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TWI274029B - Testing machine for integrated circuits - Google Patents

Testing machine for integrated circuits Download PDF

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Publication number
TWI274029B
TWI274029B TW95109049A TW95109049A TWI274029B TW I274029 B TWI274029 B TW I274029B TW 95109049 A TW95109049 A TW 95109049A TW 95109049 A TW95109049 A TW 95109049A TW I274029 B TWI274029 B TW I274029B
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TW
Taiwan
Prior art keywords
test
tray
pick
tested
place
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TW95109049A
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Chinese (zh)
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TW200736135A (en
Inventor
Xi-Yi Lin
Jia-Zhang Yang
Original Assignee
Hon Tech Inc
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Priority to TW95109049A priority Critical patent/TWI274029B/en
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Publication of TWI274029B publication Critical patent/TWI274029B/en
Publication of TW200736135A publication Critical patent/TW200736135A/en

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  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

The present invention relates to a testing machine for integrated circuits, which comprises a first feeding means provided with at least one holding tray, wherein said at least holding tray is used to hold untested integrated circuits thereon; a passing means used to pick untested integrated circuits and then place them onto a first carrying means and a second carrying means, respectively; a testing means having a plurality of testing apparatus and pick-and-place mechanisms which are respectively arranged at back side of the first and the second carrying mechanism, wherein the respective pick-and-place mechanisms can place tested integrated circuits onto the first and the second carrying mechanism, respectively, and then pick other untested integrated circuits of the first and the second carrying mechanism onto the testing apparatus so as to have a testing process. In addition, the first and the second carrying means can transport tested integrated circuits to the passing means by which said tested integrated circuits can be picked out, then other untested integrated circuits will be placed onto the first and the second carrying means so as to be tested, also, the passing means will further transmit the tested integrated circuits to a second collection means for storage, thereby enabling to enhance the production efficiency.

Description

1274029 九、發明說明: 【發明所屬之技術領域】 本之細峨·職嫩節省成 【先前技術】 制心在現今,業者於積體電路(integrated circuit,簡稱I c) 3完成後、’均會利用-i C檢測機執行電路檢測作業,以檢測1274029 IX. Description of the invention: [Technical field to which the invention belongs] This article is a technical and technical work. [Previous technology] The heart is now, after the completion of the integrated circuit (Ic) 3, Will use the -i C detector to perform circuit test operations to detect

示程中是否損壞而淘汰出不良品’請參閱第1圖所 mi前申請之台灣第9i2iG786號「ig檢測機之運送裝 iii ϋί有—供料架1,用以容納至少—盛裝待測Ic =盤’-左懸臂取放機構2係帶動取放器3作第一方向(如χ 作第:方向)位移至供料架1處,令取放器3 至t ,移將料盤中之待測1 c取出,並移載 6轉運機構4之載口 5上,該轉運機構4係令载台5作第二方 載至數組檢測台6處,一右懸臂取放機構 8==2=二二方向位移至載台5上方’令取放器 向移將载台5上之待測1c取出,並移載至-檢測 業,於檢測完畢後,該右懸臂取 ⑬向r復位,該左懸 自動化檢測作業,·惟’該檢測機於使用上仍有未^理想之 1 2峨仙錄臂取放機構7於檢測纟6及轉 1 c ’此將導致當右懸臂取放機構 c動作時,若轉運機構4之載 二5 t載运剌I C至檢測台6處,則該載台5即必須 ί 出完測1。之動作後,方可將待測 IC由載台5上取出,致使檢測台6及載台5均需等待右懸 1274029 臂取放機構7到達該處後方可執行取、放待測/完測1〇動 作,進而增加作業等待時間,造成整個檢測製程 低生產效能。 牛 2 ·該檢峨係財㈣取放機構2及錢f取放機構7分 ΐ供料及於檢測台6取、放料之動作,造成增加元件成 本之缺失。 3 · 係於供料架1與檢測台6間裝配有左懸臂取放機構 2及右懸臂取放機構7,以致組裝繁5貞而耗f時間 低生產率之缺失。 人干 4 · 於供料架1與檢測台6間褒配有左懸臂取放機構 ^及右㈣取放機構7 ’造成增加機器體積而侧空間 天0 【發明内容】 穿晋之目的―,係提供—種1 〇檢測機㈠,俾以使移料 毋須等待^ίϊ可於載达裝置處錢取、放細/完測1 c, 減元=;省=二r機(-)’俾以有效縮 減裝;於俾以有效縮 第-本發明係提供—種1 c檢測機㈠,包含: 第賴以容納至少一盛裝待測1 c之料盤; ^係用以容納至少一盛裝完測1 °之料盤; 、^有數組測試器及取放機構’各測試器侧以測試 IC ’而取放機構則可作第二方向位移用以取、放待 6 1274029 測/完測Ic; 至少一载送裝置:係設於測試裝置前方, ’以供取、放待測;ί測冗動於各測試器處 移枓裝置:係用以於第一、—¥祖 完測IC。 一置枓裝置及載达裝置間移戴待測/ 上述I c檢測機(-),該第—置料裝 =機構讀賴構,棘置麵侧樣喊構、 :,移麵作第二方向位“==移= —二置該機第構:=含—有承置, :則用以移載料盤作第二方向位移至預設錄向:移= 取、放待測/完測I c。 冉久移枓裝置 士述If檢,機㈠’該移料裝置更包含有驅動機 動,放器作第-、二方向位移,並以取放器作第三方向而 於第-、二置料裝置及載送裝置間取、放待測/完測I C。 I j述I C檢測機㈠’更包含有加熱裝置,_以加熱待測 上述I C檢測機(-)’更包含有空盤置盤裝置,係用以 料盤。 、二的 【實施方式】 為使貴審查委員對本發明作更進一步之瞭解,茲舉一 實施例並配合圖式,詳述如后: 权佳 請參閱第2圖所示,係為本發明執行J c檢測之—種實施 7 1274029 例,包含: 第-置料裝置1 Q ··其承置機構i 以容納至少— ϋϊ料盤,該托盤機構12係用以承: 瓜作第二方向位移,而將料盤擺置於一 第二置料裝置2 〇 土 ’該輸送機構13則可移载4: 作第一方向位移至預設位置以供取料.现 ·· f承置機構2 1係用以容納至盛穿 飽盤機構2 2S料 皿忭弟二方向位移,而將料盤 ’ 测試裝置3 〇 機構各 第一移載裝置40 3 2則可轉取放n3 3作第 •以移载_/調1C,· 位_ 裝置3 Q之左側數、_試器3 1 士丄並以驅動機構41驅動载台4 2作 向位移而移動於各組測試器31間, 第二移载裝置5 n .,以移载待測/完測IC ; .戦裝置3 Q之右織 匕並以驅動機構51驅動載H 用以而移動於各組測試器3 1間, 移料裝置6 0 .f载待測/完测1C ; -、移ϊΐ詈二/η料裝置1 〇、2 〇及第-、 以? 5〇間用以移載待測/ 器楚,、係以驅動機構6 1驅動取放 加熱裝置7 〇 6 2βΜ-二二二方向位移,並以取放器 移用以取、放以; 置枓波置1 〇之侧方,用以加熱 1274029 空盤置盤裝置s。·巧?1c ; 〇·係設於第—置料裝置 動機構81 q之另财,係以移 8 2:以=—用以承置空料盤之承板 請參閱第3圖所示 3入待測1c以供檢測,而第0之各測試器31中 2以容納至少-盛裝待測Ic之ίί 1〇之承置機構11 =作第三方向位移而移載至^= i,托盤機構1 2承載 ,运料盤作第二方向位二上’該輸送機構工3 料,該移料裝置6 〇係以驅動^又位^以供移料裝置6 〇取 :=ϊίΓ置料裝置10之料盤:以1=:第 位移而由料盤中取出 ^2作第 先擺置於 動取放器6 2作‘一、一;置2再以驅動機構6 1帶 測!’載至^載送=4向=載二將=裝置了。處之待 1閱第5圖所示,該已承載待測工 工即以驅動機構41驅動載台42作第一方向 為裝置3 0之-測試ns 1之前方,該測試器3 ] 玫機構3 2即可先帶動取放器3 3位移至測試器3^、# 檢測完畢之完測IC取出,並將完測IC擺置^第― 匕0之載台4 2上,以供載台4 2載出,^此時,該“ 裝置6 0因毋須將待測I C移入於測試裝置3 〇之測試哭 3 1中,係可以驅動機構61帶動取放器6 2直接位'移 一置料裝置1 0之料盤處,再次取出下一待測I C ; 請參閱第6圖所示,該第一載送裝置4 0係令驅動機構4 i 驅動载台4 2再作第一方向位移,令载台4 2之待測I^位於測 試裴置3 0之取放器3 3下方,該取放器3 3即將戴台4 2中/之 待測I C取出,以便移載至測試器3 1*處,此時,該移料裝置 1274029 6^則以驅動機構61驅動取放器6 2位 2一載达裝置5◦之载台5 2處,以供L3待剛1C取放 置3 0之右側方其—測試 而、:2移載至測 取、放料作業時間; 可即嗜移料裝置6〇^ 请參閱第7圖所示,該測試萝署q 動;取,3 3位移至峨器3 ;2方0^=機構3 2係驅 1中,以供測試器31檢測,該測ί C壓入於 預設位置,此時,該第二載 Z/Jf凡測I C载出至 ί 放機構3 2以取放器3 3將測試器、;,f共 待測I C ; I锻置1 G之健處,而再次取出下一 取放3 =圖所=移料裝置6 〇再以驅動機構6 1驅動 辦i ^ rtt、—方向位移,而將下—待測1 C移载至第-^裝置4 0之载台4 2上,並將載台4 2上之完測ϊ ^取出, 器3 ⑽台5 2則將待測1 C移載至取放 ^參閱第9圖所示,該第-載送裝置4 〇係以驅動機 載台$將下—待測I C依序載送至測試裝置3 他測減器31處,而移料裝置6 〇則以取放機構61驅動取放器 6 2位移至第二置料裝置2 〇處,令取放器6 2將完測Iς依不 同檢測等級而擺置於適當料盤中收置,此時,該第二载送裝置 5 0係以驅動機構51驅動載台5 2將完測IC载出,達到自動 化檢測I C作業,再者,當第一置料裝置1〇上之料盤,其盛裝 之I C被取用完畢後,係可將空料盤擺置於空盤置盤裝置8' 〇之 承板8 2上,而承板8 2亦可供擺置不同顏色之空料盤,而作為 1274029 補充第二置料裝置2 〇用以盛裝完測I C之料盤,達到便利 及補置空料盤之實用效益。 5置 【圖式簡單說明】 第1圖:習式第91210786號之示意圖。 第2圖:本發明之各裝置架構示意圖。 第3圖:係移料裝置取出待測I c之使用示意圖。 第4圖··係移料裝置將待測】〇擺置於第一截详 第5圖:係第一載送裝置供測試裝置之取玫椹^置之示意圖。 示意圖。 攝襬置完測IC之 第6圖::圖載送裝置供測試裝置之取放機構μ待測“之 第7圖:係測試裝置之取放機構將待測τ 圖。 I入於測試器之示意 圖·係移料裝置於第一載送裝置之栽台上 IC之示意圖。 放完測/待測 第9圖:係移料裝置將完測I C擺置於第二置粗 示意圖。 y叶裝置收料之使用 第8 【主要元件符號說明】 〔習式〕 供料架:1 取放器:3 載台:5 右懸臂取放機構: 收料架:9 〔本發明〕 第一置料裝置:1 把盤機構:12 第一置料裝置:2 托盤機構:2 2 7 0 0 左懸臂取放機構:2 轉運機構:4 檢測台:6 取放器:8 承置機構: 輸送機構: 承置機構: 輸送機構: 11 1274029 測試裝置:3 0 取放機構:3 2 第一移載裝置:4 0 載台:4 2 第二移載裝置:5 0 載台:5 2 移料裝置:6 0 取放器:6 2 加熱裝置:7 0 空盤置盤裝置:8 0 承板:8 2 測試器:31 取放器:3 3 驅動機構:41 驅動機構:51 驅動機構:61 移動機構:81If there is any damage in the process, the defective product will be eliminated. Please refer to Taiwan's No. 9i2iG786 before the application of the first image. ig ig ϋ 有 有 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供=Disk'-The left cantilever pick-and-place mechanism 2 drives the pick and place device 3 to move to the feeding frame 1 in the first direction (for example, the direction: direction), so that the pick-and-placer 3 to t are moved in the tray The 1c to be tested is taken out and transferred to the carrier 5 of the 6-transport mechanism 4. The transport mechanism 4 is used to cause the stage 5 to be carried by the second side to the array detecting station 6, and a right cantilever pick-and-place mechanism 8==2 = 2nd direction displacement to the top of the stage 5 'The picker is removed and the 1c to be tested on the stage 5 is taken out and transferred to the detection industry. After the detection is completed, the right cantilever is reset by 13 to r. The left-hanging automatic inspection operation, ·only the detector is still in use, the ideal 1 2 峨 录 臂 取 取 取 于 于 于 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及When c is in operation, if the carrier 5 of the transport mechanism 4 carries the 剌IC to the test station 6, the stage 5 must be completed. After the action, the IC to be tested can be used by the stage. 5 is taken out, so that both the test stand 6 and the stage 5 need to wait for the right suspension 1274029. After the arm pick-and-place mechanism 7 reaches the position, the action can be taken, placed, and tested for 1 ,, thereby increasing the waiting time of the work, resulting in the entire test. The process has low production efficiency. Niu 2 · The inspection system is based on (4) pick-and-place mechanism 2 and money f pick-and-place mechanism 7 minutes feeding and the action of taking and discharging the inspection station 6, resulting in an increase in component cost. The left cantilever pick-and-place mechanism 2 and the right cantilever pick-and-place mechanism 7 are assembled between the feeding rack 1 and the detecting table 6, so that the assembly is complicated and the time is low and the productivity is lacking. The human dry 4 · in the feeding rack 1 The detection table 6 is equipped with a left cantilever pick-and-place mechanism ^ and a right (four) pick-and-place mechanism 7' to increase the volume of the machine and the side space is 0 [invention content] The purpose of the thread is to provide a type 1 detection machine (1),俾 so that the transfer does not have to wait ^ίϊ can be taken at the loading device, fine/complete 1 c, minus yuan =; province = two r machine (-) '俾 to effectively reduce the load; The first aspect of the present invention provides a 1 c detecting machine (1) comprising: a first lining to accommodate at least one tray for holding 1 c to be tested ^ is used to accommodate at least one tray that has been tested for 1 °; , ^ has an array tester and pick and place mechanism 'tester side to test IC' and pick and place mechanism can be used for second direction displacement 6 1274029 test / complete test Ic; at least one carrier device: set in front of the test device, 'to feed, put for test; 测 measure redundancy at each tester transfer device: used for the first 1. The ancestor completes the test IC. The device is placed between the device and the carrier device to be tested. The above I c detector (-), the first-loading device = the mechanism to read the structure, the side of the ratchet Structure, :, shifting the surface as the second direction bit "==shift = - two sets the machine structure: = contains - there is bearing, : then the transfer tray is used for the second direction displacement to the preset direction: Shift = Take, put, and test I c.冉 枓 If If If If If, machine (1) 'The moving device also contains the drive maneuver, the device for the first -, second direction displacement, and the pick and place for the third direction The IC to be tested/completed is taken between the device and the carrier device. Ij The I C detector (1) further includes a heating device, _ to heat the above-mentioned I C detector (-)', and further includes an empty disk arranging device for the tray. [Embodiment] In order to make the reviewer further understand the present invention, an embodiment will be described in conjunction with the drawings, and the details are as follows: 权佳, see Figure 2, is the implementation of the present invention. J c detection of the implementation of 7 1274029, including: the first - placement device 1 Q · its mounting mechanism i to accommodate at least - the tray, the tray mechanism 12 is used to: melon for the second direction of displacement And the tray is placed on a second loading device 2, the soil is transported, and the conveying mechanism 13 is transported 4: the first direction is displaced to a preset position for taking the material. The current f-maintaining mechanism 2 1 series is used to accommodate the displacement of the 2 2S dish in the full-loading mechanism 2, and the first transfer device 40 3 2 of the tray 'test device 3 〇 mechanism can be transferred to n3 3 for the first • Move 1/, 1C, · bit_ left side of device 3 Q, _ tester 3 1 丄, and drive stage 4 2 by drive mechanism 41 to move between groups of testers 31, The second transfer device 5 n . is used to transfer the IC to be tested/tested; the right woven device of the device 3 Q and the drive H is driven by the drive mechanism 51 for moving in each group test 3 a, the mobile carrier feed means 6 0 .f test / measurement End 1C; -, two shift ϊΐ curse / [eta] 1 billion feed means, second square 2 - to? 5〇 is used to transfer the device to be tested, and the driving mechanism 6 1 drives the pick-and-place heating device 7 〇6 2βΜ-22nd direction displacement, and is moved by the pick and place device for taking and placing; The chopper is placed on the side of the , to heat the 1274029 empty disk arranging device s. · Qiao? 1c ; 〇 · is set in the first - loading device moving mechanism 81 q of the other money, is to move 8 2: to = - to support the empty tray of the board, please refer to Figure 3 3 into the test 1c for detection, and 2 of the 0th testers 31 are accommodated at least - the mounting mechanism 11 containing the Ic to be tested 1 = displaced in the third direction and transferred to ^ = i, the tray mechanism 1 2 Carrying, the feeding tray is in the second direction, and the conveying mechanism 6 is driven to be used for the loading device 6 to capture: = ϊ Γ Γ Γ Γ Γ Γ Disk: Take 1=: the first displacement and take out ^2 from the tray as the first pendulum placed on the movable pick-and-placer 6 2 for 'one, one; set 2 and then drive the mechanism 6 1 with the test!' Send = 4 = = 2 will be = device. As shown in Fig. 5, the load-bearing worker is driven by the drive mechanism 41 to drive the stage 42 as the first direction as the device 30-test ns1, the tester 3] 3 2 can first drive the pick and place device 3 3 to the tester 3^, # The completed test IC is taken out, and the finished IC is placed on the stage 20 之0 for the stage 4 2, ^, at this time, the "device 60 because the test IC is not required to move into the test device 3 〇 test cry 3 1 , the drive mechanism 61 can drive the pick-and-place device 6 2 direct bit 'shift one At the tray of the material device 10, the next IC to be tested is taken out again; as shown in Fig. 6, the first carrier device 40 causes the driving mechanism 4 i to drive the stage 4 2 to be displaced in the first direction. , the I/O of the stage 4 2 is located under the pick-up unit 3 3 of the test set 30, and the pick-up unit 3 3 is to take out the IC to be tested in the stage 4 2 for transfer to the tester. 3 1*, at this time, the loading device 1274029 6^ drives the pick-and-place device 6 2 position 2 to the loading station 5 2 of the loading device 5 to drive the L3 to be placed in the 1C. 0 on the right side of the test - and: 2 transfer Measuring and discharging operation time; can be called the mobile device 6〇^ Please refer to Figure 7, the test is carried out; take, 3 3 displacement to the device 3; 2 square 0^= mechanism 3 2 The drive 1 is detected by the tester 31, and the test C is pressed into the preset position. At this time, the second load Z/Jf test IC is carried out to the pick-up mechanism 3 2 to pick up the device 3 3 The tester, ;, f is to be tested IC; I forge 1 G of the health, and take out the next pick and place 3 = map = transfer device 6 〇 drive mechanism 6 1 to drive i ^ rtt, - directional displacement, and the lower - to-be-tested 1 C is transferred to the stage 4 2 of the -^ device 40, and the measurement on the stage 4 2 is taken out, and the 3 (10) stage 5 2 will be 1 C is transferred to the pick-and-place. Referring to Figure 9, the first-carrier device 4 is driven to drive the platform. The next-to-be-tested IC is sequentially carried to the test device. At 31, the picking device 6 驱动 drives the pick-and-place device 6 2 to the second loading device 2 以 by the pick-and-place mechanism 61, so that the pick-and-place device 6 2 places the test I ς according to different detection levels. The tray is placed in a suitable tray. At this time, the second carrier device 50 is driven by the drive mechanism 51. The station 5 2 will carry out the test IC to achieve the automatic detection IC operation. Furthermore, when the tray on the first loading device 1 is used, the installed IC can be placed after the IC is taken. On the carrier plate 8 2 of the empty disk tray device 8', the carrier plate 8 2 can also be used for placing empty trays of different colors, and as a 1274029 supplemental second loading device 2 for holding the test IC The trays are used to facilitate and replenish the practical benefits of empty trays. 5 set [Simplified description of the diagram] Figure 1: Schematic diagram of the formula No. 91210786. Fig. 2 is a schematic view showing the structure of each device of the present invention. Fig. 3 is a schematic view showing the use of the Ic to be tested by the transfer device. Figure 4 ········································································· schematic diagram. Figure 6 of the test completion IC:: Figure carrier device for the pick-and-place mechanism of the test device μ to be tested" Figure 7: The pick-and-place mechanism of the test device will be measured τ map. I enter the tester Schematic diagram of the IC of the material transfer device on the planting station of the first carrier device. Release test/test to be carried out in Fig. 9: The system of the transfer device places the measurement IC on the second rough layout. Use of equipment receipts 8th [Main component symbol description] [Live] Feeding rack: 1 Pick and place: 3 Stage: 5 Right cantilever pick-and-place mechanism: Receiving rack: 9 [Invention] First stock Device: 1 disk mechanism: 12 first loading device: 2 tray mechanism: 2 2 7 0 0 left cantilever pick-and-place mechanism: 2 transfer mechanism: 4 test station: 6 pick-and-place: 8 holding mechanism: conveying mechanism: Holding mechanism: Conveying mechanism: 11 1274029 Test device: 3 0 Pick-and-place mechanism: 3 2 First transfer device: 4 0 Stage: 4 2 Second transfer device: 5 0 Stage: 5 2 Transfer device: 6 0 Pick and place: 6 2 Heating device: 7 0 Empty disk setting device: 8 0 Carrier plate: 8 2 Tester: 31 Pick and place: 3 3 Drive mechanism: 41 drive Moving mechanism: 51 Drive mechanism: 61 Moving mechanism: 81

1212

Claims (1)

1274029 1 申請專利範圍: 種I C檢測機(一),包含 第一置料裝置 第二置料裝置 測試裝置1274029 1 Patent application scope: I C detector (1), including the first loading device, the second feeding device, the testing device 係用以容納至少一盛裝待測IC之料盤; 係用以容納至少一盛裝完測IC之料盤; 係設有數組測試器及取放機構,各測I’ 用以測試I C,而取放機構則用以取、^炷 測/完測IC; 双待 至少一载送裝置:係用以於測試裝置之各測試器 /完測 I C ; 移料裝置第一、二置料裝置及载送裝 載待測/完測I c。 依申請專利範圍第1項所述之1〇檢測機㈠, ㈡而輸送機 依申請專利範圍第1項所述之1(:檢測機㈠, 有承置機構、托盤機構及輸送機構,其承置 至ΐ完測1 c之料盤’托盤機構係用 笼㈣—方向位移,峨送機制肋移載料盤作 第-方向轉至預設位置。 秒斯皿1卞 4 ·依申請專利範圍第所述之J⑽測機㈠, 哕 構係驅動取放器作第二方向位移、於^ 忒器及載达裝置間取、放待測/完測I c。 已-^^利範圍第㈣斤述之“檢測機卜卜 該 ϊ::5ίίί於測ΐ裝置之左、右數組測試器前方設有 組測試器間移動用以載送待測/完測ί C。別於左、右數 6 ·依申請專利範圍第5項所述之1(:檢測機(―),其中,該 2 3 13 1274029 7 第一載送裝置係以驅動機構驅動載台作第一 測試裝置及移料裝置分別取、放待測/完測i C。 申請專利範圍第5項所述之1C檢測機(-),其中,該 第^送《置係'以驅動機構驅動載台作第—移= 測試裝置及移料裂置分別取、放待測/完測I c。移而仏 8 .依申請專利範圍第i項所述之1(:檢測機(一),ι中,該 移料裝置係以驅動機構帶動取放器作第一、二 & = 方向位移’俾以於第一、二峨置及載送 裝置間取、放待測/完測I c。The utility model is characterized in that it is used for accommodating at least one tray for holding the IC to be tested; it is for accommodating at least one tray for holding the IC to be tested; and is provided with an array tester and a pick-and-place mechanism, and each test I' is for testing the IC, and taking The release mechanism is used to take, test, and test the IC; the dual-at least one carrier device is used for each tester/test IC of the test device; the first and second load devices of the transfer device and Send the load to be tested/completed I c. According to the 1st detection machine (1), (2) and the conveyor mentioned in the first paragraph of the patent application scope (1): the inspection machine (1), the installation mechanism, the tray mechanism and the conveying mechanism Set to the tray of the 1 c measuring tray 'Tray mechanism system cage (4) - direction displacement, the feeding mechanism rib transfer tray to the first direction to the preset position. Seconds 1 卞 4 · According to the patent application scope The J(10) measuring machine (1) described above, the 哕 structure drives the pick and place device for the second direction displacement, and the 待 忒 及 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、斤说""Detector 卜卜ϊ::5ίίί The left and right array testers in front of the test device are provided with a group tester movement to carry the test/test ί C. Not to the left and right 6 · According to item 5 of the patent application scope (: detection machine (-), wherein the 2 3 13 1274029 7 first carrier device drives the stage as the first test device and the material transfer device by the drive mechanism Take and test the i C separately. Apply the 1C detector (-) described in item 5 of the patent scope, where the The moving mechanism drives the stage as the first shift = the test device and the transfer splitting respectively take and put the test/finish I c. Move and 仏8. According to the scope of the patent application scope i (1: detection machine ( a), in ι, the moving device drives the pick and place device as the first, second & = direction displacement '俾 to take and put the test/end between the first and second devices and the carrier device Test I c. 9·依申請專利範圍第i項所述c檢測機(一) 熱裝置,係用以加熱待測;[C。 10 ·依申請專利範圍第1項所述c檢測機(一), 空盤置盤裝置,係用以容納至少一空料盤。 3 1 1 ·依申請專利範圍第1〇項所述C檢測機(一),1 忒空盤置盤裝置係於一移動機構之上方設有用以承置空 之承板,而使承板可作第二方向位移。 二9. The c detector (1) thermal device according to item i of the patent application scope is used to heat the test to be tested; [C. 10. The c-detector (1) according to item 1 of the patent application scope, the empty disc arranging device is for accommodating at least one empty tray. 3 1 1 · According to the C test machine (1) mentioned in the first paragraph of the patent application scope, 1 忒 盘 置 置 系 系 系 系 系 系 忒 忒 忒 忒 忒 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 C C Displace in the second direction. two 1414
TW95109049A 2006-03-16 2006-03-16 Testing machine for integrated circuits TWI274029B (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102116831A (en) * 2009-12-30 2011-07-06 上海允科自动化有限公司 Integrated circuit (IC) detection device
CN103926480A (en) * 2013-01-10 2014-07-16 致茂电子(苏州)有限公司 Test machine table with dry environment
TWI456220B (en) * 2012-12-27 2014-10-11 Chroma Ate Inc Test apparatus with dry environment

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102116831A (en) * 2009-12-30 2011-07-06 上海允科自动化有限公司 Integrated circuit (IC) detection device
TWI456220B (en) * 2012-12-27 2014-10-11 Chroma Ate Inc Test apparatus with dry environment
CN103926480A (en) * 2013-01-10 2014-07-16 致茂电子(苏州)有限公司 Test machine table with dry environment

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Publication number Publication date
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