TWI446777B - Chip card holding structure - Google Patents
Chip card holding structure Download PDFInfo
- Publication number
- TWI446777B TWI446777B TW97139906A TW97139906A TWI446777B TW I446777 B TWI446777 B TW I446777B TW 97139906 A TW97139906 A TW 97139906A TW 97139906 A TW97139906 A TW 97139906A TW I446777 B TWI446777 B TW I446777B
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- TW
- Taiwan
- Prior art keywords
- card
- wafer
- wafer card
- holding device
- mounting surface
- Prior art date
Links
- 230000007246 mechanism Effects 0.000 claims description 16
- 238000005266 casting Methods 0.000 claims description 2
- 238000001746 injection moulding Methods 0.000 claims description 2
- 238000009434 installation Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- Telephone Set Structure (AREA)
Description
本發明涉及一種用於容置並固持晶片卡之固持裝置,特別涉及一種用於攜帶型電子裝置上之晶片卡固持裝置。 The present invention relates to a holding device for accommodating and holding a wafer card, and more particularly to a wafer card holding device for a portable electronic device.
隨著通訊事業之迅速發展,行動電話、個人數位助理(personal digital assistant,PDA)等各種攜帶型電子裝置之使用越來越普及。隨著該等攜帶型電子裝置產品之功能日益多元化,應用於該等攜帶型裝置上之用於存儲記憶之晶片卡亦越來越多,例如SD卡(Secure Digital Memory Card)、CF卡(Compact Flash Card)、SIM卡(Subscriber Identification Module Card,用戶識別卡)等。其中,SIM卡是一種裝有IC晶片之塑膠卡片,其具有記錄個人用戶號碼及通訊錄等功能,藉由更換SIM卡,其可供多個用戶使用。 With the rapid development of the communication industry, the use of various portable electronic devices such as mobile phones and personal digital assistants (PDAs) has become more and more popular. As the functions of these portable electronic device products become increasingly diversified, more and more wafer cards for storing memories are applied to such portable devices, such as an SD card (Secure Digital Memory Card) and a CF card ( Compact Flash Card), SIM card (Subscriber Identification Module Card), etc. The SIM card is a plastic card equipped with an IC chip, which has the functions of recording a personal user number and an address book, and can be used by a plurality of users by replacing the SIM card.
習知晶片卡一般容置於攜帶型電子裝置之一卡槽內。當該晶片卡容置於該卡槽內時,該晶片卡上之積體電路藉由一連接器與該攜帶型電子裝置之電路板連接。當需要更換該晶片卡時,使用者使用手指直接按住該晶片卡暴露之部分,並向該卡槽外拖動,藉由使用者手指與該晶片卡之間之摩擦力使該晶片卡隨使用者手指運動,直至晶片卡由該卡槽內滑出。 Conventional wafer cards are generally housed in a card slot of a portable electronic device. When the chip card is received in the card slot, the integrated circuit on the chip card is connected to the circuit board of the portable electronic device by a connector. When the wafer card needs to be replaced, the user directly presses the exposed portion of the wafer card with a finger and drags the card card outside, and the wafer card is driven by the friction between the user's finger and the wafer card. The user's finger moves until the wafer card slides out of the card slot.
然,於實際使用中,由於晶片卡暴露於卡槽外之部分一般較小, 直接按壓外露部分操作較為困難;有些型號之晶片卡甚至全部容置於卡槽內。故,使用者難以藉由直接按壓該晶片卡之方式帶動該晶片卡由卡槽滑出。 However, in actual use, since the wafer card is generally exposed to the outside of the card slot, the portion is generally small. It is more difficult to directly press the exposed part; some models of the chip card are even placed in the card slot. Therefore, it is difficult for the user to drive the wafer card to slide out of the card slot by directly pressing the wafer card.
有鑒於以上缺陷,有必要提供一種易於更換晶片卡且可有效容置、固持晶片卡之晶片卡固持裝置。 In view of the above drawbacks, it is necessary to provide a wafer card holding device that can easily replace a wafer card and can effectively accommodate and hold the wafer card.
一種晶片卡固持裝置,其包括一基體及二卡持機構;該基體包括一安裝面,該二卡持機構相對設置於基體之安裝面上並與該安裝面共同形成一用於容置一晶片卡之卡容置空間;所述晶片卡固持裝置還包括一彈性件,其凸設於基體之安裝面上並部分收容於該卡容置空間內,以將晶片卡彈性抵持於該卡容置空間內。 A wafer card holding device includes a base body and two latching mechanisms; the base body includes a mounting surface, and the two latching mechanisms are oppositely disposed on the mounting surface of the base body and form a chip for receiving a chip together with the mounting surface The card holder accommodating device further includes an elastic member protruding from the mounting surface of the base body and partially received in the card accommodating space to elastically resist the wafer card to the card accommodating space Set the space.
相較於習知技術,所述晶片卡固持裝置結構簡單,其藉由於晶片卡固持裝置之一止擋壁上設置一彈性件,輕易地實現了晶片卡之安裝及拆卸,同時使得晶片卡之安裝及更換過程變得更加簡單,容易操作。 Compared with the prior art, the wafer card holding device has a simple structure, and the mounting and dismounting of the chip card is easily realized by providing an elastic member on one of the stopper walls of the wafer card holding device, and at the same time, the wafer card is The installation and replacement process is simpler and easier to operate.
30‧‧‧晶片卡固持裝置 30‧‧‧ wafer card holder
31‧‧‧基體 31‧‧‧ base
311‧‧‧安裝面 311‧‧‧Installation surface
33‧‧‧卡持機構 33‧‧‧ card holding institutions
331‧‧‧止擋壁 331‧‧‧stop wall
335‧‧‧防脫塊 335‧‧‧Anti-blocking
35‧‧‧卡容置空間 35‧‧‧Card accommodating space
37‧‧‧彈性件 37‧‧‧Flexible parts
40‧‧‧卡連接器 40‧‧‧ card connector
50‧‧‧晶片卡 50‧‧‧wafer card
圖1為本發明晶片卡固持裝置較佳實施例之立體示意圖;圖2為將晶片卡安裝至圖1所示晶片卡固持裝置內或從該晶片卡固持裝置內取出晶片卡時之操作示意圖;圖3為晶片卡完全安裝於圖1所示晶片卡固持裝置內之立體示意圖。 1 is a perspective view of a preferred embodiment of a wafer card holding device of the present invention; and FIG. 2 is a schematic view showing the operation of mounting a wafer card into or removing a wafer card from the wafer card holding device of FIG. 3 is a perspective view showing the wafer card completely mounted in the wafer card holding device shown in FIG. 1.
本發明之較佳實施例公開一種晶片卡固持裝置,其適用於行動電 話、個人數位助理(personal digital assistant,PDA)等攜帶型電子裝置。於本實施例中,以應用於一行動電話(圖未示)為例說明此晶片卡固持裝置。 A preferred embodiment of the present invention discloses a wafer card holding device suitable for use in mobile power Portable electronic devices such as personal digital assistants (PDAs). In the present embodiment, the wafer card holding device is described by taking a mobile phone (not shown) as an example.
請參閱圖1,本發明較佳實施例之晶片卡固持裝置30包括一基體31、二卡持機構33及一彈性件37。所述基體31大致呈矩形板狀,其可以為一行動電話之殼體。所述基體31包括一安裝面311。 Referring to FIG. 1 , a wafer card holding device 30 according to a preferred embodiment of the present invention includes a base 31 , two latching mechanisms 33 , and an elastic member 37 . The base body 31 has a substantially rectangular plate shape, which may be a housing of a mobile phone. The base 31 includes a mounting surface 311.
所述二卡持機構33相對設置於基體31之安裝面311上,並與該安裝面311共同形成一用於容置一晶片卡50之卡容置空間35。於本實施例中,所述每一卡持機構33包括一止擋壁331及二防脫塊335,該止擋壁331大致呈“U”形壁狀,其相對朝向地凸設於基體31之安裝面311上。所述每一止擋壁331之兩端遠離該安裝面311之一側分別朝向該卡容置空間35方向延伸形成一防脫塊335,該防脫塊335與安裝面311之間之距離與晶片卡50之厚度尺寸相當。所述卡容置空間35內之安裝面311上設有一晶片卡連接器40,以用於與裝設於該卡容置空間35內之晶片卡50電性連接。 The two holding mechanisms 33 are disposed on the mounting surface 311 of the base 31, and together with the mounting surface 311, form a card accommodating space 35 for accommodating a wafer card 50. In this embodiment, each of the latching mechanisms 33 includes a stop wall 331 and two anti-drop blocks 335. The stop wall 331 has a substantially U-shaped wall shape and protrudes from the base body 31 in a facing orientation. On the mounting surface 311. The two ends of each of the stop walls 331 extend away from the side of the mounting surface 311 toward the card accommodating space 35 to form a tamper-proof block 335. The distance between the detachment preventing block 335 and the mounting surface 311 is The wafer card 50 has a comparable thickness. A chip card connector 40 is disposed on the mounting surface 311 of the card accommodating space 35 for electrically connecting to the chip card 50 mounted in the card accommodating space 35.
所述彈性件37為一弧形舌狀之彈片,其凸設於一卡持機構33之止擋壁331之端部,並部分收容於該卡容置空間35內,以將晶片卡50彈性抵持於該卡容置空間35內。 The elastic member 37 is an arcuate tongue-shaped elastic piece protruding from the end of the retaining wall 331 of the latching mechanism 33 and partially received in the card accommodating space 35 to elasticize the wafer card 50. Resist in the card accommodation space 35.
請一併參閱圖2及圖3,安裝所述晶片卡50時,將所述晶片卡50之一側朝向該彈性件37端插入並抵觸於該彈性件37上,朝彈性件37方向施力於晶片卡50上,推動晶片卡50抵壓該彈性件37發生彈性形變,直至該晶片卡50被完全收容於所述卡容置空間35內。所述晶片卡50被裝設於卡容置空間35內後,彈性件37彈性抵持於該晶片卡50上,以防止該晶片卡50鬆動。所述防脫塊335卡抵於該晶 片卡50四角之上方,以防止該晶片卡50脫出。當需要取出所述晶片卡50時,朝向彈性件37方向施力,推壓該彈性件37朝遠離該卡容置空間35方向運動,使該晶片卡50朝向彈性件37方向移動直至該晶片卡50之遠離彈性件37一側可被掀起,同時用手指將該晶片卡50之遠離該彈性件37之一側相對該彈性件37向上掀起,即可取出所述晶片卡50。 Referring to FIG. 2 and FIG. 3, when the wafer card 50 is mounted, one side of the wafer card 50 is inserted into the elastic member 37 toward the end of the elastic member 37, and is biased toward the elastic member 37. On the wafer card 50, the wafer card 50 is pushed to press the elastic member 37 to be elastically deformed until the wafer card 50 is completely received in the card housing space 35. After the wafer card 50 is installed in the card accommodating space 35, the elastic member 37 elastically resists the wafer card 50 to prevent the wafer card 50 from being loosened. The anti-deblocking block 335 is stuck to the crystal Above the four corners of the card 50, the wafer card 50 is prevented from coming out. When the wafer card 50 needs to be taken out, the force is applied toward the elastic member 37, and the elastic member 37 is pushed to move away from the card accommodating space 35, so that the wafer card 50 is moved toward the elastic member 37 until the wafer card is moved. The wafer card 50 can be taken out by pulling up the side of the elastic member 37 away from the side of the elastic member 37 with a finger.
可以理解,所述卡持機構33可藉由衝壓、鑄造、射出成型等方法與基體31一體成型製成。 It can be understood that the holding mechanism 33 can be integrally formed with the base 31 by means of stamping, casting, injection molding or the like.
可以理解,所述卡持機構33亦不限於由本實施例中之“U”形止擋壁331,其亦可以為由二大致“L”形之止擋壁間隔設置形成。 It can be understood that the holding mechanism 33 is not limited to the "U" shaped stop wall 331 in the embodiment, and may be formed by two stop walls of a substantially "L" shape.
可以理解,所述彈性件37亦可以直接凸設於所述基體31之安裝面上,並部分收容於該卡容置空間35內。 It can be understood that the elastic member 37 can be directly protruded from the mounting surface of the base 31 and partially received in the card accommodating space 35.
所述晶片卡固持裝置30結構簡單,其藉由於一止擋壁331上設置一彈性件37,輕易地實現了晶片卡50之安裝及拆卸,使晶片卡50之安裝及更換過程變得更加簡單,容易操作。 The wafer card holding device 30 has a simple structure, and the mounting and dismounting of the wafer card 50 is easily realized by providing an elastic member 37 on a stopper wall 331, thereby simplifying the process of installing and replacing the wafer card 50. Easy to operate.
綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,本發明之範圍並不以上述實施例為限,舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and equivalent modifications or variations made by those skilled in the art in light of the spirit of the present invention are It should be covered by the following patent application.
30‧‧‧晶片卡固持裝置 30‧‧‧ wafer card holder
31‧‧‧基體 31‧‧‧ base
311‧‧‧安裝面 311‧‧‧Installation surface
33‧‧‧卡持機構 33‧‧‧ card holding institutions
331‧‧‧止擋壁 331‧‧‧stop wall
335‧‧‧防脫塊 335‧‧‧Anti-blocking
35‧‧‧卡容置空間 35‧‧‧Card accommodating space
37‧‧‧彈性件 37‧‧‧Flexible parts
40‧‧‧卡連接器 40‧‧‧ card connector
50‧‧‧晶片卡 50‧‧‧wafer card
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97139906A TWI446777B (en) | 2008-10-17 | 2008-10-17 | Chip card holding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97139906A TWI446777B (en) | 2008-10-17 | 2008-10-17 | Chip card holding structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201018174A TW201018174A (en) | 2010-05-01 |
| TWI446777B true TWI446777B (en) | 2014-07-21 |
Family
ID=44831107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97139906A TWI446777B (en) | 2008-10-17 | 2008-10-17 | Chip card holding structure |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI446777B (en) |
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2008
- 2008-10-17 TW TW97139906A patent/TWI446777B/en not_active IP Right Cessation
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| Publication number | Publication date |
|---|---|
| TW201018174A (en) | 2010-05-01 |
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