TWI692278B - Flexible circuit board - Google Patents
Flexible circuit board Download PDFInfo
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- TWI692278B TWI692278B TW108139839A TW108139839A TWI692278B TW I692278 B TWI692278 B TW I692278B TW 108139839 A TW108139839 A TW 108139839A TW 108139839 A TW108139839 A TW 108139839A TW I692278 B TWI692278 B TW I692278B
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- circuit board
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- 238000001514 detection method Methods 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 18
- 239000010408 film Substances 0.000 claims description 11
- 230000005540 biological transmission Effects 0.000 claims description 10
- 239000010409 thin film Substances 0.000 claims description 7
- 238000000605 extraction Methods 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- 238000007689 inspection Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
本發明關於一種軟性線路板,特別是一種具有不同形狀或位置特徵的軟性線路板。The invention relates to a flexible circuit board, in particular to a flexible circuit board with different shape or position characteristics.
軟性線路板為LCD螢幕的重要元件,其用以連接液晶面板及電路板,因應LCD螢幕的大尺寸及高畫質需求,軟性線路板上的線路數目大幅增加,因此須以自動光學檢測(automatic optical inspection, AOI)取代目視檢測,擷取線路圖案影像,並使用視覺軟體進行分析,以檢測線路是否存在缺陷,然而當軟性線路板上的線路為重複圖案且橫跨不同影像擷取區域時,擷取自不同區域的影像之間並無特徵可區分,即使根據分析結果判斷線路存在缺陷,仍無法得知缺陷位於軟性線路板的哪一區域。The flexible circuit board is an important component of the LCD screen. It is used to connect the LCD panel and the circuit board. In response to the large size and high image quality requirements of the LCD screen, the number of circuits on the flexible circuit board has increased significantly. Therefore, automatic optical inspection (automatic inspection) is required. optical inspection, AOI) replaces visual inspection, captures line pattern images, and uses visual software to analyze whether the line is defective. However, when the line on the flexible circuit board is a repeating pattern and spans different image capture areas, There are no features that can be distinguished between the images captured from different areas. Even if the circuit is judged to have a defect based on the analysis result, it is still impossible to know which region of the flexible circuit board the defect is in.
本發明之目的在於提供一種軟性線路板,軟性線路板上的線路層具有不同的識別特徵,分別位於不同影像擷取區域內,以利AOI系統區分來自不同區域的線路影像。The purpose of the present invention is to provide a flexible circuit board, the circuit layers on the flexible circuit board have different identification features, which are located in different image capturing areas, so that the AOI system can distinguish circuit images from different areas.
本發明之一種軟性線路板包含一薄膜基板、複數個傳動孔及一線路層,該薄膜基板具有一表面,該表面定義有一檢測區,該檢測區具有一第一影像擷取區域及一第二影像擷取區域,該些傳動孔縱向排列於該薄膜基板兩側,該檢測區沿著同側的該些傳動孔排列方向具有一長度,該長度不小於同側相鄰的該些傳動孔之間的一距離,該線路層形成於該表面且具有第一識別特徵及一第二識別特徵,該第一識別特徵位於該第一影像擷取區域內,該第二識別特徵位於該第二影像擷取區域內,該第一識別特徵及該第二識別特徵為不同的形狀特徵或位置特徵,其中該第一識別特徵由至少一第一單元構成,該第一單元具有兩個第一線路及一第一標記,該些第一線路互相對稱鏡射且各具有至少一第一延伸部及一第一讓位部,該第一延伸部自該第一讓位部的一側延伸,該些第一延伸部之間的一間距小該些第一讓位部之間的一間距,該第一標記位於該些第一讓位部之間,其中該第二識別特徵由至少一第二單元構成,該第二單元具有兩個第二線路及一第二標記,該些第二線路互相對稱鏡射且各具有至少一第二延伸部及一第二讓位部,該第二延伸部自該第二讓位部的一側延伸,該些第二延伸部之間的一間距小於該些第二讓位部之間的一間距,該第二標記位於該些第二讓位部之間。A flexible circuit board of the present invention includes a film substrate, a plurality of transmission holes and a circuit layer. The film substrate has a surface defined by a detection area, the detection area has a first image capture area and a second In the image capturing area, the drive holes are longitudinally arranged on both sides of the film substrate, and the detection area has a length along the arrangement direction of the drive holes on the same side, and the length is not less than that of the drive holes adjacent on the same side A distance between the circuit layer is formed on the surface and has a first identification feature and a second identification feature, the first identification feature is located in the first image capture area, the second identification feature is located in the second image In the extraction area, the first identification feature and the second identification feature are different shape features or position features, wherein the first identification feature is composed of at least one first unit, and the first unit has two first lines and A first mark, the first lines are symmetrically mirrored with each other and each have at least a first extension portion and a first concession portion, the first extension portion extends from one side of the first concession portion, the A distance between the first extensions is smaller than a distance between the first yielding parts, the first mark is located between the first yielding parts, wherein the second identification feature is composed of at least one second unit The second unit has two second lines and a second mark. The second lines are symmetrically mirrored with each other and each has at least a second extension portion and a second concession portion. The second extension portion is from One side of the second concession extends, a spacing between the second extensions is smaller than a spacing between the second concessions, the second mark is located between the second concessions .
若AOI系統擷取的影像為重複線路圖案,分析軟體無法區分不同區域的影像,因此本發明於該線路層形成不同形狀或位置的該第一識別特徵及該第二識別特徵,以供AOI系統區分擷取自該第一影像擷取區域及該第二影像擷取區域的線路影像。If the image captured by the AOI system is a repeated circuit pattern, the analysis software cannot distinguish images in different regions, so the present invention forms the first identification feature and the second identification feature with different shapes or positions on the circuit layer for the AOI system Differentiate the line images captured from the first image capturing area and the second image capturing area.
請參閱第1a圖,其為本發明之第一實施例,一捲帶基板包含複數個軟性線路板A,各該軟性線路板A具有一薄膜基板100、複數個傳動孔200及一線路層300,該些傳動孔200縱向排列於該薄膜基板100兩側,該線路層300形成於該薄膜基板100之一表面110,較佳地,該薄膜基板100為聚醯亞胺(polyimide, PI)薄膜或聚對苯二甲酸乙二酯(polyethylene terephthalate, PET)薄膜,且兩側分別具有不小於7個該傳動孔200,一銅箔基材覆蓋於該薄膜基板100之該表面110,經蝕刻後形成該線路層300,且該線路層300覆蓋該薄膜基板100之該表面110的比例不小於47.2%。Please refer to FIG. 1a, which is the first embodiment of the present invention. A tape substrate includes a plurality of flexible circuit boards A, each of which has a
請參閱第1a圖,該表面110定義有一檢測區111,部份該線路層300位於該檢測區111內,自動光學檢測(automatic optical inspection, AOI)系統針對位於該檢測區111的該線路層300進行檢測,以確認該線路層300是否存在缺陷,該檢測區111沿著同側的該些傳動孔200排列方向具有一長度L,該長度L不小於同側相鄰的該些傳動孔200之間的一距離D,較佳地,該長度L大於該距離D,該檢測區111包含一第一影像擷取區域111a及一第二影像擷取區域111b,在本實施例中,該第一影像擷取區域111a及該第二影像擷取區域111b縱向排列於該檢測區111中,因此可使用同一CCD攝影機依序擷取位於該第一影像擷取區域111a及該第二影像擷取區域111b內的該線路層300影像,再藉由視覺軟體分析影像,判斷該線路層300是否存在缺陷。Please refer to FIG. 1a, the
請參閱第1a圖,該線路層300具有一第一識別特徵及一第二識別特徵,該第一識別特徵位於該第一影像擷取區域111a內,該第二識別特徵位於該第二影像擷取區域111b內,在本實施例中,該第一識別特徵及該第二識別特徵為不同的形狀特徵,因此視覺軟體分析影像時,可藉由該第一識別特徵及該第二識別特徵區分來自該第一影像擷取區域111a及該第二影像擷取區域111b的影像。Please refer to FIG. 1a, the
請參閱第1b圖,該第一識別特徵由至少一第一單元310構成,該第一單元310具有兩個第一線路311及一第一標記312,兩個第一線路311互相對稱鏡射,各該第一線路311具有至少一第一延伸部311a及一第一讓位部311b,該第一延伸部311a連接該第一讓位部311b且自該第一讓位部311b的一側延伸,該些第一延伸部311a之間的一間距P1a小於該些第一讓位部311b之間的一間距P1b,該第一標記312位於該些第一讓位部311b之間的空間,較佳地,各該第一線路311具有兩個第一延伸部311a,分別自該第一讓位部311b的兩側向外延伸。Please refer to FIG. 1b, the first identification feature is composed of at least one
請參閱第1c圖,該第二識別特徵由至少一第二單元320構成,該第二單元320具有兩個第二線路321及一第二標記322,兩個第二線路321互相對稱鏡射,各該第二線路321具有至少一第二延伸部321a及一第二讓位部321b,該第二延伸部321a連接該第二讓位部321b且自該第二讓位部321b的一側延伸,該些第二延伸部321a之間的一間距P2a小於該些第二讓位部321b之間的一間距P2b,該第二標記322位於該些第二讓位部321b之間的空間,較佳地,各該第二線路321具有兩個第二延伸部321a,分別自該第二讓位部321b的兩側向外延伸。
Please refer to FIG. 1c, the second identification feature is composed of at least one
在本實施例中,該些第一延伸部311a之間的該間距P1a實質上等於該些第二延伸部321a之間的該間距P2a,且該些第一讓位部311b之間的該間距P1b實質上等於該些第二讓位部321b之間的該間距P2b,且該些第一線路311、該第一標記312、該些第二線路321、該第二標記322及其他位於該薄膜基板100上的線路係藉由同一蝕刻製程所形成。
In this embodiment, the pitch P1a between the first extending
該第一識別特徵及該第二識別特徵取決於該第一標記312及該第二標記322的形狀、位置或其組合,因此當該第一標記312的形狀不同於該第二標記322的形狀時,該第一識別特徵及該第二識別特徵為不同形狀特徵,當該第一標記312於該第一影像擷取區域111a內的相對位置不同於該第二標記322於該第二影像擷取區域111b內的相對位置時,該第一識別特徵及該第二識別特徵為不同位置特徵。
The first identification feature and the second identification feature depend on the shape, position or combination of the
請參閱第1a圖,較佳地,該第一識別特徵由複數個第一單元310構成,該第二識別特徵由複數個第二單元320構成,因此該第一識別特徵包含複數個第一標記312,而該第二識別特徵包含複數個第二標記322,當其中之一該第一單元310之該第一標記312及其中之一該第二單元320之該第二標記322的形狀不同時,該第一識別特徵及該第二識別特徵即為不同形狀特徵,在第一實施例中,該些第一單元310之該第一標記312具有不同形狀,該些第二單元320之該第二標記322具有不同形狀,且該些第一標記312及該些第二標記322的形狀未重複。Please refer to FIG. 1a. Preferably, the first recognition feature is composed of a plurality of
請參閱第1a圖,在本實施例中,該些第一單元310之該第一標記312及該些第二單元320之該第二標記322的位置為對稱配置,即該些第一標記312於該第一影像擷取區域111a內的配置與該些第二標記322於該第二影像擷取區域111b內的配置相同,因此該第一識別特徵及該第二識別特徵為相同位置特徵及不同形狀特徵。Please refer to FIG. 1a. In this embodiment, the positions of the
請參閱第2圖,其為本發明之第二實施例,與第一實施例的差異在於該些第一單元310之該第一標記312具有相同形狀(圓形),該些第二單元320之該第二標記322具有相同形狀(倒三角形),但該些第一標記312的形狀不同於該些第二標記322的形狀,因此該第一識別特徵及該第二識別特徵為相同位置特徵及不同形狀特徵。Please refer to FIG. 2, which is the second embodiment of the present invention. The difference from the first embodiment is that the
請參閱第3圖,其為本發明之第三實施例,與第一實施例的差異在於該些第一單元310之該第一標記312及該些第二單元320之該第二標記322的位置為非對稱配置,即該些第一標記312於該第一影像擷取區域111a內的配置不同於該些第二標記322於該第二影像擷取區域111b內的配置,因此該第一識別特徵及該第二識別特徵為不同位置特徵及不同形狀特徵。Please refer to FIG. 3, which is the third embodiment of the present invention. The difference from the first embodiment is that the
請參閱第4圖,其為本發明之第四實施例,與第三實施例的差異在於該些第一單元310之該第一標記312及該些第二單元320之該第二標記322具有相同形狀(圓形),因此該第一識別特徵及該第二識別特徵為不同位置特徵及相同形狀特徵。Please refer to FIG. 4, which is a fourth embodiment of the present invention. The difference from the third embodiment is that the
請參閱第1a至4圖,較佳地,該第一標記312未連接該些第一線路311且與該些第一線路311電性絕緣,該第二標記322未連接該些第二線路321且與該些第二線路321電性絕緣,且該第一標記312及該第二標記322為實心虛置圖案(dummy pattern),在其他實施例中,該第一標記312可連接該些第一線路311,該第二標記322可連接該些第二線路321,本發明不以此為限制。Please refer to FIGS. 1a to 4. Preferably, the
請參閱第5a至5c圖,其為本發明之第五實施例,與第一實施例的差異在於該第一標記312及該第二標記322為空心虛置圖案,較佳地,該第一標記312之線寬實質上等於該些第一線路311之線寬,該第二標記322之線寬實質上等於該些第二線路321之線寬,且該些第一線路311之線寬實質上等於該些第二線路321之線寬。Please refer to FIGS. 5a to 5c, which is a fifth embodiment of the present invention. The difference from the first embodiment is that the
請參閱第6圖,其為本發明之第六實施例,與第一實施例的差異在於該第一影像擷取區域111a及該第二影像擷取區域111b橫向排列於該檢測區111,因此位於該第一影像擷取區域111a及該第二影像擷取區域111b內的該線路層300影像係由不同CCD攝影機所擷取。Please refer to FIG. 6, which is a sixth embodiment of the present invention. The difference from the first embodiment is that the first
請參閱第7圖,其為本發明之第七實施例,該檢測區111被劃分為一第一影像擷取區域111a、一第二影像擷取區域111b、一第三影像擷取區域111c及一第四影像擷取區域111d,該第一影像擷取區域111a及該第二影像擷取區域111b縱向排列,由一CCD攝影機擷取其影像,該第三影像擷取區域111c及該第四影像擷取區域111d縱向排列,由另一CCD攝影機擷取其影像,該些影像擷取區域內分別具有一識別特徵,且該些識別特徵為不同的形狀特徵或位置特徵,用以區分該些影像擷取區域,本發明不限制影像擷取區域的數目及排列方式,係根據該檢測區111大小及CCD攝影機配置,選擇性地將該檢測區111劃分為複數個影像擷取區域。Please refer to FIG. 7, which is a seventh embodiment of the present invention. The
本發明之保護範圍當視後附之申請專利範圍所界定者為準,任何熟知此項技藝者,在不脫離本發明之精神和範圍內所作之任何變化與修改,均屬於本發明之保護範圍。The scope of protection of the present invention shall be subject to the scope defined in the attached patent application. Any changes and modifications made by those who are familiar with this skill without departing from the spirit and scope of the present invention shall fall within the scope of protection of the present invention. .
100:薄膜基板
110:表面
111:檢測區
111a:第一影像擷取區域
111b:第二影像擷取區域
111c:第三影像擷取區域
111d:第四影像擷取區域
200:傳動孔
300:線路層
310:第一單元
311:第一線路
311a:第一延伸部
311b:第一讓位部
312:第一標記
320:第二單元
321:第二線路
321a:第二延伸部
321b:第二讓位部
322:第二標記
A:軟性線路板
D:距離
L:長度
P1a:間距
P1b:間距
P2a:間距
P2b:間距100: thin film substrate
110: surface
111:
第1a圖:依據本發明之第一實施例,一種軟性線路板之上視圖。 第1b圖:第1a圖之局部放大圖。 第1c圖:第1a圖之局部放大圖。 第2圖:依據本發明之第二實施例,一種軟性線路板之上視圖。 第3圖:依據本發明之第三實施例,一種軟性線路板之上視圖。 第4圖:依據本發明之第四實施例,一種軟性線路板之上視圖。 第5a圖:依據本發明之第五實施例,一種軟性線路板之上視圖。 第5b圖:第5a圖之局部放大圖。 第5c圖:第5a圖之局部放大圖。 第6圖:依據本發明之第六實施例,一種軟性線路板之上視圖。 第7圖:依據本發明之第七實施例,一種軟性線路板之上視圖。 Figure 1a: A top view of a flexible circuit board according to the first embodiment of the present invention. Figure 1b: Partially enlarged view of Figure 1a. Figure 1c: Partially enlarged view of Figure 1a. Figure 2: A top view of a flexible circuit board according to the second embodiment of the present invention. Figure 3: A top view of a flexible circuit board according to the third embodiment of the present invention. Figure 4: A top view of a flexible circuit board according to the fourth embodiment of the present invention. Figure 5a: A top view of a flexible circuit board according to a fifth embodiment of the present invention. Figure 5b: Partially enlarged view of Figure 5a. Figure 5c: Partially enlarged view of Figure 5a. Figure 6: A top view of a flexible circuit board according to the sixth embodiment of the present invention. Figure 7: A top view of a flexible circuit board according to the seventh embodiment of the present invention.
100:薄膜基板 100: thin film substrate
110:表面 110: surface
111:檢測區 111: detection area
111a:第一影像擷取區域 111a: first image capture area
111b:第二影像擷取區域 111b: Second image capture area
200:傳動孔 200: transmission hole
300:線路層 300: line layer
312:第一標記 312: First mark
322:第二標記 322: Second mark
A:軟性線路板 A: Flexible circuit board
D:距離 D: distance
L:長度 L: length
Claims (14)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108139839A TWI692278B (en) | 2019-11-01 | 2019-11-01 | Flexible circuit board |
| CN201911106890.3A CN112770480B (en) | 2019-11-01 | 2019-11-13 | flexible circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108139839A TWI692278B (en) | 2019-11-01 | 2019-11-01 | Flexible circuit board |
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| Publication Number | Publication Date |
|---|---|
| TWI692278B true TWI692278B (en) | 2020-04-21 |
| TW202119876A TW202119876A (en) | 2021-05-16 |
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| TW108139839A TWI692278B (en) | 2019-11-01 | 2019-11-01 | Flexible circuit board |
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| CN (1) | CN112770480B (en) |
| TW (1) | TWI692278B (en) |
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| CN113777113B (en) * | 2021-08-02 | 2024-11-15 | 景旺电子科技(珠海)有限公司 | Optical detection method of light board and light board manufacturing method |
| TWI845296B (en) * | 2023-05-04 | 2024-06-11 | 頎邦科技股份有限公司 | Layout structure of flexible circuit board |
Citations (2)
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| TWM387995U (en) * | 2010-04-09 | 2010-09-01 | Shanghai Microtek Technology Co Ltd | Automated optical inspection system |
| CN105136818A (en) * | 2015-09-18 | 2015-12-09 | 联策科技股份有限公司 | Image Inspection Method for Printed Substrates |
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| JP3031042B2 (en) * | 1992-03-17 | 2000-04-10 | 松下電器産業株式会社 | Printed wiring board for surface mounting |
| JP3767691B2 (en) * | 2002-02-27 | 2006-04-19 | セイコーエプソン株式会社 | Wiring board and method for manufacturing tape-like wiring board |
| JP2007067272A (en) * | 2005-09-01 | 2007-03-15 | Nitto Denko Corp | TAB tape carrier and method for manufacturing the same |
| JP2007134658A (en) * | 2005-11-14 | 2007-05-31 | Nitto Denko Corp | Wiring circuit board and method for manufacturing wiring circuit board and mounting electronic component |
| CN101309550B (en) * | 2008-06-16 | 2010-11-03 | 友达光电(苏州)有限公司 | Circuit board and electronic device applying the same |
| CN101713635B (en) * | 2008-10-06 | 2012-03-21 | 鸿富锦精密工业(深圳)有限公司 | Printed circuit board (PCB) and positioning system as well as positioning method thereof |
| JP5538048B2 (en) * | 2010-04-22 | 2014-07-02 | 日東電工株式会社 | Alignment mark detection method and printed circuit board manufacturing method |
| CN103118482B (en) * | 2012-12-28 | 2015-08-05 | 威力盟电子(苏州)有限公司 | There is circuit board and the discrimination method thereof of quality identification mark |
| CN107895064B (en) * | 2017-10-19 | 2020-01-10 | 上海望友信息科技有限公司 | Component polarity detection method, system, computer readable storage medium and device |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM387995U (en) * | 2010-04-09 | 2010-09-01 | Shanghai Microtek Technology Co Ltd | Automated optical inspection system |
| CN105136818A (en) * | 2015-09-18 | 2015-12-09 | 联策科技股份有限公司 | Image Inspection Method for Printed Substrates |
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| Publication number | Publication date |
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| TW202119876A (en) | 2021-05-16 |
| CN112770480A (en) | 2021-05-07 |
| CN112770480B (en) | 2021-12-24 |
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