TWI404885B - Led lamp assembly - Google Patents

Abstract

An LED lamp assembly, includes an upper plate, a lower plate and a plurality of light emitting units sandwiched between the two plates. Each light emitting unit includes a heat sink having two opposite ends respectively abutting against the two plates and a LED module embedded in a lower end thereof. The lower plate defines a plurality of through holes respectively in alignment with the LED modules for allowing light emitted by the LED modules traveling therethrough.

Description

Light-emitting diode lighting device

The invention relates to a lighting device, in particular to a lighting diode lighting device.

As a new generation of light source, the light-emitting diode can not replace the traditional incandescent lamp on a large scale. However, it has the advantages of long working life, energy saving and environmental protection, and is generally favored by the market. Moreover, the module composed of the light-emitting diode can generate a high-power, high-brightness light source, and thus will widely and revolutionarily replace the existing light source such as a conventional incandescent lamp, thereby becoming a main light source that meets the theme of energy conservation and environmental protection.

As the power and brightness of the LED or its module increase, the heat generated is also increased. If the heating problem of the LED is not properly solved, the working life of the LED lamp will be Seriously affected. Therefore, a heat sink is usually installed on the light emitting diode module to dissipate heat, and the diode module is uniformly applied to the bottom of a heat sink as a light source. However, such a luminaire uses a single heat sink to dissipate all of the illuminating diode modules at the same time. It is very easy to cause uneven heat dissipation due to the different arrangement of the illuminating diode modules, and it is difficult to ensure all the illuminating diodes. The heat generated during the operation of the body module can be dissipated in time, resulting in a shortened life of the individual LED modules. Or burned out, etc.

In view of the above, it is necessary to provide a light-emitting diode lighting device for separately radiating each of the light-emitting diode modules.

A light-emitting diode lighting device includes an upper substrate, a lower substrate, and a plurality of light-emitting units sandwiched between the upper substrate and the lower substrate, each of the light-emitting units including a heat sink and an upper surface respectively abutting the upper substrate and the lower substrate The light emitting diode module on the bottom surface of the heat sink has a plurality of through holes corresponding to the light emitting diode modules respectively for the illumination light generated by the light emitting diode module to pass.

The illumination light generated by the light emitting diode module of the light emitting unit of the light emitting diode illumination device illuminates under the light emitting diode illumination device through the through hole of the lower substrate, and the heat generated by each of the light emitting diode modules is The heat is dissipated by a separate heat sink. Therefore, the heat generated by the individual light-emitting diode modules cannot be dissipated in time due to uneven heat dissipation, which affects the overall stability.

10‧‧‧Upper and lower substrates

12‧‧‧Folding

14‧‧‧through hole

16‧‧‧Perforation

20‧‧‧Lighting unit

22‧‧‧ radiator

222‧‧‧thermal column

2220‧‧‧Receipt Department

2222‧‧‧Steps

2224‧‧‧ recessed part

2226‧‧‧Arch

2228‧‧‧With holes

224‧‧‧heat plate

2240‧‧‧ fixed cylinder

2242‧‧‧Fixed holes

226‧‧‧ Heat sink

24‧‧‧Lighting diode module

242‧‧‧Circuit board

244‧‧‧Lighting diode components

26‧‧‧Light cover

262‧‧‧

28‧‧‧Fixed ring

282‧‧‧ protruding parts

284‧‧‧through hole

30‧‧‧Top box

40‧‧‧Installation combination

42‧‧‧Connecting parts

44‧‧‧ hanging wire

100‧‧‧ rods

1 is a perspective assembled view of a preferred embodiment of a light-emitting diode lighting device of the present invention.

Figure 2 is an inverted view of Figure 1.

3 is an exploded perspective view of the light-emitting diode lighting device of FIG. 1.

Figure 4 is an inverted view of Figure 3.

Figure 5 is an enlarged exploded view of the heat sink of Figure 4.

Referring to FIGS. 1 to 4, a light-emitting diode lighting device in a preferred embodiment of the present invention is mainly used indoors and is installed in a room by hanging. The illuminating device includes a plurality of illuminating units 20 spaced apart from each other, a lower substrate 10, a plurality of illuminating units 20 interposed between the upper and lower substrates 10, a top box 30 mounted on the upper substrate 10, and an upper substrate. 10 Connect and suspend the mounting assembly 40 of the light-emitting diode lighting device.

The upper and lower substrates 10 are flat plates having the same shape and structure, and each of the upper and lower substrates 10 has a triangular shape, but the corners thereof are rounded, and the three sides are curved inwardly in an arc shape. In other embodiments, The upper and lower substrates 10 may be in various shapes including rectangles, circles, and other polygons. The peripheral edges of the upper and lower substrates 10 are vertically extended with a hem 12 to passivate the edge of the substrate 10 and to strengthen the strength thereof. The lower substrate 10 is provided with a plurality of through holes 14 through which the illumination light of the light emitting unit 20 passes, and the upper and lower substrates 10 are further provided with a plurality of upper and lower substrates 10 for fixing the upper and lower substrates 10 Perforation 16. The through holes 14 are respectively corresponding to the light emitting units 20 and can be distributed on the lower substrate 10 in a specific manner. In this embodiment, the two through holes 14 are spaced apart from each other at the center to the corner of the lower substrate 10. . The through holes 16 are evenly distributed on the upper and lower substrates 10 to cooperate with the rod 100 to firmly connect the upper and lower substrates 10, and two through holes 16 are disposed on opposite sides of each through hole 14 so that The rod 100 is inserted into the light-emitting unit 20 while being matched with the through hole 16 , and the two through holes 16 on opposite sides of each of the through holes 14 are located on the line connecting the center of the upper and lower substrates 10 to one of the two substrates 10 . In order to strengthen the connection between the upper and lower substrates 10, a through hole 16 is formed in the middle of the three edges of the substrate 10.

The rod member 100 includes a rod body (not labeled) disposed between the upper and lower substrates 10 and two heads formed at the ends of the rod body and respectively stuck on the top surface of the upper substrate 10 and the bottom surface of the lower substrate 10 (not Reference numeral), wherein at least one of the heads can be coupled to the rod body by screwing.

As shown in FIG. 5 , the light-emitting unit 20 includes a heat sink 22 , a light-emitting diode module 24 embedded in the center of the bottom of the heat sink 22 , and a light cover 26 covering the light-emitting diode module 24 . The lamp cover 26 is secured to one of the retaining rings 28 on the heat sink 22. The heat sink 22 is formed of a metal material having good thermal conductivity, such as aluminum, copper, etc., and includes a heat conducting column 222, four heat radiating plates 224 extending outwardly from the outer peripheral surface of the heat conducting column 222, and a heat conducting column 222. The outer peripheral surface extends uniformly outwardly from the plurality of fins 226. The heat conducting column 222 has a cylindrical shape, and a bottom portion of the heat receiving portion 222 is recessed inwardly to form a receiving portion 2220. The top surface of the receiving portion 2220 is flat to cover the light emitting diode module 24. The annular edge of the accommodating portion 2220 vertically protrudes downwardly from the hollow inner wall of the corresponding receiving portion of the heat conducting column 222, and an annular step portion 2222 is formed. The bottom edge of the bottom portion of the step portion 2222 is recessed to form an annular concave portion. 2224. The joint between the heat conducting column 222 and the heat dissipation plate 224 is outwardly formed in a circular arc shape, so that the inner wall of the heat conducting column 22 forms a bulging portion 2226 outwardly corresponding to the arcuate protrusion below the step portion 2222. A matching hole 2228 is defined in the bottom surface of the step portion 2222 corresponding to the arch portion 2226. A fixing cylinder 2240 is formed at the end of each of the heat dissipation plates 224. The fixing cylinder 2240 is provided with a vertical hole and a fixing hole 2242 for the rod 100 to pass through. The fins 226 extend radially outward from the outer circumferential surface of the heat conducting post 222 and are symmetrically distributed about the center of the heat conducting post 222.

The LED module 24 has a circular shape and can be accommodated in the heat conducting column 222. The accommodating portion 2220 is disposed on the top surface of the accommodating portion 2220. The illuminating diode module 24 includes a circular circuit board 242 attached to the top surface of the accommodating portion 2220 and mounted on the circuit board 242. Light-emitting diode element 244.

The lamp cover 26 is a cover body having a downward semi-circular protrusion, and a top end edge thereof extends horizontally with a circular joint edge 262. The fixing ring 28 has a circular shape, and a four-projecting portion 282 is protruded outwardly from the outer peripheral edge. The protruding portion 282 defines a through hole 284 corresponding to the matching hole 2228 of the heat-conducting column 222.

When the light-emitting unit 20 is in the assembled state, the LED module 24 is received in the receiving portion 2220 of the heat-conducting column 222 and is disposed on the top surface of the receiving portion 2220; the bonding edge 262 of the lamp cover 26 The bottom surface of the cover edge 262 of the lamp cover 26 is flush with the bottom surface of the step portion 2222; finally, the fixed ring 28 is pressed against the bottom surface of the joint edge 262 and the step. The bottom surface of the portion 2222 is coplanar on the annular surface, and the protruding portions 282 of the fixing ring 28 are respectively received in the arching portions 2226 of the inner wall of the heat conducting column 222; finally, the screws 200 pass through the through holes of the fixing ring 28. The 284 is engaged with the fitting hole 2228 of the bottom surface of the step portion 2222 to fix the lamp cover 26. The lamp cover 26 mounted on the heat-conducting column 222 receiving portion 2220 has a semi-spherical shape and protrudes downward from the bottom end of the heat-conducting column 222.

Referring to FIG. 3, the top box 30 has a flat triangular prism shape and is mounted on the top surface of the upper substrate 10 to accommodate electronic components such as an electronic rectifier and a control circuit.

The mounting assembly 40 includes a connector 42 mounted to the ceiling and a plurality of suspension wires 44 extending downwardly from the connector 42 to suspend the upper and lower substrates 10.

When the above-mentioned light-emitting diode lighting device is in an assembled state, the light-emitting unit 20 Between the upper and lower substrates 10, respectively, and the two ends of the heat sink 22 of the light-emitting unit 20 respectively abut the upper and lower substrates 10, and the heat-conducting column 222, the heat-dissipating plate 224 and the heat sink 226 of the heat sink 22 are both upper and lower. The lower substrate 10 is vertical, and the lamp cover 26 of each of the light emitting units 20 is exposed downwardly through the through hole 14 of the lower substrate 10 to be exposed below the lower substrate 10. The rods 100 are respectively engaged with the through holes 16 corresponding to the upper and lower substrates 10, and the rods 100 are disposed on the corresponding sides of the through holes 14 and are disposed in the fixing holes 2242 of the two fixing cylinders 2240 of the light emitting unit 20. Thereby, the upper and lower substrates 10 and the light-emitting units 20 interposed in the upper and lower substrates 10 are fixed. Finally, the heads of the rods 100 located on the top surface of the upper substrate 10 and adjacent to the edges of the upper and lower substrates 10 are respectively connected to the lower ends of the suspension wires 44 to suspend the light-emitting diode lighting device under the ceiling.

When the illuminating diode device is used, the illuminating light generated by the illuminating diode module 24 of the illuminating unit 20 passes through the through hole 14 of the lower substrate 10 to illuminate the underside of the illuminating diode illuminating device, and each illuminating diode The heat generated by the body module 24 is dissipated by a separate heat sink 22. Therefore, the heat generated by the individual light-emitting diode modules 24 cannot be dissipated in time due to uneven heat dissipation, thereby affecting the overall stability.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

10‧‧‧Upper and lower substrates

20‧‧‧Lighting unit

40‧‧‧Installation combination

Claims (9)

An illuminating diode illuminating device comprises an upper substrate, a lower substrate and a plurality of illuminating units interposed between the upper substrate and the lower substrate, wherein the illuminating unit comprises a heat sink respectively abutting the upper substrate and the lower substrate And a light-emitting diode module embedded in the bottom surface of the heat sink, wherein the upper substrate and the lower substrate are triangular shapes in which the corners are rounded, and the three sides are curved inwardly, and the lower substrate is provided with a plurality of corresponding lights respectively. The through hole of the diode module passes through the illumination light generated by the LED module. The illuminating diode illuminating device of claim 1, wherein the heat sink comprises a heat conducting column and a plurality of heat sinks extending from the outer circumferential surface of the heat conducting column, the light emitting diode module being installed at the bottom of the heat conducting column end. The illuminating unit of the illuminating unit of claim 2, wherein the illuminating unit further comprises a lamp cover covering the illuminating diode module, wherein the lamp cover is convex downward and passes through the lower substrate. hole. The illuminating diode illuminating device of claim 3, wherein the bottom end of the heat-conducting column is recessed inwardly to form a receiving portion for accommodating the LED module, and the top surface of the receiving portion corresponds to the heat-conducting column The hollow inner wall of the receiving portion is disposed downward with a step portion surrounding the light emitting diode module and coupled to the top end of the lamp cover. The illuminating unit of the fourth aspect of the invention, wherein the illuminating unit further comprises a fixing ring, the inner edge of the bottom surface of the step portion is recessed to form a concave portion, and the top end of the lamp cover extends outwardly with a joint edge The bonding edge is placed in the concave portion of the step portion and the bottom surface thereof is flush with the bottom surface of the step portion, and the fixing ring is sleeved on The lamp cover is simultaneously pressed on the bottom surface of the step portion and the joint edge. The illuminating diode illuminating device of claim 2, wherein a plurality of heat dissipating plates extend uniformly outwardly from the outer peripheral surface of the heat conducting column, and the end of the heat dissipating plate forms a fixed cylinder, and the fixing cylinder is provided with a rod member. Both ends of the rods are respectively engaged with the upper substrate and the lower substrate. The illuminating diode illuminating device of claim 6, wherein the heat conducting column, the heat dissipating plate and the heat sink are perpendicular to the upper substrate and the lower substrate. The illuminating diode illuminating device of claim 1, wherein the upper substrate and the lower substrate are parallel to each other and the edges of the upper substrate and the lower substrate extend toward each other with a hem. The illuminating diode illuminating device of claim 1, further comprising a mounting assembly comprising a connecting member and a plurality of hanging wires extending downward from the connecting member and combined with the upper substrate.