1274029 九、發明說明: 【發明所屬之技術領域】 本之細峨·職嫩節省成 【先前技術】 制心在現今,業者於積體電路(integrated circuit,簡稱I c) 3完成後、’均會利用-i C檢測機執行電路檢測作業,以檢測1274029 IX. Description of the invention: [Technical field to which the invention belongs] This article is a technical and technical work. [Previous technology] The heart is now, after the completion of the integrated circuit (Ic) 3, Will use the -i C detector to perform circuit test operations to detect
示程中是否損壞而淘汰出不良品’請參閱第1圖所 mi前申請之台灣第9i2iG786號「ig檢測機之運送裝 iii ϋί有—供料架1,用以容納至少—盛裝待測Ic =盤’-左懸臂取放機構2係帶動取放器3作第一方向(如χ 作第:方向)位移至供料架1處,令取放器3 至t ,移將料盤中之待測1 c取出,並移載 6轉運機構4之載口 5上,該轉運機構4係令载台5作第二方 載至數組檢測台6處,一右懸臂取放機構 8==2=二二方向位移至載台5上方’令取放器 向移將载台5上之待測1c取出,並移載至-檢測 業,於檢測完畢後,該右懸臂取 ⑬向r復位,該左懸 自動化檢測作業,·惟’該檢測機於使用上仍有未^理想之 1 2峨仙錄臂取放機構7於檢測纟6及轉 1 c ’此將導致當右懸臂取放機構 c動作時,若轉運機構4之載 二5 t載运剌I C至檢測台6處,則該載台5即必須 ί 出完測1。之動作後,方可將待測 IC由載台5上取出,致使檢測台6及載台5均需等待右懸 1274029 臂取放機構7到達該處後方可執行取、放待測/完測1〇動 作,進而增加作業等待時間,造成整個檢測製程 低生產效能。 牛 2 ·該檢峨係財㈣取放機構2及錢f取放機構7分 ΐ供料及於檢測台6取、放料之動作,造成增加元件成 本之缺失。 3 · 係於供料架1與檢測台6間裝配有左懸臂取放機構 2及右懸臂取放機構7,以致組裝繁5貞而耗f時間 低生產率之缺失。 人干 4 · 於供料架1與檢測台6間褒配有左懸臂取放機構 ^及右㈣取放機構7 ’造成增加機器體積而侧空間 天0 【發明内容】 穿晋之目的―,係提供—種1 〇檢測機㈠,俾以使移料 毋須等待^ίϊ可於載达裝置處錢取、放細/完測1 c, 減元=;省=二r機(-)’俾以有效縮 減裝;於俾以有效縮 第-本發明係提供—種1 c檢測機㈠,包含: 第賴以容納至少一盛裝待測1 c之料盤; ^係用以容納至少一盛裝完測1 °之料盤; 、^有數組測試器及取放機構’各測試器侧以測試 IC ’而取放機構則可作第二方向位移用以取、放待 6 1274029 測/完測Ic; 至少一载送裝置:係設於測試裝置前方, ’以供取、放待測;ί測冗動於各測試器處 移枓裝置:係用以於第一、—¥祖 完測IC。 一置枓裝置及載达裝置間移戴待測/ 上述I c檢測機(-),該第—置料裝 =機構讀賴構,棘置麵侧樣喊構、 :,移麵作第二方向位“==移= —二置該機第構:=含—有承置, :則用以移載料盤作第二方向位移至預設錄向:移= 取、放待測/完測I c。 冉久移枓裝置 士述If檢,機㈠’該移料裝置更包含有驅動機 動,放器作第-、二方向位移,並以取放器作第三方向而 於第-、二置料裝置及載送裝置間取、放待測/完測I C。 I j述I C檢測機㈠’更包含有加熱裝置,_以加熱待測 上述I C檢測機(-)’更包含有空盤置盤裝置,係用以 料盤。 、二的 【實施方式】 為使貴審查委員對本發明作更進一步之瞭解,茲舉一 實施例並配合圖式,詳述如后: 权佳 請參閱第2圖所示,係為本發明執行J c檢測之—種實施 7 1274029 例,包含: 第-置料裝置1 Q ··其承置機構i 以容納至少— ϋϊ料盤,該托盤機構12係用以承: 瓜作第二方向位移,而將料盤擺置於一 第二置料裝置2 〇 土 ’該輸送機構13則可移载4: 作第一方向位移至預設位置以供取料.现 ·· f承置機構2 1係用以容納至盛穿 飽盤機構2 2S料 皿忭弟二方向位移,而將料盤 ’ 测試裝置3 〇 機構各 第一移載裝置40 3 2則可轉取放n3 3作第 •以移载_/調1C,· 位_ 裝置3 Q之左側數、_試器3 1 士丄並以驅動機構41驅動载台4 2作 向位移而移動於各組測試器31間, 第二移载裝置5 n .,以移载待測/完測IC ; .戦裝置3 Q之右織 匕並以驅動機構51驅動載H 用以而移動於各組測試器3 1間, 移料裝置6 0 .f载待測/完测1C ; -、移ϊΐ詈二/η料裝置1 〇、2 〇及第-、 以? 5〇間用以移載待測/ 器楚,、係以驅動機構6 1驅動取放 加熱裝置7 〇 6 2βΜ-二二二方向位移,並以取放器 移用以取、放以; 置枓波置1 〇之侧方,用以加熱 1274029 空盤置盤裝置s。·巧?1c ; 〇·係設於第—置料裝置 動機構81 q之另财,係以移 8 2:以=—用以承置空料盤之承板 請參閱第3圖所示 3入待測1c以供檢測,而第0之各測試器31中 2以容納至少-盛裝待測Ic之ίί 1〇之承置機構11 =作第三方向位移而移載至^= i,托盤機構1 2承載 ,运料盤作第二方向位二上’該輸送機構工3 料,該移料裝置6 〇係以驅動^又位^以供移料裝置6 〇取 :=ϊίΓ置料裝置10之料盤:以1=:第 位移而由料盤中取出 ^2作第 先擺置於 動取放器6 2作‘一、一;置2再以驅動機構6 1帶 測!’載至^載送=4向=載二將=裝置了。處之待 1閱第5圖所示,該已承載待測工 工即以驅動機構41驅動載台42作第一方向 為裝置3 0之-測試ns 1之前方,該測試器3 ] 玫機構3 2即可先帶動取放器3 3位移至測試器3^、# 檢測完畢之完測IC取出,並將完測IC擺置^第― 匕0之載台4 2上,以供載台4 2載出,^此時,該“ 裝置6 0因毋須將待測I C移入於測試裝置3 〇之測試哭 3 1中,係可以驅動機構61帶動取放器6 2直接位'移 一置料裝置1 0之料盤處,再次取出下一待測I C ; 請參閱第6圖所示,該第一載送裝置4 0係令驅動機構4 i 驅動载台4 2再作第一方向位移,令载台4 2之待測I^位於測 試裴置3 0之取放器3 3下方,該取放器3 3即將戴台4 2中/之 待測I C取出,以便移載至測試器3 1*處,此時,該移料裝置 1274029 6^則以驅動機構61驅動取放器6 2位 2一載达裝置5◦之载台5 2處,以供L3待剛1C取放 置3 0之右側方其—測試 而、:2移載至測 取、放料作業時間; 可即嗜移料裝置6〇^ 请參閱第7圖所示,該測試萝署q 動;取,3 3位移至峨器3 ;2方0^=機構3 2係驅 1中,以供測試器31檢測,該測ί C壓入於 預設位置,此時,該第二載 Z/Jf凡測I C载出至 ί 放機構3 2以取放器3 3將測試器、;,f共 待測I C ; I锻置1 G之健處,而再次取出下一 取放3 =圖所=移料裝置6 〇再以驅動機構6 1驅動 辦i ^ rtt、—方向位移,而將下—待測1 C移载至第-^裝置4 0之载台4 2上,並將載台4 2上之完測ϊ ^取出, 器3 ⑽台5 2則將待測1 C移載至取放 ^參閱第9圖所示,該第-載送裝置4 〇係以驅動機 載台$將下—待測I C依序載送至測試裝置3 他測減器31處,而移料裝置6 〇則以取放機構61驅動取放器 6 2位移至第二置料裝置2 〇處,令取放器6 2將完測Iς依不 同檢測等級而擺置於適當料盤中收置,此時,該第二载送裝置 5 0係以驅動機構51驅動載台5 2將完測IC载出,達到自動 化檢測I C作業,再者,當第一置料裝置1〇上之料盤,其盛裝 之I C被取用完畢後,係可將空料盤擺置於空盤置盤裝置8' 〇之 承板8 2上,而承板8 2亦可供擺置不同顏色之空料盤,而作為 1274029 補充第二置料裝置2 〇用以盛裝完測I C之料盤,達到便利 及補置空料盤之實用效益。 5置 【圖式簡單說明】 第1圖:習式第91210786號之示意圖。 第2圖:本發明之各裝置架構示意圖。 第3圖:係移料裝置取出待測I c之使用示意圖。 第4圖··係移料裝置將待測】〇擺置於第一截详 第5圖:係第一載送裝置供測試裝置之取玫椹^置之示意圖。 示意圖。 攝襬置完測IC之 第6圖::圖載送裝置供測試裝置之取放機構μ待測“之 第7圖:係測試裝置之取放機構將待測τ 圖。 I入於測試器之示意 圖·係移料裝置於第一載送裝置之栽台上 IC之示意圖。 放完測/待測 第9圖:係移料裝置將完測I C擺置於第二置粗 示意圖。 y叶裝置收料之使用 第8 【主要元件符號說明】 〔習式〕 供料架:1 取放器:3 載台:5 右懸臂取放機構: 收料架:9 〔本發明〕 第一置料裝置:1 把盤機構:12 第一置料裝置:2 托盤機構:2 2 7 0 0 左懸臂取放機構:2 轉運機構:4 檢測台:6 取放器:8 承置機構: 輸送機構: 承置機構: 輸送機構: 11 1274029 測試裝置:3 0 取放機構:3 2 第一移載裝置:4 0 載台:4 2 第二移載裝置:5 0 載台:5 2 移料裝置:6 0 取放器:6 2 加熱裝置:7 0 空盤置盤裝置:8 0 承板:8 2 測試器:31 取放器:3 3 驅動機構:41 驅動機構:51 驅動機構:61 移動機構:81If there is any damage in the process, the defective product will be eliminated. Please refer to Taiwan's No. 9i2iG786 before the application of the first image. ig ig ϋ 有 有 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供=Disk'-The left cantilever pick-and-place mechanism 2 drives the pick and place device 3 to move to the feeding frame 1 in the first direction (for example, the direction: direction), so that the pick-and-placer 3 to t are moved in the tray The 1c to be tested is taken out and transferred to the carrier 5 of the 6-transport mechanism 4. The transport mechanism 4 is used to cause the stage 5 to be carried by the second side to the array detecting station 6, and a right cantilever pick-and-place mechanism 8==2 = 2nd direction displacement to the top of the stage 5 'The picker is removed and the 1c to be tested on the stage 5 is taken out and transferred to the detection industry. After the detection is completed, the right cantilever is reset by 13 to r. The left-hanging automatic inspection operation, ·only the detector is still in use, the ideal 1 2 峨 录 臂 取 取 取 于 于 于 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及When c is in operation, if the carrier 5 of the transport mechanism 4 carries the 剌IC to the test station 6, the stage 5 must be completed. After the action, the IC to be tested can be used by the stage. 5 is taken out, so that both the test stand 6 and the stage 5 need to wait for the right suspension 1274029. After the arm pick-and-place mechanism 7 reaches the position, the action can be taken, placed, and tested for 1 ,, thereby increasing the waiting time of the work, resulting in the entire test. The process has low production efficiency. Niu 2 · The inspection system is based on (4) pick-and-place mechanism 2 and money f pick-and-place mechanism 7 minutes feeding and the action of taking and discharging the inspection station 6, resulting in an increase in component cost. The left cantilever pick-and-place mechanism 2 and the right cantilever pick-and-place mechanism 7 are assembled between the feeding rack 1 and the detecting table 6, so that the assembly is complicated and the time is low and the productivity is lacking. The human dry 4 · in the feeding rack 1 The detection table 6 is equipped with a left cantilever pick-and-place mechanism ^ and a right (four) pick-and-place mechanism 7' to increase the volume of the machine and the side space is 0 [invention content] The purpose of the thread is to provide a type 1 detection machine (1),俾 so that the transfer does not have to wait ^ίϊ can be taken at the loading device, fine/complete 1 c, minus yuan =; province = two r machine (-) '俾 to effectively reduce the load; The first aspect of the present invention provides a 1 c detecting machine (1) comprising: a first lining to accommodate at least one tray for holding 1 c to be tested ^ is used to accommodate at least one tray that has been tested for 1 °; , ^ has an array tester and pick and place mechanism 'tester side to test IC' and pick and place mechanism can be used for second direction displacement 6 1274029 test / complete test Ic; at least one carrier device: set in front of the test device, 'to feed, put for test; 测 measure redundancy at each tester transfer device: used for the first 1. The ancestor completes the test IC. The device is placed between the device and the carrier device to be tested. The above I c detector (-), the first-loading device = the mechanism to read the structure, the side of the ratchet Structure, :, shifting the surface as the second direction bit "==shift = - two sets the machine structure: = contains - there is bearing, : then the transfer tray is used for the second direction displacement to the preset direction: Shift = Take, put, and test I c.冉 枓 If If If If If, machine (1) 'The moving device also contains the drive maneuver, the device for the first -, second direction displacement, and the pick and place for the third direction The IC to be tested/completed is taken between the device and the carrier device. Ij The I C detector (1) further includes a heating device, _ to heat the above-mentioned I C detector (-)', and further includes an empty disk arranging device for the tray. [Embodiment] In order to make the reviewer further understand the present invention, an embodiment will be described in conjunction with the drawings, and the details are as follows: 权佳, see Figure 2, is the implementation of the present invention. J c detection of the implementation of 7 1274029, including: the first - placement device 1 Q · its mounting mechanism i to accommodate at least - the tray, the tray mechanism 12 is used to: melon for the second direction of displacement And the tray is placed on a second loading device 2, the soil is transported, and the conveying mechanism 13 is transported 4: the first direction is displaced to a preset position for taking the material. The current f-maintaining mechanism 2 1 series is used to accommodate the displacement of the 2 2S dish in the full-loading mechanism 2, and the first transfer device 40 3 2 of the tray 'test device 3 〇 mechanism can be transferred to n3 3 for the first • Move 1/, 1C, · bit_ left side of device 3 Q, _ tester 3 1 丄, and drive stage 4 2 by drive mechanism 41 to move between groups of testers 31, The second transfer device 5 n . is used to transfer the IC to be tested/tested; the right woven device of the device 3 Q and the drive H is driven by the drive mechanism 51 for moving in each group test 3 a, the mobile carrier feed means 6 0 .f test / measurement End 1C; -, two shift ϊΐ curse / [eta] 1 billion feed means, second square 2 - to? 5〇 is used to transfer the device to be tested, and the driving mechanism 6 1 drives the pick-and-place heating device 7 〇6 2βΜ-22nd direction displacement, and is moved by the pick and place device for taking and placing; The chopper is placed on the side of the , to heat the 1274029 empty disk arranging device s. · Qiao? 1c ; 〇 · is set in the first - loading device moving mechanism 81 q of the other money, is to move 8 2: to = - to support the empty tray of the board, please refer to Figure 3 3 into the test 1c for detection, and 2 of the 0th testers 31 are accommodated at least - the mounting mechanism 11 containing the Ic to be tested 1 = displaced in the third direction and transferred to ^ = i, the tray mechanism 1 2 Carrying, the feeding tray is in the second direction, and the conveying mechanism 6 is driven to be used for the loading device 6 to capture: = ϊ Γ Γ Γ Γ Γ Γ Disk: Take 1=: the first displacement and take out ^2 from the tray as the first pendulum placed on the movable pick-and-placer 6 2 for 'one, one; set 2 and then drive the mechanism 6 1 with the test!' Send = 4 = = 2 will be = device. As shown in Fig. 5, the load-bearing worker is driven by the drive mechanism 41 to drive the stage 42 as the first direction as the device 30-test ns1, the tester 3] 3 2 can first drive the pick and place device 3 3 to the tester 3^, # The completed test IC is taken out, and the finished IC is placed on the stage 20 之0 for the stage 4 2, ^, at this time, the "device 60 because the test IC is not required to move into the test device 3 〇 test cry 3 1 , the drive mechanism 61 can drive the pick-and-place device 6 2 direct bit 'shift one At the tray of the material device 10, the next IC to be tested is taken out again; as shown in Fig. 6, the first carrier device 40 causes the driving mechanism 4 i to drive the stage 4 2 to be displaced in the first direction. , the I/O of the stage 4 2 is located under the pick-up unit 3 3 of the test set 30, and the pick-up unit 3 3 is to take out the IC to be tested in the stage 4 2 for transfer to the tester. 3 1*, at this time, the loading device 1274029 6^ drives the pick-and-place device 6 2 position 2 to the loading station 5 2 of the loading device 5 to drive the L3 to be placed in the 1C. 0 on the right side of the test - and: 2 transfer Measuring and discharging operation time; can be called the mobile device 6〇^ Please refer to Figure 7, the test is carried out; take, 3 3 displacement to the device 3; 2 square 0^= mechanism 3 2 The drive 1 is detected by the tester 31, and the test C is pressed into the preset position. At this time, the second load Z/Jf test IC is carried out to the pick-up mechanism 3 2 to pick up the device 3 3 The tester, ;, f is to be tested IC; I forge 1 G of the health, and take out the next pick and place 3 = map = transfer device 6 〇 drive mechanism 6 1 to drive i ^ rtt, - directional displacement, and the lower - to-be-tested 1 C is transferred to the stage 4 2 of the -^ device 40, and the measurement on the stage 4 2 is taken out, and the 3 (10) stage 5 2 will be 1 C is transferred to the pick-and-place. Referring to Figure 9, the first-carrier device 4 is driven to drive the platform. The next-to-be-tested IC is sequentially carried to the test device. At 31, the picking device 6 驱动 drives the pick-and-place device 6 2 to the second loading device 2 以 by the pick-and-place mechanism 61, so that the pick-and-place device 6 2 places the test I ς according to different detection levels. The tray is placed in a suitable tray. At this time, the second carrier device 50 is driven by the drive mechanism 51. The station 5 2 will carry out the test IC to achieve the automatic detection IC operation. Furthermore, when the tray on the first loading device 1 is used, the installed IC can be placed after the IC is taken. On the carrier plate 8 2 of the empty disk tray device 8', the carrier plate 8 2 can also be used for placing empty trays of different colors, and as a 1274029 supplemental second loading device 2 for holding the test IC The trays are used to facilitate and replenish the practical benefits of empty trays. 5 set [Simplified description of the diagram] Figure 1: Schematic diagram of the formula No. 91210786. Fig. 2 is a schematic view showing the structure of each device of the present invention. Fig. 3 is a schematic view showing the use of the Ic to be tested by the transfer device. Figure 4 ········································································· schematic diagram. Figure 6 of the test completion IC:: Figure carrier device for the pick-and-place mechanism of the test device μ to be tested" Figure 7: The pick-and-place mechanism of the test device will be measured τ map. I enter the tester Schematic diagram of the IC of the material transfer device on the planting station of the first carrier device. Release test/test to be carried out in Fig. 9: The system of the transfer device places the measurement IC on the second rough layout. Use of equipment receipts 8th [Main component symbol description] [Live] Feeding rack: 1 Pick and place: 3 Stage: 5 Right cantilever pick-and-place mechanism: Receiving rack: 9 [Invention] First stock Device: 1 disk mechanism: 12 first loading device: 2 tray mechanism: 2 2 7 0 0 left cantilever pick-and-place mechanism: 2 transfer mechanism: 4 test station: 6 pick-and-place: 8 holding mechanism: conveying mechanism: Holding mechanism: Conveying mechanism: 11 1274029 Test device: 3 0 Pick-and-place mechanism: 3 2 First transfer device: 4 0 Stage: 4 2 Second transfer device: 5 0 Stage: 5 2 Transfer device: 6 0 Pick and place: 6 2 Heating device: 7 0 Empty disk setting device: 8 0 Carrier plate: 8 2 Tester: 31 Pick and place: 3 3 Drive mechanism: 41 drive Moving mechanism: 51 Drive mechanism: 61 Moving mechanism: 81
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