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TW201636188A - Work piece processing apparatus and work piece processing method - Google Patents

Work piece processing apparatus and work piece processing method Download PDF

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Publication number
TW201636188A
TW201636188A TW104110700A TW104110700A TW201636188A TW 201636188 A TW201636188 A TW 201636188A TW 104110700 A TW104110700 A TW 104110700A TW 104110700 A TW104110700 A TW 104110700A TW 201636188 A TW201636188 A TW 201636188A
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TW
Taiwan
Prior art keywords
workpiece
spraying device
processing
feeding unit
host
Prior art date
Application number
TW104110700A
Other languages
Chinese (zh)
Inventor
郭俊良
蘇致豪
侯建旭
路國明
Original Assignee
和碩聯合科技股份有限公司
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Publication date
Application filed by 和碩聯合科技股份有限公司 filed Critical 和碩聯合科技股份有限公司
Priority to TW104110700A priority Critical patent/TW201636188A/en
Priority to CN201610195113.0A priority patent/CN106041070A/en
Publication of TW201636188A publication Critical patent/TW201636188A/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/50Means for feeding of material, e.g. heads
    • B22F12/53Nozzles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20Direct sintering or melting
    • B22F10/25Direct deposition of metal particles, e.g. direct metal deposition [DMD] or laser engineered net shaping [LENS]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30Process control
    • B22F10/32Process control of the atmosphere, e.g. composition or pressure in a building chamber
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30Process control
    • B22F10/38Process control to achieve specific product aspects, e.g. surface smoothness, density, porosity or hollow structures
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/90Means for process control, e.g. cameras or sensors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00Processes of additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00Apparatus for additive manufacturing; Details thereof or accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/70Gas flow means
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/25Process efficiency

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Mechanical Engineering (AREA)
  • Analytical Chemistry (AREA)
  • Powder Metallurgy (AREA)
  • Laser Beam Processing (AREA)

Abstract

An apparatus and method for processing work piece. The apparatus includes a working platform, a spray device, a material supplying unit, a host, and a scanning device. The working platform is adapted to carry the work piece. The spray device is disposed over the working platform and includes a laser light source. The material supplying unit provides a building material to a processing position on the work piece, wherein the building material includes metal powders and an adhesive. The laser light source provides a laser light to the processing position for forming and bonding the building material to the component. The host drives the spray device with respect to the working platform and stores an original model information corresponding to the work piece. The scanning device scans the work piece to build up a work piece model information. The host compares the original model information with the work piece model information, to generate a processing information, and accordingly control the spray device.

Description

工作件加工設備以及工作件加工方法 Work piece processing equipment and work piece processing method

本發明是有關於一種工作件加工設備,且特別是有關於一種適於進行工作件加工的工作件加工設備與方法。 The present invention relates to a workpiece processing apparatus, and more particularly to a workpiece processing apparatus and method suitable for processing workpieces.

隨著電腦輔助製造(Computer Aided Manufacturing,CAM)技術的成熟,結合電腦數值控制(Computer Numerical Control,CNC)機械加工與三維計算機輔助設計(Computer Aided Design,CAD)等技術,積層製造技術將零件生產導入更高精密度與快速成型的領域。在現有的積層製造技術中,雷射金屬積層製造技術是以金屬為積層製造基礎的核心,並採用聚焦雷射能量熔合細微的金屬粉末,以形成精密的零件。從零件的機械特性、長時間的穩定性、生產性等各方面來看,雷射金屬積層製造技術適合應用於客製化小型量產製造,也是現今多種積層製造技術中最為蓬勃發展的一種。 With the maturity of Computer Aided Manufacturing (CAM) technology, combined with computer numerical control (CNC) machining and 3D Computer Aided Design (CAD) technology, laminated manufacturing technology will produce parts. Introduce areas of higher precision and rapid prototyping. In the existing laminated manufacturing technology, the laser metallization manufacturing technology is based on the core of metal-based laminate manufacturing, and uses concentrated laser energy to fuse fine metal powder to form precise parts. From the aspects of mechanical properties of parts, long-term stability, and productivity, laser metallization manufacturing technology is suitable for custom small-scale mass production, and it is also one of the most vigorous development of various laminated manufacturing technologies.

然而,現有的積層製造技術仍舊缺乏對零件的缺陷或損 毀進行加工的機制。更具體而言,以電子產品為例,當零件存在缺陷或發生損壞時,一般的處理方式是直接拆卸並更換此零件。然而,若此零件的造價較高,將提高維修成本,並造成材料的浪費。 However, the existing laminated manufacturing technology still lacks defects or damage to parts. Destroy the mechanism of processing. More specifically, in the case of an electronic product, when a part is defective or damaged, the general treatment is to directly disassemble and replace the part. However, if the cost of the part is high, the maintenance cost will be increased and the material will be wasted.

本發明提供一種工作件加工設備,適於藉由積層製造技術對工作件進行加工,例如修補缺陷,以重複零件使用,節省材料耗用,並可提供具高自由度的維修效能。 The present invention provides a workpiece processing apparatus suitable for processing workpieces by a laminate manufacturing technique, such as repairing defects, repeating parts use, saving material consumption, and providing maintenance with high degree of freedom.

本發明的一種工作件加工設備包括工作平台、供料單元、噴射裝置、主機以及掃描裝置。工作平台適於承載工作件。供料單元適於提供建構材料,且建構材料包括金屬粉末以及黏著體。噴射裝置設置於工作平台上方,且噴射裝置包括雷射光源。供料單元連接噴射裝置。當供料單元透過噴射裝置噴覆建構材料至工作件上的一加工位置,同時噴射裝置使雷射光源提供一雷射光至一加工位置,以成形建構材料並與工作件結合。主機耦接工作平台與噴射裝置,並用以控制噴射裝置相對於工作平台移動,且主機包括資料庫,用以儲存對應工作件之原始件模型資料。掃描裝置耦接主機,用以掃描工作件的外觀,以建立工作件模型資料。主機適於接收工作件模型資料,並且比較原始件模型資料與工作件模型資料,以取得比較結果,並依據比較結果產生加工資料。主機適於依據加工資料控制噴射裝置,使噴射裝置移動至工 作件上的加工位置。 A workpiece processing apparatus of the present invention includes a work platform, a feeding unit, an ejection device, a host, and a scanning device. The work platform is adapted to carry a work piece. The feed unit is adapted to provide a construction material, and the construction material includes a metal powder and an adherend. The spray device is disposed above the work platform, and the spray device includes a laser light source. The feeding unit is connected to the spraying device. When the feeding unit sprays the construction material through a spraying device to a processing position on the workpiece, the spraying device causes the laser light source to provide a laser light to a processing position to form the construction material and combine with the workpiece. The host is coupled to the working platform and the spraying device, and is configured to control the movement of the spraying device relative to the working platform, and the host includes a data library for storing the original model data of the corresponding working piece. The scanning device is coupled to the host to scan the appearance of the workpiece to establish the workpiece model data. The host is adapted to receive the work piece model data, and compare the original part model data with the work piece model data to obtain a comparison result, and generate the processing data according to the comparison result. The host is adapted to control the injection device according to the processing data, so that the injection device moves to work The processing position on the workpiece.

在本發明的一實施例中,上述掃描裝置包括攝像元件,用以擷取工作件的影像,以產生工作件模型資料。 In an embodiment of the invention, the scanning device includes an imaging component for capturing an image of the workpiece to generate a workpiece model data.

在本發明的一實施例中,上述比較結果包括三維計算機輔助設計(Computer Aided Design,CAD)圖檔。 In an embodiment of the invention, the comparison result comprises a three-dimensional Computer Aided Design (CAD) image file.

在本發明的一實施例中,上述供料單元包括配置於噴射裝置內且連接噴射裝置之開口端的供料管道。供料單元藉由供料管道以朝向噴射裝置的開口端提供建構材料。雷射光源配置於噴射裝置內,並且朝向噴射裝置的該開口端發射雷射光。 In an embodiment of the invention, the feed unit includes a supply conduit disposed within the spray device and coupled to the open end of the spray device. The feed unit supplies construction material to the open end of the spray device by means of a supply conduit. A laser source is disposed within the injection device and emits laser light toward the open end of the injection device.

在本發明的一實施例中,上述噴射裝置更具有氣體管道,其連接噴射裝置的開口端,用以提供惰性氣體或是氮氣至加工位置。 In an embodiment of the invention, the injection device further has a gas conduit connected to the open end of the injection device for providing an inert gas or nitrogen to the processing location.

在本發明的一實施例中,上述加工位置位於惰性氣體環境或是氮氣環境中。 In an embodiment of the invention, the processing location is in an inert gas environment or a nitrogen atmosphere.

在本發明的一實施例中,上述工作件加工設備更包括阻隔件,圍繞噴射裝置與加工位置,以形成惰性氣體環境或是氮氣環境。 In an embodiment of the invention, the workpiece processing apparatus further includes a barrier member surrounding the injection device and the processing position to form an inert gas atmosphere or a nitrogen atmosphere.

在本發明的一實施例中,上述供料單元包括第一供料單元以及第二供料單元,用以分別提供不同的建構材料至加工位置。 In an embodiment of the invention, the feeding unit includes a first feeding unit and a second feeding unit for respectively providing different construction materials to the processing position.

本發明提供一種工作件加工方法,適於藉由積層製造技術對工作件進行加工,以重複零件使用,節省材料耗用,並可提供具高自由度的維修效能。 The invention provides a working piece processing method, which is suitable for processing a working piece by a layer manufacturing technique, repeats the use of parts, saves material consumption, and provides maintenance performance with high degree of freedom.

本發明的工作件加工方法,適用於工作件加工設備。工作件加工設備包括工作平台、供料單元、噴射裝置、主機以及掃描裝置。供料單元提供一建構材料。噴射裝置設置於工作平台上方。噴射裝置包括雷射光源。供料單元連接噴射裝置。主機耦接工作平台與噴射裝置,並用以控制噴射裝置能夠相對於工作平台移動。主機包括資料庫,用以儲存對應工作件之原始件模型資料。掃描裝置耦接主機。工作件加工方法包括:承載工作件於工作平台;藉由掃描裝置掃描工作件的外觀,以建立工作件模型資料;主機接收工作件模型資料,並比較原始件模型資料與工作件模型資料,以取得比較結果,並依據比較結果產生加工資料;以及,主機依據加工資料以控制噴射裝置,使噴射裝置移動至對應加工資料的工作件上的加工位置。供料單元透過噴射裝置噴覆建構材料至工作件上的加工位置,同時噴射裝置使雷射光源提供雷射光至加工位置,以成形建構材料並與工作件結合,其中建構材料包括金屬粉末以及黏著體。 The working piece processing method of the invention is suitable for the workpiece processing equipment. The workpiece processing equipment includes a work platform, a feeding unit, an injection device, a host, and a scanning device. The feed unit provides a construction material. The spraying device is arranged above the working platform. The spray device includes a laser source. The feeding unit is connected to the spraying device. The host is coupled to the working platform and the spraying device, and is configured to control the movement of the spraying device relative to the working platform. The host includes a database for storing the original model data of the corresponding work piece. The scanning device is coupled to the host. The working piece processing method comprises: carrying the working piece on the working platform; scanning the appearance of the working piece by the scanning device to establish the working piece model data; the host receiving the working piece model data, and comparing the original piece model data with the working piece model data, The comparison result is obtained, and the processing data is generated according to the comparison result; and the host computer controls the injection device according to the processing data to move the injection device to the processing position on the workpiece corresponding to the processing data. The feeding unit sprays the construction material to the processing position on the workpiece through the spraying device, and the spraying device causes the laser light source to provide the laser light to the processing position to form the construction material and combine with the working piece, wherein the construction material comprises metal powder and adhesion. body.

在本發明的一實施例中,上述比較原始件模型資料與工作件模型資料的方法包括藉由主機對原始件模型資料與工作件模型資料進行減法運算,以建立三維計算機輔助設計圖檔。 In an embodiment of the invention, the method for comparing the original model data and the workpiece model data comprises: performing a subtraction operation on the original model data and the workpiece model data by the host to establish a three-dimensional computer-aided design image file.

在本發明的一實施例中,上述依據比較結果產生加工資料的方法包括:將三維計算機輔助設計圖檔轉換為適用於電腦輔助製造(Computer Aided Manufacturing,CAM)的點矩陣檔;依據點矩陣檔來規劃加工路徑;以及,將加工路徑轉換為數值控制資料, 以依據數值控制資料來控制噴射裝置相對於工作件的移動。 In an embodiment of the invention, the method for generating processing data according to the comparison result comprises: converting a three-dimensional computer aided design image file into a point matrix file suitable for Computer Aided Manufacturing (CAM); To plan the machining path; and to convert the machining path into numerical control data, The movement of the spray device relative to the workpiece is controlled in accordance with the numerical control data.

在本發明的一實施例中,上述供料單元透過噴射裝置噴覆建構材料至工作件上的加工位置,同時噴射裝置使雷射光源提供雷射光至加工位置的方法包括:供料單元包括配置於噴射裝置內且連接噴射裝置之開口端的供料管道,其中供料單元藉由供料管道並朝向噴射裝置的開口端提供建構材料,且雷射光源配置於噴射裝置內,並且朝向噴射裝置的開口端發射雷射光。 In an embodiment of the invention, the feeding unit sprays the construction material through the spraying device to the processing position on the workpiece, and the spraying device provides the laser light source with the laser light to the processing position, including: the feeding unit includes the configuration a supply conduit in the injection device and connected to the open end of the injection device, wherein the supply unit supplies the construction material through the supply conduit and toward the open end of the injection device, and the laser light source is disposed in the injection device and faces the injection device The open end emits laser light.

在本發明的一實施例中,上述工作件加工方法更包括提供惰性氣體或是氮氣至加工位置。 In an embodiment of the invention, the workpiece processing method further includes supplying an inert gas or nitrogen to the processing position.

在本發明的一實施例中,上述工作件加工方法更包括使加工位置位於惰性氣體環境或是氮氣環境中。 In an embodiment of the invention, the working piece processing method further comprises positioning the processing position in an inert gas environment or a nitrogen atmosphere.

在本發明的一實施例中,上述供料單元包括第一供料單元以及第二供料單元,用以同時或依序提供不同的建構材料至加工位置。 In an embodiment of the invention, the feeding unit comprises a first feeding unit and a second feeding unit for simultaneously or sequentially providing different construction materials to the processing position.

本發明另提供一種工作件加工設備,適於藉由積層製造技術在工作平台上直接形成完整的工作件,不須間接形成於上述工作件上,可提供高精密度與高自由度的生產效能。 The invention further provides a workpiece processing device, which is suitable for directly forming a complete working piece on a working platform by a layer manufacturing technique, and does not need to be formed indirectly on the working piece, thereby providing high precision and high degree of freedom of production performance. .

本發明的工作件加工設備,包括工作平台、供料單元以及噴射裝置。供料單元適於提供建構材料,且建構材料包括金屬粉末以及黏著體。噴射裝置設置於工作平台上方。噴射裝置雷射光源。供料單元連接噴射裝置。當供料單元透過噴射裝置噴覆建構材料至工作平台上的加工位置,同時噴射裝置使雷射光源提供 雷射光至加工位置,以成形建構材料。 The workpiece processing apparatus of the present invention comprises a working platform, a feeding unit and a spraying device. The feed unit is adapted to provide a construction material, and the construction material includes a metal powder and an adherend. The spraying device is arranged above the working platform. Spray device laser source. The feeding unit is connected to the spraying device. When the feeding unit sprays the construction material through the spraying device to the processing position on the working platform, and the spraying device provides the laser light source The laser light is directed to the processing location to form the construction material.

在本發明的一實施例中,上述工作件加工設備更包括主機,耦接工作平台與噴射裝置,並用以控制噴射裝置相對於工作平台移動。主機包括資料庫,用以儲存零件模型資料,且主機適於依據零件模型資料來控制噴射裝置,使噴射裝置移動至工作平台上的加工位置。 In an embodiment of the invention, the workpiece processing apparatus further includes a main body coupled to the working platform and the spraying device, and configured to control the movement of the spraying device relative to the working platform. The host computer includes a database for storing part model data, and the host is adapted to control the injection device according to the part model data to move the injection device to a processing position on the work platform.

在本發明的一實施例中,供料單元包括配置於噴射裝置內且連接噴射裝置之開口端的供料管道。供料單元藉由供料管道並朝向噴射裝置的開口端提供建構材料。雷射光源配置於噴射裝置內,並且朝向噴射裝置的開口端發射雷射光。 In an embodiment of the invention, the supply unit includes a supply conduit disposed within the injection device and coupled to the open end of the injection device. The feed unit provides construction material through the supply conduit and toward the open end of the spray device. The laser source is disposed within the injection device and emits laser light toward the open end of the injection device.

在本發明的一實施例中,上述噴射裝置更具有氣體管道,其連接噴射裝置的開口端,用以提供惰性氣體或是氮氣至加工位置。 In an embodiment of the invention, the injection device further has a gas conduit connected to the open end of the injection device for providing an inert gas or nitrogen to the processing location.

在本發明的一實施例中,上述加工位置位於惰性氣體環境或是氮氣環境中。 In an embodiment of the invention, the processing location is in an inert gas environment or a nitrogen atmosphere.

在本發明的一實施例中,上述工作件加工設備更包括阻隔件,圍繞噴射裝置與加工位置,以形成惰性氣體環境或是氮氣環境。 In an embodiment of the invention, the workpiece processing apparatus further includes a barrier member surrounding the injection device and the processing position to form an inert gas atmosphere or a nitrogen atmosphere.

在本發明的一實施例中,上述供料單元包括第一供料單元以及第二供料單元,用以分別提供不同的建構材料至加工位置。 In an embodiment of the invention, the feeding unit includes a first feeding unit and a second feeding unit for respectively providing different construction materials to the processing position.

為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 The above described features and advantages of the invention will be apparent from the following description.

100‧‧‧工作件加工設備 100‧‧‧Workpiece processing equipment

110‧‧‧工作平台 110‧‧‧Working platform

120‧‧‧噴射裝置 120‧‧‧Spray device

120a‧‧‧噴射裝置之開口端 120a‧‧‧Open end of the spray device

122‧‧‧雷射光源 122‧‧‧Laser light source

126‧‧‧氣體管道 126‧‧‧ gas pipeline

130‧‧‧供料單元 130‧‧‧Feeding unit

132‧‧‧供料管道 132‧‧‧Feeding pipeline

140‧‧‧主機 140‧‧‧Host

142‧‧‧資料庫 142‧‧‧Database

150‧‧‧建構材料 150‧‧‧ Construction materials

160‧‧‧掃描裝置 160‧‧‧Scanning device

180‧‧‧原始件模型資料 180‧‧‧ original model data

190‧‧‧惰性氣體 190‧‧‧Inert gas

192‧‧‧惰性氣體環境 192‧‧‧Inert gas environment

195‧‧‧阻隔件 195‧‧‧Resistance

210‧‧‧工作件 210‧‧‧Workpieces

212‧‧‧缺陷(加工位置) 212‧‧‧ Defects (machining position)

214‧‧‧加工結構 214‧‧‧Processing structure

222~228‧‧‧金屬層 222~228‧‧‧metal layer

270‧‧‧熔化池 270‧‧‧melting pool

280‧‧‧加工零件模型資料 280‧‧‧Processing part model data

290‧‧‧三維計算機輔助設計圖檔 290‧‧‧3D computer aided design files

D‧‧‧燒結方向 D‧‧‧Sintering direction

L‧‧‧雷射光 L‧‧‧Laser light

S310~S340‧‧‧步驟 S310~S340‧‧‧Steps

S332~S336‧‧‧步驟 S332~S336‧‧‧Steps

600‧‧‧工作件加工設備 600‧‧‧Workpiece processing equipment

610‧‧‧工作件 610‧‧‧Workpieces

612‧‧‧缺陷(加工位置) 612‧‧‧ Defects (machining position)

620‧‧‧噴射裝置 620‧‧‧spraying device

620a‧‧‧噴射裝置的開口端 620a‧‧‧Open end of the spray device

622‧‧‧雷射光源 622‧‧‧Laser light source

632‧‧‧第一供料單元 632‧‧‧First Feeding Unit

632a‧‧‧第一供料管道 632a‧‧‧First supply pipeline

634‧‧‧第二供料單元 634‧‧‧Second feed unit

634a‧‧‧第二供料管道 634a‧‧‧Second supply pipeline

652‧‧‧第一建構材料 652‧‧‧First construction materials

654‧‧‧第二建構材料 654‧‧‧Second construction material

700‧‧‧工作件加工設備 700‧‧‧Workpiece processing equipment

710‧‧‧工作平台 710‧‧‧Working platform

720‧‧‧噴射裝置 720‧‧‧jetting device

720a‧‧‧噴射裝置之開口端 720a‧‧‧Open end of the spray device

722‧‧‧雷射光源 722‧‧‧Laser light source

732‧‧‧第一供料單元 732‧‧‧First Feeding Unit

732a‧‧‧第一供料管道 732a‧‧‧First supply pipeline

734‧‧‧第二供料單元 734‧‧‧Second feed unit

734a‧‧‧第二供料管道 734a‧‧‧Second supply pipeline

728‧‧‧氣體管道 728‧‧‧ gas pipeline

742‧‧‧加工位置 742‧‧‧Processing position

750‧‧‧建構材料 750‧‧‧ Construction materials

752‧‧‧第一建構材料 752‧‧‧First construction materials

754‧‧‧第二建構材料 754‧‧‧Second construction material

760‧‧‧工作件 760‧‧‧Workpieces

762‧‧‧第一結構體 762‧‧‧First structure

764‧‧‧第二結構體 764‧‧‧Second structure

770‧‧‧主機 770‧‧‧Host

772‧‧‧資料庫 772‧‧‧Database

780‧‧‧零件模型資料 780‧‧‧Part model data

790‧‧‧惰性氣體 790‧‧‧Inert gas

792‧‧‧惰性氣體環境 792‧‧‧Inert gas environment

795‧‧‧阻隔件 795‧‧‧Resistance

圖1繪示依照本發明之一實施例的工作件加工設備。 1 illustrates a workpiece processing apparatus in accordance with an embodiment of the present invention.

圖2A為噴射裝置在工作件的加工位置上所進行的燒結反應的局部示意圖。 Figure 2A is a partial schematic view of the sintering reaction performed by the spraying device at the processing position of the workpiece.

圖2B繪示依據本發明另一實施例之噴射裝置與工作件的示意圖。 2B is a schematic view of a spray device and a work piece according to another embodiment of the present invention.

圖3為應用本實施例的工作件加工設備所進行的工作件加工方法的流程圖。 Fig. 3 is a flow chart showing a method of processing a workpiece by applying the workpiece processing apparatus of the embodiment.

圖4繪示將對應於缺陷的三維計算機輔助設計圖檔轉換為加工資料的流程。 FIG. 4 illustrates a flow of converting a three-dimensional computer aided design image file corresponding to a defect into processing material.

圖5為應用本實施例的工作件加工設備完成工作件加工後的示意圖。 Fig. 5 is a schematic view showing the processing of the workpiece after the workpiece processing apparatus of the embodiment is applied.

圖6繪示依照本發明另一實施例的工作件加工設備。 FIG. 6 illustrates a workpiece processing apparatus in accordance with another embodiment of the present invention.

圖7A~7C繪示依照本發明不同實施例的工作件加工設備。 7A-7C illustrate a workpiece processing apparatus in accordance with various embodiments of the present invention.

圖8A繪示依據本發明一實施例之噴射裝置與工作平台的局部示意圖。 FIG. 8A is a partial schematic view of a spray device and a work platform according to an embodiment of the invention.

圖8B繪示依據本發明另一實施例之噴射裝置與工作平台的局部示意圖。 FIG. 8B is a partial schematic view of a spray device and a work platform according to another embodiment of the present invention.

圖1繪示依照本發明之一實施例的工作件加工設備 100,其包括工作平台110、噴射裝置120、供料單元130、主機140以及掃描裝置160等。在本實施例中,例如是應用電腦數值控制(CNC)機械加工技術來實現工作平台110、噴射裝置120以及主機140之間的半自動或自動化操作。更具體而言,主機140例如是電腦主機或電腦數值控制(CNC)機械加工系統,其耦接工作平台110與噴射裝置120,以傳輸控制訊號至工作平台110與噴射裝置120,控制噴射裝置120相對於工作平台110在X-Y-Z三維軸向上移動。 1 illustrates a workpiece processing apparatus in accordance with an embodiment of the present invention 100, which includes a work platform 110, an injection device 120, a feeding unit 130, a host 140, a scanning device 160, and the like. In the present embodiment, semi-automatic or automated operation between the work platform 110, the spray device 120, and the host 140 is implemented, for example, using computer numerical control (CNC) machining techniques. More specifically, the host 140 is, for example, a computer host or a computer numerical control (CNC) machining system coupled to the work platform 110 and the injection device 120 to transmit control signals to the work platform 110 and the injection device 120, and to control the injection device 120. Moving relative to the work platform 110 in the XYZ three-dimensional axial direction.

工作平台110適於承載工作件210,其例如是結構上具有缺陷212或局部損壞的零件。噴射裝置120設置於工作平台110上方,且噴射裝置120包括雷射光源122。 The work platform 110 is adapted to carry a work piece 210, such as a part that is structurally defective or partially damaged. The spray device 120 is disposed above the work platform 110 and the spray device 120 includes a laser light source 122.

本實施例的工作件加工設備100例如是利用金屬積層製造技術搭配雷射燒結技術來對工作件210進行加工。供料單元130連接噴射裝置120,並且適於提供建構材料150。本實施例的建構材料150例如是包含有金屬粉末與黏著體的混合物。在此,使用的金屬粉末例如是鋁、鈦或其他適用的材質。本實施例可以選擇與工作件210相同的金屬材料,或是強度更高,或是可滿足其他使用需求的材料。黏著體例如是樹脂或其他適用的高分子聚合物等。此外,供料單元130適於透過噴射裝置120噴覆建構材料150至工作件210上的加工位置212(即前述的缺陷212),同時,雷射光源122可提供雷射光L至加工位置212,以成形建構材料150並與工作件210結合。實際上,本實施例可採用適用於金屬積層 製造技術的各種積層材料與雷射燒結技術的反應光源,於此不逐一贅述。 The workpiece processing apparatus 100 of the present embodiment processes the workpiece 210 by, for example, a metal lamination manufacturing technique in conjunction with a laser sintering technique. The feed unit 130 is coupled to the spray device 120 and is adapted to provide a build material 150. The building material 150 of the present embodiment is, for example, a mixture containing a metal powder and an adherend. Here, the metal powder used is, for example, aluminum, titanium or other suitable materials. In this embodiment, the same metal material as the working piece 210 can be selected, or the material with higher strength or other requirements for use can be selected. The adhesive is, for example, a resin or other suitable high molecular polymer. In addition, the feeding unit 130 is adapted to spray the construction material 150 through the spraying device 120 to the processing position 212 on the workpiece 210 (ie, the aforementioned defect 212), while the laser source 122 can provide the laser light L to the processing position 212, The forming material 150 is formed and bonded to the work piece 210. In fact, this embodiment can be applied to metal laminates. The various laminated materials of the manufacturing technology and the reaction light source of the laser sintering technology are not described one by one.

圖2A為噴射裝置120在工作件210的加工位置212上所進行的燒結反應的局部示意圖。如圖2A所示,供料單元130包括配置於噴射裝置120內且連接噴射裝置120之開口端120a的供料管道132。雷射光源122配置於噴射裝置120內,並且朝向噴射裝置120的開口端120a發射雷射光L。在噴射裝置120沿著燒結方向D相對於工作平台110移動的過程中,供料單元130藉由供料管道132以朝向噴射裝置120的開口端120a提供建構材料150,同時噴射裝置120使雷射光源122朝向噴射裝置120的開口端120a發射雷射光L。聚焦於加工位置212的雷射光L會將建構材料150加熱至高溫熔融狀態。此時,建構材料150內含的黏著體會因高溫揮發,而留下熔融狀態的金屬粉末所形成的熔化池270。其後,隨著噴射裝置120的來回移動,在移動路徑後方的熔融狀態的金屬粉末會逐漸冷卻、固化,而依序形成對應相疊的至少一金屬層222~228。 2A is a partial schematic view of the sintering reaction performed by the spray device 120 at the processing location 212 of the workpiece 210. As shown in FIG. 2A, the feed unit 130 includes a supply conduit 132 disposed within the spray device 120 and coupled to the open end 120a of the spray device 120. The laser light source 122 is disposed within the ejection device 120 and emits laser light L toward the open end 120a of the ejection device 120. During the movement of the spraying device 120 relative to the work platform 110 along the sintering direction D, the feeding unit 130 supplies the building material 150 to the open end 120a of the spraying device 120 by the supply conduit 132 while the spraying device 120 causes the laser to be irradiated The light source 122 emits laser light L toward the open end 120a of the ejection device 120. The laser light L focused on the processing location 212 heats the build material 150 to a high temperature molten state. At this time, the adherend contained in the build material 150 is volatilized by the high temperature, leaving a molten pool 270 formed by the molten metal powder. Thereafter, as the ejection device 120 moves back and forth, the molten metal powder in the molten state behind the moving path is gradually cooled and solidified, and at least one metal layer 222 to 228 correspondingly stacked is sequentially formed.

另外,在圖2A所示的噴射裝置120內可另外設置氣體管道126,其連接噴射裝置120的開口端120a,用以提供惰性氣體(或是氮氣)190至加工位置212,使得加工位置212位於惰性氣體環境(或是氮氣環境)192中。此處的惰性氣體(Inert Gas)例如是氬氣(Ar)、氦氣(He)或其他適用的惰性氣體,亦或是氮氣,以避免加工位置212的建構材料150因熱產生氧化或加工過程中材料噴濺等 問題。 Additionally, a gas conduit 126 may be additionally provided in the injection device 120 illustrated in FIG. 2A that is coupled to the open end 120a of the spray device 120 for providing inert gas (or nitrogen) 190 to the processing location 212 such that the processing location 212 is located In an inert gas atmosphere (or nitrogen atmosphere) 192. The inert gas (Inert Gas) here is, for example, argon (Ar), helium (He) or other suitable inert gas, or nitrogen gas, to prevent the building material 150 at the processing location 212 from being thermally oxidized or processed. Material splashing, etc. problem.

當然,在本發明的其他實施例中,也可以選擇不在噴射裝置120中設置氣體管道126,而改以獨立的氣體噴頭(未繪示)來提供惰性氣體,或是將工作件加工設備100設置於具有惰性氣體的環境中,來提供類似的惰性氣體環境。 Of course, in other embodiments of the present invention, it is also possible to choose not to provide the gas pipe 126 in the injection device 120, but to provide an inert gas by a separate gas nozzle (not shown), or to set the workpiece processing device 100. Provide a similar inert gas environment in an environment with an inert gas.

圖2B繪示依據本發明另一實施例之噴射裝置120與工作件210的示意圖。本實施例與圖2A之實施例類似,主要差異為:在噴射裝置120外圍設置阻隔件195,使其圍繞噴射裝置120與加工位置210。阻隔件195內可以提供惰性氣體或是氮氣,以形成惰性氣體環境(或是氮氣環境)192。相關元件可參考圖2A之實施例的說明,於此不再贅述。 2B is a schematic view of the spray device 120 and the workpiece 210 according to another embodiment of the present invention. This embodiment is similar to the embodiment of FIG. 2A with the main difference being that a barrier 195 is placed around the ejection device 120 to surround the ejection device 120 and the processing location 210. An inert gas or nitrogen gas may be supplied to the barrier member 195 to form an inert gas atmosphere (or a nitrogen atmosphere) 192. For related components, reference may be made to the description of the embodiment of FIG. 2A, and details are not described herein again.

基於前述的反應機制,本實施例的工作件加工設備100可實現對工作件210的加工。圖3為應用本實施例的工作件加工設備100所進行的工作件加工方法的流程圖。請同時參考圖1與3,主機140包括一資料庫142,用以儲存對應工作件210之原始件模型資料180。在此,原始件模型資料180所指為完整無損的零件模型資料。此外,掃描裝置160可選擇性地配置於工作平台110上。 Based on the aforementioned reaction mechanism, the workpiece processing apparatus 100 of the present embodiment can realize the processing of the workpiece 210. FIG. 3 is a flow chart showing a method of processing a workpiece by the workpiece processing apparatus 100 of the present embodiment. Referring to FIG. 1 and FIG. 3 simultaneously, the host 140 includes a database 142 for storing the original model data 180 of the corresponding work piece 210. Here, the original model data 180 is referred to as intact part model data. Additionally, the scanning device 160 can be selectively disposed on the work platform 110.

首先,承載工作件210於工作平台110(步驟S310)。當工作件210被放置於工作平台110上之後,掃描裝置160用以掃描工作件210的一外觀,以建立工作件模型資料280(步驟S320),並將工作件模型資料280傳送至主機140。在本實施例中,工作件模 型資料280所指為包含缺陷(對應於缺陷212)的零件模型資料。本實施例的掃描裝置160例如是具有電荷耦合元件(Charge-coupled Device,CCD)的攝像元件、3D掃描器或影像辨識元件,其同樣可整合於電腦數值控制(CNC)機械加工系統,而藉由例如三維模型掃描的方式來擷取工作件的影像,以建立工作件模型資料280。 First, the work piece 210 is carried on the work platform 110 (step S310). After the work piece 210 is placed on the work platform 110, the scanning device 160 is configured to scan an appearance of the work piece 210 to establish the work piece model data 280 (step S320), and transfer the work piece model data 280 to the host 140. In this embodiment, the workpiece mold Type data 280 is referred to as part model data containing defects (corresponding to defect 212). The scanning device 160 of the embodiment is, for example, an imaging device having a charge-coupled device (CCD), a 3D scanner or an image recognition component, which can also be integrated into a computer numerical control (CNC) machining system, and The image of the work piece is captured by, for example, a three-dimensional model scan to create work piece model data 280.

接著,如步驟S330所示,主機140接收工作件模型資料280,並比較原始件模型資料180與工作件模型資料280,以取得比較結果,並依據比較結果產生加工資料。在此步驟中,例如是藉由主機140對原始件模型資料180與工作件模型資料280進行減法運算,以建立對應於缺陷的三維計算機輔助設計(Computer Aided Design,CAD)圖檔290。 Next, as shown in step S330, the host computer 140 receives the work piece model data 280, and compares the original piece model data 180 with the work piece model data 280 to obtain a comparison result, and generates machining data according to the comparison result. In this step, for example, the original model data 180 and the work model data 280 are subtracted by the host 140 to establish a three-dimensional Computer Aided Design (CAD) image file 290 corresponding to the defect.

接著,更可進行如圖4所示的步驟來將對應於缺陷的三維計算機輔助設計圖檔290轉換為加工資料。首先,如步驟S332所示,將三維計算機輔助設計圖檔290轉換為適用於電腦輔助製造(Computer Aided Manufacturing,CAM)的點矩陣檔。接著,如步驟S334所示,依據點矩陣檔來規劃加工路徑。之後,再如步驟S336所示,將加工路徑轉換為數值控制資料,以依據數值控制資料來控制噴射裝置120相對於工作件210的移動。 Next, the steps shown in FIG. 4 can be further performed to convert the three-dimensional computer aided design image file 290 corresponding to the defect into processed material. First, as shown in step S332, the three-dimensional computer aided design file 290 is converted into a dot matrix file suitable for Computer Aided Manufacturing (CAM). Next, as shown in step S334, the processing path is planned in accordance with the dot matrix file. Thereafter, as shown in step S336, the machining path is converted into numerical control data to control the movement of the injection device 120 relative to the workpiece 210 in accordance with the numerical control data.

在將對應於缺陷的三維計算機輔助設計圖檔290轉換為加工資料之後,可如圖3的步驟S340所示,主機140依據加工資料(即步驟S326所獲得的數值控制資料)來控制噴射裝置120,使噴射裝置120移動至對應加工資料的工作件210上的加工位置 212。供料單元130透過噴射裝置120噴覆建構材料150至工作件210上的加工位置212,同時噴射裝置120使雷射光源122提供雷射光L至加工位置212,以成形建構材料150並與工作件210結合,其中建構材料150如前述包括金屬粉末以及黏著體。 After converting the three-dimensional computer aided design file 290 corresponding to the defect into the processing data, the host 140 may control the injection device 120 according to the processing data (ie, the numerical control data obtained in step S326) as shown in step S340 of FIG. , moving the spraying device 120 to the processing position on the workpiece 210 corresponding to the processing data 212. The feeding unit 130 sprays the construction material 150 to the processing position 212 on the workpiece 210 through the spraying device 120, while the spraying device 120 causes the laser light source 122 to provide the laser light L to the processing position 212 to form the building material 150 and the workpiece. 210 bonding wherein the build material 150 comprises a metal powder and an adherent as previously described.

最終,如圖5所示,噴射裝置120應用前述的積層製造技術在工作件210的缺陷212內形成填滿缺陷212的加工結構214,使工作件210回復到完整無缺陷的狀態(即回復到完整無缺陷的工作件210的工作件模型資料與原始件模型資料180是完全相同),而使得回復到完整無缺陷的工作件210可以再次被使用。 Finally, as shown in FIG. 5, the spraying device 120 applies the aforementioned layering manufacturing technique to form the processing structure 214 filled with the defect 212 in the defect 212 of the workpiece 210, so that the workpiece 210 returns to a complete defect-free state (ie, returns to The work piece model data of the complete defect-free work piece 210 is identical to the original piece model data 180, so that the work piece 210 that is returned to the complete defect-free work piece can be used again.

在前述實施例中,建構材料150並不限於僅包含單一種類的金屬粉末。換言之,建構材料150可能包含兩種以上的金屬粉末。此外,本發明也可以選擇以不同的管道來提供不同種類的建構材料150,來滿足可能的製作需求。 In the foregoing embodiments, the build material 150 is not limited to containing only a single type of metal powder. In other words, the build material 150 may contain more than two metal powders. In addition, the present invention may also choose to provide different types of construction materials 150 in different conduits to meet possible manufacturing needs.

具體而言,圖6繪示了依照本發明另一實施例的工作件加工設備600。如圖6所示,工作件加工設備600與前述實施例的工作件加工設備100的差異包括:供料單元包括配置於噴射裝置620內且連接噴射裝置620之開口端620a的第一供料單元632以及同樣配置於噴射裝置620內且連接噴射裝置620之開口端620a的第二供料單元634,第一供料單元632以及第二供料單元634藉由第一供料管道632a與第二供料管道634a分別噴覆第一建構材料652與第二建構材料654至加工位置612(即工作件610的缺陷612),同時噴射裝置620使雷射光源622朝向開口端620a發射 雷射光L,以固化位於加工位置612的第一建構材料652及/或第二建構材料654,其中雷射光源622配置於噴射裝置620內。在本實施例中,主機640可以控制噴射裝置620進而決定使第一供料單元632以及第二供料單元634同時或依序提供第一建構材料652與第二建構材料654至加工位置612。換言之,本實施例可以依據需求在加工位置612上形成由單一建構材料構成的結構,或是兩種以上的建構材料所構成的結構。 In particular, Figure 6 depicts a workpiece processing apparatus 600 in accordance with another embodiment of the present invention. As shown in FIG. 6, the difference between the workpiece processing apparatus 600 and the workpiece processing apparatus 100 of the foregoing embodiment includes that the supply unit includes a first supply unit disposed in the injection device 620 and connected to the open end 620a of the injection device 620. 632 and a second feeding unit 634, which is also disposed in the spraying device 620 and connected to the open end 620a of the spraying device 620, the first feeding unit 632 and the second feeding unit 634 are provided by the first supply conduit 632a and the second The supply conduit 634a sprays the first build material 652 and the second build material 654 to the processing location 612 (i.e., the defect 612 of the workpiece 610), respectively, while the spray device 620 causes the laser source 622 to emit toward the open end 620a. The laser light L is used to cure the first build material 652 and/or the second build material 654 at the processing location 612, wherein the laser source 622 is disposed within the spray device 620. In the present embodiment, the host 640 can control the spray device 620 to in turn cause the first feed unit 632 and the second feed unit 634 to simultaneously and sequentially provide the first build material 652 and the second build material 654 to the processing position 612. In other words, the present embodiment can form a structure composed of a single construction material or a structure composed of two or more construction materials at the processing position 612 as needed.

另一方面,本發明所提出的工作件加工設備並不限於對工作件上的缺陷進行加工。舉例而言,本發明所提出的工作件加工設備也可直接在工作平台上進行積層製造,以直接形成所需的工作件或結構件。 On the other hand, the workpiece processing apparatus proposed by the present invention is not limited to processing defects on the workpiece. For example, the workpiece processing apparatus proposed by the present invention can also be laminated directly on a work platform to directly form a desired work piece or structural member.

圖7A繪示依照本發明又一實施例的工作件加工設備700。本實施例的工作件加工設備700與前述實施例的工作件加工設備600的主要差異在於省略了進行缺陷加工所需的掃描裝置。主機730耦接工作平台710與噴射裝置720,並用以控制噴射裝置720相對於工作平台710移動。主機770包括資料庫772,用以儲存對應工作件760之零件模型資料780,且主機770適於依據零件模型資料780來控制噴射裝置720在加工位置742上進行積層製造。在此,主機730、工作平台710與噴射裝置720之間的作動可參考圖3、4所示的電腦數值控制方法,於此不再贅述。 FIG. 7A illustrates a workpiece processing apparatus 700 in accordance with yet another embodiment of the present invention. The main difference between the workpiece processing apparatus 700 of the present embodiment and the workpiece processing apparatus 600 of the foregoing embodiment is that the scanning apparatus required for performing defect processing is omitted. The host 730 is coupled to the working platform 710 and the spraying device 720 and is used to control the movement of the spraying device 720 relative to the working platform 710. The host 770 includes a database 772 for storing part model data 780 of the corresponding work piece 760, and the host 770 is adapted to control the spray device 720 to perform laminate manufacturing at the processing position 742 in accordance with the part model data 780. Here, the operation between the host 730, the working platform 710 and the spraying device 720 can be referred to the computer numerical value control method shown in FIGS. 3 and 4, and details are not described herein again.

又如圖7A所示,本實施例的噴射裝置720例如是設置於工作平台710上方,其包括雷射光源722配置於噴射裝置720內, 並且朝向噴射裝置720的開口端720a發射雷射光L。第一供料單元732以及第二供料單元734分別連接噴射裝置720之開口端720a的第一供料管道732a以及第二供料管道734a,以藉由第一供料管道732a以及第二供料管道734a朝向噴射裝置720的開口端720a提供不同的第一建構材料752以及第二建構材料754,同時噴射裝置720使雷射光源722提供雷射光L至工作平台710上的加工位置742,燒結第一建構材料752及/或第二建構材料754。所述第一建構材料752或第二建構材料754可為包含有金屬粉末與黏著體的混合物。在此,使用的金屬粉末例如是鋁、鈦或其他適用的材質。黏著體例如是樹脂或其他適用的高分子聚合物等。 As shown in FIG. 7A , the spraying device 720 of the embodiment is disposed above the working platform 710 , and includes a laser light source 722 disposed in the spraying device 720 . And the laser light L is emitted toward the open end 720a of the ejection device 720. The first supply unit 732 and the second supply unit 734 are respectively connected to the first supply conduit 732a and the second supply conduit 734a of the open end 720a of the injection device 720 for the first supply conduit 732a and the second supply The material conduit 734a provides a different first build material 752 and a second build material 754 toward the open end 720a of the spray device 720, while the spray device 720 provides the laser light source 722 with the laser light L to a processing location 742 on the work platform 710, sintering First build material 752 and/or second build material 754. The first build material 752 or the second build material 754 can be a mixture comprising a metal powder and an adherent. Here, the metal powder used is, for example, aluminum, titanium or other suitable materials. The adhesive is, for example, a resin or other suitable high molecular polymer.

在本實施例中,主機770可以控制噴射裝置720進而決定使第一供料單元732以及第二供料單元734同時或依序提供第一建構材料752與第二建構材料754至加工位置742。如圖7A所示即為先在工作平台710上提供第一建構材料752,同時噴射裝置720使雷射光源722提供雷射光L至工作平台710上的加工位置742,以形成第一結構體762之後,再於第一結構體762上提供第二建構材料754,同時噴射裝置720使雷射光源722提供雷射光L至第一結構體762上的加工位置,而於第一結構體762上形成第二結構體764,最終形成所需的工作件760。藉由此方式,可以在工作件760的不同部位形成不同強度的結構體。 In the present embodiment, the host 770 can control the spraying device 720 to determine that the first feeding unit 732 and the second feeding unit 734 simultaneously or sequentially provide the first building material 752 and the second building material 754 to the processing position 742. As shown in FIG. 7A, a first build material 752 is first provided on the work platform 710, while the spray device 720 causes the laser source 722 to provide laser light L to a processing location 742 on the work platform 710 to form a first structure 762. Thereafter, a second build material 754 is further provided on the first structure 762, while the spray device 720 causes the laser light source 722 to provide the laser light L to the processing position on the first structure 762, and forms on the first structure 762. The second structure 764 ultimately forms the desired workpiece 760. In this way, structures of different strengths can be formed at different locations of the workpiece 760.

圖7B繪示依照本發明又一實施例的工作件加工設備700的另一種製作方式。本實施例與前述實施例的差異在於:本實施 例的主機770控制噴射裝置720進而決定使第一供料單元732以及第二供料單元734藉由第一供料管道732a以及第二供料管道734a同時提供第一建構材料752與第二建構材料754至工作平台710上的加工位置742。因此,所形成的工作件760即混合了第一建構材料752與第二建構材料754。 FIG. 7B illustrates another manner of making a workpiece processing apparatus 700 in accordance with yet another embodiment of the present invention. The difference between this embodiment and the foregoing embodiment is that the present implementation The host 770 of the example controls the injection device 720 to determine that the first supply unit 732 and the second supply unit 734 simultaneously provide the first construction material 752 and the second construction by the first supply conduit 732a and the second supply conduit 734a. Material 754 to processing location 742 on work platform 710. Thus, the formed workpiece 760 is a mixture of the first build material 752 and the second build material 754.

然於其他實施例中,第一建構材料752以及第二建構材料754亦可為相同混合物,用以形成所需的工作件760。更具體而言,圖7C繪示依照本發明又一實施例的工作件加工設備700。本實施例與前述實施例的差異在於:本實施例的第一供料單元732以及第二供料單元734藉由第一供料管道732a以及第二供料管道734a提供相同的建構材料750至加工位置742。因此,所形成的工作件760是由單一建構材料750所形成。當然,本實施例也可以選擇由單一個供料單元來提供相同的建構材料750至第一供料管道732a以及第二供料管道734a。 In other embodiments, the first build material 752 and the second build material 754 may also be the same mixture to form the desired workpiece 760. More specifically, FIG. 7C illustrates a workpiece processing apparatus 700 in accordance with yet another embodiment of the present invention. The difference between this embodiment and the foregoing embodiment is that the first supply unit 732 and the second supply unit 734 of the present embodiment provide the same construction material 750 through the first supply conduit 732a and the second supply conduit 734a to Processing location 742. Thus, the formed workpiece 760 is formed from a single build material 750. Of course, this embodiment may also choose to provide the same construction material 750 to the first supply conduit 732a and the second supply conduit 734a from a single supply unit.

另外,圖8A繪示依據本發明一實施例之噴射裝置720與工作平台710的局部示意圖。相關元件可參考圖7A之實施例的說明,於此不再贅述。本實施例如圖8A所示在噴射裝置720內設置氣體管道728,其連接噴射裝置720的開口端720a,用以提供惰性氣體(或是氮氣(N2))790至加工位置742,使得加工位置742位於惰性氣體環境792中。此處的惰性氣體(Inert Gas)例如是氬氣(Ar)、氦氣(He)或其他適用的惰性氣體,亦或是氮氣(N2),以避免加工位置742的第一建構材料752或第二建構材料754因熱產生 氧化或加工過程中材料噴濺等問題。當然,本實施例也可以選擇不在噴射裝置720中設置氣體管道728,而改以獨立的氣體噴頭(未繪示)來提供惰性氣體或是氮氣,或是將工作件加工設備700設置於具有惰性氣體或是氮氣的腔室中,來提供類似的惰性氣體環境或是氮氣環境。 In addition, FIG. 8A is a partial schematic view of the ejection device 720 and the working platform 710 according to an embodiment of the invention. For related components, reference may be made to the description of the embodiment of FIG. 7A, and details are not described herein again. The present embodiment, as shown in FIG. 8A, is provided with a gas conduit 728 in the injection device 720 that connects the open end 720a of the injection device 720 for providing an inert gas (or nitrogen (N 2 )) 790 to the processing location 742 such that the processing location 742 is located in an inert gas environment 792. The inert gas (Inert Gas) herein is, for example, argon (Ar), helium (He) or other suitable inert gas, or nitrogen (N 2 ) to avoid the first build material 752 of the processing location 742 or The second build material 754 has problems such as oxidation due to heat or splashing of material during processing. Of course, this embodiment may also choose not to provide the gas pipe 728 in the spraying device 720, but to provide an inert gas or nitrogen gas by using a separate gas nozzle (not shown), or to set the workpiece processing device 700 to be inert. A gas or nitrogen chamber provides a similar inert gas or nitrogen atmosphere.

圖8B繪示依據本發明另一實施例之噴射裝置720與工作平台710的局部示意圖。本實施例與圖8A之實施例類似,主要差異為:在噴射裝置720外圍設置阻隔件795,使其圍繞噴射裝置720與工作件760。阻隔件795內可以提供惰性氣體(或是氮氣),以形成惰性氣體環境(或是氮氣環境)792。相關元件可參考圖7A之實施例的說明,於此不再贅述。 FIG. 8B is a partial schematic view of the spray device 720 and the work platform 710 according to another embodiment of the present invention. This embodiment is similar to the embodiment of FIG. 8A, with the main difference being that a barrier 795 is placed around the ejection device 720 to surround the ejection device 720 and the workpiece 760. An inert gas (or nitrogen) may be provided in the barrier 795 to form an inert gas environment (or a nitrogen atmosphere) 792. For related components, reference may be made to the description of the embodiment of FIG. 7A, and details are not described herein again.

綜上所述,本發明提出的工作件加工設備與方法可藉由積層製造技術來對工作件進行加工,例如修補缺陷,以重複零件使用,節省材料耗用,並可提供具高自由度的維修效能。此外,本發明亦可選擇直接在工作平台上以單一建構材料或是混合不同的建構材料來形成局部強化或整體的工作件,以實現高精密度與高自由度的生產效能。 In summary, the working piece processing apparatus and method proposed by the present invention can process workpieces by laminating manufacturing techniques, such as repairing defects, repeating parts use, saving material consumption, and providing high degree of freedom. Maintenance performance. In addition, the present invention may also choose to form a locally strengthened or integral working piece directly on the working platform by using a single construction material or mixing different construction materials to achieve high precision and high degree of freedom of production performance.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100‧‧‧工作件加工設備 100‧‧‧Workpiece processing equipment

110‧‧‧工作平台 110‧‧‧Working platform

120‧‧‧噴射裝置 120‧‧‧Spray device

122‧‧‧雷射光源 122‧‧‧Laser light source

130‧‧‧供料單元 130‧‧‧Feeding unit

140‧‧‧主機 140‧‧‧Host

142‧‧‧資料庫 142‧‧‧Database

150‧‧‧建構材料 150‧‧‧ Construction materials

160‧‧‧掃描裝置 160‧‧‧Scanning device

180‧‧‧原始件模型資料 180‧‧‧ original model data

210‧‧‧工作件 210‧‧‧Workpieces

212‧‧‧缺陷(加工位置) 212‧‧‧ Defects (machining position)

280‧‧‧加工零件模型資料 280‧‧‧Processing part model data

290‧‧‧三維計算機輔助設計圖檔 290‧‧‧3D computer aided design files

L‧‧‧雷射光 L‧‧‧Laser light

Claims (22)

一種工作件加工設備,包括:一工作平台,適於承載一工作件;一供料單元,適於提供一建構材料,該建構材料包括一金屬粉末以及一黏著體;一噴射裝置,設置於該工作平台上方,該噴射裝置包括一雷射光源,該供料單元連接該噴射裝置,當該供料單元透過該噴射裝置噴覆該建構材料至該工作件上的一加工位置,同時該噴射裝置使該雷射光源提供一雷射光至該加工位置,以成形該建構材料並與該工作件結合;一主機,耦接該工作平台與該噴射裝置,並用以控制該噴射裝置能夠相對於該工作平台移動,且該主機包括一資料庫,用以儲存對應該工作件之一原始件模型資料;以及一掃描裝置,耦接該主機,該掃描裝置用以掃描該工作件的一外觀,以建立一工作件模型資料,其中該主機適於接收該工作件模型資料,並且比較該原始件模型資料與該工作件模型資料,以取得一比較結果,並依據該比較結果產生一加工資料,且該主機適於依據該加工資料控制該噴射裝置,使該噴射裝置移動至該工作件上的該加工位置。 A working piece processing apparatus, comprising: a working platform adapted to carry a working piece; a feeding unit adapted to provide a construction material, the construction material comprising a metal powder and an adhesive body; a spraying device disposed at the Above the working platform, the spraying device comprises a laser light source, the feeding unit is connected to the spraying device, and the feeding unit sprays the construction material through a spraying device to a processing position on the working member, and the spraying device Having the laser light source provide a laser beam to the processing position to form the construction material and combine with the workpiece; a host coupled to the working platform and the spraying device, and configured to control the spray device to be capable of working relative to the working device The platform is moved, and the host includes a database for storing the original model data corresponding to the working piece; and a scanning device coupled to the host, the scanning device is configured to scan an appearance of the working piece to establish a work piece model data, wherein the host is adapted to receive the work piece model data, and compare the original piece model data with the work piece Type data to obtain a comparison result, and generating a comparison result according to the processing information, and the host is adapted to the ejection device according to the control data processing, so that the ejection means to move the machining position in the workpiece. 如申請專利範圍第1項所述的工作件加工設備,其中該掃描裝置包括一攝像元件,用以擷取該工作件的影像,以產生該工作件模型資料。 The workpiece processing apparatus of claim 1, wherein the scanning device comprises an image capturing component for capturing an image of the workpiece to generate the workpiece model data. 如申請專利範圍第1項所述的工作件加工設備,其中該比較結果包括一三維計算機輔助設計(Computer Aided Design,CAD)圖檔。 The work piece processing apparatus according to claim 1, wherein the comparison result comprises a three-dimensional computer aided design (CAD) image file. 如申請專利範圍第1項所述的工作件加工設備,其中該供料單元包括配置於該噴射裝置內且連接該噴射裝置之一開口端的一供料管道,該供料單元藉由該供料管道以朝向該噴射裝置的該開口端提供該建構材料,該雷射光源配置於該噴射裝置內,並且朝向該噴射裝置的該開口端發射該雷射光。 The workpiece processing apparatus of claim 1, wherein the feeding unit comprises a supply pipe disposed in the spraying device and connected to an open end of the spraying device, the feeding unit by the feeding A conduit provides the build material toward the open end of the spray device, the laser source being disposed within the spray device and emitting the laser light toward the open end of the spray device. 如申請專利範圍第4項所述的工作件加工設備,其中該噴射裝置更具有一氣體管道,該氣體管道連接該噴射裝置的該開口端,用以提供一惰性氣體或是氮氣至該加工位置。 The workpiece processing apparatus of claim 4, wherein the injection device further has a gas pipe connected to the open end of the injection device for supplying an inert gas or nitrogen to the processing position. . 如申請專利範圍第1項所述的工作件加工設備,其中該加工位置位於一惰性氣體環境或是一氮氣環境中。 The workpiece processing apparatus of claim 1, wherein the processing location is in an inert gas atmosphere or a nitrogen atmosphere. 如申請專利範圍第6項所述的工作件加工設備,更包括一阻隔件,圍繞該噴射裝置與該加工位置,以形成該惰性氣體環境或是該氮氣環境。 The workpiece processing apparatus of claim 6, further comprising a barrier member surrounding the spraying device and the processing position to form the inert gas environment or the nitrogen atmosphere. 如申請專利範圍第1項所述的工作件加工設備,其中該供料單元包括一第一供料單元以及一第二供料單元,用以分別提供不同的建構材料至該加工位置。 The workpiece processing apparatus of claim 1, wherein the feeding unit comprises a first feeding unit and a second feeding unit for respectively providing different construction materials to the processing position. 一種工作件加工方法,適用於一工作件加工設備,該工作件加工設備包括一工作平台、一供料單元、一噴射裝置、一主機以及一掃描裝置,該供料單元提供一建構材料,該噴射裝置設置 於該工作平台上方,該噴射裝置包括一雷射光源,該供料單元連接該噴射裝置,該主機耦接該工作平台與該噴射裝置,並用以控制該噴射裝置能夠相對於該工作平台移動,且該主機包括一資料庫,用以儲存對應一工作件之一原始件模型資料,以及該掃描裝置耦接該主機,該工作件加工方法包括:承載該工作件於該工作平台;藉由該掃描裝置掃描該工作件的一外觀,以建立一工作件模型資料;該主機接收該工作件模型資料,並比較該原始件模型資料與該工作件模型資料,以取得一比較結果,並依據該比較結果產生一加工資料;以及該主機依據該加工資料以控制該噴射裝置,使該噴射裝置移動至對應該加工資料的該工作件上的該加工位置,該供料單元透過該噴射裝置噴覆該建構材料至該工作件上的該加工位置,同時該噴射裝置使該雷射光源提供一雷射光至該加工位置,以成形該建構材料並與該工作件結合,其中該建構材料包括一金屬粉末以及一黏著體。 A workpiece processing method is applicable to a workpiece processing apparatus, the workpiece processing apparatus comprising a working platform, a feeding unit, a spraying device, a host and a scanning device, wherein the feeding unit provides a construction material, Spray device setting Above the working platform, the spraying device comprises a laser light source, the feeding unit is connected to the spraying device, the main body is coupled to the working platform and the spraying device, and is configured to control the spraying device to be movable relative to the working platform, And the host includes a database for storing the original model data corresponding to one of the workpieces, and the scanning device is coupled to the host, the workpiece processing method includes: carrying the workpiece on the working platform; The scanning device scans an appearance of the workpiece to establish a workpiece model data; the host receives the workpiece model data, and compares the original model data with the workpiece model data to obtain a comparison result, and according to the The comparison result produces a processing data; and the host controls the spraying device according to the processing data to move the spraying device to the processing position on the workpiece corresponding to the processed material, and the feeding unit is sprayed through the spraying device Constructing material to the processing location on the workpiece while the ejection device provides the laser source with a laser To the processing position, to construct the molding material and combined with the working member, wherein the material comprises a construction of a metal powder and an adhesion thereof. 如申請專利範圍第9項所述的工作件加工方法,其中比較該原始件模型資料與該工作件模型資料的方法包括藉由該主機對該原始件模型資料與該工作件模型資料進行減法運算,以建立一三維計算機輔助設計(Computer Aided Design,CAD)圖檔。 The method for processing a workpiece according to claim 9, wherein the method for comparing the original model data with the workpiece model data comprises performing subtraction on the original model data and the workpiece model data by the host To create a three-dimensional Computer Aided Design (CAD) image file. 如申請專利範圍第10項所述的工作件加工方法,其中依 據該比較結果產生該加工資料的方法包括:將該三維計算機輔助設計圖檔轉換為適用於電腦輔助製造(Computer Aided Manufacturing,CAM)的一點矩陣檔;依據該點矩陣檔來規劃一加工路徑;以及將該加工路徑轉換為一數值控制資料,以依據該數值控制資料來控制該噴射裝置相對於該工作件的移動。 For example, the working piece processing method described in claim 10, wherein The method for generating the processing data according to the comparison result comprises: converting the three-dimensional computer aided design image file into a point matrix file suitable for Computer Aided Manufacturing (CAM); and planning a processing path according to the point matrix file; And converting the processing path into a numerical control data to control movement of the injection device relative to the workpiece according to the numerical control data. 如申請專利範圍第9項所述的工作件加工方法,其中該供料單元透過該噴射裝置噴覆該建構材料至該工作件上的該加工位置,同時該噴射裝置使該雷射光源提供一雷射光至該加工位置的方法包括:該供料單元包括配置於該噴射裝置內且連接該噴射裝置之一開口端的一供料管道,該供料單元藉由該供料管道並朝向該噴射裝置的該開口端提供該建構材料,該雷射光源配置於該噴射裝置內,並且朝向該噴射裝置的該開口端發射該雷射光。 The working piece processing method according to claim 9, wherein the feeding unit sprays the construction material to the processing position on the working piece through the spraying device, and the spraying device provides the laser light source with a The method of laser light to the processing position includes: the feeding unit includes a supply pipe disposed in the spraying device and connected to an open end of the spraying device, the feeding unit is directed toward the spraying device by the feeding pipe The open end provides the construction material, the laser source being disposed within the spray device and emitting the laser light toward the open end of the spray device. 如申請專利範圍第9項所述的工作件加工方法,更包括提供一惰性氣體或是氮氣至該加工位置。 The working piece processing method according to claim 9, further comprising providing an inert gas or nitrogen gas to the processing position. 如申請專利範圍第9項所述的工作件加工方法,更包括使該加工位置位於一惰性氣體環境或是一氮氣環境中。 The working piece processing method according to claim 9, further comprising placing the processing position in an inert gas environment or a nitrogen atmosphere. 如申請專利範圍第9項所述的工作件加工方法,其中該供料單元包括一第一供料單元以及一第二供料單元,用以同時或依序提供不同的建構材料至該加工位置。 The working piece processing method according to claim 9, wherein the feeding unit comprises a first feeding unit and a second feeding unit for simultaneously or sequentially providing different construction materials to the processing position. . 一種工作件加工設備,包括: 一工作平台;一供料單元,適於提供一建構材料,該建構材料包括一金屬粉末以及一黏著體;以及一噴射裝置,設置於該工作平台上方,該噴射裝置包括一雷射光源,該供料單元連接該噴射裝置,當該供料單元透過該噴射裝置噴覆該建構材料至該工作平台上的一加工位置,同時該噴射裝置使該雷射光源提供一雷射光至該加工位置,以成形該建構材料。 A workpiece processing device comprising: a working platform; a feeding unit adapted to provide a construction material, the construction material comprising a metal powder and an adhesive body; and a spraying device disposed above the working platform, the spraying device comprising a laser light source, a feeding unit is coupled to the spraying device, and the feeding unit sprays the building material through a spraying device to a processing position on the working platform, and the spraying device causes the laser light source to provide a laser light to the processing position, To form the construction material. 如申請專利範圍第16項所述的工作件加工設備,更包括一主機,耦接該工作平台與該噴射裝置,並用以控制該噴射裝置能夠相對於該工作平台移動,其中該主機包括一資料庫,用以儲存一零件模型資料,且該主機適於依據該零件模型資料以控制該噴射裝置,使該噴射裝置移動至該工作平台上的該加工位置。 The workpiece processing apparatus of claim 16, further comprising a host coupled to the working platform and the spraying device, and configured to control the spraying device to be movable relative to the working platform, wherein the host includes a data a library for storing a part model data, and the host is adapted to control the injection device according to the part model data to move the injection device to the processing position on the work platform. 如申請專利範圍第16項所述的工作件加工設備,其中該供料單元包括配置於該噴射裝置內且連接該噴射裝置之一開口端的一供料管道,該供料單元藉由該供料管道並朝向該噴射裝置的該開口端提供該建構材料,該雷射光源配置於該噴射裝置內,並且朝向該噴射裝置的該開口端發射該雷射光。 The workpiece processing apparatus of claim 16, wherein the feeding unit comprises a supply pipe disposed in the spraying device and connected to an open end of the spraying device, the feeding unit by the feeding The conduit and the construction material are provided toward the open end of the spray device, the laser source being disposed within the spray device and emitting the laser light toward the open end of the spray device. 如申請專利範圍第18項所述的工作件加工設備,其中該噴射裝置更具有一氣體管道,該氣體管道連接該噴射裝置的該開口端,用以提供一惰性氣體或是氮氣至該加工位置。 The workpiece processing apparatus according to claim 18, wherein the spraying device further has a gas pipe connected to the open end of the spraying device for supplying an inert gas or nitrogen to the processing position. . 如申請專利範圍第16項所述的工作件加工設備,其中該 加工位置位於一惰性氣體環境或是一氮氣環境中。 The workpiece processing apparatus according to claim 16, wherein the The processing position is in an inert gas atmosphere or a nitrogen atmosphere. 如申請專利範圍第20項所述的工作件加工設備,更包括一阻隔件,圍繞該噴射裝置與該加工位置,以形成該惰性氣體環境或是該氮氣環境。 The workpiece processing apparatus according to claim 20, further comprising a barrier member surrounding the spraying device and the processing position to form the inert gas environment or the nitrogen atmosphere. 如申請專利範圍第16項所述的工作件加工設備,其中該供料單元包括一第一供料單元以及一第二供料單元,用以分別提供不同的建構材料至該加工位置。 The workpiece processing apparatus of claim 16, wherein the feeding unit comprises a first feeding unit and a second feeding unit for respectively providing different construction materials to the processing position.
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