TWI416802B - Chip card holding structure - Google Patents
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- TWI416802B TWI416802B TW97142089A TW97142089A TWI416802B TW I416802 B TWI416802 B TW I416802B TW 97142089 A TW97142089 A TW 97142089A TW 97142089 A TW97142089 A TW 97142089A TW I416802 B TWI416802 B TW I416802B
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Abstract
Description
本發明涉及一種用於容置並固持晶片卡之固持裝置,特別涉及一種用於攜帶型電子裝置上之晶片卡固持裝置。 The present invention relates to a holding device for accommodating and holding a wafer card, and more particularly to a wafer card holding device for a portable electronic device.
隨著通訊事業之迅速發展,行動電話、個人數位助理(personal digital assistant,PDA)等各種攜帶型電子裝置之使用越來越普及。隨著該等攜帶型電子裝置產品之功能日益多元化,應用於該等攜帶型裝置上之用於存儲記憶之晶片卡也越來越多,例如SD卡(Secure Digital Memory Card)、CF卡(Compact Flash Card)、SIM卡(Subscriber Identification Module Card,用戶識別卡)等。其中,SIM卡係一種裝有IC晶片之塑膠卡片,其具有記錄個人用戶號碼及通訊簿等功能,藉由更換SIM卡,其可供多個用戶使用。 With the rapid development of the communication industry, the use of various portable electronic devices such as mobile phones and personal digital assistants (PDAs) has become more and more popular. As the functions of these portable electronic device products become increasingly diversified, more and more wafer cards for storing memories are applied to such portable devices, such as an SD card (Secure Digital Memory Card) and a CF card ( Compact Flash Card), SIM card (Subscriber Identification Module Card), etc. Among them, the SIM card is a plastic card equipped with an IC chip, which has functions of recording a personal user number and an address book, and can be used by a plurality of users by replacing the SIM card.
習知晶片卡一般容置於攜帶型電子裝置之一卡槽內。當該晶片卡容置於該卡槽內時,該晶片卡上之積體電路藉由一連接器與該攜帶型電子裝置之電路板連接。當需要更換該晶片卡時,使用者使用手指直接按住該晶片卡暴露之部分,並向該卡槽外拖動,藉由使用者手指與該晶片卡之間之摩擦力使該晶片卡隨使用者手指運動,直至晶片卡由該卡槽內滑出。 Conventional wafer cards are generally housed in a card slot of a portable electronic device. When the chip card is received in the card slot, the integrated circuit on the chip card is connected to the circuit board of the portable electronic device by a connector. When the wafer card needs to be replaced, the user directly presses the exposed portion of the wafer card with a finger and drags the card card outside, and the wafer card is driven by the friction between the user's finger and the wafer card. The user's finger moves until the wafer card slides out of the card slot.
然,於實際使用中,由於晶片卡暴露於卡槽外之部分一般較小,直接按壓外露部分操作較為困難;有些型號之晶片卡甚至全部容置於卡槽內。故,使用者難以藉由直接按壓該晶片卡之方式帶動該晶片卡由卡槽滑出。 However, in actual use, since the portion of the wafer card exposed to the card slot is generally small, it is difficult to directly press the exposed portion; some types of wafer cards are even accommodated in the card slot. Therefore, it is difficult for the user to drive the wafer card to slide out of the card slot by directly pressing the wafer card.
有鑒於以上缺陷,有必要提供一種易於更換晶片卡且可有效容置、固持晶片卡之晶片卡固持裝置。 In view of the above drawbacks, it is necessary to provide a wafer card holding device that can easily replace a wafer card and can effectively accommodate and hold the wafer card.
一種晶片卡固持裝置,其包括一基體及一底板,該基體具有一外表面、一與該外表面相對之內表面及一垂直於該外表面及內表面之側面;所述內表面上凹設有一貫通側面之條形凹槽,並於該基體上形成二相對平行之導向側壁;所述底板裝設於基體之內表面上,並與條形凹槽共同形成一裝設晶片卡之容納腔室;所述晶片卡固持裝置還包括一推取裝置,其包括一主體及一推壁;該推取裝置可滑動地裝設於基體之條形凹槽內,與條形凹槽於該側面上形成一矩形開口,以便於將晶片卡從該矩形開口插入並裝夾於主體與底壁之間,並藉由滑動推取裝置帶動推壁將晶片卡推出。 A wafer card holding device comprising a base body and a bottom plate, the base body having an outer surface, an inner surface opposite to the outer surface, and a side perpendicular to the outer surface and the inner surface; the inner surface is recessed a strip-shaped recess penetrating through the side surface, and forming two opposite parallel guiding sidewalls on the base body; the bottom plate is mounted on the inner surface of the base body, and together with the strip-shaped recesses, forms a receiving cavity for mounting the wafer card The wafer card holding device further includes a pushing device including a main body and a pushing wall; the pushing device is slidably mounted in the strip groove of the base body, and the strip groove is on the side A rectangular opening is formed in the upper portion to facilitate insertion and clamping of the wafer card from the rectangular opening between the main body and the bottom wall, and push the push wall to push the wafer card out by the sliding push device.
相較於習知技術,所述晶片卡固持裝置結構簡單,其藉由一可滑動地裝設於基體上之推取裝置,輕易地實現了晶片卡之固持及拆卸,同時使得晶片卡之安裝及更換過程變得更加簡單,容易操作。 Compared with the prior art, the wafer card holding device has a simple structure, and the wafer card is easily held and disassembled by a pushing device slidably mounted on the substrate, and the wafer card is installed at the same time. And the replacement process is easier and easier to operate.
100‧‧‧晶片卡固持裝置 100‧‧‧ wafer card holder
10‧‧‧基體 10‧‧‧ base
11‧‧‧外表面 11‧‧‧ outer surface
12‧‧‧內表面 12‧‧‧ inner surface
13‧‧‧側面 13‧‧‧ side
14‧‧‧缺口 14‧‧‧ gap
140‧‧‧電池容納室 140‧‧‧Battery storage room
15‧‧‧條形凹槽 15‧‧‧ strip groove
152‧‧‧開口 152‧‧‧ openings
153‧‧‧導向側壁 153‧‧‧guide side wall
154‧‧‧滑槽 154‧‧ ‧ chute
155‧‧‧抵持壁 155‧‧‧Resist the wall
157‧‧‧導向槽 157‧‧‧ Guide groove
159‧‧‧安裝槽 159‧‧‧Installation slot
30‧‧‧底板 30‧‧‧floor
35‧‧‧連接器 35‧‧‧Connector
50‧‧‧推取裝置 50‧‧‧Feeling device
51‧‧‧主體 51‧‧‧ Subject
53‧‧‧夾持壁 53‧‧‧Clamping wall
55‧‧‧推壁 55‧‧‧ pushed wall
57‧‧‧導向塊 57‧‧‧ Guide block
59‧‧‧開啟部 59‧‧‧Opening Department
圖1為本發明晶片卡固持裝置較佳實施例之立體分解示意圖;圖2為本發明晶片卡固持裝置較佳實施例之另一視角下之立體分 解示意圖;圖3為本發明晶片卡固持裝置組裝後之立體示意圖;圖4為晶片卡裝設於本發明晶片卡固持裝置內之立體示意圖;圖5為晶片卡未被完全推入晶片卡固持裝置內之安裝示意圖;圖6為晶片卡被完全裝設於晶片卡固持裝置內之安裝示意圖。 1 is a perspective exploded view of a preferred embodiment of a wafer card holding device of the present invention; FIG. 2 is a perspective view of another preferred embodiment of the chip card holding device of the present invention. 3 is a schematic perspective view of the wafer card holding device of the present invention; FIG. 4 is a perspective view of the chip card mounted in the chip card holding device of the present invention; FIG. 5 is a wafer card not fully pushed into the chip card holding device FIG. 6 is a schematic view showing the installation of the wafer card in the wafer card holding device.
本發明之較佳實施例公開一種晶片卡固持裝置,其適用於行動電話、個人數位助理(personal digital assistant,PDA)等攜帶型電子裝置。於本實施例中,以應用於一行動電話(圖未示)為例說明此晶片卡固持裝置。 A preferred embodiment of the present invention discloses a wafer card holding device suitable for use in a portable electronic device such as a mobile phone or a personal digital assistant (PDA). In the present embodiment, the wafer card holding device is described by taking a mobile phone (not shown) as an example.
請參閱圖1及圖2,所述晶片卡固持裝置100包括一基體10、一底板30及一推取裝置50。所述基體10可為一行動電話之機殼,其大致呈矩形板狀。該基體10具有一外表面11、一與該外表面11相對之內表面12及一垂直於該外表面11及內表面12之側面13。於本發明較佳實施例中,所述基體10上貫通開設有一大致矩形之缺口14,從而於該基體10上形成所述垂直於外表面11及內表面12之側面13。所述基體10與所述底板30配合裝設一起時,該基體10之缺口14與底板30共同圍成一大致矩形凹腔狀之電池容納室140(請參閱圖3或圖4所示)。所述基體10之內表面12上臨近該側面13位置處向下凹設形成一與該缺口14相互連通之大致矩形之條形凹槽15,並對應於該基體10之內表面12上形成一底壁151、二相對平行之導向側壁153及一遠離該側面13一端之抵持壁155。所述條形凹 槽15之靠近側面13一端之開口位置處之底壁151上朝向外表面11方向貫通開設有一月牙形開口152。所述二導向側壁153上分別相對凹設有一大致“L”形之滑槽154,以用於將所述推取裝置裝入並可滑動地裝設於該條形凹槽15內。所述滑槽154包括一導向槽157及一安裝槽159,該導向槽157沿平行於該內表面12方向凹設於該導向側壁153上。所述安裝槽159由內表面12上靠近該側面13一端且臨近該導向側壁153位置處向下凹設形成,並與該導向槽157相互連通。該導向槽157與安裝槽159共同形成所述大致“L”形之滑槽154。 Referring to FIGS. 1 and 2 , the wafer card holding device 100 includes a base 10 , a bottom plate 30 , and a pushing device 50 . The base body 10 can be a casing of a mobile phone, which has a substantially rectangular plate shape. The base 10 has an outer surface 11, an inner surface 12 opposite the outer surface 11, and a side surface 13 perpendicular to the outer surface 11 and the inner surface 12. In the preferred embodiment of the present invention, a substantially rectangular cutout 14 is formed in the base 10 such that the side surface 13 perpendicular to the outer surface 11 and the inner surface 12 is formed on the base 10. When the base 10 and the bottom plate 30 are fitted together, the notch 14 of the base 10 and the bottom plate 30 together form a substantially rectangular cavity-shaped battery receiving chamber 140 (refer to FIG. 3 or FIG. 4). The inner surface 12 of the base body 10 is recessed downwardly adjacent to the side surface 13 to form a substantially rectangular strip-shaped recess 15 communicating with the notch 14 and forming a corresponding surface on the inner surface 12 of the base 10. The bottom wall 151, the two parallel guiding side walls 153 and a resisting wall 155 away from the one end of the side surface 13. The strip concave A crescent-shaped opening 152 is formed in the bottom wall 151 of the groove 15 near the opening end of the side surface 13 in the direction toward the outer surface 11. The two guiding side walls 153 are respectively recessed with a substantially "L"-shaped sliding groove 154 for loading and slidably mounting the pushing device in the strip-shaped groove 15. The sliding slot 154 includes a guiding slot 157 and a mounting slot 159. The guiding slot 157 is recessed on the guiding sidewall 153 in a direction parallel to the inner surface 12 . The mounting groove 159 is formed by being recessed downward from the inner surface 12 near one end of the side surface 13 and adjacent to the guiding side wall 153, and communicates with the guiding groove 157. The guide groove 157 and the mounting groove 159 together form the substantially "L" shaped chute 154.
所述底板30可為一電路板,其大致呈矩形板狀,該底板30上對應於所述基體10之條形凹槽15位置處設有一卡連接器35。所述底板30裝設於基體10之內表面12上,與內表面12上之條形凹槽15共同形成一大致矩形凹腔狀之用於裝設所述推取裝置30及一晶片卡70之容納腔室(圖未標)。該容納腔室於側面13上形成一矩形開口。所述底板30與基體10上之缺口14共同形成一大致矩形凹腔狀之電池容納室140。 The bottom plate 30 can be a circuit board having a substantially rectangular plate shape, and a card connector 35 is disposed on the bottom plate 30 corresponding to the strip-shaped recess 15 of the base 10. The bottom plate 30 is mounted on the inner surface 12 of the base 10, and forms a substantially rectangular concave shape with the strip-shaped recess 15 on the inner surface 12 for mounting the pick-up device 30 and a wafer card 70. The accommodation chamber (not shown). The receiving chamber forms a rectangular opening in the side surface 13. The bottom plate 30 and the notch 14 on the base 10 together form a substantially rectangular cavity-shaped battery receiving chamber 140.
所述推取裝置50大致呈矩形框體狀,其可滑動地裝設於基體10之條形凹槽15內。所述推取裝置50包括一主體51、二夾持壁53、一推壁55、二導向塊57及一開啟部59。該主體51大致呈矩形板狀,其外形尺寸大小與所述基體10之條形凹槽15大致相當。所述二夾持壁53大致呈矩形條狀,由該主體51之二縱向側緣垂直延伸彎折形成,用於對裝設於條形凹槽15內之晶片卡50進行限位元以防止其於條形凹槽15內晃動。所述推壁55大致呈矩形條狀,其由該主 體51一端之橫向側緣垂直延伸彎折形成,並與該二夾持壁53位於同一側。所述二導向塊57大致呈矩形塊狀,其分別沿平行該主體51方向相對向外凸設於該二夾持壁53之靠近該推壁55端之外側壁上,以分別對應地可滑動配合裝設於該條形凹槽15之二導向槽157內。所述二導向塊57之外形尺寸與所述滑槽154之安裝槽159相當,以使得裝設所述推取裝置50時,該推取裝置50之二導向塊57從該二安裝槽159裝入並分別可滑動地裝設於該導向槽157內。 所述開啟部59大致呈矩形塊狀,其由該主體51之與該推壁53相對之另一端之橫向側緣沿與該推壁55彎折方向相反之方向延伸彎折形成於該主體51之另一側,以使得該推取裝置50可滑動地裝設於基體10之條形凹槽15內時,與條形凹槽15於該側面13上形成一矩形開口,以便於將晶片卡70從該矩形開口插入並裝夾於主體51與底壁151之間,並藉由滑動推取裝置50帶動推壁55將晶片卡70推出。 The pushing device 50 is substantially in the shape of a rectangular frame and is slidably mounted in the strip-shaped recess 15 of the base 10. The pushing device 50 includes a main body 51, two clamping walls 53, a pushing wall 55, two guiding blocks 57 and an opening portion 59. The main body 51 has a substantially rectangular plate shape and has an outer size substantially equivalent to the strip-shaped recess 15 of the base 10. The two clamping walls 53 are substantially rectangular strips, and are formed by vertically extending and extending the longitudinal side edges of the main body 51 for limiting the wafer card 50 installed in the strip-shaped recesses 15 to prevent It sways within the strip groove 15. The push wall 55 is substantially in the shape of a rectangle, which is The lateral side edges of one end of the body 51 are vertically bent and formed on the same side as the two clamping walls 53. The two guiding blocks 57 are substantially in the shape of a rectangular block, and are respectively protruded outwardly in the direction parallel to the main body 51, and are respectively disposed on the outer side walls of the two clamping walls 53 near the end of the pushing wall 55 so as to be correspondingly slidable respectively. The fitting is installed in the two guiding grooves 157 of the strip groove 15 . The outer shape of the two guiding blocks 57 is equivalent to the mounting groove 159 of the sliding slot 154, so that when the pushing device 50 is installed, the guiding block 57 of the pushing device 50 is loaded from the two mounting slots 159. The inlets are slidably mounted in the guide grooves 157. The opening portion 59 is substantially in the shape of a rectangular block, and is formed by extending and bending a lateral side edge of the other end of the main body 51 opposite to the pushing wall 53 in a direction opposite to a bending direction of the pushing wall 55. On the other side, when the pushing device 50 is slidably mounted in the strip-shaped recess 15 of the base 10, a rectangular opening is formed on the side 13 with the strip-shaped recess 15 to facilitate the wafer card 70 is inserted from the rectangular opening and clamped between the main body 51 and the bottom wall 151, and the slide wall 55 is pushed by the sliding push device 50 to push the wafer card 70 out.
請一併參閱圖5及圖6,安裝所述晶片卡固持裝置100時,將所述推取裝置50之二導向塊57分別對準該基體10之內表面12上之安裝槽159,該推取裝置50之開啟部59朝向該條形凹槽15之底壁151。下壓該推取裝置50,使該二導向塊57進入到導向槽157內,同時朝向抵持壁155方向推動該推取裝置50,使該推取裝置50之二導向塊57沿該條形凹槽15之二導向側壁153上之導向槽157滑入。將所述底板30之設有卡連接器35之表面朝向該基體10之內表面12方向裝設於基體10上,該底板30之卡連接器35對應容置裝設於該條形凹槽15內,與該條形凹槽15圍成一大致矩形凹腔狀之用於裝設 所述推取裝置30及一晶片卡70之容納腔室,並於該側面13上形成一矩形開口。所述底板30與基體10之缺口14共同形成所述大致矩形凹腔狀之電池容納室140。 Referring to FIG. 5 and FIG. 6 , when the wafer card holding device 100 is mounted, the two guiding blocks 57 of the pushing device 50 are respectively aligned with the mounting grooves 159 on the inner surface 12 of the base 10 , and the pushing The opening portion 59 of the take-up device 50 faces the bottom wall 151 of the strip-shaped recess 15. The pushing device 50 is pressed down, and the two guiding blocks 57 are inserted into the guiding groove 157 while pushing the pushing device 50 toward the resisting wall 155, so that the guiding device 57 of the pushing device 50 is along the strip shape. The guide groove 157 on the guide side wall 153 of the second groove 15 slides in. The surface of the bottom plate 30 with the card connector 35 is disposed on the base 10 in the direction of the inner surface 12 of the base 10. The card connector 35 of the bottom plate 30 is correspondingly received in the strip groove 15 . And surrounding the strip-shaped recess 15 into a substantially rectangular concave shape for mounting The absorbing device 30 and a receiving chamber of a wafer card 70 form a rectangular opening on the side surface 13. The bottom plate 30 and the notch 14 of the base 10 together form the substantially rectangular cavity-shaped battery receiving chamber 140.
請一併參閱圖3及圖4,裝入所述晶片卡70時,將所述晶片卡70由晶片卡固持裝置100之條形凹槽15於側面13上之矩形開口端插入,使該晶片卡70裝設並彈性夾持於推取裝置50之主體51、二夾持壁53與底板30之卡連接器35之間,即完成該晶片卡70之安裝。當需要取出所述晶片卡70時,由基體10之開口152處施力於推取裝置50之開啟部59上,將推取裝置50拉出,該推取裝置50上之推壁55帶動該晶片卡70朝向側面13方向移動,即可取出所述晶片卡70。 Referring to FIG. 3 and FIG. 4 together, when the wafer card 70 is loaded, the wafer card 70 is inserted into the rectangular open end of the side surface 13 by the strip groove 15 of the wafer card holding device 100, so that the wafer is inserted. The card 70 is mounted and elastically clamped between the main body 51 of the pushing device 50, the two clamping walls 53 and the card connector 35 of the bottom plate 30, that is, the mounting of the wafer card 70 is completed. When the wafer card 70 needs to be taken out, the opening 152 of the base 10 is applied to the opening portion 59 of the pushing device 50 to pull the pushing device 50, and the pushing wall 55 of the pushing device 50 drives the card 50. The wafer card 70 is moved in the direction of the side surface 13, so that the wafer card 70 can be taken out.
本發明所述晶片卡固持裝置100結構簡單,其藉由一可滑動地裝設於基體10上之推取裝置50,輕易地實現了晶片卡70之固持及拆卸,同時使得晶片卡70之安裝及更換過程變得更加簡單,容易操作。 The wafer card holding device 100 of the present invention has a simple structure, and the holding and dismounting of the wafer card 70 is easily realized by a pushing device 50 slidably mounted on the base 10, and the wafer card 70 is mounted at the same time. And the replacement process is easier and easier to operate.
綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,本發明之範圍並不以上述實施例為限,舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and equivalent modifications or variations made by those skilled in the art in light of the spirit of the present invention are It should be covered by the following patent application.
100‧‧‧晶片卡固持裝置 100‧‧‧ wafer card holder
10‧‧‧基體 10‧‧‧ base
11‧‧‧外表面 11‧‧‧ outer surface
13‧‧‧側面 13‧‧‧ side
14‧‧‧缺口 14‧‧‧ gap
140‧‧‧電池容納室 140‧‧‧Battery storage room
152‧‧‧開口 152‧‧‧ openings
30‧‧‧底板 30‧‧‧floor
50‧‧‧推取裝置 50‧‧‧Feeling device
59‧‧‧開啟部 59‧‧‧Opening Department
70‧‧‧晶片卡 70‧‧‧wafer card
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97142089A TWI416802B (en) | 2008-10-31 | 2008-10-31 | Chip card holding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97142089A TWI416802B (en) | 2008-10-31 | 2008-10-31 | Chip card holding structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201017997A TW201017997A (en) | 2010-05-01 |
| TWI416802B true TWI416802B (en) | 2013-11-21 |
Family
ID=44831042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97142089A TWI416802B (en) | 2008-10-31 | 2008-10-31 | Chip card holding structure |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI416802B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2789968Y (en) * | 2005-04-13 | 2006-06-21 | 富港电子(东莞)有限公司 | SIM card connector with ejection mechanism |
| TWI345345B (en) * | 2005-12-02 | 2011-07-11 | Fih Hong Kong Ltd | Chip card holding structure |
-
2008
- 2008-10-31 TW TW97142089A patent/TWI416802B/en not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2789968Y (en) * | 2005-04-13 | 2006-06-21 | 富港电子(东莞)有限公司 | SIM card connector with ejection mechanism |
| TWI345345B (en) * | 2005-12-02 | 2011-07-11 | Fih Hong Kong Ltd | Chip card holding structure |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201017997A (en) | 2010-05-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |