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TWI561341B - Polishing pad with concentric or approximately concentric polygon groove pattern - Google Patents

Polishing pad with concentric or approximately concentric polygon groove pattern

Info

Publication number
TWI561341B
TWI561341B TW101102753A TW101102753A TWI561341B TW I561341 B TWI561341 B TW I561341B TW 101102753 A TW101102753 A TW 101102753A TW 101102753 A TW101102753 A TW 101102753A TW I561341 B TWI561341 B TW I561341B
Authority
TW
Taiwan
Prior art keywords
concentric
polishing pad
groove pattern
polygon groove
approximately
Prior art date
Application number
TW101102753A
Other languages
English (en)
Other versions
TW201235154A (en
Inventor
William C Allison
Diane Scott
Alexander William Simpson
Original Assignee
Nexplanar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nexplanar Corp filed Critical Nexplanar Corp
Publication of TW201235154A publication Critical patent/TW201235154A/zh
Application granted granted Critical
Publication of TWI561341B publication Critical patent/TWI561341B/zh

Links

Classifications

    • H10P52/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW101102753A 2011-01-26 2012-01-20 Polishing pad with concentric or approximately concentric polygon groove pattern TWI561341B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/014,630 US9211628B2 (en) 2011-01-26 2011-01-26 Polishing pad with concentric or approximately concentric polygon groove pattern

Publications (2)

Publication Number Publication Date
TW201235154A TW201235154A (en) 2012-09-01
TWI561341B true TWI561341B (en) 2016-12-11

Family

ID=45562465

Family Applications (3)

Application Number Title Priority Date Filing Date
TW105134598A TWI623380B (zh) 2011-01-26 2012-01-20 具有同心或趨近同心之多邊形溝槽圖案的拋光墊
TW101102753A TWI561341B (en) 2011-01-26 2012-01-20 Polishing pad with concentric or approximately concentric polygon groove pattern
TW104139487A TWI586487B (zh) 2011-01-26 2012-01-20 具有同心或趨近同心之多邊形溝槽圖案的拋光墊

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW105134598A TWI623380B (zh) 2011-01-26 2012-01-20 具有同心或趨近同心之多邊形溝槽圖案的拋光墊

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW104139487A TWI586487B (zh) 2011-01-26 2012-01-20 具有同心或趨近同心之多邊形溝槽圖案的拋光墊

Country Status (8)

Country Link
US (2) US9211628B2 (zh)
EP (1) EP2668004B1 (zh)
JP (3) JP2014508048A (zh)
KR (2) KR101777684B1 (zh)
CN (2) CN105619238B (zh)
SG (2) SG182934A1 (zh)
TW (3) TWI623380B (zh)
WO (1) WO2012102938A1 (zh)

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US9211628B2 (en) * 2011-01-26 2015-12-15 Nexplanar Corporation Polishing pad with concentric or approximately concentric polygon groove pattern
USD678745S1 (en) * 2011-07-07 2013-03-26 Phuong Van Nguyen Spinning insert polishing pad
JP5629749B2 (ja) * 2012-12-28 2014-11-26 東洋ゴム工業株式会社 研磨パッドの製造方法
JP5620465B2 (ja) * 2012-12-28 2014-11-05 東洋ゴム工業株式会社 円形状研磨パッド
US20150056895A1 (en) * 2013-08-22 2015-02-26 Cabot Microelectronics Corporation Ultra high void volume polishing pad with closed pore structure
TWI599447B (zh) * 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
CN103753382B (zh) * 2014-01-06 2016-04-27 成都时代立夫科技有限公司 一种抛光垫及其制备方法
JP6283940B2 (ja) * 2014-03-28 2018-02-28 富士紡ホールディングス株式会社 研磨パッド
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US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
TWI689406B (zh) * 2014-10-17 2020-04-01 美商應用材料股份有限公司 研磨墊及製造其之方法
CN113579992A (zh) 2014-10-17 2021-11-02 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
JP2018524193A (ja) * 2015-07-30 2018-08-30 ジェイエイチ ローデス カンパニー， インコーポレイテッド ポリマーラップ加工材料、ポリマーラップ加工材料を含む媒体およびシステム、およびそれらを形成し使用する方法
WO2017074773A1 (en) 2015-10-30 2017-05-04 Applied Materials, Inc. An apparatus and method of forming a polishing article that has a desired zeta potential
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10875146B2 (en) * 2016-03-24 2020-12-29 Rohm And Haas Electronic Materials Cmp Holdings Debris-removal groove for CMP polishing pad
CN109075054B (zh) * 2016-03-25 2023-06-09 应用材料公司 具有局部区域速率控制及振荡模式的研磨系统
WO2017165068A1 (en) * 2016-03-25 2017-09-28 Applied Materials, Inc. Local area polishing system and polishing pad assemblies for a polishing system
KR101799497B1 (ko) 2016-07-13 2017-11-20 주식회사 케이씨 화학 기계적 연마 장치
US10864612B2 (en) * 2016-12-14 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad and method of using
US10625393B2 (en) * 2017-06-08 2020-04-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pads having offset circumferential grooves for improved removal rate and polishing uniformity
US10861702B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Controlled residence CMP polishing method
US10586708B2 (en) 2017-06-14 2020-03-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Uniform CMP polishing method
US10857647B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings High-rate CMP polishing method
US10857648B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Trapezoidal CMP groove pattern
US10777418B2 (en) 2017-06-14 2020-09-15 Rohm And Haas Electronic Materials Cmp Holdings, I Biased pulse CMP groove pattern
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
JP7299970B2 (ja) 2018-09-04 2023-06-28 アプライド マテリアルズ インコーポレイテッド 改良型研磨パッドのための配合物
US10464188B1 (en) * 2018-11-06 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and polishing method
JP7710434B2 (ja) * 2019-07-12 2025-07-18 シーエムシー マテリアルズ リミティド ライアビリティ カンパニー ポリアミンおよびシクロヘキサンジメタノール硬化剤を使用した研磨パッド
KR102746090B1 (ko) 2020-03-13 2024-12-26 삼성전자주식회사 Cmp 패드 및 이를 구비하는 화학적 기계적 연마 장치
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN112959212B (zh) * 2021-03-22 2023-03-03 万华化学集团电子材料有限公司 一种带有优化沟槽的化学机械抛光垫及其应用

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TWI274631B (en) * 2005-08-31 2007-03-01 Iv Technologies Co Ltd Polishing pad and method of fabricating the same
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Also Published As

Publication number Publication date
TW201609312A (zh) 2016-03-16
TWI586487B (zh) 2017-06-11
KR20130110216A (ko) 2013-10-08
TW201235154A (en) 2012-09-01
JP2016165795A (ja) 2016-09-15
CN103429389B (zh) 2016-10-05
US20120190281A1 (en) 2012-07-26
SG10201404027TA (en) 2014-10-30
EP2668004B1 (en) 2021-03-24
TWI623380B (zh) 2018-05-11
JP6140749B2 (ja) 2017-05-31
JP2015155141A (ja) 2015-08-27
TW201707857A (zh) 2017-03-01
WO2012102938A1 (en) 2012-08-02
SG182934A1 (en) 2012-08-30
JP6359050B2 (ja) 2018-07-18
EP2668004A1 (en) 2013-12-04
CN105619238A (zh) 2016-06-01
CN103429389A (zh) 2013-12-04
KR101777684B1 (ko) 2017-09-13
CN105619238B (zh) 2018-12-14
JP2014508048A (ja) 2014-04-03
US20160023322A1 (en) 2016-01-28
KR20150122258A (ko) 2015-10-30
US9211628B2 (en) 2015-12-15

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