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TWI868300B - Observation fixture - Google Patents

Observation fixture Download PDF

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TWI868300B
TWI868300B TW110102951A TW110102951A TWI868300B TW I868300 B TWI868300 B TW I868300B TW 110102951 A TW110102951 A TW 110102951A TW 110102951 A TW110102951 A TW 110102951A TW I868300 B TWI868300 B TW I868300B
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platform
chip
frame
opening
base
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TW110102951A
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TW202129814A (en
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楠欣浩
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日商迪思科股份有限公司
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • H10P74/27—
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H10P74/20—

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  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

[課題] 提供用以輕易觀察封裝體元件晶片等晶片的側面的觀察用治具。 [解決手段] 觀察用治具(2)係具有：在表面具備有保持晶片(34)的黏著層(10)的平台(4)；將平台(4)以由伏平的狀態變化成豎立的狀態的方式可旋轉地支持，並且具備對應平台(4)的背面所形成的貫穿開口(20)的框體(6)；及具備有被插入在貫穿開口(20)且使平台(4)由伏平的狀態形成為豎立的狀態的突起(30)的基台(8)。[Topic] To provide an observation jig for easily observing the side surface of a chip such as a package component chip. [Solution] The observation jig (2) comprises: a platform (4) having an adhesive layer (10) on the surface for holding a chip (34); a frame (6) that rotatably supports the platform (4) in a manner that allows the platform (4) to change from a flat state to a vertical state and has a through opening (20) formed on the back side of the platform (4); and a base (8) having a protrusion (30) that is inserted into the through opening (20) and allows the platform (4) to change from a flat state to a vertical state.

Description

觀察用治具Observation jig

本發明係關於觀察晶片的側面時所使用的觀察用治具。The present invention relates to an observation jig used when observing the side surface of a chip.

藉由分割預定線區劃IC、LSI等複數元件且形成在表面的晶圓係藉由可旋轉地配備有切削刀的切割裝置而被分割為各個元件晶片，經分割的各元件晶片係被利用在行動電話、個人電腦等電氣機器。A wafer having a plurality of components such as ICs and LSIs formed on its surface divided by predetermined dividing lines is divided into individual component chips by a dicing device rotatably equipped with a cutting blade. The divided component chips are used in electrical devices such as mobile phones and personal computers.

此外，使元件晶片整列複數在配線基板而藉由壓模樹脂所封裝之被稱為QFN(Quad Flat Non-leaded package，四側無引腳扁平封裝)的晶片尺寸封裝體基板亦藉由切割裝置而被分割為各個封裝體元件晶片(參照例如專利文獻1)。In addition, a chip-sized package substrate called QFN (Quad Flat Non-leaded package) in which a plurality of component chips are arranged on a wiring substrate and packaged by a molding resin is also divided into individual package component chips by a dicing device (see, for example, Patent Document 1).

接著，QFN係跨過鄰接的元件而形成電極且橫過分割預定線來作配設，因此若以切削刀切斷分割預定線時，因金屬的延性，電極伸展而有電極彼此短路之虞。因此，封裝體元件晶片係以側面朝上的方式被黏貼在黏著膠帶，藉由顯微鏡觀察側面且檢測電極是否短路。 [先前技術文獻] [專利文獻]Next, QFN is arranged across the predetermined separation line by forming electrodes across adjacent components. Therefore, if the predetermined separation line is cut with a cutting knife, the electrodes will stretch due to the ductility of the metal and there is a risk of short circuit between the electrodes. Therefore, the package component chip is pasted on the adhesive tape with the side facing up, and the side is observed under a microscope to detect whether the electrodes are short-circuited. [Prior technical literature] [Patent literature]

[專利文獻1] 日本特開2019-145558號公報[Patent Document 1] Japanese Patent Application Publication No. 2019-145558

(發明所欲解決之問題)(Invent the problem you want to solve)

但是，封裝體元件係小至數mm見方左右，而且封裝體元件的厚度亦薄，因此將封裝體元件晶片的側面黏貼在黏著膠帶時，必須要有相當的注意力，並且難以保持封裝體元件晶片的側面朝上的狀態，藉由顯微鏡觀察封裝體元件晶片的側面時有費工的問題。However, the packaged components are as small as a few mm square and thin, so when sticking the side of the packaged component chip to the adhesive tape, considerable attention must be paid, and it is difficult to keep the side of the packaged component chip facing up, which is labor-intensive to observe the side of the packaged component chip under a microscope.

鑑於上述事實而完成的本發明之課題在提供用以輕易觀察封裝體元件晶片等晶片的側面的觀察用治具。 (解決問題之技術手段)The subject of the present invention completed in view of the above facts is to provide an observation tool for easily observing the side of a chip such as a packaged component chip. (Technical means to solve the problem)

本發明係提供以下之觀察用治具，俾以解決上述課題。亦即，本發明係提供一種觀察用治具，其係觀察晶片的側面時所使用的觀察用治具，其係具有：在表面具備有保持晶片的黏著層的平台；將該平台以由伏平的狀態變化成豎立的狀態的方式可旋轉地支持，並且具備對應該平台的背面所形成的貫穿開口的框體；及具備有被插入在該貫穿開口且使該平台由伏平的狀態形成為豎立的狀態的突起的基台。The present invention provides the following observation jig to solve the above-mentioned problem. That is, the present invention provides an observation jig used when observing the side of a chip, which comprises: a platform having an adhesive layer on the surface for holding the chip; a frame that rotatably supports the platform in a manner that allows the platform to change from a flat state to a vertical state and has a through opening formed on the back of the platform; and a base having a protrusion that is inserted into the through opening and allows the platform to change from a flat state to a vertical state.

較佳為該框體係支持複數該平台，該基台係對應該複數平台而具備複數該突起。 (發明之效果)Preferably, the frame supports a plurality of the platforms, and the base has a plurality of protrusions corresponding to the plurality of platforms. (Effect of the invention)

本發明之觀察用治具係具有：在表面具備有保持晶片的黏著層的平台；將該平台以由伏平的狀態變化成豎立的狀態的方式可旋轉地支持，並且具備對應該平台的背面所形成的貫穿開口的框體；及具備有被插入在該貫穿開口且使該平台由伏平的狀態形成為豎立的狀態的突起的基台，因此可輕易將封裝體元件晶片等晶片的側面朝上而以顯微鏡觀察，在以顯微鏡的觀察上費工的問題即解決。The observation jig of the present invention comprises: a platform having an adhesive layer on the surface for holding a chip; a frame that rotatably supports the platform in a manner that allows the platform to be changed from a flat state to a vertical state and has a through opening formed on the back side of the platform; and a base having a protrusion that is inserted into the through opening and allows the platform to be changed from a flat state to a vertical state, thereby easily allowing the side of a chip such as a package component chip to be observed under a microscope with the side facing upward, thereby solving the problem of labor-intensive observation under a microscope.

以下一邊參照圖示，一邊說明按照本發明所構成的觀察用治具的較適實施形態。The following describes a preferred embodiment of the observation jig according to the present invention with reference to the drawings.

圖1中全體以符號2表示的觀察用治具係具有：在表面具備有保持晶片的黏著層的平台4；將平台4以由伏平的狀態變化成豎立的狀態的方式可旋轉地支持，並且具備對應平台4的背面所形成的貫穿開口的框體6；及具備有被插入在貫穿開口且使平台4由伏平的狀態形成為豎立的狀態的突起的基台8。The observation jig, which is generally indicated by the symbol 2 in FIG. 1 , comprises: a platform 4 having an adhesive layer on its surface for holding a chip; a frame 6 that rotatably supports the platform 4 in a manner that allows it to change from a flat state to a vertical state and has a through opening formed on the back side of the platform 4; and a base 8 having a protrusion that is inserted into the through opening and allows the platform 4 to change from a flat state to a vertical state.

平台4係形成為矩形板狀，在平台4的表面係設有保持晶片的矩形狀的黏著層10。可與平台4的表面的尺寸相同的黏著層10的尺寸係以可保持各種尺寸的晶片的尺寸為佳，例如1cm×1cm左右即可。如藉由參照圖1所理解，平台4的表面係形成為平坦，另一方面，在平台4的背面係形成有段差，平台4係具有：厚度相對較大的第一部分12、與厚度小於第一部分12的第二部分14。在圖示之實施形態的各平台4係附設有由第一部分12的側面16突出的圓柱狀的一對軸18，一對軸18係配置在彼此對向的位置。The platform 4 is formed in a rectangular plate shape, and a rectangular adhesive layer 10 for holding a wafer is provided on the surface of the platform 4. The size of the adhesive layer 10, which can be the same as the size of the surface of the platform 4, is preferably a size that can hold wafers of various sizes, for example, about 1 cm×1 cm. As understood by referring to FIG. 1, the surface of the platform 4 is formed to be flat, and on the other hand, a step is formed on the back of the platform 4. The platform 4 has: a first portion 12 with a relatively large thickness, and a second portion 14 with a thickness smaller than the first portion 12. Each platform 4 in the illustrated embodiment is provided with a pair of cylindrical shafts 18 protruding from the side surface 16 of the first portion 12, and the pair of shafts 18 are arranged at positions opposite to each other.

框體6係全體形成為長方形狀，以框體6的長邊方向隔著間隔形成有可收容平台4的矩形狀的一對貫穿開口20。在框體6的內周面22係形成有插入平台4的軸18的圓形的複數支持孔24，各支持孔24係配置在彼此對向的位置。接著，在框體6中，若在各支持孔24插入平台4的各軸18，以將平台4由伏平的狀態變化成豎立的狀態的方式可旋轉地支持。 The frame 6 is formed in a rectangular shape as a whole, and a pair of rectangular through openings 20 for accommodating the platform 4 are formed at intervals in the long side direction of the frame 6. A plurality of circular support holes 24 for inserting the shaft 18 of the platform 4 are formed on the inner circumferential surface 22 of the frame 6, and each support hole 24 is arranged at a position opposite to each other. Then, in the frame 6, if each shaft 18 of the platform 4 is inserted into each support hole 24, the platform 4 is rotatably supported in a manner that changes from a flat state to a vertical state.

如圖1所示，在各貫穿開口20以框體6的長邊方向隔著間隔L1配置有由內周面22的下側部分突出的一對突出片26。接著，平台4被支持在框體6時，平台4的第二部分14被支持在各突出片26。如上所示，各貫穿開口20的形狀係對應平台4的背面的形狀而形成。 As shown in FIG1 , a pair of protruding pieces 26 protruding from the lower side of the inner peripheral surface 22 are arranged at intervals L1 in the long side direction of the frame 6 at each through opening 20. Then, when the platform 4 is supported on the frame 6, the second portion 14 of the platform 4 is supported on each protruding piece 26. As shown above, the shape of each through opening 20 is formed to correspond to the shape of the back side of the platform 4.

基台8係具備：全體呈直方體狀的主部28、及以主部28的長邊方向隔著間隔而由主部28的上表面朝上方突出的一對突起30。各突起30係配置在主部28的短邊方向單側，並且當框體6被載置於主部28的上表面時，配置成位於形成在各貫穿開口20的一對突出片26間。主部28的長邊方向中的突起30的尺寸L2係比形成在各貫穿開口20的一對突出片26的間隔L1稍小。此外，在主部28的短邊方向另一側係以主部28的長邊方向隔著間隔形成有矩形狀的一對收容開口32。 The base 8 has: a main part 28 in the shape of a rectangular block as a whole, and a pair of protrusions 30 protruding upward from the upper surface of the main part 28 at intervals in the long side direction of the main part 28. Each protrusion 30 is arranged on one side of the short side direction of the main part 28, and when the frame 6 is placed on the upper surface of the main part 28, it is arranged to be located between a pair of protruding pieces 26 formed in each through opening 20. The size L2 of the protrusion 30 in the long side direction of the main part 28 is slightly smaller than the interval L1 between the pair of protruding pieces 26 formed in each through opening 20. In addition, on the other side of the short side direction of the main part 28, a pair of rectangular receiving openings 32 are formed at intervals in the long side direction of the main part 28.

接著，支持有平台4的框體6被載置於基台8的主部28的上表面，並且基台8的各突起30被插入在框體6的各貫穿開口20，若各突起30通過形成在各貫穿開口20的一對突出片26間，各突起30將各平台4的第二部分14的背面推至上方，使各平台4旋轉而由伏平的狀態變化成豎立的狀態。此外，各平台4變化成豎立的狀態時，各平台4的第一部分12被收容在基台8的各收容開口32。 Next, the frame 6 supporting the platform 4 is placed on the upper surface of the main part 28 of the base 8, and the protrusions 30 of the base 8 are inserted into the through openings 20 of the frame 6. When the protrusions 30 pass between a pair of protruding pieces 26 formed in the through openings 20, the protrusions 30 push the back of the second part 14 of each platform 4 upward, so that each platform 4 rotates and changes from a flat state to a vertical state. In addition, when each platform 4 changes to a vertical state, the first part 12 of each platform 4 is received in each receiving opening 32 of the base 8.

接著說明使用如上所述之觀察用治具2來觀察晶片的側面的方法。在圖示之實施形態中係如圖2所 示，首先，使晶片34保持在旋轉自如地被支持在框體6的平台4的黏著層10。 Next, a method for observing the side surface of a chip using the observation jig 2 described above is described. In the illustrated embodiment, as shown in FIG2 , first, the chip 34 is held on the adhesive layer 10 of the platform 4 that is rotatably supported on the frame 6 .

圖示之實施形態中的晶片34係被稱為QFN的晶片尺寸封裝體基板被分割成各個封裝體元件晶片的矩形板狀的晶片，電極36露出於晶片的表面34a及晶片的側面34b。 The chip 34 in the illustrated embodiment is a rectangular plate-shaped chip in which a chip-sized package substrate called QFN is divided into individual package component chips, and the electrode 36 is exposed on the surface 34a and the side surface 34b of the chip.

接著，如圖3所示，將框體6載置於基台8的主部28的上表面，在框體6的各貫穿開口20插入基台8的各突起30，而使各突起30通過至形成在各貫穿開口20的一對突出片26間。如此一來，各平台4的第二部分14的背面藉由各突起30而被推至上方，各平台4旋轉而由伏平的狀態變化成豎立的狀態，並且各平台4的第一部分12被收容在基台8的各收容開口32。藉此，如圖3(b)所示，可將被保持在各平台4的晶片的側面34b朝上，可藉由顯微鏡來觀察晶片的側面34b。在各平台4旋轉時、或各平台4旋轉而變化成豎立的狀態之後，晶片34亦被保持在平台4的黏著層10，因此安定保持晶片的側面34b朝上的狀態。 Next, as shown in FIG3 , the frame 6 is placed on the upper surface of the main portion 28 of the base 8, and the protrusions 30 of the base 8 are inserted into the through openings 20 of the frame 6, so that the protrusions 30 pass between the pair of protruding pieces 26 formed in the through openings 20. In this way, the back surface of the second portion 14 of each platform 4 is pushed upward by the protrusions 30, and each platform 4 rotates and changes from a flat state to a vertical state, and the first portion 12 of each platform 4 is received in each receiving opening 32 of the base 8. Thereby, as shown in FIG3 (b), the side surface 34b of the wafer held on each platform 4 can be turned upward, and the side surface 34b of the wafer can be observed through a microscope. When each platform 4 rotates, or after each platform 4 rotates and changes to a vertical state, the chip 34 is also held on the adhesive layer 10 of the platform 4, thereby stably maintaining the side surface 34b of the chip facing upward.

如以上所示，圖示之實施形態的觀察用治具2由於具有：在表面具備有保持晶片34的黏著層10的平台4；將平台4以由伏平的狀態變化成豎立的狀態的方式可旋轉地支持，並且具備對應平台4的背面所形成的貫穿開口20的框體6；及具備有被插入在貫穿開口20且使平台4由伏平的狀態形成為豎立的狀態的突起30的基台8，因此可輕易將晶片的側面34b朝上而以顯微鏡觀察，在以顯微鏡的觀察上費工的問題即解決。As shown above, the observation jig 2 of the illustrated embodiment comprises: a platform 4 having an adhesive layer 10 on the surface for holding a chip 34; a frame 6 which rotatably supports the platform 4 in a manner that allows it to change from a flat state to a vertical state and has a through opening 20 formed on the back side of the platform 4; and a base 8 having a protrusion 30 which is inserted into the through opening 20 and allows the platform 4 to change from a flat state to a vertical state. Therefore, the side surface 34b of the chip can be easily observed under a microscope with the side surface 34b facing upward, thereby solving the problem of labor-intensive observation under a microscope.

其中，圖示之實施形態的框體6係支持一對平台4，惟框體6亦可形成為支持1個平台4，或形成為支持3個以上的平台4。圖示之實施形態的基台8係具備有一對突起30，惟基台8亦可對應平台4的數量而具備1個或3個以上的突起30。此外，亦可連結複數個圖示之實施形態的觀察用治具2。The frame 6 of the illustrated embodiment supports a pair of platforms 4, but the frame 6 may also be formed to support one platform 4, or may be formed to support more than three platforms 4. The base 8 of the illustrated embodiment has a pair of protrusions 30, but the base 8 may also have one or more than three protrusions 30 corresponding to the number of platforms 4. In addition, a plurality of the illustrated embodiments of the observation jig 2 may be connected.

2:觀察用治具 4:平台 6:框體 8:基台 10:黏著層 12:第一部分 14:第二部分 16:側面 18:軸 20:貫穿開口 22:內周面 24:支持孔 26:突出片 28:主部 30:突起 32:收容開口 34:晶片 34a:晶片的表面 34b:晶片的側面 36:電極 L1:間隔 L2:尺寸2: Observation jig 4: Platform 6: Frame 8: Base 10: Adhesive layer 12: First part 14: Second part 16: Side surface 18: Axis 20: Through opening 22: Inner surface 24: Support hole 26: Protrusion 28: Main part 30: Protrusion 32: Receiving opening 34: Chip 34a: Surface of chip 34b: Side surface of chip 36: Electrode L1: Interval L2: Dimension

[圖1]係按照本發明所構成的觀察用治具的分解斜視圖。 [圖2]係示出使晶片保持在圖1所示的平台的狀態的斜視圖。 [圖3](a)係示出連同保持有晶片的平台一起將框體載置於基台的狀態的斜視圖，(b)係示出平台由伏平的狀態變化成豎立的狀態的狀態的斜視圖。[FIG. 1] is an exploded perspective view of the observation jig constructed according to the present invention. [FIG. 2] is a perspective view showing a state where a chip is held on the platform shown in FIG. 1. [FIG. 3] (a) is a perspective view showing a state where a frame is placed on a base together with the platform holding the chip, and (b) is a perspective view showing a state where the platform changes from a flat state to a vertical state.

2:觀察用治具2: Observation fixture

4:平台4: Platform

6:框體6: Frame

8:基台8: Abutment

10:黏著層10: Adhesive layer

14:第二部分14: Part 2

18:軸18: Axis

20:貫穿開口20:Through the opening

24:支持孔24: Support hole

26:突出片26: Protruding piece

28:主部28: Main

30:突起30: Protrusion

32:收容開口32: Containment Opening

34:晶片34: Chip

34a:晶片的表面34a: Surface of wafer

34b:晶片的側面34b: Side of chip

36:電極36: Electrode

Claims (2)

一種觀察用治具，其係觀察晶片的側面時所使用的觀察用治具，其係具有： 在表面具備有保持晶片的黏著層的平台； 將該平台以由伏平的狀態變化成豎立的狀態的方式可旋轉地支持，並且具備對應該平台的背面所形成的貫穿開口的框體；及 具備有被插入在該貫穿開口且使該平台由伏平的狀態形成為豎立的狀態的突起的基台。An observation jig is used when observing the side of a chip, and comprises: a platform having an adhesive layer on the surface for holding the chip; a frame that supports the platform rotatably so as to change from a flat state to a vertical state and has a through opening formed on the back side of the platform; and a base having a protrusion that is inserted into the through opening and causes the platform to change from a flat state to a vertical state. 如請求項1之觀察用治具，其中，該框體係支持複數該平台，該基台係對應該複數平台而具備複數該突起。As for the observation jig of claim 1, wherein the frame supports a plurality of the platforms, and the base has a plurality of protrusions corresponding to the plurality of platforms.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201248807A (en) * 2011-05-27 2012-12-01 Taiwan Semiconductor Mfg Method for semiconductor packaging and packaging jig
TW201440949A (en) * 2013-03-12 2014-11-01 迪思科股份有限公司 Keep the fixture
TW201737403A (en) * 2016-01-27 2017-10-16 迪思科股份有限公司 Segmentation fixture and wafer segmentation method
TWM573080U (en) * 2018-09-21 2019-01-11 智優科技股份有限公司 Loading jig

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0184436U (en) * 1987-11-26 1989-06-05
JP2935384B2 (en) * 1991-11-30 1999-08-16 太陽誘電株式会社 Jig for visual inspection of chip-shaped circuit components
JP2556277B2 (en) * 1993-11-25 1996-11-20 日本電気株式会社 Holder device for semiconductor observation
JP2831853B2 (en) * 1994-08-31 1998-12-02 株式会社アドバンテスト IC positioning device
JP2004020205A (en) * 2002-06-12 2004-01-22 Hitachi Kokusai Electric Inc Board inspection equipment
JP2006222180A (en) * 2005-02-09 2006-08-24 Matsushita Electric Ind Co Ltd Chip mounting apparatus and chip mounting method
JP4931149B2 (en) * 2007-10-25 2012-05-16 信越ポリマー株式会社 Holding jig, a set of holding jigs, and an adherend holding device
JP5227688B2 (en) * 2008-07-28 2013-07-03 株式会社堀場製作所 Mask substrate inspection equipment
JP2010205816A (en) * 2009-03-02 2010-09-16 Shin Etsu Polymer Co Ltd Jig for examination of substrate housing container
JP2011009304A (en) 2009-06-23 2011-01-13 Fujikura Ltd Chip tray and method for moving chip
CN102712414B (en) * 2010-01-13 2016-05-04 旭硝子株式会社 The loading attachment of the accepting container of plate body and host body and plate body and transport vehicle
JP5923876B2 (en) * 2011-06-15 2016-05-25 富士電機株式会社 Semiconductor device manufacturing apparatus and semiconductor device manufacturing method
CN103208451B (en) * 2013-03-15 2015-10-28 日月光半导体制造股份有限公司 Chip jacking method and module
JP2016162914A (en) 2015-03-03 2016-09-05 株式会社ディスコ Vacuum tweezers
CN206804533U (en) * 2017-04-18 2017-12-26 浙江富春江光电科技有限公司 A kind of chip cross-section microexamination servicing unit
CN207752968U (en) 2018-01-16 2018-08-21 湖南大合新材料有限公司 A kind of semiconductor packages multi-orientation detection equipment
JP7036616B2 (en) 2018-02-16 2022-03-15 株式会社ディスコ How to divide the package board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201248807A (en) * 2011-05-27 2012-12-01 Taiwan Semiconductor Mfg Method for semiconductor packaging and packaging jig
TW201440949A (en) * 2013-03-12 2014-11-01 迪思科股份有限公司 Keep the fixture
TW201737403A (en) * 2016-01-27 2017-10-16 迪思科股份有限公司 Segmentation fixture and wafer segmentation method
TWM573080U (en) * 2018-09-21 2019-01-11 智優科技股份有限公司 Loading jig

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