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TWI439351B - Adsorption tablets - Google Patents

Adsorption tablets Download PDF

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Publication number
TWI439351B
TWI439351B TW098131866A TW98131866A TWI439351B TW I439351 B TWI439351 B TW I439351B TW 098131866 A TW098131866 A TW 098131866A TW 98131866 A TW98131866 A TW 98131866A TW I439351 B TWI439351 B TW I439351B
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Taiwan
Prior art keywords
adsorption
sheet
hole
substrate
holes
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TW098131866A
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English (en)
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TW201012597A (en
Inventor
橘俊光
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日東電工股份有限公司
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Publication of TWI439351B publication Critical patent/TWI439351B/zh

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    • H10P72/78—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Description

吸附用片
本發明係關於一種吸附用片，其係安裝於將對象物真空吸附之吸附裝置。
從以往開始將金屬箔、塑膠膜、生胚片等薄且質輕之片體或膜進行加工之步驟等中，係使用真空吸附對象物之吸附裝置，而片體或膜則藉此吸附裝置固定或運送。此種吸附裝置中，為了保護對象物等，係於吸附面貼附有具有通氣性之多孔質片(參照例如專利文獻1)。
專利文獻1：日本專利特開2001-353788號公報
然而，當對象物為薄且質輕之片體或膜的情況時，真空吸附時多孔質片的表面形狀會轉印至對象物上，此轉印痕跡有時會對最終產品之性能或外觀造成不良影響。為了防止轉印痕跡，係考慮減小吸引量，並減低經抽真空造成之壓力差。然而，如此一來，以往之多孔質片因為比較厚(例如專利文獻1之實施例為2mm)，故空氣亦會從多孔質片的側面被吸入，而因其橫向滲漏的影響造成無法獲得充分之吸附力。
就解決此問題之方法而言，係考慮使用厚度薄之多孔質片以降低橫向之滲漏量。如此一來，即使減小吸引量亦可獲得充分之吸附力。然而，因為於吸附裝置之吸附面通常設有吸引用之凹溝，故若使用厚度較薄之多孔質片，則因為其剛性小所以多孔質片會因為吸引而被拉入凹溝內產生極大之變形。因此吸附面的凹溝邊緣會透過多孔質片強力地壓在對象物上，而於對象物留下吸附痕跡。
本發明有鑒於上述事情，目的係提供一種可抑制橫向之滲漏且不易在對象物上留下吸附痕跡之吸附用片。
為達成上述目的，本發明係提供一種吸附用片，其係安裝於真空吸附對象物之吸附裝置者，其具備基板與多孔質體，該基板係具有接觸於該吸附面之一側面，並設有複數個貫通孔；該多孔質體係貼附於該基板之另一側面以覆蓋該複數個貫通孔，且厚度為1.4mm以下。
上述構成因為多孔質體之厚度為1.4mm以下這樣薄，故可抑制空氣從多孔質體的側面被吸入，亦即可抑制橫向之滲漏。且因為此多孔質體係貼附於設有貫通孔之基板，故只要縮小貫通孔的大小，即可將因吸引造成多孔質體被拉入貫通孔內而發生變形之變形量減小，且可使得貫通孔邊緣不易壓在對象物上。因此，本發明可抑制橫向的滲漏且難以於對象物上留下吸附痕跡。
以下參照圖式詳細說明用以實施本發明之最佳形態。
圖1係表示本發明一實施形態之吸附片1安裝於吸附裝置4之吸附面4a之狀態。吸附裝置4係用以將對象物真空吸附並運送者，其係具備：圖1所示之吸附頭40、使吸附頭40升降之升降機構(未圖示)、使吸附頭40水平移動之移動機構(未圖示)、與藉由吸引路徑41連接於吸附頭40之真空泵(未圖式)。而吸附頭40之平行於水平面之下面係對象物所吸附之吸附面4a。其中，吸附用片1並不限於安裝在用以運送對象物之吸附裝置4，亦可廣泛地安裝在具有真空吸附功能之其他係附裝置(例如研磨裝置或切割裝置等加工裝置)。
於吸附面4a係設有吸引用凹溝42，而於此凹溝42之底面有吸引路徑41開口著。本實施形態中，凹溝42係如圖2A所示，係由從吸引路徑41向兩側延伸出之一條橫溝42a與從橫溝42a再向兩側延伸出之4條縱溝42b所構成。各溝42a、42b之寬度為例如10mm。其中，凹溝42之形狀並不限定於此，亦可適當地選擇。例如凹溝42亦可由十字狀的溝與將該十字狀溝包圍之框狀的溝所構成。或者，凹溝42例如亦可由矩陣狀配置於吸附面4a之複數個圓形之有底孔所構成。
吸附用片1係具有可將凹溝42覆蓋之大小(例如與吸附面4a相同大小或比其小一圈之大小)，並以例如雙面膠帶等固定於吸附面4a。此吸附用片1具有一側面(圖1中為上面)2a及另一側面(圖1中為下面)2b，並且具備基板2與多孔質體3，該基板2一側面2a接觸於吸附面4a，該多孔質體3貼附於基板2之另一側面2b。
基板2只要是具有適當剛性(例如剛性率(橫彈性係數)為1MPa~300GPa左右)者即可，並不限制其之材質。例如基板2可使用聚乙烯、聚丙烯、聚苯乙烯、聚碳酸酯、聚對苯甲酸乙二醇酯等所構成之塑膠板，或者不鏽鋼、鋁等所構成之金屬板、或矽膠、腈橡膠、乙烯丙烯橡膠、氨酯橡膠、天然橡膠等所構成之橡膠板。又，基板2之厚度方面，當為塑膠板或橡膠板時例如0.3~30mm，當為金屬板時例如0.2~20mm。
如圖2B所示，於基板2上，對應於凹溝42之位置係設有於板厚方向貫通該基板2之複數個貫通孔21。本實施形態中，雖僅在對應於凹溝42之位置上設有貫通孔21，但貫通孔21亦可規則地或隨機地設置成涵蓋基板2之全面。此情況時，未對應於凹溝42之位置的貫通孔21係僅被吸附面4a覆蓋。又，如本實施形態這樣僅在對應於凹溝42之位置形成貫通孔21的方式，從使加工效率或吸引時之吸附力穩定之觀點來看較佳。
貫通孔21較佳係設置成各個貫通孔21與最接近其之貫通孔21的中心間距離為90mm。本實施形態中，為了實現此設置，貫通孔21係以上述90mm以下之10mm間距來配置於所有的溝42a、42b的中心線上，而相鄰的貫通孔21的中心間距則全為10mm。又，將貫通孔21配置成矩陣狀的情況時，其縱橫向之間距只要為上述之90mm即可。各個貫通孔21與最接近其之貫通孔21的中心間距更佳為65mm以下。
貫通孔21較佳係以小於凹溝42之大小即平視時不會突出凹溝42之大小來設置。具體而言，由可將吸引時多孔質體3之變形抑制減少之觀點來看，各貫通孔21較佳為開口面積(垂直於軸方向之方向上的截面積)為64mm2 以下者(例如貫通孔21為正方形時，邊長為8mm以下，貫通孔21為圓形時直徑為約9mm以下)，且更佳為開口面積在30mm2 以下者。再者，各貫通孔21的大小方面，為了在即使吸附裝置4之吸引量減小時亦可使得通過貫通孔21之空氣流通順暢，而以直徑0.5mm以上之圓形為佳，直徑1.0mm以上之圓形更佳，最佳為直徑1.5mm以上之圓形。又，各貫通孔21的形狀可為從軸方向看去為矩形或橢圓形等，從加工性之觀點來看較佳為圓形。
多孔質體3係以覆蓋所有的貫通孔21的方式貼附於基板2之另一側面2b。此多孔質體3只要是多孔性片狀者即可，而其例可舉出：織布、不織布、施有穿孔加工之膜、塑膠粉體經燒結而成為多孔質化所成之燒結片體等。其中，由避免纖維等脫落造成異物附著於對象物之問題的觀點、以及可易於獲得孔均勻存在於整個面且面的整體可獲得均勻吸附力之觀點來看，使用塑膠粉體之燒結片體為佳。再者，在用途方面，因為與對象物之間會產生摩擦，故由耐磨耗性及耐衝擊性優異之觀點來看，使用平均分子量50萬以上之超高分子量聚乙烯粉體所製作而成之燒結片體為佳。
使用超高分子量聚乙烯粉體來製作燒結片體方面，可使用以下所示之方法。第一個方法是在將該粉體置於模具之狀態下進行燒結來製作出燒結塊，再將此燒結塊以車床加工加工成片狀之方法。第二個方法是在將該粉體整成既定厚度之狀態下進行燒結之方法。第三個方法是將該粉體分散於溶劑而成之所謂漿料以既定厚度塗佈於表面經脫模處理之金屬板上，並加熱至超高分子量聚乙烯之熔點以上以使其進行燒結之方法。
多孔質體3之厚度較佳為0.05mm以上且1.4mm以下。依製法之不同多孔質體3之彎曲彈性係數會不同，因此吸引時之變形程度會不同，而若厚度未滿0.05mm則易於引起多孔質體3之損傷等缺點，而若厚度超過1.4mm則從多孔質體3側面吸入空氣即所謂橫向之滲漏會變得明顯。較佳之多孔質體3厚度為0.05mm以上且1.0mm以下。
多孔質體3之透氣度係以弗拉吉魯(音譯)數來表示，較佳為0.1cm3 /cm2 /s以上300cm3 /cm2 /s以下。此處，所謂弗拉吉魯數係使用JIS L 1096所規定之弗拉吉魯試驗法所測得之數值。較佳之透氣度為0.5cm3 /cm2 /s以上且100cm3 /cm2 /s以下。
再者，基板2之貫通孔21的大小與多孔質體3之厚度之關係方面，在如上所述多孔質體3厚度為0.05~1.4mm範圍內此一條件下，當從軸方向看貫通孔21時，外切於貫通孔21輪廓之最小矩形框之邊長中最大者定為A，多孔質體3之厚度定為B時，係滿足B/A2 ≧0.015為佳。又，貫通孔21為圓形時，A便等於貫通孔21之直徑。若B/A2 未滿0.015則雖因多孔質體3的材質或構造有所不同，但仍有因吸引造成多孔質體3產生極大變形之虞。就較佳之B/A2 而言，在多孔質體3之厚度為0.05~1.4mm範圍內之條件下，為0.025以上，尤佳為0.025~0.040。
基板2與多孔質體3之接合方法，只要是貫通孔21與多孔質體3內部空隙不會被蓋住且可確保通過貫通孔21通氣之方法即不特別限定。可利用例如以熱進行熔融、以熱熔片進行熱熔融、以雙面膠或黏著劑進行接著等。當利用黏著劑時，即使於多孔質體3整面塗佈黏著劑，黏著劑係以多孔質的狀態形成局部不存在之部位而可確保通氣性。或者，使多孔質體3之大小成為突出於基板2之程度，並將其突出之部分彎折於基板2之角，再以膠帶或接著劑等將此固定於基板2之側面。
具有以上所說明之構成的黏著片1中，只要使用厚度為1.4mm以下這樣薄的多孔質體3，即可抑制從多孔質體3側面吸入空氣即橫向之滲漏。且因為此多孔質體3係貼附於設有貫通孔21之基板2，故只要減小貫通孔21的大小，即可抑制因吸引造成多孔質體3被拉入貫通孔21內而發生變形之變形量為較小，且可使得貫通孔21邊緣難以壓附於對象物。因此，可使得難以於對象物留下吸附痕跡。
實施例
以下舉出實施例詳細說明本發明，但本發明並不限定該等實施例。
(實施例)
將超高分子量聚乙烯粉末(分子量500萬、體積密度0.47g/cm3 、平均粒徑120μm)填充於內徑500mm、高500mm的模具，並將此置於金屬製耐壓容器，再將容器內減壓至10hPa。之後於容器內導入經加熱之水蒸氣，藉此於容器內進行160℃、6080hPa、5小時之加熱，再緩緩冷卻以獲得圓筒狀的燒結塊。將此燒結塊以車床切割成各種厚度以切出燒結片體，再將此每隔100mm切割一次。將此燒結片體以加壓機於130℃、30Pa加壓1小時，以製作0.025~1.0mm厚度之多孔質體。
又，針對各多孔質體，從體積與重量求出體積密度，再代入超高分子量聚乙烯之真密度0.935g/cm3 以{1-(體積密度/真密度)}×100之算式算出氣孔率。
準備厚度2mm、100mm見方之聚乙烯板或鋁板，於此以圖2B所示之方式穿設1.5~6.0mm直徑之圓形貫通孔，以製作出多種基板。於此基板貼附多孔質體以獲得吸附用片(實施例1~8)。
基板與多孔質體係使用以PET作為基材之使用之雙面膠帶(No.5606：日東電工公司製)來接合。雙面膠帶係貼於孔加工前之聚乙烯板或鋁板的整個面，再於該板雙面膠帶之上施以孔加工，以避免雙面膠帶造成貫通孔之覆蓋。
(比較例)
將從燒結塊切出之燒結片體的厚度改為較厚以外，係以與實施例相同的方式製作1.5mm的多孔質體。再以與實施例相同之方式將此貼附在設有直徑6.0mm之貫通孔的基板(聚乙烯板)上以獲得吸附用片。又，針對多孔質體以與實施例同樣的方式算出氣孔率。
(評價)
針對實施例1~8及比較例之吸附用片，從多孔質體之厚度B與基板之貫通孔直徑A算出B/A2 。
又，將各吸附用片安裝於具有運送功能之吸附裝置，並進行厚度10μm之鋁箔吸附試驗。吸附試驗係將吸引量定為10L/min，並在兩張桌子之間進行鋁箔的吸附、運送、此一連續動作的循環100次，並同時數算吸附不良的次數。又，觀察試驗後鋁箔的表面，以目視確認是否有留下吸附痕跡。
將各吸附用片的各性狀及B/A2 與試驗結果示於表1。
其中，表中之吸附痕跡狀況欄中○表示良好，△表示僅留下些微之吸附痕跡。
由表1可了解到實施例1~8中，B/A2 未滿0.015之實施例6、7雖留下些微吸附痕跡，但鋁箔的運送大致可良好(實施例1~7尤其可良好地進行)地進行。又，B/A2 未滿0.025之實施例2、3雖沒發生吸附痕跡，但確認到鋁箔發生些微變形。相對於此，多孔質體的厚度超過1.4mm的比較例方面，係如前所述無法獲得充分的吸附力，有吸附不良的問題。
1．．．吸附用片
2．．．基板
2a．．．一側面
2b．．．另一側面
21．．．貫通孔
3．．．多孔質體
4．．．吸附裝置
4a．．．吸附面
42．．．凹溝
42a．．．橫溝
42b．．．縱溝
圖1，係表示本發明一實施形態之吸附片安裝於吸附裝置之吸附面之狀態的剖面圖。
圖2，圖2A為圖1之IIA線剖面圖，圖2B為圖1之機板之俯視圖。
1．．．吸附用片
2．．．基板
2a．．．一側面
2b．．．另一側面
21．．．貫通孔
3．．．多孔質體
4．．．吸附裝置
4a．．．吸附面
42．．．凹溝
42a．．．橫溝
42b．．．縱溝

Claims (9)

  1. 一種吸附用片，其係安裝於真空吸附對象物之吸附裝置的吸附面者，其特徵在於具備基板與多孔質體，其中該基板係具有接觸於該吸附面之一側面，並設有複數個貫通孔；該多孔質體係以覆蓋該複數個貫通孔的方式貼附於該基板之另一側面，且厚度為1.4mm以下。
  2. 如申請專利範圍第1項之吸附用片，其中，該多孔質體係由超高分子量聚乙烯所構成者。
  3. 如申請專利範圍第2項之吸附用片，其中，該多孔質體係超高分子量聚乙烯粉體經燒結而成為多孔質化所成者。
  4. 如申請專利範圍第1項之吸附用片，其中，該複數個貫通孔係配置成各個貫通孔與最接近其之貫通孔的中心間距為65mm以下。
  5. 如申請專利範圍第4項之吸附用片，其中，該複數個貫通孔分別為開口面積在64mm2 以下者。
  6. 如申請專利範圍第5項之吸附用片，其中，當從軸方向看該貫通孔時，外切於貫通孔輪廓之最小矩形框之邊長中最大者定為A，該多孔質體之厚度定為B時，係滿足B/A2 ≧0.015。
  7. 如申請專利範圍第1項之吸附用片，其中，該基板係塑膠板或金屬板。
  8. 如申請專利範圍第1項之吸附用片，其中，於該吸附面設有吸引用凹溝，且該複數個貫通孔係以小於該凹溝之大小設置於對應於該凹溝之位置。
  9. 如申請專利範圍第8項之吸附用片，其中，該凹溝係由複數個溝所構成。
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JP2010099826A (ja) 2010-05-06
US20110183108A1 (en) 2011-07-28
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KR20110067132A (ko) 2011-06-21
JP5623721B2 (ja) 2014-11-12

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