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TWI460075B - Pressing machine - Google Patents

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Publication number
TWI460075B
TWI460075B TW099138816A TW99138816A TWI460075B TW I460075 B TWI460075 B TW I460075B TW 099138816 A TW099138816 A TW 099138816A TW 99138816 A TW99138816 A TW 99138816A TW I460075 B TWI460075 B TW I460075B
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TW
Taiwan
Prior art keywords
film
substrate
pressing
press machine
carrier
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TW099138816A
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Chinese (zh)
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TW201220348A (en
Inventor
Vincent Lai
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C Sun Mfg Ltd
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Priority to TW099138816A priority Critical patent/TWI460075B/en
Priority to CN2011101968567A priority patent/CN102463733A/en
Publication of TW201220348A publication Critical patent/TW201220348A/en
Application granted granted Critical
Publication of TWI460075B publication Critical patent/TWI460075B/en

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  • Manufacturing Of Printed Circuit Boards (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Description

壓合機Press machine

本發明是有關於一種壓合機,特別是指一種用以將薄膜壓合在基材上的壓合機。This invention relates to a press, and more particularly to a press for pressing a film onto a substrate.

目前半導體的微影製程中,將光阻依覆在晶圓上的方式大致可分為濕式與乾式兩種,濕式是將液態光阻以旋塗法塗佈在晶圓上,再以烘烤方式將液態光阻烘乾。乾式是將乾膜光阻(Dry film resist)製成光阻帶,並經由壓合機將乾膜光阻貼附在晶圓上,例如台灣專利第502310公告號(申請案號為090130837)專利案所揭露的乾膜光阻之壓合裝置。At present, in the lithography process of semiconductor, the way of blocking the photoresist on the wafer can be roughly divided into wet type and dry type. In the wet type, the liquid photoresist is coated on the wafer by spin coating, and then The baking method is to dry the liquid photoresist. The dry type is a dry film resist made of a photoresist strip, and the dry film resist is attached to the wafer via a press machine, for example, the patent of Taiwan Patent No. 502310 (Application No. 090130837) The dry film photoresist press device disclosed in the case.

由於晶圓表面上會設有複數個高低不同的晶粒或者是圖案(pattern),使得晶圓表面是呈現凹凸不平的狀態,因此,如何構思出一種能將乾膜光阻壓合並填覆在晶圓之表面的壓合裝置設計,遂成為本發明要進一步改進的主題。Since there are a plurality of different crystal grains or patterns on the surface of the wafer, the surface of the wafer is uneven, so how to conceive a dry film photo-resistive pressure and fill it in The design of the press-fit device on the surface of the wafer has become the subject of further improvement of the present invention.

本發明之主要目的,在於提供一種用以將薄膜壓合在基材上並能將薄膜填覆於基材之表面的壓合機。SUMMARY OF THE INVENTION A primary object of the present invention is to provide a press for pressing a film onto a substrate and filling the film against the surface of the substrate.

本發明之另一目的,在於提供一種壓合方法,透過先將薄膜壓合於基材上後,再由薄膜上切割出與基材大小相當的薄膜片體。Another object of the present invention is to provide a method of laminating a film sheet having a size equivalent to that of a substrate by first pressing a film onto a substrate.

本發明的目的及解決先前技術問題是採用以下技術手段來實現的,依據本發明所揭露的壓合機,包含一供料裝 置、一回收元件、一高度調整裝置、一壓合裝置,及一切割元件。The object of the present invention and the prior art problem are solved by the following technical means. The press machine according to the present invention comprises a feeding device. a resetting element, a height adjusting device, a pressing device, and a cutting element.

供料裝置提供一薄膜;回收元件與薄膜一端連接並可回收薄膜;高度調整裝置設置於供料裝置與回收元件之間,高度調整裝置包括二相間隔且供薄膜纏繞的活動滾輪,二活動滾輪可帶動薄膜在一第一高度位置,及一高度低於第一高度位置的第二高度位置之間移動;壓合裝置包括一承載座及一壓合盤,承載座位於薄膜下方並可供一基材放置,當薄膜在第二高度位置時,薄膜鄰近於基材表面;壓合盤位於薄膜上方並包含一設置於底端的彈性壓膜,及一可對彈性壓膜吸氣或吹氣的第一氣體流道,壓合盤可在一間隔位於承載座與薄膜上方的初始位置,及一壓合於承載座且彈性壓膜壓迫薄膜使其貼覆於基材表面的壓合位置之間往復運動;切割元件設置於壓合裝置一側,切割元件可將薄膜貼覆於基材表面的部分切割,以形成一與基材大小相當的薄膜片體。The feeding device provides a film; the recycling component is connected to one end of the film and can recover the film; the height adjusting device is disposed between the feeding device and the recycling component, and the height adjusting device comprises two movable rollers for winding the film, and two movable rollers The movable film is movable between a first height position and a second height position lower than the first height position; the pressing device comprises a bearing seat and a pressing plate, and the bearing seat is located under the film and is provided for The substrate is placed. When the film is at the second height position, the film is adjacent to the surface of the substrate; the pressure plate is located above the film and includes an elastic film disposed at the bottom end, and a film that can be inhaled or blown to the elastic film. The first gas flow path, the press-fit disc may be located at an initial position above the carrier and the film at a spacing, and between a press-fit position of the carrier and the elastic film pressing the film to adhere to the surface of the substrate. Reciprocating motion; the cutting element is disposed on one side of the pressing device, and the cutting element can cut a portion of the film attached to the surface of the substrate to form a film sheet having a size equivalent to the substrate.

本發明的目的及解決先前技術問題還可以採用以下技術手段進一步實現。The object of the present invention and solving the prior art problems can be further achieved by the following technical means.

高度調整裝置還包括一供薄膜纏繞的固定滾輪,二活動滾輪與固定滾輪位在同一水平高度位置,二活動滾輪可相對於固定滾輪移動,以帶動薄膜在第一、第二高度位置之間移動。The height adjusting device further comprises a fixed roller for winding the film, the movable roller and the fixed roller are at the same horizontal position, and the two movable rollers are movable relative to the fixed roller to drive the film to move between the first and second height positions. .

薄膜纏繞在固定滾輪與其中一活動滾輪頂端,且薄膜纏繞在其中另一活動滾輪底端。The film is wound around the fixed roller and the top of one of the movable rollers, and the film is wound around the bottom end of the other movable roller.

承載座包含一供基材放置的固定座體,及一設置於固定座體內的頂推件,頂推件可在一凸伸出固定座體以承載基材的承載位置,及一使基材貼覆於固定座體的收合位置之間往復運動。The carrier includes a fixing base for the substrate to be placed, and a pushing member disposed in the fixing body. The pushing member can extend the fixing body to carry the bearing position of the substrate, and the substrate is Reciprocating between the folded positions of the fixed seat.

固定座體包含一頂面,及一形成於頂面的第二氣體流道,所述第二氣體流道可對基材吸氣。The fixed seat body includes a top surface and a second gas flow path formed on the top surface, and the second gas flow path can inhale the substrate.

固定座體還包含一形成於頂面的第三氣體流道,當壓合盤在壓合位置時,第三氣體流道可對壓合盤與承載座之間所形成的一腔室吸氣。The fixing base further comprises a third gas flow passage formed on the top surface. When the pressing disc is in the pressing position, the third gas flow passage can inhale a chamber formed between the pressing disc and the bearing seat. .

固定座體還包含一用以供頂推件安裝的安裝槽,安裝槽的一開口形成於頂面。頂推件包含一可吸附基材的吸氣孔。The fixing base further comprises a mounting groove for mounting the pushing member, and an opening of the mounting groove is formed on the top surface. The pushing member includes a suction hole that can adsorb the substrate.

固定座體還包含一可對基材加熱的下加熱元件,下加熱元件包括一用以產生熱源的加熱部、一設置於加熱部頂端並可與基材接觸的導熱部,及一設置於加熱部底端的隔熱部。The fixing base further comprises a lower heating element capable of heating the substrate, the lower heating element comprises a heating part for generating a heat source, a heat conducting part disposed at the top end of the heating part and contacting the substrate, and a heating part The thermal insulation at the bottom of the section.

承載座還包含一設置於固定座體上用以冷卻固定座體的冷卻元件。The carrier also includes a cooling element disposed on the fixed base for cooling the fixed seat.

壓合盤還包含一可對彈性壓膜加熱的上加熱元件,上加熱元件包括一用以產生熱源的加熱部、一設置於加熱部底端與彈性壓膜之間的導熱部,及一設置於加熱部頂端的隔熱部。The pressure plate further comprises an upper heating element capable of heating the elastic pressing film, wherein the upper heating element comprises a heating portion for generating a heat source, a heat conducting portion disposed between the bottom end of the heating portion and the elastic pressing film, and a setting The heat insulating portion at the top end of the heating portion.

彈性壓膜為矽膠或橡膠材質。The elastic film is made of silicone or rubber.

依據本發明所揭露的壓合方法,適於將一薄膜壓合於置放在一承載座上的一基材表面,該方法包含下述步驟: (A)向下調整薄膜高度,使薄膜鄰近於基材表面;(B)壓合一壓合盤於承載座上,對壓合盤的一彈性壓膜朝下吹氣,彈性壓膜壓迫薄膜使其貼覆於基材表面;(C)對彈性壓膜朝上吸氣,使彈性壓膜與薄膜分離,並且移離壓合盤使其與承載座分離;及(D)切割薄膜貼覆於基材表面部分,以形成一與基材大小相當的薄膜片體。The pressing method according to the present invention is suitable for pressing a film onto a surface of a substrate placed on a carrier, the method comprising the steps of: (A) adjusting the height of the film downward to make the film adjacent to the surface of the substrate; (B) pressing a pressing plate on the carrier, blowing an elastic film against the pressing plate downward, and pressing the film with elastic film Laying it against the surface of the substrate; (C) inhaling the elastic film upward, separating the elastic film from the film, and moving away from the platen to separate from the carrier; and (D) cutting the film The surface portion of the substrate is formed to form a film sheet having a size equivalent to that of the substrate.

藉由上述技術手段,本發明光阻帶壓合機的優點及功效在於,藉由壓合盤之彈性壓膜設計,當壓合盤在壓合位置時,第一氣體流道會對彈性壓膜朝下吹氣,彈性壓膜會向下壓迫並擠壓薄膜之第一保護層及光阻層的組合體,使光阻層被擠壓入基材之表面,使得光阻層能填覆基材之表面,藉此,能減少光阻層與基材之表面間的空隙,以提昇壓合的良率。再者,透過先將薄膜之第一保護層及光阻層的組合體壓合於基材的表面後,再由第一保護層及光阻層的組合體上切割出與基材大小相當的薄膜片體的方式,能提昇薄膜之壓合過程的速率,以縮短壓合的工時。According to the above technical means, the advantages and effects of the photoresist strip press of the present invention are that, by the elastic lamination design of the press-disc, the first gas flow path will be elastically pressed when the press-disc is in the pressing position. When the film is blown downward, the elastic film presses down and presses the combination of the first protective layer and the photoresist layer of the film, so that the photoresist layer is pressed onto the surface of the substrate, so that the photoresist layer can be filled. The surface of the substrate, whereby the gap between the photoresist layer and the surface of the substrate can be reduced to improve the yield of the press. Furthermore, by first pressing the combination of the first protective layer and the photoresist layer of the film on the surface of the substrate, the combination of the first protective layer and the photoresist layer is cut to the size of the substrate. The way of the film sheet can increase the rate of the film pressing process to shorten the pressing time.

有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之一個較佳實施例的詳細說明中,將可清楚的呈現。透過具體實施方式的說明,當可對本發明為達成預定目的所採取的技術手段及功效得以更加深入且具體的了解,然而所附圖式只是提供參考與說明之用,並非用來對本發明加以限制。The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments. The technical means and functions of the present invention for achieving the intended purpose can be more deeply and specifically understood by the description of the specific embodiments. However, the drawings are only for the purpose of reference and description, and are not intended to limit the invention. .

在本發明被詳細描述之前,要注意的是,在以下的說明內容中,類似的元件是以相同的編號來表示。Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals.

如圖1、圖2及圖3所示,是本發明壓合機的一較佳實施例,該壓合機300主要是用以將一薄膜1壓合在一基材2上,在本實施例中,薄膜1是以一光阻帶為例作說明,而基材2是以一晶圓為例作說明,當然,薄膜1也可為保護膜或其他形式的薄膜。圖1為薄膜1的局部剖視圖,薄膜1包括一光阻層11、一貼覆於光阻層11頂面的第一保護層12,及一貼覆於光阻層11底面的第二保護層13,第一保護層12的材質可為聚對苯二甲酸乙二酯(PET),而第二保護層13的材質可為聚乙烯(PE),透過第一保護層12與第二保護層13的設置能對光阻層11提供保護的作用。圖2為基材2的局部剖視圖,由於基材2上設置有複數個高低不同的凸部21,前述凸部21可為晶粒或者是圖案(pattern),使得基材2的一表面22是呈現凹凸不平的狀態,本實施例的壓合機300是要將薄膜1的第二保護層13撕離光阻層11底面後,再將薄膜1的光阻層11壓合於基材2的表面22。As shown in FIG. 1 , FIG. 2 and FIG. 3 , a preferred embodiment of the press machine of the present invention is mainly used for pressing a film 1 onto a substrate 2 in the present embodiment. In the example, the film 1 is exemplified by a photoresist strip, and the substrate 2 is exemplified by a wafer. Of course, the film 1 can also be a protective film or other forms of film. 1 is a partial cross-sectional view of a film 1 including a photoresist layer 11, a first protective layer 12 attached to the top surface of the photoresist layer 11, and a second protective layer attached to the bottom surface of the photoresist layer 11. The material of the first protective layer 12 may be polyethylene terephthalate (PET), and the material of the second protective layer 13 may be polyethylene (PE), which is transmitted through the first protective layer 12 and the second protective layer. The arrangement of 13 can provide protection to the photoresist layer 11. 2 is a partial cross-sectional view of the substrate 2. Since the substrate 2 is provided with a plurality of protrusions 21 having different heights, the protrusions 21 may be grains or patterns, such that a surface 22 of the substrate 2 is In a state in which the unevenness is present, the press machine 300 of the present embodiment is to peel the second protective layer 13 of the film 1 away from the bottom surface of the photoresist layer 11, and then press the photoresist layer 11 of the film 1 against the substrate 2. Surface 22.

如圖1及圖3所示,壓合機300包含一供料裝置3、一回收元件4、一高度調整裝置5、一切割元件6,及一壓合裝置70。供料裝置3包括一供應滾軸31、一回收滾軸32,及一撕離滾軸33,供應滾軸31上捲繞著薄膜1,供應滾軸31可透過轉動將薄膜1沿箭頭A1輸出。撕離滾軸33設置於供應滾軸31後側,並可將供應滾軸31輸出之薄膜1的第二保護層13撕離,使得薄膜1形成一第一保護層及光阻層的組合體14,以及被撕離下來的第二保護層13,透過回收滾軸32的轉動使得被撕離下來的第二保護層13可沿著箭頭A2方向輸送至回收滾軸32上,以將第二保護層13捲繞在一起。另外,第一保護層及光阻層的組合體14可藉由供應滾軸31以及回收元件4的轉動而被沿著箭頭A3方向帶動,在本實施例中,回收元件4為一滾軸,藉由回收元件4的轉動可將第一保護層及光阻層的組合體14捲繞在一起。As shown in FIGS. 1 and 3, the press machine 300 includes a feeding device 3, a recovery member 4, a height adjusting device 5, a cutting member 6, and a pressing device 70. The feeding device 3 includes a supply roller 31, a recovery roller 32, and a tearing roller 33. The supply roller 31 is wound with a film 1 which is rotatably driven to output the film 1 along the arrow A1. . The tear-off roller 33 is disposed on the rear side of the supply roller 31, and can peel off the second protective layer 13 of the film 1 output from the supply roller 31, so that the film 1 forms a combination of the first protective layer and the photoresist layer. 14, and the second protective layer 13 which is torn off, through the rotation of the recovery roller 32, the second protective layer 13 which is torn off can be transported to the recovery roller 32 in the direction of the arrow A2 to The protective layer 13 is wound together. In addition, the assembly 14 of the first protective layer and the photoresist layer can be driven in the direction of the arrow A3 by the rotation of the supply roller 31 and the recovery member 4. In the embodiment, the recovery member 4 is a roller. The combination of the first protective layer and the photoresist layer 14 can be wound together by the rotation of the recycling member 4.

如圖3及圖4所示,壓合裝置70包含一承載座7及一壓合盤8,承載座7設置於撕離滾軸33與回收元件4之間且間隔位於薄膜1的第一保護層及光阻層的組合體14下方,壓合盤8間隔位於薄膜1的第一保護層及光阻層的組合體14上方且對應於承載座7上方的位置。承載座7包括一固定座體71,及一設置於固定座體71內的頂推件72,固定座體71包含一座本體710,及一設置於座本體710內用以對基材2(如圖2)加熱的下加熱元件716,下加熱元件716包括一用以產生熱源的加熱部717、一設置於加熱部717頂端並可與基材2接觸的導熱部718,及一設置於加熱部717底端的隔熱部719,固定座體71之導熱部718的一頂面711可供基材2放置,導熱部718可將加熱部717所產生的熱源傳導至基材2,藉此,可對基材2均勻地加熱。另外,隔熱部719則用以阻隔加熱部717所產生的熱源向下發散,使得加熱部717的熱源大部份都能有效地透過導熱部718 的傳導而對基材2加熱,藉此,能避免熱源的損失。As shown in FIG. 3 and FIG. 4, the pressing device 70 includes a carrier 7 and a pressing plate 8. The carrier 7 is disposed between the tearing roller 33 and the recovery member 4 and is spaced apart from the first protection of the film 1. Below the assembly 14 of layers and photoresist layers, the press-disc discs 8 are spaced above the first protective layer of the film 1 and the combination of photoresist layers 14 and correspond to positions above the carrier 7. The carrier 7 includes a fixing body 71 and a pushing member 72 disposed in the fixing body 71. The fixing body 71 includes a body 710, and is disposed in the seat body 710 for the substrate 2 (eg 2) a heated lower heating element 716 comprising a heating portion 717 for generating a heat source, a heat conducting portion 718 disposed at the top end of the heating portion 717 and in contact with the substrate 2, and a heating portion 718 disposed at the heating portion The heat insulating portion 719 at the bottom end of the 717, a top surface 711 of the heat conducting portion 718 of the fixing base 71 can be placed on the substrate 2, and the heat conducting portion 718 can conduct the heat source generated by the heating portion 717 to the substrate 2, thereby being The substrate 2 is uniformly heated. In addition, the heat insulating portion 719 is configured to block the heat source generated by the heating portion 717 from being diverged downward, so that most of the heat source of the heating portion 717 can effectively pass through the heat conducting portion 718. The conduction of the substrate 2 is heated, whereby the loss of the heat source can be avoided.

固定座體71的座本體710以及下加熱元件716共同形成一用以供頂推件72安裝的安裝槽712,安裝槽712的一開口713形成於頂面711並可供頂推件72穿出。頂推件72底端與一驅動機構(圖未示)相連接,頂推件72可受驅動機構帶動而在一凸伸出固定座體71的頂面711以承載基材2的承載位置(如圖7所示),及一使基材2貼覆於頂面711的收合位置(如圖8所示)之間往復運動。當移載機構(圖未示)將基材2平移至間隔承載座7上方一段距離時,頂推件72能上移至承載位置以承載基材2,藉此,可縮短頂推件72與基材2之間的距離,以避免移載機構在放置基材2於承載座7之頂面711的過程中因為落摔而造成基材2受損的情形產生。較佳地,頂推件72包含一吸氣孔721,吸氣孔721包括一呈縱向延伸的孔部722(如圖7所示),及複數個形成於頂端並與孔部722相連通的溝槽部723,各溝槽部723呈圓環形並可吸附基材2,藉此,當頂推件72帶動基材2在承載位置與收合位置之間移動的過程中,能避免基材2產生晃動的情形。The seat body 710 of the fixing base 71 and the lower heating element 716 together form a mounting groove 712 for mounting the pushing member 72. An opening 713 of the mounting groove 712 is formed on the top surface 711 and is permeable to the pushing member 72. . The bottom end of the pushing member 72 is connected to a driving mechanism (not shown), and the pushing member 72 can be driven by the driving mechanism to protrude from the top surface 711 of the fixing base 71 to carry the bearing position of the substrate 2 ( As shown in FIG. 7 and a reciprocating motion between the folded position of the substrate 2 attached to the top surface 711 (shown in FIG. 8). When the transfer mechanism (not shown) translates the substrate 2 to a distance above the spacer carrier 7, the pushing member 72 can be moved up to the carrying position to carry the substrate 2, whereby the pushing member 72 can be shortened The distance between the substrates 2 prevents the transfer mechanism from being damaged by the falling of the substrate 2 during the placement of the substrate 2 on the top surface 711 of the carrier 7. Preferably, the pushing member 72 includes an air suction hole 721. The air suction hole 721 includes a longitudinally extending hole portion 722 (shown in FIG. 7), and a plurality of holes are formed at the top end and communicate with the hole portion 722. The groove portion 723 has a circular ring shape and can adsorb the substrate 2, thereby avoiding the base when the pushing member 72 drives the substrate 2 to move between the carrying position and the folding position. The material 2 is shaken.

如圖3及圖5所示,壓合盤8包含一座體81、一彈性壓膜82及一壓環83,彈性壓膜82為矽膠或橡膠材質所製成,彈性壓膜82外周緣是透過壓環83的壓合而固定在座體81底面,使得彈性壓膜82能接合在座體81與壓環83之間。壓合盤8還包含一設置於座體81內的上加熱元件84,上加熱元件84包括一用以產生熱源的加熱部841、一設 置於加熱部841底端與彈性壓膜82之間的導熱部842,及一設置於加熱部841頂端的隔熱部843,導熱部842與彈性壓膜82內表面接觸並可將加熱部841所產生的熱源傳導至彈性壓膜82,藉此,可對彈性壓膜82均勻地加熱。另外,隔熱部843則用以阻隔加熱部841所產生的熱源向上發散,使得加熱部841的熱源大部份都能有效地透過導熱部842的傳導而對彈性壓膜82加熱,藉此,能避免熱源的損失。As shown in FIG. 3 and FIG. 5, the pressing plate 8 comprises a body 81, an elastic pressing film 82 and a pressing ring 83. The elastic pressing film 82 is made of silicone rubber or rubber material, and the outer periphery of the elastic pressing film 82 is transparent. The press ring 83 is press-fitted to the bottom surface of the seat body 81 so that the elastic press film 82 can be engaged between the seat body 81 and the pressure ring 83. The pressing plate 8 further includes an upper heating element 84 disposed in the base 81. The upper heating element 84 includes a heating portion 841 for generating a heat source. The heat conducting portion 842 disposed between the bottom end of the heating portion 841 and the elastic pressing film 82, and the heat insulating portion 843 disposed at the top end of the heating portion 841, the heat conducting portion 842 is in contact with the inner surface of the elastic pressing film 82 and the heating portion 841 can be The generated heat source is conducted to the elastic pressing film 82, whereby the elastic pressing film 82 can be uniformly heated. In addition, the heat insulating portion 843 is configured to block the heat source generated by the heating portion 841 from being diverged upward, so that most of the heat source of the heating portion 841 can effectively pass through the conduction of the heat conducting portion 842 to heat the elastic pressing film 82, thereby Can avoid the loss of heat source.

壓合盤8還包含一形成於座體81與上加熱元件84之間的第一氣體流道85,第一氣體流道85的一端是與氣體供應裝置(圖未示)相連接,而另一端則被彈性壓膜82所封閉,透過氣體供應裝置的控制使得第一氣體流道85可對彈性壓膜82吸氣或吹氣,藉此,使得彈性壓膜82能貼覆於上加熱元件84的導熱部842上,或者是與導熱部842分離而凸伸出壓環83底面。另外,壓合盤8可透過驅動機構的帶動在一間隔位於承載座7上方的初始位置(如圖3所示),及一壓合於承載座7的壓合位置(如圖10所示)之間往復運動,當壓合盤8在壓合位置時,透過第一氣體流道85對彈性壓膜82吹氣使得彈性壓膜82能壓迫薄膜1的第一保護層及光阻層的組合體14使其貼覆在基材2的表面22(如圖2所示)。The pressure plate 8 further includes a first gas flow path 85 formed between the seat body 81 and the upper heating element 84. One end of the first gas flow path 85 is connected to a gas supply device (not shown), and the other One end is closed by the elastic pressing film 82, and the first gas flow path 85 can inhale or blow the elastic pressing film 82 by the control of the gas supply device, whereby the elastic pressing film 82 can be attached to the upper heating element. The heat conducting portion 842 of the 84 is separated from the heat conducting portion 842 and protrudes from the bottom surface of the pressing ring 83. In addition, the pressing plate 8 can be driven by the driving mechanism at an initial position (shown in FIG. 3) spaced above the carrier 7, and a pressing position pressed against the carrier 7 (as shown in FIG. 10). During the reciprocating motion, when the pressing plate 8 is in the pressing position, the elastic pressing film 82 is blown through the first gas flow path 85 so that the elastic pressing film 82 can press the combination of the first protective layer and the photoresist layer of the film 1. The body 14 is attached to the surface 22 of the substrate 2 (as shown in Figure 2).

高度調整裝置5包括二相間隔且鄰近於撕離滾軸33的活動滾輪51、52,及一鄰近於回收元件4的固定滾輪53,二活動滾輪51、52及固定滾輪53用以供薄膜1的第一保護層及光阻層的組合體14纏繞,二活動滾輪51、52可相 對於固定滾輪53水平地移動,以帶動薄膜1的第一保護層及光阻層的組合體14在一第一高度位置(如圖3所示),及一高度低於第一高度位置的第二高度位置(如圖9所示)之間移動。當在第一高度位置時,第一保護層及光阻層的組合體14間隔位於承載座7的上方,藉此,使得第一保護層及光阻層的組合體14與承載座7之間具有空間可供移載機構伸入以進行基材2的置放動作。當在第二高度位置時,第一保護層及光阻層的組合體14靠近承載座7並且鄰近於基材2的表面22。The height adjusting device 5 includes movable rollers 51, 52 spaced apart from each other and adjacent to the tearing roller 33, and a fixed roller 53 adjacent to the recovery member 4, and two movable rollers 51, 52 and a fixed roller 53 for the film 1 The first protective layer and the combination of the photoresist layers 14 are wound, and the two movable rollers 51 and 52 can be phased. The fixed roller 53 is horizontally moved to drive the assembly 14 of the first protective layer and the photoresist layer of the film 1 at a first height position (as shown in FIG. 3), and a height lower than the first height position. Move between the two height positions (as shown in Figure 9). When in the first height position, the combination 14 of the first protective layer and the photoresist layer is spaced above the carrier 7, whereby the combination of the first protective layer and the photoresist layer 14 and the carrier 7 There is a space for the transfer mechanism to extend to perform the placement of the substrate 2. When in the second height position, the first protective layer and the combination of photoresist layers 14 are adjacent to the carrier 7 and adjacent to the surface 22 of the substrate 2.

在本實施例中,二活動滾輪51、52與固定滾輪53位在同一水平高度位置,薄膜1的第一保護層及光阻層的組合體14纏繞在固定滾輪53頂端與其中一活動滾輪51頂端,使得第一保護層及光阻層的組合體14能被支撐在第一高度位置。由於第一保護層及光阻層的組合體14穿過二活動滾輪51、52之間並且纏繞在其中另一活動滾輪52底端,且活動滾輪52底端鄰近於承載座7之固定座體71的頂面711,藉此,透過二活動滾輪51、52水平地移動並朝固定滾輪53方向靠近,即可將第一保護層及光阻層的組合體14下壓使其調整到第二高度位置。In this embodiment, the two movable rollers 51, 52 and the fixed roller 53 are at the same horizontal position, and the first protective layer and the photoresist layer assembly 14 of the film 1 are wound around the top of the fixed roller 53 and one of the movable rollers 51. The top end enables the combination 14 of the first protective layer and the photoresist layer to be supported at the first height position. Since the first protective layer and the combination of the photoresist layers 14 pass between the two movable rollers 51, 52 and are wound around the bottom end of the other movable roller 52, and the bottom end of the movable roller 52 is adjacent to the fixed seat of the carrier 7. The top surface 711 of the 71, whereby the first protective layer and the photoresist layer assembly 14 are pressed down to be adjusted to the second position by moving the two movable rollers 51, 52 horizontally and approaching the fixed roller 53. Height position.

以下將針對壓合機300的壓合方法進行詳細說明:如圖3、圖6及圖7所示,圖6為薄膜1的壓合方法流程圖,圖6的主要流程為:如步驟91,透過承載座7承載基材2。The following is a detailed description of the pressing method of the press machine 300: as shown in FIG. 3, FIG. 6 and FIG. 7, FIG. 6 is a flow chart of the pressing method of the film 1, and the main flow of FIG. 6 is as follows: The substrate 2 is carried through the carrier 7.

在使用壓合機300時,壓合盤8是在一間隔位於承載 座7上方的初始位置(如圖7所示),且二活動滾輪51、52是在一鄰近於撕離滾軸33的第一位置,此時,活動滾輪51及固定滾輪53可將第一保護層及光阻層的組合體14支撐在第一高度位置,藉此,第一保護層及光阻層的組合體14與固定座體71之間具有空間可供頂推件72活動,並且可供移載機構伸入以進行基材2的置放動作。另外,透過第一氣體流道85向上吸氣並抽真空,使得彈性壓膜82能保持在貼覆於上加熱元件84的導熱部842上的位置,藉此,以便於導熱部842能將加熱部841產生的熱源傳遞至彈性壓膜82,以對彈性壓膜82進行加熱。When the press machine 300 is used, the press plate 8 is placed at a space The initial position above the seat 7 (as shown in FIG. 7), and the two movable rollers 51, 52 are in a first position adjacent to the tear-off roller 33. At this time, the movable roller 51 and the fixed roller 53 can be first. The combination of the protective layer and the photoresist layer 14 is supported at the first height position, whereby a space between the assembly 14 of the first protective layer and the photoresist layer and the fixed seat 71 is movable for the pusher 72, and The transfer mechanism can be inserted to perform the placement of the substrate 2. In addition, the first gas passage 85 is sucked up and evacuated, so that the elastic laminate 82 can be held at a position on the heat conducting portion 842 of the upper heating member 84, thereby allowing the heat conducting portion 842 to heat. The heat source generated by the portion 841 is transmitted to the elastic pressing film 82 to heat the elastic pressing film 82.

藉由驅動機構帶動頂推件72由圖3所示的收合位置沿箭頭I方向向上移動至承載位置後,移載機構能伸入第一保護層及光阻層的組合體14與固定座體71之間,以將基材2移載至頂推件72上供頂推件72承載。透過頂推件72的吸氣孔721朝下吸氣,使得基材2能被溝槽部723吸附在頂推件72的頂面。接著,如圖8所示,驅動機構會帶動頂推件72由承載位置沿箭頭II方向向下移動,由於基材2被吸氣孔721的溝槽部723所吸附,因此在下移過程中,能避免基材2產生晃動的情形。當頂推件72向下移動到收合位置時,基材2會貼覆在固定座體71之下加熱元件716的頂面711。固定座體71還包含一形成於座本體710與下加熱元件716上的第二氣體流道715,第二氣體流道715包括一與氣體供應裝置相連接的孔部720,及複數個形成於頂面711並與孔部720相連通的溝槽部724,各溝槽部724呈圓 環形用以對基材2吸氣,使得基材2能平整地貼覆在固定座體71的頂面711,以避免基材2只透過吸氣孔721吸附時會造成外周圍處往上翹的情形。After the driving mechanism drives the pushing member 72 to move upward from the folding position shown in FIG. 3 in the direction of the arrow I to the carrying position, the transfer mechanism can extend into the assembly 14 and the fixing seat of the first protective layer and the photoresist layer. Between the bodies 71, the substrate 2 is transferred to the pushing member 72 for carrying by the pushing member 72. The air suction hole 721 of the pushing member 72 is sucked downward so that the base material 2 can be attracted to the top surface of the pushing member 72 by the groove portion 723. Next, as shown in FIG. 8, the driving mechanism drives the pushing member 72 to move downward from the carrying position in the direction of the arrow II. Since the substrate 2 is adsorbed by the groove portion 723 of the air suction hole 721, during the downward movement, It is possible to avoid the situation in which the substrate 2 is shaken. When the pusher 72 is moved down to the collapsed position, the substrate 2 will be applied to the top surface 711 of the heating element 716 below the fixed seat 71. The fixed seat body 71 further includes a second gas flow path 715 formed on the seat body 710 and the lower heating element 716. The second gas flow path 715 includes a hole portion 720 connected to the gas supply device, and a plurality of holes 720 are formed on the gas supply device. a groove portion 724 of the top surface 711 and communicating with the hole portion 720, each groove portion 724 is round The ring is used for inhaling the substrate 2, so that the substrate 2 can be flatly attached to the top surface 711 of the fixing body 71, so as to prevent the substrate 2 from being lifted up only through the suction hole 721. The situation.

如圖6及圖9所示,如步驟92,向下調整薄膜1高度,使薄膜1鄰近於基材2的表面22。As shown in FIGS. 6 and 9, as in step 92, the height of the film 1 is adjusted downward so that the film 1 is adjacent to the surface 22 of the substrate 2.

驅動供應滾軸31、回收滾軸32及回收元件4旋轉,使得薄膜1的第一保護層及光阻層的組合體14能沿箭頭A3方向被輸送至回收元件4上。接著,驅動二活動滾輪51、52由第一位置沿箭頭A3方向水平移動,活動滾輪52在移動過程中會逐漸地將第一保護層及光阻層的組合體14往下壓,待二活動滾輪51、52移動到一鄰近於固定滾輪53的第二位置(如圖9所示)時,活動滾輪52及撕離滾軸33共同將第一保護層及光阻層的組合體14支撐在第二高度位置,使得第一保護層及光阻層的組合體14能鄰近於基材2的表面22並與表面22保持一段距離,以便於壓合盤8將第一保護層及光阻層的組合體14平整地壓合在基材2的表面22,能防止壓合過程中第一保護層及光阻層的組合體14產生皺折的情形。The drive supply roller 31, the recovery roller 32, and the recovery member 4 are rotated, so that the first protective layer of the film 1 and the combination of the photoresist layers 14 can be transported to the recovery member 4 in the direction of the arrow A3. Then, the two movable rollers 51, 52 are driven to move horizontally in the direction of the arrow A3 by the first position, and the movable roller 52 gradually presses the first protective layer and the combination of the photoresist layers 14 during the moving process. When the rollers 51, 52 are moved to a second position adjacent to the fixed roller 53, as shown in FIG. 9, the movable roller 52 and the tear-off roller 33 jointly support the combination of the first protective layer and the photoresist layer 14 The second height position is such that the first protective layer and the photoresist layer assembly 14 can be adjacent to the surface 22 of the substrate 2 and at a distance from the surface 22, so that the first protective layer and the photoresist layer are pressed by the bonding pad 8. The assembly 14 is flatly pressed against the surface 22 of the substrate 2 to prevent wrinkles in the assembly 14 of the first protective layer and the photoresist layer during the pressing process.

如圖6及圖10所示,如步驟93,壓合壓合盤8於承載座7上,對壓合盤8的彈性壓膜82朝下吹氣,彈性壓膜82壓迫薄膜1使其貼覆於基材2的表面22。As shown in FIG. 6 and FIG. 10, in step 93, the pressure-bonding disc 8 is pressed onto the carrier 7, and the elastic pressing film 82 of the pressing disc 8 is blown downward, and the elastic pressing film 82 presses the film 1 to stick it. Covering the surface 22 of the substrate 2.

驅使供應滾軸31、回收滾軸32及回收元件4停止旋轉,使第一保護層及光阻層的組合體14保持不動的狀態,接著,藉由驅動機構帶動壓合盤8沿箭頭II方向下移,當壓 合盤8的壓環83將薄膜1的第一保護層及光阻層的組合體14抵壓於承載座7的一設置於頂面711的氣密環714時,壓合盤8與承載座7之間所形成的一腔室9呈一氣密狀態,其中,氣密環714是由橡膠或矽膠等彈性材質所製成。在氣密狀態下,上加熱元件84的加熱部841會產生熱源,使得導熱部842能對彈性壓膜82進行加熱,而下加熱元件716的加熱部717也會產生熱源,使得導熱部718能對基材2進行加熱。The supply roller 31, the recovery roller 32 and the recovery element 4 are driven to stop rotating, and the first protective layer and the photoresist layer assembly 14 are kept in a stationary state. Then, the driving mechanism drives the pressure plate 8 in the direction of the arrow II. Move down, when pressed When the pressure ring 83 of the lap 8 presses the first protective layer of the film 1 and the combination 14 of the photoresist layer against the airtight ring 714 of the top surface 711 of the carrier 7, the pressure plate 8 and the carrier A chamber 9 formed between 7 is in an airtight state, wherein the airtight ring 714 is made of an elastic material such as rubber or silicone. In the airtight state, the heating portion 841 of the upper heating element 84 generates a heat source, so that the heat conducting portion 842 can heat the elastic pressing film 82, and the heating portion 717 of the lower heating element 716 also generates a heat source, so that the heat conducting portion 718 can The substrate 2 is heated.

接著,如圖11及圖12所示,固定座體71還包含一形成於座本體710上的第三氣體流道725,第三氣體流道725包括一與氣體供應裝置相連接的孔部726,及一形成於下加熱元件716外周圍與座本體710之間的溝槽部727,各溝槽部727呈圓環形用以對腔室9向下吸氣,同時,壓合盤8的第一氣體流道85會對彈性壓膜82朝下吹氣而解除真空狀態,藉此,彈性壓膜82會向下壓迫並擠壓薄膜1的第一保護層及光阻層的組合體14,使光阻層11貼覆在基材2的表面22上。受到壓合盤8將薄膜1的第一保護層及光阻層的組合體14抵壓於承載座7,使得光阻層11會同時貼覆在承載座7之固定座體71的頂面711。由於彈性壓膜82具有彈性並且能塑性變形,因此,彈性壓膜82受第一氣體流道85的氣體下壓以及第三氣體流道725的溝槽部727吸附時,彈性壓膜82能將光阻層11擠壓入基材2之表面22的凹部221內,使得光阻層11能填覆基材2之凹凸不平的表面22,藉此,能減少光阻層11與基材2之表面22間的空隙。Next, as shown in FIG. 11 and FIG. 12, the fixing base 71 further includes a third gas flow path 725 formed on the seat body 710, and the third gas flow path 725 includes a hole portion 726 connected to the gas supply device. And a groove portion 727 formed between the outer periphery of the lower heating element 716 and the seat body 710, each groove portion 727 being annularly shaped to inhale the chamber 9 downwardly, and at the same time, pressing the disk 8 The first gas flow path 85 blows the elastic pressure film 82 downward to release the vacuum state, whereby the elastic pressure film 82 presses down and presses the first protective layer of the film 1 and the combination of the photoresist layers 14 The photoresist layer 11 is applied to the surface 22 of the substrate 2. The first protective layer and the combination of the photoresist layers 14 of the film 1 are pressed against the carrier 7 by the pressing pad 8, so that the photoresist layer 11 is simultaneously attached to the top surface 711 of the fixing body 71 of the carrier 7. . Since the elastic pressing film 82 is elastic and plastically deformable, when the elastic pressing film 82 is adsorbed by the gas of the first gas flow path 85 and the groove portion 727 of the third gas flow path 725, the elastic pressing film 82 can The photoresist layer 11 is extruded into the concave portion 221 of the surface 22 of the substrate 2, so that the photoresist layer 11 can fill the uneven surface 22 of the substrate 2, whereby the photoresist layer 11 and the substrate 2 can be reduced. A gap between the surfaces 22.

如圖6、圖13及圖14所示,如步驟94,對彈性壓膜82朝上吸氣,使彈性壓膜82與薄膜1分離,並且移離壓合盤8使其與承載座7分離。As shown in FIG. 6, FIG. 13, and FIG. 14, as in step 94, the elastic pressing film 82 is sucked upward, the elastic pressing film 82 is separated from the film 1, and the pressing plate 8 is separated from the bearing block 7 to be separated from the carrier 7. .

透過第三氣體流道725的溝槽部727停止吸氣,以及第一氣體流道85向上吸氣,使得彈性壓膜82能被向上吸附而與第一保護層及光阻層的組合體14的第一保護層12分離,藉此,使彈性壓膜82能回復到貼覆於上加熱元件84的導熱部842上的位置。如圖15所示,藉由驅動機構帶動壓合盤8沿箭頭I方向上移,使壓合盤8回復到間隔位於承載座7上方的初始位置。The suction is stopped through the groove portion 727 of the third gas flow path 725, and the first gas flow path 85 is sucked upward, so that the elastic pressure film 82 can be adsorbed upward and combined with the first protective layer and the photoresist layer 14 The first protective layer 12 is separated, whereby the elastic laminate 82 can be returned to a position that is attached to the heat conducting portion 842 of the upper heating element 84. As shown in FIG. 15, the pressing mechanism 8 is moved upward in the direction of the arrow I by the driving mechanism, so that the pressing plate 8 is returned to the initial position where the spacing is above the carrier 7.

如圖6、圖16及圖17所示,如步驟95,切割薄膜1貼覆於基材2的表面22部分以形成一與基材2大小相當的薄膜片體15。As shown in FIGS. 6, 16, and 17, in step 95, the dicing film 1 is attached to the surface 22 portion of the substrate 2 to form a film sheet 15 having a size equivalent to that of the substrate 2.

切割元件6在本實施例中是以一切刀為例作說明,藉由移載機構(圖未示)帶動切割元件6移動至第一保護層及光阻層的組合體14上,接著,帶動切割元件6沿箭頭III方向旋轉並切割第一保護層及光阻層的組合體14貼覆於基材2的表面22部份,以形成一與基材2大小相當的薄膜片體15。需說明的是,在應用上,切割元件6也可透過雷射對第一保護層及光阻層的組合體14進行裁切的動作,並不以切刀的形式為限。In this embodiment, the cutting element 6 is exemplified by all the knives, and the cutting member 6 is driven to move to the assembly 14 of the first protective layer and the photoresist layer by a transfer mechanism (not shown), and then driven. The combination of the cutting element 6 in the direction of the arrow III and cutting the first protective layer and the photoresist layer 14 is applied to the surface 22 portion of the substrate 2 to form a film sheet 15 having a size equivalent to that of the substrate 2. It should be noted that, in application, the cutting element 6 can also perform the cutting action of the combination of the first protective layer and the photoresist layer by laser, and is not limited to the form of the cutter.

如圖6及圖18所示,如步驟96,冷卻承載座7,向上調整薄膜1高度,使薄膜1剝離承載座7。As shown in FIGS. 6 and 18, as in step 96, the carrier 7 is cooled, and the height of the film 1 is adjusted upward to peel the film 1 from the carrier 7.

由於彈性壓膜82壓迫第一保護層及光阻層的組合體14 於基材2的表面22過程中,受到上、下加熱元件84、716的加熱,使得光阻層11會黏附在基材2的表面22以及承載座7之固定座體71的頂面711。因此,為了便於將光阻層11剝離固定座體71的頂面711,承載座7還包含一設置於固定座體71上用以冷卻固定座體71的冷卻元件73,藉由冷卻元件73冷卻固定座體71,使得黏附在固定座體71的頂面711上的光阻層11溫度能夠下降。接著,二活動滾輪51、52由第二位置沿箭頭IV方向朝第一位置復位的過程中,二活動滾輪51、52會旋轉且能輕易地將第一保護層及光阻層的組合體14剝離固定座體71的頂面711,並同時與貼覆於基材2的表面22之薄膜片體15分離,待二活動滾輪51、52復位到第一位置時,第一保護層及光阻層的組合體14會完全剝離固定座體71的頂面711並且與薄膜片體15分離。Since the elastic pressing film 82 presses the combination of the first protective layer and the photoresist layer 14 During the surface 22 of the substrate 2, it is heated by the upper and lower heating elements 84, 716 such that the photoresist layer 11 adheres to the surface 22 of the substrate 2 and the top surface 711 of the holder 71 of the carrier 7. Therefore, in order to facilitate the peeling of the photoresist layer 11 from the top surface 711 of the fixing body 71, the carrier 7 further includes a cooling element 73 disposed on the fixing body 71 for cooling the fixing body 71, which is cooled by the cooling element 73. The seat body 71 is fixed such that the temperature of the photoresist layer 11 adhered to the top surface 711 of the fixed seat body 71 can be lowered. Then, during the resetting of the second movable rollers 51, 52 by the second position in the direction of the arrow IV toward the first position, the two movable rollers 51, 52 are rotated and the combination of the first protective layer and the photoresist layer can be easily combined. The top surface 711 of the fixing base 71 is peeled off and simultaneously separated from the film sheet 15 attached to the surface 22 of the substrate 2. When the two movable rollers 51, 52 are reset to the first position, the first protective layer and the photoresist are The assembly 14 of the layer completely peels off the top surface 711 of the fixed seat 71 and is separated from the film sheet 15.

如圖6及圖19所示,如步驟97,將基材2及貼覆於基材2的表面22的薄膜片體15頂離承載座7。As shown in FIGS. 6 and 19, in step 97, the substrate 2 and the film sheet 15 attached to the surface 22 of the substrate 2 are lifted off the carrier 7.

藉由第二氣體流道715的溝槽部724停止吸氣,使得基材2不會被吸附在頂面711,藉此,當驅動機構帶動頂推件72沿箭頭I方向向上移動時,基材2能輕易地被頂推件72往上頂。當頂推件72上移至承載位置後,移載機構即可伸入第一保護層及光阻層的組合體14與固定座體71之間將基材2移離頂推件72,此時,即完成薄膜1的壓合作業。之後,重覆步驟91~97即可進行薄膜1與下一個基材2的壓合作業。The suction is stopped by the groove portion 724 of the second gas flow path 715, so that the substrate 2 is not adsorbed on the top surface 711, whereby when the driving mechanism drives the pushing member 72 to move upward in the direction of the arrow I, the base The material 2 can be easily pushed up by the pusher 72. After the pushing member 72 is moved up to the carrying position, the transfer mechanism can extend between the first protective layer and the combination of the photoresist layer 14 and the fixing body 71 to move the substrate 2 away from the pushing member 72. At the time, the press cooperation of the film 1 is completed. Thereafter, the press bonding of the film 1 and the next substrate 2 can be carried out by repeating steps 91 to 97.

歸納上述,本實施例的壓合機300,藉由壓合盤8之彈性壓膜82設計,當壓合盤8在壓合位置時,第一氣體流道85會對彈性壓膜82朝下吹氣,彈性壓膜82會向下壓迫並擠壓薄膜1之第一保護層及光阻層的組合體14,使光阻層11被擠壓入基材2之表面22的凹部221內,使得光阻層11能填覆基材2之表面22,藉此,能減少光阻層11與基材2之表面22間的空隙,以提昇壓合的良率。再者,透過先將薄膜1之第一保護層及光阻層的組合體14壓合於基材2的表面22後,再由第一保護層及光阻層的組合體14上切割出與基材2大小相當的薄膜片體15的方式,能提昇薄膜1之壓合過程的速率,以縮短壓合的工時,故確實能達成本發明所訴求之目的。In summary, the press machine 300 of the present embodiment is designed by the elastic pressing film 82 of the pressing plate 8. When the pressing plate 8 is in the pressing position, the first gas flow path 85 faces the elastic pressing film 82 downward. When the air is blown, the elastic pressing film 82 presses down and presses the first protective layer of the film 1 and the combination 14 of the photoresist layer, so that the photoresist layer 11 is pressed into the concave portion 221 of the surface 22 of the substrate 2, The photoresist layer 11 is allowed to fill the surface 22 of the substrate 2, whereby the gap between the photoresist layer 11 and the surface 22 of the substrate 2 can be reduced to improve the yield of the press. Furthermore, after the first protective layer 14 and the photoresist layer 14 are bonded to the surface 22 of the substrate 2, the first protective layer and the photoresist layer 14 are cut out. The manner of the film sheet 15 having the same size of the substrate 2 can increase the rate of the pressing process of the film 1 to shorten the working time of the pressing, so that the object of the present invention can be achieved.

惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

1‧‧‧薄膜1‧‧‧film

11‧‧‧光阻層11‧‧‧Photoresist layer

12‧‧‧第一保護層12‧‧‧First protective layer

13‧‧‧第二保護層13‧‧‧Second protective layer

14‧‧‧第一保護層及光阻層的組合體14‧‧‧Combination of first protective layer and photoresist layer

15‧‧‧薄膜片體15‧‧‧film sheet

2‧‧‧基材2‧‧‧Substrate

21‧‧‧凸部21‧‧‧ convex

22‧‧‧表面22‧‧‧ Surface

221‧‧‧凹部221‧‧‧ recess

300‧‧‧壓合機300‧‧‧Compression machine

3‧‧‧供料裝置3‧‧‧Feeding device

31‧‧‧供應滾軸31‧‧‧Supply roller

32‧‧‧回收滾軸32‧‧‧Recycling roller

33‧‧‧撕離滾軸33‧‧‧Tear off the roller

4‧‧‧回收元件4‧‧‧Recycling components

5‧‧‧高度調整裝置5‧‧‧ Height adjustment device

51、52‧‧‧活動滾輪51, 52‧‧‧ activity scroll wheel

53‧‧‧固定滾輪53‧‧‧Fixed roller

6‧‧‧切割元件6‧‧‧ cutting elements

70‧‧‧壓合裝置70‧‧‧ Pressing device

7‧‧‧承載座7‧‧‧Hosting

71‧‧‧固定座體71‧‧‧ fixed seat

710‧‧‧座本體710‧‧‧

711‧‧‧頂面711‧‧‧ top surface

712‧‧‧安裝槽712‧‧‧Installation slot

713‧‧‧開口713‧‧‧ openings

714‧‧‧氣密環714‧‧‧ airtight ring

715‧‧‧第二氣體流道715‧‧‧Second gas flow path

716‧‧‧下加熱元件716‧‧‧ Lower heating element

717‧‧‧加熱部717‧‧‧ heating department

718‧‧‧導熱部718‧‧‧Transfer Department

719‧‧‧隔熱部719‧‧‧Insulation

720‧‧‧孔部720‧‧‧ Hole Department

72‧‧‧頂推件72‧‧‧Pushing pieces

721‧‧‧吸氣孔721‧‧‧ suction holes

722‧‧‧孔部722‧‧‧ Hole Department

723‧‧‧溝槽部723‧‧‧ Groove

724‧‧‧溝槽部724‧‧‧ Groove Department

725‧‧‧第三氣體流道725‧‧‧ third gas flow path

726‧‧‧孔部726‧‧‧ Hole Department

727‧‧‧溝槽部727‧‧‧ Groove Department

73‧‧‧冷卻元件73‧‧‧ Cooling element

8‧‧‧壓合盤8‧‧‧Compression plate

81‧‧‧座體81‧‧‧ body

82‧‧‧彈性壓膜82‧‧‧Elastic film

83‧‧‧壓環83‧‧‧ Pressure ring

84‧‧‧上加熱元件84‧‧‧Upper heating element

841‧‧‧加熱部841‧‧‧ heating department

842‧‧‧導熱部842‧‧‧Transfer Department

843‧‧‧隔熱部843‧‧‧Insulation Department

85‧‧‧第一氣體流道85‧‧‧First gas flow path

9‧‧‧腔室9‧‧‧ chamber

A1、A2‧‧‧箭頭A1, A2‧‧‧ arrows

A3‧‧‧箭頭A3‧‧‧ arrow

I、II‧‧‧箭頭I, II‧‧‧ arrows

III、IV‧‧‧箭頭III, IV‧‧‧ arrows

圖1是本發明壓合機的一較佳實施例的薄膜的局部剖視圖;圖2是本發明壓合機的一較佳實施例的基材的局部剖視圖;圖3是本發明壓合機的一較佳實施例的示意圖,說明頂推件位在收合位置,壓合盤位在初始位置,薄膜的第一保護層及光阻層位在第一高度位置; 圖4是本發明壓合機的一較佳實施例的承載座的俯視圖;圖5是本發明壓合機的一較佳實施例的壓合盤的仰視圖;圖6是本發明壓合機的一較佳實施例的薄膜的壓合方法流程圖;圖7是本發明壓合機的一較佳實施例的示意圖,說明頂推件位在承載位置;圖8是本發明壓合機的一較佳實施例的示意圖,說明頂推件下移到收合位置;圖9是本發明壓合機的一較佳實施例的示意圖,說明薄膜的第一保護層及光阻層位在第二高度位置;圖10是本發明壓合機的一較佳實施例的示意圖,說明壓合盤下移到壓合位置;圖11是本發明壓合機的一較佳實施例的示意圖,說明第一氣體流道對彈性壓膜朝下吹氣,彈性壓膜會向下壓迫薄膜的第一保護層及光阻層使其貼覆在基材的表面;圖12是本發明壓合機的一較佳實施例的局部剖視圖,說明彈性壓膜將光阻層擠壓入基材表面的凹部內;圖13是本發明壓合機的一較佳實施例的示意圖,說明第一氣體流道對彈性壓膜朝上吸氣;圖14是本發明壓合機的一較佳實施例的局部剖視圖,說明光阻層填覆於基材表面的凹部內;圖15是本發明壓合機的一較佳實施例的示意圖,說明 壓合盤復位到初始位置;圖16是本發明壓合機的一較佳實施例的示意圖,說明切割元件裁切薄膜的第一保護層及光阻層;圖17是本發明壓合機的一較佳實施例的示意圖,說明第一保護層及光阻層上切割形成薄膜片體;圖18是本發明壓合機的一較佳實施例的示意圖,說明薄膜的第一保護層及光阻層復位到第一高度位置;及圖19是本發明壓合機的一較佳實施例的示意圖,說明頂推件將基材及薄膜片體頂推到承載位置。1 is a partial cross-sectional view of a film of a preferred embodiment of the press machine of the present invention; FIG. 2 is a partial cross-sectional view of a substrate of a preferred embodiment of the press machine of the present invention; and FIG. 3 is a view of the press machine of the present invention. A schematic view of a preferred embodiment shows that the pusher is in the folded position, the press position is at the initial position, and the first protective layer and the photoresist layer of the film are at the first height position; Figure 4 is a plan view of a carrier of a preferred embodiment of the press machine of the present invention; Figure 5 is a bottom plan view of a press plate of a preferred embodiment of the press of the present invention; Figure 6 is a press machine of the present invention; FIG. 7 is a schematic view of a preferred embodiment of the press machine of the present invention, illustrating the pusher position in the carrying position; FIG. 8 is a press machine of the present invention. A schematic view of a preferred embodiment illustrates the pusher member being moved down to the collapsed position; and FIG. 9 is a schematic view of a preferred embodiment of the press machine of the present invention, illustrating the first protective layer and the photoresist layer of the film. Figure 2 is a schematic view of a preferred embodiment of the press machine of the present invention, illustrating the lowering of the press-fit disc to the press-fit position; Figure 11 is a schematic view of a preferred embodiment of the press machine of the present invention, illustrating The first gas flow channel blows the elastic pressing film downward, and the elastic pressing film presses the first protective layer and the photoresist layer of the film downward to adhere to the surface of the substrate; FIG. 12 is a press machine of the present invention. A partial cross-sectional view of a preferred embodiment illustrating the elastic laminate pressing the photoresist layer into the recess of the substrate surface Figure 13 is a schematic view of a preferred embodiment of the press machine of the present invention, illustrating a first gas flow path for inhaling the elastic film upward; Figure 14 is a partial cross-sectional view of a preferred embodiment of the press machine of the present invention, The photoresist layer is filled in the concave portion of the surface of the substrate; FIG. 15 is a schematic view of a preferred embodiment of the press machine of the present invention, illustrating The pressing plate is reset to the initial position; FIG. 16 is a schematic view of a preferred embodiment of the press machine of the present invention, illustrating the first protective layer and the photoresist layer of the cutting element for cutting the film; FIG. 17 is a press machine of the present invention. A schematic view of a preferred embodiment illustrating a first protective layer and a photoresist layer formed by cutting a film sheet; FIG. 18 is a schematic view of a preferred embodiment of the press machine of the present invention, illustrating a first protective layer and light of the film The resist layer is reset to the first height position; and FIG. 19 is a schematic view of a preferred embodiment of the press machine of the present invention, illustrating that the pusher pushes the substrate and the film sheet to the carrying position.

1‧‧‧薄膜1‧‧‧film

13‧‧‧第二保護層13‧‧‧Second protective layer

14‧‧‧第一保護層及光阻層的組合體14‧‧‧Combination of first protective layer and photoresist layer

300‧‧‧壓合機300‧‧‧Compression machine

3‧‧‧供料應裝置3‧‧‧Feeding device

31‧‧‧供應滾軸31‧‧‧Supply roller

32‧‧‧回收滾軸32‧‧‧Recycling roller

33‧‧‧撕離滾軸33‧‧‧Tear off the roller

4‧‧‧回收元件4‧‧‧Recycling components

5‧‧‧高度調整裝置5‧‧‧ Height adjustment device

51、52‧‧‧活動滾輪51, 52‧‧‧ activity scroll wheel

53‧‧‧固定滾輪53‧‧‧Fixed roller

6‧‧‧切割元件6‧‧‧ cutting elements

70‧‧‧壓合裝置70‧‧‧ Pressing device

7‧‧‧承載座7‧‧‧Hosting

71‧‧‧固定座體71‧‧‧ fixed seat

710‧‧‧座本體710‧‧‧

711‧‧‧頂面711‧‧‧ top surface

712‧‧‧安裝槽712‧‧‧Installation slot

713‧‧‧開口713‧‧‧ openings

714‧‧‧氣密環714‧‧‧ airtight ring

715‧‧‧第二氣體流道715‧‧‧Second gas flow path

716‧‧‧下加熱元件716‧‧‧ Lower heating element

717‧‧‧加熱部717‧‧‧ heating department

718‧‧‧導熱部718‧‧‧Transfer Department

719‧‧‧隔熱部719‧‧‧Insulation

720‧‧‧孔部720‧‧‧ Hole Department

72‧‧‧頂推件72‧‧‧Pushing pieces

721‧‧‧吸氣孔721‧‧‧ suction holes

723‧‧‧溝槽部723‧‧‧ Groove

724‧‧‧溝槽部724‧‧‧ Groove Department

725‧‧‧第三氣體流道725‧‧‧ third gas flow path

726‧‧‧孔部726‧‧‧ Hole Department

727‧‧‧溝槽部727‧‧‧ Groove Department

73‧‧‧冷卻元件73‧‧‧ Cooling element

8‧‧‧壓合盤8‧‧‧Compression plate

81‧‧‧座體81‧‧‧ body

82‧‧‧彈性壓膜82‧‧‧Elastic film

83‧‧‧壓環83‧‧‧ Pressure ring

84‧‧‧上加熱元件84‧‧‧Upper heating element

841‧‧‧加熱部841‧‧‧ heating department

842‧‧‧導熱部842‧‧‧Transfer Department

843‧‧‧隔熱部843‧‧‧Insulation Department

85‧‧‧第一氣體流道85‧‧‧First gas flow path

A1、A2‧‧‧箭頭A1, A2‧‧‧ arrows

A3‧‧‧箭頭A3‧‧‧ arrow

Claims (10)

一種壓合機,包含:一供料裝置,提供一薄膜;一回收元件,與該薄膜一端連接並可回收該薄膜;一高度調整裝置,設置於該供料裝置與該回收元件之間,該高度調整裝置包括二相間隔且供該薄膜纏繞的活動滾輪,該二活動滾輪可帶動該薄膜在一第一高度位置,及一高度低於該第一高度位置的第二高度位置之間移動;一壓合裝置,包括:一承載座,位於該薄膜下方並可供一基材放置,當該薄膜在該第二高度位置時,該薄膜鄰近於該基材表面;一壓合盤,位於該薄膜上方並包含一設置於底端的彈性壓膜,及一可對該彈性壓膜吸氣或吹氣的第一氣體流道,該壓合盤可在一間隔位於該承載座與該薄膜上方的初始位置,及一壓合於該承載座且該彈性壓膜壓迫該薄膜使其貼覆於該基材表面的壓合位置之間往復運動;及一切割元件,設置於該壓合裝置一側,該切割元件可將該薄膜貼覆於該基材表面的部分切割,以形成一與該基材大小相當的薄膜片體;該承載座包含一供該基材放置的固定座體,及一設置於該固定座體上用以冷卻該固定座體的冷卻元件,該 壓合盤還包含一可對該彈性壓膜加熱的上加熱元件,該上加熱元件包括一用以產生熱源的加熱部、一設置於該加熱部底端與該彈性壓膜之間的導熱部,及一設置於該加熱部頂端的隔熱部。 A press machine comprising: a feeding device for providing a film; a recycling member connected to one end of the film and recovering the film; and a height adjusting device disposed between the feeding device and the recycling member, The height adjustment device includes two movable rollers that are spaced apart and wound by the film, and the two movable rollers can drive the film to move between a first height position and a second height position lower than the first height position; a pressing device comprising: a carrier located below the film and disposed for a substrate, the film being adjacent to the surface of the substrate when the film is at the second height position; a pressure plate located at the Above the film, comprising an elastic pressing film disposed at the bottom end, and a first gas flow path for inhaling or blowing the elastic pressing film, the pressing plate being located at an interval above the bearing seat and the film An initial position, and a reciprocating motion between the pressing position of the carrier and the elastic pressing film pressing the film to adhere to the surface of the substrate; and a cutting element disposed on the side of the pressing device , the The cutting element can cut a portion of the film attached to the surface of the substrate to form a film sheet having a size corresponding to the substrate; the carrier includes a fixing body for the substrate, and a a cooling element on the fixing base for cooling the fixing base body, The pressure plate further comprises an upper heating element capable of heating the elastic pressing film, the upper heating element comprising a heating portion for generating a heat source, a heat conducting portion disposed between the bottom end of the heating portion and the elastic pressing film And a heat insulating portion provided at a top end of the heating portion. 根據申請專利範圍第1項所述之壓合機,其中,該高度調整裝置還包括一供該薄膜纏繞的固定滾輪,該二活動滾輪與該固定滾輪位在同一水平高度位置,該二活動滾輪可相對於該固定滾輪移動,以帶動該薄膜在該第一、第二高度位置之間移動。 The press machine of claim 1, wherein the height adjusting device further comprises a fixed roller for winding the film, the two movable rollers are at the same level position as the fixed roller, and the two movable rollers The movable roller is movable relative to the fixed roller to move the film between the first and second height positions. 根據申請專利範圍第2項所述之壓合機,其中,該薄膜纏繞在該固定滾輪與其中一活動滾輪頂端,且該薄膜纏繞在其中另一活動滾輪底端。 The press machine of claim 2, wherein the film is wound around the fixed roller and one of the movable roller tips, and the film is wound around the bottom end of the other movable roller. 根據申請專利範圍第3項所述之壓合機,其中,該承載座包含一設置於該固定座體內的頂推件,該頂推件可在一凸伸出該固定座體以承載該基材的承載位置,及一使該基材貼覆於該固定座體的收合位置之間往復運動。 The press machine of claim 3, wherein the carrier includes a pushing member disposed in the fixing body, and the pushing member can protrude from the fixing body to carry the base. The carrying position of the material and a reciprocating motion between the folded position of the substrate and the fixed seat. 根據申請專利範圍第4項所述之壓合機,其中,該固定座體包含一頂面,及一形成於該頂面的第二氣體流道,該第二氣體流道可對該基材吸氣。 The press machine of claim 4, wherein the fixed seat body comprises a top surface, and a second gas flow path formed on the top surface, the second gas flow path can be the substrate Inhale. 根據申請專利範圍第5項所述之壓合機,其中,該固定座體還包含一形成於該頂面的第三氣體流道,當該壓合盤在該壓合位置時,該第三氣體流道可對該壓合盤與該承載座之間所形成的一腔室吸氣。 The press machine of claim 5, wherein the fixing base further comprises a third gas flow path formed on the top surface, the third when the pressing plate is in the pressing position The gas flow path can inhale a chamber formed between the pressure plate and the carrier. 根據申請專利範圍第5項所述之壓合機,其中,該固定 座體還包含一用以供該頂推件安裝的安裝槽,該安裝槽的一開口形成於該頂面,該頂推件包含一可吸附該基材的吸氣孔。 a press machine according to claim 5, wherein the fixing The base body further includes a mounting groove for mounting the pushing member, an opening of the mounting groove is formed on the top surface, and the pushing member comprises a suction hole for adsorbing the substrate. 根據申請專利範圍第7項所述之壓合機,其中,該固定座體還包含一可對該基材加熱的下加熱元件,該下加熱元件包括一用以產生熱源的加熱部、一設置於該加熱部頂端並可與該基材接觸的導熱部,及一設置於該加熱部底端的隔熱部。 The press machine of claim 7, wherein the fixing base further comprises a lower heating element capable of heating the substrate, the lower heating element comprising a heating portion for generating a heat source, and a setting a heat conducting portion at the top end of the heating portion and in contact with the substrate, and a heat insulating portion disposed at a bottom end of the heating portion. 根據申請專利範圍第1項所述之壓合機,其中,該彈性壓膜為矽膠或橡膠材質。 The press machine according to claim 1, wherein the elastic film is made of silicone or rubber. 根據申請專利範圍第1項所述之壓合機,其中,該承載座包含一供該基材放置的固定座體,及一設置於該固定座體內的頂推件,該頂推件可在一凸伸出該固定座體以承載該基材的承載位置,及一使該基材貼覆於該固定座體的收合位置之間往復運動。 The press machine of claim 1, wherein the carrier comprises a fixing base for the substrate, and a pushing member disposed in the fixing body, the pushing member is A protruding protrusion protrudes from the fixing body to carry the bearing position of the substrate, and a reciprocating motion between the folding position of the substrate and the fixing body.
TW099138816A 2010-11-11 2010-11-11 Pressing machine TWI460075B (en)

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