TWI688123B - Strip structure - Google Patents
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- TWI688123B TWI688123B TW108109403A TW108109403A TWI688123B TW I688123 B TWI688123 B TW I688123B TW 108109403 A TW108109403 A TW 108109403A TW 108109403 A TW108109403 A TW 108109403A TW I688123 B TWI688123 B TW I688123B
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- alignment marks
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- outer ring
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- solid crystal
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- 239000000758 substrate Substances 0.000 claims abstract description 45
- 239000000463 material Substances 0.000 claims abstract description 4
- 239000013078 crystal Substances 0.000 claims description 26
- 239000007787 solid Substances 0.000 claims description 26
- 230000002093 peripheral effect Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
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Abstract
Description
本揭示係關於一種料帶結構。 This disclosure relates to a tape structure.
現有的料帶結構通常在基板上設置有對位記號,以於對料帶結構進行切割時協助對準塑料層上相鄰凹杯的交界。然而,基板上對位記號與塑料層係於不同的兩道製程中形成,故基板上的對位記號之精準度有限。 Existing tape structures are usually provided with alignment marks on the substrate, so as to assist in aligning the boundary of adjacent concave cups on the plastic layer when cutting the tape structure. However, the alignment mark on the substrate and the plastic layer are formed in two different processes, so the accuracy of the alignment mark on the substrate is limited.
有鑑於此,本揭示之一目的在於提出一種具有更精確的對位記號之料帶結構。 In view of this, one objective of the present disclosure is to propose a tape structure with more accurate alignment marks.
為達成上述目的,依據本揭示的一些實施方式,一種料帶結構包含基板以及塑料層。塑料層設置於基板上,並包含本體以及外環部。本體具有複數個凹杯結構。外環部環繞連接本體,並且具有複數個對位記號。任一對位記號的中心線對齊兩相鄰凹杯結構之間的交界線。 To achieve the above objective, according to some embodiments of the present disclosure, a tape structure includes a substrate and a plastic layer. The plastic layer is disposed on the substrate and includes a body and an outer ring. The body has a plurality of concave cup structures. The outer ring portion surrounds the connecting body and has a plurality of alignment marks. The center line of any alignment mark is aligned with the boundary line between two adjacent concave cup structures.
依據本揭示的一些實施方式,一種料帶結構包含基板以及塑料層。塑料層設置於基板上,並包含固晶區以及外環部。固晶區具有複數個固晶段。外環部環繞固晶區,並且具 有複數個對位記號。任一對位記號的中心線對齊兩相鄰固晶段之間的交界線。 According to some embodiments of the present disclosure, a tape structure includes a substrate and a plastic layer. The plastic layer is disposed on the substrate and includes a solid crystal area and an outer ring portion. The solid crystal area has a plurality of solid crystal segments. The outer ring surrounds the solid crystal area and has There are multiple alignment marks. The center line of any alignment mark is aligned with the boundary line between two adjacent die bonding segments.
於本揭示的一或多個實施方式中,對位記號沿外環部的外緣線設置。 In one or more embodiments of the present disclosure, the alignment marks are provided along the outer edge line of the outer ring portion.
於本揭示的一或多個實施方式中,對位記號為突起結構,其由外緣線突出於外環部。 In one or more embodiments of the present disclosure, the alignment mark is a protrusion structure, which protrudes from the outer ring portion by the outer edge line.
於本揭示的一或多個實施方式中,對位記號為兩相鄰的突起結構,兩突起結構間具有間隙,對位記號的中心線通過間隙。 In one or more embodiments of the present disclosure, the alignment mark is two adjacent protrusion structures, and there is a gap between the two protrusion structures, and the center line of the alignment mark passes through the gap.
於本揭示的一或多個實施方式中,對位記號為內凹結構,其由外緣線內縮於外環部。 In one or more embodiments of the present disclosure, the alignment mark is a concave structure, which shrinks from the outer edge line to the outer ring portion.
於本揭示的一或多個實施方式中,其中兩該對位記號重疊於一相同交界線,且所述兩對位記號位於本體的相對兩側。 In one or more embodiments of the present disclosure, two of the alignment marks overlap on the same boundary line, and the two alignment marks are located on opposite sides of the body.
於本揭示的一或多個實施方式中,對位記號相對於基板的高度小於本體相對於基板的高度。 In one or more embodiments of the present disclosure, the height of the alignment mark relative to the substrate is smaller than the height of the body relative to the substrate.
於本揭示的一或多個實施方式中,最外側的凹杯結構至少具有邊界線,其對齊備位記號。 In one or more embodiments of the present disclosure, the outermost concave cup structure has at least a boundary line, which is aligned with the reserve mark.
於本揭示的一或多個實施方式中,備位記號的結構與對位記號的結構相同。 In one or more embodiments of the present disclosure, the structure of the spare mark is the same as the structure of the counter mark.
綜上所述,本揭示的料帶結構直接於塑料層上形成對位記號,有效地提高對位記號對齊相鄰凹杯/固晶段之間的交界的精準度。 In summary, the strip structure of the present disclosure directly forms alignment marks on the plastic layer, which effectively improves the accuracy of alignment of alignment marks between adjacent concave cups/solid crystal segments.
100、300、400、500‧‧‧料帶結構 100, 300, 400, 500 ‧‧‧ strip structure
110‧‧‧基板 110‧‧‧ substrate
120、320、420、520‧‧‧塑料層 120, 320, 420, 520 ‧‧‧ plastic layer
130‧‧‧本體 130‧‧‧Body
131‧‧‧凹杯結構 131‧‧‧Concave cup structure
132、133‧‧‧交界線 132, 133‧‧‧ boundary line
134、135‧‧‧邊界線 134, 135‧‧‧ boundary
140、340、440‧‧‧外環部 140, 340, 440‧‧‧ Outer Ring Department
141、341、441‧‧‧對位記號 141, 341, 441‧‧‧ alignment mark
142‧‧‧外緣線 142‧‧‧Outer line
143‧‧‧備位記號 143‧‧‧ reserve mark
341a、341b‧‧‧突起結構 341a, 341b ‧‧‧ protruding structure
341c‧‧‧間隙 341c‧‧‧Gap
530‧‧‧固晶區 530‧‧‧Solid crystal area
531‧‧‧固晶段 531‧‧‧Solid crystal section
CL‧‧‧中心線 CL‧‧‧Centerline
H1、H2‧‧‧高度 H1, H2‧‧‧ Height
X1‧‧‧第一方向 X1‧‧‧First direction
X2‧‧‧第二方向 X2‧‧‧Second direction
為使本揭示之上述及其他目的、特徵、優點與實施方式能更明顯易懂,所附圖式之說明如下:第1圖為繪示依據本揭示一實施方式之料帶結構的俯視圖。 In order to make the above and other objects, features, advantages and embodiments of the present disclosure more obvious and understandable, the drawings are described as follows: FIG. 1 is a top view illustrating a tape structure according to an embodiment of the present disclosure.
第2圖為繪示第1圖所示之料帶結構沿線段N-N’的局部放大剖視圖。 FIG. 2 is a partially enlarged cross-sectional view illustrating the tape structure shown in FIG. 1 along line N-N'.
第3圖為繪示依據本揭示另一實施方式之料帶結構的局部放大俯視圖。 FIG. 3 is a partially enlarged plan view showing a tape structure according to another embodiment of the present disclosure.
第4圖為繪示依據本揭示另一實施方式之料帶結構的局部放大俯視圖。 FIG. 4 is a partially enlarged plan view showing a tape structure according to another embodiment of the present disclosure.
第5圖為繪示依據本揭示另一實施方式之料帶結構的俯視圖。 FIG. 5 is a top view showing a tape structure according to another embodiment of the present disclosure.
第6圖為繪示第5圖所示之料帶結構沿線段M-M’的局部放大剖視圖。 Fig. 6 is a partially enlarged cross-sectional view illustrating the tape structure shown in Fig. 5 along line M-M'.
為使本揭示之敘述更加詳盡與完備,可參照所附之圖式及以下所述各種實施方式。圖式中之各元件未按比例繪製,且僅為說明本揭示而提供。以下描述許多實務上之細節,以提供對本揭示的全面理解,然而,相關領域具普通技術者應當理解可在沒有一或多個實務上之細節的情況下實施本揭示,因此,該些細節不應用以限定本揭示。 For a more detailed and complete description of the present disclosure, reference may be made to the accompanying drawings and various embodiments described below. The elements in the drawings are not drawn to scale and are provided only to illustrate the present disclosure. Many practical details are described below to provide a comprehensive understanding of this disclosure. However, those of ordinary skill in the relevant arts should understand that this disclosure can be implemented without one or more practical details. Therefore, these details are not Apply to limit this disclosure.
請參照第1圖,其為繪示依據本揭示一實施方式之料帶結構100的俯視圖。於本實施方式中,料帶結構100為發光二極體料帶結構,其用以承載發光二極體晶片(圖未示)。料帶結構100包含基板110以及設置於基板110上的塑料層120。於一些實施方式中,基板110為金屬基板或陶瓷基板,塑料層120以模塑成型(molding)的方式形成於基板110上。
Please refer to FIG. 1, which is a top view illustrating a
如第1圖所示,塑料層120包含本體130以及環繞連接本體130的外環部140。本體130具有上下貫穿的複數個凹杯結構131(亦可參閱第2圖),其配置以供發光二極體晶片設置。於本實施方式中,凹杯結構131以矩陣形式排列,並且每一凹杯結構131實質上佔據一矩形區域。具體而言,凹杯結構131沿第一方向X1排列為複數個直排,並且沿垂直於第一方向X1的第二方向X2排列為複數個橫排。兩相鄰直排的凹杯結構131之間具有沿第一方向X1延伸的交界線132,而兩相鄰橫排的凹杯結構131之間具有沿第二方向X2延伸的交界線133。交界線132、133為預定的切割線,於圖中以虛線表示。另外,位於最左/右側直排的凹杯結構131的左/右側具有沿第一方向X1延伸的邊界線134,而位於最上/下方橫排的凹杯結構131的上/下側具有沿第二方向X2延伸的邊界線135。本揭示不限於上述的凹杯結構131排列方式。
As shown in FIG. 1, the
如第1圖所示,外環部140具有複數個對位記號141,其沿著外環部140的外緣線142設置。對位記號141的中心線CL對齊交界線132、133,且位於本體130相對兩側(亦即,上下兩側或左右兩側)的兩對位記號141重疊於同一交界線
132、133。具體而言,於本實施方式中,對位記號141為對稱的突起結構,其由外環部140突出於外緣線142。設置於本體130上下兩側的對位記號141平行於交界線132延伸(換言之,垂直於交界線133延伸),且其中心線CL對齊交界線132。設置於本體130左右兩側的對位記號141平行於交界線133延伸(換言之,垂直於交界線132延伸),且其中心線CL對齊交界線133。對料帶結構100進行切割時,對位記號141可協助對準相鄰凹杯結構131之間的交界線132、133,以平均地將相鄰凹杯結構131切割分離。
As shown in FIG. 1, the
近來發光二極體封裝尺寸的縮小,使得凹杯結構131的側壁逐漸變薄,若切割時稍有偏差可能損壞凹杯結構131。本揭示改進現有的料帶結構將對位記號設置於基板上的做法,將對位記號141與凹杯結構131於成型塑料層120的製程中同時形成,因此能更精準地對齊凹杯結構131之間的交界線132、132。
The recent reduction in the size of the light emitting diode package has caused the side walls of the
需說明的的是,儘管於第1圖中每一交界線132、133均有對應的對位記號141,但本揭示不以此為限。於另一些實施方式中,僅部分交界線132、133具有對應的對位記號141,切割機器配置以在對齊特定對位記號141並進行切割後,平移固定距離以進行下一次切割。
It should be noted that although each
如第1圖所示,於一些實施方式中,外環部140還具有對齊最外側的凹杯結構131之邊界線134、135的複數個備位記號143。備位記號143為對稱的突起結構,其由外緣線142突出於外環部140,並且平行於邊界線134或邊界線135延伸。
備位記號143的中心線CL對齊邊界線134、135,以協助準確地切除外環部140。於本實施方式中,備位記號143與對位記號141的結構相同,但本揭示不以此為限。
As shown in FIG. 1, in some embodiments, the
請參照第2圖,其為繪示第1圖所示之料帶結構100沿線段N-N’的局部放大剖視圖。於一些實施方式中,在垂直於基板110的方向上,對位記號141相對於基板110的高度H1小於本體130相對於基板110的高度H2。由於對位記號141位於塑料層120最外圍的部分,將對位記號141的高度設計的較低使得用以形成塑料層120的模具在外圍部分高度較低,因此於模具內注入塑料時較容易將模具填滿,從而能形成位置準確且清楚的對位記號141。於一些實施方式中,不僅是對位記號141的高度,外環部140整體高度皆為小於本體高度H2的高度H1,但本揭示不以此為限。
Please refer to FIG. 2, which is a partially enlarged cross-sectional view illustrating the
請參照第3圖,其為繪示依據本揭示另一實施方式之料帶結構300的局部放大俯視圖。料帶結構300包含基板110以及設置於基板110上的塑料層320,而塑料層320包含本體130以及環繞連接本體130的外環部340,其中基板110以及本體130的結構與第1圖所示的實施方式相同,因此可參照前文相關描述,在此不贅述。本實施方式與第1圖所示的實施方式的差異處,在於料帶結構300的外環部340具有結構與對位記號141相異的對位記號341。具體而言,對位記號341包含兩相鄰但彼此分離的突起結構341a、341b。突起結構341a、341b由外緣線142突出於外環部340,且兩者間具有間隙341c,對位記號341的中心線CL通過間隙341c,並且對稱地
劃分間隙341c。對料帶結構300進行切割時,突起結構341a、341b之間的間隙341c可協助對齊交界線132切割,以將交界線132兩側的凹杯結構131分離。於一些實施方式中,備位記號(未示於第3圖中)亦由兩相鄰但彼此分離的突起結構組成。
Please refer to FIG. 3, which is a partially enlarged plan view illustrating a
請參照第4圖,其為繪示依據本揭示另一實施方式之料帶結構400的局部放大俯視圖。料帶結構400包含基板110以及設置於基板110上的塑料層420,而塑料層420包含本體130以及環繞連接本體130的外環部440,其中基板110以及本體130的結構與第1圖所示的實施方式相同,因此可參照前文相關描述,在此不贅述。本實施方式與第1圖所示的實施方式的差異處,在於料帶結構400的外環部440具有結構與對位記號141相異的對位記號441。具體而言,對位記號441為對稱的內凹結構,其由外緣線142內縮於外環部440。對位記號441平行於交界線132延伸,且其中心線CL對齊交界線132。於一些實施方式中,備位記號(未示於第4圖中)亦為內凹結構。
Please refer to FIG. 4, which is a partially enlarged plan view illustrating a
需說明的是,對位記號的外型不限於第1圖至第4圖所示的實施方式,只要對位記號設置於塑料層,從而能與凹杯結構於同一道製程中形成,對位記號可具有任何合適的外型。 It should be noted that the appearance of the alignment mark is not limited to the embodiments shown in FIGS. 1 to 4, as long as the alignment mark is provided on the plastic layer, it can be formed in the same process as the concave cup structure. The indicia can have any suitable appearance.
請參照第5圖以及第6圖。第5圖為繪示依據本揭示另一實施方式之料帶結構500的俯視圖,而第6圖為繪示第5圖所示之料帶結構500沿線段M-M’的局部放大剖視圖。如第5
圖所示,料帶結構500包含基板110以及設置於基板110上的塑料層520,其中塑料層520具有固晶區530以及外環部140。外環部140環繞固晶區530,並且相對於固晶區530高起(如第6圖所示)。
Please refer to Figure 5 and Figure 6. FIG. 5 is a top view showing a
如第5圖所示,固晶區530具有以矩陣形式排列的複數個固晶段531,固晶段531係配置以供發光二極體晶片(圖未示)設置。相鄰的固晶段531之間具有沿第一方向X1延伸的交界線132或是沿第二方向X2延伸的交界線133。外環部140具有複數個對位記號141,對位記號141由外環部140突出於外緣線142,並且其中心線CL對齊交界線132、133。於一些實施方式中,外環部140還具有複數個備位記號143,備位記號143的中心線CL對齊最外側的固晶段531之邊界線134、135。
As shown in FIG. 5, the
需說明的是,本實施方式的塑料層520的外環部140與第1圖所示之實施方式實質上相同,故前段僅針對其主要特徵做描述,其他細節可參考前文中相關敘述。另外,亦可以對位記號341或對位記號441或其他合適外型的對位記號來取代料帶結構500的對位記號141。
It should be noted that the
綜上所述,本揭示的料帶結構直接於塑料層上形成對位記號,有效地提高對位記號對齊相鄰凹杯/固晶段之間的交界的精準度。 In summary, the strip structure of the present disclosure directly forms alignment marks on the plastic layer, which effectively improves the accuracy of alignment of alignment marks between adjacent concave cups/solid crystal segments.
儘管本揭示已以實施方式揭露如上,然其並非用以限定本揭示,任何熟習此技藝者,於不脫離本揭示之精神及範圍內,當可作各種之更動與潤飾,因此本揭示之保護範圍當視後附之申請專利範圍所界定者為準。 Although this disclosure has been disclosed as above by way of implementation, it is not intended to limit this disclosure. Anyone who is familiar with this skill can make various changes and modifications within the spirit and scope of this disclosure, so the protection of this disclosure is protected The scope shall be as defined in the appended patent application scope.
100‧‧‧料帶結構 100‧‧‧material structure
110‧‧‧基板 110‧‧‧ substrate
120‧‧‧塑料層 120‧‧‧Plastic layer
130‧‧‧本體 130‧‧‧Body
131‧‧‧凹杯結構 131‧‧‧Concave cup structure
132、133‧‧‧交界線 132, 133‧‧‧ boundary line
134、135‧‧‧邊界線 134, 135‧‧‧ boundary
140‧‧‧外環部 140‧‧‧Outer Ring Department
141‧‧‧對位記號 141‧‧‧ alignment mark
142‧‧‧外緣線 142‧‧‧Outer line
143‧‧‧備位記號 143‧‧‧ reserve mark
CL‧‧‧中心線 CL‧‧‧Centerline
X1‧‧‧第一方向 X1‧‧‧First direction
X2‧‧‧第二方向 X2‧‧‧Second direction
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108109403A TWI688123B (en) | 2019-03-19 | 2019-03-19 | Strip structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108109403A TWI688123B (en) | 2019-03-19 | 2019-03-19 | Strip structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI688123B true TWI688123B (en) | 2020-03-11 |
| TW202036934A TW202036934A (en) | 2020-10-01 |
Family
ID=70766880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108109403A TWI688123B (en) | 2019-03-19 | 2019-03-19 | Strip structure |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI688123B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111933776B (en) * | 2020-07-29 | 2022-06-28 | 佛山市国星光电股份有限公司 | A bracket array, a single bracket, a device array and a light-emitting device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201842219U (en) * | 2010-10-27 | 2011-05-25 | 威海中复西港船艇有限公司 | Marker buoy for ship's navigation |
| TWM441223U (en) * | 2012-07-18 | 2012-11-11 | Single Well Ind Corp | Led plastic stand for preventing warpage of a base structure |
| TWM486149U (en) * | 2014-04-28 | 2014-09-11 | Tato Prec Ind Co Ltd | Array type thermosetting LED rack structure |
| TW201447168A (en) * | 2013-06-05 | 2014-12-16 | I Chiun Precision Ind Co Ltd | LED strip structure with ceramic substrate and manufacturing method thereof |
| TWM520195U (en) * | 2015-08-13 | 2016-04-11 | Xial Technology Co Ltd | Substrate with independent reflection cup |
-
2019
- 2019-03-19 TW TW108109403A patent/TWI688123B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201842219U (en) * | 2010-10-27 | 2011-05-25 | 威海中复西港船艇有限公司 | Marker buoy for ship's navigation |
| TWM441223U (en) * | 2012-07-18 | 2012-11-11 | Single Well Ind Corp | Led plastic stand for preventing warpage of a base structure |
| TW201447168A (en) * | 2013-06-05 | 2014-12-16 | I Chiun Precision Ind Co Ltd | LED strip structure with ceramic substrate and manufacturing method thereof |
| TWM486149U (en) * | 2014-04-28 | 2014-09-11 | Tato Prec Ind Co Ltd | Array type thermosetting LED rack structure |
| TWM520195U (en) * | 2015-08-13 | 2016-04-11 | Xial Technology Co Ltd | Substrate with independent reflection cup |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202036934A (en) | 2020-10-01 |
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