TWI335635B - Repair apparatus for substrate circuit of flat display panel - Google Patents
Repair apparatus for substrate circuit of flat display panel Download PDFInfo
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- TWI335635B TWI335635B TW096122798A TW96122798A TWI335635B TW I335635 B TWI335635 B TW I335635B TW 096122798 A TW096122798 A TW 096122798A TW 96122798 A TW96122798 A TW 96122798A TW I335635 B TWI335635 B TW I335635B
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- 239000000758 substrate Substances 0.000 title claims description 66
- 230000008439 repair process Effects 0.000 title claims description 39
- 239000000523 sample Substances 0.000 claims description 95
- 238000007689 inspection Methods 0.000 claims description 34
- 238000012360 testing method Methods 0.000 claims description 16
- 230000002950 deficient Effects 0.000 claims description 15
- 230000003287 optical effect Effects 0.000 claims description 10
- 238000012546 transfer Methods 0.000 claims description 10
- 238000000227 grinding Methods 0.000 claims description 2
- 230000007547 defect Effects 0.000 description 17
- 238000000034 method Methods 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 210000003746 feather Anatomy 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
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- Optics & Photonics (AREA)
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
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Description
1335635 九、發明說明: 【發明所屬之技術領域】 本發明係有關用於平面顯示器面板之修復設備,且尤 係有關用於平面顯示器面板之基材電路的修復設備’其能 修復基材電路及同時檢驗該電路是否電路斷珞/短路。 【先前技術】1335635 IX. Description of the Invention: [Technical Field] The present invention relates to a repairing apparatus for a flat panel display panel, and more particularly to a repairing apparatus for a substrate circuit for a flat panel display panel, which is capable of repairing a substrate circuit and Also check if the circuit is broken/short circuit. [Prior Art]
平面顯示器面板係分類為陰極射線管(CRT)、液晶顯 示器(LCD)等等》因為其消耗較少電力且其重量輕,故LCD 尤係具有優勢且吸引更多注意。 平面顯示器面板(例如LCD)係用一陣列基材、一基 材、及一液晶層構成。該陣列基材包括配置於矩陣形式中 之複數個像素電極,沿成列之複數像素電極配置的複數個 掃描線’及沿成行之複數像素電極配置的複數個信號線。Flat panel displays are classified into cathode ray tubes (CRTs), liquid crystal displays (LCDs, etc.) because they consume less power and are lighter in weight, so LCDs are particularly advantageous and attract more attention. A flat panel display panel (e.g., an LCD) is constructed using an array of substrates, a substrate, and a liquid crystal layer. The array substrate includes a plurality of pixel electrodes disposed in a matrix form, a plurality of scan lines disposed along a plurality of pixel electrodes arranged in columns, and a plurality of signal lines disposed along a plurality of pixel electrodes in a row.
然而’該陣列基材在製造期間可能有缺陷。例如,電 氣信號線重疊(即短路)。當一陣列基材具有此一缺陷時, 影像無法適當地產生。因此,已重疊之信號線應加以切除, 以防止信號線中之重疊。此一製程係稱為「修復」。 第1圖顯示用於平面顯示器面板之習知修復設備1,包 括:一平台,其係用於支撐—欲修復之基材;一置於該平 台上之雷射顯微鏡3’其係用於取得基材之圖片及使用一雷 射束修復該基材之缺陷區;一光源5,其係用於將光供應給 雷射顯微鏡3;及一移動構件(未顯示),其係用於在χ軸及 5 1335635 Y軸方向上移動該平台。 以下描述一種藉由使用羽t ^ ^ I知修復設備1修復基村的方However, the array substrate may be defective during manufacture. For example, the electrical signal lines overlap (ie, short). When an array of substrates has such a defect, the image cannot be properly produced. Therefore, the overlapping signal lines should be cut off to prevent overlap in the signal lines. This process is called "repair." Figure 1 shows a conventional repair device 1 for a flat panel display panel comprising: a platform for supporting a substrate to be repaired; a laser microscope 3' placed on the platform for obtaining a picture of the substrate and a defect area for repairing the substrate using a laser beam; a light source 5 for supplying light to the laser microscope 3; and a moving member (not shown) for use in the substrate Shaft and 5 1335635 move the platform in the Y-axis direction. The following describes a method for repairing a base village by using a feather t ^ ^ I repair device 1
法。基材係藉由轉移機器臂(未顯示)置於平台上。當接收 由外部檢驗裝置輸入之缺陷區資訊時,移動構件(未顯示) 基於輸入資訊來移動平台,使得缺陷區可置於雷射顯微鏡3 下。在此,在調整平台之位置的同時,當光源、5將光傳送至 缺陷區上時,該缺陷區透過雷射顯微鏡3監視器來監控。當 平台之位置在基材上決定時’缺陷區之某一部分係由一自 雷射顯微鏡3放射之雷射束切除,以修復該基材。在完成修 復製程後,轉移機器臂將基材轉移離開平台。之後,係施 行一檢驗製程以檢驗基材之一電路是否斷路/短路。 然而,習知修復設備具有以下缺點: 當檢驗裝置之一座標系統未與修復設備匹配時,修復 設備可能無法自檢驗裝置讀取基材之缺陷資訊,從而將有 缺陷基材轉移至下一平台。law. The substrate is placed on the platform by a transfer robotic arm (not shown). When receiving the defective area information input by the external inspection device, the moving member (not shown) moves the platform based on the input information so that the defective area can be placed under the laser microscope 3. Here, while the position of the stage is being adjusted, when the light source 5 transmits light onto the defective area, the defective area is monitored by a laser microscope 3 monitor. When the position of the platform is determined on the substrate, a portion of the defective region is removed by a laser beam radiated from the laser microscope 3 to repair the substrate. After completing the repair process, the transfer robot arm transfers the substrate away from the platform. Thereafter, an inspection process is performed to verify whether the circuit of one of the substrates is open/short. However, conventional repair devices have the following disadvantages: When one of the calibration devices of the inspection device is not matched with the repair device, the repair device may not be able to read the defect information of the substrate from the inspection device, thereby transferring the defective substrate to the next platform. .
因為一基材修復製程及一檢驗基材電路之斷路/短路 的檢驗製程係個別地施行,故製程時間拉長並X降低生產 率。 【發明内容】 因此,本發明已針對以上問題進行,且本發明之一目 的係提供一種用於平面顯示器面板之基材電路的修復設 備,其能同時施行一缺陷偵測製程、一修復製程、及一檢 6 1335635Since a substrate repair process and an inspection process for detecting the open/short circuit of the substrate circuit are performed individually, the process time is lengthened and X is reduced in productivity. SUMMARY OF THE INVENTION Accordingly, the present invention has been made in view of the above problems, and an object of the present invention is to provide a repairing apparatus for a substrate circuit of a flat display panel, which can simultaneously perform a defect detecting process, a repair process, And one inspection 6 1335635
用於檢查探針是 於檢驗閘極塾或 針以同時檢驗複 在水平及垂直方 較佳的係, 動構件,其係用 一探針單元;及 向上移動該多探 較佳的係, 驗製程’該設備包含一修復單元’其包括 雷射、及一檢驗單元,因此缩短處理時間 及減少設備體積。 依據本發明之一態樣,以上及其他 一種用於平面顯示器面扳之修復設備而達 含:一修復台;一平台,其上係置故一欲 X轴移動構件,其係在該修復台之X軸方# 二Y軸移動構件,各連接至各X軸移動構不 係在Y軸方向上彼此相間隔;及一修復單 二Y軸移動構件其中之一處,該修復單元 欲檢驗之基材的缺陷區之光學單元,一用 之雷射’及一用於檢驗該已修復基材電路 一檢驗單元。 該第一檢驗單元包含:一 否磨擦該基材;一單一揭 資料墊:及—多探針單元 數電極整;及—探針移禽 向上移動多探針單元及單 本發明之探針移動構件色 於在垂直方向上移動該多 —探針水平移動構件,其 針單元及該單一探針單元 該修復設備更包一 一先學單元、_ 、減少缺陷率、 目的可藉由提出 到,該設備包 檢驗之基材;-上彼此相間g . #之一上表面,其 元’其係安裴在 包栝一用於偵測 於修復該缺陷區 之斷路/短路的第 '相機單元,其係 針單元’其係用 ‘,其具有複數探 構件,其係用於 一移動單元。 ‘含一探針垂直移 探針單元及該單 係用於在水平方 〇 檢驗單元,其係 安裝在未安裝該修復單元之另一Y軸移動構件處。 【實施方式】 現將參考附圖詳述本發明之較佳具體實施例β 第2圖顯示根據本發明之平面顯示器面板的修復設備。 如第2圖中所示’修復設借1〇包括:一修復台6〇〇; _ 平台700’其係置於修復台_ 600上,且一欲修復之基材係置 於其上;一修復單元,其包括一光學單元3〇〇,用於偵測— 可能形成在基材上之缺陷區,一用於藉由將雷射束放射於 基材上以修復其上之缺陷區的雷射2〇〇,及一用於檢驗已修 復基材電路是否斷路/短路之第一檢驗單元1〇〇; 一 χ軸移動 構件400’其係用於在X軸方向上移動該修復單元;及一 γ 軸移動構件500,其係用於在γ軸方向上移動該修復單元。The inspection probe is used to inspect the gate or the needle to simultaneously test the better horizontal and vertical lines, the moving member, which uses a probe unit; and the upward movement of the multi-exploration system. Process 'The device includes a repair unit' which includes a laser and an inspection unit, thereby reducing processing time and reducing equipment size. According to one aspect of the present invention, the above and other repairing devices for a flat panel display panel include: a repairing station; a platform on which an X-axis moving member is attached, which is attached to the repairing station The X-axis side #2 Y-axis moving members, each connected to each X-axis moving structure are not spaced apart from each other in the Y-axis direction; and one of the repairing single-two Y-axis moving members, the repairing unit is to be inspected An optical unit of a defect area of the substrate, a laser for use, and a test unit for inspecting the repaired substrate circuit. The first inspection unit comprises: a non-friction substrate; a single data pad: and - a multi-probe unit electrode assembly; and - a probe moving bird moving the multi-probe unit and a single probe movement of the invention The component is colored to move the multi-probe horizontal moving member in a vertical direction, the needle unit and the single probe unit, the repairing device further includes a first learning unit, _, reducing a defect rate, and the purpose can be raised by The device package inspects the substrate; - the upper surface of each other g. # one of the upper surface, the element is mounted on the first camera unit for detecting the open/short circuit of the defective area, Its needle unit 'which is used' has a complex probe member for a mobile unit. The ‘one probe vertically shifting probe unit and the single unit are used for horizontally 检验 inspection unit, which is mounted at another Y-axis moving member to which the repair unit is not mounted. [Embodiment] A preferred embodiment of the present invention will now be described in detail with reference to the accompanying drawings. Fig. 2 shows a repair apparatus for a flat panel display panel according to the present invention. As shown in Fig. 2, the 'repairing package includes: a repairing station 6〇〇; _ platform 700' is placed on the repairing station _ 600, and a substrate to be repaired is placed thereon; A repair unit comprising an optical unit 3 for detecting a defective area that may be formed on a substrate, and a mine for repairing a defective area thereon by emitting a laser beam onto the substrate Shooting 2〇〇, and a first inspection unit 1〇〇 for checking whether the repaired substrate circuit is open/short; a shaft moving member 400' is used to move the repair unit in the X-axis direction; A gamma-axis moving member 500 for moving the repairing unit in the γ-axis direction.
修復台6 0 0較佳係配置成包括一振動控制構件(未顯 示)’其係用於移除外部或内部產生之振動。乂軸移動構件 400係安裝在600修復台的一上表面上之χ轴方向上。又轴移 動構件400配置之方法係:Χ軸支撐件41〇彼此隔開地安裝 在修復台600之X軸方向上;及_ χ軸執42〇,其係安裝在X 轴支撐件410之一上表面上,以使γ軸支撐件在父軸方向上 滑動,其將解釋於後。 同時,Υ軸移動構件500係在父軸支撐件41〇之垂直方向 上(即Υ軸方向上),置於χ軸支撐件41〇之一上表面上。各 個γ軸移動構件500包括··一 γ軸支撐件51〇,其二端連接至 X軸軌420以沿X軸軌420滑動;_γ軸軌52〇,其係在丫轴方 向上形成在Y軸支撐件510之一側面上;及一Y軸轨塊530’ 其係安裝在Υ轴軌520上以沿Υ軸轨520滑動,且其上安裝該 修復單元。 用於支撐該基材之平台700係置於修復台600之一内側 表面,其覆蓋X軸移動構件400及Υ轴移動構件500二者。 光學單元300係用於偵測一可能在平面顯示器面板之 基材上形成的缺陷區。光學單元300包括:一光源310、一 透鏡320、及一感測器(未顯示)。當光源31〇故射光至基材 上時,光係從該基材反射。從基材反射之光係透過透鏡320 轉移至感測器。感測器接著藉由讀取反射光量中之差異檢 驗缺陷的存在。 藉由使用本發明之光學單元3 00,可確定基材上是否已 產生任何缺陷’無須直接磨擦基材。因此,可保護基材防 止可能由磨擦產生的損害。同樣地’可藉由移除由於一檢 驗裝置及修復設備間之座標系統的不一致產生之誤差,因 而明顯地減少缺陷率。 雷射200係用於移除在平面顯示器面板之基材上的缺 陷雷射2〇〇包括一用於產生雷射束之雷射振盛器m 一 用於匯聚雷射束之匯聚器透鏡22Q,及—用於提供雷射束路 仏之雷射頭230。自雷射振盪器21〇產生之雷射束切除重疊 的信號線以修復有缺陷之基材。 第一撿驗單元1〇〇a係用於檢驗已修復基材之一電路是 否斷路/短路。第一檢 _ 弟檢驗早兀l〇0a包括:一相機單元,其係 用於檢查探針是否磨擦 令悬材,一早一探針單元,其係用於 檢驗閘極墊或資料墊;一多探針單元 驗若干電極塾;及一探針移動構件, 向上移動多探針單元及單—探針單元 單元100a的組件係顯示在第3及4圖中 的構造將詳述於下》The repair station 600 is preferably configured to include a vibration control member (not shown) that is used to remove externally or internally generated vibrations. The cymbal moving member 400 is mounted on the upper surface of the 600 restoring table in the direction of the yaw axis. The method of configuring the shaft moving member 400 is such that the cymbal support members 41 are mounted spaced apart from each other in the X-axis direction of the repairing table 600; and the _ χ shaft holder 42 〇 is mounted on one of the X-axis supporting members 410 On the upper surface, the γ-axis support slides in the direction of the parent axis, which will be explained later. At the same time, the cymbal moving member 500 is placed on the upper surface of the cymbal support member 41 in the vertical direction of the parent shaft support member 41 (i.e., in the direction of the yaw axis). Each of the γ-axis moving members 500 includes a γ-axis support member 51, the two ends of which are coupled to the X-axis rail 420 to slide along the X-axis rail 420; the γ-axis rail 52〇, which is formed in the Y-axis direction at Y One side of the shaft support member 510; and a Y-axis rail block 530' are mounted on the stern rail 520 for sliding along the stern rail 520, and the repair unit is mounted thereon. The platform 700 for supporting the substrate is placed on one of the inner side surfaces of the repair table 600, which covers both the X-axis moving member 400 and the y-axis moving member 500. The optical unit 300 is for detecting a defective area that may be formed on a substrate of a flat display panel. The optical unit 300 includes a light source 310, a lens 320, and a sensor (not shown). When the light source 31 is emitted onto the substrate, the light is reflected from the substrate. Light reflected from the substrate is transferred through the lens 320 to the sensor. The sensor then checks for the presence of a defect by reading the difference in the amount of reflected light. By using the optical unit 300 of the present invention, it can be determined whether any defects have been produced on the substrate without the need to directly rub the substrate. Therefore, the substrate can be protected from damage that may be caused by friction. Similarly, the defect rate can be significantly reduced by removing errors due to inconsistencies in the coordinate system between the inspection device and the repairing device. The laser 200 is used to remove the defect laser 2 on the substrate of the flat display panel, including a laser oscillator for generating a laser beam, and a condenser lens 22Q for collecting the laser beam. And - a laser head 230 for providing a laser beam path. The laser beam generated from the laser oscillator 21 切除 removes the overlapping signal lines to repair the defective substrate. The first verification unit 1A is used to check whether the circuit of one of the repaired substrates is open/short. The first inspection _ 弟 兀 兀 〇 〇 a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a The probe unit detects a plurality of electrodes 塾; and a probe moving member, moving the multi-probe unit and the component unit of the single-probe unit 100a to show the structure shown in FIGS. 3 and 4 will be described in detail below.
_如第2圖中顯示,光學單元300、雷射200及第一檢驗單 = l〇〇a組裝成一修復單元.該修復單元之配置方法係將其 安裝在Y軸支撐件510之¥轴轨塊53〇上(位於該平台之一 側)’以沿Y軸軌520移動。 在此’本發明之修復設備較佳係可配置成包括_第二 檢驗單元1 00b,其係安裝在未安裝該修復單元之一 γ軸移 動構件500處。As shown in Fig. 2, the optical unit 300, the laser 200, and the first checklist = l〇〇a are assembled into a repair unit. The repair unit is configured to be mounted on the ¥ axle of the Y-axis support 510. Block 53 is placed on one side of the platform to move along the Y-axis rail 520. Here, the repairing apparatus of the present invention is preferably configured to include a second inspection unit 100b installed at a γ-axis moving member 500 to which one of the repairing units is not mounted.
’其係配置以同時檢 其係在垂直及水平方 。本發明第之一檢驗 。第一檢驗單元l〇〇a 第二檢驗單元10〇b可安裝在未安裝一修.復單元之γ軸 支擇件510的Y軸軌塊530處,因此如同以上描述之修復單 疋的運動’係在X軸及γ轴方向上移動。在此,第二檢驗單 & 1〇〇b之構造係與安裝在修復單元處的第一檢驗單元l〇〇a 類似。在此情況下,基材之檢驗係如下:第一檢驗單元1 〇〇a 之夕探針單元磨擦對應於已修復部分的像素電極;第二檢 驗單几1 00b之單一探針單元磨擦一閘極墊或資料墊;且電 阻值係由二探針測量,因而檢驗基材電路之斷路/短路。因 此’當提供使用二檢驗單.元1 00 a及1 0 0b之修復設備時,檢 驗基材可更有效地施行。 第3圖係顯示根據本發明之檢驗單元的組件之分解 圖’且第4圖係顯示本發明之檢驗單元的組裝狀態的透視 10 巴栝 本發明之檢驗單」 於檢查探針是否磨擦基材;—單一 /機單兀110,其係用 檢驗閘極墊或資料墊;一多探針十單疋160’其係用於 檢驗若干電極墊之複數探針.①150’其具有用於同時 ’及―探針移動搆件140,装 用於在垂直及水平方向上移動 其係 探針早元150及單一探針 早兀160 。 1 相機單元110係用於檢查探 W及基材間之磨拆_ &能, 發明的相機單元110包括:―相她 磨擦狀I、。本 相機112 ’其係定位在單_ 針單元160及多探針單元15〇上,^ 你平探 上用於檢查探針及基材間之 磨擦狀態;及一相機轉移構侔,4门之 '、係用於在水平方向上較 動相機U2,以致相機112可拍 上移 辦咏針早兀150及160二者。 相機轉移構件較佳係包赵 ^ 括—相機轉移軌116;及一相施 連接塊1 1 4,其一側連接至^ 相機 相機H2且另一側連接至相機 移軌116,以沿相機轉移轨116滑動。 轉 探針移動構件14〇係連杻谷夕 單元160_ # 仔連接至多探針單元15〇及單一探針 単兀160 一者,以在水平及 町 1<Λ _ ^ 垂直方向上移動探針單元150及 160。探針移動構件14〇 12〇) 較佳係包括一探針垂直移動構件 其在垂直方向上移動探 孚銘叙棋批η 可早70150及丨60,及一探針水 十移動構件130,苴在皮伞士丄 ^ '、在水千方向上移動探針。 本發明之探針垂直孩叙 驅動裝置。 *移動構件“Ο可實施為—滾珠螺桿 本發明之探針水平移動 i* , » 傅件130可配置成包括一水平 軌132及—水平軌塊134。 因此,# 4 i 使本發明之二構件140(其可垂直及水平地移動探釺) 同時^③備能精確檢驗基材上所欲的部分。 資料塾或閉::探針單元160係裝設單·'探針162,其磨擦 明之單一探針„从檢驗基材電路的斷路/短路。較佳係本發 -探針^連接早Λ160可更包括單一探針框架164,其將單 接至探針移動構件丨4 〇。 :5圖顯示多探針單元150之詳細構造。 複數:^針單元15G係用於同時測量規律配置在基材上之 152; 一 夕探針早凡150包括:複數探針 ,,151 ’其係在常態中容納複數探針152及當 =未時使探針152突出卜轴啟動器⑴,其定位在探 151之—上表面處,用於當偶而要求時使探針152突 H心155 ’其係、用於檢查探針是否磨擦基材。 另一方面,本發明之多探針單元15〇較佳係更包括一多'The system is configured to check both vertical and horizontal. The first test of the present invention. The first inspection unit 10a can be mounted at the Y-axis rail block 530 of the y-axis support member 510 to which the repair unit is not mounted, thus repairing the movement of the unit as described above. 'The system moves in the X-axis and γ-axis directions. Here, the structure of the second inspection sheet & 1〇〇b is similar to the first inspection unit 10a installed at the repair unit. In this case, the inspection of the substrate is as follows: the first inspection unit 1 〇〇a, the probe unit friction corresponds to the pixel electrode of the repaired portion; the second inspection unit is a single probe unit of the 1 00b friction The pad or the data pad; and the resistance value is measured by the two probes, thus checking the open/short circuit of the substrate circuit. Therefore, when a repairing apparatus using two checklists of $100 a and 100b is provided, the test substrate can be more efficiently performed. 3 is an exploded view showing the components of the inspection unit according to the present invention, and FIG. 4 is a perspective view showing the assembled state of the inspection unit of the present invention. 10 Checking whether the probe rubs the substrate. ;-Single/machine single 兀110, which is used to test the gate pad or data pad; a multi-probe ten 疋160' is used to test the multiple probes of several electrode pads. 1150' It has been used for simultaneous ' And the probe moving member 140 is configured to move the probe early element 150 and the single probe early 160 in the vertical and horizontal directions. 1 The camera unit 110 is used to check the grinding and dismantling between the probe and the substrate. The camera unit 110 of the invention includes: - a her frictional shape I. The camera 112' is positioned on the single-needle unit 160 and the multi-probe unit 15〇, and is used to check the friction state between the probe and the substrate; and a camera transfer configuration, 4 doors ', is used to move the camera U2 in the horizontal direction, so that the camera 112 can take the transfer needles earlier than 150 and 160. The camera transfer member preferably includes a camera transfer rail 116; and a phase connection block 1 1 4, one side of which is coupled to the camera camera H2 and the other side to the camera shift rail 116 for transfer along the camera The rail 116 slides. The probe moving member 14 is connected to the multi-probe unit 15〇 and the single probe unit 160 to move the probe unit in the horizontal direction and the 1 1 lt _ ^ vertical direction. 150 and 160. The probe moving member 14〇12〇) preferably includes a probe vertical moving member that moves in the vertical direction, and the probe water is moved 70° and 丨60, and a probe water ten moving member 130, In the leather umbrella 丄 ^ ', move the probe in the direction of the water. The probe of the present invention is a vertical driving device. * Moving member "Ο can be implemented as - ball screw The probe horizontal movement i* of the present invention, » The piece 130 can be configured to include a horizontal rail 132 and a horizontal rail block 134. Thus, #4 i makes the second invention The member 140 (which can move the probe vertically and horizontally) at the same time can accurately inspect the desired portion of the substrate. Data 塾 or closed:: The probe unit 160 is equipped with a single 'probe 162, the friction A single probe „ from the open/short circuit of the test substrate circuit. Preferably, the probe-connecting probe 160 may further include a single probe frame 164 that will be attached to the probe moving member 丨4 单. The :5 diagram shows the detailed construction of the multi-probe unit 150. The plural: ^ needle unit 15G is used to simultaneously measure the regular arrangement of 152 on the substrate; the overnight probe 150 includes: a plurality of probes, 151 'which is in the normal state to accommodate the plurality of probes 152 and when = not The probe 152 is caused to protrude from the spindle starter (1), which is positioned at the upper surface of the probe 151, for occasionally requiring the probe 152 to protrude from the center 155', for checking whether the probe rubs the substrate . On the other hand, the multi-probe unit 15 of the present invention preferably includes more than one
探針框架1 5 7,其#以F έΒ从ΛΚ , d U 、 牛彼此連接,且係附接至探針移 動構件“〇,以允許多探針單元15。能在水平及垂直方探向針上移The probe frame 1 5 7 is connected to each other by F έΒ from ΛΚ , d U , and the cow is attached to the probe moving member “〇 to allow the multi-probe unit 15 to be explored horizontally and vertically. Needle up
移動D 下文中將描述一種使用本發明之修復設備修復一基材 的方法》 首先,當將基材置於平台上時,一光學單元開始運轉。 修復單元接著移動以檢驗基材上是否發生任何缺陷。在其 上安裝修復單元之Y軸軌塊係沿γ軸軌移動,且具有γ軸軌 之Υ軸支撐件係沿X轴轨移動,因此致能檢驗基材上之每一 部分《= 12 1335635 之光透過透鏡入射至感測器上。 ,從基封反 π感測器藉由结 量中之差異檢驗缺陷的存在。+去伯 。取反射光 田禾偵測到任 祀 材被轉移至下一平台。 了缺陷時,基 然而,當偵測到任何缺陷時, 叮 移動修復I_ 射用於缺陷區上施行修復。之後, 711以定位雷 由射束在其 除重疊的信號線,從而施行該修復。 、上放射以切Mobile D A method of repairing a substrate using the repairing apparatus of the present invention will be described hereinafter. First, when the substrate is placed on the platform, an optical unit starts to operate. The repair unit then moves to verify if any defects have occurred on the substrate. The Y-axis rail block on which the repair unit is mounted moves along the γ-axis rail, and the y-axis support member having the γ-axis rail moves along the X-axis rail, thereby enabling inspection of each portion of the substrate "= 12 1335635 Light is incident on the sensor through the lens. From the base-sealed anti-π sensor, the presence of defects is checked by the difference in the amount of the measurement. + Go to Bo. Taking reflected light Tianhe detected that any of the materials were transferred to the next platform. In the case of a defect, however, when any defect is detected, 叮 the mobile repair I_ shot is applied to the defective area for repair. Thereafter, 711 performs the repair by locating the lightning beam in addition to the overlapping signal lines. Radiation
在完成修復製程後,第一檢驗單元之多 已修復部分的像素電極墊,且第二檢驗單元單元磨擦 元磨擦一閘極墊或資料墊。由二探 疋之平—探針單 用來檢驗該基材電路是否斷路/短路。在此,。電阻值係 相機來檢查探針是否磨擦基材。可科 可用感挪器及 •用相機韓敕 來調整相機位置,直至其位於一想要 件 文懷觸的部分。 針移動構件可精密地移動探針單元。 探 需求部分施行檢驗。 了針對—確切 若未曾從該檢驗摘測出任何缺陷,則基材被轉 一平台β 如以上描述’本發明包括一修復單元,其具有—光學 單元、-雷射、及一檢驗單元,《同時施行一缺陷摘測; 程,一修復製程,及一檢驗製程。因此可缩短產品製造時 間’減少設備安裝空間及產品缺陷率,且增加生產力。After the repair process is completed, the first inspection unit has a repaired portion of the pixel electrode pad, and the second inspection unit unit rubs the element to rub a gate pad or a data pad. The probe is used to check whether the substrate circuit is open/short. here,. The resistance value is the camera to check if the probe is rubbing the substrate. You can use the sensor and • use the camera to adjust the camera position until it is in the desired part. The needle moving member can precisely move the probe unit. Exploring the demand part of the inspection. For the purpose of - if no defects have been extracted from the test, the substrate is transferred to a platform β as described above. 'The invention includes a repair unit having an optical unit, a laser, and a test unit, At the same time, a defect extraction test; a process, a repair process, and an inspection process are performed. Therefore, the manufacturing time of the product can be shortened, the equipment installation space and product defect rate are reduced, and productivity is increased.
同樣地’本發明包括一移動構件,其允許該設備在X 轴及γ轴方向上移動,從而允許該設備檢驗在其任何部分 處之基材。 13 1335635 此外,本發明係配置以在一檢驗單元中包括一多探針 單元及一單一探針單元,以使基材電路之斷路/短路檢驗能 - 快速施行,使其可同時施行一個別電路之檢驗及鄰近像素 . 電極墊的檢驗。 再者,本發明係配置成包括一移動構件,其係用於移 動該修復單元;一探針移動構件,其係用於在垂直及水平 方向上移動探針;及一相機,因此允許在一精確需求位置 施行修復及檢驗。 ® 雖然本發明之較佳具體實施例已揭示用於示範目的, 但熟習此項技術人士將會瞭解在不脫離隨附申請專利範圍 中揭示之本發明範疇及精神下,各種修改、增加及替換均 屬可行。 【圖式簡單說明】 本發明之以上及其他目的、特徵及其他優點,將可自 以上結合附圖之說明中更清楚地瞭解’其中: 第1圖係顯示習知修復設備之示意圖; 第2圖係顯示根據本發明之修復設備的透視圖; 第3圖係顯示根據本發明之檢驗單元的分解透視圖; 第4圖係顯示根據本發明之檢驗單元的透視圖·,及 第5圖係顯示根據本發明之多探針單元的分解透視圖。 【主要元件符號說明】 習知修復設備 3 雷射顯微鏡 14 1335635Similarly, the present invention includes a moving member that allows the device to move in the X-axis and gamma-axis directions, thereby allowing the device to inspect the substrate at any portion thereof. 13 1335635 In addition, the present invention is configured to include a multi-probe unit and a single probe unit in an inspection unit to enable the circuit breaker/short circuit test of the substrate circuit to be quickly implemented so that a different circuit can be simultaneously implemented. Inspection and adjacent pixels. Inspection of electrode pads. Furthermore, the present invention is configured to include a moving member for moving the repairing unit; a probe moving member for moving the probe in a vertical and horizontal direction; and a camera, thus allowing Repair and inspection at the exact location required. Although the preferred embodiment of the present invention has been disclosed for the purpose of illustration, those skilled in the art will appreciate that various modifications, additions and substitutions can be made without departing from the scope and spirit of the invention disclosed in the appended claims. Both are feasible. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and other advantages of the present invention will become more <RTIgt; The figure shows a perspective view of a repairing device according to the invention; Fig. 3 shows an exploded perspective view of the testing unit according to the invention; Fig. 4 shows a perspective view of the testing unit according to the invention, and Fig. 5 An exploded perspective view of a multi-probe unit in accordance with the present invention is shown. [Main component symbol description] Conventional repair equipment 3 Laser microscope 14 1335635
5 光 源 10 修 復 設 備 100 檢 驗 單 元 100a 第- 一 i 会驗單: 元 100b 第 二 i 兹單元 110 相 機 單 元 112 相 機 114 相 機 連 接 塊 116 相 機 轉 移 軌 120 探 針 垂 直 移 動構件 130 探 針 水 平 移 動構件 132 水 平 軌 134 水 平 軌 塊 140 探 針 移 動 構 件 150 多 探 針 單 元 15 1 探 針 組 件 152 複 數 探 針 153 軸 啟 動 器 155 感 測 器 157 探 針 框 架 160 單 — 探 針 單 元 162 單 — 探 針 164 單 .一 探 針 框 架 200 雷 射 210 雷 射 振 盪 器 220 匯 聚 器 透 鏡 230 雷 射 頭 300 光 學 單 元 3 10 光 源 320 透 鏡 400 X 軸 移 動 構 件 4 10 X 軸 支 撐 件 420 X 轴 軌 500 Y 轴 移 動 構 件 5 10 Y 支 撐 件 520 Y 轴 軌 530 Y 軸 轨 塊 600 修 復 台 700 平台 155 Light source 10 Repair device 100 Inspection unit 100a First-one verification check: Unit 100b Second i-unit 110 Camera unit 112 Camera 114 Camera connection block 116 Camera transfer rail 120 Probe vertical moving member 130 Probe horizontal moving member 132 Horizontal Rail 134 Horizontal Rail Block 140 Probe Moving Member 150 Multi-Probe Unit 15 1 Probe Assembly 152 Complex Probe 153 Shaft Actuator 155 Sensor 157 Probe Frame 160 Single - Probe Unit 162 Single - Probe 164 Single A probe frame 200 Laser 210 Laser oscillator 220 Converger lens 230 Laser head 300 Optical unit 3 10 Light source 320 Lens 400 X-axis moving member 4 10 X-axis support 420 X-axis rail 500 Y-axis moving member 5 10 Y support 520 Y-axis rail 530 Y-axis rail block 600 Repair station 700 Platform 15
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| KR1020060077016A KR100822223B1 (en) | 2006-08-16 | 2006-08-16 | Repair Device for Flat Panel Display Circuits |
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| KR101053453B1 (en) | 2008-12-09 | 2011-08-03 | 참엔지니어링(주) | Mask repair apparatus with multiple alignment means |
| KR101194341B1 (en) * | 2010-08-24 | 2012-10-24 | 주식회사 대양기술 | Apparatus for cutting the optical sheet |
| KR101269443B1 (en) * | 2011-09-20 | 2013-05-30 | 참엔지니어링(주) | Apparatus for testing and repairing of substrate |
| KR101269446B1 (en) * | 2011-10-05 | 2013-05-30 | 참엔지니어링(주) | Apparatus for testing and repairing of substrate |
| KR101682520B1 (en) * | 2015-07-02 | 2016-12-06 | 참엔지니어링(주) | Inspection apparatus and method |
| CN106597704A (en) * | 2016-12-22 | 2017-04-26 | 武汉精测电子技术股份有限公司 | Rotating device and display panel detection device |
| JP2018146826A (en) * | 2017-03-07 | 2018-09-20 | 株式会社ブイ・テクノロジー | Substrate correction device |
| WO2019103299A1 (en) | 2017-11-23 | 2019-05-31 | 주식회사 프로텍 | Laser apparatus for printed electronics system and operating method thereof |
| KR101999992B1 (en) * | 2018-01-24 | 2019-07-15 | 주식회사 에이치비테크놀러지 | Auto focusing assembly of repairing apparatus |
| KR102305737B1 (en) | 2020-04-27 | 2021-09-30 | 주식회사 에이치비테크놀러지 | Composite machining laser refair device capable of controlling slits and spots |
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| KR100522752B1 (en) * | 2003-06-02 | 2005-10-20 | 참이앤티 주식회사 | LCD repair device having a capacity of Automated Optical Inspection and repair method thereof |
| KR20050030023A (en) * | 2003-09-24 | 2005-03-29 | 삼성전자주식회사 | Test and repair apparatus for tft substrate |
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| TW200811980A (en) | 2008-03-01 |
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