉積噴頭、過濾系統和加熱模組,所述金屬漿料承載腔通過所述連桿機構和所述金屬沉積噴頭連接,所述過濾系統連接在所述連桿機構上,所述加熱模組配置為固化所述金屬布線。The additive manufacturing device according to claim 1, wherein the metal wiring module includes a metal slurry carrying cavity, a connecting rod mechanism, a metal deposition nozzle, a filtering system, and a heating module, and the metal slurry carrying cavity passes through The link mechanism is connected to the metal deposition nozzle, the filtering system is connected to the link mechanism, and the heating module is configured to solidify the metal wiring. 如請求項1所述的增材製造裝置,其中所述布線修復模組包括圖像傳感器、雷射光單元和化學氣相沉積單元,所述圖像傳感器檢測所述金屬布線的所述缺陷,所述雷射光單元和所述化學氣相沉積單元根據所述圖像傳感器檢測的情況修復所述缺陷。The additive manufacturing apparatus according to claim 1, wherein the wiring repair module includes an image sensor, a laser light unit, and a chemical vapor deposition unit, and the image sensor detects the defect of the metal wiring , The laser light unit and the chemical vapor deposition unit repair the defect according to a situation detected by the image sensor. 如請求項7所述的增材製造裝置,其中所述圖像傳感器固定在所述雷射光單元上並隨所述雷射光單元的雷射光頭同步運動,或者所述圖像傳感器固定在所述金屬布線模組上並隨所述金屬布線模組同步運動。The additive manufacturing device according to claim 7, wherein the image sensor is fixed on the laser light unit and moves synchronously with a laser head of the laser light unit, or the image sensor is fixed on the laser light unit The metal wiring module moves synchronously with the metal wiring module. 如請求項7所述的增材製造裝置,其中所述雷射光單元包括第二振鏡、第二雷射光源和雷射光頭,所述第二雷射光源與所述雷射光頭連接。The additive manufacturing apparatus according to claim 7, wherein the laser light unit includes a second galvanometer, a second laser light source, and a laser head, and the second laser light source is connected to the laser head. 如請求項7所述的增材製造裝置,其中所述化學氣相沉積單元包括儲氣單元、連接管路、氣體噴嘴、氣體抽排裝置、惰性氣體單元和保護罩,所述氣體抽排裝置用於排放修復過程中產生的廢氣,所述儲氣單元通過所述連接管路和所述氣體噴嘴連接,以提供反應氣體,所述惰性氣體單元提供的惰性氣體通過所述保護罩出射,所述保護罩設置在所述氣體噴嘴外圈。The additive manufacturing apparatus according to claim 7, wherein the chemical vapor deposition unit includes a gas storage unit, a connection pipe, a gas nozzle, a gas extraction device, an inert gas unit, and a protective cover, and the gas extraction device It is used to discharge the exhaust gas generated during the repair process. The gas storage unit is connected to the gas nozzle through the connection pipe to provide a reactive gas. The inert gas provided by the inert gas unit is emitted through the protective cover. The protective cover is disposed on an outer ring of the gas nozzle. 如請求項10所述的增材製造裝置,其中所述保護罩上設置有氣體流量調節裝置,以調節所述保護罩流通的氣體流量。The additive manufacturing apparatus according to claim 10, wherein a gas flow adjustment device is provided on the protective cover to adjust a gas flow rate flowing through the protective cover. 一種增材製造方法,其特徵在於,包括: 步驟1:通過殼體增材模組在工件台模組上構建殼體; 步驟2:通過金屬布線模組在所述殼體上設置金屬布線; 步驟3:通過布線修復模組檢測所述金屬布線的缺陷並修復所述缺陷; 步驟4:通過殼體增材模組在布線後的殼體上形成殼蓋。An additive manufacturing method, comprising: Step 1: Construct the shell on the workpiece table module through the shell additive module; Step 2: Set up metal wiring on the casing through a metal wiring module; Step 3: Detect the defects of the metal wiring and repair the defects through a wiring repair module; Step 4: Form a shell cover on the wired shell through the shell additive module. 如請求項12所述的增材製造方法,其中所述步驟1包括: 提供一目標加工模型; 將所述殼體增材模組根據所述目標加工模型加工獲得所述殼體。The additive manufacturing method according to claim 12, wherein the step 1 includes: Provide a target processing model; The shell additive module is processed to obtain the shell according to the target processing model. 如請求項13所述的增材製造方法,其中所述步驟1還包括:通過供料系統提供物料,通過增材加工模組加工所述物料以獲得所述殼體。The additive manufacturing method according to claim 13, wherein the step 1 further comprises: providing materials through a feeding system, and processing the materials through an additive processing module to obtain the shell. 如請求項14所述的增材製造方法,其中所述步驟1還包括:通過所述供料系統提供塑料粉,通過舖粉裝置在工件台模組上舖設所述塑料粉,通過雷射光燒結單元加工所述物料以獲得所述殼體。The additive manufacturing method according to claim 14, wherein the step 1 further comprises: providing plastic powder through the feeding system, laying the plastic powder on a workpiece table module through a powder laying device, and sintering by laser The unit processes the material to obtain the shell. 如請求項15所述的增材製造方法,其中所述步驟1還包括:通過所述舖粉裝置將燒結產生的多餘塑料粉回收至回收系統。The additive manufacturing method according to claim 15, wherein the step 1 further comprises: recycling the excess plastic powder generated by sintering to the recycling system through the powder spreading device. 如請求項14所述的增材製造方法,其中通過供料系統提供物料,通過增材加工模組加工所述物料以獲得所述殼體還包括: 通過所述供料系統提供塑料絲,通過塑料絲打印頭加工所述物料以獲得所述殼體。The additive manufacturing method according to claim 14, wherein the material is provided through a feeding system, and the material is processed through an additive processing module to obtain the shell, further comprising: A plastic wire is provided through the feeding system, and the material is processed through a plastic wire print head to obtain the housing. 如請求項12所述的增材製造方法,其中所述步驟2包括: 通過金屬漿料承載腔提供金屬漿料,並經過連桿機構傳輸至金屬沉積噴頭後在殼體上設置所述金屬布線。The additive manufacturing method according to claim 12, wherein the step 2 includes: The metal paste is provided through the metal paste bearing cavity, and the metal wiring is provided on the casing after being transmitted to the metal deposition nozzle through the link mechanism. 如請求項18所述的增材製造方法,其中所述步驟2還包括:在所述連桿機構上設置過濾系統,以過濾從所述金屬漿料承載腔提供至所述金屬沉積噴頭的金屬漿料,在通過所述金屬沉積噴頭在所述殼體上沉積所述金屬布線後,還通過加熱模組固化所述金屬布線。The additive manufacturing method according to claim 18, wherein the step 2 further comprises: providing a filtering system on the link mechanism to filter the metal provided from the metal slurry bearing cavity to the metal deposition nozzle After the slurry deposits the metal wiring on the casing through the metal deposition nozzle, the metal wiring is further cured by a heating module. 如請求項12所述的增材製造方法,其中所述步驟3包括: 通過圖像傳感器檢測所述金屬布線模組的金屬布線缺陷,通過雷射光單元和化學氣相沉積單元根據所述圖像傳感器檢測情況修復所述缺陷。The additive manufacturing method according to claim 12, wherein the step 3 includes: A metal wiring defect of the metal wiring module is detected by an image sensor, and the defect is repaired by a laser light unit and a chemical vapor deposition unit according to a detection condition of the image sensor. 如請求項13所述的增材製造方法,其中通過圖像傳感器檢測所述金屬布線的缺陷的步驟包括: 設置一與所述金屬布線模組同步運動的圖像傳感器; 在布線過程中,通過所述圖像傳感器記錄並追蹤所述金屬布線的情況。The additive manufacturing method according to claim 13, wherein the step of detecting a defect of the metal wiring by an image sensor includes: Setting an image sensor that moves synchronously with the metal wiring module; During the wiring process, the condition of the metal wiring is recorded and tracked by the image sensor. 如請求項21所述的增材製造方法,其中通過雷射光單元和化學氣相沉積單元根據所述圖像傳感器檢測的情況修復所述缺陷的步驟包括: 獲取所述圖像傳感器記錄的所述金屬布線情況,並獲得所述金屬布線模組布線產生的所述缺陷; 根據所述布線缺陷控制雷射光單元和所述化學氣相沉積單元分別運動,使得雷射光單元的雷射光照射所述化學氣相沉積單元提供的反應氣體以修復所述缺陷。The additive manufacturing method according to claim 21, wherein the step of repairing the defect by a laser light unit and a chemical vapor deposition unit according to a situation detected by the image sensor includes: Acquiring the metal wiring conditions recorded by the image sensor, and acquiring the defects generated by the metal wiring module wiring; The laser light unit and the chemical vapor deposition unit are respectively controlled to move according to the wiring defect, so that the laser light of the laser light unit irradiates the reaction gas provided by the chemical vapor deposition unit to repair the defect.
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