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TWI365033B - Chip card latching device - Google Patents

Chip card latching device Download PDF

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Publication number
TWI365033B
TWI365033B TW97128396A TW97128396A TWI365033B TW I365033 B TWI365033 B TW I365033B TW 97128396 A TW97128396 A TW 97128396A TW 97128396 A TW97128396 A TW 97128396A TW I365033 B TWI365033 B TW I365033B
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TW
Taiwan
Prior art keywords
wafer card
holding device
wafer
placing table
sliding
Prior art date
Application number
TW97128396A
Other languages
Chinese (zh)
Other versions
TW201006354A (en
Inventor
Zhong-Shu Qin
Hsiao Hua Tu
Wen-Wei Song
Jun Wang
Ye Liu
Xu-Ri Zhang
Original Assignee
Fih Hong Kong Ltd
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Publication date
Application filed by Fih Hong Kong Ltd filed Critical Fih Hong Kong Ltd
Priority to TW97128396A priority Critical patent/TWI365033B/en
Publication of TW201006354A publication Critical patent/TW201006354A/en
Application granted granted Critical
Publication of TWI365033B publication Critical patent/TWI365033B/en

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Telephone Set Structure (AREA)

Description

I365D33 ιοί年.03月0·2日梭正_頁 六、發明說明: 【發明所屬之技術領域】 [0001] 本發明涉及一種晶片卡卡持裝置,尤其涉及一種應用於 可攜式電子裝置之晶片卡卡持裝置。 【先前技術】 [0002] 近年來,具有集成電路之表面晶片卡廣泛應用於電子裝 置中以提高或增加電子裝置之性能,如安裝於行動電話 中之用戶識別卡(subscriber identification module card,以下通稱SIM卡),其内儲存有操作行動 電話之必要資訊,而且記載有用戶個人資訊。藉由更換 SI Μ卡,一隻行動電話可供多個用戶使用。 [0003] 習知之SIM卡一般容置於行動電話之—^槽内。當該SIM 卡容置於該卡槽内時,該SIM卡上之集成電路藉由一連接 器與該行動電話之電路板連接。同時,該SIM卡部分暴露 於該卡槽外,如此,當需要更換該SIM卡時,使用者手指 直接按壓該SIM卡暴露於該卡槽外之部分,並藉由使用者 手指與該SIM卡之間之摩擦力,而使該SIM卡由該卡槽内 滑出。 [0004] 由於SIM卡暴露於該卡槽外之部分一般較小,因此使用者 難以按壓該SIM卡,如此,使用者手指與該SIM卡之間不 易產生摩擦力,進而難以藉由該摩擦力帶動該SIM卡由該 卡槽滑出。 【發明内容】 [0005] 有鑒於此,有必要提供一種便於取出晶片卡之晶片卡卡 持裝置。 09712839^^^^* Α〇101 第3頁/共15頁 1013079350-0 1365033 101年.03月0>日核正替換頁 [0006] 一種晶片卡卡持裝置,其包括一放置台及一殼體,該放 置台設置於該殼體上,該放置台用以卡合一晶片卡於其 上,該晶片卡卡持裝置還包括一裝配於該殼體上之彈出 機構及一形成於該殼體上之容置腔,該彈出機構及該容 置腔分別位於該放置台相對之兩側,該容置腔用以容納 一電池於其内,所述之該電池容納於該容置腔内時,該 晶片卡受該彈出機構與該電池之抵持而穩固於該放置台 上;當該電池由該容置腔内取出後,該晶片卡被該彈出 機構自動彈出該放置台。 [0007] 相較于習知技術,所述晶片卡卡持裝置在取出電池時, 彈出機構抵持晶片卡由該置台上滑出,這使得晶片卡可 輕鬆地由放置台上滑出。 【實施方式】 [0008] 本發明之較佳實施例公開一種晶片卡卡持裝置,其適用 於行動電話等可攜式電子裝置。在本實施例中,以行動 電話為例說明此晶片卡卡持裝置。 [0009] 請參閱圖1,該晶片卡卡持裝置100包括一殼體10、一容 納於該殼體10内之電池20及一設置於該殼體10上之彈出 機構30。請參閱圖5,一晶片卡40 (比如SIM卡、存儲卡 )經由該電池20與該彈出機構30之卡合而固定於該殼體 10上。 [0010] 請參閱圖1,該殼體10為行動電話機殼之一部分,大體為 長方體形。該殼體10之下半部開設一長方形容置腔12, 該容置腔12由周壁122圍成,其用來容納該電池20於其内 。請一併參閱圖2,該殼體10之上半部設置一放置台14, 1013079350-0 097128390^ AQ1Q1 ^ 4 1 ; ^ 15 1 1365033 101·年.03月02日按正替換頁 該放置台14之一側與該周壁122鄰接,另一側與該彈出機 構30鄰接(參圖4)。該放置台14用於放置該晶片卡40。 該放置台14之二相對側緣分別垂直向上延伸有一側壁142 ,每一該侧壁142向放置台14内延伸有大致與該放置台14 平行之一卡鉤144。請參閱圖4,所述側壁142及卡鉤144 分別用於限定該晶片卡40之Y、Z方向上之自由度。 [0011] 請一併參閱圖3,該彈出機構30包括一滑動體32、一固定 座34及一彈性體36。該滑動體32包括一弓形主體322及 一由該主體322向該©定座34方向延伸之導柱324。該主 體322之中部凸設有複數定位部3222,所述定位部3222 用以與該固定座34配合。 [0012] 請一併參閱圖4,該IS定座34固定(比如,熱熔)於該殼 體10上,其由朝向該滑動體32之一端向遠離該滑動體32 之一端依次開設一滑槽342及一與該滑槽342導通之盲孔 344,從而於該固定座34上形成二相對之滑槽壁3422。 該滑槽342與該主體322對應設置,該主體322可滑動地 容置於該滑槽342内,該盲孔344用於容納該彈性體36。 該固定座34於所述滑槽壁3422上對應於所述定位部3222 開設複數定位槽3424,所述定位部3222可滑動地容置於 所述定位槽3424内。 [0013] 請參閱圖3,該彈性體36抵持於該滑動體32與該固定座34 之間,其提供該滑動體32遠離該固定座34之力。本實施 例中,該彈性體36為一枉狀壓簧,其一端套設於該導柱 . 324上,另一端容納於該盲孔344内。 09712839#單編號 A〇101 第5頁/共15頁 1013079350-0 1365033 101年.03月日修正替換頁 [0014] 請參閱圖4,組裝該晶片卡卡持裝置100時,首先將該彈 性體36之一端伸進該盲孔344内;使該滑動體32之導柱 324與該彈性體36之另一端對準,然後以朝向該固定座34 之方向壓該滑動體32而使該滑動體32滑入該滑槽342内及 該定位部3222滑入該定位槽3424内,此時,該彈性體36 處於壓縮狀態而積蓄彈力;接著,將該固定座34固定於 該殼體10上,且此時該滑動體32與該放置台14抵持,如 此,可藉由該放置台14之抵持而阻止該滑動體32於該彈 性體36彈力之作用下而由該滑槽342内滑出,即完成該晶 片卡卡持裝置100之組裝。 [0015] 安裝該晶片卡40時,首先將該晶片卡40置於該放置台14 上,再按如圖4箭頭X所示之方向將該晶片卡40之一端插 入所述卡鉤144内,然後將該電池20裝入該容置腔12内, 此時,該電池20壓迫該晶片卡40之另一端而使該晶片卡 40繼續按如圖4箭頭X所示方向運動,該晶片卡40運動過 程中,將驅動該滑動體32運動而繼續壓迫該彈性體36, 直到該晶片卡4 0位於如圖5所示位置,此時,該晶片卡4 0 於X方向抵持於該電池20與該滑動體32之間,而Y、Z方向 由所述側壁142及卡鉤144限制,因此該晶片卡40穩固地 安裝於該殼體10上。 [0016] 需取出該晶片卡40時,將該電池20由該容置腔12内取出 ,即解除該電池20與該晶片卡40之間之抵持,如此,該 彈性體36被釋放而驅使該滑動體32沿箭頭X之反方向運動 ,進而將該晶片卡40彈出。 [0017] 所述晶片卡卡持裝置100當該取出電池20時,該彈出機構 1013079350-0 _2839产單编號删1 第6頁/共15頁 1365.033 101年.03月0·2日按正_»頁 30抵持該晶片卡4〇由該放置台14上滑出’這使得該晶片 卡4 0玎輕鬆地由該放置台14上滑出。 [0018] 綜上所述’本發明符合發明專利要件,爰依法提出專利 申請。惟’以上所述者僅為本發明之較佳實施例,本發 明之範圍並不以上述實施例為限,舉凡熟悉本案技藝之 人士援依本發明之精神所作之等效修飾或變化,皆應涵 蓋於以下申請專利範圍内。 【圖式簡單說明】 [0019] 則係本發明較佳實施例之晶片卡卡持裝置之立體分解示 意圖; [0020] 圖2係圖1所示晶片卡卡持裝番 下下得裝置之另一視角之局部立體分 解示意圖; [0021] 圖3係圖1所示晶片卡卡持裝置之彈出機構之剖視圖; [0022] 機構、一 [0023] 圖5係圖2所示晶片卡卡持裝置之组裝圖。 【主要元件符號說明】 [0024] 晶片卡卡持裝置:100 [0025] 滑動體:32 [0026] 殼體:10 [0027] 主體:322 [0028] 容置腔:12 09712839^ 删1 第7頁/共〗,百 只’共15頁 1013079350-0 1365033 [0029] 定位部:3222 [0030] 周壁:122 [0031] 導柱:324 [0032] 放置台:14 [0033] 固定座:34 [0034] 側壁:142 [0035] 滑槽:342 [0036] 卡鉤:14 4 [0037] 定位槽:3424 [0038] 電池:20 [0039] 彈性體:36 [0040] 彈出機構:30 [0041] 晶片卡· 4 0 09712839#單编號 A〇101 第8頁/共15頁 101年.03月0>日梭正替換頁 1013079350-0[0001] The present invention relates to a wafer card holding device, and more particularly to a portable electronic device. Wafer card holding device. [Prior Art] [0002] In recent years, surface wafer cards having integrated circuits have been widely used in electronic devices to enhance or increase the performance of electronic devices, such as a subscriber identification module card installed in a mobile phone. SIM card), which stores the necessary information for operating the mobile phone, and records the user's personal information. By replacing the SI Leica, one mobile phone can be used by multiple users. [0003] A conventional SIM card is generally housed in a slot of a mobile phone. When the SIM card is housed in the card slot, the integrated circuit on the SIM card is connected to the circuit board of the mobile phone by a connector. At the same time, the SIM card is partially exposed outside the card slot. When the SIM card needs to be replaced, the user's finger directly presses the SIM card to expose the portion outside the card slot, and the user's finger and the SIM card are used. The friction between the SIM card slides out of the card slot. [0004] Since the portion of the SIM card exposed to the card slot is generally small, it is difficult for the user to press the SIM card. Therefore, friction between the user's finger and the SIM card is less likely to occur, and thus the friction is difficult to be utilized. The SIM card is driven to slide out of the card slot. SUMMARY OF THE INVENTION [0005] In view of the above, it is necessary to provide a wafer card holding device that facilitates removal of a wafer card. 09712839^^^^* Α〇101 Page 3 of 15 1013079350-0 1365033 101.03 month 0> Japanese nuclear replacement page [0006] A wafer card holder device comprising a placement table and a shell The mounting table is disposed on the housing, and the placing table is configured to engage a wafer card thereon. The wafer card holding device further includes an ejection mechanism mounted on the housing and a shell formed on the housing The accommodating cavity is disposed on the opposite sides of the placing table, the accommodating cavity is configured to receive a battery therein, and the battery is received in the accommodating cavity The wafer card is stabilized on the placing table by the ejecting mechanism and the battery; when the battery is taken out of the receiving cavity, the wafer card is automatically ejected by the ejecting mechanism. [0007] Compared to the prior art, when the wafer card holding device removes the battery, the eject mechanism abuts the wafer card and slides out of the table, which allows the wafer card to be easily slid out of the placing table. [Embodiment] A preferred embodiment of the present invention discloses a wafer card holding device which is suitable for a portable electronic device such as a mobile phone. In the present embodiment, the wafer card holding device will be described by taking a mobile phone as an example. Referring to FIG. 1, the chip card holding device 100 includes a casing 10, a battery 20 housed in the casing 10, and an ejecting mechanism 30 disposed on the casing 10. Referring to FIG. 5, a wafer card 40 (such as a SIM card or a memory card) is fixed to the casing 10 via the battery 20 in engagement with the eject mechanism 30. [0010] Referring to FIG. 1, the housing 10 is a portion of a mobile phone casing, generally having a rectangular parallelepiped shape. A rectangular receiving cavity 12 is defined in the lower half of the housing 10. The receiving cavity 12 is surrounded by a peripheral wall 122 for receiving the battery 20 therein. Referring to FIG. 2 together, a placing table 14 is disposed on the upper half of the casing 10. 1013079350-0 097128390^ AQ1Q1 ^ 4 1 ; ^ 15 1 1365033 101·year.03.02. One side of the 14 is adjacent to the peripheral wall 122, and the other side is adjacent to the eject mechanism 30 (see Fig. 4). The placement table 14 is used to place the wafer card 40. Two opposite side edges of the placing table 14 extend vertically upwardly with a side wall 142, and each of the side walls 142 extends into the placing table 14 with a hook 144 substantially parallel to the placing table 14. Referring to FIG. 4, the side wall 142 and the hook 144 are respectively used to define the degrees of freedom of the wafer card 40 in the Y and Z directions. [0011] Referring to FIG. 3 together, the eject mechanism 30 includes a sliding body 32, a fixing base 34 and an elastic body 36. The slider 32 includes an arcuate body 322 and a guide post 324 extending from the body 322 toward the © seat. A plurality of positioning portions 3222 are protruded from the middle portion of the main body 322, and the positioning portion 3222 is configured to cooperate with the fixing base 34. [0012] Referring to FIG. 4 together, the IS holder 34 is fixed (eg, thermally fused) to the housing 10, and is opened by sliding toward one end of the sliding body 32 toward one end of the sliding body 32. The slot 342 and a blind hole 344 are connected to the slot 342 to form two opposite slot walls 3422. The sliding slot 342 is disposed corresponding to the main body 322. The main body 322 is slidably received in the sliding slot 342 for receiving the elastic body 36. The fixing seat 34 defines a plurality of positioning slots 3424 corresponding to the positioning portion 3222 on the sliding slot wall 3422, and the positioning portion 3222 is slidably received in the positioning slot 3424. [0013] Referring to FIG. 3, the elastic body 36 is abutted between the sliding body 32 and the fixing base 34, which provides the force of the sliding body 32 away from the fixing base 34. In this embodiment, the elastic body 36 is a spring-shaped compression spring, and one end of the elastic body 36 is sleeved on the guide post 324, and the other end is received in the blind hole 344. 09712839#单编号A〇101 Page 5/15 pages 1013079350-0 1365033 101.03月日日修正 replacement page [0014] Referring to FIG. 4, when assembling the wafer card holder 100, the elastomer is first One end of 36 extends into the blind hole 344; the guide post 324 of the sliding body 32 is aligned with the other end of the elastic body 36, and then the sliding body 32 is pressed in a direction toward the fixing seat 34 to make the sliding body 32 is slid into the sliding groove 342 and the positioning portion 3222 is slid into the positioning groove 3424. At this time, the elastic body 36 is in a compressed state to accumulate elastic force; then, the fixing seat 34 is fixed on the housing 10, At this time, the sliding body 32 is in contact with the placing table 14, so that the sliding body 32 can be prevented from sliding in the sliding slot 342 by the elastic force of the elastic body 36 by the abutment of the placing table 14. The assembly of the wafer card holding device 100 is completed. [0015] When the wafer card 40 is mounted, the wafer card 40 is first placed on the placement table 14, and one end of the wafer card 40 is inserted into the hook 144 in the direction indicated by the arrow X in FIG. The battery 20 is then loaded into the accommodating chamber 12, at which time the battery 20 presses the other end of the wafer card 40 to cause the wafer card 40 to continue moving in the direction indicated by the arrow X in FIG. During the movement, the sliding body 32 is driven to continue to press the elastic body 36 until the wafer card 40 is in the position shown in FIG. 5, at which time the wafer card 40 is held in the X direction against the battery 20. Between the sliding body 32 and the Y and Z directions are restricted by the side wall 142 and the hook 144, the wafer card 40 is firmly mounted on the housing 10. [0016] When the wafer card 40 needs to be taken out, the battery 20 is taken out from the accommodating cavity 12, that is, the resistance between the battery 20 and the wafer card 40 is released, so that the elastic body 36 is released and driven. The slider 32 is moved in the opposite direction of the arrow X to eject the wafer card 40. [0017] The wafer card holding device 100, when the battery 20 is taken out, the ejection mechanism 1013079350-0 _2839 production number is deleted 1 page 6 / 15 pages 1365.033 101 years. 03 months 0. 2 days The _»page 30 resists the wafer card 4 and slides out of the placement table 14 'this allows the wafer card 40 to be easily slid out of the placement table 14. [0018] In summary, the invention conforms to the patent requirements of the invention, and the patent application is filed according to law. However, the above description is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments, and equivalent modifications or variations made by those skilled in the art in light of the spirit of the present invention are It should be covered by the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS [0019] FIG. 2 is a perspective exploded view of a wafer card holding device according to a preferred embodiment of the present invention; [0020] FIG. 2 is another device of the wafer card holding device shown in FIG. [0021] FIG. 3 is a cross-sectional view showing the eject mechanism of the wafer card holding device shown in FIG. 1; [0022] mechanism, a [0023] FIG. 5 is a wafer card holding device shown in FIG. Assembly diagram. [Main component symbol description] [0024] Wafer card holding device: 100 [0025] Sliding body: 32 [0026] Housing: 10 [0027] Main body: 322 [0028] accommodating cavity: 12 09712839^ Delete 1 7 Page / Total〗, Hundreds 'Total 15 Pages 1013079350-0 1365033 [0029] Positioning Department: 3222 [0030] Wall: 122 [0031] Guide column: 324 [0032] Placement table: 14 [0033] Fixing seat: 34 [ 0034] Sidewall: 142 [0035] Chute: 342 [0036] Hook: 14 4 [0037] Locating slot: 3424 [0038] Battery: 20 [0039] Elastomer: 36 [0040] Eject mechanism: 30 [0041] Wafer Card·4 0 09712839#单号A〇101 Page 8 of 15 Page 101.03月○0> 日梭正换页1013079350-0

Claims (1)

1365033 ιοί年.03月&日梭正_寅 七、申請專利範圍: 1 . 一種晶片卡卡持裝置,其包括一放置台及一殼體,該放置 台設置於該殼體上,該放置台用以卡合一晶片卡於其上, 其改良在於:該晶片卡卡持裝置還包括一裝配於該殼體上 之彈出機構及一形成於該殼體上之容置腔,該彈出機構及 該容置腔分別位於該放置台相對之兩側,該容置腔用以容 納一電池於其内,所述之該電池容納於該容置腔内時,該 晶片卡受該彈出機構與該電池之抵持而.穩固於該放置台上 ;當該電池由該容置腔内取出後,該晶片卡被該彈出機構 自動彈出該放置台。 2. 如申請專利範圍第1項所述之晶片卡卡持裝置,其中所述 之放置台之二相對側緣分別延伸一側壁,每一該側壁向該 放置台内延伸一卡鉤,該晶片卡藉由所述卡鉤卡合於該放 置台上。 3. 如申請專利範圍第1項所述之晶片卡卡持裝置,其中所述 之彈出機構包括一裝配於該殼體上之固定座、一可滑動地 容置於該固定座之滑動體及一抵持於該滑動體與該固定座 之間之彈性體,該滑動體甩以抵持該晶片卡,該彈性體用 以提供該晶片卡由該放置台上滑出之力。 4 .如申請專利範圍第3項所述之晶片卡卡持裝置,其中所述 之滑動體包括一主體,該固定座對應於該主體開設一滑槽 ,該主體可滑動地容置於該滑槽内。 5 .如申請專利範圍第4項所述之晶片卡卡持裝置,其中所述 之滑動體還包括由該主體延伸之一導柱,該固定座還開設 一與該滑槽導通之盲孔,該彈性體一端套設於該導柱上, 09712839# 單編號 A〇101 第9頁/共15頁 1013079350-0 1365033 101·年.03月02日梭正替換百 另一端容置於該盲孔内。 6. 如申請專利範圍第4項所述之晶片卡卡持裝置,其中所述 之主體之中部凸設有複數定位部,該固定座對應於所述定 位部開設複數定位槽,所述定位部可滑動地容置於所述定 位槽内。 7. 如申請專利範圍第4項所述之晶片卡卡持裝置,其中所述 之主體呈一弓形。 09712839#單编號 A〇101 第10頁/共15頁 1013079350-01365033 ιοί年.03月& 日梭正_寅七, application patent scope: 1. A wafer card holding device, comprising a placing table and a casing, the placing table is disposed on the casing, the placing The tablet card is adapted to: the wafer card holding device further comprises an ejecting mechanism mounted on the housing and a receiving cavity formed on the housing, the ejecting mechanism And the accommodating cavity is respectively located on opposite sides of the placing table, the accommodating cavity is for accommodating a battery therein, and when the battery is received in the accommodating cavity, the wafer card is subjected to the ejecting mechanism and The battery is stabilized on the placing table; when the battery is taken out of the receiving cavity, the wafer card is automatically ejected by the ejecting mechanism. 2. The wafer card holding device of claim 1, wherein the two opposite side edges of the placing table respectively extend a side wall, and each of the side walls extends a hook into the placing table, the wafer The card is engaged with the mounting table by the hook. 3. The wafer card holding device of claim 1, wherein the ejecting mechanism comprises a fixing seat mounted on the housing, a sliding body slidably received in the fixing seat, and An elastic body that is abutted between the sliding body and the fixing base, the sliding body is configured to abut the wafer card, and the elastic body is used to provide a force for the wafer card to slide out of the placing table. 4. The wafer card holding device of claim 3, wherein the sliding body comprises a main body, the fixing seat defines a sliding slot corresponding to the main body, and the main body is slidably received in the sliding Inside the slot. 5. The wafer card holding device of claim 4, wherein the sliding body further comprises a guiding post extending from the main body, the fixing seat further opening a blind hole that is electrically connected to the sliding slot. One end of the elastic body is sleeved on the guide post, 09712839# single number A〇101 page 9 / total 15 page 1013079350-0 1365033 101 · year. March 02, the shuttle is replacing the other end of the hole in the blind hole Inside. 6. The wafer card holding device of claim 4, wherein the middle portion of the body is convexly provided with a plurality of positioning portions, and the fixing seat defines a plurality of positioning grooves corresponding to the positioning portion, the positioning portion Slidably received in the positioning groove. 7. The wafer card holding device of claim 4, wherein the body has an arcuate shape. 09712839#单号 A〇101 Page 10 of 15 1013079350-0
TW97128396A 2008-07-25 2008-07-25 Chip card latching device TWI365033B (en)

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