1300329 九、發明說明： 【發明所屬之技術領域】 尤其係一種用以對電子元 本發明涉及一種散熱裝置 件散熱之散熱裝置。 【先前技術】 電腦性能之提升使得記憶體、顯示卡等附加板卡上曰 片容量日益增加’體積越來越小，工作速度越來越塊，-此過程產生之熱量不斷增加，如何快速將這些附加板卡上 之晶片熱量快速有效散發，亦成為目前業者需解決之問題。 通常業界在電子元件上安裝散熱元件輔助其散熱 使散熱元件與發熱元件接觸緊密牢固，需借助一扣具實現 散熱元件與該發熱元件之穩固連接。 然而，由於附加板卡上元件密布，空間小且相鄰板卡 間距乍，在其上直接安裝散熱元件時，極易與其相鄰板卡 產生干涉，操作不便。 【發明内容】 有鑒於此，有必要提供一種便於安裝之散熱裝置。 -一種散熱裝置用以對一板卡散熱，該散熱裝置包括覆 蓋“板卡兩侧之第一、一散熱板及固定該板卡和散熱板之 固定元件，該固定元件包括位於該第一、二散熱板兩側之 二扣片，一扣件穿過該二扣片、第一、二散熱板及板卡而 將該第一、二散熱板及板卡夾置於該二扣片之間。 與習知技術相比較，上述第一、二散熱板覆蓋於板卡 1300329 兩側’散熱面積大，佔用空間小。二扣片通過扣件夾扣第 /一、二散熱板和板卡，扣合穩固，便於安裝。 --【實施方式】 請參閱圖1至圖3，本發明散熱裝置包括設於一板卡10 • 兩側之第一、二散熱板20、30及將該第一、二散熱板20、 ,30固定至板卡1〇之第一扣具和一對第二扣具60。該第一扣 具包括位於第一、二散熱板20、30兩侧之二扣片40。 該板卡10為一電路板110，該電路板110相對二側面上 具有若干電子元件120。該電路板110之中央設一通孔111， 板體兩側緣之靠上部各設有一缺口 113。 第一、二散熱板20、30均由導熱材料如金屬板材製成。 第〆、二散熱板20、30之中部對應電路板11〇之通孔111分 別設有一穿孔211、311。第一、二散熱板20、30之近上、 下端緣之中部形成有凸向電路板110之固定部213、313，該 固定部213、313均設有一供銷釘321穿過之固定孔（圖未 •示）。該第一、二散熱板20、3·0之近兩侧端處均向外凸出 二“U”形擋邊215、315，該擋邊215、315分別在該第一、 二散熱板20、30上圍繞形成一扣接部217、317，該扣接部 217、 317上分別設有一凹點（未標示）。該第一、二散熱 板20、30之上端緣對應該扣接部217、317處開設有切口 218、 318。該第一散熱板20之兩側端對應電路板110之缺口 113處向第二散熱板30方向突伸出二肋條219,每一肋條219 近末端處上下對稱凸伸有二突翼（未標示）。第二散熱板 7 1300329 30兩側端緣處對應該二肋條219設有二凹口 319。 為實現上述第一、二散熱板20、30與電路板110上之電 -子元件120之間更好之熱傳導，該第一、二散熱板20、30與 電路板110之電子元件120之間夾置有導熱性良好之導熱膠 墊130，該導熱膠墊130可以係一整塊，亦可以根據需要分 成若干塊。 上述電路板110背面中央之電子元件120高出其他電子 元件120，第二散熱板30之中央向外凸出，從而形成對應該 電子元件120凹陷之收容部320。上述穿孔311設於該收容部 320之中心處。該第二散熱板30於該收容部320之相對兩側 向外突出二凸塊330。 每一扣片40由一片形板材如金屬片一體彎折成型，其 包括一定位部410、從該定位部410兩側相對延伸之二弧形 延伸部430及從該二延伸部430末端進一步延伸之二抵壓部 450。該定位部410之設有一中心孔411。 每一第二扣具60大致呈倒“U”形，其包括一主體部 610及從該主體部610相對兩側向下延伸之二平行扣合部 630。每一扣合部630之近末端處向内凸伸一凸點（未標 示），以與第一、二散熱板20、30扣接部217、317之凹點 卡合。 組裝時，上述第一散熱板20之肋條219穿過電路板110 之缺口 113及第二散熱板30之凹口 319，該肋條219之末端變 形向電路板110方向抵壓上述第二散熱板30,該肋條219之 8 1300329 突翼向第一散熱板20方向抵壓該電路板110。該第一、二散 /熱板20、30、導熱膠墊130和電路板110通過銷釘321穿過該 -第一、二散熱板20、30之固定部213、313及電路板110而相 對固定。上述二扣片40夾置該第一、二散熱板20、30於其 間，一柱形扣件50之中部穿過該二扣片40定位部410之中心 孔411、第一、二散熱板之穿孔211、311及電路板110之通 孔111，該柱形扣件50之兩端各設一擴大的頭部510，該二 頭部510抵擋於該二扣片40之外側，該二扣片40之抵壓部 > 450向電路板110方向抵壓該第一、二散熱板20、30。位於 第二散熱板30—側之扣片40之抵壓部450通過螺釘（未標示） 固定至第二散熱板之凸塊330上。該二第二扣具60夾扣於該 第一、二散熱板20、30之近兩端處。每一第二扣具60之主 體部610跨置於該第一、二散熱板20、30上端緣之切口 218、 318處，二扣合部630通過其上之凸點（未標示）與扣接部 217、317凹點卡合而定位於扣接部217、317，且向電路板 > 110方向抵壓該第一、二散熱板20、30。從而，該第一、二 散熱板20、30、導熱膠墊130和電子元件120緊密貼合。該 電子元件120工作時產生之熱量傳遞至該第一、二散熱板 20、30而散發出去。 上述第一、二散熱板20、30為板形而覆蓋於電子元件 120上，散熱面積大，且佔用空間小。二扣片40通過扣件50 彈性夾扣第一、二散熱板20、30和板卡10，扣合穩固，便 於安裝。 綜上所述，本發明符合發明專利要.件，爰依法提出專 9 1300329 . n 淮以上該者僅為本發明之較佳實施例，舉凡熟 ^悉本案技藝之人士，在爰依本發明精神所作之等效修飾或 變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明散熱裝置及相關元件之立體分解圖。 圖2係圖1之立體組合圖。 圖3係圖2另一角度之視圖。 【主要元件符號說明】 板卡 10 電路板 110 通孔 111 缺口 113 電子元件 120 導熱膠墊 130 第一散熱板 20 穿孔 211 、 311 固定部 213 、 313 擋邊 215 、 315 扣接部 217 、 317 切口 218 、 318 肋條 219 弟一散熱板 30 ra 口 319 銷釘 321 收容部 320 凸塊 330 扣片 40 定位部 410 中心孔 411 延伸部 430 抵壓部 450 扣件 50 頭部 510 第二扣具 60 主體部 610 扣合部 6301300329 IX. Description of the invention: [Technical field to which the invention pertains] In particular, a heat sink for dissipating heat from a heat dissipating device is disclosed. [Prior Art] The improvement of computer performance has led to an increase in the capacity of sputum on additional boards such as memory and display cards. 'The volume is getting smaller and smaller, and the working speed is getting more and more blocks. The heat generated in this process is increasing, how to quickly The heat dissipation of the wafers on these additional boards is quickly and effectively distributed, which has become a problem that the current industry needs to solve. Generally, the industry installs a heat dissipating component on an electronic component to assist in heat dissipation. The heat dissipating component is in close contact with the heat generating component, and a fastener is required to securely connect the heat dissipating component to the heat generating component. However, since the components on the additional board are densely packed, the space is small, and the spacing between adjacent boards is small, when the heat dissipating component is directly mounted thereon, it is easy to interfere with the adjacent board, and the operation is inconvenient. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat sink that is easy to install. a heat dissipating device for dissipating heat to a card, the heat dissipating device comprising a first component, a heat dissipating plate and a fixing component for fixing the card and the heat dissipating plate on both sides of the card, the fixing component comprising the first component, Two fastening pieces on both sides of the two heat dissipation plates, wherein the first and second heat dissipation plates and the card holder are placed between the two fastening pieces through the two fastening pieces, the first and second heat dissipation plates and the card Compared with the prior art, the first and second heat dissipation plates cover the two sides of the card 1300329, and the heat dissipation area is large, and the occupied space is small. The two fastening pieces clamp the first/second heat dissipation plate and the board through the fasteners. The fastening is stable and easy to install. -- [Embodiment] Referring to FIG. 1 to FIG. 3 , the heat dissipation device of the present invention comprises first and second heat dissipation plates 20 , 30 disposed on one side of the board 10 • The two heat dissipation plates 20, 30 are fixed to the first buckle of the card 1 and the pair of second buckles 60. The first buckle includes two buckles on both sides of the first and second heat dissipation plates 20, 30. 40. The card 10 is a circuit board 110 having a plurality of electronic components 120 on opposite sides. The circuit board 1 A through hole 111 is defined in the center of the 10, and a notch 113 is formed on the upper side of the two sides of the plate body. The first and second heat dissipation plates 20, 30 are all made of a heat conductive material such as a metal plate. The second and second heat dissipation plates 20, 30 The through holes 111 corresponding to the circuit board 11 are respectively provided with a through hole 211, 311. The upper and lower end edges of the first and second heat dissipation plates 20 and 30 are formed with fixing portions 213 and 313 protruding toward the circuit board 110. The fixing portions 213 and 313 are respectively provided with a fixing hole through which the pin 321 passes (not shown). The first and second heat dissipating plates 20 and 3·0 are outwardly protruded from the two sides. The ribs 215 and 315 are respectively formed on the first and second heat dissipation plates 20 and 30 to form a fastening portion 217 and 317, and the fastening portions 217 and 317 are respectively provided with a concave point. (not shown). The upper end edges of the first and second heat dissipation plates 20 and 30 are provided with cutouts 218 and 318 corresponding to the fastening portions 217 and 317. The two ends of the first heat dissipation plate 20 correspond to the gap of the circuit board 110. Two ribs 219 are protruded toward the second heat dissipation plate 30 at the position of the second heat dissipation plate 30, and two ribs are protruded from the upper end of each rib 219. The second heat dissipation plate 7 1300329 30 is provided with two notches 319 corresponding to the two ribs 219 at both end edges. To realize the first and second heat dissipation plates 20, 30 and the electro-sub-element 120 on the circuit board 110 For better heat conduction, a thermal conductive pad 130 with good thermal conductivity is interposed between the first and second heat dissipation plates 20 and 30 and the electronic component 120 of the circuit board 110. The thermal pad 130 can be a whole piece. The electronic component 120 at the center of the back surface of the circuit board 110 is higher than the other electronic components 120, and the center of the second heat dissipation plate 30 is convex outward to form a receiving portion 320 corresponding to the recess of the electronic component 120. The through hole 311 is disposed at the center of the receiving portion 320. The second heat dissipation plate 30 protrudes outward from the two sides of the receiving portion 320 by two protrusions 330. Each of the cleats 40 is integrally formed by bending a sheet of material such as a metal sheet, and includes a positioning portion 410, two arcuate extending portions 430 extending from opposite sides of the positioning portion 410, and further extending from the ends of the two extending portions 430. The second pressing portion 450. The positioning portion 410 is provided with a center hole 411. Each of the second clips 60 has a substantially inverted U shape and includes a main body portion 610 and two parallel engaging portions 630 extending downward from opposite sides of the main body portion 610. A bump (not shown) protrudes inwardly from the proximal end of each of the fastening portions 630 to engage with the recesses of the first and second heat dissipation plates 20, 30 fastening portions 217, 317. When assembled, the rib 219 of the first heat dissipation plate 20 passes through the notch 113 of the circuit board 110 and the notch 319 of the second heat dissipation plate 30, and the end of the rib 219 deforms to press the second heat dissipation plate 30 toward the circuit board 110. The ribs 219 of the 1300329 tabs press the circuit board 110 in the direction of the first heat sink 20. The first and second heat dissipation/heat plates 20 and 30, the thermal conductive pad 130 and the circuit board 110 are relatively fixed by the pins 321 passing through the fixing portions 213 and 313 of the first and second heat dissipation plates 20 and 30 and the circuit board 110. . The two fastening pieces 40 are disposed between the first and second heat dissipation plates 20 and 30. The middle of a cylindrical fastener 50 passes through the central hole 411 of the positioning portion 410 of the two fastening pieces 40, and the first and second heat dissipation plates are disposed. The through holes 211, 311 and the through holes 111 of the circuit board 110, the two ends of the cylindrical fasteners 50 are respectively provided with an enlarged head 510, and the two heads 510 are opposite to the outer sides of the two fastening pieces 40. The pressing portion 40 of 40 presses the first and second heat radiating plates 20 and 30 in the direction of the circuit board 110. The pressing portion 450 of the cleat 40 on the side of the second heat radiating plate 30 is fixed to the bump 330 of the second heat radiating plate by a screw (not shown). The two second fasteners 60 are clamped at the proximal ends of the first and second heat dissipation plates 20 and 30. The main body portion 610 of each of the second fastening members 60 is disposed at the slits 218 and 318 of the upper end edges of the first and second heat dissipation plates 20 and 30, and the two fastening portions 630 are protruded (not labeled) and buckled thereon. The joint portions 217 and 317 are recessed and positioned in the fastening portions 217 and 317, and the first and second heat dissipation plates 20 and 30 are pressed in the direction of the circuit board > Thereby, the first and second heat dissipation plates 20, 30, the thermal pad 130 and the electronic component 120 are closely attached. The heat generated by the operation of the electronic component 120 is transmitted to the first and second heat dissipation plates 20, 30 to be emitted. The first and second heat dissipation plates 20 and 30 are in the shape of a plate and cover the electronic component 120, and have a large heat dissipation area and a small occupied space. The two fastening pieces 40 elastically clamp the first and second heat dissipation plates 20 and 30 and the card 10 through the fastener 50, and the fastening is stable and convenient for installation. In summary, the present invention is in accordance with the invention patents, and is proposed in accordance with the law. The above is only a preferred embodiment of the present invention, and those skilled in the art are skilled in the art. Equivalent modifications or variations of the spirit should be covered by the following patents. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded perspective view of a heat sink and related components of the present invention. 2 is a perspective assembled view of FIG. 1. Figure 3 is a view of another angle of Figure 2. [Major component symbol description] Board 10 Circuit board 110 Through hole 111 Notch 113 Electronic component 120 Thermal pad 130 First heat sink 20 Perforation 211, 311 Fixing part 213, 313 Flange 215, 315 Fastening part 217, 317 Incision 218, 318 ribs 219 brothers heat sink 30 ra 319 pins 321 accommodating portion 320 bumps 330 clasps 40 locating portions 410 central holes 411 extensions 430 abutments 450 fasteners 50 heads 510 second clips 60 main body 610 fastening part 630