TWI746367B - Composite circuit board and manufacturing method thereof - Google Patents

Abstract

The present invention provides a composite circuit board and a manufacturing method thereof. The composite circuit board includes a substrate, a ceramic block, an insulating ink, and a first additional circuit. The substrate has a board, a first circuit layer formed on one side of the board, and a second circuit layer that is formed on the other side of the board. The substrate has an accommodating hole penetrating there-through. The ceramic block is arranged in the accommodating hole, and is fixed to a wall of the accommodating hole through the insulating ink. The first additional circuit is connected to and coplanar with the first circuit layer, and is formed on the ceramic block.

Description

Composite circuit board and manufacturing method thereof

The invention relates to a circuit board, in particular to a composite circuit board and a manufacturing method thereof.

As the application of products with high calorific value becomes more and more popular, the requirements for heat dissipation efficiency and heat resistance of circuit boards are getting higher and higher. Therefore, in recent years, thermally conductive circuit boards have been gradually applied to products with high calorific value to meet the heat dissipation efficiency and heat resistance requirements of products with high calorific value. However, the existing circuit board adopts a heat dissipation structure to achieve high heat dissipation requirements, and it is often necessary to sacrifice the circuit layout (for example, the circuit layout must bypass the above heat dissipation structure).

Therefore, the inventor believes that the above-mentioned shortcomings can be improved, and with great concentration of research and the application of scientific principles, we finally propose an invention with reasonable design and effective improvement of the above-mentioned shortcomings.

The embodiment of the present invention is to provide a composite circuit board and a manufacturing method thereof, which can effectively improve the defects that may occur in the existing circuit board.

The embodiment of the present invention discloses a method for manufacturing a composite circuit board, which includes: a preparation step: providing a substrate and a ceramic block; wherein the substrate includes a first circuit layer and a second circuit layer on opposite sides, respectively. Circuit layer, and the substrate is formed with a penetrating accommodating A hole; a placing step: attaching the second circuit layer of the substrate to a carrier, and placing the ceramic block into the containing hole and attaching it to the carrier; and a printing Step: forming an insulating ink in a gap between the ceramic block and the hole wall of the accommodating hole and a first gap surrounded by the first circuit layer; wherein, adjacent to the first circuit The surface of the ceramic block of the layer is exposed outside the insulating ink and is defined as a first circuit addition area; a plating step: thickening the first circuit layer and extending the first circuit layer to form There is a first extension part covering the first line extension area; and a patterning step: etching the first extension part to form a first extension line connected to the first line layer.

The embodiment of the present invention also discloses a composite circuit board, which includes: a substrate having a board body, a first circuit layer formed on one side of the board body, and a first circuit layer formed on the other side of the board body. The second circuit layer; wherein the substrate is formed with a through-shaped accommodating hole; a ceramic block and an insulating ink, the ceramic block is located in the accommodating hole, and fixed to the insulating ink The wall of the accommodating hole; wherein the surface of the ceramic block adjacent to the first circuit layer is exposed to the insulating ink and is defined as a first circuit addition area; and a first addition circuit , It is connected and coplanar on the first circuit layer, and the first additional circuit is formed on the first circuit additional area of the ceramic block.

In summary, the composite circuit board and the manufacturing method thereof disclosed in the embodiment of the present invention provide a connection to the first circuit board by embedding the ceramic block with the first circuit addition area in the substrate. The formation of the first additional circuit of the circuit layer can effectively avoid the effect of embedding the ceramic block on the overall circuit layout of the composite circuit board.

In order to further understand the features and technical content of the present invention, please refer to the following detailed descriptions and drawings about the present invention, but these descriptions and drawings are only used to illustrate the present invention, and do not make any claims about the protection scope of the present invention. limit.

100: composite circuit board

1: substrate

11: receiving hole

12: Board body

13: The first circuit layer

14: The second circuit layer

2: ceramic block

21: Ceramic body

22: conductive layer

221: The first line extension area

222: Second Route Additional Area

3: Insulating ink

4a: first extension

4: The first additional line

5a: second extension

5: Second additional line

200: carrier

G: gap

V1: The first gap

V2: second gap

S110: Preparation steps

S120: Placement step

S130: Printing steps

S140: Thickening step

S150: Leveling step

S160: Electroplating step

S170: Patterning step

FIG. 1 is a schematic plan view of the preparation steps of the manufacturing method of the composite circuit board according to the first embodiment of the present invention.

2 is a schematic plan view of the placing step of the manufacturing method of the composite circuit board according to the first embodiment of the present invention.

Fig. 3 is a three-dimensional schematic diagram of Fig. 2.

4 is a schematic plan view of the printing step of the manufacturing method of the composite circuit board according to the first embodiment of the present invention.

5 is a schematic plan view of the thickening step of the manufacturing method of the composite circuit board according to the first embodiment of the present invention.

6 is a schematic plan view of the planarization step of the manufacturing method of the composite circuit board according to the first embodiment of the present invention.

7 is a schematic plan view of the electroplating step of the manufacturing method of the composite circuit board according to the first embodiment of the present invention.

8 is a schematic plan view of the patterning step of the manufacturing method of the composite circuit board according to the first embodiment of the present invention.

Fig. 9 is a three-dimensional schematic diagram of Fig. 8.

FIG. 10 is a three-dimensional schematic diagram of a composite circuit board according to the second embodiment of the present invention.

Fig. 11 is a schematic cross-sectional view of Fig. 10 along the section line XI-XI.

The following are specific examples to illustrate the implementation of the "composite circuit board and its manufacturing method" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented by other different specific embodiments Implementation or application, various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to actual dimensions, and are stated in advance. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.

It should be understood that although terms such as "first", "second", and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one element from another, or one signal from another signal. In addition, the term "or" used in this document may include any one or a combination of more of the associated listed items depending on the actual situation.

[Example 1]

Please refer to FIG. 1 to FIG. 9, which are the first embodiment of the present invention. This embodiment discloses a composite circuit board 100 and a manufacturing method thereof; in order to facilitate the description of this embodiment, the manufacturing method of the composite circuit board will be introduced first, and then the composite circuit board 100 will be described later. Wherein, the composite circuit board 100 is manufactured by implementing the manufacturing method of the composite circuit board in this embodiment, but the present invention is not limited thereto.

Please refer to FIG. 1 to FIG. 9, which are schematic flow diagrams of the manufacturing method of the composite circuit board. Wherein, the manufacturing method of the composite circuit board in this embodiment sequentially includes a preparation step S110, a placing step S120, a printing step S130, a thickening step S140, a flattening step S150, and an electroplating step. S160 and a patterning step S170, but the present invention is not limited to this.

For example, in other embodiments not shown in the present invention, the manufacturing method of the composite circuit board may omit the planarization step S150 and the electroplating step S160 according to design requirements; or, the composite circuit board The multiple steps S110 to S170 included in the manufacturing method of the circuit board can also be adjusted according to design requirements in order.

As shown in FIG. 1, the preparation step S110: Provide a substrate 1 and a ceramic block 2; wherein, the substrate 1 is formed with an accommodating hole 11 in a penetrating shape, and the volume of the ceramic block 2 is slightly smaller than The volume of the accommodating hole 11 and the height of the ceramic block 2 are approximately equal to the depth of the accommodating hole 11. In addition, the shape of the ceramic block 2 can be changed according to design requirements, and is not limited to the drawing of this embodiment.

Furthermore, the ceramic block 2 in this embodiment includes a ceramic body 21 and a conductive layer 22 formed on the outer surface of the ceramic body 21. In other words, the ceramic body 21 is covered by the conductive layer 22 in this embodiment, but the invention is not limited to this. For example, in other embodiments not shown in the present invention, the ceramic body 21 may also only be covered by the conductive layer 22 with its top and bottom surfaces; or, the ceramic block 2 may not be formed by the conductive layer 22.述conductive layer 22.

Wherein, in the preparation step S110, the ceramic body 21 sequentially passes through a degreasing process, a roughening process, a sensitization process, and an activation process, and then is applied to the outer surface of the ceramic body 21. The conductive layer 22 (such as a conductive palladium layer) is formed. In this embodiment, the oil removal process is implemented by ethanol (C2H5OH), the coarsening process is implemented by sodium hydroxide (NaOH), and the sensitization process is implemented by stannous chloride dihydrate (SnCl2.2H2O) and Hydrogen chloride (HCl) is implemented, and the activation process is implemented by palladium chloride (PdCl2) and hydrogen chloride (HCl), but the present invention is not limited to this.

In addition, the substrate 1 includes a board 12 and a first circuit layer 13 and a second circuit layer 14 located on opposite sides of the board 12 respectively. Wherein, the accommodating hole 11 is equivalent to being formed through the board 12, the first circuit layer 13, and the second circuit layer 14. Furthermore, the first circuit layer 13 (and/or the second circuit layer 14) may be a pattern lacking partial circuits, and the first circuit layer 13 (and/or the second circuit layer 14) The position of the missing partial circuit corresponds to the accommodating hole 11.

As shown in Figures 2 and 3, the placing step S120: the second The circuit layer 14 is attached to a carrier 200, and the ceramic block 2 is placed in the containing hole 11 and attached to the carrier 200. Wherein, the carrier 200 is preferably a heat-resistant tape, and the carrier 200 is illustrated by a polymide (PI) tape in this embodiment, but the present invention is not limited thereto.

As shown in FIG. 4, the printing step S130: a gap G between the ceramic block 2 and the hole wall of the accommodating hole 11 (such as: FIG. 2) and the first circuit layer 13 An insulating ink 3 is formed in a surrounding first void V1. Wherein, the hole wall of the accommodating hole 11 (such as: FIG. 2) and the side wall of the ceramic block 2 are completely covered by the insulating ink 3, and the insulating ink 3 in this embodiment includes There is a mixed material of resin and solder resist material, but the present invention is not limited to this.

In this embodiment, the surface of the conductive layer 22 adjacent to the first circuit layer 13 (for example, the top surface of the conductive layer 22 in FIG. 4) is exposed outside the insulating ink 3 and defines Is a first circuit addition area 221; the surface of the conductive layer 22 adjacent to the second circuit layer 14 (the bottom surface of the conductive layer 22 in FIG. 4) is exposed outside the insulating ink 3 and defines Add area 222 for a second line.

As shown in FIG. 5, the thickening step S140: removing the carrier 200 and thickening the insulating ink 3, so that the insulating ink 3 covers the first circuit layer 13 and the second circuit layer 14. And the ceramic block 2; that is to say, the first circuit layer 13, the second circuit layer 14, and the ceramic block 2 are all embedded in the insulating ink 3 (such as: the The first line extension area 221 and the second line extension area 222 are also covered with the insulating ink 3).

As shown in FIG. 6, the leveling step S150: brushing the insulating ink 3 so that the first circuit layer 13, the second circuit layer 14, and the ceramic block 2 (the first A circuit extension area 221 and the second circuit extension area 222) are exposed outside the insulating ink 3, and the insulating ink 3 is only left in the gap G, the first gap V1, and the first gap V1. In a second gap V2 surrounded by the second circuit layer 14.

In more detail, the first circuit addition area 221 is coplanar on the first circuit layer 13 and the adjacent insulating ink 3, and the second circuit addition area 222 is coplanar on the second circuit layer 13 The circuit layer 14 and the adjacent insulating ink 3 parts.

As shown in FIG. 7, the electroplating step S160: thicken the first circuit layer 13 and extend the first circuit layer 13 to form a first extension covering the first circuit addition area 221 Portion 4a; and thicken the second circuit layer 14 so that the second circuit layer 14 is extended to form a second extension portion 5a covering the second circuit addition area 222.

In this embodiment, the first extension portion 4a covers the entire first line extension area 221 and is coplanar with the thickened first line layer 13, and the second extension portion 5a covers the entire area. The second circuit addition area 222 is coplanar with the thickened second circuit layer 14. Wherein, the thickness of the first circuit layer 13 and the thickness of the second circuit layer 14 are preferably each thickened to at least 200 micrometers (μm), but the present invention is not limited to this.

As shown in FIGS. 8 and 9, the patterning step S170: etching the first extension 4a (such as FIG. 7) to form a first additional circuit 4 connected to the first circuit layer 13; and The second extension portion 5a (such as FIG. 7) is etched to form a second additional wiring 5 connected to the second wiring layer 14. In this embodiment, the thickness of the first additional circuit 4 is less than the thickness of the first circuit layer 13, and the thickness of the second additional circuit 5 is less than the thickness of the second circuit layer 14. .

In this embodiment, the first additional circuit 4 is a local circuit lacking in the first circuit layer 13, and the second additional circuit 5 is a local circuit lacking in the second circuit layer 14. In other words, the first circuit layer 13 and the first additional circuit 4 together form a complete circuit, and the second circuit layer 14 and the second additional circuit 5 also together form another complete circuit, However, the present invention is not limited to this.

It should be additionally noted that the manufacturing method of the composite circuit board is described in this embodiment It is explained that the first additional line 4 and the second additional line 5 are formed on the ceramic block 2, but the present invention is not limited to this. For example, in other embodiments not shown in the present invention, the method for manufacturing the composite circuit board may also form only the first additional circuit 4 (that is, the The second additional circuit 5) is not formed on the ceramic block 2.

The above is the description of the manufacturing method of the composite circuit board of this embodiment, and the following briefly introduces the composite circuit board 100 of this embodiment, and the detailed structure of the composite circuit board 100 can refer to the above description The related description in the manufacturing method of the composite circuit board, but the present invention is not limited to this.

Please refer to FIG. 8 and FIG. 9, which are schematic diagrams of the composite circuit board 100. The composite circuit board 100 includes a substrate 1, an insulating ink 3, a ceramic block 2 embedded in the substrate 1 through the insulating ink 3, and two opposite sides of the ceramic block 2 respectively. A first additional line 4 and a second additional line 5 on the side. Wherein, the substrate 1 is formed with an accommodating hole 11 in a penetrating shape, and the ceramic block 2 is located in the accommodating hole 11 and fixed to the accommodating hole 11 by the insulating ink 3 wall.

Furthermore, the substrate 1 has a board body 12, a first circuit layer 13 formed on one side of the board body 12, and a second circuit layer 14 formed on the other side of the board body 12. The ceramic block 2 includes a ceramic body 21 and a conductive layer 22 formed on the outer surface of the ceramic body 21. In this embodiment, the surface of the conductive layer 22 adjacent to the first circuit layer 13 is exposed outside the insulating ink 3 and is defined as a first circuit addition area 221, which is adjacent to the second circuit layer The surface of the conductive layer 22 of 14 is exposed outside the insulating ink 3 and is defined as a second circuit addition area 222.

The first additional circuit 4 is connected and coplanar on the first circuit layer 13, and the first additional circuit 4 is formed on the first circuit additional area 221 of the ceramic block 2, and the second A circuit layer 13 and the first additional circuit 4 preferably form a complete circuit together, but the present invention is not limited to this.

Furthermore, the second additional circuit 5 is connected and coplanar with the second circuit layer 14, and the second circuit layer 14 is formed on the second circuit additional area 222 of the ceramic block 2, and The second circuit layer 14 and the second additional circuit 5 preferably together form another complete circuit, but the present invention is not limited to this.

It should be additionally noted that the thickness of the first circuit layer 13 and the thickness of the second circuit layer 14 are each at least 200 microns, and the thickness of the first additional circuit 4 is smaller than that of the first circuit layer 13. The thickness of the second additional circuit 5 is smaller than the thickness of the second circuit layer 14.

[Example 2]

Please refer to FIG. 10 and FIG. 11, which are the second embodiment of the present invention. Since this embodiment is similar to the first embodiment above, the similarities of the two embodiments will not be described again. The difference between this embodiment and the first embodiment is roughly explained as follows: In this embodiment, the ceramic block 2 does not include the conductive layer 22 in the first embodiment; that is, the ceramic block 2 in this embodiment is equivalent to the ceramic body 21 in the first embodiment. Accordingly, the first circuit additional area 221 is defined on the surface of the ceramic block 2 adjacent to the first circuit layer 13 and exposed to the insulating ink 3 (for example, the ceramic block 2 in FIG. 11的上面), and the second circuit additional area 222 is defined on the surface of the ceramic block 2 adjacent to the second circuit layer 14 and exposed outside the insulating ink 3 (such as: The bottom surface of the ceramic block 2).

In the same way, the ceramic block 2 used in the manufacturing method of the composite circuit board in this embodiment also does not include the conductive layer 22 of the first embodiment, and the manufacturing method of the composite circuit board is in this embodiment. The flow of the remaining steps in the embodiment is similar to the above-mentioned first embodiment, and will not be repeated here.

[Technical Effects of Embodiments of the Invention]

In summary, the composite circuit board and its manufacturing method disclosed in the embodiments of the present invention Method, by embedding the ceramic block with the first additional circuit area in the substrate to provide the first additional circuit forming connection to the first circuit layer, thereby effectively avoiding the embedding The ceramic block affects the overall circuit layout. Furthermore, the ceramic block may be further provided with the second additional circuit area to provide the formation of the second additional circuit connected to the second circuit layer, thereby effectively avoiding embedding of the ceramic block It affects the overall circuit layout of the composite circuit board.

The content disclosed above is only the preferred and feasible embodiments of the present invention, and does not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the patent scope of the present invention. Inside.

100: composite circuit board

1: substrate

11: receiving hole

12: Board body

13: The first circuit layer

14: The second circuit layer

2: ceramic block

21: Ceramic body

22: conductive layer

221: The first line extension area

222: Second Route Additional Area

3: Insulating ink

4: The first additional line

5: Second additional line

S170: Patterning step

Claims (9)

A method for manufacturing a composite circuit board includes: a preparation step: providing a substrate and a ceramic block; wherein the substrate includes a first circuit layer and a second circuit layer on opposite sides, and The substrate is formed with an accommodating hole in a penetrating shape; an placing step: attaching the second circuit layer of the substrate to a carrier, and placing the ceramic block in the accommodating hole and Attached to the carrier; and a printing step: a gap between the ceramic block and the hole wall of the accommodating hole and a first gap surrounded by the first circuit layer are formed Insulating ink; wherein the surface of the ceramic block adjacent to the first circuit layer is exposed outside the insulating ink and is defined as a first circuit addition area; an electroplating step: thickening the first circuit layer , And extend the first circuit layer to form a first extension part covering the first circuit addition area; and a patterning step: etching the first extension part to form a connection to the first A first additional line on the line layer. The method of manufacturing a composite circuit board according to claim 1, wherein the ceramic block includes a ceramic body and a conductive layer formed on the outer surface of the ceramic body; the method of manufacturing the composite circuit board is Between the printing step and the electroplating step, it further includes: a thickening step: removing the carrier and thickening the insulating ink so that the insulating ink covers the first circuit layer, the second circuit layer, and the second circuit layer. Circuit layer, and the ceramic block; and a leveling step: rubbing the insulating ink so that the first circuit layer, the second circuit layer, and the ceramic block are exposed to the insulating ink outside, And the insulating ink only remains in the gap, the first gap, and a second gap surrounded by the second circuit layer. The method for manufacturing a composite circuit board according to claim 1, wherein, in the printing step, the surface of the ceramic block adjacent to the second circuit layer is exposed outside the insulating ink and is defined as A second circuit addition area; in the electroplating step, the second circuit layer is further thickened, and the second circuit layer is extended to form a second extension covering the second circuit addition area Portion; in the patterning step, the second extension portion is further etched to form a second additional circuit connected to the second circuit layer. The method for manufacturing a composite circuit board according to claim 3, wherein in the electroplating step, the thickness of the first circuit layer and the thickness of the second circuit layer are each increased to at least 200 microns ( μm). The method for manufacturing a composite circuit board according to claim 2, wherein, in the preparation step, the ceramic body sequentially passes through a degreasing process, a roughening process, a sensitization process, and an activation process , And further forming the conductive layer on the outer surface of the ceramic body. The method for manufacturing a composite circuit board according to claim 5, wherein, in the preparation step, the oil removal process is implemented by ethanol (C ₂ H ₅ OH), and the roughening process is performed by sodium hydroxide ( NaOH), the sensitization process is implemented by stannous chloride dihydrate (SnCl _2. 2H ₂ O) and hydrogen chloride (HCl), and the activation process is implemented by palladium chloride (PdCl ₂ ) and hydrogen chloride (HCl). The method for manufacturing a composite circuit board according to claim 1, wherein the first A circuit layer and the first additional circuit together constitute a complete circuit. A composite circuit board comprising: a substrate with a board body, a first circuit layer formed on one side of the board body, and a second circuit layer formed on the other side of the board body; wherein , The substrate is formed with an accommodating hole in a penetrating shape; a ceramic block and an insulating ink, the ceramic block is located in the accommodating hole and is fixed to the accommodating hole by the insulating ink The hole wall; wherein the surface of the ceramic block adjacent to the first circuit layer is exposed to the insulating ink and is defined as a first circuit addition area; and a first addition circuit, which is connected and coplanar On the first circuit layer, and the first additional circuit is formed on the first circuit additional area of the ceramic block; wherein the surface of the ceramic block adjacent to the second circuit layer is exposed to the Outside the insulating ink and defined as a second circuit addition area; the composite circuit board further includes a second additional circuit connected and coplanar on the second circuit layer, and the second circuit layer Formed on the second circuit addition area of the ceramic block. The composite circuit board according to claim 8, wherein the thickness of the first circuit layer and the thickness of the second circuit layer are each at least 200 micrometers (μm), and the thickness of the first additional circuit is less than The thickness of the first circuit layer, and the thickness of the second additional circuit is smaller than the thickness of the second circuit layer.

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