TWI334030B - Repair device and repair method - Google Patents
Repair device and repair method Download PDFInfo
- Publication number
- TWI334030B TWI334030B TW096103649A TW96103649A TWI334030B TW I334030 B TWI334030 B TW I334030B TW 096103649 A TW096103649 A TW 096103649A TW 96103649 A TW96103649 A TW 96103649A TW I334030 B TWI334030 B TW I334030B
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- 230000008439 repair process Effects 0.000 title claims description 37
- 238000000034 method Methods 0.000 title claims description 10
- 239000000758 substrate Substances 0.000 claims description 62
- 239000000523 sample Substances 0.000 claims description 41
- 238000012360 testing method Methods 0.000 claims description 27
- 239000004973 liquid crystal related substance Substances 0.000 claims description 5
- 230000008021 deposition Effects 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 3
- 230000002950 deficient Effects 0.000 claims 1
- 239000000428 dust Substances 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- 230000006698 induction Effects 0.000 claims 1
- 239000002689 soil Substances 0.000 claims 1
- 230000007547 defect Effects 0.000 description 13
- 238000001514 detection method Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000007689 inspection Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000010902 straw Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
Description
1334030 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種用以檢測及修復在電路配線中之 復裝置’該裝置係設置於液晶顯示襄置⑽)、電裝顯示面板^ Plasma Display Panel) ’以及其他平面顯示器(FpDs ;1334030 IX. Description of the Invention: [Technical Field] The present invention relates to a composite device for detecting and repairing in a circuit wiring. The device is disposed on a liquid crystal display device (10), and an electrical display panel ^ Plasma Display Panel) 'and other flat panel displays (FpDs;
Displays)的基板等上。· ’ ^anel ^ 【先前技術】 FPD基板最近已在尺寸上增大,而且比起吾棄不良基板 •籲在製造過程中出現的不良基板已變得較不昂貴。電路配線^ 置(修復裝置)係用來修復基板上的缺陷。 乂 、 以下說明修復錢的料前後之製造方法。在此過程 一部分,檢測缺陷並藉由專門用以測試整個基板上的FpD之 . 配線的斷路缺陷Copen-circuit defect)以及短路缺陷 • (short-circuit defect)之電子缺陷檢測裝置(〇s (短/斷路' ^ 試器)或自動影像檢測裝置(A0I裝置:自動光學檢驗裝置 (Automatic Optical Inspection device))以確定其位置:而 檢測與位置測定的結果會在電腦中儲存成資料。修復裝置以此 料為基礎來修復軸。〇S測勒或自動光學檢峨置接著再一次 翬證實缺陷已被正確地修復。因而使製程倒退,而產品產量減少。 近來,為增進產量,已開發出安裴於〇s測試器上之修復裝置。 然而,在製造過程中,僅可使用有限量的空間來放置修復裝置, •而此裝置有儘可⑨縮小體積的需要。此裝置亦必須改善產量並 低成本。 -供ne日專利公報第〇2一〇2947號所揭露之修復裝置係為一配 之習知修復裝置的例子。配備〇s測試器之習知修復 f置3有:一座台’其支撐一已安裝的受測單元,其中座台可移 至探測,置與修復位置,並可加以控制以便於三正交軸上移 動,並在二維平面上旋轉;一測試裝置,藉由外加電力於探測位 1334030 的形式而設置於各@不_方向上。因此,為了檢剩所有 路與短路缺陷,必須使饋電探針頭108與所有的電極墊片接觸。 因此’在上述之習知裝置中,必須將LCD基板移離開支撐架1〇5 一次並加以旋轉,之後並重新安裝在修復裝置上。圖1β顯示的 態中,LCD基板已移離開支撐架1〇5,並在旋轉9〇度德 裝於修復裝置上。 < 然而’上述之習知技術具有以下的缺點。 在上述的習知技術中,FPD基板上的缺陷位置由先前步驟中 設置之0S職純檢測,修縣置基於檢測㈣料而 至缺,位^置,而修復該缺陷。此修復結果再一次回到先前步驟之 0S測試器以確認缺陷是否已正確地被修復。然而,此類 具有以下的缺點:曾修復過之FPD基板repaired = substrate)又回到先前步驟,而增加了工作時間與單元作業時 (tact time)。 ” ’ 曰 —些製造業者最近已提出為修復裝置提供 ί 而,如在圖1所示之f知_ GS測定器 ίπΓ盆f置巾,此習知系統有如下的缺點4要從支撐架上移除 i基t一次並重新安裝基板的步驟;需要轉子裝置(rotor ielice)'财外部旋轉機構之_裝置;所增加钱_增加了 成本,且早凡作業時間進一步地增加。 ·— 【發明内容】 祕ΐΐ月々之目的為提供一修復裝置’其可有效地進入lcd基板上 ^。斤有電路配線、檢測缺陷、並修復缺陷而不移除與重新安裝基 二= 發明之修復裝置包括:一座台,其上安裝了基板;第一與第 探su!者該座台之一表面的第一方向上移動;第-及第二 於該二ί別,於該第一及第二高架,且能夠在與關 弟方向相父的第二方向上移動;以及一修復單元, 7 1334030 板ϊί測料,其設置於該第—高架以便能夠在第 -。其中該第一及第二探針感應器單元中之每一個且 力::ίϊΓ ;夠,第二方向上移動;-探針單元,用以; 該受測單’以及—感應器單元,用以檢測流至 電流,兩者並列於該平台部分上;以及平台驅動單 的轉軸^平台部分繞著在與該座台之—表面正交的方向上 高其中ΐ修鮮元設置於鱗—高架與該第二 Γ二探針感應器單元設置於該第-高架之該 葉:=;ΐ該弟二探針感應器單元設置於該第二高架之該 高架:單元於該第-高架之料^ ,二探;感 探針感應器單元,分別設置於該第-及第: 關”-方向相交之第二以以 用以外加電壓至基板之受測 該其:各個該第-ί第= :刀—月匕夠於第一方向上移動;一探針單元, 早元,以及一感應器單元,用以檢測 針單ί及該感應器單元兩者均並列 著在與,座台之一表面正交轉:二:動該平台部分繞 芊之··其巾該第—探針感魅單元設置於該第-高 竿之;it ’該第二探針感應器單元係、設置於該第二高 木之料、㈣上’該第三赫並靴於 8 3<間’且該修復單,元設置於該f三高架之該第—及第二高架 -高構:其中該第—騎感應11單元餘置於該第 二高架=Ϊ架側上’該第二探針感應、11單元係S置於該第 第二高W架側上’遺第二局架並不位於該第—高架與該 二高架=側ί該修復單元係設置於該第三高架與該第-及第 5^ — 〇 * 座口馬動早 7G ,將該座台、該第一、第 相關之,該座台驅動單元係用以在與平板 路配吉構:f中r基板之受測單元為設置於該基板之電 該受測單元:或第二楝針感應11單元之探針單元與該基板之 流至該點’並於兩點之間外加電壓以檢測電流是否 又測早疋,稭此檢測出電路配線上的短路。 電路其巾—基板之受測單福設置於該基板之 板之該第—探_應器單元之任—探針單元與該基 接的流是否流至與該基板之該受測單元相連 電路配線,藉此檢測出該電路配線上的斷路。 =_如下結構:針-級之受解福 ;=缺=修復單元㈣-祕絲至較解紅短ϊίΐ ㈣如下結構.其巾—基板之受測單元為設置於該基板之電 元發射—雷射光綠該受測單元之斷路位 置,並猎由化學瘵氧沈積法(CVD)執行修復。 substrate) 〇 =:基:面顯示器基板可為液晶顯示裝置之基板或是ΐ裝 能在與關於該高架之第—> 感應器單元具有-平二方向上鑛。其中探針 用以外加電壓至基板之^^可於k方向上移動;厂探針單元, 流至受測單元之電流,兩者均:二f一感應器單兀’用以檢測 驅動平台部分繞著在與該:台=面=:二Display) on the substrate, etc. · 'anel ^ ^ [Prior Art] FPD substrates have recently increased in size and have become less expensive than the poor substrates that have appeared in the manufacturing process. The circuit wiring (repair device) is used to repair defects on the substrate. 、 , The following describes the manufacturing method before and after the repair of the money. In part of this process, defects are detected and used to test FpD on the entire substrate. Copen-circuit defect of the wiring and short-circuit defect electronic defect detection device (〇s (short) / Open circuit '^ tester' or automatic image inspection device (A0I device: Automatic optical inspection device) to determine its position: the results of detection and position measurement are stored in the computer as data. Based on this material, the shaft is repaired. 〇S measuring or automatic optical inspection and then confirming that the defect has been correctly repaired, thus making the process backward and the product yield is reduced. Recently, in order to increase the output, the safety has been developed. The repair device on the 〇s tester. However, in the manufacturing process, only a limited amount of space can be used to place the repair device, and the device has the need to reduce the volume. The device must also improve the yield. Low-cost. - The repair device disclosed in Japanese Patent Laid-Open Publication No. Hei 2 〇 2947 is an example of a conventional repair device. The conventional repair of the tester has three sets: a stand that supports an installed test unit, wherein the stand can be moved to the detection, set and repair position, and can be controlled to move on the three orthogonal axes. And rotating on a two-dimensional plane; a test device is set in each @不_ direction by applying power in the form of the detection bit 1334030. Therefore, in order to check all the paths and short-circuit defects, the feed probe head must be made 108 is in contact with all of the electrode pads. Therefore, in the above conventional device, the LCD substrate must be moved away from the support frame 1〇5 once and rotated, and then reinstalled on the repairing device. The LCD substrate has been moved away from the support frame 1〇5 and mounted on the repairing device at a rotation of 9 degrees. <Therefore, the above-mentioned prior art has the following disadvantages. In the above-mentioned prior art, on the FPD substrate The defect position is detected by the 0S job set in the previous step, and the repair county fixes the defect based on the detection (four) material, and fixes the defect. The repair result is returned to the previous step of the 0S tester to confirm the defect. Is it already Correctly repaired. However, this type has the following disadvantages: the repaired FPD substrate repaired = substrate) is returned to the previous step, which increases the working time and tact time. " 曰 - Some manufacturers have recently proposed to provide 修复 for the repair device, as shown in Figure 1 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The step of removing the i-base once and re-installing the substrate; the rotor device is required to be the device of the external rotation mechanism; the added cost _ increases the cost, and the working time is further increased. Contents] The purpose of the secret moon is to provide a repair device that can effectively enter the lcd substrate. The circuit has wiring, detects defects, and repairs defects without removing and reinstalling the base 2. The invention includes: a platform on which a substrate is mounted; a first and a second probe are moved in a first direction on a surface of the platform; and a second and a second are on the first and second elevated frames, And being movable in a second direction opposite to the direction of Guandi; and a repair unit, 7 1334030, a sheet of material, which is disposed at the first-high shelf so as to be capable of being at - - wherein the first and second probes Each of the sensor units and Force:: ίϊΓ; enough, moving in the second direction; - probe unit for; the test list 'and the sensor unit for detecting the flow to the current, both of which are listed on the platform portion; and the platform The rotating shaft of the driving unit is partially disposed in a direction orthogonal to the surface of the platform, wherein the upper portion is disposed on the scale-elevator and the second second probe sensor unit is disposed on the first-high frame The leaf:=;ΐThe second probe sensor unit is disposed on the elevated shelf of the second elevated frame: the unit is in the first-high shelf material ^, the second probe; the sensing probe sensor unit is respectively disposed in the first - and the "off" - the second of the intersecting directions to apply the applied voltage to the substrate of the test: each of the first -: - knife - moon is moved in the first direction; a probe unit , the early element, and a sensor unit for detecting the needle single and the sensor unit are both juxtaposed on the surface of one of the seats: two: moving the platform partially around The first probe-sensing unit is disposed in the first-high ;; the 'the second probe sensor unit is disposed on the The second high wood material, (4) on the 'the third Hehe boots in 8 3 < between the and the repair order, the element is set in the f three elevated frame - and the second elevated - high structure: where the first ride The sensing 11 unit is left on the second overhead = truss side 'the second probe sensing, and the 11 unit system S is placed on the second high W frame side 'the second local frame is not located in the first The elevated frame and the two elevated frame=side ί, the repairing unit is disposed on the third elevated frame and the first and the fifth and the first 马* 口 马 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 The platform driving unit is configured to cooperate with the flat circuit: the measuring unit of the r substrate is the measuring unit that is disposed on the substrate, or the probe unit of the second unit 11 and the substrate The flow to this point 'and a voltage is applied between the two points to detect whether the current is measured early, and the straw detects a short circuit on the circuit wiring. The circuit of the substrate-measured substrate is disposed on the board of the substrate, and the probe unit and the base connected flow flow to the circuit connected to the tested unit of the substrate Wiring, thereby detecting an open circuit on the circuit wiring. =_The following structure: needle-level is solved by the solution; = lack = repair unit (four) - secret silk to more red short ϊ ΐ (4) The following structure. The towel-substrate test unit is the cell emission set on the substrate - The laser light green is the disconnected position of the unit under test, and the hunting is performed by chemical oxygen deposition (CVD). Substrate : =: base: The surface display substrate can be a substrate or an armor of a liquid crystal display device, and can be mined in a direction parallel to the sensor unit of the overhead. The probe can be moved in the k direction by applying a voltage to the substrate; the factory probe unit, the current flowing to the unit under test, both: two f-inductor unit 兀' for detecting the driving platform portion Around with: the table = face =: two
配線 二:電 J 觸單;撿並 示裝置之基板或電槳顯示面板之基基板也可疋液晶顯 =時,藉由下 位於該觉測單元的該探針感應器單元之後,令 二二ί的该受測單元接觸於兩點,於該兩點之間外加電壓凡 ί; 復單;細到鱗時,將該修 12Wiring 2: The electric J touches the single substrate; the base substrate of the display device or the base substrate of the electric paddle display panel can also be displayed after the liquid crystal display = by the lower of the probe sensor unit of the sensing unit, ί The unit under test is in contact with two points, and a voltage is applied between the two points; a single order; when the scale is fine, the repair is performed.
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006028764A JP2007206641A (en) | 2006-02-06 | 2006-02-06 | Repair device and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200734656A TW200734656A (en) | 2007-09-16 |
| TWI334030B true TWI334030B (en) | 2010-12-01 |
Family
ID=38486135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096103649A TWI334030B (en) | 2006-02-06 | 2007-02-01 | Repair device and repair method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2007206641A (en) |
| KR (1) | KR100868471B1 (en) |
| CN (1) | CN101017256B (en) |
| TW (1) | TWI334030B (en) |
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| KR101060472B1 (en) * | 2007-11-30 | 2011-08-29 | 엘지디스플레이 주식회사 | Defective cell repair method of LCD panel |
| KR100908327B1 (en) * | 2007-12-28 | 2009-07-17 | 주식회사 코윈디에스티 | Thin film forming device using laser |
| KR100909959B1 (en) * | 2008-01-28 | 2009-07-30 | 참앤씨(주) | LC panel repair apparatus and method |
| KR20100030867A (en) | 2008-09-11 | 2010-03-19 | 삼성전자주식회사 | Inspecting apparatus for solar cell and inspecting method using the same |
| JP5088579B2 (en) * | 2008-09-12 | 2012-12-05 | オムロン株式会社 | Glass substrate repair device |
| JP5240466B2 (en) * | 2009-03-12 | 2013-07-17 | オムロン株式会社 | FPD substrate manufacturing method and apparatus |
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| JP5637532B2 (en) * | 2010-12-27 | 2014-12-10 | 株式会社ブイ・テクノロジー | Laser processing equipment |
| KR101317173B1 (en) | 2011-12-19 | 2013-10-15 | 참엔지니어링(주) | Apparatus for testing and repairing of substrate |
| US9297074B2 (en) | 2013-12-31 | 2016-03-29 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Liquid crystal display panel repairing method and repairing system |
| CN103744201A (en) * | 2013-12-31 | 2014-04-23 | 深圳市华星光电技术有限公司 | Liquid crystal display panel repair method and repair system |
| CN104280904A (en) * | 2014-09-26 | 2015-01-14 | 京东方科技集团股份有限公司 | Array substrate detecting head and device and array substrate detecting method |
| CN104880841B (en) * | 2015-05-18 | 2018-05-25 | 合肥京东方光电科技有限公司 | Substrate prosthetic device and restorative procedure |
| KR101553290B1 (en) | 2015-07-01 | 2015-09-16 | (주)넥스틴 | system for inspection and repair for substrate of OLED display |
| CN104991391B (en) * | 2015-07-30 | 2018-01-30 | 武汉华星光电技术有限公司 | The restorative procedure of display panel |
| CN109116591A (en) * | 2017-06-26 | 2019-01-01 | 深圳市宇顺工业智能科技有限公司 | A kind of LCD liquid crystal display screen detection method |
| TWI634339B (en) * | 2017-11-21 | 2018-09-01 | 興城科技股份有限公司 | Method and apparatus for testing a tft panel |
| CN113203960A (en) * | 2021-04-26 | 2021-08-03 | 深圳市华星光电半导体显示技术有限公司 | Open-circuit and short-circuit testing device and method |
| CN114035384B (en) | 2021-10-27 | 2023-09-01 | 滁州惠科光电科技有限公司 | Array substrate circuit repairing method and device and array substrate |
| CN117580679A (en) * | 2021-11-25 | 2024-02-20 | 奥宝科技有限公司 | Improved handling of flexible circuit boards (CBs) using vacuum plates adapted to flexible circuit board (CB) designs |
| CN114879389A (en) * | 2022-05-23 | 2022-08-09 | 南京阿德庞斯信息科技有限公司 | Liquid crystal display defect repairing equipment and repairing method thereof |
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| US5164565A (en) * | 1991-04-18 | 1992-11-17 | Photon Dynamics, Inc. | Laser-based system for material deposition and removal |
| US20010015641A1 (en) * | 1998-09-23 | 2001-08-23 | Mark A. Swart | Circuit board testing apparatus |
| KR100402179B1 (en) * | 2001-09-21 | 2003-10-17 | 미래산업 주식회사 | Tilt Correcting System of Dual Gantries |
| KR100402177B1 (en) * | 2001-09-21 | 2003-10-17 | 미래산업 주식회사 | Tilt Correcting System of Gantry for Surface Mounting Device |
| CN2727784Y (en) * | 2004-03-26 | 2005-09-21 | 广辉电子股份有限公司 | Line defect detection and laser repair equipment for flat panel displays |
| JP2006049384A (en) * | 2004-07-30 | 2006-02-16 | Laserfront Technologies Inc | Gantry type XY stage |
-
2006
- 2006-02-06 JP JP2006028764A patent/JP2007206641A/en active Pending
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2007
- 2007-02-01 TW TW096103649A patent/TWI334030B/en not_active IP Right Cessation
- 2007-02-05 KR KR1020070011746A patent/KR100868471B1/en not_active Expired - Fee Related
- 2007-02-06 CN CN2007100067919A patent/CN101017256B/en not_active Expired - Fee Related
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| KR100868471B1 (en) | 2008-11-12 |
| KR20070080231A (en) | 2007-08-09 |
| CN101017256A (en) | 2007-08-15 |
| CN101017256B (en) | 2011-03-30 |
| JP2007206641A (en) | 2007-08-16 |
| TW200734656A (en) | 2007-09-16 |
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