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TW202129814A - Observation jig for easily observing a side surface of a chip such as a package element chip - Google Patents

Observation jig for easily observing a side surface of a chip such as a package element chip Download PDF

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TW202129814A
TW202129814A TW110102951A TW110102951A TW202129814A TW 202129814 A TW202129814 A TW 202129814A TW 110102951 A TW110102951 A TW 110102951A TW 110102951 A TW110102951 A TW 110102951A TW 202129814 A TW202129814 A TW 202129814A
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platform
chip
wafer
observation
frame
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TWI868300B (en
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楠欣浩
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日商迪思科股份有限公司
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • H10P74/27—
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H10P74/20—

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

[課題] 提供用以輕易觀察封裝體元件晶片等晶片的側面的觀察用治具。 [解決手段] 觀察用治具(2)係具有：在表面具備有保持晶片(34)的黏著層(10)的平台(4)；將平台(4)以由伏平的狀態變化成豎立的狀態的方式可旋轉地支持，並且具備對應平台(4)的背面所形成的貫穿開口(20)的框體(6)；及具備有被插入在貫穿開口(20)且使平台(4)由伏平的狀態形成為豎立的狀態的突起(30)的基台(8)。[Problem] To provide an observation jig for easily observing the side surface of a chip such as a package element chip. [Solution] The observation jig (2) has: a platform (4) with an adhesive layer (10) holding the wafer (34) on the surface; the platform (4) is changed from a flat state to an upright The state is rotatably supported and is provided with a frame body (6) corresponding to the through opening (20) formed on the back of the platform (4); The flat state is formed as the base (8) of the protrusion (30) in the erect state.

Description

觀察用治具Observation fixture

本發明係關於觀察晶片的側面時所使用的觀察用治具。The present invention relates to an observation jig used when observing the side surface of a wafer.

藉由分割預定線區劃IC、LSI等複數元件且形成在表面的晶圓係藉由可旋轉地配備有切削刀的切割裝置而被分割為各個元件晶片，經分割的各元件晶片係被利用在行動電話、個人電腦等電氣機器。The wafers formed on the surface of IC, LSI, etc. are divided into multiple components by dividing predetermined lines into individual component wafers by a dicing device rotatably equipped with a cutter. The divided component wafers are used in Electrical equipment such as mobile phones and personal computers.

此外，使元件晶片整列複數在配線基板而藉由壓模樹脂所封裝之被稱為QFN(Quad Flat Non-leaded package，四側無引腳扁平封裝)的晶片尺寸封裝體基板亦藉由切割裝置而被分割為各個封裝體元件晶片(參照例如專利文獻1)。In addition, a chip-size package substrate called QFN (Quad Flat Non-leaded package) is also used for a chip-size package substrate called QFN (Quad Flat Non-leaded package), which aligns multiple component chips on the wiring substrate and is packaged by a compression molding resin. It is divided into individual package element wafers (see, for example, Patent Document 1).

接著，QFN係跨過鄰接的元件而形成電極且橫過分割預定線來作配設，因此若以切削刀切斷分割預定線時，因金屬的延性，電極伸展而有電極彼此短路之虞。因此，封裝體元件晶片係以側面朝上的方式被黏貼在黏著膠帶，藉由顯微鏡觀察側面且檢測電極是否短路。 [先前技術文獻] [專利文獻]Next, QFN forms electrodes across adjacent elements and arranges them across the planned dividing line. Therefore, when the planned dividing line is cut with a cutter, the electrodes stretch due to the ductility of the metal and the electrodes may short-circuit with each other. Therefore, the chip of the package body is pasted on the adhesive tape with the side face up, and the side face is observed by a microscope to detect whether the electrode is short-circuited. [Prior Technical Literature] [Patent Literature]

[專利文獻1] 日本特開2019-145558號公報[Patent Document 1] Japanese Patent Application Publication No. 2019-145558

(發明所欲解決之問題)(The problem to be solved by the invention)

但是，封裝體元件係小至數mm見方左右，而且封裝體元件的厚度亦薄，因此將封裝體元件晶片的側面黏貼在黏著膠帶時，必須要有相當的注意力，並且難以保持封裝體元件晶片的側面朝上的狀態，藉由顯微鏡觀察封裝體元件晶片的側面時有費工的問題。However, the package component is as small as a few mm square, and the thickness of the package component is also thin. Therefore, when sticking the side surface of the package component chip to the adhesive tape, considerable attention must be paid and it is difficult to hold the package component When the side surface of the chip is facing upward, there is a problem of labor-consuming observing the side surface of the package element chip through a microscope.

鑑於上述事實而完成的本發明之課題在提供用以輕易觀察封裝體元件晶片等晶片的側面的觀察用治具。 (解決問題之技術手段)The subject of the present invention completed in view of the above facts is to provide an observation jig for easily observing the side surface of a chip such as a package element chip. (Technical means to solve the problem)

本發明係提供以下之觀察用治具，俾以解決上述課題。亦即，本發明係提供一種觀察用治具，其係觀察晶片的側面時所使用的觀察用治具，其係具有：在表面具備有保持晶片的黏著層的平台；將該平台以由伏平的狀態變化成豎立的狀態的方式可旋轉地支持，並且具備對應該平台的背面所形成的貫穿開口的框體；及具備有被插入在該貫穿開口且使該平台由伏平的狀態形成為豎立的狀態的突起的基台。The present invention provides the following observation jig to solve the above-mentioned problems. That is, the present invention provides an observation jig, which is used when observing the side surface of a wafer, and has: a platform with an adhesive layer holding the wafer on the surface; It is rotatably supported by changing from a flat state to an upright state, and is provided with a frame corresponding to a through opening formed on the back of the platform; It is a raised abutment in an upright state.

較佳為該框體係支持複數該平台，該基台係對應該複數平台而具備複數該突起。 (發明之效果)Preferably, the frame system supports a plurality of the platforms, and the abutment is provided with a plurality of the protrusions corresponding to the plurality of platforms. (Effects of the invention)

本發明之觀察用治具係具有：在表面具備有保持晶片的黏著層的平台；將該平台以由伏平的狀態變化成豎立的狀態的方式可旋轉地支持，並且具備對應該平台的背面所形成的貫穿開口的框體；及具備有被插入在該貫穿開口且使該平台由伏平的狀態形成為豎立的狀態的突起的基台，因此可輕易將封裝體元件晶片等晶片的側面朝上而以顯微鏡觀察，在以顯微鏡的觀察上費工的問題即解決。The observation jig of the present invention has: a platform provided with an adhesive layer holding the wafer on the surface; the platform is rotatably supported by changing from a flat state to an upright state, and has a back surface corresponding to the platform The formed through-opening frame body; and a base equipped with a protrusion inserted in the through-opening to form the platform from a flat state to an upright state, so that the side surface of a chip such as a package element chip can be easily When looking up with a microscope, the problem of labor-intensive observation with a microscope is solved.

以下一邊參照圖示，一邊說明按照本發明所構成的觀察用治具的較適實施形態。Hereinafter, referring to the drawings, a suitable embodiment of the observation jig constructed according to the present invention will be described.

圖1中全體以符號2表示的觀察用治具係具有：在表面具備有保持晶片的黏著層的平台4；將平台4以由伏平的狀態變化成豎立的狀態的方式可旋轉地支持，並且具備對應平台4的背面所形成的貫穿開口的框體6；及具備有被插入在貫穿開口且使平台4由伏平的狀態形成為豎立的狀態的突起的基台8。The observation jig system denoted by the symbol 2 in FIG. 1 as a whole has: a platform 4 provided with an adhesive layer holding the wafer on the surface; And it is provided with the frame 6 corresponding to the through opening formed in the back surface of the platform 4, and the base 8 equipped with the protrusion inserted in the through opening, and the platform 4 is formed from the flat state to the upright state.

平台4係形成為矩形板狀，在平台4的表面係設有保持晶片的矩形狀的黏著層10。可與平台4的表面的尺寸相同的黏著層10的尺寸係以可保持各種尺寸的晶片的尺寸為佳，例如1cm×1cm左右即可。如藉由參照圖1所理解，平台4的表面係形成為平坦，另一方面，在平台4的背面係形成有段差，平台4係具有：厚度相對較大的第一部分12、與厚度小於第一部分12的第二部分14。在圖示之實施形態的各平台4係附設有由第一部分12的側面16突出的圓柱狀的一對軸18，一對軸18係配置在彼此對向的位置。The platform 4 is formed in a rectangular plate shape, and a rectangular adhesive layer 10 for holding a wafer is provided on the surface of the platform 4. The size of the adhesive layer 10 that can be the same as the size of the surface of the platform 4 is preferably a size that can hold wafers of various sizes, for example, about 1 cm×1 cm. As understood by referring to Fig. 1, the surface of the platform 4 is formed flat. On the other hand, a step is formed on the back of the platform 4. The platform 4 has: a first portion 12 with a relatively large thickness, and a Part 12 of the second part 14. Each platform 4 of the illustrated embodiment is provided with a pair of cylindrical shafts 18 protruding from the side surface 16 of the first portion 12, and the pair of shafts 18 are arranged at positions facing each other.

框體6係全體形成為長方形狀，以框體6的長邊方向隔著間隔形成有可收容平台4的矩形狀的一對貫穿開口20。在框體6的內周面22係形成有插入平台4的軸18的圓形的複數支持孔24，各支持孔24係配置在彼此對向的位置。接著，在框體6中，若在各支持孔24插入平台4的各軸18，以將平台4由伏平的狀態變化成豎立的狀態的方式可旋轉地支持。The frame body 6 is formed in a rectangular shape as a whole, and a pair of rectangular through openings 20 capable of accommodating the platform 4 are formed at intervals in the longitudinal direction of the frame body 6. The inner peripheral surface 22 of the frame 6 is formed with a plurality of circular supporting holes 24 inserted into the shaft 18 of the platform 4, and the supporting holes 24 are arranged at positions facing each other. Next, in the frame 6, if each shaft 18 of the platform 4 is inserted into each supporting hole 24, the platform 4 is rotatably supported so that the platform 4 is changed from a flat state to an upright state.

如圖1所示，在各貫穿開口20以框體6的長邊方向隔著間隔L1配置有由內周面22的下側部分突出的一對突出片26。接著，平台4被支持在框體6時，平台4的第二部分14被支持在各突出片26。如上所示，各貫穿開口20的形狀係對應平台4的背面的形狀而形成。As shown in FIG. 1, in each through opening 20, a pair of protruding pieces 26 protruding from the lower side portion of the inner peripheral surface 22 are arranged at an interval L1 in the longitudinal direction of the frame 6. Next, when the platform 4 is supported by the frame 6, the second part 14 of the platform 4 is supported by each protruding piece 26. As shown above, the shape of each through opening 20 is formed corresponding to the shape of the back surface of the platform 4.

基台8係具備：全體呈直方體狀的主部28、及以主部28的長邊方向隔著間隔而由主部28的上表面朝上方突出的一對突起30。各突起30係配置在主部28的短邊方向單側，並且當框體6被載置於主部28的上表面時，配置成位於形成在各貫穿開口20的一對突出片26間。主部28的長邊方向中的突起30的尺寸L2係比形成在各貫穿開口20的一對突出片26的間隔L1稍小。此外，在主部28的短邊方向另一側係以主部28的長邊方向隔著間隔形成有矩形狀的一對收容開口32。The base 8 is provided with a main part 28 which is a rectangular parallelepiped as a whole, and a pair of protrusions 30 protruding upward from the upper surface of the main part 28 with an interval in the longitudinal direction of the main part 28. Each protrusion 30 is arranged on one side in the short-side direction of the main portion 28, and when the frame 6 is placed on the upper surface of the main portion 28, it is arranged so as to be located between a pair of protruding pieces 26 formed in each through opening 20. The dimension L2 of the protrusion 30 in the longitudinal direction of the main portion 28 is slightly smaller than the interval L1 between the pair of protruding pieces 26 formed in each through opening 20. In addition, on the other side in the short-side direction of the main portion 28, a pair of rectangular accommodation openings 32 are formed with an interval in the long-side direction of the main portion 28.

接著，支持有平台4的框體6被載置於基台8的主部28的上表面，並且基台8的各突起30被插入在框體6的各貫穿開口20，若各突起30通過形成在各貫穿開口20的一對突出片26間，各突起30將各平台4的第二部分14的背面推至上方，使各平台4旋轉而由伏平的狀態變化成豎立的狀態。此外，各平台4變化成豎立的狀態時，各平台4的第一部分12被收容在基台8的各收容開口32。Next, the frame 6 supporting the platform 4 is placed on the upper surface of the main portion 28 of the base 8, and the protrusions 30 of the base 8 are inserted into the through openings 20 of the frame 6. If the protrusions 30 pass Formed between a pair of protruding pieces 26 of each penetrating opening 20, each protrusion 30 pushes the back surface of the second portion 14 of each platform 4 upward to rotate each platform 4 from a flat state to an upright state. In addition, when each platform 4 is changed to an upright state, the first part 12 of each platform 4 is accommodated in each accommodation opening 32 of the base 8.

接著說明使用如上所述之觀察用治具2來觀察晶片的側面的方法。在圖示之實施形態中係如圖2所示，首先，使晶片34保持在旋轉自如地被支持在框體6的平台4的黏著層10。Next, a method of observing the side surface of the wafer using the observation jig 2 as described above will be described. In the illustrated embodiment, as shown in FIG. 2, first, the wafer 34 is held on the adhesive layer 10 rotatably supported on the platform 4 of the frame 6.

圖示之實施形態中的晶片34係被稱為QFN的晶片尺寸封裝體基板被分割成各個封裝體元件晶片的矩形板狀的晶片，電極36露出於晶片34的表面34a及側面34b。The wafer 34 in the illustrated embodiment is a wafer-sized package substrate called QFN, which is divided into rectangular plate-shaped wafers of individual package element wafers, and the electrodes 36 are exposed on the surface 34a and side surfaces 34b of the wafer 34.

接著，如圖3所示，將框體6載置於基台8的主部28的上表面，在框體6的各貫穿開口20插入基台8的各突起30，而使各突起30通過至形成在各貫穿開口20的一對突出片26間。如此一來，各平台4的第二部分14的背面藉由各突起30而被推至上方，各平台4旋轉而由伏平的狀態變化成豎立的狀態，並且各平台4的第一部分12被收容在基台8的各收容開口32。藉此，如圖3(b)所示，可將被保持在各平台4的晶片34的側面34b朝上，可藉由顯微鏡來觀察晶片34的側面34b。在各平台4旋轉時、或各平台4旋轉而變化成豎立的狀態之後，晶片34亦被保持在平台4的黏著層10，因此安定保持晶片34的側面34b朝上的狀態。Next, as shown in FIG. 3, the frame 6 is placed on the upper surface of the main portion 28 of the base 8, and the protrusions 30 of the base 8 are inserted into the through openings 20 of the frame 6, so that the protrusions 30 pass To between a pair of protruding pieces 26 formed in each through opening 20. In this way, the back of the second part 14 of each platform 4 is pushed up by the protrusions 30, each platform 4 rotates to change from a flat state to an upright state, and the first part 12 of each platform 4 is It is accommodated in each accommodating opening 32 of the base 8. As a result, as shown in FIG. 3(b), the side surface 34b of the wafer 34 held on each stage 4 can face upward, and the side surface 34b of the wafer 34 can be observed with a microscope. When each stage 4 rotates, or after each stage 4 rotates and changes to an upright state, the wafer 34 is also held on the adhesive layer 10 of the stage 4, so the state where the side surface 34b of the wafer 34 faces upward is stably maintained.

如以上所示，圖示之實施形態的觀察用治具2由於具有：在表面具備有保持晶片34的黏著層10的平台4；將平台4以由伏平的狀態變化成豎立的狀態的方式可旋轉地支持，並且具備對應平台4的背面所形成的貫穿開口20的框體6；及具備有被插入在貫穿開口20且使平台4由伏平的狀態形成為豎立的狀態的突起30的基台8，因此可輕易將晶片34的側面34b朝上而以顯微鏡觀察，在以顯微鏡的觀察上費工的問題即解決。As shown above, the observation jig 2 of the illustrated embodiment has: a platform 4 provided with an adhesive layer 10 holding a wafer 34 on the surface; and the platform 4 is changed from a flat state to an upright state It is rotatably supported and is provided with a frame 6 corresponding to the through opening 20 formed on the back of the platform 4; The base 8 can be easily observed with a microscope with the side 34b of the wafer 34 facing upward, and the problem of labor-consuming observation with the microscope is solved.

其中，圖示之實施形態的框體6係支持一對平台4，惟框體6亦可形成為支持1個平台4，或形成為支持3個以上的平台4。圖示之實施形態的基台8係具備有一對突起30，惟基台8亦可對應平台4的數量而具備1個或3個以上的突起30。此外，亦可連結複數個圖示之實施形態的觀察用治具2。Wherein, the frame 6 of the illustrated embodiment supports a pair of platforms 4, but the frame 6 can also be formed to support one platform 4, or formed to support more than three platforms 4. The base 8 of the illustrated embodiment is provided with a pair of protrusions 30, but the base 8 may be provided with one or three or more protrusions 30 corresponding to the number of the platforms 4. In addition, it is also possible to connect a plurality of observation jigs 2 of the illustrated embodiment.

2:觀察用治具 4:平台 6:框體 8:基台 10:黏著層 12:第一部分 14:第二部分 16:側面 18:軸 20:貫穿開口 22:內周面 24:支持孔 26:突出片 28:主部 30:突起 32:收容開口 34:晶片 34a:晶片的表面 34b:晶片的側面 36:電極 L1:間隔 L2:尺寸2: Observation fixture 4: platform 6: Frame 8: Abutment 10: Adhesive layer 12: Part One 14: Part Two 16: side 18: axis 20: Through opening 22: inner peripheral surface 24: Support hole 26: Protruding piece 28: Main part 30: protrusion 32: Containment opening 34: chip 34a: The surface of the wafer 34b: the side of the chip 36: Electrode L1: interval L2: size

[圖1]係按照本發明所構成的觀察用治具的分解斜視圖。 [圖2]係示出使晶片保持在圖1所示的平台的狀態的斜視圖。 [圖3](a)係示出連同保持有晶片的平台一起將框體載置於基台的狀態的斜視圖，(b)係示出平台由伏平的狀態變化成豎立的狀態的狀態的斜視圖。[Figure 1] is an exploded perspective view of an observation jig constructed in accordance with the present invention. [Fig. 2] A perspective view showing a state in which a wafer is held on the stage shown in Fig. 1. [Fig. [Fig. 3] (a) is a perspective view showing the state where the frame is placed on the base together with the platform holding the wafer, and (b) is the state where the platform has changed from a flat state to an upright state Oblique view.

2:觀察用治具2: Observation fixture

4:平台4: platform

6:框體6: Frame

8:基台8: Abutment

10:黏著層10: Adhesive layer

14:第二部分14: Part Two

18:軸18: axis

20:貫穿開口20: Through opening

24:支持孔24: Support hole

26:突出片26: Protruding piece

28:主部28: Main part

30:突起30: protrusion

32:收容開口32: Containment opening

34:晶片34: chip

34a:晶片的表面34a: The surface of the wafer

34b:晶片的側面34b: the side of the chip

36:電極36: Electrode

Claims (2)

一種觀察用治具，其係觀察晶片的側面時所使用的觀察用治具，其係具有： 在表面具備有保持晶片的黏著層的平台； 將該平台以由伏平的狀態變化成豎立的狀態的方式可旋轉地支持，並且具備對應該平台的背面所形成的貫穿開口的框體；及 具備有被插入在該貫穿開口且使該平台由伏平的狀態形成為豎立的狀態的突起的基台。An observation jig, which is an observation jig used when observing the side surface of a wafer, and has: Have a platform on the surface that holds the adhesive layer of the chip; The platform is rotatably supported so that it changes from a flat state to an upright state, and is provided with a frame corresponding to the through opening formed on the back of the platform; and The base is provided with a protrusion inserted in the through opening to form the platform from a flat state to an upright state. 如請求項1之觀察用治具，其中，該框體係支持複數該平台，該基台係對應該複數平台而具備複數該突起。For example, the observation fixture of claim 1, wherein the frame system supports a plurality of the platforms, and the abutment corresponds to the plurality of platforms and has a plurality of the protrusions.
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