九、發明說明： 【發明所屬之技術領域】 本發明尤減提供-_自動化 測及自動分類之作業，進而達贴⑽^錢計讀外觀檢 觀檢測之裝置。 翻有雄升檢測產能之電子元件外 【先前技術】 按，晶片（chip)於製作卜，你# 0 , IKwaferO予以_(Die SawUC^ 取至料盤收置，由於晶片歷經 =勹者==吸 於晶片製作完成後，均會進杆曰H二兩業者為確保製作質， 電路的檢測後，則需再進行外的檢測’於完成内部 吸嘴或外力刮損表面等不失有、電路斷線，及 汰出不良品.。 J缺失進而棟選出良好的晶片，以淘 1圖目卜以外觀檢測機進行檢測，請參閱第 機」發明號「電子耕之外觀檢測 ! 2及出料裝置i 3'=。裝上置二，右裝3 1、檢測裝置 入舰升降機構1 1 2，而可機構1 1 1及 構1 1 2上承置有待測晶片之料將人料ϋ升降機 台1 21位置；請參閱第2 =，至檢測裝置12之檢測 1 2 1上設有可作x—閱厂^該?測裝置1 2係於-檢測台 治具機構1 2 2將承置有待、、丨丨//移之治具機構1 2 2，而可以 之下方，以供檢測器i 2 3’對:;盤盤上移载至檢測器1 2 3 業；請參閱第3圖，料盤A中+^各a 晶片進行外觀檢測作 1 2 2即帶動料盤〜立|至^^曰完畢後，治具機構 圖’出料裳置1 3係設有；升位置；請參 升至預設之收料位置 之出枓匣131，而可上 盤“側方移載’而使料盤A滑移=置二移之= 1333550 1 進而完成檢測晶片外觀之作業。 並於完成後移、將:業’ 於該外觀檢測機上接锖 麻二檢J丨出不良。口時，並無法 之不良品棟選出來，並將 種可全面進行自動化外觀t 趨勢J，如何設計-IX. Description of the invention: [Technical field to which the invention pertains] The present invention provides, in particular, an apparatus for automated measurement and automatic sorting, and further provides a device for detecting (10) money reading appearance inspection. Outside the electronic components that have the ability to detect the production capacity [previous technology] Press, chip (chip) in the production of Bu, you # 0, IKwaferO to _ (Die SawUC^ to the tray, due to the wafer history = = = = = After the wafer is finished, it will enter the rod 曰H two to ensure the quality of the production, after the detection of the circuit, it needs to be tested outside the 'completed internal nozzle or external force scratched surface, etc., circuit Disconnection, and the elimination of defective products. J is missing and then selects a good wafer, and the inspection is performed by the appearance inspection machine. Please refer to the machine "Invention" "Electronic Tillage Appearance Inspection! 2 and Discharge The device i 3'= is mounted on the second, the right device 3 1 , the detecting device is placed in the ship lifting mechanism 1 1 2, and the materials of the wafer to be tested are placed on the mechanism 1 1 1 and the structure 1 1 2 Lift table 1 21 position; please refer to 2 =, to the detection device 12 detection 1 2 1 is available for x-reading factory ^ the measuring device 1 2 is - detecting station fixture mechanism 1 2 2 bearing Hold the fixture, 丨丨// move the fixture mechanism 1 2 2, and below it, for the detector i 2 3' pair:; the tray is transferred to the detection 1 2 3 industry; please refer to Figure 3, +A each of the wafers in the tray A for the appearance inspection 1 2 2 to drive the tray ~ Li | to ^ ^ 曰 after the completion of the fixture mechanism diagram Set 1 3 series; raise position; please go to the preset discharge position of the exit 枓匣 131, and can be placed on the side of the "side shift" and make the tray A slip = set two shift = 1333550 1 In addition, the operation of detecting the appearance of the wafer is completed. After the completion of the operation, the industry will be connected to the appearance inspection machine and the ramie inspection will be performed. If the mouth is not selected, the defective product can not be selected and will be planted. Fully automated look t trend J, how to design -
能，即為業者致力研發;ίί及刀類之作業，以有效提升檢測產 【發明内容】 ^發明之主要目的係提供—種可自動化進行電子 Κϊ巧收於檢測區之另側設有良品交換區、次級品交換區 ^收舰，電子元件於完成檢測作#後，係可移載至交換 t欠器依據檢測結果，將良品交換區料盤上 料盤，使尸” 父換區料盤上之良品補置於良品交換區 ί杜ΪΓ 料盤可進行交換而完全承置為良品之電 m後再由移載器將該承置良品之料盤移載至收料匣收納 你自動化之方式完成電子元件之外觀檢測及自動分類 作業’達到有效提升檢測產能之目的。 本發明之次一目的係提供一種可自動化進 取代人工作業，達到節省人力及作業時間，而降低 成本及提咼生產效率。 本發明之另一目的係提供一種可自動化進行電子元件外觀檢 測之裝置，其交換區之換料器係依據檢測結果自動化的進行移置 分類作業’以取代人工作業，其可避免因人工楝選疏失或技術不 佳而損傷電子元件之外觀，進而降低電子元件之損壞率。 6 1333550 【實施方式】 為使貴審查委員對本發明作更進一 ^ 實施例並配合圖式，說明如后： 乂之瞭解，铋舉一較佳 睛參閱第5圖，本發明係於機台 2 0，以容納至少-承置有胸μ方叹有了升降之供料H 载器2 2係可作第一方向（γ軸向） f 弋-暫置區2 3，該第—_2 = 區2 5及檢測區2 6，檢變？ 12U移载第二暫置 檢測器27可作方2向6:ΐΥ:=^ 件進行外觀檢測，並將檢測_傳= 9 7 ϋ猶# )移載第二移載器28 ’於檢測器 2 7兀成檢測後’第三移載器2 8可將料盤 區2 9及第四暫置區3 〇，該第四暫置區 咖移載之第四移載器31，而可 有 m置區3 3.，另第四移載器3 口 °軸向）移載之第五移载器3 4，以將位於第五 暫料盤2 U向前移載至良品交換區3 5或將位於第 六暫置區3 3之料盤2 1A移載至次級品交無3 6，該次級品交 換區36另側設有-不良品收料區37，以供收納完全損壞之不 良品，一可作第一、二、三方向（X一γ_ζ_)位移而移動於良品 父換區3 5、次級品父換區3 6及不良品收料區3 7間之換料器 3 8 ’其可依據檢測結果將良品交換區3 5之料盤上之次級品移 置於次級vm父換區3 6之料盤或將不良品取出移置於不良品收料 區3 7，並將次級品交換區3 6料盤上之良品補置於良品交換區 3 5之料盤，使得良品交換區3 5之料盤可進行交換而完全承置 為良品之電子元件，為了便於將電子元件準確置於料盤内，良品 7 1333550 品交換區3 6之間的下方設有為CCD之檢查器 器38上之電子元件的角度位置，以控制換料 °，又兮=的修正補償，進而將電子元件準確置於料盤内 載電ΐΖί ί器3 9因設於下雜置，使得換料11 3 8於移 交換區3 j i f可由下方對電子元件的f面進行檢測，另良品 肺i巧 交換區3 6分別設有第六移載器4Q及第七 盤向前ΠίΤ良品交換區3 5及次級品交換區3 6之料 電子元件之分料Ε4 2及次級品收料114 3 ’以完成 係將= ^本發明於初始進行檢測時，第—移載器1 2 暫置iW =承置有待測電子元件之料盤21Α移載至第一 = 一移載器2 2完成料盤21Α的移載後，隨即回移 2 Q處，此時供料S2 0將承置有待測電子元件之料盤 匕丄β下降至供料位置。 盤2 ]月’接著第二移載器2 4於第一暫置區2 3將料 系要士^載至檢測區2 6 ’而第一移載器2 2則將供料匿2 0上 Ϊίίίΐΐ子元件之料盤2 1B移載至第-暫置區2 3，第-移 j料盤2 1B的移載後，隨即回移至供料E 2 0處，此 2 0料置有細電子元件之·2 lc下降至供料位 =參閱第8圖，檢測區2 6内開始由檢測器2 7對料盤21A 哭之^疋件進行外觀檢測，並將檢測之訊號傳輸至中央控制 “二杜iiA進行檢測之’’第二移载112 4會於第一暫置 枓盤2 1B移載至第二暫置區2 5 ’以等待進行檢測，而 8 1 2縣供料® 2 Q上承置有制電子元件之料盤 2 至第一暫置區23，第一移載器22完成料盤2K的 =後^即回移至供舰2 0處，此時供料£2 〇將承置待測 電子兀件之料盤21D下降至供料位置。 =====檢 測器2 7對料盤2 1β上夕夂^移載檢測區2 6内開始由檢 訊號傳輸至中央控制，並將檢測之 元有待測電子 盤2 1D的移載後，隨即^移料° 2=一 2完成料 六暫iiKHi細_3 _盤2 ^移載至第 至第四q η —移翻2 8騎^成檢測之健2 ib移載 ίΪΓ 3 〇 ’此時第二移載器2 4會將第二暫置區2$ 料，2 1C移載至檢測區2 6内開始由檢測器2 7對料盤J以 之·α·ί子碰断外触測，並將檢狀峨傳輸至+央控制5| 檢測之同時，第二移載器24會於第—暫 ^盤2 ID移载至第二暫置區2 5，以等待進行檢測，而第 器2 2則將供料匣2 〇處承置有待測電子元件之料盤21£ ，第-暫置(12 3，第-移載器2 2完成料盤2 1E的移載後，p p回移至供料!£2 Q處’此時供料g2⑽承置制電子元= 料盤2 1F下降至供料位置。 < 請參閱第1 1圖，接著第五移載器3 4將料盤2 1A向前 至次級品交換區3 6，以提供交換料使用，而第三移載器2 回移至檢測區26。 只 請參閱第12圖，接著第四移載器31及第五移载器34 ^回至第四暫置區3 0位置，第三移載器2 8則將完成檢測之粗 盤2 1C移載至第三暫置區2 9，此時第二移載器2 4會將第二暫 m2 9 2 ID移载至檢測區2 6内開始由檢測器2 7對 之各電子元件進行外觀檢測，並將檢測之訊號傳輸至 署，料盤2 1D檢測之同時，第二移载器2 4會於第一暫 ^2 3將巧盤2 1E移載至第二暫置區2 5，以等待進行檢測， 2 笛2-2Γ將供料E 2 〇處承置有待測電子元件之料盤 移射第—暫置區2 3，第一移載器2 2完成料盤2 1F的 電子L牛之供料匣2 〇處’此時供料匣2 〇將承置待測 1 触2 1下降至供料位置；另完成檢測並位於次級品 =、區3 6之料盤2 1A ’可依據檢測結果由換料器3 8將完全損 使用之不良品移载至不良品收料區3 7，而使料盤2 1A 僅承置良品及次級品。 χ Λ 請參閱第1 3圖，接著第四移載器3 1將料盤2 1Β移載至第 ^置區3 2，以準備進入良品交換區3 5，而第三移載 暫置區29之料盤2 K移載至第四暫置區3〇。請 ί ^圖，接/第五移載器3 4將料盤2 1Β向前移载至良品 、&3 5，而第二移載器2 8則回移至檢測區2 6。 務閲ί1 5圖’接著第四移載113 1及第五移彻3 4將 盤2 ] ϋ -3撕〇位置’第三移載器2 8則將完成檢測之料 署H c:移载至第二暫置區2 9 ’此時第二移載器2 4會將第二暫 料^91 $料盤21Ε移載至檢測區2 6内開始由檢測器2 7對 由上之各電子元件進行外觀檢測，並將檢測之訊號傳輸至 ΐ=制器，料盤2 1Ε檢測之同時’第二移載器2 4會於第」暫 =3將料盤2 1F移載至第二暫置區25，以等待進行檢測， 移载器2 2則將供料ϋ 2 0處承置有待測電子元件之料盤 移載德移第—暫置區2 3 ’第—移載器2 2完成料盤21G的 1H下降至供料位置；另完成檢測並位於良品交 換G3 5之料盤21B即依據檢測結果由換料器3 8將完全損壞 1333550 ·=堪使肖之不&品移紅不^㈣區3 7 -人級品交換區3 6之料盤21A上之良。捕署8並將 2 1B J, pT 3 5Energy, that is, the industry is committed to research and development; ίί and the operation of the knife to effectively improve the detection of the product [invention] The main purpose of the invention is to provide an electronic exchange of electronically accommodating on the other side of the detection area with good exchange The district and the secondary product exchange area will receive the ship. After the electronic component is completed as the test #, it can be transferred to the exchange t-under device according to the test result, and the tray of the good exchange area is put on the tray to make the body change. The good products on the plate are placed in the good exchange area. ί Du ΪΓ The tray can be exchanged and fully placed as a good product. After the transfer, the tray of the finished product is transferred to the receiving hopper to store your automation. The method for completing the appearance detection and automatic sorting operation of the electronic component 'achieves the purpose of effectively improving the detection capacity. The second object of the present invention is to provide an automated work to replace the manual work, thereby saving labor and working time, and reducing costs and improving costs. Production efficiency. Another object of the present invention is to provide an apparatus for automatically performing appearance inspection of electronic components, wherein the exchanger of the exchange area is automatically moved according to the detection result. The classification operation 'in place of the manual operation, which can avoid the damage of the electronic components due to manual selection or poor technology, thereby reducing the damage rate of the electronic components. 6 1333550 [Embodiment] In order to enable the reviewing committee to make the present invention Further, the embodiment is combined with the drawings to illustrate the following: 了解 乂 铋 铋 铋 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 , , , , , , , , , , , , , , , , , , , , , , , , , The lifting and feeding H carrier 2 2 can be used as the first direction (γ axis) f 弋 - temporary zone 2 3, the first - 2 = zone 2 5 and the detection zone 2 6, detection? 12U transfer The second temporary detector 27 can perform the appearance detection on the square 2:6:ΐΥ:=^, and transfer the detection_transmission=9 7 ϋ# to the second transfer device 28' to the detector 2 7兀After the detection, the third transfer carrier 28 can move the tray area 29 and the fourth temporary area 3, and the fourth temporary area is transferred to the fourth transfer unit 31, and can have a m-zone. 3 3. The fourth transfer device 3 port 4 axially shifts the fifth transfer carrier 3 4 to transfer the fifth temporary tray 2 U forward to the good exchange area 3 5 or will be located Sixth temporary Zone 3 3 tray 2 1A transfer to secondary product delivery no 3 6, the secondary product exchange area 36 is provided on the other side - defective product receiving area 37, for the storage of completely damaged defective products, one can be used The first, second, and third directions (X_γ_ζ_) shift and move to the good parent change zone 3 5, the secondary product parent change zone 3 6 and the defective goods receive zone 3 7 refiller 3 8 ' The test result moves the secondary product on the tray of the good product exchange area 35 to the tray of the secondary vm parent exchange area 36 or removes the defective product into the defective product receiving area 3 7 and the secondary The good products on the trays of the product exchange area 3 are placed in the trays of the good exchange area 35, so that the trays of the good exchange area 35 can be exchanged and completely placed as good electronic components, in order to facilitate the accurate electronic components. Placed in the tray, the angle between the electronic components on the inspector 38 of the CCD is set below the good 7 1333550 product exchange area 36 to control the refueling °, and the correction compensation of 兮 = The electronic components are accurately placed in the tray. The device is placed in the lower miscellaneous, so that the refueling 11 3 8 is in the transfer area 3 jif can be placed on the electrons from below. The f-plane of the component is detected, and the other good product is provided with a sixth transfer device 4Q and a seventh disk forward Π Τ good exchange area 35 and a secondary exchange area 3 6 electronic components. Dispense Ε 4 2 and secondary product receipt 114 3 'to complete the system = ^ When the invention is initially tested, the first transfer carrier 1 2 temporarily sets iW = the tray 21 with the electronic component to be tested is moved After loading to the first = a transfer carrier 2 2 to complete the transfer of the tray 21 ,, then move back 2 Q, at this time the supply S20 will drop the tray 匕丄 β of the electronic component to be tested to Material location. The disk 2 ] month 'following the second transfer device 24 in the first temporary zone 2 3 to carry the material system to the detection zone 2 6 ' and the first transfer carrier 2 2 will supply the supply 2 0 The tray 2 1B of the sub-component is transferred to the first temporary region 2 3, and after the transfer of the first-shift j tray 2 1B, it is moved back to the feeding E 2 0, and the material is placed fine. The 2 lc of the electronic component is lowered to the supply level. Referring to Figure 8, the detection of the device is detected by the detector 27 in the detection area, and the detection signal is transmitted to the central control. "Second Dui IAA for detection" 'Second transfer 112 4 will be transferred to the second temporary zone 2 5 ' at the first temporary tray 2 1B to wait for detection, while 8 1 2 County Feeding ® 2 Q carries the tray 2 of the electronic component to the first temporary area 23, and the first transfer unit 22 completes the =2 of the tray 2, and then moves back to the ship 20, at which time the feed is £2.下降 Lower the tray 21D of the electronic component to be tested to the feeding position. =====Detector 2 7 pairs of trays 2 1β 上 夂 ^ Transfer detection area 2 6 begins to be transmitted from the inspection number to Central control, and the detection element has to be tested after the electronic disk 2 1D is transferred , then ^ moving material ° 2 = one 2 completed material six temporary iiKHi fine _3 _ disk 2 ^ transfer to the fourth to the fourth q η - shift 2 8 riding ^ into the detection of the health 2 ib transfer ΪΓ 3 〇 ' At this time, the second transfer unit 24 transfers the second temporary area 2$, 2 1C to the detection area 26, and starts to be hit by the detector 27 with the tray J and the α·ί. When the test is detected and the test condition is transmitted to the + central control 5| detection, the second transfer device 24 is transferred to the second temporary set 2 5 at the first temporary disk 2 ID to wait for detection. And the second unit 2 is to place the tray 21 of the electronic component to be tested at the supply 匣2 ,, and the first temporary position (12 3, after the transfer of the tray 2 1E is completed by the first transfer carrier 2 2 , pp moves back to the feed! £2 at Q' At this time, the feed g2 (10) is placed in the electronic unit = the tray 2 1F is lowered to the feeding position. < Refer to Figure 1 1 and then the fifth transfer 3 4 advance the tray 2 1A to the secondary exchange area 3 6 to provide for the use of the exchange, and the third transfer 2 to move back to the detection zone 26. Referring only to Figure 12, then the fourth transfer 31 and the fifth transfer carrier 34 ^ return to the fourth temporary zone 3 0 position, and the third transfer carrier 28 will complete the detection The coarse disk 2 1C is transferred to the third temporary area 2 9, and the second transfer unit 24 transfers the second temporary m2 9 2 ID to the detection area 26 to start the detection by the detector 27 The electronic component performs appearance inspection and transmits the detection signal to the department. At the same time as the tray 2 1D detection, the second transfer device 24 will transfer the smart disk 2 1E to the second temporary position at the first temporary ^2 3 Zone 2 5, in order to wait for the test, 2 flute 2-2Γ, the feed E 2 〇 is placed on the tray of the electronic component to be tested, the first temporary zone 2 3, the first transferer 2 2 finished material Plate 2 1F electronic L cattle supply 匣 2 〇 ' at this time feeding 匣 2 〇 will be placed to be tested 1 touch 2 1 down to the feeding position; another completed detection and located in the secondary product =, area 3 6 The tray 2 1A ' can transfer the defective product completely damaged to the defective product receiving area 3 7 by the refiller 38 according to the detection result, so that the tray 2 1A can only hold the good product and the secondary product. χ Λ Referring to FIG. 1 3, the fourth transfer device 3 1 then transfers the tray 2 1Β to the first region 3 2 to prepare for entering the good exchange area 35, and the third transfer temporary area 29 The tray 2 K is transferred to the fourth temporary zone 3〇. ί^, the fifth/five transfer carrier 3 4 transfers the tray 2 1Β forward to the good, & 35, and the second transfer unit 28 moves back to the detection zone 26. ί ί 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 To the second temporary zone 2 9 ' at this time, the second transfer device 24 transfers the second temporary material ^91 $Tray 21Ε into the detection zone 26 to start the detection of the electrons from the detector 27 The component is visually inspected and the detected signal is transmitted to the ΐ= controller. The tray 2 is detected at the same time. 'The second transfer unit 2 4 will be at the first time=3 to transfer the tray 2 1F to the second temporary The zone 25 is set to wait for the detection, and the transfer device 2 2 carries the tray of the electronic component to be tested at the feeding port 2 0. The shifting-temporary zone 2 3 'the first shifting device 2 2Complete the 1H of the tray 21G to the feeding position; the tray 21B which is finished detecting and located in the good exchange G3 5 will completely damage the 1333550 according to the detection result by the refiller 38. Moved to the red (^) area 3 7 - the level of the product exchange area 3 6 on the tray 21A. Capture 8 and 2 1B J, pT 3 5
，換料器3 8可經由檢查器3 9檢知換料、 、2 1B 的角度位置，並控制換料器3 8作角度電子元件 電子元件準確交換置於料盤2 1A、2 1B内，，進而將 3 5之料盤2 1B可進行交細完全承1 置為内良品良品交換區 CCD檢查器3 9亦可由下方對換 ’上二二件，另該 的檢測。 d a上之電子疋件進行背面 ==二tifr'1細^-29 之料 方式至4 3收置’進而以全面自動化之 件之外觀檢測及自動分類作業’達到有效提升檢 本發明實深具實用性及進步性，然未見有相同之 七==】從而允符發明彻請要件，爰依法提出申請。 第1圖·係，93131668號「電子it件之外觀檢測機」專利案之架 構示意圖。 ” 第2圖.係第93131668號「電子元件之外觀檢測機」專利案進行 檢測之示意圖。 〃 第3圖.係第93131668號「電子元件之外觀檢測機」專利案完成 11 1333550 檢測後之不意圖。 第4圖：係第93131668號「電子元件之外觀檢測機」專利案檢測 後收料之示意圖。 第5圖.係本發明之架構不意圖。 第6圖：係本發明之動作示意圖（一）。 第7圖：係本發明之動作示意圖（二）。 第8圖：係本發明之動作示意圖（三）。 第9圖：係本發明之動作示意圖（四）。 第10圖：係本發明之動作示意圖（五）。 第1 1圖：係本發明之動作示意圖（六）。 第1 2圖：係本發明之動作示意圖（七）。 第13圖：係本發明之動作示意圖（八）。 第1 4圖：係本發明之動作示意圖（九）。 第1 5圖：係本發明之動作示意圖（十）。 第1 6圖：係本發明之動作示意圖（十一）。 第1 7圖：係本發明之動作示意圖（十二）。 【主要元件符號說明】 習用部分： 11:送料裝置 111:移料機構 12:檢測裝置 121:檢測台 12 3 :檢測器 13:出料裝置 131:出料匣 本發明部分： 2 0 :供料匣 2 1A :料盤 2 1D :料盤 112:入料匣升降機構 12 2 :治具機構 13 2 :移料機構 2 1B :料盤 2 1E :料盤 2 1C :料盤 2 1F :料盤 12 1333550 2 1G :料盤 2 1Η :料盤 2 2 :第一移載器 2 3:第一暫置區 2 2 5 第二暫置區 2 6 .檢測區 2 28 第三移載器 2 9:第三暫置區 3 3 1 第四移載器 3 2:第五暫置區 3 3 4 第五移載器 3 5.良品父換區 3 6 次級品父換區 3 7 .不良品收料區 3 8 換料器 3 9 :檢查器 4 4 1 第七移載器 4 2:良品收料匣 4 3 次級品收料匣 4:第二移載器 7 :檢測器 0:第四暫置區 3:第六暫置區 0:第六移載器The refiller 38 can detect the angular position of the refueling, 2 1B via the inspector 39, and control the rechanger 38 to accurately exchange the electronic components of the angle electronic component in the trays 2 1A, 2 1B. In addition, the tray 5 2B of the 3 5 can be made into a fine cross-section, and the CCD inspector can be replaced by the lower part of the CCD inspector. The electronic components on the da are on the back == two tifr'1 fine ^ -29 materials to 4 3 collection 'and then the overall automation of the appearance of the detection and automatic classification operations 'to achieve effective lifting inspection Practicality and progress, but did not see the same seven ==] so that the invention is required, and the application is made according to law. Fig. 1 is a schematic diagram of the structure of the patent application of "Electronic-item appearance inspection machine" No. 93131668. Fig. 2 is a schematic diagram of the detection of the patent case of "Electronic Component Appearance Detector" No. 93131668. 〃 Fig. 3. The patent case No. 93131668 “Appearance detector for electronic components” is completed. 11 1333550 Not intended after inspection. Fig. 4 is a schematic diagram showing the receipt of the patent of the "Electronic Component Appearance Detector" patent No. 93131668. Figure 5 is an illustration of the architecture of the present invention. Figure 6 is a schematic view of the action of the present invention (1). Figure 7 is a schematic view of the action of the present invention (2). Figure 8 is a schematic view of the action of the present invention (3). Figure 9 is a schematic view of the action of the present invention (4). Figure 10 is a schematic view of the action of the present invention (5). Fig. 1 is a schematic view showing the action of the present invention (6). Figure 12: Schematic diagram of the action of the present invention (7). Figure 13 is a schematic view of the action of the present invention (8). Figure 14 is a schematic diagram of the action of the present invention (9). Fig. 15 is a schematic view showing the operation of the present invention (10). Figure 16 is a schematic diagram of the action of the present invention (11). Figure 17 is a schematic diagram of the action of the present invention (12). [Main component symbol description] Conventional part: 11: Feeding device 111: Transfer mechanism 12: Detection device 121: Test station 12 3: Detector 13: Discharge device 131: Discharge device 匣 Part of the invention: 2 0 : Feeding匣 2 1A : tray 2 1D : tray 112 : feed 匣 lifting mechanism 12 2 : jig mechanism 13 2 : transfer mechanism 2 1B : tray 2 1E : tray 2 1C : tray 2 1F : tray 12 1333550 2 1G : tray 2 1 Η : tray 2 2 : first transfer unit 2 3: first temporary area 2 2 5 second temporary area 2 6 . detection area 2 28 third transfer unit 2 9 : Third temporary zone 3 3 1 Fourth transferor 3 2: Fifth temporary zone 3 3 4 Fifth transferer 3 5. Good parent change zone 3 6 Secondary parent change zone 3 7 . Receipt area 3 8 Refiller 3 9 : Inspector 4 4 1 Seventh transferer 4 2: Good receipt 匣 4 3 Secondary receipt 匣 4: Second transfer 7 : Detector 0: Four temporary zone 3: sixth temporary zone 0: sixth transferer
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