TWI398600B - Led lamp - Google Patents
Led lamp Download PDFInfo
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- TWI398600B TWI398600B TW97125375A TW97125375A TWI398600B TW I398600 B TWI398600 B TW I398600B TW 97125375 A TW97125375 A TW 97125375A TW 97125375 A TW97125375 A TW 97125375A TW I398600 B TWI398600 B TW I398600B
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Description
本發明涉及一種照明裝置,特別係指一種可靈活更換光源並可有效進行散熱之發光二極體燈具。 The invention relates to a lighting device, in particular to a light-emitting diode lamp which can flexibly replace a light source and can effectively dissipate heat.
隨著發光效率之提升,發光二極體已被越來越廣泛地應用到各個領域當中,如住宅照明燈、工業照明燈及交通指示燈等等。在該等應用當中,通常將大量之發光二極體串接到一塊電路板上組成一發光二極體模組,然後再將該發光二極體模組固定於一殼體上,從而組裝成一完整之發光二極體燈具。 With the improvement of luminous efficiency, light-emitting diodes have been more and more widely used in various fields, such as residential lighting, industrial lighting and traffic lights. In these applications, a large number of light-emitting diodes are usually connected to a circuit board to form a light-emitting diode module, and then the light-emitting diode module is fixed on a casing to be assembled into one. Complete light-emitting diode lamp.
惟,上述所有之發光二極體均被整合在一塊電路板上而形成一體之發光二極體模組,由於發光二極體與電路板間一般採用焊接方式固定,二者間極難拆卸。如若發光二極體模組中部分發光二極體不慎損壞而需進行更換,就只能將這一發光二極體模組從殼體上卸下而整塊替換成一全新之發光二極體模組,導致燈具之維修成本極為高昂。此外,替換下之發光二極體模組由於其損壞之發光二極體無法與電路板分離,導致其不能再被重新利用,而只能作報廢處理。惟,儘管發光二極體模組有部分發光二極體損壞,其還保留有大量可正常工作之發光二極體,如若就此將更換下之整個發光二極體模組廢棄不用將導致完好之發光二極體亦不能再被重新利用,造成極大之浪費。另外,由於傳統之殼體均採用工程塑料等材料製成,其導熱性能不佳,不能有效地將發光二極體 工作時產生之熱量散發出去,導致發光二極體之發光效率受到影響。 However, all of the above-mentioned light-emitting diodes are integrated on one circuit board to form an integrated light-emitting diode module. Since the light-emitting diodes and the circuit board are generally fixed by soldering, the two are extremely difficult to disassemble. If some of the light-emitting diodes in the LED module are inadvertently damaged and need to be replaced, the LED module can only be removed from the housing and replaced with a new LED. Modules result in extremely high maintenance costs for the luminaires. In addition, the replacement LED module cannot be reused due to its damaged LED, which can only be reused, and can only be disposed of. However, although the LED module is partially damaged by the LED, it still retains a large number of working LEDs. If the entire LED module is replaced, the replacement will not result in good condition. Light-emitting diodes can no longer be reused, causing great waste. In addition, since the conventional casings are made of materials such as engineering plastics, their thermal conductivity is not good, and the LEDs cannot be effectively used. The heat generated during operation is dissipated, which causes the luminous efficiency of the light-emitting diode to be affected.
有鑒於此,實有必要提供一種可靈活更換光源並可有效進行散熱之發光二極體燈具。 In view of this, it is necessary to provide a light-emitting diode lamp that can be flexibly replaced with a light source and can effectively dissipate heat.
一種發光二極體燈具,其包括一導熱殼體及複數發光二極體模組,每一發光二極體模組包括一電路板及複數安裝於電路板上之發光二極體,該等發光二極體模組彼此獨立地固定至殼體內以將熱量藉由殼體散發出去,每一發光二極體模組還包括一與電路板相貼合之導熱板,發光二極體模組藉由導熱板固定至殼體內,每一發光二極體模組還包括一固定至導熱板上之導光架,該導光架及導熱板共同將電路板夾置於其間,該導光架包括一開設導光孔之水平之出光部、二分別形成於出光部相對兩側之豎直之側壁及二自側壁向外延伸出之水平之側翼,導光架藉由該二側翼固定至導熱板上。 A light-emitting diode lamp includes a heat-conducting casing and a plurality of light-emitting diode modules, each of the light-emitting diode modules includes a circuit board and a plurality of light-emitting diodes mounted on the circuit board, and the light-emitting diodes The diode modules are fixed to the housing independently of each other to dissipate heat through the housing. Each of the LED modules further includes a heat conducting plate that is attached to the circuit board, and the LED module is borrowed. The light-emitting diode module further includes a light guide frame fixed to the heat-conducting plate, the light guide frame and the heat-conducting plate collectively sandwiching the circuit board therebetween, the light guide frame comprises a horizontal light-emitting portion that defines a light-guiding hole, two vertical side walls formed on opposite sides of the light-emitting portion, and two horizontal side wings extending outward from the side wall, and the light guide frame is fixed to the heat-conducting plate by the two side wings on.
與習知技術相比,本發明之發光二極體燈具採用相互獨立之發光二極體模組固定在殼體內,即使某一發光二極體模組之部分發光二極體損壞,只需單獨更換該損壞之該發光二極體模組即可,而不需將所有之發光二極體模組均替換掉。因此,本發明之發光二極體燈具可有針對性地對其發光二極體模組進行靈活之更換,從而節省了維修成本,並有效地減少了浪費。此外,由於殼體採用熱導性良好之材料製成,其可迅速地將發光二極體產生之熱量散發至周圍之空氣當中,從而確保發光二極體正 常運作。 Compared with the prior art, the LED lamp of the present invention is fixed in the housing by using independent LED modules, even if some of the LEDs of a certain LED module are damaged, only need to be separate. The damaged LED module can be replaced without replacing all of the LED modules. Therefore, the light-emitting diode lamp of the present invention can flexibly replace the light-emitting diode module in a targeted manner, thereby saving maintenance cost and effectively reducing waste. In addition, since the housing is made of a material having good thermal conductivity, it can quickly dissipate the heat generated by the light-emitting diode into the surrounding air, thereby ensuring that the light-emitting diode is positive. Often functioning.
如圖1-2所示,本發明之發光二極體燈具包括一殼體10及二並排地固設於殼體10內之發光二極體模組20。 As shown in FIG. 1-2, the LED lamp of the present invention includes a housing 10 and two LED modules 20 that are fixed in the housing 10 in parallel.
殼體10由熱導性良好之金屬材料製成,如鋁、銅或二者之合金,以便將固定於其中之發光二極體模組20所產生之熱量散發至周圍之空氣中。殼體10包括一矩形之外罩12、二樞接於外罩12底面之懸臂14及複數形成於外罩12底面之鰭片16。外罩12之頂面向下凹陷出一矩形空腔120,其由一平坦之矩形安裝面122及一環狀之內周面124共同圍設而成。該空腔120之容積大於二發光二極體模組20之體積之和,其內部設置一隔板126,以將二發光二極體模組20相互隔開。安裝面122上開設複數螺孔128,其用於供螺絲30螺合(如圖3),以將發光二極體模組20鎖固於殼體10內;內周面124則用於對發光二極體模組20進行定位,以方便將發光二極體模組20安裝於殼體10內。二懸臂14相互平行地設置於靠近外罩12之相對兩端之位置處,每一懸臂14大致呈“U”形,其用於將圖1中所示之發光二極體燈具顛倒地懸置於天花板(圖未示)上,使發光二極體模組20之光線朝向天花板下方射出。鰭片16彼此平行地自外罩12底面向下延伸而出,其用於增大殼體10之散熱面積,以將發光二極體模組20所產生之熱量更快地散發出去。 The casing 10 is made of a metal material having good thermal conductivity, such as aluminum, copper or an alloy of both, in order to dissipate heat generated by the LED module 20 fixed therein to the surrounding air. The housing 10 includes a rectangular outer cover 12, two cantilever arms 14 pivotally connected to the bottom surface of the outer cover 12, and a plurality of fins 16 formed on the bottom surface of the outer cover 12. A rectangular cavity 120 is recessed downwardly from the top of the outer cover 12, and is surrounded by a flat rectangular mounting surface 122 and an annular inner circumferential surface 124. The volume of the cavity 120 is greater than the sum of the volumes of the two LED modules 20, and a partition 126 is disposed inside to separate the two LED modules 20 from each other. A plurality of screw holes 128 are defined in the mounting surface 122 for screwing the screws 30 (as shown in FIG. 3) to lock the LED module 20 in the housing 10; the inner peripheral surface 124 is used for illuminating The diode module 20 is positioned to facilitate mounting the LED module 20 in the housing 10. The two cantilevers 14 are disposed in parallel with each other at positions opposite to opposite ends of the outer cover 12, and each cantilever 14 is substantially "U" shaped for suspending the light emitting diode lamp shown in FIG. 1 upside down. On the ceiling (not shown), the light of the LED module 20 is emitted toward the bottom of the ceiling. The fins 16 extend downward from the bottom surface of the outer cover 12 in parallel with each other for increasing the heat dissipation area of the housing 10 to dissipate heat generated by the light-emitting diode module 20 more quickly.
請一併參閱圖3-4,每一發光二極體模組20包括一導熱板22、複數固定於導熱板22上之電路板24、複數安裝於電 路板24上之發光二極體26及一固定至導熱板22上之導光架28。 Referring to FIG. 3-4 together, each LED module 20 includes a heat conducting board 22, a plurality of circuit boards 24 fixed on the heat conducting board 22, and a plurality of electrical boards. The light emitting diode 26 on the circuit board 24 and a light guide frame 28 fixed to the heat conducting board 22.
導熱板22亦由熱導性良好之金屬材料製成,其呈一被切去四角之正方形板體之構造。該導熱板22上開設複數穿孔220,供螺絲40穿設而將電路板24鎖固於其頂面。導熱板22之底面貼覆有一層導熱膠222(如圖4),其用於粘結至殼體10之空腔120之安裝面122上,從而完成發光二極體模組20與殼體10之熱導性連接。 The heat conducting plate 22 is also made of a metal material having good thermal conductivity, and has a configuration in which a square plate body of four corners is cut. A plurality of through holes 220 are defined in the heat conducting plate 22 for the screws 40 to be inserted to lock the circuit board 24 to the top surface thereof. The bottom surface of the heat conducting plate 22 is covered with a layer of thermal conductive adhesive 222 (FIG. 4) for bonding to the mounting surface 122 of the cavity 120 of the housing 10, thereby completing the LED module 20 and the housing 10. Thermally conductive connection.
該等電路板24並排地固定於導熱板22之頂面。每一電路板24呈矩形之長條狀,其頂面等距地安裝複數發光二極體26,以將發光二極體26發出之光線均勻地輻射出去。每一電路板24開設複數與導熱板22之穿孔220對應之穿孔(圖未標),供螺絲40穿過而將電路板24固定於導熱板22上。 The circuit boards 24 are secured side by side to the top surface of the heat conducting plate 22. Each of the circuit boards 24 has a rectangular strip shape, and a plurality of light emitting diodes 26 are mounted equidistantly on the top surface thereof to uniformly radiate light emitted from the light emitting diodes 26. Each of the circuit boards 24 defines a plurality of perforations (not shown) corresponding to the through holes 220 of the heat conducting plates 22 for the screws 40 to pass through to fix the circuit board 24 to the heat conducting plates 22.
導光架28固定於導熱板22之頂面,其包括二水平之側翼282、分別自二側翼282內緣豎直向上形成之二側壁284及一連接於二側壁284之間之水平之出光部286。該二側翼282之輪廓與導熱板22之相對兩側之輪廓相一致,每一側翼282均開設與導熱板22穿孔220對應之穿孔281,供螺絲30穿設而將導光架28固定至導熱板22及殼體10上。每一側壁284之高度大於每一電路板24及安裝於其上之發光二極體26之厚度之和,以將出光部286支撐於發光二極體26上方。出光部286之底面向上凹陷出與導熱板22之穿孔220對應之三溝槽283(如圖4),其用於收容電路板24上之螺絲40之頂部,以防止導光架28與螺絲40間發生 干涉。出光部286之頂面均勻地開設複數導光孔280,其中每一導光孔280均對應於一相應之發光二極體26,以使每一發光二極體26所發出之光線都可被引導出去。每一導光孔280呈口徑自上至下逐漸減小之構造,其由四傾斜之內壁面288共同圍設而成,以將發光二極體26所發出之光線以預定角度射出,從而提升發光二極體燈具之整體出光效率。可以選擇地,對於本發明之發光二極體燈具而言,發光二極體26所發出光線之射出角以45度至60度為宜,因此,導光孔280之每一內壁面288與對應之豎直面之夾角可控制在45度至60度之間。此外,為使發光二極體26所發出之大部分光線均能被輸送至發光二極體燈具外部,每一導光孔280之內壁面288上還可塗覆一層反射率較高之反光材料(圖未示)。 The light guide frame 28 is fixed on the top surface of the heat conducting plate 22, and includes two horizontal side wings 282, two side walls 284 respectively formed vertically from the inner edges of the two side wings 282, and a horizontal light emitting portion connected between the two side walls 284. 286. The contours of the two side wings 282 are consistent with the contours of the opposite sides of the heat conducting plate 22, and each of the side wings 282 defines a through hole 281 corresponding to the through hole 220 of the heat conducting plate 22 for the screw 30 to be passed to fix the light guide frame 28 to the heat conduction. On the plate 22 and the housing 10. The height of each of the side walls 284 is greater than the sum of the thicknesses of each of the circuit boards 24 and the light-emitting diodes 26 mounted thereon to support the light-emitting portion 286 above the light-emitting diodes 26. The bottom surface of the light exiting portion 286 is recessed upwardly with three grooves 283 corresponding to the through holes 220 of the heat conducting plate 22 (see FIG. 4) for receiving the top of the screw 40 on the circuit board 24 to prevent the light guide frame 28 and the screw 40 from being interposed. occur put one's oar in. A plurality of light guiding holes 280 are uniformly formed on the top surface of the light emitting portion 286, wherein each of the light guiding holes 280 corresponds to a corresponding light emitting diode 26, so that the light emitted by each of the light emitting diodes 26 can be Guide out. Each of the light guiding holes 280 has a structure in which the diameter gradually decreases from the top to the bottom, and is surrounded by the four inclined inner wall surfaces 288 to emit the light emitted from the light emitting diode 26 at a predetermined angle, thereby lifting The overall light extraction efficiency of the LED lamp. Alternatively, for the light-emitting diode lamp of the present invention, the light-emitting diode 26 preferably emits light at an angle of 45 to 60 degrees. Therefore, each inner wall surface 288 of the light guiding hole 280 corresponds to The angle between the vertical faces can be controlled between 45 degrees and 60 degrees. In addition, in order to enable most of the light emitted by the LED 26 to be transmitted to the outside of the LED, the inner wall 288 of each of the light guiding holes 280 may be coated with a reflective material having a higher reflectivity. (not shown).
組裝該發光二極體燈具時,首先將已安裝好發光二極體26之電路板24並排地設置於導熱板22頂面,然後將螺絲40穿過電路板24及導熱板22中部區域之穿孔,使二者相互固定。再將導光架28置設於導熱板22頂面,使每一發光二極體26均暴露於導光架28之相應導光孔280內,然後將二螺絲30分別穿過位於位於導光架28相對兩側區域之二中間之穿孔281及導熱板22上與之對應之二穿孔220,使上述各元件預先鎖固成一發光二極體模組20。最後將該發光二極體模組20藉由其導熱板22底面之導熱膠222貼置於殼體10之空腔120之安裝面122上,再將四螺絲30穿過導光架28及導熱板22上剩餘之穿孔220、281而螺鎖於殼體10之螺孔128內,從而將發光二極體模組20牢固地安 裝於殼體10內。同理,組裝另一發光二極體模組20時只需重複上述步驟即可。 When the LED device is assembled, the circuit board 24 on which the LEDs 26 have been mounted is first disposed side by side on the top surface of the heat conducting board 22, and then the screws 40 are passed through the perforations in the central portion of the circuit board 24 and the heat conducting board 22. To make the two fixed to each other. The light guide frame 28 is disposed on the top surface of the heat conducting plate 22, so that each of the light emitting diodes 26 is exposed to the corresponding light guiding hole 280 of the light guide frame 28, and then the two screws 30 are respectively located at the light guiding position. The second through hole 281 of the opposite side of the frame 28 and the corresponding two through holes 220 of the heat conducting plate 22 are used to pre-lock the components into a light emitting diode module 20. Finally, the LED module 20 is placed on the mounting surface 122 of the cavity 120 of the housing 10 by the thermal conductive adhesive 222 on the bottom surface of the heat conducting plate 22, and then the four screws 30 are passed through the light guide frame 28 and conduct heat. The remaining through holes 220, 281 on the plate 22 are screwed into the screw holes 128 of the housing 10, thereby firmly fixing the LED module 20 Installed in the housing 10. Similarly, when assembling another LED module 20, it is only necessary to repeat the above steps.
與習知技術相比,本發明之二發光二極體模組20相互獨立地固定至殼體10內,二者間不存在連接關係,即使一發光二極體模組20之發光二極體26損壞,只需單獨更換該發光二極體模組20即可,而不需把二發光二極體模組20均替換掉。因此,本發明之發光二極體燈具可有針對性地對發光二極體模組20進行靈活之更換,從而節省了維修成本,並有效地減少了浪費。此外,由於發光二極體模組20固定在熱導性良好之殼體10內,其產生之熱量可藉由殼體10快速地散發至周圍之空氣中,從而確保發光二極體26之正常運作。 Compared with the prior art, the two LED modules 20 of the present invention are fixed to the housing 10 independently of each other, and there is no connection relationship between them, even the LED of the LED module 20 26 damage, only need to replace the LED module 20 separately, without replacing the two LED modules 20. Therefore, the LED of the present invention can flexibly replace the LED module 20 in a targeted manner, thereby saving maintenance costs and effectively reducing waste. In addition, since the LED module 20 is fixed in the housing 10 having good thermal conductivity, the heat generated by the LED module 20 can be quickly dissipated into the surrounding air by the housing 10, thereby ensuring the normality of the LED 26 . Operation.
綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。 In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.
10‧‧‧殼體 10‧‧‧shell
12‧‧‧外罩 12‧‧‧ Cover
120‧‧‧空腔 120‧‧‧ Cavity
122‧‧‧安裝面 122‧‧‧Installation surface
124‧‧‧內周面 124‧‧‧ inner circumference
126‧‧‧隔板 126‧‧ ‧ partition
128‧‧‧螺孔 128‧‧‧ screw holes
14‧‧‧懸臂 14‧‧‧Cantilever
16‧‧‧鰭片 16‧‧‧Fins
20‧‧‧發光二極體模組 20‧‧‧Lighting diode module
22‧‧‧導熱板 22‧‧‧heat conducting plate
220‧‧‧穿孔 220‧‧‧Perforation
222‧‧‧導熱膠 222‧‧‧thermal adhesive
24‧‧‧電路板 24‧‧‧ boards
26‧‧‧發光二極體 26‧‧‧Lighting diode
28‧‧‧導光架 28‧‧‧Light guide
280‧‧‧導光孔 280‧‧‧Light guide hole
281‧‧‧穿孔 281‧‧‧Perforation
282‧‧‧側翼 282‧‧‧Flanking
283‧‧‧溝槽 283‧‧‧ trench
284‧‧‧側壁 284‧‧‧ side wall
286‧‧‧出光部 286‧‧‧Lighting Department
288‧‧‧內壁面 288‧‧‧ inner wall
30、40‧‧‧螺絲 30, 40‧‧‧ screws
圖1係本發明發光二極體燈具之立體組裝圖。 1 is a perspective assembled view of a light-emitting diode lamp of the present invention.
圖2係圖1之部分分解圖。 Figure 2 is a partial exploded view of Figure 1.
圖3係圖2中之發光二極體模組之放大圖。 3 is an enlarged view of the light emitting diode module of FIG. 2.
圖4係圖3之倒置圖。 Figure 4 is an inverted view of Figure 3.
10‧‧‧殼體 10‧‧‧shell
126‧‧‧隔板 126‧‧ ‧ partition
20‧‧‧發光二極體模組 20‧‧‧Lighting diode module
26‧‧‧發光二極體 26‧‧‧Lighting diode
28‧‧‧導光架 28‧‧‧Light guide
30‧‧‧螺絲 30‧‧‧ screws
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97125375A TWI398600B (en) | 2008-07-04 | 2008-07-04 | Led lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97125375A TWI398600B (en) | 2008-07-04 | 2008-07-04 | Led lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201002998A TW201002998A (en) | 2010-01-16 |
| TWI398600B true TWI398600B (en) | 2013-06-11 |
Family
ID=44825367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97125375A TWI398600B (en) | 2008-07-04 | 2008-07-04 | Led lamp |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI398600B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM305302U (en) * | 2006-06-29 | 2007-01-21 | Chaun Choung Technology Corp | Large-sized LED lamp combination structure |
| CN101105268A (en) * | 2007-07-31 | 2008-01-16 | 李旭亮 | LED road lamp and LED road lamp radiation area expansion method |
| TWM335632U (en) * | 2007-11-06 | 2008-07-01 | Jia-Yi Chen | Reflection module for LED lighting apparatus |
-
2008
- 2008-07-04 TW TW97125375A patent/TWI398600B/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM305302U (en) * | 2006-06-29 | 2007-01-21 | Chaun Choung Technology Corp | Large-sized LED lamp combination structure |
| CN101105268A (en) * | 2007-07-31 | 2008-01-16 | 李旭亮 | LED road lamp and LED road lamp radiation area expansion method |
| TWM335632U (en) * | 2007-11-06 | 2008-07-01 | Jia-Yi Chen | Reflection module for LED lighting apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201002998A (en) | 2010-01-16 |
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| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |