TWI865218B - Substrate structure - Google Patents

Abstract

The present invention discloses an substrate structure. The substrate structure comprises a substrate body, a plurality of packaging areas, a plurality of first cutting trails, a plurality of second cutting trails being staggered with those first cutting trails, a plurality of third cutting trails intersecting those first and second cutting trails and together define jointly the plurality of packaging areas, at least one first mark located on at least one of the first cutting trails, and at least one second mark located on at least one of the second cutting trails and with a different look to the first mark. By the implementation of the present invention, it can easily be determined whether the substrate structure is placed on an equipment with a correct orientation, and the area of the substrate structure surface can be used efficiently without the waste caused by the present of the identification marks.

Description

Substrate structure

The present invention relates to a substrate structure, in particular to a substrate structure with markings for direction identification.

As various smart mobile communication devices become more popular and penetrate into the lives of the general public, these consumer electronic products not only have higher and higher requirements for performance, but also increasingly stringent requirements for portability and manufacturing costs. To improve performance, it is necessary to improve the core semiconductor components, such as the computing power of the central processing unit and the capacity of the memory chip, as well as the processing speed of all these components. To improve the computing power and memory capacity of semiconductor components, the number of components must be increased. On the other hand, to improve portability, these components must be made thinner and smaller. Coupled with the requirement to reduce manufacturing costs, the combination of the above requirements means that the density of semiconductor components/assemblies in the finished product should be increased as much as possible. This means that when these semiconductor elements or components are placed on a package substrate, for example, the unused area on the surface of the package substrate must be reduced as much as possible, preferably leaving only the minimum space between chips that is just enough for cutting in the subsequent singulation process.

On the other hand, since each pin or contact of these semiconductor components with high-density components has different functions, these components are directional. This requires that the orientation of the package substrate must be correctly identified and confirmed in many stages of the process, especially when the entire package substrate is just loaded onto an automated machine, so that the correct process steps can be performed in the correct direction and at the correct positions, such as at different contacts or pins. Therefore, in the semiconductor package process currently used in the industry, identification marks are set on the package substrate so that the machine can identify the orientation of the package substrate through these identification marks. However, once an identification mark is set on the substrate surface, it is impossible to set a chip at the location of the identification mark, or even along the entire substrate surface that is at least as wide as the mark in the longitudinal and lateral directions, otherwise the identification marks will be blocked by the chip and cannot be identified. This makes it impossible to effectively use the area of the substrate surface, and increases the manufacturing cost required to be distributed for individual semiconductor components.

Therefore, how to overcome the above-mentioned problems of known technology has become a difficult problem that the industry needs to overcome urgently.

In view of the above-mentioned deficiencies of the prior art, the present invention provides a substrate structure, comprising: a substrate body; a plurality of packaging regions, which are defined on a surface of the substrate body; a plurality of first cutting paths formed on the substrate body; a plurality of second cutting paths formed on the substrate body, which are parallel to the plurality of first cutting paths and arranged at intervals with the plurality of first cutting paths; a plurality of third cutting paths formed on the substrate body, which are parallel to the plurality of first cutting paths. The first cutting road and the plurality of second cutting roads intersect and jointly divide the at least one packaging area; at least one first mark formed on the substrate body is located at a corner of at least one of the first cutting roads adjacent to one of the packaging areas; and at least one second mark formed on the substrate body is located at another corner of at least one of the second cutting roads adjacent to each of the packaging areas, and the at least one second mark is different in appearance from the at least one first mark.

The aforementioned substrate structure, wherein the first cutting paths are arranged in odd rows, and the second cutting paths are arranged in even rows, or the plurality of first cutting paths and the plurality of second cutting paths are arranged in reverse order.

The aforementioned substrate structure, wherein each of the first marks is in the shape of a cross.

The aforementioned substrate structure, wherein each of the second marks is composed of four straight lines, and the straight lines are arranged in pairs along the second cutting path and the third cutting path.

The aforementioned substrate structure, wherein the at least one first mark and the at least one second mark are respectively located at diagonal positions of each packaging area.

The aforementioned substrate structure, wherein one of the at least one first mark and the at least one second mark is a triangle mark, and the other is a square mark.

The aforementioned substrate structure, wherein the width of each first cutting line is different from the width of each second cutting line.

The aforementioned substrate structure further comprises: at least one third mark formed on the substrate body, which is located on the other surface of the substrate body corresponding to at least one of the first cutting paths and adjacent to a corner of the packaging area; and at least one fourth mark formed on the substrate body, which is located on the other surface of the substrate body corresponding to at least one of the second cutting paths and adjacent to another corner of the packaging area, and the at least one fourth mark is different in appearance from the at least one third mark; wherein at least one of the third mark and the fourth mark is different in appearance from the at least one first mark and the at least one second mark.

As can be seen from the above, the substrate structure of the present invention is mainly to set the first mark and the second mark with different appearances on the first cutting road and the second cutting road on the surface of the substrate body, and/or set the third mark and the fourth mark with different appearances on the other surface of the substrate body, and to identify whether the placement direction of the substrate structure is correct by the relative position or arrangement of these first mark, the second mark and/or the third mark and the fourth mark, so as to avoid the risk of incorrect process execution and product failure caused by incorrect placement direction. At the same time, because these marks are set on the cutting road, there is no need to reserve a dedicated space for them on the surface of the substrate body, so the utilization rate of the surface of the substrate body can be greatly improved, thereby reducing the manufacturing cost.

1: Substrate structure

10: Substrate body

11: Packaging area

12: First cutting path

121: First Mark

122: The third sign

13: Second cutting path

131: Second mark

132: The fourth sign

14: The third cutting path

Figures 1 to 4 are partial top views of different variations of the substrate structure of the present invention.

Figure 5 is a top view schematic diagram of a variation of one embodiment of the substrate structure of the present invention.

Figure 6 is a partial top view schematic diagram of another variation of the substrate structure embodiment of the present invention.

The following is a specific and concrete example to illustrate the implementation of the present invention. People familiar with this technology can easily understand other advantages and effects of the present invention from the content disclosed in this manual.

It should be noted that the structures, proportions, sizes, etc. depicted in the drawings attached to this manual are only used to match the contents disclosed in the manual for people familiar with this technology to understand and read, and are not used to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modification of the structure, change of the proportion relationship or adjustment of the size should still fall within the scope of the technical content disclosed by the present invention without affecting the effect and purpose that can be achieved by the present invention. At the same time, the terms such as "upper", "lower", "one", "first" and "second" used in this specification are only for the convenience of description, and are not used to limit the scope of implementation of the present invention. Changes or adjustments to their relative relationships, without substantial changes to the technical content, should also be regarded as the scope of implementation of the present invention.

FIG1 is a partial top view schematic diagram of an embodiment of the substrate structure of the present invention. As shown in FIG1, the present embodiment provides a substrate structure 1, which includes: a substrate body 10; a plurality of packaging areas 11; a plurality of first cutting lanes 12; a plurality of second cutting lanes 13; a plurality of third cutting lanes 14, which together with the first cutting lanes 12 and the second cutting lanes 13 divide the plurality of packaging areas 11; a first mark 121, which is located on one of the first cutting lanes 12; and a second mark 131, which is located on one of the second cutting lanes 13, and the second mark 131 is different in appearance from the first mark 121.

The substrate body 10 shown in the present embodiment may be a package substrate with a circuit structure having a core layer or a circuit structure without a core layer (coreless) for carrying a semiconductor chip (not shown). In terms of the current mainstream semiconductor component structure, the substrate body 10 usually includes at least one dielectric layer (not shown) and a circuit layer (not shown) bonded to the dielectric layer, such as a circuit layer formed in the form of a circuit redistribution layer (RDL). The material used to form the dielectric layer may be, for example, a dielectric material such as polybenzoxazole (PBO), polyimide (PI), prepreg, etc. It should be understood that the substrate body 10 can also be other objects capable of carrying semiconductor chips, such as lead frames, wafers, silicon interposers, etc., but is not limited to the above.

A plurality of packaging areas 11 are defined on one surface of the substrate body 10. In the embodiment shown in FIG. 1 , the surface of the substrate body 10 shown therein includes a plurality of packaging areas 11. Each packaging area 11 can be used to set a semiconductor chip (not shown) and package it on the surface of the area.

As shown in FIG. 1 , a plurality of first cutting lanes 12, a plurality of second cutting lanes 13, and a plurality of third cutting lanes 14 are defined on the substrate body 10. The first cutting lanes 12 and the second cutting lanes 13 are parallel to each other and arranged alternately. The third cutting lanes 14 intersect with the first cutting lanes 12 and the second cutting lanes 13, and the three together divide the packaging areas 11. The first cutting lanes 12, the second cutting lanes 13, and the third cutting lanes 14 are the paths to be cut when performing the singulation process in the future. Since the packaging areas 11 are divided by these cutting lanes, after the cutting is completed along these cutting lanes, the packaging areas 11 can be separated into separate objects.

The first cutting lanes 12 and the second cutting lanes 13 are parallel to each other and arranged alternately. In one embodiment, the arrangement order is calculated from the left side of the substrate body 10, and the cutting lanes located in each odd-numbered row are defined as the first cutting lanes 12, and the cutting lanes located in each even-numbered row are defined as the second cutting lanes 13. However, this is only an arrangement order defined for the purpose of following a basis for subsequent identification. Therefore, other embodiments may also define the cutting lanes located in each even-numbered row as the first cutting lanes 12 in the opposite order, and define the cutting lanes located in each odd-numbered row as the second cutting lanes 13, or even define the starting point of the arrangement from the other end of the substrate body 10. The present invention has no special restrictions on this, but all machines used in the process must be set up according to the same definition principle before the process starts, so that there will be no confusion and errors between different process stages.

As shown in FIG1 , a first mark 121 is provided at a corner adjacent to each packaging area 11 on each first cutting lane 12. A second mark 131 is provided at another corner adjacent to each packaging area 11 on each second cutting lane 13, and the second mark 131 is different from the first mark 121 in appearance. It should be understood that the so-called difference in appearance may be a difference in shape, or a difference in color, or a combination of shape and color, and this embodiment has no limitation on this.

As shown in FIG. 1 , each first mark 121 in this embodiment is a cross-shaped mark. Each second mark 131 in this embodiment is composed of four straight-line patterns, and these straight-line patterns are arranged in pairs along the second cutting path 13 and the third cutting path 14, so that a cross-shaped pattern is also formed at the intersection of each second cutting path 13 and the third cutting path 14.

The following is an example of the embodiment shown in FIG. 1: Assuming that the direction shown in the figure is the correct placement direction of the substrate structure 1 in each process, it is easy to understand that if the substrate structure 1 is rotated 90 degrees clockwise and placed incorrectly on the machine, the first marks 121 set along each individual first cutting lane 12 will change from the vertical arrangement shown in FIG. 1 to the horizontal arrangement. The same is true for each second mark 131. Moreover, after rotating 90 degrees clockwise, the first cutting lane 12 originally in the first row on the left side and the first marks 121 set thereon will become the first row on the top side.

On the contrary, if the substrate structure 1 shown in FIG. 1 is rotated 90 degrees counterclockwise and placed incorrectly, although the first marks 121 on each first cutting lane 12 and the second marks 131 on each second cutting lane 13 will also be arranged horizontally, the first cutting lane 12 and the first marks 121 arranged thereon, which were originally in the first row on the left side, will become the first row near the bottom side.

There is another situation of incorrect placement: when the substrate structure 1 in this embodiment is rotated 180 degrees and placed incorrectly on the machine, the first marks 121 on each first cutting street 12 and the second marks 131 on each second cutting street 13 will still be arranged in the vertical direction, but the first cutting street 12 and the first marks 121 thereon originally located in the first row on the left side will become located in the first row on the right side. That is, the relative position between the first cutting street 12 and the first marks 121 thereon and the second cutting street 13 and the second marks 131 thereon will be opposite to when the substrate structure 1 is placed correctly.

Through the above analysis results of various incorrect placement conditions, whether it is an operator or an automated machine device, it can easily determine whether the substrate structure 1 provided in this embodiment has been placed in the correct direction by observing the arrangement direction and relative position of the first marks 121 and the second marks 131 on the substrate structure 1. When an incorrect placement occurs, it can also be easily determined what kind of error condition it is and how much angle it deviates from the correct placement direction, and thus it can be easily corrected.

FIG2 is a partial top view of a variation of an embodiment of the present invention. As shown in FIG2, in this embodiment, each first mark 121 is a square mark, and each second mark 131 is a triangle mark. Of course, it is also possible to swap the shapes of the two, as long as they are clearly defined before the process starts.

In addition, in order to make the judgment easier, in addition to setting the first mark 121 on the first cutting road 12 and the second mark 131 on the second cutting road 13 to different appearances, the width of each first cutting road 12 can be set to be different from the width of each second cutting road 13. For example, as shown in Figure 3, the first cutting road 12 is set wider than the second cutting road 13. In this way, in addition to observing the difference in appearance and/or arrangement and relative position of the first mark 121 and the second mark 131 to judge the placement direction of the substrate structure 1, the observation of the difference in width between the first cutting road 12 and the second cutting road 13 can be added as a judgment condition, which can make the judgment easier.

FIG4 is a partial top view schematic diagram of another variation of the embodiment of the substrate structure 1 of the present invention. In this embodiment, the first mark 121 and the second mark 131 are respectively located at two diagonal positions of the packaging area 11. Since such a setting further increases the asymmetry of the arrangement, it can also achieve the effect of increasing the conditions for judgment and making the judgment easier.

FIG5 is a top view schematic diagram of another variation of the embodiment of the substrate structure 1 of the present invention. In this embodiment, the first mark 121 is only set at the intersection of the first first cutting path 12 near the left side and the first third cutting path 14 near the top, and the second mark 131 is only set at the intersection of the second cutting path 13 at the rightmost side of the substrate body 10 and the third cutting path 14 at the bottom. That is, only one first mark 121 and one second mark 131 are set on the surface of the substrate body 10. Such a configuration can achieve the same recognition effect with the least number of first marks 121 and second marks 131.

Please refer to FIG. 1 and FIG. 6 at the same time. In addition to the above-mentioned state of forming the first mark 121 and the second mark 131 only on one surface of the substrate body 10, the substrate structure 1 of the present invention may further include: at least one third mark 122 and at least one fourth mark 132 formed on the other surface of the substrate body 10. Assuming that the first mark 121 and the second mark 131 are formed on one surface of the substrate body 10 as shown in FIG. 1, as shown in FIG. 6, the third mark 122 may be formed on the other surface of the substrate body 10 corresponding to the corner of the at least one first cutting path 12 adjacent to the packaging area 11; and the fourth mark 132 may be formed on the other surface of the substrate body 10 corresponding to the at least one second cutting path 13 adjacent to another corner of the packaging area 11. Since the substrate body 10 is completely cut off during cutting, the positions of the cutting lines and the packaging area 11 on the two surfaces of the substrate body 10 must completely correspond to each other. Only the arrangement order of the first cutting line 12 and the second cutting line 13 will appear to be opposite on the two opposite surfaces.

As shown in FIG. 1 and FIG. 6 , the fourth mark 132 is different in appearance from the third mark 122, and at least one of the third mark 122 and the fourth mark 132 is different in appearance from the first mark 121 and the second mark 131 located on the other side. In this embodiment, the appearance of the fourth mark 132 in FIG. 6 is different from the first mark 121 and the second mark 131 in FIG. 1 , but the third mark 122 is the same in appearance as the first mark 121 shown in FIG. 1 . Nevertheless, since the pattern combinations of the marks on the two sides of the substrate body 10 are different, the two different surfaces of the substrate body 10 can still be distinguished, and no matter which surface is observed, the direction of the substrate body 10 can be identified by the combination of the first mark 121 and the second mark 131 or the combination of the third mark 122 and the fourth mark 132 on the surface.

In summary, the present invention is mainly to respectively set a first mark 121 and a second mark 131 with different appearances on the first cutting road 12 and the second cutting road 13 on the surface of the substrate body 10, and/or set a third mark 122 and a fourth mark 132 on another surface, and to identify whether the placement direction of the substrate structure 1 is correct by the difference in appearance and relative position or arrangement of these first marks 121 and the second marks 131 and/or the third marks 122 and the fourth marks 132, so as to avoid the risk of incorrect process execution and product failure due to incorrect placement direction. At the same time, because these marks are set on the cutting road, there is no need to reserve a dedicated space for them on the surface of the substrate body 10, so the utilization rate of the surface of the substrate body 10 can be greatly improved, thereby reducing the manufacturing cost.

The above embodiments are used to illustrate the principles and effects of the present invention, but are not used to limit the present invention. Anyone familiar with this technology can modify the above embodiments without violating the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as listed in the attached patent application scope.

1: Substrate structure

10: Substrate body

11: Packaging area

12: First cutting path

121: First Mark

13: Second cutting path

131: Second mark

14: The third cutting path

Claims (8)

A substrate structure includes: a substrate body; a plurality of packaging areas defined on a surface of the substrate body; a plurality of first cutting paths formed on the substrate body; a plurality of second cutting paths formed on the substrate body, which are parallel to the plurality of first cutting paths and arranged at intervals with the plurality of first cutting paths; a plurality of third cutting paths formed on the substrate body, which intersect with the plurality of first cutting paths and the plurality of second cutting paths and jointly divide the plurality of packaging areas; at least one first mark formed on the substrate body, which is located at a corner adjacent to one of the packaging areas on at least one of the first cutting paths; and at least one second mark formed on the substrate body, which is located at another corner adjacent to one of the packaging areas on at least one of the second cutting paths, and the at least one second mark is different in appearance from the at least one first mark. The substrate structure as described in claim 1, wherein the plurality of first cutting paths are arranged in odd rows, and the plurality of second cutting paths are arranged in even rows, or the plurality of first cutting paths and the plurality of second cutting paths are arranged in reverse order. A substrate structure as described in claim 1, wherein the at least one first mark is in the shape of a cross. The substrate structure as described in claim 1, wherein the at least one second mark is composed of four straight lines, and the straight lines are arranged in pairs along the second cutting path and the third cutting path. The substrate structure as described in claim 1, wherein the at least one first mark and the at least one second mark are respectively located at diagonal positions of each packaging area. The substrate structure as described in claim 1, wherein one of the at least one first mark and the at least one second mark is a triangle mark and the other is a square mark. A substrate structure as described in claim 1, wherein the width of each first cutting line is different from the width of each second cutting line. The substrate structure as described in any one of claims 1 to 7 further comprises: at least one third mark formed on the substrate body, which is located on the other surface of the substrate body corresponding to at least one of the first cutting paths and adjacent to a corner of the packaging area; and at least one fourth mark formed on the substrate body, which is located on the other surface of the substrate body corresponding to at least one of the second cutting paths and adjacent to another corner of the packaging area, and the at least one fourth mark is different in appearance from the at least one third mark; wherein at least one of the third mark and the fourth mark is different in appearance from the at least one first mark and the at least one second mark.

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