1328737 .九、發明說明： •【發明所屬之技術領域】 本發明涉及一種扣合裝置組合，特別係指一種用於將 政熱裝置固定至電子裝置之扣合裳置組合。 【先前技術】 諸如電腦中央處理器、北橋晶片、顯卡等高功率電子 元器件在運行時會產生大量之熱量，該等熱量如果不能被 有效j散去，將直接導致溫度急劇上升，而嚴重影響到電 子疋器件之正常運行。為此，需要散熱裝置來對該等電子 元器件進行散熱，同時，還需要扣合裝置以將散熱裝置固 定至電子元器件。 人中國大陸專利第01215323.0號揭示了一種散熱裝置組 合，其包括一散熱器以及一將散熱器固定到電子元器件上 之扣合元件。所述散熱器包括一基座及複數自基座向上延 伸而出之圓柱狀之鰭片。所述扣合元件為一金屬桿一體彎 折而成，其具有一圓環及二分別自圓環兩端反向延伸出之 扣腳。固定該散熱器至電子元器件上時，只需將所述扣合 元件之圓環穿過散熱器之某一鰭片，然後將扣合元件之二 #腳卡扣至電子元器件所處之電路板上，即可完成組裝過 程。 ' 但是，由於所述扣合元件之圓環需穿過散熱器之鰭片 才倉b對散熱器進行限位’當完成扣合之後，扣合元件將對 鰭片產生一橫向之擠壓力。如若散熱器之鰭片較薄，該擠 /37 •壓力將很容易導致H片產生形變，使扣合Μ之圓環從轉 片上脫落，致使扣合it件無法固定住散熱器。從而，散熱 器和電子it器件間之接觸將極不穩定，受W形狀影響較 大。 【發明内容】 有雲於此，實有必要提供一種可將散熱器穩定地固定 至電子元器件之扣合裝置組合。 一種扣合裝置組合，用於將散熱器固定至安裝於電路 板之電子S器件上’所述電路板向上形成—支架，所述扣 ^裝置組合包括一供散熱器結合之基座及二分別位於散熱 器兩側之扣合元件，所述每一扣合元件包括一臂部及自一 #。卩端向下延伸之支撐部，所述支撐部固定至電路板而 支撐所述臂部，所料部之另—端與電路板之支架相扣合 而使所述臂部向下按壓所述基座。 與習知技術相比，本發明扣合裝置組合之基座與散熱 器相結合’將散熱器固定至扣合裝置組合之基座上；再， 二扣合元件分別位於散熱器之兩側而直接作用於基座，無 需與散熱器相配合即可將散熱器固定至電子元器件上。故 無論散熱器之構造如何發生變化，都不會對二扣合元件造 成影響，從而可實現散熱器與電子元器件間之穩定接觸。 【實施方式】 如圖1所示，本發明之扣合裝置組合20用於將一散熱器 10固定至一電子元器件上30。所述電子元器件30安裝於〆 1328737 電路板40之中部。該電路板40靠近電子元器件30之位置開 - 設二螺孔44，供扣合裝置組合20相應之結構穿設。該電路 . 板40之右側向上延伸出一支架42。該支架42包括二分別形 成於電路板40相鄰二角處之支撐桿（圖未標）及一連接該 二支撐桿之橫桿（圖未標），其中每一支撐桿均垂直於電 路板40。所述橫桿平行於電路板40，其橫截面呈圓形，用 於與扣合裝置組合20相應之結構相配合。 I 圖1至圖3示出了本發明之其中一實施例：所述扣合裝 置組合20包括一安裝於電子元器件30上之基座22、二分別 位於基座22前後兩側之扣合元件24、及二固定扣合元件24 至電路板40之螺桿件26。所述基座22包括一矩形之板體（圖 未標）。所述板體之中部區域開設複數凹槽（圖未標）， 以收容散熱器10之相應結構；其下表面垂直向下延伸出一 凸塊224,用於與電子元器件30接觸而將其產生之熱量傳導 至基座22 ;其上表面之前後兩侧分別垂直向上延伸出二矩 • 形之受壓部220,用於承接扣合元件24,其中每一受壓部220 上表面均開設一圓孔222，以供螺絲（圖未示）穿過。 所述扣合元件24分別抵壓於基座22之前後兩侧，其中 每一扣合元件24包括一與基座22受壓部220接觸之臂部240 及一自該臂部240—端向下延伸之支撐部242。所述臂部240 進一步包括一平行於基座22板體之抵壓部2402及自該抵壓 部2402前後兩側垂直向上形成之二折邊（圖未標）。所述 抵壓部2402呈矩形，其長度大於所述基座22受壓部220之長 度，從而當該抵壓部2402抵壓於基座22之受壓部220時，其 1328737 左右兩端將延伸超出基座22。所述抵壓部2402之左侧及中 - 部分別開設二穿孔2400、2408，其中左侧之穿孔2400與電 • 路板40之一螺孔44相對應，以供螺桿件26穿過而將扣合元 件24固定於電路板40上；中部之穿孔2408與基座22之一圓 孔222相對應’以供螺絲穿過該穿孔2408和該圓孔222 ’從 而將扣合元件24固定於基座22上。每一折邊之左端及中部 之高度相等’共同形成一矩形構造之延伸部（圖未標）； 鲁其右端之高度向外逐漸增大，形成一具有直角三角形構造 之結合部2404。所述每一結合部2404之末端延伸超出抵壓 部2402之右端’其開設一半圓形之缺口 2406，用於與電路 板40支架42之橫桿相卡合，以進一步將扣合元件24固定至 電路板40上。所述支撐部242自臂部240左侧穿孔2400之邊 緣垂直向下延伸而出，形成一中空之圓筒狀構造，供螺桿 件26穿設。所述支撐部242之高度與電路板40之支架42之高 度相等’由此’當臂部240之扣合部2404與電路板40支架42 •之橫桿相卡扣時，該支撐部242可抵靠於電路板40，進而支 撐該臂部240，使其不致發生傾斜。 所述散熱器1〇結合至基座22上，其包括複數相互間隔 之韓片12及複數穿設於該等鰭片12内之熱管14。所述鰭片 12均平行於基座22之板體，且相鄰鰭片12間通過折邊（圖 未標）卡扣相互連接。位於散熱器10底部之鰭片12通過焊 接固定於基座22上，此時所述熱管14之一部分收容於基座 22之凹槽内’以將基座22所吸收之熱量迅速地傳輸至所述 鰭片12上。 1328737 請一併參閱圖1至圖3,使用該扣合裝置組合20時，首 • 先’將已預焊有散熱器10之基座22放置於電路板40上，使 *_其凸塊224與電子元器件30相接觸，其二受壓部220則分別 位於電子元器件30之前後兩侧；然後，將二扣合元件24之 抵壓部2402分別置於基座22之二受壓部220上，使電路板40 支架42之橫桿卡入每一扣合元件24之缺口 2406内，且每一 扣合元件24之支撐部242抵靠於電路板40且對準電路板40 φ 中相應之螺孔44 ’此時每一扣合元件24之穿孔2408位於基 座22相應圓孔222之正上方。之後，將穿設有彈簧262之螺 桿件26穿過扣合元件24之穿孔2400和支撐部242，使其螺鎖 於電路板40之螺孔44内，從而將扣合元件24固定於電路板 40上’此時該彈簧262壓縮於螺桿件26之螺帽（圖未標）和 扣合元件24之臂部240之間，其彈性形變所產生之回彈力向 下按壓扣合元件24，使扣合元件24與基座22緊密貼合，進 而使基座22之凸塊224向下抵壓電子元器件3〇，由此實現凸 # 塊224與電子元器件30之緊密接觸；最後，將螺絲穿過扣合 元件24之穿孔2408而螺鎖於基座22之圓孔222内，從而將扣 合元件24固定至基座22上，以此實現對散熱器1()之水平限 位。 圖4至圖5示出了本發明之另一實施例，其與上述實施 例之主要區別在於：所述扣合元件64與基座60固結為一 體，以適應不同之需求。 請一併參閱圖1’所述基座60包括一矩形之板體62,其 中部開設有複數平行之凹槽620 ’以收容散熱器50之相應結 1328737 構；其前後兩側分別向上形成二扣合元件64。每一扣合元 • 件64包括一垂直於板體之侧壁（圖未標）及一自側壁頂部 . 垂直向外延伸之臂部（圖未標），其中該臂部之左侧向上 形成一扣合部640，其右側垂直向下形成一支撐部642。所 述扣合部640包括二相互平行之三角片（圖未標），其中每 一三角片均垂直於臂部，其一邊結合至臂部，另一邊則延 伸超出臂部之左端且開設有一半圓形之缺口（圖未標）。 I 一連接片（圖未標）連接該二三角片之末端，其具有一向 内凹陷且呈半圓形之凹部6400，以與電路板40支架42之橫 桿相扣合。一穿孔6420貫穿所述臂部及支撐部642，以供螺 桿件644穿設而將基座60固定於電路板40上。 所述散熱器50包括複數相互間隔之鰭片52及複數穿設 該等鰭片52之熱管54。相鄰鰭片52間通過折邊（圖未標） 扣合相連接，其中每一鰭片52均垂直於板體62。所述折邊 通過焊接結合至板體62上，從而將散熱器50固定至基座 • 60，此時熱管54之下部嵌入基座60之凹槽620内。一導熱板 70通過焊接結合至基座60之下部而將基座60夾置於導熱板 70和散熱器50之間，其下表面與電子元器件30接觸而吸收 其產生之熱量；其上表面與熱管54相接觸而將所吸收之熱 量傳輸至鰭片52。 使用該基座60時，首先，將已焊有散熱器50及導熱板 70之基座60放置於電子元器件30上，使導熱板70與電子元 器件30接觸，且基座60之扣合部640與電路板40支架42之橫 桿相卡合，此時基座60之支撐部642抵靠於電路板40且對準 11 1328737 電路板40相應之螺孔44 ;然後，再將螺桿件644穿過基座60 • 之穿孔6420而螺鎖於電路板40之螺孔44内，由此，完成了 ..組裝過程。 本發明扣合元件裝置20之基座22、60與散熱器10、50 相結合，可將散熱器10、50固定至扣合裝置組合20之基座 22、60上；再，二扣合元件24、64分別位於散熱器10、50 之兩侧而直接作用於基座22、60，無需與散熱器10、50相 I 配合即可將散熱器10、50固定至電子元器件30上。故無論 散熱器10、50之構造如何發生變化，都不會對二扣合元件 24、64造成影響，從而可實現散熱器10、50與電子元器件 30間之穩定接觸。 綜上所述，本發明確已符合發明專利之要件，遂依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施例， 自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝 之人士援依本發明之精神所作之等效修飾或變化，皆應涵 鲁蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本發明一實施例之扣合裝置組合之立體分解 圖，此時一散熱器及一電路板分別位於扣合裝置組合之上 方及下方。 圖2係圖1之部分組裝圖。 圖3係圖1之立體組裝圖。 圖4係本發明另一實施例之扣合裝置組合之立體分解 (S ) 12 1328737 圖，此時一散熱器及一導熱板分別位於扣合裝置組合之上 方及下方。 圖5係圖4之組裴圖。 【主要元件符號說明】1328737. IX. Description of the Invention: • Technical Field to Which the Invention A Field The present invention relates to a combination of a fastening device, and more particularly to a combination of a fastening device for fixing a thermal device to an electronic device. [Prior Art] High-power electronic components such as computer central processing units, north bridge chips, graphics cards, etc. generate a large amount of heat during operation. If such heat cannot be dissipated, it will directly cause a sharp rise in temperature, which will seriously affect To the normal operation of the electronic device. For this reason, a heat sink is required to dissipate the electronic components, and a snap-fit device is also required to fix the heat sink to the electronic components. Japanese Patent No. 01215323.0 discloses a heat sink assembly comprising a heat sink and a fastening component for securing the heat sink to the electronic component. The heat sink includes a base and a plurality of cylindrical fins extending upward from the base. The fastening component is integrally bent by a metal rod, and has a ring and two fastening legs respectively extending from opposite ends of the ring. When fixing the heat sink to the electronic component, the ring of the fastening component is simply passed through a certain fin of the heat sink, and then the two feet of the fastening component are buckled to the electronic component. The assembly process is completed on the board. ' However, since the ring of the fastening element needs to pass through the fin of the heat sink, the bunker b limits the heat sink. When the buckle is completed, the snap element will exert a lateral pressing force on the fin. . If the fins of the heat sink are thin, the pressure/37 • pressure will easily cause the H piece to deform, causing the ring of the snap ring to fall off the rotor, so that the snap-on piece cannot fix the heat sink. Thus, the contact between the heat sink and the electronic it device is extremely unstable and is greatly affected by the W shape. SUMMARY OF THE INVENTION In view of this, it is necessary to provide a combination of fastening devices that can stably fix a heat sink to an electronic component. A fastening device assembly for fixing a heat sink to an electronic S device mounted on a circuit board, wherein the circuit board is formed upwardly, the bracket comprises a base for the heat sink and two separate Fastening elements on both sides of the heat sink, each of the fastening elements comprising an arm and a #. a supporting portion extending downwardly from the end, the supporting portion is fixed to the circuit board to support the arm portion, and the other end of the material portion is engaged with the bracket of the circuit board to press the arm portion downward Pedestal. Compared with the prior art, the base of the fastening device combination of the present invention is combined with the heat sink to fix the heat sink to the base of the fastening device combination; and then, the two fastening components are respectively located on both sides of the heat sink. Directly acting on the pedestal, the heat sink can be attached to the electronic component without the need to cooperate with the heat sink. Therefore, no matter how the structure of the heat sink changes, it will not affect the two fastening components, so that stable contact between the heat sink and the electronic components can be achieved. [Embodiment] As shown in Fig. 1, the fastening device assembly 20 of the present invention is used to fix a heat sink 10 to an electronic component 30. The electronic component 30 is mounted to the middle of the 〆 1328737 circuit board 40. The circuit board 40 is adjacent to the position of the electronic component 30. Two screw holes 44 are provided for the corresponding structure of the fastening device assembly 20. The circuit has a bracket 42 extending upward from the right side of the board 40. The bracket 42 includes two support rods (not labeled) respectively formed at adjacent corners of the circuit board 40 and a cross bar (not labeled) connecting the two support rods, wherein each support rod is perpendicular to the circuit board 40. The crossbar is parallel to the circuit board 40 and has a circular cross-section for mating with the corresponding structure of the snap-fit assembly 20. 1 to 3 show an embodiment of the present invention: the fastening device assembly 20 includes a base 22 mounted on the electronic component 30, and two fastenings on the front and rear sides of the base 22, respectively. The component 24, and the second fastening component 24 are attached to the screw member 26 of the circuit board 40. The base 22 includes a rectangular plate (not shown). A plurality of grooves (not shown) are formed in the middle portion of the plate body to receive the corresponding structure of the heat sink 10; a bump 224 extends vertically downward from the lower surface thereof for contacting the electronic component 30 to The generated heat is transmitted to the pedestal 22; the front and the rear sides of the upper surface respectively extend vertically upwards and outwards to form a pressing portion 220 for receiving the fastening member 24, wherein the upper surface of each of the pressure receiving portions 220 is opened A circular hole 222 is provided for the screw (not shown) to pass through. The fastening elements 24 are respectively pressed against the front and rear sides of the base 22, wherein each of the fastening elements 24 includes an arm portion 240 that is in contact with the pressure receiving portion 220 of the base 22 and an end portion from the arm portion 240. The lower extending support portion 242. The arm portion 240 further includes a pressing portion 2402 parallel to the plate body of the base 22 and a two-folded edge (not labeled) formed vertically from the front and rear sides of the pressing portion 2402. The pressing portion 2402 has a rectangular shape and a length greater than a length of the pressure receiving portion 220 of the base 22, so that when the pressing portion 2402 is pressed against the pressure receiving portion 220 of the base 22, the left and right ends of the 1328737 will be Extending beyond the base 22. The left side and the middle part of the pressing portion 2402 are respectively provided with two through holes 2400 and 2408, wherein the left side hole 2400 corresponds to one of the screw holes 44 of the electric circuit board 40 for the screw member 26 to pass through. The fastening component 24 is fixed to the circuit board 40; the central through hole 2408 corresponds to a circular hole 222 of the base 22 for the screw to pass through the through hole 2408 and the circular hole 222' to fix the fastening component 24 to the base 22 on. The heights of the left and middle sides of each hem are equal to each other to form an extension of a rectangular structure (not shown); the height of the right end of the rib is gradually increased outward to form a joint 2404 having a right-angled triangular configuration. The end of each of the joint portions 2404 extends beyond the right end of the pressing portion 2402 to open a semicircular notch 2406 for engaging with the cross bar of the circuit board 40 bracket 42 to further fix the fastening component 24 To the circuit board 40. The support portion 242 extends vertically downward from the edge of the left side opening 2400 of the arm portion 240 to form a hollow cylindrical structure for the screw member 26 to pass through. The height of the support portion 242 is equal to the height of the bracket 42 of the circuit board 40. Thus, when the fastening portion 2404 of the arm portion 240 is engaged with the crossbar of the circuit board 40 bracket 42, the support portion 242 can be The arm portion 240 is supported against the circuit board 40 so as not to be tilted. The heat sink 1 is coupled to the base 22 and includes a plurality of Korean sheets 12 spaced apart from each other and a plurality of heat pipes 14 disposed in the fins 12. The fins 12 are all parallel to the plate body of the susceptor 22, and the adjacent fins 12 are connected to each other by a hem (not shown). The fins 12 located at the bottom of the heat sink 10 are fixed to the base 22 by soldering. At this time, one of the heat pipes 14 is partially received in the recesses of the base 22 to rapidly transfer the heat absorbed by the base 22 to the ground. On the fins 12. 1328737 Please refer to FIG. 1 to FIG. 3 together, when using the fastening device combination 20, the first base 22 is pre-welded with the heat sink 10 on the circuit board 40, so that *_the bump 224 In contact with the electronic component 30, the two pressure receiving portions 220 are respectively located on the front and rear sides of the electronic component 30; then, the pressing portions 2402 of the two fastening components 24 are respectively placed in the two pressure receiving portions of the base 22 220, the crossbar of the circuit board 40 bracket 42 is inserted into the notch 2406 of each fastening component 24, and the support portion 242 of each fastening component 24 abuts against the circuit board 40 and aligns with the circuit board 40 φ Corresponding screw holes 44' at this time the perforations 2408 of each of the fastening elements 24 are located directly above the corresponding circular holes 222 of the base 22. Thereafter, the screw member 26 wearing the spring 262 is passed through the through hole 2400 of the fastening member 24 and the support portion 242 to be screwed into the screw hole 44 of the circuit board 40, thereby fixing the fastening member 24 to the circuit board. At this time, the spring 262 is compressed between the nut of the screw member 26 (not shown) and the arm portion 240 of the fastening member 24, and the elastic force generated by the elastic deformation thereof presses the fastening member 24 downward. The fastening component 24 is in close contact with the base 22, so that the protrusion 224 of the base 22 presses down the electronic component 3 〇, thereby achieving the close contact between the convex block 224 and the electronic component 30. Finally, The screw is threaded into the circular hole 222 of the base 22 through the through hole 2408 of the fastening member 24 to secure the fastening member 24 to the base 22, thereby achieving horizontal restriction of the heat sink 1(). 4 to 5 show another embodiment of the present invention, which differs from the above embodiment in that the fastening member 64 and the base 60 are integrally fixed to suit different needs. Referring to FIG. 1 ' together, the base 60 includes a rectangular plate body 62, and a plurality of parallel grooves 620' are formed in the middle portion thereof to receive the corresponding nodes 1328737 of the heat sink 50; Fastening element 64. Each of the fastening members 64 includes a side wall (not shown) perpendicular to the side of the panel and an upper arm extending from the side of the side wall (not shown), wherein the left side of the arm portion is formed upward. A fastening portion 640 has a support portion 642 formed vertically downward on the right side thereof. The fastening portion 640 includes two mutually parallel triangular pieces (not labeled), wherein each of the triangular pieces is perpendicular to the arm portion, one side of which is coupled to the arm portion, and the other side extends beyond the left end of the arm portion and is opened halfway. Round notch (not shown). A connecting piece (not shown) is attached to the end of the two triangular piece, and has an inwardly recessed and semi-circular recess 6400 for engaging with the crossbar of the circuit board 40 bracket 42. A through hole 6420 extends through the arm portion and the support portion 642 for the screw member 644 to pass through to fix the base 60 to the circuit board 40. The heat sink 50 includes a plurality of fins 52 spaced apart from each other and a plurality of heat pipes 54 through which the fins 52 are disposed. Adjacent fins 52 are connected by a hem (not shown), wherein each fin 52 is perpendicular to the plate 62. The flange is joined to the plate 62 by welding to secure the heat sink 50 to the base 60, at which point the lower portion of the heat pipe 54 is embedded in the recess 620 of the base 60. A heat conducting plate 70 is bonded to the lower portion of the base 60 by welding to sandwich the base 60 between the heat conducting plate 70 and the heat sink 50, and the lower surface thereof is in contact with the electronic component 30 to absorb the heat generated therefrom; Contact with the heat pipe 54 transfers the absorbed heat to the fins 52. When the susceptor 60 is used, first, the susceptor 60 to which the heat sink 50 and the heat transfer plate 70 are soldered is placed on the electronic component 30, the heat conductive plate 70 is in contact with the electronic component 30, and the susceptor 60 is fastened. The portion 640 is engaged with the cross bar of the circuit board 40 bracket 42. At this time, the support portion 642 of the base 60 abuts against the circuit board 40 and is aligned with the corresponding screw hole 44 of the circuit board 40 of the 1 1328737 circuit; The 644 is threaded into the screw hole 44 of the circuit board 40 through the through hole 6420 of the base 60, thereby completing the assembly process. The bases 22, 60 of the fastening component device 20 of the present invention are combined with the heat sinks 10, 50 to secure the heat sinks 10, 50 to the bases 22, 60 of the fastening device assembly 20; 24 and 64 are respectively located on both sides of the heat sinks 10 and 50 and directly act on the pedestals 22 and 60, and the heat sinks 10 and 50 can be fixed to the electronic components 30 without being matched with the heat sinks 10 and 50. Therefore, no matter how the structure of the heat sinks 10, 50 changes, the two fastening elements 24, 64 are not affected, so that stable contact between the heat sinks 10, 50 and the electronic components 30 can be achieved. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application in this case. Equivalent modifications or variations made by those skilled in the art in light of the spirit of the present invention are intended to be within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view of a combination of a fastening device according to an embodiment of the present invention, in which a heat sink and a circuit board are respectively located above and below the combination of the fastening device. Figure 2 is a partial assembled view of Figure 1. Figure 3 is a perspective assembled view of Figure 1. 4 is a perspective exploded view of a combination of a fastening device according to another embodiment of the present invention (S) 12 1328737, in which a heat sink and a heat conducting plate are respectively located above and below the combination of the fastening device. Figure 5 is a group diagram of Figure 4. [Main component symbol description]
散熱器 10、50 縛片 12 ' 52 熱管 14、54 扣合裝置組合 20 基座 22、60 受壓部 220 圓孔 222 凸塊 224 扣合元件 24、64 臂部 240 穿孔 2400、2408、 6420抵壓部 2402 結合部 2404 、 640 缺口 2406 支撐部 242 > 642 螺桿件 26 、 644 彈簧 262 電子元器件 30 電路板 40 支架 42 螺孔 44 板體 62 凹槽 620 凹部 6400 導熱板 70 13Heatsink 10, 50 Baffle 12' 52 Heat pipe 14, 54 Knitting device combination 20 Base 22, 60 Pressure receiving portion 220 Round hole 222 Bump 224 Fastening element 24, 64 Arm portion 240 Perforation 2400, 2408, 6420 Pressing portion 2402 Bonding portion 2404, 640 Notch 2406 Supporting portion 242 > 642 Screw member 26, 644 Spring 262 Electronic component 30 Circuit board 40 Bracket 42 Screw hole 44 Plate 62 Groove 620 Concave portion 6400 Heat conducting plate 70 13