TWI399505B - Led lamp - Google Patents
Led lamp Download PDFInfo
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- TWI399505B TWI399505B TW97135040A TW97135040A TWI399505B TW I399505 B TWI399505 B TW I399505B TW 97135040 A TW97135040 A TW 97135040A TW 97135040 A TW97135040 A TW 97135040A TW I399505 B TWI399505 B TW I399505B
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- diode lamp
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- emitting diode
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- 239000000758 substrate Substances 0.000 claims description 11
- 230000003247 decreasing effect Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 1
- 238000005286 illumination Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Description
本發明涉及一種發光二極體燈具,特別涉及一種用於戶外照明之發光二極體燈具。 The invention relates to a light-emitting diode lamp, in particular to a light-emitting diode lamp for outdoor lighting.
發光二極體光源作為一種新興之第三代光源,雖然現在還不能大規模取代傳統之白熾燈,但係其具有工作壽命長、節能、環保等優點,而普遍被市場看好。而且,目前由發光二極體組成之模組能產生大功率、高亮度之光源,因此將廣泛地、革命性地取代傳統之白熾燈等現有之光源,進而成為符合節能環保主題之主要光源。 As a new generation of light source, the light-emitting diode light source can not replace the traditional incandescent lamp on a large scale, but it has the advantages of long working life, energy saving and environmental protection, and is generally favored by the market. Moreover, the module composed of the light-emitting diode can generate a high-power, high-brightness light source, and thus will widely and revolutionarily replace the existing light source such as a conventional incandescent lamp, thereby becoming a main light source that meets the theme of energy conservation and environmental protection.
然而,隨著發光二極體或其模組之功率、亮度之增大,其產生之熱量也越來越大,若不能妥善解決發光二極體之發熱問題,則發光二極體燈具之工作壽命將受到嚴重影響。因此通常都在發光二極體模組上安裝一散熱器對其散熱,該散熱器具有一底板和底板上形成之複數散熱鰭片。對於一些大功率之燈具,其發光二極體一般係密集地排列在該底板上並與該底板導熱連接。因此發光二極體產生之熱量就可以通過底板傳導到散熱鰭片上而散發到周圍之空氣中。然而,該二極體模組則呈水平貼置於該散熱器底部而成之平面光源,其照射 方向單一從而照射面積有限,很多情況下都難以使用戶滿意。 However, as the power and brightness of the light-emitting diode or its module increase, the amount of heat generated is also increased. If the heat generation problem of the light-emitting diode is not properly solved, the operation of the light-emitting diode lamp Life expectancy will be severely affected. Therefore, a heat sink is generally disposed on the light emitting diode module to dissipate heat therefrom. The heat sink has a plurality of heat sink fins formed on the bottom plate and the bottom plate. For some high-power lamps, the light-emitting diodes are generally densely arranged on the bottom plate and thermally connected to the bottom plate. Therefore, the heat generated by the light-emitting diode can be radiated to the surrounding air through the bottom plate and radiated to the surrounding fins. However, the diode module is a planar light source horizontally placed on the bottom of the heat sink, and the illumination thereof The direction is single and the irradiation area is limited, and in many cases, it is difficult to satisfy the user.
有鑒於此,有必要提供一種照明面積較大之發光二極體燈具。 In view of this, it is necessary to provide a light-emitting diode lamp with a large illumination area.
一種發光二極體燈具,包括一散熱器和複數貼設於散熱器上之發光二極體模組,該散熱器包括一導熱筒、由導熱筒周緣向外延伸之複數導熱支板和形成於導熱支板兩側之複數散熱片,每一導熱支板呈直角三角形,且該等導熱支板之直角邊與導熱筒周緣接合,從而在導熱筒周圍由導熱支板頂部形成由上向下傾斜之安裝頂面,該等發光二極體模組分別貼設在安裝頂面上。 A light-emitting diode lamp comprising a heat sink and a plurality of light-emitting diode modules attached to the heat sink, the heat sink comprising a heat-conducting tube, a plurality of heat-conducting support plates extending outward from a periphery of the heat-conducting tube, and formed on a plurality of heat radiating fins on both sides of the heat conducting support plate, each of the heat conducting support plates is a right triangle, and the right angle sides of the heat conducting support plates are engaged with the periphery of the heat conducting tube, so as to be inclined from the top to the bottom of the heat conducting support plate by the top of the heat conducting support plate The mounting top surface, the LED modules are respectively attached to the mounting top surface.
上述發光二極體模組分別安裝在傾斜面向四周之散熱器安裝頂面上,發光二極體模組產生之燈光均勻地照向發光二極體燈具之各個方向且由於發光二極體模組均係傾斜面向四周,從而在發光二極體燈具周圍形成一個寬廣均勻之照射區域。 The light-emitting diode modules are respectively mounted on the top surface of the radiator mounted on the inclined surface, and the light generated by the light-emitting diode module uniformly illuminates in various directions of the light-emitting diode lamp and is due to the light-emitting diode module They are all inclined to the periphery to form a wide and uniform illumination area around the LED luminaire.
10‧‧‧底座 10‧‧‧Base
12‧‧‧基板 12‧‧‧Substrate
14‧‧‧固定緣 14‧‧‧Fixed Edge
140‧‧‧螺孔 140‧‧‧ screw holes
16‧‧‧鰭片 16‧‧‧Fins
18‧‧‧容置筒 18‧‧‧容筒
180‧‧‧容置空間 180‧‧‧ accommodating space
19‧‧‧固定柱 19‧‧‧Fixed column
190‧‧‧配合孔 190‧‧‧With holes
20‧‧‧安裝件 20‧‧‧Installation
22‧‧‧安裝筒 22‧‧‧Installation
24‧‧‧安裝板 24‧‧‧Installation board
240‧‧‧透孔 240‧‧‧through hole
242‧‧‧穿孔 242‧‧‧Perforation
30‧‧‧散熱器 30‧‧‧ radiator
32‧‧‧導熱筒 32‧‧‧thermal tube
320‧‧‧通孔 320‧‧‧through hole
34‧‧‧導熱支板 34‧‧‧heat conduction support
340‧‧‧安裝頂面 340‧‧‧Installation top surface
342‧‧‧散熱片 342‧‧‧ Heat sink
40‧‧‧發光二極體模組 40‧‧‧Lighting diode module
42‧‧‧電路板 42‧‧‧ boards
44‧‧‧發光二極體 44‧‧‧Lighting diode
50‧‧‧燈罩 50‧‧‧shade
52‧‧‧結合緣 52‧‧‧Combined edge
520‧‧‧結合孔 520‧‧‧bond hole
圖1為本發明發光二極體燈具之一較佳實施例之立體分解圖。 1 is an exploded perspective view of a preferred embodiment of a light-emitting diode lamp of the present invention.
圖2為圖1中發光二極體燈具之立體組合圖。 2 is a perspective assembled view of the light-emitting diode lamp of FIG. 1.
圖3為圖1之倒置圖。 Figure 3 is an inverted view of Figure 1.
圖4為圖2之倒置圖。 Figure 4 is an inverted view of Figure 2.
請參考圖1-4,本發明一較佳實施例中之發光二極體燈具用於為室內和戶外一些特定之場合提供柔和均勻之照明燈光,該發光二極體燈具包括一底座10、與底座10底部連接之一安裝件20、安裝於底座10頂面之一散熱器30、貼設在散熱器30上之複數發光二極體模組40和與底座10配合將散熱器30及發光二極體模組40罩於其內之一透光燈罩50。 Referring to FIG. 1-4, a light-emitting diode lamp according to a preferred embodiment of the present invention is used to provide soft and uniform illumination for certain occasions indoors and outdoors. The light-emitting diode lamp includes a base 10, and A mounting member 20 is attached to the bottom of the base 10, a heat sink 30 mounted on the top surface of the base 10, a plurality of LED modules 40 attached to the heat sink 30, and the base 10 is coupled to the heat sink 30 and the light emitting unit The pole body module 40 is covered by a light transmissive lamp cover 50 therein.
上述底座10由導熱金屬材料製成,其包括一圓形基板12、由基板12周緣垂直向上凸起之一環形固定緣14、由基板12底面中部垂直向下延伸之一容置筒18和垂直設置於基板12底面並由容置筒18周緣向外呈放射狀延伸之鰭片16。所述固定緣14頂部均勻開設有複數螺孔140,用於與穿過燈罩50之螺釘(圖未示)配合。所述容置筒18內形成一容置空間180,以容置諸如電子整流器及控制電路等電子元件。所述容置筒18之外周緣設置有垂直連接基板12頂面之三固定柱19,所述固定柱19關於容置筒18中心軸線對稱設置且固定柱19內開設有用於連接安裝件20之配合孔190。 The base 10 is made of a heat conductive metal material, and includes a circular substrate 12, an annular fixing edge 14 projecting vertically upward from the periphery of the substrate 12, and a receiving cylinder 18 vertically extending from the bottom surface of the bottom surface of the substrate 12. The fins 16 are disposed on the bottom surface of the substrate 12 and extend radially outward from the periphery of the receiving cylinder 18. A plurality of screw holes 140 are uniformly formed in the top of the fixing edge 14 for engaging with screws (not shown) passing through the lamp cover 50. An accommodating space 180 is formed in the accommodating cylinder 18 to accommodate electronic components such as an electronic rectifier and a control circuit. The outer periphery of the accommodating cylinder 18 is provided with three fixing posts 19 perpendicularly connecting the top surfaces of the substrate 12, the fixing posts 19 are symmetrically disposed about the central axis of the accommodating cylinder 18, and the fixing post 19 is provided with a connecting member 20 for connecting the mounting member 20 Fit the hole 190.
上述安裝件20包括一圓形安裝板24和由安裝板24底面中部位置垂直向下延伸之一安裝筒22。所述安裝板24之直徑略大於底座10容置筒18之外徑,以完全封蓋該容置筒18之底端開口,且安裝板24中間開設一供導線穿過之透孔240,安裝板24靠近其周緣處均勻開設有複數穿孔242。所述穿孔242供固定件(圖未示)穿過與底座10固定柱19之配合孔190配合而將 安裝件20連接固定到底座10底部。所述安裝筒22可以直接套設外界之燈桿(圖未示)而將發光二極體燈具安裝到預定之位置。 The mounting member 20 includes a circular mounting plate 24 and a mounting barrel 22 extending vertically downward from a central portion of the bottom surface of the mounting plate 24. The diameter of the mounting plate 24 is slightly larger than the outer diameter of the accommodating cylinder 18 of the base 10 to completely cover the bottom end opening of the accommodating cylinder 18, and a through hole 240 through which the wire passes is installed in the middle of the mounting plate 24, and is installed. The plate 24 is uniformly provided with a plurality of perforations 242 near its circumference. The through hole 242 is fitted with a fixing member (not shown) through the mating hole 190 of the fixing post 19 of the base 10 to The mounting member 20 is attached and fixed to the bottom of the base 10. The mounting cylinder 22 can directly mount an external light pole (not shown) to mount the LED luminaire to a predetermined position.
上述散熱器30由導熱性能良好之金屬材料如鋁、銅等一體形成,其包括一導熱筒32、由導熱筒32外周緣向外延伸之複數導熱支板34和形成於導熱支板34兩側之複數散熱片342。所述導熱筒32為一多稜柱,在不同之實施例中可以為三稜柱、四稜柱或八稜柱等,在本實施例中,該導熱筒32為一六稜柱體,導熱筒32中心開設一沿六稜柱體中軸線上下貫通之圓形通孔320。所述導熱支板34由導熱筒32之六稜柱面垂直向外延伸,每一導熱支板34均呈直角三角形,且導熱支板34之直角邊與導熱筒32之六稜柱面接合,從而使導熱支板34在導熱筒32周圍形成由上向下傾斜之安裝頂面340,所述安裝頂面340用於貼設安裝對應之發光二極體模組40,且所述每一安裝頂面340與其所連接之導熱筒32之筒壁之夾角相同。所述散熱片342由導熱支板34之兩側垂直延伸而出,且相互關於導熱支板34對稱。所述散熱片342相互間隔並與導熱筒32之一對應之稜柱面平行,所述散熱片340之高度由導熱筒32向外遞減,且散熱片342之頂面呈傾斜面狀並與對應之導熱支板34之安裝頂面340共面,從而使散熱器30整體呈一六稜臺狀。所述散熱器30之頂部小底部大,散熱器30之所有散熱片342之底面及導熱支板34之底面共面以貼置在底座10基板12之頂面並正好處在底座10固定緣14之環繞之內。 The heat sink 30 is integrally formed of a metal material having good thermal conductivity, such as aluminum, copper, etc., and includes a heat conducting tube 32, a plurality of heat conducting support plates 34 extending outward from the outer periphery of the heat conducting tube 32, and formed on both sides of the heat conducting support plate 34. The plurality of heat sinks 342. The heat conducting tube 32 is a polygonal prism. In different embodiments, it may be a triangular prism, a quadrangular prism or an octagonal prism. In the embodiment, the heat conducting tube 32 is a hexagonal prism, and the heat conducting tube 32 is opened at the center. A circular through hole 320 penetrating up and down along the central axis of the hexagonal prism. The heat conducting support plate 34 extends perpendicularly outward from the hexagonal cylindrical surface of the heat conducting tube 32. Each of the heat conducting support plates 34 has a right angle triangle shape, and the right angle side of the heat conducting support plate 34 is engaged with the hexagonal cylindrical surface of the heat conducting tube 32, thereby The heat-dissipating support plate 34 forms a mounting top surface 340 which is inclined upwardly and downwardly around the heat-conducting tube 32, and the mounting top surface 340 is used for attaching and mounting the corresponding light-emitting diode module 40, and each of the mounting top surfaces 340 is at the same angle as the wall of the heat conducting tube 32 to which it is attached. The fins 342 are vertically extended from both sides of the heat conducting support plate 34 and are symmetric with respect to the heat conducting support plate 34. The fins 342 are spaced apart from each other and are parallel to the prism surface corresponding to one of the heat conducting tubes 32. The height of the heat sink 340 is outwardly decreased by the heat conducting tube 32, and the top surface of the heat sink 342 is inclined and corresponding thereto. The mounting top surface 340 of the heat conducting support plate 34 is coplanar so that the heat sink 30 as a whole has a hexagonal prism shape. The bottom of the heat sink 30 has a small bottom, and the bottom surface of all the heat sinks 342 of the heat sink 30 and the bottom surface of the heat transfer support plate 34 are coplanar to be placed on the top surface of the base 12 of the base 10 and are advantageously at the fixed edge 14 of the base 10. Surrounded by it.
上述發光二極體模組40包括一縱長矩形電路板42和安裝在電路板42上並延其長度方向排列之複數發光二極體44。所述電路板42之一側面貼設在散熱器30之安裝頂面340上,電路板42之另一面安裝所述發光二極體44。 The LED module 40 includes a vertically long rectangular circuit board 42 and a plurality of LEDs 44 mounted on the circuit board 42 and extending in the longitudinal direction thereof. One side of the circuit board 42 is attached to the mounting top surface 340 of the heat sink 30, and the light emitting diode 44 is mounted on the other side of the circuit board 42.
上述燈罩50由透明或半透明如玻璃、樹脂等材料製成,其大致呈一下端開口之圓臺形狀,燈罩50底端周緣水平向外延伸形成一環形結合緣52。所述結合緣52之大小正好與底座10之固定緣14大小相等,以使結合緣52正好與該固定緣14接合,且結合緣52上開設有複數結合孔520,以供螺釘穿過結合孔520與固定緣14上之螺孔140配合而將燈罩50固定到底座10上,並將散熱器30及發光二極體模組40封於其內。 The lamp cover 50 is made of a transparent or translucent material such as glass, resin or the like, and has a truncated cone shape which is open at the lower end. The peripheral edge of the bottom end of the lamp cover 50 extends horizontally outward to form an annular joint edge 52. The connecting edge 52 is equal in size to the fixing edge 14 of the base 10, so that the engaging edge 52 is just engaged with the fixing edge 14. The connecting edge 52 is provided with a plurality of coupling holes 520 for the screws to pass through the coupling hole. The 520 cooperates with the screw hole 140 on the fixing edge 14 to fix the lamp cover 50 to the base 10, and seals the heat sink 30 and the LED module 40 therein.
上述發光二極體燈具工作時,發光二極體模組40分別安裝在傾斜面向四周之散熱器30安裝頂面340上,發光二極體模組50產生之燈光均勻地照向發光二極體燈具之各個方向,且由於發光二極體模組50均係傾斜面向四周,而在發光二極體燈具周圍形成一個寬廣均勻之照射區域。此外,發光二極體模組40工作時產生之熱量可以直接由導熱支板34吸收並由散熱片342和底座10之鰭片16將熱量散發出去。 When the above-mentioned light-emitting diode lamp is in operation, the light-emitting diode modules 40 are respectively mounted on the top surface 340 of the heat sink 30 which is inclined to face all around, and the light generated by the light-emitting diode module 50 uniformly illuminates the light-emitting diode. In all directions of the luminaire, and because the illuminating diode module 50 is inclined to face all around, a wide and uniform illumination area is formed around the illuminating diode lamp. In addition, the heat generated by the operation of the LED module 40 can be directly absorbed by the heat transfer plate 34 and dissipated by the heat sink 342 and the fins 16 of the base 10.
綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,舉凡熟悉本案技藝之人士,在爰依本發明精神所作之等效修飾或變化,皆應涵蓋於以下之申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
10‧‧‧底座 10‧‧‧Base
50‧‧‧燈罩 50‧‧‧shade
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97135040A TWI399505B (en) | 2008-09-12 | 2008-09-12 | Led lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97135040A TWI399505B (en) | 2008-09-12 | 2008-09-12 | Led lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201011212A TW201011212A (en) | 2010-03-16 |
| TWI399505B true TWI399505B (en) | 2013-06-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97135040A TWI399505B (en) | 2008-09-12 | 2008-09-12 | Led lamp |
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| Country | Link |
|---|---|
| TW (1) | TWI399505B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200507686A (en) * | 2003-08-11 | 2005-02-16 | Ming-De Lin | Light-emitting diode lamp |
| US20050174780A1 (en) * | 2004-02-06 | 2005-08-11 | Daejin Dmp Co., Ltd. | LED light |
| TWM293397U (en) * | 2005-12-27 | 2006-07-01 | Ching-Fen Wang | Structure of light diffusive LED lamp |
| TWM297440U (en) * | 2006-03-10 | 2006-09-11 | Thermoplus Technology Inc | Heat-dissipating structure of lamp |
| US20080002410A1 (en) * | 2006-06-30 | 2008-01-03 | Burton Thomas R | Apparatus for using heat pipes in controlling temperature of an led light unit |
-
2008
- 2008-09-12 TW TW97135040A patent/TWI399505B/en not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200507686A (en) * | 2003-08-11 | 2005-02-16 | Ming-De Lin | Light-emitting diode lamp |
| US20050174780A1 (en) * | 2004-02-06 | 2005-08-11 | Daejin Dmp Co., Ltd. | LED light |
| TWM293397U (en) * | 2005-12-27 | 2006-07-01 | Ching-Fen Wang | Structure of light diffusive LED lamp |
| TWM297440U (en) * | 2006-03-10 | 2006-09-11 | Thermoplus Technology Inc | Heat-dissipating structure of lamp |
| US20080002410A1 (en) * | 2006-06-30 | 2008-01-03 | Burton Thomas R | Apparatus for using heat pipes in controlling temperature of an led light unit |
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| Publication number | Publication date |
|---|---|
| TW201011212A (en) | 2010-03-16 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |