JP2011109007A - Mounter and mounting method - Google Patents

Abstract

To provide a mounting apparatus and a mounting method capable of integrating a ring frame and a wafer without generating excessive tension in a mounting sheet.
The mounting apparatus attaches a mounting sheet MS loosened by this movement to the center side of the wafer W1, while moving the tip of the deformation allowing member 341 to the center side of the wafer W1, and further, a second pressing member. The portion protruding from the wafer W1 of the mounting sheet MS is attached to the ring frame RF by the roller.
[Selection] Figure 2

Description

  The present invention relates to a mounting apparatus and a mounting method for integrating a frame and an adherend through an adhesive sheet in which an adhesive layer is laminated on one surface of a base sheet.

  Semiconductor wafers (hereinafter sometimes simply referred to as wafers) on which circuits such as ICs (Integrated Circuits) and LSIs (Large Scale Integrations) are formed on one side are used to reduce the size and weight of electronic devices. Before being divided into a thickness of about 50 μm. However, when the wafer is thinned in this way, its own rigidity is lost, and handling in subsequent processes becomes difficult. Thus, a wafer processing method for facilitating handling during processing has been studied (see, for example, Patent Document 1). In this wafer processing method, when processing a wafer having a circuit forming region on which a circuit is formed and an outer peripheral surplus region surrounding the circuit forming region on the front surface, it corresponds to the circuit forming region on the back surface of the wafer. By forming a recess in the area to be formed, a ring-shaped reinforcing portion is formed outside the recess.

  On the other hand, in a semiconductor manufacturing process, in order to integrate a wafer and a ring frame, a mounting device for attaching a mounting sheet (adhesive sheet) to the wafer and the ring frame is used (for example, see Patent Document 2). . In this mounting device, on the substrate mounting table in the vacuum chamber, while supporting only the peripheral edge of the disc-shaped wafer, the ring frame with the adhesive sheet attached is placed on the frame fixing table, The wafer is positioned inside the ring frame. Then, after reducing the pressure in the vacuum chamber and preliminarily bonding the wafer and the adhesive sheet with the application roller, the atmosphere is introduced into the vacuum chamber so that the wafer and the adhesive sheet are bonded to each other with a differential pressure.

JP 2007-19461 A JP 2008-66684 A

By the way, it is conceivable to use the mounting device described in Patent Document 2 in order to integrate the wafer subjected to the processing method described in Patent Document 1 and the ring frame. In this case, if the adhesive sheet is preliminarily bonded with the application roller, the adhesive sheet is attached to the wafer in a state where a space is formed in the concave portion (a state where the concave portion is closed). Here, even if an elastically deformable sticking roller is used, the adhesive sheet cannot be reliably stuck to the corner formed by the ring-shaped reinforcing portion and the bottom surface of the recess. When the atmosphere is introduced in such a state, the adhesive sheet that has closed the recessed space by the differential pressure is stuck to the entire recessed portion in a state where an extra tension is applied.
When the wafer in the above state is diced, the distance between the diced chips becomes non-uniform due to the elastic restoring force of the adhesive sheet, and the accurate position is supported when picking up these chips. Can not do. As a result, the supported chip cannot be bonded to an accurate position, resulting in inconvenience that bonding failure occurs.

  An object of the present invention is to provide a mounting device and a mounting method capable of integrating a frame and an adherend without generating extra tension on an adhesive sheet.

  In order to achieve the above object, a mounting apparatus of the present invention is a mounting apparatus that integrates a frame and an adherend through an adhesive sheet in which an adhesive layer is laminated on one surface of a base sheet. An adherend support means for supporting the adherend, a frame support means capable of supporting the frame in a state of being located outside the adherend, and an outer shape larger than the outer shape of the adherend. A sheet supply means for supplying the adhesive sheet, an adhesive sheet support means for supporting the supplied adhesive sheet on the outside of the adherend and having a moving member movable toward the adherend; A configuration in which first adhesive means for attaching the adhesive sheet to one surface of the adherend and second adhesive means for attaching the adhesive sheet protruding from the adherend to the frame are provided. Adopt To have.

At this time, in the mounting apparatus of the present invention, the moving member is a member that can be deformed by a tension acting on the adhesive sheet when the adhesive sheet is attached to one surface of the adherend by the first attaching means. It is preferable that it is a deformation | transformation permission member formed by.
In the mounting device of the present invention, it is preferable that the first sticking means sticks the adhesive sheet to the adherend using a change in atmospheric pressure.
Furthermore, in the mounting apparatus according to the present invention, the second sticking means includes a pressing means capable of pressing the adhesive sheet, an inclination means for inclining the adhesive sheet with respect to the frame, and the pressing means as the adhesive sheet. And moving means for moving the frame relative to the frame.
And it is preferable that the mounting apparatus of this invention is further equipped with the cutting | disconnection means which can cut | disconnect the said adhesive sheet.

  On the other hand, the mounting method of the present invention is a mounting method in which a frame and an adherend are integrated via an adhesive sheet in which an adhesive layer is laminated on one surface of a substrate sheet, the adherend Supporting the frame in a state positioned outside the adherend, supplying the adhesive sheet having an outer shape larger than the outer shape of the adherend, and the supply A step of supporting the adhered adhesive sheet outside the adherend by a moving member movable toward the adherend, and when a tension acts on the adhesive sheet, or before the tension acts, Adopting a method comprising: moving the moving member to affix the adhesive sheet to one surface of the adherend; and affixing the adhesive sheet protruding from the adherend to the frame. is doing

  According to the present invention as described above, since the adhesive sheet can be attached to the adherend in a state where the adhesive sheet is supported by the moving member, for example, a recess as described in the background art is provided. Even when the adhesive sheet is applied to the concave portion of the adherend, the adhesive sheet is moved when the moving member moves toward the adherend when tension acts on the adhesive sheet or before the tension acts. The adhesive sheet can be applied to the entire concave portion of the adherend without generating excessive tension. In addition, when one surface of the adherend is a flat surface, it is possible to suppress generation of extra tension in a portion of the adhesive sheet between the adherend and the frame. Therefore, when the adherend to which the adhesive sheet is attached is integrated with the frame and then the adherend is separated into individual pieces, the elastic restoring force of the adhesive sheet may cause the chip spacing to be non-uniform. Therefore, the chip can be picked up properly and the bonding failure of the chip can be eliminated.

Further, if the movable member is a deformation allowing member formed by a member that can be elastically deformed, the configuration can be simplified. Furthermore, if an adhesive sheet is affixed to a to-be-adhered body using the change of atmospheric pressure, it can be affixed without mixing bubbles between the adherend and the adhesive sheet. And if it adopts an inclination means to incline the adhesive sheet with respect to the frame and the adhesive sheet is attached to the frame by the pressing means, the adhesive sheet and the frame can be attached without generating bubbles or wrinkles. Can do. Furthermore, if it has a configuration having a cutting means, the adhesive sheet affixed to the adherend can be cut into a predetermined shape, so that the shape of the adhesive sheet to be employed is not limited and versatility is improved. .
Here, the adhesive sheet cannot be attached to the adherend without wrinkles or bubbles unless a certain amount of tension is applied. In the present invention, “extra tension” means that, for example, as described above, the intervals between the chips become non-uniform and bonding failure occurs, which causes trouble in each process of applying a predetermined treatment to the adherend. Refers to the tension.

The fragmentary sectional view of the mount device concerning a 1st embodiment of the present invention. (A), (B), (C) is operation | movement explanatory drawing of the mounting apparatus of 1st Embodiment. (A), (B), (C) is operation | movement explanatory drawing of the mounting apparatus of 1st Embodiment. The fragmentary sectional view of the mount device concerning a 2nd embodiment of the present invention. (A), (B), (C) is operation | movement explanatory drawing of the mounting apparatus of 2nd Embodiment. (A), (B) is operation | movement explanatory drawing of the mounting apparatus which concerns on 3rd Embodiment of this invention. (A), (B) is operation | movement explanatory drawing of the mounting apparatus which concerns on 4th Embodiment of this invention.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, a first embodiment of the invention will be described with reference to the drawings.
In FIG. 1, a mounting apparatus 1 attaches a mounting sheet MS as an adhesive sheet to a wafer W1 as an adherend and a ring frame RF as a frame, and the wafer W1 and the ring frame RF are bonded by this mounting sheet MS. To be integrated. Here, as shown in FIG. 2A, the wafer W1 is ground so that the outer edge portion is thicker than the other portions, so that the annular protrusion protruding in the thickness direction (back surface side) is obtained. The portion W11 is formed on the outer edge portion, and the concave portion W12 is formed on the inner side surrounded by the convex portion W11, and a circuit is formed on the surface (the opposite side of the grinding surface, the lower surface in FIG. 1) W13. A semiconductor wafer. Wafer W1 is integrated with ring frame RF by attaching mounting sheet MS to bottom surface W15 and inner peripheral surface W16 of concave portion W12, and top surface W14 of convex portion W11. The mounting sheet MS has a configuration in which an adhesive layer is laminated on one surface of the base sheet, has an outer shape larger than the outer shape of the wafer W1, and is larger than the opening of the ring frame RF, It is cut in advance into an outer shape that fits in the plane. A protective sheet (not shown) is affixed to the surface W13.
The mounting apparatus 1 includes a sheet supplying unit 2 that supplies the mounting sheet MS, and a decompression applying unit 3 as a first attaching unit that attaches the mounting sheet MS supplied from the sheet supplying unit 2 to the wafer W1. , A moving means 4 for moving the wafer W1, the ring frame RF, and the like, and a second pressing roller 5 as a second sticking means for sticking the mounting sheet MS to the ring frame RF. In the following description, the right side in FIG. 1 may be referred to as an upstream side, and the left side in FIG.

  The sheet supply unit 2 is supported by a frame (not shown). In this frame, a support roller 21 that supports the mounting sheet MS temporarily attached to the release sheet RL at a predetermined interval by winding it in a roll shape, and two guide rollers for guiding the release sheet RL and the mount sheet MS. The guide roller 22 and a peel plate 23 that inclines to the lower left in FIG. 1 and peels the mounting sheet MS from the release sheet RL. Further, the frame includes a driving roller 24 driven by a motor 26, a pinch roller 25 that sandwiches the release sheet RL between the drive roller 24, a collection roller 27 that collects the release sheet RL by a driving means (not shown), and a peel. A first pressing roller 28 is provided for pressing and attaching the mounting sheet MS peeled off by the plate 23 to a deformation allowing member 341 described later.

  The decompression pasting means 3 pastes the mounting sheet MS onto the wafer W1 in a decompressed state, and presses and pastes the mounting sheet MS onto the wafer W1 using the differential pressure, and is a box whose upper surface is opened. The lower chamber 31 is formed in a box shape with the lower surface opened, and an upper chamber 32 that can contact the upper surface of the lower chamber 31 to form the space A (see FIG. 2). The space A can be sealed with a packing 311 provided on the upper surface of the lower chamber 31.

In the lower chamber 31, an adherend support means 33 for supporting the wafer W1, an adhesive sheet support means 34 for supporting the mounting sheet MS, and a frame support means 35 for supporting the ring frame RF are provided. Yes.
The adherend support means 33 includes a substantially disc-shaped inner table 331 on which the wafer W1 is placed and which is moved up and down by a linear motor 332. The inner table 331 is provided so that the wafer W1 can be held at a predetermined position on the upper surface thereof by holding means (not shown).
The adhesive sheet supporting means 34 is formed in a ring shape by an elastically deformable member made of rubber, resin, etc., and a deformation allowing member 341 as a moving member capable of supporting the mounting sheet MS on the upper surface, and this deformation allowing A holding part 342 for holding the member 341 and an inclination means 343 for raising and lowering or inclining the holding part 342 are provided. The holding part 342 includes a cylindrical holding part main body 344 and a lower end connecting part 345 connecting the upstream side and the downstream side of the lower end surface of the holding part main body 344. The tilting means 343 includes an upstream linear motion motor 347 that raises and lowers the upstream and downstream sides of the lower end connecting portion 345, and a downstream linear motion motor 348. The deformation allowing member 341 is made of a material having a smaller elastic modulus than the mounting sheet MS.
The frame support means 35 includes an outer table 351 that is formed in a cylindrical shape surrounding the adhesive sheet support means 34 and on which the ring frame RF is placed, and a pair of linear motion motors 352 that raise and lower the outer table 351. ing. The outer table 351 is provided so that the ring frame RF can be held at a predetermined position on the upper surface thereof by holding means (not shown).

  The upper chamber 32 is formed by a plate-like upper surface portion 321 and a side surface portion 322 extending downward from the outer edge of the upper surface portion 321. The upper surface portion 321 is provided with an atmospheric pressure adjusting means 36 that can depressurize the space A through an atmospheric pressure adjusting hole 323 and a linear motion motor 324 that moves the upper chamber 32 up and down. Further, an upper pressing means 37 for pressing the mounting sheet MS from above is provided in the upper portion of the upper surface portion 321 in FIG. As shown in FIG. 2, the upper pressing means 37 is attached to the output shaft of the linear motor 371, is provided on the outer edge side of the holding portion 372 having a through hole 374, and has an inner diameter. A ring-shaped convex pressing member 373 formed to have a diameter smaller than the diameter of the inner peripheral surface W16 of the wafer W1 by twice the thickness of the mounting sheet MS, and a biasing force such as a spring on the lower surface of the holding portion 372 in FIG. A holding part 377 having a through-hole 376 and provided on the outer edge side of the holding part 377 and having an outer diameter larger than the diameter of the inner peripheral surface W16 of the wafer W1. And a ring-shaped recess pressing member 378 having a small diameter corresponding to twice the thickness.

The moving means 4 is composed of a single-axis robot provided extending in the left-right direction in FIG. 1, and a slider 41 of this single-axis robot is fixed to the lower surface of the lower chamber 31, and the lower chamber 31 is moved upstream and downstream. It is configured to be possible.
The second pressing roller 5 is provided so as to be moved up and down in FIG. 1 by a driving means (not shown).

In the mounting apparatus 1 described above, a procedure for attaching the mounting sheet MS to the wafer W1 and the ring frame RF and integrating the wafer W1 and the ring frame RF will be described.
First, in a state where the lower chamber 31 is positioned upstream of the sheet supply unit 2, the wafer W1 and the ring frame RF are respectively predetermined by the holding unit (not shown) by the adherend support unit 33 and the frame support unit 35. Positioned and held in position. At this time, the top surface W14 of the wafer W1 is positioned so as to be positioned above the top surface of the ring frame RF, and the top surface of the deformation allowing member 341 is positioned so as to be positioned above the top surface W14 of the wafer W1. Has been.
Then, while the lower chamber 31 is moved downstream by the moving unit 4, the mounting sheet MS fed out from the sheet supply unit 2 is pressed by the first pressing roller 28, so that the mounting sheet MS is deformed by the deformation allowing member 341. Affixed to the top surface. Thereafter, as shown in FIG. 1, when the lower chamber 31 reaches just below the upper chamber 32, the movement by the moving means 4 is stopped.

Next, as shown in FIG. 2A, the upper chamber 32 is lowered to seal the space A, and the space A is brought into a reduced pressure state including a vacuum state by the atmospheric pressure adjusting means 36.
Then, as shown in FIG. 2B, by driving the linear motion motor 371, the recess pressing member 378 is lowered to press the mounting sheet MS against the bottom surface W15 of the wafer W1, and the mounting sheet MS is mounted on the outer edge region of the bottom surface W15. Press the sheet MS. At this time, since the space between the concave pressing member 378 and the deformation allowing member 341 is constrained, even if an attempt is made to generate tension in the adhesive sheet portion positioned outside the concave pressing member 378, the deformation allowing member 341 has its tension. Thus, the elastic deformation of the wafer W1 toward the center side can suppress the generation of excessive tension in the mounting sheet MS.
After that, by continuing to drive the linear motor 371, as shown in FIG. 2 (C), the convex pressing member 373 resists the urging force of the urging means 375 so that the mounting sheet MS is mounted on the top surface of the wafer W1. Affix to W14. At this time, the deformation allowing member 341 is also lowered by driving the upstream and downstream linear motion motors 347 and 348.
Thereafter, when the atmosphere is introduced into the space A from the pressure adjusting hole 323, the mounting sheet MS is attached to the entire bottom surface W15 of the wafer W1 by the pressure. Thus, the mounting sheet MS is attached to the bottom surface W15 and the inner peripheral surface W16 of the wafer W1 and the top surface W14 of the convex portion W11.

  Thereafter, the convex pressing member 373 and the concave pressing member 378 are separated from the mounting sheet MS and the upper chamber 32 is separated from the lower chamber 31. Next, as shown in FIG. 3A, the holding portion 342 is inclined so that the upstream and downstream linear motion motors 347 and 348 are driven and the downstream side of the mounting seat MS is lower than the upstream side. And Then, the lower chamber 31 is moved downstream so that the downstream end of the mounting sheet MS is positioned directly below the second pressing roller 5 by driving the moving unit 4, and the second pressing roller 5 is not shown. And the downstream end of the mounting sheet MS is pressed against the ring frame RF. Thereafter, as shown in FIG. 3B, while the lower chamber 31 is further moved to the downstream side, the upstream and downstream linear motion motors 347 and 348 are linked to gradually move the upstream side of the mounting sheet MS. The portion of the mounting sheet MS that protrudes from the wafer W1 is attached to the ring frame RF. 3C, the deformation allowing member 341 is lowered and separated from the mounting sheet MS, whereby the wafer W1 and the ring frame RF are integrated, and the integrated wafer W1 is illustrated. It is conveyed to another process by the non-conveying means, and thereafter the same operation as described above is repeated.

The first embodiment as described above has the following effects.
That is, since the deformation allowing member 341 is deformed by the tension applied to the mounting sheet MS, it is possible to suppress the generation of extra tension on the mounting sheet MS attached to the ring frame RF, and the wafer W1 is separated into pieces. In this case, the chip spacing is not uneven due to the elastic restoring force of the mounting sheet MS, so that the chip can be appropriately picked up. Further, since the deformation allowing member 341 is made of an elastically deformable member such as rubber or resin, there is no need to provide a control mechanism for deforming the deformation allowing member 341, and the structure can be simplified. Furthermore, since the mounting sheet MS is placed in an inclined posture and then attached to the ring frame RF, it is possible to prevent air bubbles from being caught between the mounting sheet MS and the ring frame RF.

Next, 2nd Embodiment of this invention is described based on drawing.
FIG. 4 is a partial cross-sectional view showing a mounting apparatus 1B according to the second embodiment.
The difference between the mounting apparatus 1B of the second embodiment and the mounting apparatus 1 of the first embodiment is that the sheet supply means 2B is provided instead of the sheet supply means 2, and the cutting means 6B is provided in the decompression pasting means 3. This is a new point.
The sheet supply unit 2B is supported by a frame (not shown). The frame includes a support roller 211B for winding and supporting the belt-like sheet MS1 in a roll shape, an upstream drive roller 212B driven by a motor 213B, and a pinch roller 214B that sandwiches the belt-like sheet MS1 between the upstream drive roller 212B. A collection roller 221B that is driven by a motor (not shown) and collects the belt-like sheet MS1 cut by the cutting means 6B, a downstream drive roller 222B that is driven by the motor 223B, and a downstream drive roller 222B A pinch roller 224B that sandwiches the belt-like sheet MS1 therebetween, a reciprocating body portion 231B that can be reciprocated in the vertical and horizontal directions in FIG. And by the rotation motor 234B And a drive roller 233B disposed rolling capable.

  The cutting means 6B is provided on the upper surface 321 of the upper chamber 32 at the lower part in FIG. 4, the arm 62B extending in the horizontal direction from the output shaft of the rotary motor 61B, and the tip of the arm 62B. A single-axis robot 63B that moves the slider 64B up and down, a cutting motor 65B fixed to the slider 64B, and a rotating blade 66B as a cutting member attached to the output shaft of the cutting motor 65B. ing. Further, an upper pressing means 37 that does not rotate following the rotation of the arm 62B is provided on the lower surface of the arm 62B.

  When the mounting sheet MS is attached to the wafer W1 in the mounting apparatus 1B, first, in the state where the lower chamber 31 is positioned below the upper chamber 32, the belt-like sheet MS1 is formed on the upper surface of the deformation allowing member 341. Support. Next, the upper chamber 32 and the rotary blade 66B are lowered, and the cutting motor 65B and the rotary motor 61B are driven, whereby the belt-like sheet MS1 is cut outside the deformation allowing member 341 to form the mounting sheet MS. . Thereafter, the rotary blade 66B is raised and the upper chamber 32 is lowered to seal the space A. At this time, the belt-like sheet MS1 is sandwiched between the upper chamber 32 and the lower chamber 31, but the sealing degree of the space A is maintained by the packing 311. Then, by performing the same control as in FIG. 2 of the first embodiment, the mounting sheet MS is attached to the entire recess W12 and the top surface W14 of the wafer W1 (see FIG. 5A).

  Next, as shown in FIG. 5B, the upper chamber 32 is separated from the lower chamber 31, and the portion of the mounting sheet MS that protrudes from the wafer W1 is at the same level as the belt-like sheet MS1. The table 331 and the deformation allowing member 341 are raised. The ring frame RF is also raised and brought into contact with the mounting sheet MS and the belt-like sheet MS1. Thereafter, as shown in FIG. 5C, the reciprocating main body 231B is lowered, and then the drive roller 233B is rotated and moved rightward. Accordingly, the belt-like sheet MS1 adhered to the upper surface of the lower chamber 31 is floated while the mounting sheet MS is pressed and stuck to the ring frame RF. When the reciprocating main body portion 231B is positioned at a position indicated by a two-dot chain line in FIG. 5C, the wafer W1 integrated with the ring frame RF is transferred to another process by a transfer means (not shown). Then, with the rotation of the rotary motor 234B locked, the reciprocating main body portion 231B is moved leftward, and the upstream and downstream drive rollers 212B and 222B are rotated so that the new belt-like sheet MS1 is positioned below the upper chamber 32.

  According to the second embodiment as described above, since the belt-like sheet MS1 can be employed without employing the mounting sheet MS that has been cut into a predetermined shape in advance, there is an effect that versatility is improved.

Next, 3rd Embodiment of this invention is described based on drawing.
FIGS. 6A and 6B are operation explanatory views of the mounting apparatus 1C according to the third embodiment.
The difference between the mounting apparatus 1C of the third embodiment and the mounting apparatus 1 of the first embodiment is that, instead of the wafer W1 having the recess W12, the wafer W2 having no recess is an object to be pasted, and the decompression pasting means 3 Instead of this, a pressing sticking means 3C as a first sticking means is provided.
An adherend support means 33C, an adhesive sheet support means 34, and a frame support means 35 are provided on the sticking base 31A of the pressing sticking means 3C. A pressing means 38C is provided above the adherend support means 33C. The pressing means 38C has a pressing surface 382C that has a gently curved pressing surface 382C and that can be moved up and down by a linear motion motor 383C. Note that the pressing member 381C is configured by an elastically deformable member.

When the mounting sheet MS is attached to the wafer W2 in the mounting apparatus 1C, the back surface W21 of the wafer W2 is supported by the deformation allowing member 341 as shown in FIG. 6A. The ring frame RF is moved to a state where a minute gap is formed between the adherend surface RF1 and the mounting sheet MS while being positioned below the MS.
Thereafter, when the sheet central portion of the mounting sheet MS is pressed against the back surface W21 of the wafer W2 by the pressing surface 382C of the pressing member 381C, the pressing member 381C is gradually elastically deformed and the pressed portion is attached to the back surface W21. Is done. Along with this sticking, a tension toward the central portion of the wafer W2 is generated in the non-sticking sheet portion, but the deformation allowing member 341 is elastically deformed toward the central side of the wafer W2 by the tension, so that the mounting sheet MS It is possible to suppress the occurrence of extra tension.
When the mounting sheet MS protruding from the wafer W2 is stuck to the ring frame RF, for example, the mounting sheet MS is kept horizontal without being inclined and the deformation allowing member 341 is deformed. The sticking base 31A is moved downstream, and the mounting sheet MS is pressed against the ring frame RF by the second pressing roller 5.

  According to the third embodiment as described above, the decompression pasting means of the first embodiment can be omitted, and the configuration can be simplified.

Next, 4th Embodiment of this invention is described based on drawing.
7A and 7B are operation explanatory views of the mounting apparatus 1D according to the fourth embodiment.
The difference between the mounting apparatus 1D of the fourth embodiment and the mounting apparatus 1C of the third embodiment is that the adhesive sheet supporting means 34 is disposed outside the frame supporting means 35, and the adhesive sheet supporting means 34D can support the adhesive sheet S. This is the point.
The adhesive sheet support means 34D includes a ring-shaped deformation permission member 341D having a diameter larger than that of the deformation permission member 341 of the third embodiment, and a substantially cylindrical holding portion main body 344D that supports the deformation permission member 341D. Yes. The holding unit main body 344D is supported by the upstream linear motion motor 347 and the downstream linear motion motor 348 so as to surround the outer table 351.

  When the mounting sheet MS is attached to the wafer W2 in the mounting apparatus 1D, the back surface W21 of the wafer W2 is positioned below the mounting sheet MS as shown in FIG. It is assumed that a gap is formed between the frame RF and the mounting sheet MS. Thereafter, when the central portion of the mounting sheet MS is pressed against the back surface W21 of the wafer W2 by the pressing surface 382C of the pressing member 381C, the pressing member 381C is gradually elastically deformed and pressed as in the third embodiment. The part is attached to the back surface W21. Along with this sticking, a tension toward the central portion of the wafer W2 is generated in the non-sticking sheet portion, but the deformation allowing member 341 is elastically deformed toward the central side of the wafer W2 by the tension, so that the mounting sheet MS It is possible to suppress the occurrence of extra tension.

  According to the fourth embodiment as described above, the mounting device 1D can achieve the same effects as the mounting device 1C of the third embodiment.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description limited to the shape, material, etc. disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such is included in this invention.

That is, in the first to fourth embodiments, the following configuration may be used.
For example, the case where the adherends are the wafers W1 and W2 has been shown, but the adherends are not limited to them, and other than the wafers W1 and W2, glass plates, steel plates, resin plates, and other plates Other than the plate-like member and the plate-like member can also be targeted.
When the mounting sheet MS is attached to the ring frame RF, the second pressing roller 5 may be moved without moving the lower chamber 31 and the attaching base 31A, or the lower chamber 31 and the attaching base 31A The two pressing rollers 5 may be moved together.

Further, instead of a deformable member such as the deformation allowing member 341, 341D, a slide mechanism or the like that moves the tip of a moving member having a shape substantially equal to the deformation allowing member 341, 341D to the center side of the wafer W1, etc. is adopted. The moving member may be moved toward the center of the wafer W1 by a control mechanism when the mounting sheet MS is attached to the wafer W1 or by a tension acting on the mounting sheet MS. The timing for moving the moving member by the control mechanism may be the same as when the tension is applied to the mounting sheet MS, or may be before the tension is applied. In addition, such a moving means is formed of a material that is deformed by the tension acting on the mounting sheet MS because it can suppress the generation of extra tension on the mounting sheet MS by moving without being deformed by itself. It may be made of a material that does not deform.
Furthermore, the moving member may have a configuration in which a rotating member such as a plurality of bearings is arranged on the surface to which the mounting sheet MS is attached in addition to the above configuration. In this case, when tension is to be generated in the mounting sheet MS portion located outside the recess pressing member 378, the rotating member is rotated by the tension, and extra tension is generated in the mounting sheet MS. This can be suppressed.
Further, the sheet supply means 2B and the cutting means 6B may be provided in the mounting devices 1C and 1D of the third and fourth embodiments. In the first and second embodiments, the mounting sheet MS is held in a ring frame by the second pressing roller 5 while the mounting sheet MS is kept horizontal without being inclined and the deformation allowing member 341 is deformed. You may press against RF. Then, a non-rotating cutter may be provided instead of the rotating blade 66B, and the mounting sheet MS may be cut by moving the cutter along the circumferential direction of the ring frame RF. Further, instead of the rotary blade 66B, a cylindrical cutter may be provided, and the mounting sheet MS may be cut by pressing the cutter against the mounting sheet MS on the ring frame RF. Furthermore, the attachment target in the mounting apparatuses 1 and 1B of the first and second embodiments may be the wafer W2.

DESCRIPTION OF SYMBOLS 1, 1B, 1C, 1D ... Mounting apparatus 2, 2B ... Sheet supply means 3 ... Depressurization sticking means (1st sticking means)
3C, 3D ... pressing and pasting means (first pasting means)
4 ... Moving means 5 ... Second pressing roller (second sticking means)
6B: Cutting means 33, 33C: Substrate support means 34, 34D ... Adhesive sheet support means 35 ... Frame support means 341, 341D ... Deformation allowing member (moving member)
343 ... Inclination means MS ... Mounting sheet (adhesive sheet)
RF: Ring frame (frame)
W1, W2 ... Wafer (Substrate)

Claims (6)

A mounting device that integrates a frame and an adherend through an adhesive sheet in which an adhesive layer is laminated on one surface of a base sheet,
An adherend support means for supporting the adherend;
Frame support means capable of supporting the frame in a state of being located outside the adherend;
Sheet supply means for supplying the adhesive sheet having an outer shape larger than the outer shape of the adherend;
An adhesive sheet supporting means for supporting the supplied adhesive sheet on the outside of the adherend and having a moving member movable toward the adherend;
A first attaching means for attaching the adhesive sheet to one surface of the adherend;
And a second attaching means for attaching the adhesive sheet protruding from the adherend to the frame.   The moving member is a deformable member formed by a member that can be deformed by a tension acting on the adhesive sheet when the adhesive sheet is stuck to one surface of the adherend by the first sticking means. The mounting apparatus according to claim 1, wherein:   The mounting apparatus according to claim 1, wherein the first sticking unit sticks the adhesive sheet to the adherend using a change in atmospheric pressure. The second sticking means includes a pressing means capable of pressing the adhesive sheet,
2. The apparatus according to claim 1, further comprising a tilting unit that tilts the adhesive sheet with respect to the frame, and a moving unit that moves the pressing unit relative to the adhesive sheet and the frame. The mounting apparatus according to claim 3.   The mounting apparatus according to claim 1, further comprising a cutting unit capable of cutting the adhesive sheet. A mounting method for integrating a frame and an adherend through an adhesive sheet in which an adhesive layer is laminated on one surface of a base sheet,
Supporting the adherend;
Supporting the frame in a state of being located outside the adherend;
Supplying the adhesive sheet having an outer shape larger than the outer shape of the adherend;
Supporting the supplied adhesive sheet on the outside of the adherend by a moving member movable toward the adherend;
When the tension acts on the adhesive sheet, or before the tension acts, the step of moving the moving member and sticking the adhesive sheet on one surface of the adherend;
And a step of attaching an adhesive sheet protruding from the adherend to the frame.

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