TWI340411B - Substrate processing apparatus - Google Patents

Substrate processing apparatus

Info

Publication number: TWI340411B
Authority: TW; Taiwan
Prior art keywords: processing apparatus; substrate processing; substrate; processing
Prior art date: 2006-07-04

Application number

TW096116501A

Other languages

English (en)

Other versions

TW200811956A (en

Inventor

Takashi Kakimura

Original Assignee

Dainippon Screen Mfg

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2006-07-04

Filing date

2007-05-09

Publication date

2011-04-11

2007-05-09 Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg

2008-03-01 Publication of TW200811956A publication Critical patent/TW200811956A/zh

2011-04-11 Application granted granted Critical

2011-04-11 Publication of TWI340411B publication Critical patent/TWI340411B/zh

Classifications

- H10P76/2041—
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/60—Substrates
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
- G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
- G03F7/202—Masking pattern being obtained by thermal means, e.g. laser ablation

Landscapes

Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Optics & Photonics (AREA)
Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

TW096116501A 2006-07-04 2007-05-09 Substrate processing apparatus TWI340411B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2006184405A JP2008016543A (ja)	2006-07-04	2006-07-04	基板処理装置

Publications (2)

Publication Number	Publication Date
TW200811956A TW200811956A (en)	2008-03-01
TWI340411B true TWI340411B (en)	2011-04-11

Family

ID=39036064

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW096116501A TWI340411B (en)	2006-07-04	2007-05-09	Substrate processing apparatus

Country Status (4)

Country	Link
JP (1)	JP2008016543A (zh)
KR (1)	KR100865844B1 (zh)
CN (1)	CN101101856B (zh)
TW (1)	TWI340411B (zh)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP5049303B2 (ja) *	2008-03-17	2012-10-17	東京エレクトロン株式会社	熱処理装置、熱処理装置の温度調整方法、及び、プログラム
JP4638931B2 (ja) *	2008-09-12	2011-02-23	東京エレクトロン株式会社	基板処理装置
JP5399153B2 (ja) *	2008-12-12	2014-01-29	東京エレクトロン株式会社	真空処理装置、真空処理システムおよび処理方法
KR101117019B1 (ko) *	2009-10-19	2012-03-19	다이니폰 스크린 세이조우 가부시키가이샤	기판 처리 장치 및 기판 처리 방법
JP5372695B2 (ja) *	2009-10-19	2013-12-18	大日本スクリーン製造株式会社	基板処理装置
JP5431863B2 (ja) *	2009-10-19	2014-03-05	大日本スクリーン製造株式会社	基板処理装置
JP2011124342A (ja) *	2009-12-09	2011-06-23	Tokyo Electron Ltd	基板処理装置、基板処理方法及びこの基板処理方法を実行させるためのプログラムを記録した記録媒体
JP2011216572A (ja) *	2010-03-31	2011-10-27	Dainippon Screen Mfg Co Ltd	基板処理装置
WO2012114850A1 (ja) *	2011-02-24	2012-08-30	シャープ株式会社	塗布膜乾燥方法及び塗布膜乾燥装置
JP5869782B2 (ja) *	2011-05-30	2016-02-24	東レエンジニアリング株式会社	浮上搬送加熱装置
JP5465701B2 (ja) *	2011-08-12	2014-04-09	株式会社上村工業	液晶ディスプレイ等の製造工程におけるガラス基盤面の急速且つ高精度調温装置
JP5851295B2 (ja) *	2012-03-16	2016-02-03	東レエンジニアリング株式会社	熱処理装置
JP5988359B2 (ja) *	2012-07-18	2016-09-07	東レエンジニアリング株式会社	熱処理装置
TWI590367B (zh) *	2012-11-20	2017-07-01	東麗工程股份有限公司	Suspension transfer heat treatment device
JP5995675B2 (ja) *	2012-11-20	2016-09-21	東レエンジニアリング株式会社	冷却装置
JP5858438B2 (ja) *	2013-03-26	2016-02-10	株式会社日本製鋼所	アニール被処理体の製造方法、レーザアニール基台およびレーザアニール装置
CN103274604B (zh) *	2013-04-23	2015-05-06	北京京东方光电科技有限公司	一种基板加热设备
JP5724014B1 (ja) *	2014-04-22	2015-05-27	株式会社幸和	基板支持装置及び基板処理装置
KR102544865B1 (ko) *	2016-07-19	2023-06-19	주식회사 케이씨텍	기판 가열 장치
WO2019026916A1 (ja) *	2017-08-01	2019-02-07	株式会社新川	フレームフィーダ
CN108996242B (zh) *	2018-08-17	2021-04-09	通彩智能科技集团有限公司	一种非接触式的气浮爪装置
CN112344679A (zh) *	2019-10-25	2021-02-09	广东聚华印刷显示技术有限公司	烤箱及气悬浮装置
KR102334200B1 (ko) *	2020-06-03	2021-12-02	한국고요써모시스템(주)	열처리 장치의 기판 반송 유닛
JP7054542B2 (ja) *	2020-07-02	2022-04-14	カティーバ，インコーポレイテッド	印刷ギャップの制御のための装置および方法
KR20240174407A (ko) *	2023-06-08	2024-12-17	주식회사 엘지에너지솔루션	전극 제조 장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS63202516A (ja) *	1987-02-17	1988-08-22	Hitachi Plant Eng & Constr Co Ltd	板状物の移送装置
JPH11283909A (ja)	1998-03-31	1999-10-15	Dainippon Screen Mfg Co Ltd	基板熱処理装置
JP2000072251A (ja) *	1998-08-31	2000-03-07	Watanabe Shoko:Kk	浮上搬送装置および浮上搬送システム
JP2000181080A (ja) *	1998-12-21	2000-06-30	Fuji Photo Film Co Ltd	感光性樹脂層積層方法
JP4426276B2 (ja) *	2003-10-06	2010-03-03	住友重機械工業株式会社	搬送装置、塗布システム、及び検査システム
JP4373175B2 (ja) *	2003-10-17	2009-11-25	オリンパス株式会社	基板搬送装置
KR100782448B1 (ko) *	2003-11-21	2007-12-05	가부시키가이샤 아이에이치아이	기판 카세트, 기판 반송 장치, 기판 보관 반송 장치, 기판반입 시스템, 기판 반출 시스템 및 기판 반입/반출 시스템
JP4305918B2 (ja) *	2004-01-30	2009-07-29	東京エレクトロン株式会社	浮上式基板搬送処理装置

2006
- 2006-07-04 JP JP2006184405A patent/JP2008016543A/ja not_active Abandoned
2007
- 2007-05-09 TW TW096116501A patent/TWI340411B/zh not_active IP Right Cessation
- 2007-06-08 KR KR1020070056087A patent/KR100865844B1/ko not_active Expired - Fee Related
- 2007-06-15 CN CN2007101066877A patent/CN101101856B/zh not_active Expired - Fee Related

Also Published As

Publication number	Publication date
CN101101856A (zh)	2008-01-09
TW200811956A (en)	2008-03-01
CN101101856B (zh)	2010-10-13
KR100865844B1 (ko)	2008-10-29
JP2008016543A (ja)	2008-01-24
KR20080004345A (ko)	2008-01-09

Publication	Publication Date	Title
TWI370510B (en)	2012-08-11	Substrate processing apparatus
TWI340411B (en)	2011-04-11	Substrate processing apparatus
GB0616131D0 (en)	2006-09-20	Surface processing apparatus
TWI372440B (en)	2012-09-11	Substrate treating apparatus
EG25708A (en)	2012-05-29	Processing apparatus
TWI370508B (en)	2012-08-11	Substrate processing apparatus and substrate processing method
TWI366224B (en)	2012-06-11	Substrate treatment apparatus
TWI367538B (en)	2012-07-01	Substrate processing apparatus and substrate processing method
GB2466578B (en)	2011-07-06	Data processing apparatus
GB0609366D0 (en)	2006-06-21	Processing method
TWI366242B (en)	2012-06-11	Substrate treating apparatus
TWI373067B (en)	2012-09-21	Substrate processing method and substrate processing device
TWI340316B (en)	2011-04-11	Electronic apparatus
TWI369727B (en)	2012-08-01	Substrate processing apparatus
EP2056198A4 (en)	2010-08-18	TASK PROCESSING DEVICE
GB2433371B (en)	2007-11-14	Data processing apparatus
PL1943197T3 (pl)	2017-09-29	Sposób obróbki podłoża
GB2448488B (en)	2012-09-12	Data processing apparatus
TWI346973B (en)	2011-08-11	Substrate processing apparatus and substrate processing method
EP2216804A4 (en)	2016-01-20	PLASMA PROCESSING DEVICE
TWI370797B (en)	2012-08-21	Conveyor apparatus for brittle substrate
TWI341499B (en)	2011-05-01	Medium processing apparatus
TWI370507B (en)	2012-08-11	Apparatus for processing a substrate
TWI349958B (en)	2011-10-01	Substrate treating apparatus
KR101218555B9 (ko)	2025-01-10	기판처리장치

Legal Events

Date	Code	Title	Description
2015-01-11	MM4A	Annulment or lapse of patent due to non-payment of fees