1289415 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種耦合差動對結構，詳言之，係關於一 種具有至少二線路層之耦合差動對結構。 【先前技術】 參考圖1所丨，習知之耗合差動對結才# 12係形成於一基 板11上。該麵合差動對結構12包括二輕合差動訊號ς 121 122。一耦合差動訊號線121、122相鄰設置於該基板 11上，且相隔一間距（S1)，以形成該耦合差動對12:土 該耦合差動對12之每一耦合差動訊號線121、122之高 度為H1，係配合在該基板上之其他線路製程而固定。當2 耦合差動對12應用於高速差動對時，需要較大之^度 (wi)。因此，在基板上該耦合差動對12將佔用相當大之佈 線（layout)空間。 因此，實有必要提供一種創新且富進步性之耦合差動對 結構，以解決上述問題。 【發明内容】 本發明之目的在於提供一種耦合差動對結構及具耦合差 動對之基板結構。該耦合差動對結構形成於一基板上，該 麵e差動對結構包括：二搞合差動訊號線。二麵合差動訊 號線相鄰設置於該基板上，形成該耦合差動對，每一耦合 差動訊號線具有至少二線路層，使得該耦合差動對之該耦 合差動訊號線具有一設定高度及一設定寬度。 本發明之耦合差動對結構具有至少二線路層，故可依據 95641.doc 1289415 該耦合差動對結構之電氣特性，調整每一耦合差動訊號線 之該設定高度及該設定寬度。因此，當相對地增加耦合差 動訊號線之該設定咼度時，該耦合差動訊號線之該設定寬 度可相對地降低’故可減少該耦合差動對結構在基板上之 佈線空間。並且，本發明之耦合差動對結構可提供較強之 耦合電磁場，提高抗雜訊能力。 【實施方式】 請參閱圖2，其顯示本發明具耦合差動對之基板結構。 本發明具耦合差動對之基板結構2〇包括：一基板21、一耦 合差動對結構22及複數個圖案化線路25、26等。該基板 21具有一表面211。該等圖案化線路25、26係形成一圖案 化線路層，且形成於該表面211上。該等圖案化線路25、 26具有一第三高度H3。 該輕合差動對結構22係形成於該基板21之該表面211 上。該輕合差動對結構22包括二耦合差動訊號線23、24。 二搞合差動訊號線23、24相鄰設置於該基板21之該表面 211上’且相隔一間距（S 1 )，以形成該耦合差動對22。 每一耗合差動訊號線具有至少二線路層，使得該耦合差 動對之該耦合差動訊號線具有一設定高度及一設定寬度。 在本發明之實施例中，以每一耦合差動訊號線具有二線路 層說明之’但不限於每一耦合差動訊號線僅具有二線路 層。其中該第一耦合差動訊號線23具有一第一線路層23 1 及一第二線路層232，且該第二耦合差動訊號線24亦具有 一第一線路層241及一第二線路層242。 95641.doc -6- 1289415 以該第一耦合差動訊號線23為例說明，該第一線路層 231係為與該等圖案化線路25、26同時形成於該基板2ι 之该表面211上。亦即，該等圖案化線路乃、26與該第一 線路層231以同一製程形成於該表面211上。因此，該第 一線路層231之高度係配合在該基板上之該等圖案化線路 25、26製程而固定為m，且該第一線路層之第一高度m 等於該等圖案化線路25、26之第三高度113。該第二線路 層232形成於該第一線路層231上。較佳地，該第二線路 層232係以電鍍形成於該第一線路層231上，但不限於以 電鍍之方式。並且，該第一線路層231及該第二線路層232 可均為銅層。 因此，該第一線路層231具有一第一高度H1，該第二線 路層232具有一第二高度與該第二高度 H2之和為該設定咼度。故本發明耦合差動對之每一耦合差 動訊號線之該設定高度可相對地提高，使得該耦合差動訊 5虎線之4 $又疋見度W2可相對地降低。相較於圖1之習知 耦合差動訊號線121之寬度W1，本發明之該耦合差動訊號 線之該設定寬度W2較小。故可減少該耦合差動對結構在 基板上之佈線空間。並且，本發明之該耦合差動訊號線之 該設定寬度W2可以較該等圖案化線路乃、26之寬度 小，以增加設計之彈性。 參考圖4所示，其顯示本發明之該耦合差 應示意圖。配合參考圖3,其顯示習知之該== 耦合效應示意圖。因此，相較於圖3所顯示習知之該耦合 95641.doc1289415 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a coupled differential pair structure, and more particularly to a coupled differential pair structure having at least two circuit layers. [Prior Art] Referring to Fig. 1, a conventional differential and differential pair 12 is formed on a substrate 11. The surface differential pair structure 12 includes two light differential signals ς 121 122. A coupled differential signal line 121, 122 is disposed adjacent to the substrate 11 and spaced apart by a spacing (S1) to form the coupled differential pair 12: each coupled differential signal line of the coupled differential pair 12 The height of 121 and 122 is H1, which is fixed by other line processes on the substrate. When the 2 coupled differential pair 12 is applied to a high speed differential pair, a larger degree (wi) is required. Therefore, the coupled differential pair 12 will occupy a substantial layout space on the substrate. Therefore, it is necessary to provide an innovative and progressive coupled differential pair structure to solve the above problems. SUMMARY OF THE INVENTION It is an object of the present invention to provide a coupled differential pair structure and a substrate structure having a coupled differential pair. The coupled differential pair structure is formed on a substrate, and the surface e differential pair structure comprises: two engaging differential signal lines. The two-sided differential signal line is disposed adjacent to the substrate to form the coupled differential pair, and each coupled differential signal line has at least two circuit layers, such that the coupled differential signal has a coupled differential signal line Set the height and a set width. The coupled differential pair structure of the present invention has at least two circuit layers, so that the set height of the coupled differential signal line and the set width can be adjusted according to the electrical characteristics of the coupled differential pair structure according to 95641.doc 1289415. Therefore, when the set intensity of the coupled differential signal line is relatively increased, the set width of the coupled differential signal line can be relatively lowered. Therefore, the wiring space of the coupled differential pair structure on the substrate can be reduced. Moreover, the coupled differential pair structure of the present invention can provide a strong coupled electromagnetic field and improve the anti-noise capability. [Embodiment] Referring to Figure 2, there is shown a substrate structure of the present invention having a coupled differential pair. The substrate structure 2 of the present invention having a coupled differential pair includes a substrate 21, a coupled differential pair structure 22, and a plurality of patterned lines 25, 26 and the like. The substrate 21 has a surface 211. The patterned lines 25, 26 form a patterned wiring layer and are formed on the surface 211. The patterned lines 25, 26 have a third height H3. The light and differential pair structure 22 is formed on the surface 211 of the substrate 21. The light differential differential pair structure 22 includes two coupled differential signal lines 23, 24. The differential signal lines 23, 24 are disposed adjacent to the surface 211 of the substrate 21 and spaced apart by a spacing (S1) to form the coupled differential pair 22. Each of the constrained differential signal lines has at least two circuit layers such that the coupled differential pair has a set height and a set width. In an embodiment of the invention, each of the coupled differential signal lines has a two-layer layer description, but is not limited to having only two line layers per coupled differential signal line. The first coupled differential signal line 23 has a first circuit layer 23 1 and a second circuit layer 232 , and the second coupled differential signal line 24 also has a first circuit layer 241 and a second circuit layer . 242. 95641.doc -6- 1289415 Taking the first coupled differential signal line 23 as an example, the first circuit layer 231 is formed on the surface 211 of the substrate 2i simultaneously with the patterned lines 25 and 26. That is, the patterned lines 26 and the first circuit layer 231 are formed on the surface 211 in the same process. Therefore, the height of the first circuit layer 231 is fixed to m by the process of the patterned lines 25 and 26 on the substrate, and the first height m of the first circuit layer is equal to the patterned lines 25, The third height of 26 is 113. The second wiring layer 232 is formed on the first wiring layer 231. Preferably, the second wiring layer 232 is formed on the first wiring layer 231 by electroplating, but is not limited to electroplating. Moreover, the first circuit layer 231 and the second circuit layer 232 may both be copper layers. Therefore, the first circuit layer 231 has a first height H1, and the second circuit layer 232 has a second height and a second height H2 as the set temperature. Therefore, the set height of each coupled differential signal line of the coupled differential pair of the present invention can be relatively increased, so that the 4K and the visibility W2 of the coupled differential signal can be relatively reduced. The set width W2 of the coupled differential signal line of the present invention is smaller than the width W1 of the conventional coupled differential signal line 121 of FIG. Therefore, the wiring space of the coupling differential pair structure on the substrate can be reduced. Moreover, the set width W2 of the coupled differential signal line of the present invention may be smaller than the width of the patterned lines, to increase the flexibility of the design. Referring to Figure 4, there is shown a schematic diagram of the coupling difference of the present invention. Referring to Figure 3, there is shown a schematic diagram of the known coupling effect of ==. Therefore, the coupling is similar to that shown in Figure 3. 95641.doc