JP2009158879A - Device for attaching adhesive sheets to substrates - Google Patents

Abstract

When an original adhesive sheet composed of at least a two-layer structure of an adhesive sheet and a separator is attached to a substrate and then the original adhesive sheet is cut into a substrate shape, an excess portion of the original adhesive sheet is cut into the cut edge portion and the substrate This prevents the outer peripheral edge of the pasted original adhesive sheet from reattaching.
An affixing table is disposed on a machine table so as to be movable up and down, and the affixing table is disposed on a substrate mounting table and an outer peripheral side of the substrate mounting table with an appropriate interval. The outer peripheral table 42 that can be raised with respect to the substrate mounting table 40 is formed, and the suction concave groove 41 is formed on the upper surface of the outer peripheral table 42, and the suction concave groove 41 is cut when the original adhesive sheet 43 attached to the substrate W is cut. The vicinity of the cutting edge of the original adhesive sheet 43 in the course of cutting is adsorbed by the suction force applied inside, and after cutting, the outer peripheral table 42 is lifted from the substrate mounting table 40, whereby the cutting edge portion of the original adhesive sheet 43 is moved to the substrate. Separate from the outer periphery.
[Selection] Figure 2

Description

  The present invention relates to an apparatus for attaching an adhesive sheet to a substrate. More particularly, the present invention relates to a pasting apparatus for pasting an adhesive sheet such as a die bond tape on a substrate such as a semiconductor wafer while heating.

  In general, in a manufacturing process of a semiconductor device, a wafer having a circuit pattern formed on the surface is subjected to a backside polishing and a thinning process after a protective tape is applied to the circuit pattern surface, and recently, the wafer is thinned. A die-bonding tape is affixed to the back polished surface. The wafer with the die bond tape attached is mounted on the ring frame with the circuit pattern surface facing up via the dicing tape, and then the release tape and the like are attached onto the protective tape on the surface, and the release tape and the protective tape are peeled together. After that, individual semiconductor chips are formed in a dicing process. Further, after the semiconductor chip is die-bonded on a die pad such as a lead frame, it is wired by wire bonding or the like, and sealed with a mold resin to obtain an IC or LSI product.

  The die bond tape is wider than the wafer and is composed of two layers of an adhesive sheet portion and a separator. The die bond tape is attached to the wafer by heating only the adhesive sheet portion while peeling the separator (for example, 100 to 100). 160 ° C.), the adhesive sheet was cut with a cutter blade along the outer periphery of the wafer, and the excess adhesive sheet in which the wafer portion was cut was wound up.

  However, since the die bond tape is applied while being heated, and the die bond tape is cut in the heated state, the die bond tape that has been cut adheres to the die bond tape in the excess portion of the outer periphery again by heat, and the die bond tape is cut. There was a problem of reattaching.

  Therefore, a tape support table is provided on the outer peripheral portion of the mounting table holding the wafer at a distance from the mounting table, and a suction groove is provided on the tape support table along the outer periphery of the wafer so that the excess after cutting By sucking up the part of the die-bonding tape with the suction groove, it is possible to separate the cutting edge part of the die-bonding tape affixed to the wafer and the excess part of the die-bonding tape after cutting so that they do not reattach. (For example, Patent Document 1).

  Recently, with the spread of portable devices, semiconductor wafers are required to be further reduced in size, and semiconductor wafers have also been reduced in thickness by about 50 μm. Along with this, the thickness of the die bond tape (equivalent to the adhesive sheet) itself is also reduced, the rigidity of the tape itself is also weakened, and the wafer is also affixed to the wafer in two layers with the separator remaining. (For example, Patent Document 2 and Patent Document 3).

  In the above-mentioned Patent Document 2, the separator (corresponding to the base material) is mounted on the ring frame, and after the dicing step, the semiconductor chip is picked up by leaving the separator on the dicing tape, and die bonding is performed. ing.

On the other hand, in Patent Document 3, the same process as in Patent Document 2 is performed, or a die bond tape is applied in a state where a separator (corresponding to a cover film) is left on a wafer (corresponding to an original sheet), and the wafer is reheated ( For example, the separator is peeled off after improving the adhesion between the die-bonding tape and the wafer.
JP 2002-134438 A JP-A-10-112494 JP2003-257898A

  However, the pasting of the above-mentioned patent document 1 is due to the recent thinning of the die bond tape, and if the die bond tape is stuck to the wafer with the separator remaining, the separator has rigidity, so the die bond tape is cut along the outer periphery of the wafer. At the same time, even if the die bonding tape is sucked into the suction groove, it cannot be sucked along the suction groove and a leak occurs.

  For this reason, it is not possible to start up the die bond tape of the surplus part, the surplus part of the die bond tape reattaches to the wafer side die bond tape, and the die bond tape pulls the yarn and adheres to the wafer. There was a problem.

  Further, even if the die bond tape can be sucked together with the separator into the suction groove, the excess portion of the die bond tape is peeled off by the peeling roller after the die bond tape is cut. There was a problem that a leak occurred in a part of the suction groove, and the die bond tape in the excess part returned to the flat surface and reattached to the wafer side die bond tape.

  In addition, the methods of Patent Document 2 and Patent Document 3 do not have a suction groove, and after the die bond tape is cut, an excessive portion of the die bond tape is reattached to the wafer-side die bond tape, leading to a defect in the semiconductor chip. there were.

  Furthermore, the method of Patent Document 3 has a problem that the cost is high because the separator is peeled off after reheating after the die-bonding tape is applied, and the separator requires heat resistance.

  Accordingly, an object of the present invention is to prevent the adhesive sheet of the surplus portion and the adhesive sheet on the substrate side from reattaching after an adhesive sheet such as a wide die bond tape is attached to a substrate such as a wafer and cut.

  In order to solve the above-described problems, the invention of claim 1 is a substrate having an adhesive sheet and a separator having at least a two-layer structure, and an original adhesive sheet formed wider than the substrate adsorbed and held on a pasting table. In the adhesive sheet affixing device to the substrate after cutting the original adhesive sheet along the outer periphery of the substrate, and after cutting, the cutting edge portion of the original adhesive sheet is separated from the outer periphery of the substrate, The adhering table is arranged on a machine base so that it can be moved up and down, and the adhering table is arranged on the substrate mounting table for heating and adsorbing and holding the substrate, and at an appropriate interval on the outer peripheral side of the substrate mounting table. And an outer peripheral table provided so as to be able to rise with respect to the substrate mounting table, and the outer peripheral table surface is formed with suction grooves along the entire periphery thereof, The cutting edge of the original adhesive sheet in the course of cutting is adsorbed by the suction force applied in the suction groove when the original adhesive sheet affixed to the plate is cut, and after cutting, the outer peripheral table is removed from the substrate mounting table. It is an adhesive sheet affixing device to a substrate in which the cutting edge portion of the original adhesive sheet is separated from the outer peripheral edge of the substrate by being raised.

  As described above, according to the present invention, the pasting table is composed of the substrate mounting table and the outer peripheral table, and the suction groove is formed on the outer peripheral table surface, and when the original adhesive sheet pasted on the substrate is cut. By adsorbing the vicinity of the cutting edge of the original adhesive sheet that is being cut into the suction groove, the outer peripheral table is raised from the substrate mounting table, so that the cutting edge portion of the original adhesive sheet is separated from the outer peripheral edge of the substrate. Therefore, the cut edge portion of the original adhesive sheet of the surplus portion and the outer peripheral edge of the substrate are not reattached, and the substrate is not defective.

  Furthermore, even if the suction in the suction groove leaks, the outer peripheral table is raised with respect to the substrate mounting table, so that the cut edge portion of the original adhesive sheet and the outer peripheral edge of the excess portion do not reattach, and the substrate No defects occur.

  Moreover, since the substrate mounting table to be heated and the outer peripheral table are separated, heat is not transmitted to parts other than necessary when the adhesive sheet is attached, and the excess adhesive sheet can be easily peeled off at the time of peeling.

  In addition, the adhesive sheet can be applied to the substrate with the separator remaining, and the adhesive sheet can be applied with the rigidity of the adhesive sheet maintained, so that it can be applied to the substrate without wrinkles or bubbles even if the adhesive sheet is thin. .

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic plan view of a wafer mounting apparatus to which an adhesive sheet attaching apparatus according to the present invention is applied. The steps from attaching an adhesive sheet to a wafer W and mounting it on a ring frame will be described below based on FIG.

  The wafer supply unit 2 is provided in the center of the left end in the figure, and the wafers W with the protective tape 38 attached to the circuit forming surface are stored in multiple stages in the storage cassette, and the suction hand provided at the tip of the articulated robot 12 is used. The wafers W are taken out one by one.

  The wafer W taken out is once mounted on the wafer mounting table 3 and then transferred to the alignment unit 71 while being sucked and held by the suction transfer body 13 having a smaller diameter than the wafer W. Subsequently, by rotating the suction transfer body 13, notches and orientation flat portions provided at the outer peripheral edge of the wafer are detected by the alignment sensor 14 of an appropriate means, and positioning is performed.

  The positioned wafer W is heated by an appropriate heating means (not shown) provided in the adhering table 20 by being sucked and held on the adhering table 20 of the original adhesive sheet adhering portion 4 in the lower center of the figure with the back side up. (Details of the pasting table 20 will be described later).

  On the heated wafer W, an original adhesive sheet 43 having a width wider than that of the wafer W and an integrated stack of the separator 62 and the adhesive sheet 61 is drawn out by the tape chuck 18. The original adhesive sheet 43 drawn on the wafer W is pressure-bonded and attached by horizontally moving in the drawing direction of the original adhesive sheet 43 while the attaching roller 16 presses.

  The original adhesive sheet 43 attached to the wafer W is cut along the outer periphery of the wafer W by the cutter unit 19, and the excess original adhesive sheet 43 is peeled off by the action of the peeling roller 17, and then the raw adhesive sheet winding unit 21. It is designed to be wound up by

  The wafer W on which the bonding of the original adhesive sheet 43 has been completed is horizontally moved by an appropriate means (not shown) to the position indicated by a two-dot chain line in the right direction in the drawing while being held on the bonding table 20 by suction. After the wafer W is delivered to 22, the pasting table 20 returns to the original adhesive sheet pasting unit 4.

  The wafer W sucked and held on the suction conveyance body 22 is moved to the peeling table 23 by the horizontal movement of the peeling table 23 of the separator peeling unit 5 at the lower right in the drawing to the position of the two-dot chain line below the suction conveyance body 22. It is adsorbed and held.

  When the peeling table 23 returns from the two-dot chain line position to the solid line position in the right direction, the upper peeling unit 24 acts to peel the separator 62 from the original adhesive sheet 43 affixed to the wafer W. In addition, the peeling unit 24 should just stick a peeling tape on the separator 62, for example, and may peel the separator 62 integrally with a peeling tape.

  The wafer W from which the separation of the separator 62 has been completed is transferred onto the heating table 25 of the wafer reheating unit 6 by the suction transfer body 22, and is then sucked and held on the heating table 25 and heated by appropriate means (not shown). By heating the table 25 (for example, at 180 ° C. for about 1 minute), the adhesiveness of the adhered adhesive sheet 62 to the wafer W is improved, and the reliability when performing the die bonding process is improved.

  The reheated wafer W is transferred to the lower chamber 7 in the center by the suction transfer body 26 and placed on the mount table 27 in the lower chamber 7, and then the lower chamber 7 is appropriately placed below the upper chamber 72. It moves by means (not shown).

  On the other hand, the dicing tape 31 is attached to the ring frame R in parallel with the attachment of the adhesive sheet 62, and the dicing tape 31 is attached to the ring frame R as follows.

  First, the ring frames R are supplied from the ring frame supply unit 8 in which the multi-staged ring frames R are stored by an elevator mechanism (not shown), taken out one by one by the transfer arm 28, and transferred to the dicing tape attaching unit 73.

  The ring frame R conveyed to the dicing tape affixing unit 73 is pulled out by the dicing tape 31 and affixed to the ring frame R while pressing the dicing tape 31 with the affixing roller 32, and then the ring frame R is acted on by the cutter unit 30. The dicing tape 31 is cut into an R shape. Instead of the wide dicing tape 31, a pre-cut type dicing tape previously formed in the shape of the ring frame R may be attached.

  The ring frame R to which the dicing tape 31 is attached is placed in an inclined state on an appropriate table (not shown) around the wafer W in the lower chamber 7 that has moved below the upper chamber 9.

  Next, after the upper chamber 9 is closed together with the lower chamber 7, the inside of the chamber is evacuated and lightly pressed by a flexible sticking roller (not shown) such as a sponge while swinging the ring frame R arranged in an inclined manner. The surface of the wafer W to which the adhesive sheet 61 is attached and the ring frame R are attached via the dicing tape 31.

  Further, the wafer W and the dicing tape 31 are brought into close contact with each other with a differential pressure while returning the inside of the chamber to atmospheric pressure, and the mounted wafer 74 is completed. Subsequently, the mounted wafer 74 is transported onto the peeling table 36 by the suction transport arm 75, reversed by the motor 35 provided on the suction transport arm 75, and the side to which the protective tape 38 of the mounted wafer 74 is attached is the upper surface. It mounts on the peeling table 36 so that it may become.

  The mounted wafer 74 is moved to the protective tape peeling part 10 and peeled off by a suitable means (for example, affixing the peeling tape on the protective tape 38 and winding the protective tape 38 integrally with the peeling tape to peel it off). Let

  The mounted wafer 75 from which the protective tape 38 has been peeled is sequentially pushed into and stored in the mounted wafer storage unit 11.

  Then, embodiment of the adhesive sheet sticking apparatus of this invention is described based on FIG. 2 thru | or FIG.

  FIG. 2 is a cross-sectional arrow view in the AA direction of FIG. 1, and a rail 59 is provided on the machine base 58, and the rail 59 has the pasting table 20 provided on the support plate 67. It is laid so that it can move from the adhesive sheet affixing section 4 to the position of the two-dot chain line below the suction conveyance body 22.

  A guide 60 is provided on the support plate 67, and the support plate 67 can move horizontally on the rail 59 by fitting the guide 60 with the rail 59. On the left and right sides of the support plate 67, a support frame 77 having a guide 68 provided thereon is provided upright. A rail 56 is fixed to the support frame 78 so as to be fitted to the guide 68.

  The left and right rails 56 are fixed vertically to the support plate 53 through a support frame 78, and the support plate 53 is movable up and down along the rail 56 by an elevating cylinder 57 erected on the support plate 67. . The affixing table 20 is fixed on the support plate 53, and the affixing table 20 is integrated with the support plate 53 so as to be movable up and down, and suitable driving means (not shown) along the rail 59. ) Can be moved horizontally.

  The pasting table 20 surrounds the substrate mounting table 40, which holds the mounted wafer W by suction by the suction unit 39 and can be heated by appropriate means (not shown). And an outer peripheral table 42 separated and independent. The adsorbing portion 39 may be configured by a plurality of adsorbing holes or a porous porous one.

  Hereinafter, the structure of the outer peripheral table 42 will be described with reference to FIGS. 2, 3, and 5.

  Near the inner peripheral side of the upper surface of the outer peripheral table 42, a circular suction groove 41 is provided so as to surround the substrate mounting table 40, and a plurality of suction holes 63 are provided at the bottom of the suction groove 41. . The suction holes 63 communicate with each other, and at least one of the suction holes 63 is connected to a vacuum pump (not shown) so that the suction groove 41 is sucked through the suction holes 63.

  In addition, a contact sheet 64 formed of silicone or the like is provided on the upper surface of the outer peripheral table 42 so as to surround the suction groove 41, and the adhesive sheet 61 and the outer peripheral table 42 are in close contact with each other when the adhesive sheet 61 is attached. When the adhesive sheet 61 is bonded, bubbles are prevented from entering, and when the adhesive sheet 61 is cut, the adhesive sheet 61 is prevented from shifting. In addition, the suction force of the suction groove 41 can be increased by the adhesion of the adhesive sheet 61 attached around the suction groove 41.

  In addition, a rounded portion 66 is provided perpendicular to the drawing direction of the adhesive sheet 61 on the sticking start end side of the outer peripheral table 42, and the table is attached to the portion to be pasted next when the surplus portion of the adhesive sheet 61 contacts the outer peripheral table 42. The corners are pressed against the mold. Thereby, the space | interval of the adhesive sheet 61 of an excess part can be shortened, and the waste of the adhesive sheet 61 can be reduced.

  As shown in FIG. 5, a screw member 52 is provided on the lower surface of the outer peripheral table 42, and this screw member 52 is screwed to a nut member 77 that is rotatably provided to the support plate 53 via a bearing 69. The nut member 77 is fitted and fixed to the upper and lower pulleys 51 provided below.

  The pulley 51 is configured such that a pulley 49 fixed to the shaft of the motor 48 is rotated by driving a motor 48 (see FIGS. 2 and 3) and is rotated through a belt 50. A nut member 77 fixed to 51 rotates together with the pulley 51. As the nut member 77 rotates, the screw member 52 screwed into the nut member 77 moves up and down, and the outer peripheral table 42 moves up and down independently of the substrate mounting table 40 through the screw member 52. Yes.

  In addition, a belt 54 is wound around the pulley 51 on three pulleys 65 provided at the remaining three corners of the outer peripheral table 42, and the belt 54 is maintained at an appropriate tension, and the driving force of the motor 48 is increased. Each pulley 65 is transmitted.

  As shown in FIG. 2, an adhesive sheet supply unit 15 for supplying an original adhesive sheet 43 in which an adhesive sheet 61 and a separator 62 are stacked is provided above the pasting table 20, and the supplied original adhesive sheet 43 is a guide roller. 46, the adhering roller 16, the peeling roller 17, and the tape chuck 18 are wound on the raw adhesive sheet winding unit 21 via the guide roller 70, dancer roller 76, and guide roller 47 located on the winding side. Yes.

  Further, a cutter blade 19 is provided above the original adhesive sheet 43 of the affixing table 20, and the vertical movement by an appropriate mechanism (not shown) and the cutting of the original adhesive sheet 43 along the outer periphery of the wafer W by the motor 44. Is possible.

  The affixing roller 45 can press the original adhesive sheet 43 against the affixing table 20 by the action of the cylinder 45, and can be moved horizontally on the affixing table 20 by an appropriate drive source (not shown). .

  Further, the peeling roller 17 sandwiches the original adhesive sheet 43 with two upper and lower rollers, and can move horizontally to the take-up side while rotating. At the time of application, the tension is maintained in front of the application roller 16, At the time of peeling, the upper roller moves upward to return to the initial position in a state where the nipping is released, so that the excess original adhesive sheet 43 is peeled off.

  The tape chuck 18 can be freely opened and closed by appropriate means (not shown), and when the original adhesive sheet 43 is pulled out, the tape chuck 18 is closed and horizontally moved to the take-up side while holding the original adhesive sheet 43 so that the original adhesive sheet 43 is removed. It is designed to be drawn on the pasting table 20.

  Further, a dancer roller 76 is provided on the winding side of the original adhesive sheet 43, and absorbs the tension fluctuation of the original adhesive sheet 43 by moving up and down to keep the tension of the original adhesive sheet 43 properly. Yes.

  The original adhesive sheet 43 whose tension is appropriately maintained by the dancer roller 76 is wound around the original adhesive sheet take-up portion 21 via the guide roller 47.

  The above is the configuration of the adhesive sheet pasting apparatus of the present invention, and the method for pasting the adhesive sheet 61 will be described with reference to FIGS.

  First, as shown in FIG. 6A, the wafer W is placed on the substrate placement table 40 with the protective tape 38 attached side down, and the wafer W is sucked and held by the suction portion 39 and the substrate placement table. 40 is heated by appropriate means (not shown) (for example, 130 ° C.), and the upper surface of the outer peripheral table 42 is set to the same height as the rear surface of the wafer W. Subsequently, the tape chuck 18 moves horizontally in the direction of the arrow in the drawing, whereby the original adhesive sheet 43 in which the separator 62 and the adhesive sheet 61 are overlapped is drawn onto the wafer W.

  The original adhesive sheet 18 drawn out as shown in FIG. 6B is moved from the two-dot chain line position to the solid line position by the application roller 16 and the peeling roller 17 so that the original adhesive sheet 43 is applied to the wafer W by the pressing of the application roller 16. Affixed while crimping. At this time, the affixing roller 16 may also be heated (in this case, the affixing roller 16 and the original adhesive sheet 43 are separated from each other except during affixing).

  As shown in FIG. 6C, the pasting roller 16 presses the original adhesive sheet 43 to the wafer W, and then moves backward while pressing the original adhesive sheet 43 to the initial position again. The suction hole 63 is sucked while the sticking roller 16 is retreating, and a negative pressure is generated in the suction groove 41.

  Subsequently, as shown in FIGS. 7D and 9A, the cutter blade 19 is lowered, and the cutter blade 19 is driven to rotate in the gap portion between the substrate mounting table 40 and the outer peripheral table 42, thereby providing an original adhesive sheet. 43 is cut along the outer periphery of the wafer W.

  As shown in FIG. 7 (e) and FIG. 9 (b), the vicinity of the cutting edge of the cut excess portion of the original adhesive sheet 43 is sucked by the negative pressure in the suction groove 41 simultaneously with the cutting of the original adhesive sheet 43. It is adsorbed and raised in the concave groove 41 and separated from the outer peripheral edge of the original adhesive sheet 43 attached to the wafer W side.

  7 (f) and 9 (b), the outer peripheral table 42 is raised by driving the motor 48, and the outer peripheral edge portion of the original adhesive sheet 43 attached to the wafer W is cut. Even if the adsorbing of the original adhesive sheet 43 leaks and dissolves by separating the separated excess edge portion of the original adhesive sheet 43 from the cut edge portion, the cut edge portion of the excess adhesive sheet 61 and the wafer W are separated. Thus, the outer peripheral edge portion of the adhesive sheet 61 attached to the sheet does not adhere again.

  Subsequently, as shown in FIG. 8 (g), when the tape chuck 18 is opened and the upper peeling roller 17 is raised, the clamping with the original adhesive sheet is released, and the tape chuck 18 and the peeling roller 17 are returned to the initial position of the solid line. . At this time, due to the action of the peeling roller 17, the excess portion of the original adhesive sheet 43 attached to the application table 20 is released. In addition, when the peeling roller 17 is positioned in the vicinity of the suction groove 41 as shown in FIG. 10C, the suction of the suction groove 41 starts to leak, and the original adhesive sheet 43 returns flat. Since the outer peripheral table 42 is raised and separated from the outer peripheral edge portion of the original adhesive sheet 43 on the wafer W side, it does not adhere again.

  As described above, the wafer W on which the bonding of the original adhesive sheet 43 has been completed is transported to the separator peeling unit 5 and peeled off, and reheated (for example, at 180 ° C. for about 1 minute) by the adhesive sheet reheating unit 6. Thereafter, it is used for mounting on the ring frame R.

  In addition, this invention is not limited to the said Example, In the range of invention, it can change suitably.

  For example, it can be applied to a resist film as an adhesive sheet, and various adhesive tapes can be applied as long as they need to be prevented from being reattached. In the case of an adhesive sheet having a three-layer structure in which separators are provided on the front and back surfaces of the adhesive sheet, supply the separator while peeling off one layer, and paste it so that one layer of the separator remains on the surface side of the adhesive sheet. It ’s fine.

  Moreover, the board | substrate to be used can use not only a semiconductor wafer but various board | substrates, such as a board | substrate for MEMS and a glass substrate.

  Various shapes can be used as long as the shape of the suction groove can be separated from the adhesive sheet affixed to the substrate side, such as a V-shape or U-shape, and the excess adhesive sheet that has been cut. Depending on the thickness, the depth and size can be appropriately set.

  In the present embodiment, the outer peripheral table 42 is raised, but the substrate mounting table 40 side located on the inner circumference may be lowered.

It is a schematic plan view of the wafer mount apparatus to which the adhesive sheet sticking apparatus of this invention is applied. It is a cross-sectional arrow view of the AA direction of FIG. It is a top view of the sticking table part of the adhesive sheet sticking apparatus of this invention. It is arrow sectional drawing of the BB direction of FIG. FIG. 4 is an enlarged cross-sectional arrow view in the CC direction of FIG. 3. (A) thru | or (c) is explanatory drawing which shows the sticking operation | movement of an adhesive sheet. (D) thru | or (f) is explanatory drawing which shows the sticking operation | movement of an adhesive sheet. (G) is explanatory drawing which shows the sticking operation | movement of an adhesive sheet. (A), (b) is principal part expansion explanatory drawing which shows an adhesive sheet sticking operation | movement. (C) is principal part expansion explanatory drawing which shows an adhesive sheet sticking operation | movement.

Explanation of symbols

W Wafer (Substrate)
R Ring frame 1 Wafer mounting device 2 Wafer supply unit 3 Wafer mounting table 4 Original adhesive sheet pasting unit 5 Separator peeling unit 6 Adhesive sheet reheating unit 7 Lower chamber 8 Ring frame supply unit 9 Upper chamber 10 Protective tape peeling unit 11 Mounted Wafer storage unit 12 Articulated robot 13 Adsorption conveyance body 14 Alignment sensor 15 Adhesive sheet supply unit 16 Adhesion roller 17 Peeling roller 18 Tape chuck 19 Cutter blade 20 Adhesion table 21 Original adhesion sheet winding unit 22 Adsorption conveyance body 23 Peeling table 24 Peeling Unit 25 Heating table 26 Suction transport body 27 Mount table 28 Suction transport arm 29 Dicing tape take-up section 30 Cutter unit 31 Dicing tape 32 Adhering roller 33 Dicing tape supply section 34 Suction transport arm 35 MO 36 Peeling Table 37 Peeling Unit 38 Protective Tape 39 Suction Unit 40 Substrate Placement Table 41 Suction Groove 42 Peripheral Table 43 Original Adhesive Sheet 44 Motor 45 Cylinder 46 Guide Roller 47 Guide Roller 48 Motor 49 Pulley 50 Belt 51 Pulley 52 Screw Member 53 Support plate 54 Belt 56 Rail 57 Elevating cylinder 58 Machine base 59 Rail 60 Guide 61 Adhesive sheet 62 Separator 63 Suction hole 64 Adhesive sheet 65 Pulley 66 Round portion 67 Support plate 68 Guide 69 Bearing 70 Guide roller 71 Alignment unit 72 Wafer mount unit 73 Dicing tape attaching part 74 Mounted wafer 75 Mounted wafer 76 Dancer roller 77 Support frame 78 Support frame

Claims (1)

An original adhesive sheet, which has at least a two-layer structure of an adhesive sheet and a separator and is formed wider than the substrate, is attached to the substrate held by suction on the application table with an application roller, and then the original adhesive sheet is moved along the outer periphery of the substrate. In the adhesive sheet affixing device to the substrate so that the cutting edge portion of the original adhesive sheet is separated from the outer peripheral edge of the substrate after cutting,
The adhering table is arranged on a machine base so that it can be moved up and down, and the adhering table is arranged on the substrate mounting table for heating and adsorbing and holding the substrate, and at an appropriate interval on the outer peripheral side of the substrate mounting table. And an outer peripheral table that can be raised with respect to the substrate mounting table, and the outer peripheral table surface is formed with suction grooves along its entire periphery, and is attached to the substrate. By adsorbing the vicinity of the cutting edge of the original adhesive sheet in the course of cutting by the suction force acting in the suction concave groove when cutting the adhesive sheet, and after cutting, the outer peripheral table is lifted from the substrate mounting table to perform original bonding An apparatus for adhering an adhesive sheet to a substrate, wherein a cut edge portion of the sheet is separated from the outer peripheral edge of the substrate.

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