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TWI413310B - Chip card holding structure - Google Patents

Chip card holding structure Download PDF

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Publication number
TWI413310B
TWI413310B TW97138868A TW97138868A TWI413310B TW I413310 B TWI413310 B TW I413310B TW 97138868 A TW97138868 A TW 97138868A TW 97138868 A TW97138868 A TW 97138868A TW I413310 B TWI413310 B TW I413310B
Authority
TW
Taiwan
Prior art keywords
card
holding device
wall
wafer
wafer card
Prior art date
Application number
TW97138868A
Other languages
Chinese (zh)
Other versions
TW201015794A (en
Inventor
Shi-Jin Long
Xiang-Ming Guo
Li Cheng
Original Assignee
Fih Hong Kong Ltd
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Publication date
Application filed by Fih Hong Kong Ltd filed Critical Fih Hong Kong Ltd
Priority to TW97138868A priority Critical patent/TWI413310B/en
Publication of TW201015794A publication Critical patent/TW201015794A/en
Application granted granted Critical
Publication of TWI413310B publication Critical patent/TWI413310B/en

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Abstract

The invention discloses a chip card holding structure including a main body, a card receiving groove defined in the main body and a releasing piece. The card receiving groove has an opening for inserting a chip card. The releasing piece is slidably mounted on the main body. The releasing could be limited ahead of the opening or aside of the opening to lock or unlock the chip card. The chip card holding structure has simple structure and is easy to operate, it is easily fulfill the assemble and disassemble operation to the chip card.

Description

晶片卡固持裝置 Wafer card holding device

本發明涉及一種用於容置並固持晶片卡之固持裝置,特別涉及一種用於攜帶型電子裝置上之晶片卡固持裝置。 The present invention relates to a holding device for accommodating and holding a wafer card, and more particularly to a wafer card holding device for a portable electronic device.

隨著通訊事業之迅速發展,行動電話、個人數位助理(personal digital assistant,PDA)等各種攜帶型電子裝置之使用越來越普及。隨著該等攜帶型電子裝置產品之功能日益多元化,應用於該等攜帶型裝置上之用於存儲記憶之晶片卡亦越來越多,例如SD卡(Secure Digital Memory Card)、CF卡(Compact Flash Card)、SIM卡(Subscriber Identification Module Card,用戶識別卡)等。其中,SIM卡係一種裝有IC晶片之塑膠卡片,其具有記錄個人用戶號碼及通訊簿等功能,藉由更換SIM卡,其可供多個用戶使用。 With the rapid development of the communication industry, the use of various portable electronic devices such as mobile phones and personal digital assistants (PDAs) has become more and more popular. As the functions of these portable electronic device products become increasingly diversified, more and more wafer cards for storing memories are applied to such portable devices, such as an SD card (Secure Digital Memory Card) and a CF card ( Compact Flash Card), SIM card (Subscriber Identification Module Card), etc. Among them, the SIM card is a plastic card equipped with an IC chip, which has functions of recording a personal user number and an address book, and can be used by a plurality of users by replacing the SIM card.

習知晶片卡一般容置於攜帶型電子裝置之卡槽內。當該晶片卡容置於該卡槽內時,該晶片卡上之積體電路藉由一連接器與該攜帶型電子裝置之電路板連接。當需要更換該晶片卡時,使用者使用手指直接按住該晶片卡暴露之部分,並向該卡槽外拖動,藉由使用者手指與該晶片卡之間之摩擦力使該晶片卡隨使用者手指運動,直至晶片卡由該卡槽內滑出。 Conventional wafer cards are generally housed in a card slot of a portable electronic device. When the chip card is received in the card slot, the integrated circuit on the chip card is connected to the circuit board of the portable electronic device by a connector. When the wafer card needs to be replaced, the user directly presses the exposed portion of the wafer card with a finger and drags the card card outside, and the wafer card is driven by the friction between the user's finger and the wafer card. The user's finger moves until the wafer card slides out of the card slot.

然,於實際使用中,由於晶片卡暴露於卡槽外之部分一般較小,直接按壓外露部分操作較為困難;有些型號之晶片卡甚至全部容置於卡槽內。故,使用者難以藉由直接按壓該晶片卡之方式帶動該晶片卡由卡槽滑出。 However, in actual use, since the portion of the wafer card exposed to the card slot is generally small, it is difficult to directly press the exposed portion; some types of wafer cards are even accommodated in the card slot. Therefore, it is difficult for the user to drive the wafer card to slide out of the card slot by directly pressing the wafer card.

有鑒於以上缺陷,有必要提供一種易於更換晶片卡且可有效容置、固持晶片卡之晶片卡固持裝置。 In view of the above drawbacks, it is necessary to provide a wafer card holding device that can easily replace a wafer card and can effectively accommodate and hold the wafer card.

一種晶片卡固持裝置,其包括一基體及一形成於該基體上之用於滑動裝設一晶片卡之卡裝設部,該卡裝設部具有一用以插入晶片卡之開口;所述晶片卡固持裝置還包括一釋放件,其滑動地裝設於所述基體上且可分別定位於所述開口前方或一側,用以將該晶片卡鎖持或解鎖於該卡裝設部內。 A chip card holding device includes a base body and a card mounting portion formed on the base body for slidingly mounting a wafer card, the card mounting portion having an opening for inserting a wafer card; The card retaining device further includes a release member slidably mounted on the base body and respectively positionable in front of or on one side of the opening for locking or unlocking the wafer card in the card mounting portion.

相較於習知技術,所述晶片卡固持裝置結構簡單,其藉由於基體之卡裝設部前方設置一釋放件,輕易地實現了晶片卡之安裝及拆卸,同時使得晶片卡之安裝及更換過程變得更加簡單,容易操作。 Compared with the prior art, the wafer card holding device has a simple structure, and the wafer card is easily mounted and disassembled by installing a release member in front of the card mounting portion of the base body, and the wafer card is installed and replaced at the same time. The process is much simpler and easier to operate.

100‧‧‧晶片卡固持裝置 100‧‧‧ wafer card holder

10‧‧‧基體 10‧‧‧ base

12‧‧‧側壁 12‧‧‧ side wall

13‧‧‧導向槽 13‧‧‧ Guide groove

15‧‧‧第一定位部 15‧‧‧First Positioning Department

17‧‧‧第二定位部 17‧‧‧Second Positioning Department

30‧‧‧電路板 30‧‧‧ boards

31‧‧‧卡連接器 31‧‧‧ card connector

33‧‧‧卡裝設部 33‧‧‧Card Installation Department

40‧‧‧夾持部 40‧‧‧Clamping Department

50‧‧‧釋放件 50‧‧‧ release

51‧‧‧卡合壁 51‧‧‧Card wall

52‧‧‧凸塊 52‧‧‧Bumps

53‧‧‧安裝壁 53‧‧‧Installation wall

55‧‧‧裝配空間 55‧‧‧Assembly space

90‧‧‧晶片卡 90‧‧‧wafer card

121‧‧‧條形凹槽 121‧‧‧ strip groove

123‧‧‧外側壁 123‧‧‧Outer side wall

125‧‧‧內側壁 125‧‧‧ inner side wall

圖1為本發明晶片卡固持裝置較佳實施例之立體分解示意圖;圖2為本發明晶片卡固持裝置之擋塊之立體示意圖;圖3為從本發明晶片卡固持裝置內取出或裝入晶片卡時之立體示意圖;圖4為晶片卡裝設於本發明晶片卡固持裝置內之立體示意圖。 1 is a perspective exploded view of a preferred embodiment of a wafer card holding device of the present invention; FIG. 2 is a perspective view of a stopper of the wafer card holding device of the present invention; and FIG. 3 is a view of the wafer card holding device of the present invention. FIG. 4 is a perspective view showing the wafer card mounted in the wafer card holding device of the present invention.

本發明公開一種晶片卡固持裝置,其適用於行動電話、個人數位助理(personal digital assistant,PDA)等攜帶型電子裝置。下麵將以本發明晶片卡固持裝置之較佳實施例應用於一行動電話(圖未示)為例進行說明。 The invention discloses a chip card holding device, which is suitable for a portable electronic device such as a mobile phone and a personal digital assistant (PDA). A preferred embodiment of the wafer card holding device of the present invention will be described as an example of a mobile phone (not shown).

請參閱圖1,一晶片卡固持裝置100包括一基體10、一電路板30、二夾持部40及一釋放件50。所述基體10大致呈矩形框體狀,其可以為一行動電話之機殼。所述基體10具有一側壁12,其上靠近其一端部位置處向下凹設形成 一大致矩形之條形凹槽121,並對應地於該側壁12之端部形成一外側壁123及一與該外側壁123相對平行之內側壁125。所述外側壁123之外表面上沿平行於該條形凹槽121方向凹設有條形導向槽13,該導向槽13之長度與該條形凹槽121之長度相當。所述導向槽13內間隔地凹設有一第一定位部15及一第二定位部17,以用於對裝設於該基體10之側壁12上之釋放件50進行定位。於本實施例中,所述第一定位部15及一第二定位部17為分別間隔凹設於該導向槽13兩端之二半球形限位凹槽。 Referring to FIG. 1 , a wafer card holding device 100 includes a base 10 , a circuit board 30 , two clamping portions 40 , and a release member 50 . The base body 10 has a substantially rectangular frame shape, which may be a casing of a mobile phone. The base body 10 has a side wall 12 which is recessed downwardly at a position near one end thereof. A substantially rectangular strip-shaped recess 121 defines an outer sidewall 123 and an inner sidewall 125 opposite the outer sidewall 123 at an end portion of the sidewall 12. A strip-shaped guide groove 13 is formed on the outer surface of the outer side wall 123 in a direction parallel to the strip-shaped groove 121. The length of the guide groove 13 is equivalent to the length of the strip-shaped groove 121. A first positioning portion 15 and a second positioning portion 17 are recessed in the guiding groove 13 for positioning the release member 50 mounted on the sidewall 12 of the base 10. In the embodiment, the first positioning portion 15 and the second positioning portion 17 are respectively spaced apart from the two hemispherical limiting grooves recessed at the two ends of the guiding groove 13 .

所述電路板30大致呈矩形板狀,其裝設於所述基體10上臨近該基體10之條形凹槽121位置處。所述電路板30上臨近該條形凹槽121之一側裝設有一卡連接器31。 The circuit board 30 has a substantially rectangular plate shape and is disposed on the base body 10 adjacent to the strip-shaped recess 121 of the base body 10. A card connector 31 is mounted on one side of the circuit board 30 adjacent to the strip-shaped recess 121.

所述二夾持部40相對裝設於所述電路板30上之卡連接器31之兩側,並與所述卡連接器31及電路板30共同圍成一卡裝設部33,該卡裝設部33具有一用於插入晶片卡90之且朝向條形凹槽121之開口(圖未標),以便晶片卡90容置於該卡裝設部33內。 The two clamping portions 40 are opposite to the two sides of the card connector 31 mounted on the circuit board 30, and together with the card connector 31 and the circuit board 30, form a card mounting portion 33, the card The mounting portion 33 has an opening (not shown) for inserting the wafer card 90 and facing the strip-shaped recess 121 so that the wafer card 90 is housed in the card mounting portion 33.

請參閱圖2,所述釋放件50為一橫截面大致呈“U”形之擋滑塊,其沿一與該晶片卡90滑動方向相垂直之方向滑動地裝設於所述基體10之側壁12之外側壁123上且位於所述開口前方位置處,用以將該晶片卡90卡鎖或解鎖於該卡裝設部33內。所述釋放件50包括一卡合壁51及一與該卡合壁51相對平行間隔設置之安裝壁53,該卡合壁51與安裝壁53之間圍成一大致矩形槽狀之裝配空間55。所述卡合壁51與安裝壁53之間間隔之距離與所述基體10之外側壁123之厚度尺寸相當,該安裝壁53之厚度與所述條形凹槽121之寬度尺寸相當,以使得該釋放件50可被相對滑動地裝設於該外側壁123上,該釋放件50之安裝壁53被可滑動地裝夾於該條形凹槽121內。所述卡合壁51之朝向該安裝壁53一側之內表面上對應於所述導向槽13內之第一定位部15或第 二定位部17間隔凸設有二球形凸塊52,以使該釋放件50裝設於該基體10之側壁12上時可沿該導向槽13滑動,並分別定位於該導向槽13之第一定位部15及第二定位部17位置處。 Referring to FIG. 2, the release member 50 is a substantially U-shaped block slider having a substantially U-shaped cross section, and is slidably mounted on the side wall of the base 10 in a direction perpendicular to the sliding direction of the wafer card 90. The outer side wall 123 is located at a position in front of the opening for latching or unlocking the wafer card 90 into the card mounting portion 33. The release member 50 includes an engaging wall 51 and a mounting wall 53 spaced apart from the engaging wall 51. The engaging wall 51 and the mounting wall 53 define a substantially rectangular groove-shaped assembly space 55. . The distance between the engaging wall 51 and the mounting wall 53 is equivalent to the thickness of the outer wall 123 of the base 10. The thickness of the mounting wall 53 is equivalent to the width of the strip groove 121 so that The release member 50 is slidably mounted on the outer side wall 123, and the mounting wall 53 of the release member 50 is slidably mounted in the strip-shaped recess 121. The inner surface of the engaging wall 51 facing the mounting wall 53 corresponds to the first positioning portion 15 or the first in the guiding groove 13 The two positioning portions 17 are respectively provided with two spherical protrusions 52 so as to be slidable along the guiding groove 13 when the releasing member 50 is mounted on the side wall 12 of the base body 10, and are respectively positioned at the first of the guiding grooves 13 The positioning portion 15 and the second positioning portion 17 are located.

請一併參閱圖3及圖4,裝入所述晶片卡90時,首先,用手撥動所述釋放件50,使該釋放件50沿條形凹槽121及外側壁123上之導向槽13朝遠離該卡裝設部33之一側滑移直至定位於該導向槽13之第一定位部15處。此時,所述釋放件50之安裝壁51上之二球形凸塊52分別對應卡合於該導向槽13之第一定位部15之二半球形限位凹槽內。接下來,將所述晶片卡90滑入所述二夾持部40與卡連接器31圍成之卡裝設部33內;最後,撥動所述釋放件50朝向該卡裝設部33方向滑移直至定位於該導向槽13之第二定位部17處,並擋抵於所述晶片卡90之前方以防止晶片卡90脫出,即完成所述晶片卡90之安裝。此時,所述釋放件50之安裝壁51上之二球形凸塊52分別對應卡合於該導向槽13之第二定位部17之二半球形限位凹槽內。當需要取出所述晶片卡90時,只需反向撥動所述釋放件50,使該釋放件50沿條形凹槽12朝遠離該卡裝設部33之一側滑移直至定位於該導向槽13之第一定位部15處,即可輕易取出晶片卡90。 Referring to FIG. 3 and FIG. 4 together, when loading the wafer card 90, firstly, the release member 50 is manually moved to make the release member 50 along the strip groove 121 and the guide groove on the outer sidewall 123. 13 is slid away from one side of the card mounting portion 33 until it is positioned at the first positioning portion 15 of the guiding groove 13. At this time, the two spherical protrusions 52 on the mounting wall 51 of the release member 50 respectively correspond to the two hemispherical limiting grooves of the first positioning portion 15 of the guiding groove 13 . Next, the wafer card 90 is slid into the card mounting portion 33 surrounded by the two clamping portions 40 and the card connector 31; finally, the release member 50 is swung toward the card mounting portion 33. Sliding until it is positioned at the second positioning portion 17 of the guiding groove 13 and blocking against the front of the wafer card 90 to prevent the wafer card 90 from coming off, that is, the mounting of the wafer card 90 is completed. At this time, the two spherical protrusions 52 on the mounting wall 51 of the release member 50 respectively correspond to the two hemispherical limiting grooves of the second positioning portion 17 of the guiding groove 13 . When the wafer card 90 needs to be taken out, the release member 50 only needs to be reversely toggled, so that the release member 50 slides along the strip groove 12 away from one side of the card mounting portion 33 until it is positioned at the side. At the first positioning portion 15 of the guide groove 13, the wafer card 90 can be easily taken out.

可以理解,所述釋放件50之安裝壁51上之球形凸塊52並不限於本實施例中之二個,其亦可以根據實際需要增加或減少;同時,所述導向槽13內之第一定位部15及第二定位部17上之半球形限位凹槽亦不限於本實施例中之二個,其對應於所述釋放件50之安裝壁51上之球形凸塊52可根據實際需要增加或減少。 It can be understood that the spherical protrusion 52 on the mounting wall 51 of the release member 50 is not limited to two in the embodiment, and may be increased or decreased according to actual needs; meanwhile, the first in the guiding slot 13 The hemispherical limiting groove on the positioning portion 15 and the second positioning portion 17 is not limited to two in the embodiment, and the spherical projection 52 corresponding to the mounting wall 51 of the release member 50 can be according to actual needs. increase or decrease.

本發明所述晶片卡固持裝置100結構簡單,其藉由於所述二夾持部40與卡連接器31圍成之卡裝設部33前方設置一釋放件50,輕易地實現了晶片卡90之安裝及拆卸,同時使得晶片卡90之安裝及更換過程變得更加簡單,容易操 作。 The wafer card holder device 100 of the present invention has a simple structure, and the wafer card 90 is easily realized by providing a release member 50 in front of the card mounting portion 33 surrounded by the two clamping portions 40 and the card connector 31. Installation and disassembly, at the same time, making the process of installing and replacing the wafer card 90 easier and easier to operate Work.

綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,本發明之範圍並不以上述實施例為限,舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and equivalent modifications or variations made by those skilled in the art in light of the spirit of the present invention are It should be covered by the following patent application.

100‧‧‧晶片卡固持裝置 100‧‧‧ wafer card holder

10‧‧‧基體 10‧‧‧ base

12‧‧‧側壁 12‧‧‧ side wall

121‧‧‧條形凹槽 121‧‧‧ strip groove

123‧‧‧外側壁 123‧‧‧Outer side wall

125‧‧‧內側壁 125‧‧‧ inner side wall

13‧‧‧導向槽 13‧‧‧ Guide groove

15‧‧‧第一定位部 15‧‧‧First Positioning Department

17‧‧‧第二定位部 17‧‧‧Second Positioning Department

30‧‧‧電路板 30‧‧‧ boards

31‧‧‧卡連接器 31‧‧‧ card connector

33‧‧‧卡裝設部 33‧‧‧Card Installation Department

40‧‧‧夾持部 40‧‧‧Clamping Department

50‧‧‧釋放件 50‧‧‧ release

90‧‧‧晶片卡 90‧‧‧wafer card

Claims (7)

一種晶片卡固持裝置,其包括一基體及一形成於該基體上之用於滑動裝設一晶片卡之卡裝設部,該卡裝設部具有一用以插入晶片卡之開口;其改良在於:所述晶片卡固持裝置還包括一釋放件,其滑動地裝設於所述基體上且可分別定位於所述開口前方或一側,用以將該晶片卡鎖持或解鎖於該卡裝設部內;所述基體具有一側壁,其上向下凹設形成一條形凹槽,並對應地於該側壁上形成一外側壁及一與該外側壁相對平行之內側壁;所述釋放件為一橫截面呈“U”形之擋滑塊,其可相對滑動地裝設於所述基體之外側壁上且位於所述開口前方位置處。 A wafer card holding device includes a base body and a card mounting portion formed on the base body for slidingly mounting a wafer card, the card mounting portion having an opening for inserting a wafer card; The chip card holding device further includes a release member slidably mounted on the base body and respectively positioned in front of or on one side of the opening for locking or unlocking the wafer card to the card a base portion having a side wall recessed downwardly to form a strip-shaped recess, and correspondingly forming an outer side wall and an inner side wall parallel to the outer side wall; the release member is A blocking slider having a "U" shape in cross section is slidably mounted on the outer side wall of the base body and located at a position in front of the opening. 如申請專利範圍第1項所述之晶片卡固持裝置,其中所述外側壁之外表面上沿平行於該條形凹槽方向凹設有一條形導向槽,該導向槽內設有一第一定位部及一第二定位部;所述釋放件包括一卡合壁及一與該卡合壁相對平行間隔設置之安裝壁,該安裝壁被可滑動地裝夾於所述條形凹槽內;所述卡合壁之內表面上間隔凸設有至少一球形凸塊,以使該釋放件可定位於導向槽之第一定位部及第二定位部位置處。 The wafer card holding device of claim 1, wherein the outer surface of the outer wall is concavely disposed in a direction parallel to the strip groove, and the first groove is disposed in the guiding groove. And a second positioning portion; the release member includes a locking wall and a mounting wall spaced apart from the locking wall, the mounting wall is slidably mounted in the strip groove; At least one spherical protrusion is protruded from the inner surface of the engaging wall so that the releasing member can be positioned at the positions of the first positioning portion and the second positioning portion of the guiding groove. 如申請專利範圍第2項所述之晶片卡固持裝置,其中所述晶片卡固持裝置還包括一電路板、一卡連接器及二夾持部,所述電路板裝設於基體上臨近條形凹槽位置處;所述卡連接器裝設於電路板上,所述二夾持部相對裝設電路板上並位於該卡連接器之兩側並與該卡連接器圍成所述卡裝設部。 The wafer card holding device of claim 2, wherein the chip card holding device further comprises a circuit board, a card connector and two clamping portions, the circuit board is mounted on the base body adjacent to the strip shape The card connector is mounted on the circuit board, and the two clamping portions are opposite to the mounting circuit board and are located on both sides of the card connector and enclose the card connector with the card connector. Department. 如申請專利範圍第2項所述之晶片卡固持裝置,其中所述導向槽之長度與該條形凹槽之長度相當。 The wafer card holding device of claim 2, wherein the length of the guiding groove is equal to the length of the strip groove. 如申請專利範圍第3項所述之晶片卡固持裝置,其中所述第一定位部及一 第二定位部為分別間隔凹設於該導向槽兩端之二半球形限位凹槽。 The wafer card holding device of claim 3, wherein the first positioning portion and the first positioning portion The second positioning portion is respectively spaced apart from the two hemispherical limiting grooves recessed at the two ends of the guiding groove. 如申請專利範圍第3項所述之晶片卡固持裝置,其中所述基體呈矩形框體狀,其可以為一行動電話之機殼。 The wafer card holding device of claim 3, wherein the base body has a rectangular frame shape, which may be a casing of a mobile phone. 如申請專利範圍第3項所述之晶片卡固持裝置,其中所述卡合壁與安裝壁之間間隔之距離與所述基體之外側壁之厚度尺寸相當,以使得該釋放件可被相對滑動地裝設於該外側壁上。 The wafer card holding device of claim 3, wherein a distance between the engaging wall and the mounting wall is equal to a thickness of the outer side wall of the base body, so that the release member can be relatively slid The ground is mounted on the outer side wall.
TW97138868A 2008-10-09 2008-10-09 Chip card holding structure TWI413310B (en)

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CN1290051C (en) * 2002-07-03 2006-12-13 山一电机株式会社 Card connector

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1290051C (en) * 2002-07-03 2006-12-13 山一电机株式会社 Card connector

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