TWM573080U - Loading jig - Google Patents

Abstract

A bearing fixture is provided for providing a plurality of wafers, the carrier fixture comprising a first carrier and a second carrier. The first carrier includes a first body, a plurality of first flushing holes, and a plurality of supporting units, the first flushing holes are evenly distributed on the first body, and the supporting units are respectively disposed on the first The edge of the first rinse hole is adapted to support the wafers. The second carrier can be detachably disposed on the first carrier, and the second carrier includes a second body, a plurality of second flushing holes, and a plurality of limits Bit unit. The second flushing holes are respectively formed on the second sheet corresponding to the first flushing holes, and the limiting units are respectively disposed in the second flushing holes and are adapted to be supported by the top surface of the wafers. .

Description

Bearing fixture

The present invention relates to a fixture, and more particularly to a bearing fixture.

A wafer made of a quad flat planar leadless package (QFN, DR-QFN) is manufactured by simultaneously molding a wafer assembly having a plurality of wafers in a mold, and then The wafer assembly is cut into a plurality of wafers by a cutter. However, since the cutting tool itself will generate high temperature due to friction, and the pins of the plurality of metal materials of the wafer are exposed on the side cutting surface except for the bottom surface of the wafer, the pins of the wafer are The cutting may be partially melted due to the temperature of the tool and splashed on the side cutting faces, thereby causing the pins to be shorted to each other due to the metal spatter, so that the wafer cannot be applied to the product.

Accordingly, it is an object of the present invention to provide a carrier fixture that can be provided for a plurality of wafers and that can pass the treatment fluid for cleaning to remove metal spills from the wafers.

Therefore, in some embodiments, the present invention is suitable for providing a plurality of rectangular plate-shaped wafers, each of which has a bottom surface and a top surface on the opposite side, and four connected to the bottom surface. The side surface of the top surface has four pin areas respectively located at four edges of the bottom surface, and the bearing fixture comprises a first carrier and a second carrier. The first carrier package a first sheet body, a plurality of first flushing holes, and a plurality of supporting units, the first sheet body having a first inner side surface and a first outer side surface on opposite sides, the first flushing holes are uniform Disposed from the first inner side surface to the first outer side surface formed on the first sheet body, each first flushing hole has a hole section larger than a bottom surface of the wafer, and the supporting units are respectively disposed in the first flushing holes And is adapted to support the wafers, each support unit having four first support structures respectively corresponding to four corners of the wafer, and a second support structure coupled to the first support structure, Each of the first supporting structures has a protrusion and a limiting slot extending from a hole wall surface of the corresponding first flushing hole toward a center of the first flushing hole, and the protrusion protrudes from the first a first inner side surface of the body and having a convex top surface protruding from the first inner side surface, the limiting groove is formed on the convex block and adapted to receive the corners of the wafers, and the limit is The groove is from a top surface of the bump of the bump adjacent to a center of the first flushing hole The second outer surface is formed by extending from the first outer side surface, and the second supporting structure has at least one supporting surface. The bottom surface of the bit groove is adjacent to the top surface of the bump of the bump and is adapted to abut against a region of the bottom surface of the wafer other than the pin area. The second carrier can be detachably disposed on the first carrier, and the second carrier includes a second body, a plurality of second flushing holes, and a plurality of limits a second unit having a second inner side and a second outer side on opposite sides, the second inner side being opposite to each other with the first inner side of the first carrier, the second The rinsing holes are respectively formed in the second slabs corresponding to the first rinsing holes and are formed from the second inner side surface to the second outer side surface, and the second rinsing holes have a hole section larger than the top surface of the wafer, Equal limiting units are respectively disposed in the second flushing holes and are adapted to be abutted against the top surface of the wafers.

In some implementations, the second support structure has four support ribs respectively extending from the four outer bumps adjacent to the first outer side surface, and each support rib has a corresponding convex bump adjacent to the support rib. An extension portion extending toward a center of the corresponding first flushing hole at the first outer side surface, and a support extending from a distal end of the extending portion toward a top surface of the convex portion and having a support surface at the end The support surface of the support portion is adapted to abut against an area outside the pin area of the bottom surface of the wafers.

In some embodiments, the support portion is a cylinder having a rectangular cross section.

In some embodiments, each of the second support structures further has four retaining posts that are respectively coupled between the ends of the extensions of the adjacent support ribs.

In some implementations, the second support structure has four support ribs, four detachment prevention posts, and four support protrusions, and the four support ridges are respectively adjacent to the first outer block from the four protrusions. Extending from the side surface, each of the support ribs has an extension from the corresponding first convex portion toward the center of the corresponding first flushing hole, and the four retaining columns are respectively connected to the phase Between the ends of the extending portions of the adjacent supporting ribs, the four supporting convex portions respectively extend from the four retaining columns toward the top surface of the protruding block, and the end of each supporting convex portion has a Said support surface.

In some implementations, each of the limiting units has a plurality of limiting ribs extending from a wall of the corresponding second rinsing hole toward the center of the second rinsing hole, and a connection to the limit a limiting post between the ends of the ribs and protruding from the second inner side, the limiting posts being adapted to abut against the top surface of the wafers.

In some implementations, the limiting post is further formed with a cylinder extending along the limiting post The direction is formed through the through hole of the limiting post.

In some embodiments, the bottom surface of each of the wafers further has a heat dissipation region at a center of the bottom surface and spaced apart from the pin regions, and a seal between the pin regions and the heat dissipation region. In the glue region, the limiting column has a column shape corresponding to the sealing region of the wafer, and the through hole of the limiting column corresponds to the heat dissipation region of the wafer.

In some embodiments, it is suitable for the wafers to be loosely disposed between the support units and the limit units.

In some implementations, the limiting slot of each first supporting structure has a first slot portion that is farther away from the top surface of the bump, and a connecting between the first slot portion and the top surface of the bump. a second groove portion, the cross-sectional size of the first groove portion facing the top surface of the bump is uniform, and a cross-sectional dimension of the second groove portion facing the top surface of the bump is connected to the first groove portion. The top surface of the bump is gradually enlarged.

In some embodiments, the first carrier further includes a plurality of spacers respectively formed at the corners of the first inner side of the first panel, the spacers being supported by the second carrier a second inner side surface such that the second inner side of the second carrier is opposite to the first inner side of the first carrier.

In some embodiments, each of the blocks is formed with a plurality of drainage channels that are parallel to the first inner side and are in staggered communication with each other.

In some implementations, at least two of the pads are each formed with a positioning hole, and the second carrier further includes a plurality of positioning posts formed on the second inner side of the second body, the positioning The columns are respectively corresponding to the positioning holes.

In some embodiments, the second carrier further includes a plurality of perforations formed in the second sheet and extending from the second inner side to the second outer side, the perforations being distributed in the second flush The peripheral area of the hole.

In some embodiments, the bottom surface of each of the wafers further has a heat dissipation region at a center of the bottom surface and spaced apart from the pin regions, and a seal between the pin regions and the heat dissipation region. a glue area adapted to abut against the seal area of the bottom surface.

The present invention has at least the following effects: the wafers are accommodated by the supporting unit of the first carrier and the limiting unit of the second carrier, and the aperture is larger than the first carrier of the wafer. The first rinsing hole and the second rinsing hole of the second carrier enable the processing liquid to pass through and clean the sides of the wafers to remove metal spatters on the sides of the wafers that cause the pins to be short-circuited.

10‧‧‧bearing fixture

1‧‧‧First carrier

11‧‧‧ first piece

111‧‧‧First inner side

112‧‧‧First outer side

12‧‧‧First flushing hole

13‧‧‧Support unit

131‧‧‧First support structure

132‧‧‧Bumps

132a‧‧‧Top surface of the bump

133‧‧‧Limited slot

133a‧‧‧First groove

133b‧‧‧Second trough

130‧‧‧second support structure

134‧‧‧Support ribs

134a‧‧‧Extension

134b‧‧‧Support

134c‧‧‧ support surface

135‧‧‧Anti-column

136‧‧‧ flow path

137‧‧‧Support convex

137a‧‧‧ support surface

14‧‧‧

141‧‧‧Draining channel

142‧‧‧Positioning holes

15‧‧‧The first corner

16‧‧‧First positioning hole

2‧‧‧Second carrier

21‧‧‧Second body

211‧‧‧Second inner side

212‧‧‧Second outer side

22‧‧‧Second flushing hole

23‧‧‧Limited unit

231‧‧‧Limited ribs

232‧‧‧Limited column

232a‧‧‧through hole

24‧‧‧Perforation

25‧‧‧Positioning column

26‧‧‧The second corner

27‧‧‧Second positioning hole

3‧‧‧ wafer

31‧‧‧ bottom

311‧‧‧ pin area

312‧‧‧heating area

313‧‧‧ Sealing area

32‧‧‧ top surface

33‧‧‧ side

34‧‧‧ pins

Other features and effects of the present invention will be apparent from the following description of the drawings. FIG. 1 is a schematic view of a wafer; FIG. 2 is a side view of the wafer; FIG. The schematic diagram illustrates a first carrier of a first embodiment of the present invention; FIG. 4 is a bottom view showing a second carrier of the first embodiment; 5 is a partial perspective view showing the supporting unit of the first carrier and the limiting unit of the second carrier; FIG. 6 is a view different from FIG. 5; FIG. 7 is a partial top view illustrating the FIG. 8 is a partial top plan view showing the wafer placed on the support unit of the first carrier; FIG. 9 is a partial top plan view illustrating the first carrier of a modified embodiment. FIG. 10 is a partial perspective view showing the limiting slot of the supporting unit of the modified embodiment; FIG. 11 is a partial bottom view showing the limiting unit of the second carrier; FIG. 12 is a partial bottom view. FIG. 13 is a partial cross-sectional view of FIG. 12; FIG. 14 is a partial top plan view showing the wafer being placed on the supporting unit of the first carrier FIG. 15 is a partial cross-sectional view taken along line XV-XV of FIG. 14; FIG. 16 is a top plan view showing a second embodiment of the novel carrier fixture example FIG. 17 is a partial perspective view showing the supporting unit of the first carrier and the limiting unit of the second carrier; FIG. 18 is a view different from FIG. 17; FIG. 19 is a partial top view FIG. 20 is a partial top plan view showing the wafer placed on the supporting unit of the first carrier; FIG. 21 is a partial cross-sectional view showing the wafer placed on the wafer Supporting unit of the first carrier FIG. 22 is a top plan view showing a first carrier of a third embodiment of the present invention; FIG. 23 is a bottom view showing the third embodiment. Figure 2 is a partial top plan view showing the supporting unit of the first carrier; Figure 25 is a partial bottom view showing the limiting unit of the second carrier; Figure 26 is a partial The top view shows that the wafer is placed between the support unit of the first carrier and the limiting unit of the second carrier; FIG. 27 is a partial perspective view showing a fourth embodiment of the novel carrier fixture. The supporting unit of the first carrier and the limiting unit of the second carrier; FIG. 28 is a view different from that of FIG. 27; FIG. 29 is a partial top view showing the supporting unit of the first carrier; Figure 30 is a partial top plan view showing the wafer placed on the support unit of the first carrier; and Figure 31 is a partial cross-sectional view showing the wafer being placed on the support unit of the first carrier and the first Two bearers Between the limit units of the piece.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

Referring to FIG. 1 to FIG. 4, a first embodiment of the present invention is applicable to a plurality of wafers 3 having a square plate shape, and the processing liquid can pass through to clean and remove the metal on the wafers 3. Sputters (not shown), in the first embodiment, the wafers 3 are made in a dual row quad flat no lead (DR-QFN), but in In other embodiments, the wafers 3 may also be fabricated in a package such as QFN or DFN. Each of the wafers 3 has a bottom surface 31 and a top surface 32 on the opposite side, and four side surfaces 33 connected between the bottom surface 31 and the top surface 32. The bottom surface 31 has four pin regions 311 respectively located at four edges of the bottom surface 31, a heat dissipation region 312 located at a center of the bottom surface 31 and spaced apart from the pin regions 311, and a a sealing area 313 between the pin area 311 and the heat dissipation area 312. Further, the wafer 3 has a plurality of pins 34, each of which is simultaneously exposed at one of the pin regions 311 and at a side 33 adjacent to the pin region 311, the metal spatter is When the wafers 3 are subjected to a dicing process, the pins 34 exposed at the side faces 33 of the wafer 3 are melted and sprinkled on the side faces 33 due to the high temperature knives, and the generation of the metal spatter may cause the The case where the pins 34 are short-circuited with each other. The bearing fixture 10 includes a first carrier 1 and a second carrier 2.

The first carrier 1 includes a first body 11 , a plurality of first irrigation holes 12 , and a plurality of support units 13 . The first body 11 is substantially rectangular, but is not limited thereto. In addition, in the first embodiment, the first carrier 1 is made of stainless steel, but is not limited thereto. The first sheet body 11 has a first inner side surface 111 and a first outer side surface 112 on opposite sides. The first flushing holes 12 are evenly distributed and penetrate from the first inner side surface 111 to the first outer side surface 112. The first sheet body 11 is formed on the first sheet body 11, and the cross section of each of the first flushing holes 12 is larger than the bottom surface 31 of the wafer 3.

Referring to FIG. 5 to FIG. 8 , the supporting units 13 are respectively disposed at edges of the first flushing holes 12 and are adapted to support the wafers 3 , and each supporting unit 13 has four corresponding to the wafer 3 respectively. a first support structure 131 at a corner, and a second support structure 130 connected to the first support structure 131. Each of the first support structures 131 has a bump 132 and a limiting slot 133. The protrusion 132 extends from the center of the first rinsing hole 12 toward the center of the first rinsing hole 12, and the protrusion 132 protrudes from the first inner side 111 of the first piece 11 and has the same A bump top surface 132a protrudes from the inner side surface 111. The limiting slot 133 is formed in the bump 132 and is adapted to receive the corners of the wafers 3, and the limiting slot 133 is from the bump 132. The bump top surface 132a extends adjacent to the center of the first flushing hole 12 toward the first outer side surface 112. The second supporting structure 130 is adjacent to the first outer side surface 112 of the bump 132. Extendedly formed, the second support structure 130 has four shapes extending from the four outer protrusions 132 adjacent to the first outer side surface 112 Supporting ribs 134, each of the supporting ribs 134 has an extending portion 134a extending from the corresponding first protruding portion 132 toward the center of the corresponding first flushing hole 12, and a self-corresponding portion a support portion 134b extending from the end of the extending portion 134a toward the convex top surface 132a. The support portion 134b has a supporting surface 134c at the end, and the supporting surface 134c of the supporting portion 134b of the supporting rib 134 is compared. The bottom surface of the limiting slot 133 is adjacent to the bump top surface 132a of the bump 132 and is adapted to abut against a region of the bottom surface 31 of the wafer 3 other than the pin region 311. Further, in the first embodiment, the support surface 134c of the support portion 134b is adapted to abut against the seal region 313 between the pin region 311 and the heat dissipation region 312, and the support portion is 134b is a rectangular columnar shape having rounded corners at the corners. The bottom surface of the limiting groove 133 is adjacent to the supporting surface 134c of the supporting portion 134b of the supporting protrusion 134 of the bump top surface 132a of the bump 132. The periphery of the bottom surface 31 of the wafer 3 is not directly in contact with the limiting grooves 133, so as to prevent the limiting grooves 133 from blocking the processing liquid from contacting the wafers 3, and making the processing liquid pass the first bearing more easily. The workpiece 1 and the wafers 3 are used to increase the fluidity of the treatment liquid in the bearing fixture 10. Moreover, since the supporting surface 134c of the supporting portion 134b of the supporting ribs 134 is corresponding to the sealing region 313 of the wafer 3, the supporting portion 134b of the supporting ribs 134 can be prevented from scratching the bottom surface of the wafer 3. The pin area 311 of the 31 and the heat dissipating area 312 prevent the metal plating on the metal 34 or the heat dissipating area 312 of the pin 34 of the wafer 3 from being damaged, and the supporting portion 134b having a rectangular cross section is further The shape of the sealant region 313 can be matched to avoid the support portion 134b touching the region other than the sealant region 313.

In addition, in the first embodiment, the limiting slot 133 of each first supporting structure 131 has a first slot portion 133a farther away from the bump top surface 132a, and a first slot portion 133a is coupled to the first slot portion 133a. The second groove portion 133b between the top surfaces 132a of the bumps has a uniform cross-sectional dimension of the first groove portion 133a toward the top surface 132a of the bump, and the second groove portion 133b faces the direction of the top surface 132a of the bump. The cross-sectional size is gradually enlarged from the junction with the first groove portion 133a toward the junction with the bump top surface 132a. In other words, the top opening of the limiting groove 133 has an oblique angle which gradually increases toward the outer direction, and the angle of the oblique angle is 15 degrees in the first embodiment, but is not limited thereto. Thereby, the corners of the wafers 3 can be more easily placed in the limiting grooves 133, so that the wafers 3 can be placed on the supporting unit 13 of the first carrier 1 more easily and smoothly. In addition, with reference to FIG. 9 and FIG. 10 , in a modified embodiment, each of the first supporting structures 131 further has a limiting groove 133 formed from the top of the limiting slot 133 to the bottom of the limiting slot 133 . The flow path 136 at the rounded corner, through the flow path 136 at the rounded corner of the limiting groove 133 The treatment liquid can be more easily flowed to increase the fluidity of the treatment liquid in the load-bearing jig 10. In addition, in the embodiment of the variation, the second groove portion 133b of the limiting groove 133 occupies a large depth ratio, and the second groove portion 133b has a gentle slope along the depth direction thereof, that is, It is said that the oblique angle at the top opening of the limiting groove 133 is small.

Referring to FIGS. 4 to 6 and FIG. 11 , the second carrier 2 can be detachably disposed on the first carrier 1 and detachably disposed on the first carrier 1 , and the second carrier 2 includes a second piece. The body 21, the plurality of second flushing holes 22, and the plurality of limiting units 23. The second sheet 21 is substantially rectangular, but is not limited thereto. In addition, in the first embodiment, the first carrier 1 is made of stainless steel, but is not limited thereto. The second inner body 21 has a second inner side surface 211 and a second outer side surface 212 opposite to each other, and the second inner side surface 211 is opposite to the first inner side surface 111 of the first carrier 1 . The second flushing holes 22 are respectively formed in the second sheet body 21 corresponding to the first flushing holes 12 and penetrate from the second inner side surface 211 to the second outer side surface 212, and the second flushing holes 22 The hole section is larger than the top surface 32 of the wafer 3. The limiting units 23 are respectively disposed in the second flushing holes 22 and are adapted to be abutted against the top surface 32 of the wafers 3, and each of the limiting units 23 has a plurality of holes from the corresponding second flushing holes 22 a limiting rib 231 extending from a wall toward the center of the second rinsing hole 22, and a connecting portion between the ends of the limiting ribs 231 and protruding from the second inner side surface 211 and forming a circular column a limiting post 232, the limiting post 232 is adapted to be abutted against the top surface 32 of the wafer 3. In a variant embodiment, the limiting post 232 contacts the edge of the contact surface of the wafer 3 with a conducting circle An angle to prevent the limit post 232 from scratching the wafer 3. In the first embodiment, the limiting ribs 231 extend from the four edges of the corresponding second rinsing holes 22. However, with reference to FIG. 12 and FIG. 13 , in another variant embodiment, the limiting ribs 231 may also be The four corners of the corresponding second rinsing hole 22 extend toward the center of the second rinsing hole 22, and in the modified embodiment, the limiting post 232 is in the sealing area 313 with the wafer 3. (See FIG. 1) a corresponding rectangular column shape, and the limiting post 232 is further formed with a heat dissipation region 312 formed in the limiting post 232 and extending along the column extending direction of the limiting post 232. (See FIG. 1) the corresponding through hole 232a is prevented from being scratched when the wafer 3 is placed upside down on the reverse side and the bottom surface of the wafer 3 is supported by the corresponding limiting unit 23. The pin area 311 of the wafer 3 and the heat dissipation area 312 (see FIG. 1), and the through hole 232a can also flow the processing liquid to increase the fluidity of the processing liquid.

Referring to FIG. 14 and FIG. 15 , when the wafer 3 is disposed on the first carrier 1 and is disposed between the supporting unit 13 of the first carrier 1 and the limiting unit 23 of the second carrier 2 When the hole section is larger than the first rinsing hole 12 of the first carrier 1 of the wafer 3 and the second rinsing hole 22 of the second carrier 2, the edge and the corner of the wafer 3 are exposed to the bearing fixture. 10, that is, the first carrier 1 and the second carrier 2 can allow the processing liquid to penetrate and rinse the side 33 of the wafer 3, so that the processing liquid can be applied to the side 33 of the wafer 3. The metal spatter is subjected to a complete bite, thereby effectively removing the metal spatter on the wafer 3. It should be noted that although in the first embodiment, the first flushing holes 12 and the first The two flushing holes 22 are substantially square, but in other embodiments, the first flushing holes 12 and the second flushing holes 22 may have other shapes such as a circle or a rectangle. In addition, in the first embodiment, the bearing fixture 10 is adapted to be disposed between the supporting units 13 and the limiting units 23 in a loose fit. That is, the wafer 3 has a gap with the groove wall of the limiting groove 133 of the supporting unit 13, and when the wafer 3 is supported by the supporting portion 134b of the supporting unit 13, the wafer 3 There is also a gap with the limiting post 232 of the limiting unit 23 to make the wafer 3, the vertical direction, the left-right direction, and the front-rear direction can be shaken between the support unit 13 and the limiting unit 23, so that the processing liquid can more completely contact the surface of the wafer 3 when the wafer 3 is shaken. At the same time, the fluidity of the treatment liquid in the load-bearing jig 10 is also increased. In addition, referring to FIG. 15, when the wafer 3 is disposed on the supporting unit 13, the top surface 12 of the wafer 3 is higher than the first groove portion 133a and the second groove portion 133b of the limiting groove 133. The junction of the wafer 3 can be placed in the support unit 13 more easily, but not limited thereto.

In addition, referring to FIG. 3 , FIG. 4 and FIG. 15 , in the first embodiment, the first carrier 1 further includes a plurality of corners respectively formed on the first inner side surface 111 of the first sheet 11 and The L-shaped spacers 14 are formed, and each of the spacers 14 is formed with a plurality of drainage channels 141 which are parallel to the first inner side surface 111 and are vertically intersected with each other. The spacers 14 are supported on the second inner side surface 211 of the second carrier 2 to maintain the flatness between the first carrier 1 and the second carrier 2, and the first carrier is Between the first inner side surface 111 of the first carrier member 1 and the second inner side surface 211 of the second carrier member 2, a gap is supported between the first carrier member 1 and the second carrier member 2, that is, The spacer 14 causes the second inner side 211 of the second carrier 2 to face each other at a distance from the first inner side 111 of the first carrier 1. The gap can prevent the treatment liquid from being easily retained between the first inner side surface 111 of the first carrier 1 and the second inner side surface 211 of the second carrier 2, and can also pass a lateral airflow to enable The treatment liquid between the first inner side surface 111 of the first carrier member 1 and the second inner side surface 211 of the second carrier member 2 can be carried away by the air flow, and the lateral air flow can be, for example, a liquid air cutter. The device is provided. It should be noted that the protrusion 132 of the supporting unit 13 of the first carrier 1 also has a function of providing a gap between the first carrier 1 and the second carrier 2, and therefore, in a variant embodiment , the bearing fixture 10 The first carrier 1 may not have the spacers 14 , and in another variant embodiment, the spacers 14 may also be formed on the second inner side surface 211 of the second carrier 2 without For the limit. The liquid discharge passages 141 of the spacers 14 can collect the treatment liquid by the adhesion and cohesive force characteristics of the treatment liquid, and the treatment liquid collected in the liquid discharge passages 141 can be easily blown by the lateral air flow. The jig 10 is carried away to prevent the treatment liquid from remaining between the spacers 14 and the second inner side surface 211 of the second carrier 2. In addition, in the first embodiment, the second carrier 2 further includes a plurality of through holes 24 formed in the second body 21 and extending from the second inner side surface 211 to the second outer side surface 212. Perforations 24 are distributed in the peripheral regions of the second rinsing holes 22, which also facilitate the passage of the gas stream and the discharge of the treatment liquid.

In addition, each of the pads 14 is formed with a positioning hole 142, and the second carrier 2 further includes a plurality of positioning posts 25 formed on the second inner side surface 211 of the second body 21, and the positioning posts 25 respectively corresponding to the positioning holes 142. In order to enable the second carrier 2 to be positioned on the first carrier 1, and since only three of the spacers 14 are formed with positioning holes 142, this also ensures that the user will not be in the wrong direction. The second carrier 2 is disposed on the first carrier 1 . In addition, in the first embodiment, the first carrier 1 further includes two first corner portions 15 respectively formed at two adjacent corners of the first body 11, the first carrier 1 Further comprising two second corner portions 26 formed on the second sheet 21 and corresponding to the first corner portions 15 respectively, the first corner portion 15 and the second corner portion 26 When the carrying jig 10 is provided, for example, in a transporting machine (not shown), it is possible to avoid the occurrence of an erroneous setting.

Furthermore, in general, the wafers 3 are one prior to being transferred to the carrier fixture 10. a carrier (not shown) is received, the first carrier 1 is corresponding to the carrier, and in the first embodiment, the first carrier 1 further has a plurality of the first carrier The first positioning holes 142 of the first positioning holes 142 are matched with the positioning posts 25 (not shown) of the carrier. Therefore, the user can manually cover the first carrier 1 on the carrier plate on which the wafers 3 are mounted, and flip the first carrier 1 and the carrier upside down, and the user can quickly The wafers 3 on the carrier are placed on the support units 13 of the first carrier 1, respectively, and the application of the wafers 3 to the support units 13 in a loose fit also contributes to the execution of the above method.

In addition, the second carrier 2 has a plurality of second positioning holes 142 formed in the second body 21, and the second positioning holes 142 are matched with a grasping device (not shown). The second carrier 2 is grasped by the gripping device.

Referring to FIG. 16 to FIG. 18, a second embodiment of the present type of load bearing fixture 10 is substantially the same as the first embodiment, but the difference is that each second support structure 130 of the second embodiment further has four A detachment prevention post 135 is connected between the ends of the extensions 134a of the adjacent support ribs 134, respectively. Referring to FIG. 19 to FIG. 21, the anti-seismic columns 135 together form a monogram-shaped structure, and the anti-desorption column 135 can further prevent the wafers 3 from being detached from the first carrier 1 when tilted, and the anti-off columns The position of 135 does not block the edge of the wafer 3 and its side surface 33, and the positions of the anti-separation pillars 135 correspond to the sealing region 313 of the wafer 3, so that the processing liquid can smoothly pass to rinse the wafer. Side 33 of 3. Moreover, in the second embodiment, the retaining posts 135 are flush with the outer side surface 33 of the first carrier 1 to maintain the flatness of the first carrier 1 when placed on a plane.

Referring to FIG. 22 to FIG. 26, a third embodiment of the present type of carrying fixture 10 is substantially identical to the third embodiment. The second embodiment is the same, but the difference is that the third embodiment is applicable to the plurality of wafers 3 having a rectangular plate shape, the first flushing holes 12 of the first carrier 1 and the second carrier 2 The second rinsing hole 22 is substantially rectangular, and the supporting unit 13 of the first carrier 1 is also formed to conform to the rectangular plate-like shape of the wafer 3 to support the wafers 3.

Referring to FIG. 27 to FIG. 31, a fourth embodiment of the present type of load bearing fixture 10 is substantially the same as the third embodiment, but the difference is that the second support structure 130 has four supports in the fourth embodiment. a rib 134, four detachment prevention posts 135, and four support protrusions 137 respectively formed from the four protrusions 132 adjacent to the first outer side surface 112, each support rib The 134 has an extending portion 134a extending from the first outer side surface 112 toward the center of the corresponding first flushing hole 12, and the four retaining columns 135 are respectively connected to the adjacent supporting protrusions. Between the ends of the extensions 134a of the strips 134, the four support protrusions 137 extend from the four retaining posts 135 toward the top surface of the bumps 132, and the ends of each of the support protrusions 137 There is a supporting surface 137a corresponding to the sealing region 313 of the wafer 3, and in the fourth embodiment, the supporting surfaces 137a are supported by the long sides of the sealing region 313, and the foregoing In the first to third embodiments, the supporting surfaces 134c (see FIG. 8) are abutted against the sealing area 313. Different corners. In addition, the supporting protrusions 137 have rounded corners at the ends thereof to prevent the supporting protrusions 137 from scratching the wafer 3. In addition, in the fourth embodiment, the first supporting structures 131 of the supporting unit 13 also have a flow path 136, and the first supporting structures 131 and one of the modified embodiments of the first embodiment (see FIG. 9 is substantially the same as FIG. 10) and will not be described again here. Moreover, in the fourth embodiment, the limiting units 23 of the second carrier 2 are substantially the same as the other variation embodiment of the first embodiment (see FIG. 12 and FIG. 13), and no longer Narration. and, The support unit 13 of the first carrier 1 and the limiting unit 23 of the second carrier 2 have rounded corners at multiple locations to avoid sharp edges scratching the wafer 3.

In summary, the load bearing fixture 10 of the present invention accommodates the wafers 3 by the supporting unit 13 of the first carrier 1 and the limiting unit 23 of the second carrier 2, and the holes are The first rinsing hole 12 of the first carrier 1 and the second rinsing hole 22 of the second carrier 2 are larger in cross section, so that the processing liquid can pass through and clean the side 33 of the wafer 3 to remove the A metal spatter that causes the pins 34 to be shorted is formed on the side 33 of the wafer 3.

However, the above is only the embodiment of the present invention, and when it is not possible to limit the scope of the present invention, all the simple equivalent changes and modifications according to the scope of the patent application and the contents of the patent specification are still This new patent covers the scope.

Claims (15)

A bearing fixture is provided for a plurality of rectangular plate-shaped wafers, each wafer having a bottom surface and a top surface on opposite sides, and four sides connected between the bottom surface and the top surface, the bottom surface There are four pin areas respectively located at four edges of the bottom surface, the carrying fixture comprises: a first carrier, a first piece, a plurality of first flushing holes, and a plurality of supporting units, The first sheet has a first inner side surface and a first outer side surface on opposite sides, and the first flushing holes are uniformly distributed and formed on the first piece from the first inner side surface to the first outer side surface a hole having a hole section larger than a bottom surface of the wafer, wherein the support units are respectively disposed at edges of the first flush holes and are adapted to support the wafers, and each support unit has four corresponding to a first supporting structure at four corners of the wafer, and a second supporting structure connected to the first supporting structure, each of the first supporting structures has a bump and a limiting slot, and the bump corresponds to The wall of the first flushing hole faces the a center of the flushing hole is extended, and the protrusion protrudes from the first inner side surface of the first sheet body and has a convex top surface protruding from the first inner side surface, and the limiting groove is formed on the convex portion The block is adapted to receive the corners of the wafers, and the limiting slot is formed from a top surface of the bump of the bump adjacent to a center of the first flushing hole toward the first outer side surface. The second supporting structure is formed from the protruding portion adjacent to the first outer side surface, and the second supporting structure has at least one supporting surface, and the supporting surface is adjacent to the bottom surface of the limiting slot a top surface of the bump and adapted to abut against an area outside the pin area of the bottom surface of the wafers; and a second carrier member engageable with the first carrier and detachably disposed on the first a carrier member, the second carrier member includes a second sheet body, a plurality of second flushing holes, and a plurality of limiting units, the second sheet body having a second inner side surface on the opposite side and a first a second outer side surface opposite to the first inner side surface of the first carrier member, wherein the second flushing holes respectively correspond to the first flushing holes and penetrate from the second inner side surface to the first inner side The second outer surface is formed on the second sheet, and the second flushing holes have a hole section larger than the top surface of the wafer, and the limiting units are respectively disposed on the second processing holes and are suitable for the wafers. The top is against. The supporting jig of claim 1, wherein the second supporting structure has four supporting ribs respectively extending from the four outer blocks adjacent to the first outer side, each supporting rib having a self The corresponding protrusion is adjacent to the extension of the first outer side surface toward the center of the corresponding first flushing hole, and an end extending from the end of the extending portion toward the top surface of the protrusion and having an end The support portion of the support surface, the support surface of the support portion is adapted to abut against a region outside the pin region of the bottom surface of the wafers. The load-bearing jig according to claim 2, wherein the support portion is a cylinder having a rectangular cross section. The load-bearing jig of claim 2, wherein each of the second support structures further has four retaining posts respectively connected between the ends of the extensions of the adjacent support ribs. The bearing fixture of claim 1, wherein the second supporting structure has four supporting ridges, four retaining columns, and four supporting protrusions, wherein the four supporting ridges are respectively from the four convex The block is formed adjacent to the first outer side surface, and each of the support ribs has an extension extending from the corresponding first convex portion toward the center of the corresponding first flushing hole. Decoupling is respectively connected between the ends of the extensions of the adjacent support ribs, and the four support protrusions respectively extend from the four detachment prevention columns toward the top surface of the protrusion, and each support The end of the convex portion has the support surface. The load-bearing jig according to claim 1, wherein each of the limiting units has a plurality of limiting ribs extending from a hole wall surface of the corresponding second rinsing hole toward a center of the second rinsing hole, and a connection between the ends of the limiting ribs and protruding from the second inner side A limit post that is adapted to be placed against the top surface of the wafer. The bearing fixture of claim 6, wherein the limiting post is further formed with a through hole formed in the limiting post along the extending direction of the cylinder of the limiting post. The carrier fixture of claim 7, wherein the bottom surface of each of the wafers further has a heat dissipation area at a center of the bottom surface and spaced apart from the pin area, and a pin area located at the pin area a sealing region between the heat dissipating regions, the limiting post is in a column shape corresponding to the sealing region of the wafer, and the through hole of the limiting post corresponds to the heat dissipating region of the wafer. The bearing fixture of claim 1 is adapted to be disposed between the supporting units and the limiting units for loosely fitting the wafers. The bearing fixture of claim 1, wherein the limiting slot of each first supporting structure has a first slot portion that is farther away from the top surface of the bump, and a first slot portion and the protrusion are connected to the first slot portion a second groove portion between the top surfaces of the block, the cross-sectional size of the first groove portion facing the top surface of the bump is uniform, and the cross-sectional size of the second groove portion facing the top surface of the bump is determined by the first groove The joint portion gradually expands toward the junction with the top surface of the bump. The bearing fixture of claim 1, wherein the first carrier further comprises a plurality of spacers respectively formed at corners of the first inner side of the first panel, the spacers for supporting And a second inner side of the second carrier, such that the second inner side of the second carrier is opposite to the first inner side of the first carrier. The load-bearing jig according to claim 11, wherein each of the spacers is formed with a plurality of drainage channels that are parallel to the first inner side and are alternately connected to each other. The carrier fixture of claim 11, wherein at least two of the spacers are each formed with a positioning hole, and the second carrier further comprises a plurality of positioning positions formed on the second inner side of the second body. The positioning pins are respectively disposed on the positioning holes. The bearing fixture of claim 1, wherein the second carrier further comprises a plurality of perforations formed in the second panel and extending from the second inner side to the second outer side, the perforations are distributed In the peripheral region of the second flushing holes. The load-bearing jig according to any one of claims 1 to 14, wherein the bottom surface of each of the wafers further has a heat dissipating region at a center of the bottom surface and spaced apart from the pin regions, and a And a sealing area between the pin area and the heat dissipating area, the supporting surface is adapted to abut against the sealing area of the bottom surface.