TWI352568B - Resilient clip and thermal module using the same - Google Patents
Resilient clip and thermal module using the same Download PDFInfo
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- TWI352568B TWI352568B TW96130490A TW96130490A TWI352568B TW I352568 B TWI352568 B TW I352568B TW 96130490 A TW96130490 A TW 96130490A TW 96130490 A TW96130490 A TW 96130490A TW I352568 B TWI352568 B TW I352568B
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- heat
- plate
- pressing
- pressing portion
- fixing
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- 238000003825 pressing Methods 0.000 claims description 44
- 230000017525 heat dissipation Effects 0.000 claims description 21
- 238000001704 evaporation Methods 0.000 claims description 17
- 230000008020 evaporation Effects 0.000 claims description 15
- 230000005494 condensation Effects 0.000 claims description 6
- 238000009833 condensation Methods 0.000 claims description 6
- 230000005489 elastic deformation Effects 0.000 claims description 3
- 238000010521 absorption reaction Methods 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- 238000005452 bending Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
100年05月30日修正番換頁 135.2568 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種固定元件，尤係關於一種固定彈片及使 用該固定彈片之散熱模組。 【先前技術】The invention relates to a fixing component, and more particularly to a fixing elastic piece and a heat dissipation module using the same. [Prior Art]
[0002] 在散熱領域内，散熱模組常被用於筆記本電腦内，對其 内部之發熱元件散熱。散熱模組通常包括一離心風扇， 設於離心風扇出風口處之散熱器及在散熱器與發熱元件 間傳遞熱量之一根熱管。 [0003] 具體使用時，為保證熱管與發熱元件間具良好之傳熱效 果，需要藉由一扣具將熱管固定至發熱元件上，使熱管 之蒸發段與發·熱元件緊密接觸，如中國大陸專利申請公 開第1 6231 32號中所示之扣具。該扣具之結構較為複雜， 其製造成本相對較高，不利於該扣具之大量生產和使用 【發明内容】 [0004] 有鑒於此，有必要提供一種成本較低之固定彈片及使用 該固定彈片之散熱模組。 [0005] 一種固定彈片，包括一可產生彈性變形之按壓部以及分 別位於按壓部兩端之一平板部和一抵靠部，該按壓部具 有一抵壓面及由抵壓面兩側傾斜向上延伸之兩個翼片， 該平板部上設有固定孔，該抵靠部可與其他元件相抵靠 [0006] 一種散熱模組，用於對一發熱電子元件散熱，包括散熱 096130490 表單編號A0101 第3頁/共18頁 1003191777-0 1352568 100年05月.3ϋ日’核正替换頁 器、連接發熱電子元件與散熱器之熱管以及用於將熱管 固定至發熱電子元件上之固定彈片，所述固定彈片包括 —可產生彈性變形之按壓部以及分別位於按壓部兩端之 —平板部和一抵靠部，該按壓部具有一抵壓面及由抵壓 面兩側傾斜向上延伸之兩個翼片’該平板部上設有固定 孔’該抵靠部可與其他元件相抵靠。 [0007] [0008] 該固定彈片由一金屬片連續彎折形成，使該固定彈片具 有較低之原料成本及加工成本，並且該固定彈片之組裝 過程較為方便，使該固定彈片更適宜於大規模生產。 【實施方式】 如圖1及圖2所示，該散熱模組包括一離心風扇1〇、一散 熱器20、二熱管30、40、一板體50、一吸熱塊6〇、一吸 熱板70及一固定彈片80。[0002] In the field of heat dissipation, a heat dissipation module is often used in a notebook computer to dissipate heat from its internal heating elements. The heat dissipation module usually includes a centrifugal fan, a heat sink disposed at the air outlet of the centrifugal fan, and a heat pipe that transfers heat between the heat sink and the heat generating component. [0003] In the specific use, in order to ensure a good heat transfer between the heat pipe and the heat generating component, the heat pipe needs to be fixed to the heat generating component by a buckle, so that the evaporation section of the heat pipe is in close contact with the heat generating component, such as China. The fastener shown in Continental Patent Application No. 1 621231. The structure of the buckle is relatively complicated, and the manufacturing cost thereof is relatively high, which is disadvantageous for mass production and use of the buckle. [0004] In view of the above, it is necessary to provide a fixed cost elastic piece and use the same. The thermal module of the shrapnel. [0005] A fixing elastic piece includes a pressing portion capable of elastic deformation and a flat plate portion and an abutting portion respectively located at two ends of the pressing portion, the pressing portion having a pressing surface and inclined upward from both sides of the pressing surface Extending the two fins, the flat portion is provided with a fixing hole, and the abutting portion can abut against other components. [0006] A heat dissipating module for dissipating heat from a heat-generating electronic component, including heat dissipation 096130490 Form No. A0101 3 pages/total 18 pages 1003191777-0 1352568 100 May. 3rd day 'nuclear replacement pager, heat pipe connecting the heating electronic component and the heat sink, and fixing elastic piece for fixing the heat pipe to the heat generating electronic component, The fixed elastic piece includes a pressing portion capable of elastic deformation and a flat plate portion and an abutting portion respectively located at both ends of the pressing portion, the pressing portion having an abutting surface and two wings extending obliquely upward from both sides of the pressing surface The sheet 'the flat portion is provided with a fixing hole' which can abut against other components. [0008] [0008] The fixing elastic piece is formed by continuously bending a metal piece, so that the fixed elastic piece has lower material cost and processing cost, and the assembly process of the fixed elastic piece is convenient, so that the fixed elastic piece is more suitable for large Scale production. [Embodiment] As shown in FIG. 1 and FIG. 2 , the heat dissipation module includes a centrifugal fan 1 , a heat sink 20 , two heat pipes 30 , 40 , a plate body 50 , a heat absorption block 6 , and a heat absorption plate 70 . And a fixed elastic piece 80.
[0009] 該散熱器20設於離心風扇10之出風口 11處，包括複數堆 疊在一起之散熱韓片21。該二熱管30、40之冷凝段32、 42與散熱器20之下表面相貼合。熱管30大致呈l形，其蒸 發段34延伸至吸熱塊60處，藉由吸熱塊60由cpu(圖未示 )處吸收熱量’並將熱量傳遞至散熱器2〇處。熱管大致 呈直線形，其蒸發段44相對於冷凝段42稍微向下彎折， 该熱管40之蒸發段44延伸至吸熱板70處，藉由吸熱板7〇 由VGA(圖未示）晶片處吸收熱量。The heat sink 20 is disposed at the air outlet 11 of the centrifugal fan 10 and includes a plurality of heat sinks 21 stacked together. The condensation sections 32, 42 of the two heat pipes 30, 40 are in contact with the lower surface of the heat sink 20. The heat pipe 30 is substantially l-shaped, and the evaporation section 34 extends to the heat absorbing block 60. The heat absorbing block 60 absorbs heat from the cpu (not shown) and transfers the heat to the heat sink 2〇. The heat pipe is substantially linear, and the evaporation section 44 is slightly bent downward with respect to the condensation section 42. The evaporation section 44 of the heat pipe 40 extends to the heat absorption plate 70, and is passed by the VGA (not shown) wafer by the heat absorption plate 7 Absorb heat.
[0010] 096130490 板體50為一大致呈長方體之壓鑄件，其邊緣處向下延伸 有三個固定腳51，用於將該板體50固定至一電路板（圖未 示）上。所述固定腳51之高度大於板體50之厚度，使該板 體50組裝至電路板上時’板體5〇之下表面與電路板之上 表單編號A0101 第4頁/共18頁 1003191777-0 135.2568 -：- 100年05月30日修正替換頁 表面間形成一間隙。 [0011] 該板體50於其中部之位置設有複數散熱柱52，該等散熱 柱52之下方與北橋晶片（圖未示）熱連接。該板體50由北 橋晶片處吸收熱量，並藉由板體50自身及該等散熱柱52 將熱量散發出去。 [0012] 該板體50之一端設有一方形收容孔53，該收容孔53由四 個側邊53a、53b、53c、53d圍設形成，其中與板體50之 寬度方向相對應之兩個側邊53a、53c上分別設有一個與 φ 該收容孔53相連通之凹槽53e、52f。吸熱板70設於板體 50之收容孔53内。[0010] The 096130490 plate body 50 is a substantially rectangular parallelepiped die casting having three fixing legs 51 extending downwardly at the edges for fixing the plate body 50 to a circuit board (not shown). The height of the fixing leg 51 is greater than the thickness of the plate body 50, so that when the board body 50 is assembled to the circuit board, the lower surface of the board body 5〇 and the circuit board are shown on the form No. A0101, page 4/18 pages 1003191777- 0 135.2568 -:- On May 30, 100, a gap was formed between the surfaces of the replacement page. [0011] The plate body 50 is provided with a plurality of heat dissipation columns 52 at a position of the middle portion thereof, and the heat dissipation columns 52 are thermally connected to the north bridge wafer (not shown). The plate body 50 absorbs heat from the north bridge wafer and dissipates heat by the plate body 50 itself and the heat dissipation columns 52. [0012] One end of the plate body 50 is provided with a square receiving hole 53 formed by four side edges 53a, 53b, 53c, 53d, wherein the two sides corresponding to the width direction of the plate body 50 are formed. The sides 53a, 53c are respectively provided with a recess 53e, 52f communicating with the accommodating hole 53. The heat absorbing plate 70 is disposed in the receiving hole 53 of the board body 50.
[0013] 該吸熱板70由一矩形銅片彎折形成，由其側面看該吸熱 板70板大致呈“匚”形，其包括相互平行之上板71、下 板72及連接該上板71與下板72之一側板73。該上板71與 下板72間形成一收容空間74，熱管40之蒸發段44收容於 該收容空間74内，且該熱管40之自由端45及一彎折段46 分別收容於側邊53a、53c上開設之凹槽53e、52f内。該 吸熱板70下方與VGA晶片熱連接，以使熱管40之蒸發段 44藉由該吸熱板70由VGA晶片處吸收熱量，並將熱量傳遞 至散熱器20處。 [0014] 該板體50於收容孔53之靠近散熱柱52之側邊53d上開設 一固定孔54，固定彈片80之一端對應該固定孔54設有一 通孔81。該固定彈片80之該端藉由依次穿設於該通孔81 及固定孔54之螺釘、鉚釘等固定元件90固定至該板體50 V 〇 096130490 表單編號A0101 .第5頁/共18頁 1003191777-0 1352568 100年05月30日按正;穿換頁 [0015] 請參閱圖3及圖4，該固定彈片80由一金屬片連續彎折形 成’包括位於其中部之按壓部82，由按壓部82兩側水準 向外延伸形成之第一平板部83、第二平板部84，及由第 一平板部84之向外延伸之抵靠部85。通孔81設於固定彈 片80之第一平板部83上。[0013] The heat absorbing plate 70 is formed by bending a rectangular copper plate, and the heat absorbing plate 70 is substantially "匚" shaped as viewed from the side thereof, and includes a parallel plate 71, a lower plate 72 and a connecting plate 71. One side plate 73 with one of the lower plates 72. A receiving space 74 is formed between the upper plate 71 and the lower plate 72. The evaporating section 44 of the heat pipe 40 is received in the receiving space 74, and the free end 45 and the bending section 46 of the heat pipe 40 are respectively received on the side 53a. The grooves 53e and 52f are opened in the 53c. The heat absorbing plate 70 is thermally connected to the VGA chip under the heat absorbing plate 70 so that the evaporation portion 44 of the heat pipe 40 absorbs heat from the VGA wafer by the heat absorbing plate 70 and transfers the heat to the heat sink 20. A fixing hole 54 is defined in the side wall 53d of the receiving hole 53 near the heat dissipating post 52. One end of the fixing elastic piece 80 is provided with a through hole 81 corresponding to the fixing hole 54. The end of the fixing elastic piece 80 is fixed to the plate body by a fixing member 90 such as a screw or a rivet which is sequentially inserted through the through hole 81 and the fixing hole 54, and the form number A0101. Page 5 of 18 pages 1003191777 -0 1352568 On May 30th, 100th, according to the positive; wear page [0015] Please refer to FIG. 3 and FIG. 4, the fixed elastic piece 80 is continuously bent by a metal piece to form 'including the pressing portion 82 located at the middle portion thereof, by the pressing portion The first flat plate portion 83, the second flat plate portion 84, and the abutting portion 85 extending outward from the first flat plate portion 84 are formed on the two sides. The through hole 81 is provided in the first flat plate portion 83 of the fixed elastic piece 80.
[0016]固定彈片80之按壓部82大致呈Μ形，其具有一抵壓面82a 及由抵壓面82a兩侧逐漸向上傾斜延伸之兩個翼片82b， 該兩個翼片82b之端部分別向下傾斜延伸，形成連接該按 壓部82之翼片82b與第一、第二平板部83、84之兩個連 接片82c。該按壓部82之抵壓面82a向下略微凸出於第一 、第二平板部83、84之下表面，使第一、第二平板部83 、84與吸熱板70之上表面相貼合時，按壓部82之翼片 82b可發生彈性變形向下壓緊吸熱板7〇。本實施例中，這 兩個連接片82c傾斜延伸，可以理解地，這兩個連接片 82c亦可沿垂直於第一、第二平板部83、84之方向即沿豎 直方向延伸。 [00Π]該固定彈片80之抵靠部85大致呈L形，包括由第二平板部 84向下垂直延伸之下延部85a，及由該下延部85a向外水 平延伸之一靠片85b。該下延部85a之高度需進行合理之 設計，使該靠片85b抵靠於吸熱板70之下表面時，第二平 板部84剛好與吸熱板70之上表面相貼合。 [0018] 組裝時’將該板體5〇固定至電路板上，使北橋晶片與板 體50之中部相接觸，VGA晶片位於收容孔53下方，並使收 容孔53之側邊53b之下表面與電路板之上表面間形成所述 間隙；接下來’將固定彈片80之抵靠部85置於板體50之 096130490 表單編號A0101 第6頁/共18頁 1003191777-0 100年05月30日修正替換頁j 收容孔53内靠近側邊53b之位置，並使第二平板部84基本 上垂直板體50之上表面；下一步，將熱管40之蒸發段44 置於吸熱板70之收容空間74内，並將吸熱板70與熱管40 之蒸發段44置於板體50之收容孔53内；翻轉固定彈片80 ’使抵靠部85之靠片85b之上表面與收容孔53之側邊53b 之下表面相抵靠，同時使按壓部82之抵壓面82a及第一、 第二平板部83、84之下表面與吸熱板70之上表面相貼合 ’並使第一平板部83之通孔81對準板體50之固定孔54 ; 接下來’將固定元件9〇穿設於通孔81及固定孔54内，將 固定彈片80固定至板體50上，此時，固定彈片8〇之抵壓 部82發生彈性變形，使第一、第二平板部83、84及抵壓 面82a均與吸熱板7〇之上表面緊密貼合；最後，將吸熱塊 60與熱管30之蒸發段34依次置於CPU上，並將熱管30、 40之冷凝段32、42置於散熱器20之底部，再將散熱器20 置於離心風扇丨〇之出風口 11處，實現散熱模組與電路板 之間之組裝。 將忒散熱模組組裝至電路板上後，固定彈片8〇之按壓部 82發生彈性形變，向下按壓吸熱板70，使吸熱板70與 VGA晶片緊密接觸，使熱管4〇與“八晶片之間具良好之傳 熱效果》 該固定彈片8Q由—金屬片連續脊折形成，在生產實踐中 ，該固疋彈片80通常由一金屬片衝壓形成，使該固定彈 片8〇具有較低之原料成本及加工成本，並且該固定彈片 8〇之喊過錢為方便，使㈣定彈㈣更適宜於大規 模生產。 表單編號A0101 第7頁/共18頁 1003191777-0 1352568 [0021]本實施例中，熱管40收容於吸熱板70之收容空間74内 借助吸熱板70固定至VGA晶片上，可以理解地，熱管4〇可 直接設於固定彈片80下方，利用固定彈片80變形產生之 抵壓力直接將熱管40按壓至VGA晶片上。本實施例中，固 定彈片80用於將熱管4〇固定至VGA晶片上，可以理解地， 該固定彈片80亦可用於將其他條狀結構或塊狀結構如圖i 中所示吸熱塊60固定至發熱電子元件上。[0016] The pressing portion 82 of the fixed elastic piece 80 has a substantially meandering shape, and has an abutting surface 82a and two fins 82b extending obliquely upward from both sides of the pressing surface 82a. End portions of the two flaps 82b Do not extend downward obliquely to form two tabs 82c connecting the flap 82b of the pressing portion 82 and the first and second flat portions 83, 84. The pressing surface 82a of the pressing portion 82 slightly protrudes downward from the lower surfaces of the first and second flat plate portions 83, 84, so that the first and second flat plate portions 83, 84 are attached to the upper surface of the heat absorbing plate 70. When the flap 82b of the pressing portion 82 is elastically deformed, the heat absorbing plate 7 is pressed downward. In the present embodiment, the two connecting pieces 82c are obliquely extended. It is understood that the two connecting pieces 82c may also extend in a direction perpendicular to the first and second flat plate portions 83, 84, that is, in a vertical direction. [00] The abutting portion 85 of the fixing elastic piece 80 is substantially L-shaped, and includes a lower extending portion 85a extending downward from the second flat plate portion 84, and a piece 85b extending horizontally outward from the lower extending portion 85a. . The height of the lower extension portion 85a is designed so that the second flat plate portion 84 just abuts against the upper surface of the heat absorbing plate 70 when the abutment piece 85b abuts against the lower surface of the heat absorbing plate 70. [0018] When assembling, the board body 5 is fixed to the circuit board, and the north bridge wafer is in contact with the middle of the board body 50. The VGA chip is located under the receiving hole 53, and the lower surface of the side 53b of the receiving hole 53 is formed. The gap is formed between the upper surface of the circuit board; next, 'the abutment portion 85 of the fixed elastic piece 80 is placed on the 096130490 of the plate body 50. Form No. A0101 Page 6 of 18 Page 1003191777-0 100 May 30 Correcting the position of the replacement page j in the receiving hole 53 near the side edge 53b, and making the second flat plate portion 84 substantially perpendicular to the upper surface of the plate body 50; next, the evaporation section 44 of the heat pipe 40 is placed in the receiving space of the heat absorbing plate 70. 74, the heat absorbing plate 70 and the evaporation section 44 of the heat pipe 40 are placed in the receiving hole 53 of the plate body 50; the fixing elastic piece 80' is turned over so that the upper surface of the abutting portion 85 of the abutting portion 85 and the side of the receiving hole 53 The lower surface of the 53b abuts against the pressing surface 82a of the pressing portion 82 and the lower surfaces of the first and second flat portions 83, 84 and the upper surface of the heat absorbing plate 70. The through hole 81 is aligned with the fixing hole 54 of the plate body 50; then the fixing member 9 is bored through the through hole 81 and fixed 54, the fixing elastic piece 80 is fixed to the plate body 50. At this time, the pressing portion 82 of the fixing elastic piece 8 is elastically deformed, so that the first and second flat plate portions 83 and 84 and the pressing surface 82a are respectively combined with the heat absorbing plate. 7: The upper surface is closely attached; finally, the heat absorbing block 60 and the evaporation section 34 of the heat pipe 30 are sequentially placed on the CPU, and the condensation sections 32, 42 of the heat pipes 30, 40 are placed at the bottom of the heat sink 20, and then The heat sink 20 is placed at the air outlet 11 of the centrifugal fan to realize assembly between the heat dissipation module and the circuit board. After the heat dissipation module is assembled to the circuit board, the pressing portion 82 of the fixed elastic piece 8 is elastically deformed, and the heat absorption plate 70 is pressed downward to make the heat absorption plate 70 and the VGA chip in close contact, so that the heat pipe 4 and the "eight wafers" The heat transfer effect is good. The fixed elastic piece 8Q is formed by a continuous ridge of a metal piece. In the production practice, the solid elastic piece 80 is usually formed by stamping a metal piece, so that the fixed elastic piece 8〇 has a lower material. Cost and processing cost, and the fixed shrapnel 8 喊 shouted money for convenience, so that (4) fixed bomb (four) is more suitable for mass production. Form No. A0101 Page 7 / 18 pages 1003191777-0 1352568 [0021] This embodiment The heat pipe 40 is received in the accommodating space 74 of the heat absorbing plate 70 and fixed to the VGA chip by the heat absorbing plate 70. It can be understood that the heat pipe 4 〇 can be directly disposed under the fixed elastic piece 80, and the pressure generated by the deformation of the fixed elastic piece 80 is directly The heat pipe 40 is pressed onto the VGA chip. In this embodiment, the fixing elastic piece 80 is used for fixing the heat pipe 4 to the VGA chip. It can be understood that the fixing elastic piece 80 can also be used for other strip structures or blocks. Configuration shown in the upper heating electronic component i in the heat block 60 is fixed to FIG.
[0022] 本實施例中，固定彈片80之第一平板部83與抵靠部85分 別固定至收容孔53之兩侧邊53d ' 53b，可以理解地，該 固定彈片80之第一平板部83與抵靠部85可分.別固定至兩 個不同之元件上，如該第一平板部83可固定於電路板上 ’而該抵靠部85可與板體50之下表面相抵靠，此種情況 下’按壓部82之兩個連接片82c之長度需做適應性調整。 [0023] 如5圖所示，本實施例中可以無需設置第二平板部84與靠 近第二平板部84之連接片82c，而直接由按壓部82之翼片 82b處延伸出所述抵靠部85 ’或直接由按壓部82之連接片 82c之一端延伸出所述抵靠部85，或去掉靠近第一平板部 83之連接片82c，而直接由按壓部82之翼片82b處延伸出 所述第一平板部83。可以理解地，該按壓部82還可以同 時去掉連接片82c，使第一、第二平板部83、84直接與按 壓部82之翼片82b相連，此種情況下，按壓部82大致呈V 形結構。 [0024] 综上所述，本發明符合發明專利之要件，爰依法提出專 利申請。惟以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 096130490 表單編號A0101 第8頁/共18頁 1003191777-0 100年05月30日梭正替換百 1352568 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 [0025] 圖1為本發明散熱模組一較佳實施方式之立體分解圖。 [0026] 圖2為圖1中散熱模組之立體組裝圖。 [0027] 圖3為圖1中散熱模組中扣片之立體圖。 [0028] 圖4為圖1中散熱模組中扣片之侧視圖。 [0029] 圖5為本發明散熱模組中扣片之另一實施方式之側視圖。[0022] In the embodiment, the first flat portion 83 and the abutting portion 85 of the fixing elastic piece 80 are respectively fixed to the two side edges 53d' 53b of the receiving hole 53, and it is understood that the first flat portion 83 of the fixing elastic piece 80 The abutting portion 85 can be divided into two different components, such as the first flat portion 83 can be fixed on the circuit board 'and the abutting portion 85 can abut the lower surface of the plate body 50, In this case, the length of the two connecting pieces 82c of the pressing portion 82 needs to be adaptively adjusted. As shown in FIG. 5, in the embodiment, it is not necessary to provide the second flat plate portion 84 and the connecting piece 82c adjacent to the second flat plate portion 84, and the abutting portion 82b of the pressing portion 82 directly extends the abutting portion. The portion 85' extends directly from the one end of the connecting piece 82c of the pressing portion 82 to the abutting portion 85, or the connecting piece 82c adjacent to the first flat plate portion 83 is removed, and is directly extended from the tab 82b of the pressing portion 82. The first flat plate portion 83. It can be understood that the pressing portion 82 can also remove the connecting piece 82c at the same time, so that the first and second flat plate portions 83, 84 are directly connected to the flap 82b of the pressing portion 82. In this case, the pressing portion 82 is substantially V-shaped. structure. [0024] In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above is only a preferred embodiment of the present invention, and those skilled in the art will be equivalent to 096130490 in the spirit of the present invention. Form No. A0101 Page 8/18 pages 1003191777-0 100 years 05 On the 30th of the month, the shuttle is replacing the 13522568 decoration or change, which should be covered in the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS [0025] FIG. 1 is an exploded perspective view of a preferred embodiment of a heat dissipation module of the present invention. 2 is an assembled, isometric view of the heat dissipation module of FIG. 1. 3 is a perspective view of a buckle in the heat dissipation module of FIG. 1. 4 is a side view of the buckle in the heat dissipation module of FIG. 1. [0029] FIG. 5 is a side view of another embodiment of a buckle in a heat dissipation module of the present invention.
【主要元件符號說明】 、 [0030] 離心風扇：10 [0031] 出風口 ： 11 [0032] 散熱器：20 [0033] 散熱鰭片：21 [0034] 熱管：30、40 [0035] 冷凝段：32、42 [0036] 蒸發段：34、44 [0037] 自由端：45 [0038] 彎折段：46 [0039] 板體：50 [0040] 固定腳：51 [0041] 散熱柱：52 096130490 表單編號A0101 第9頁/共18頁 1003191777-0 1352568 100年05月30日梭正替换頁 [0042] 收容孔：53 [0043] 側邊：53a、53b、53c、53d [0044] 凹槽：53e 、52f [0045] 固定孔：54 [0046] 吸熱塊：60 [0047] 吸熱板：70[Main component symbol description], [0030] Centrifugal fan: 10 [0031] Air outlet: 11 [0032] Heat sink: 20 [0033] Heat sink fin: 21 [0034] Heat pipe: 30, 40 [0035] Condensation section: 32, 42 [0036] Evaporation section: 34, 44 [0037] Free end: 45 [0038] Bending section: 46 [0039] Plate body: 50 [0040] Fixed foot: 51 [0041] Heatsink: 52 096130490 Form No. A0101 Page 9 of 18 1003191777-0 1352568 May 30th, 2014 Shuttle replacement page [0042] Reception hole: 53 [0043] Side: 53a, 53b, 53c, 53d [0044] Groove: 53e , 52f [0045] fixing hole: 54 [0046] heat absorbing block: 60 [0047] heat absorbing plate: 70
[0048] 上板：71 [0049] 下板：72 [0050] 側板：73 [0051] 收容空間：74 [0052] 固定彈片：80 [0053] 通孔：81[0048] Upper plate: 71 [0049] Lower plate: 72 [0050] Side plate: 73 [0051] Containing space: 74 [0052] Fixed shrapnel: 80 [0053] Through hole: 81
[0054] 按壓部：82 [0055] 抵壓面：82a [0056] 翼片：82b [0057] 連接片：82c [0058] 第一平板部：83 [0059] 第二平板部：84 [0060] 抵靠部：85 096130490 表單編號A0101 第10頁/共18頁 1003191777-0 100年05月30日梭正替換頁 135.2568 ' [0061]下延部：85a [0062] 靠片：85b [0063] 固定元件：90[0054] Pressing portion: 82 [0055] Abutting surface: 82a [0056] Tab: 82b [0057] Connecting piece: 82c [0058] First flat portion: 83 [0059] Second flat portion: 84 [0060] Abutment: 85 096130490 Form No. A0101 Page 10/Total 18 Page 1003191777-0 100 May 30th Shuttle Replacement Page 135.2568 '[0061] Lower Extension: 85a [0062] Back: 85b [0063] Fixed Component: 90
096130490 表單編號A0101 第11頁/共18頁 1003191777-0096130490 Form No. A0101 Page 11 of 18 1003191777-0
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96130490A TWI352568B (en) | 2007-08-17 | 2007-08-17 | Resilient clip and thermal module using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96130490A TWI352568B (en) | 2007-08-17 | 2007-08-17 | Resilient clip and thermal module using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200911091A TW200911091A (en) | 2009-03-01 |
| TWI352568B true TWI352568B (en) | 2011-11-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96130490A TWI352568B (en) | 2007-08-17 | 2007-08-17 | Resilient clip and thermal module using the same |
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| Country | Link |
|---|---|
| TW (1) | TWI352568B (en) |
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2007
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| Publication number | Publication date |
|---|---|
| TW200911091A (en) | 2009-03-01 |
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