TW201940398A - Electronic component transport device and an electronic component inspection device that can perform at least two types of inspection on the electronic components during the transport of the electronic components - Google Patents

Abstract

The present invention provides an electronic component transport device and an electronic component inspection device that can perform at least two types of inspection on the electronic components during the transport of the electronic components. The electronic component transport device transports the electronic component to the first inspection section that performs the first inspection on the electronic component and the second inspection section that performs the second inspection different from the first inspection on the electronic component. It has a holding section that holds the electronic component, a moving-carrying section that carries the electronic component, and a control section that controls the holding section. The control section makes the holding section transport the electronic component from the moving-carrying section to the first inspection section, makes the holding section transport the electronic component that has been preformed with the first inspection from the first inspection section to the moving-carrying section, and makes the holding section transport the electronic component from the moving-carrying section to the second inspection section.

Description

Electronic component transfer device and electronic component inspection device

The invention relates to an electronic component conveying device and an electronic component inspection device.

Conventionally, when performing electrical inspection of electronic components such as IC (Integrated Circuit) components, an IC processor that transports electronic components is used (for example, refer to Patent Document 1). The IC processor described in Patent Document 1 is in a state where a test socket connected to a tester is provided. Then, the electronic component is transported in this state, and the electronic component is placed in the test socket during the transportation, and the electronic component is inspected in one kind.
[Prior technical literature]
[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2000-088918

[Problems to be solved by the invention]

The IC processor described in Patent Document 1 cannot perform multiple inspections of electronic parts. After one inspection is completed, the electronic parts that have completed the inspection must be placed on a tray again, and the tray must be moved to an IC for other inspections. Processor.
[Technical means to solve the problem]

The present invention has been made in order to solve the above problems, and can be implemented as the following forms.

The electronic component transporting device of the present invention is a device that can be configured to mount electronic components, and is characterized in that:
A transfer unit that transfers the above-mentioned electronic parts;
In the first area, a first inspection unit is disposed, and the first inspection unit carries the electronic components, and the first inspection is performed on the electronic parts; and in the second area, a second inspection unit is disposed, and the second inspection unit carries the The electronic part is placed, and the electronic part is subjected to a second inspection which is different from the first inspection; and the conveying unit includes a holding unit that holds the electronic part and sequentially places the electronic part in the first inspection unit and The second inspection unit; and a collection unit that place the electronic component after the first inspection and the second inspection are performed on the mounting member.

The electronic component inspection device of the present invention is a device that can be configured to mount electronic components, and is characterized in that:
A transfer unit that transfers the above-mentioned electronic parts;
A first inspection unit that mounts the electronic component and performs the first inspection on the electronic component;
A first area in which the first inspection unit is arranged;
A second inspection unit that mounts the electronic component and performs a second inspection different from the first inspection on the electronic component; and a second area that includes the second inspection unit; and the transport unit includes a holding unit , Which holds the electronic parts and sequentially places them in the first inspection unit and the second inspection unit; and a recycling unit, which places the electronic parts after the first inspection and the second inspection, The mounting member.

Hereinafter, the electronic component transfer device and the electronic component inspection device of the present invention will be described in detail based on a preferred embodiment shown in the accompanying drawings.

<First Embodiment> Hereinafter, a first embodiment of an electronic component transfer device and an electronic component inspection device according to the present invention will be described with reference to Figs. 1 to 42. In the following, for convenience of explanation, as shown in FIG. 1, three axes that are orthogonal to each other are referred to as an X axis (first axis), a Y axis (second axis), and a Z axis. The XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. Also, a direction parallel to the X axis is also referred to as "X direction (first direction)", a direction parallel to the Y axis is also referred to as "Y direction (second direction)", and a direction parallel to the Z axis is also referred to as " Z direction (third direction) ". In addition, the direction to which the arrows in each direction are directed is referred to as "positive", and the opposite direction is referred to as "negative". In addition, the "horizontal" mentioned in the description of this case is not limited to a complete level, as long as it does not hinder the transportation of electronic parts, it also includes a state inclined slightly (for example, less than 5 °) relative to the level. In addition, the "vertical" mentioned in the description of this case is not limited to a complete vertical, as long as it does not hinder the transportation of electronic parts, it also includes a state that is slightly inclined (for example, less than 5 °) from the vertical. That is, the "orthogonality" mentioned in the description of this case is not limited to complete orthogonality, as long as it does not hinder the transportation of electronic components, it also includes a state where other axes are slightly inclined with respect to any axis. For example, it is not limited to a state where the X axis and the Y axis intersect at right angles, and also includes a state where the Y axis is slightly inclined (for example, up to 5 °) with respect to the X axis. In addition, the upper side in FIGS. 1 and 3 to 29 (also the same in FIGS. 44 and 45), that is, the positive side in the Z-axis direction may be referred to as "up" or "upper", and the lower side, that is, the Z-axis The negative side is called "down" or "down". In addition, in FIG. 30 to FIG. 42, the component transfer head in each area is omitted.

The electronic component transfer device 10 of the present invention is a processing machine having the appearance shown in FIG. 1. As shown in FIG. 2, the electronic component conveying device 10 includes a conveying section 25 that conveys an IC component 90 as an electronic component, and a first area A3-1 in which a first inspection section 16A is disposed and the first inspection section 16A is disposed. The IC element 90 (electronic component) is placed, and the IC element 90 (electronic component) is subjected to the first inspection; and the second area A3-2 is provided with the second inspection unit 16B, and the second inspection unit 16B mounts the IC The component 90 (electronic component), and the IC component 90 (electronic component) is subjected to a second inspection different from the first inspection. As shown in FIG. 3 to FIG. 29, the conveying section 25 includes a holding section 171 that holds the IC component 90 (electronic component) in the inspection area A3 and sequentially places the IC component 90 (electronic component) in the inspection section 16A The second inspection unit 16B.

Here, it is preferable that the first inspection and the second inspection include at least one of inspection conditions such as inspection content, inspection items, inspection accuracy, inspection level (standard for compliance), inspection time, number of inspections, inspection method (inspection method), and the like. 1 different.

In the case of performing the first inspection and the second inspection on the IC element 90, it is considered to prepare two electronic component inspection devices. In this case, among the two electronic component inspection devices, a first inspection tester is connected to one electronic component inspection device, and a second inspection tester is connected to the other electronic component inspection device. Then, after the first inspection of the one electronic component inspection device is completed, the operator places the IC component 90 after the first inspection on a tray, and moves from the one electronic component inspection device to the other electronic component inspection device. , The second inspection is performed using the other electronic component inspection device. Therefore, the inspection procedure for the IC device 90 becomes complicated, and it takes a lot of time from the start of the first inspection to the end of the second inspection.

In the electronic component conveying device 10 of the present invention, the holding portion 171 can hold the IC element 90 and sequentially place the IC element 90 on the first inspection portion 16A and the second inspection portion 16B. Therefore, after an inspection is completed, it is not necessary to reload the inspected electronic parts on a tray and move the tray to an electronic part inspection device for other kinds of inspections, but one electronic part inspection device can be used for one pair of ICs. Since the element 90 performs the first inspection and the second inspection, the inspection steps performed on the IC element 90 can be speeded up.

Furthermore, in this embodiment, as described below, the movement of the component supply section 14 (electronic component supply section) in the X direction and the movement of the component transfer head 17 (holding section 171) in the Y direction and the Z direction The IC device 90 is transferred from the first inspection unit 16A to the second inspection unit 16B in accordance with the movement operation, but it is not limited to this. For example, when the component transfer head 17 can also be moved in the X direction, the component movement movement of the component transfer head 17 in the X direction, the Y direction, and the Z direction can be combined to perform the IC component 90 from the first The inspection unit 16A is transferred to the second inspection unit 16B. When the component supply section 14 is omitted and the first inspection section 16A and the second inspection section 16B can be moved in the X direction, the movement operation and the component transfer head 17 in the Y direction and The combination of the movements in the Z direction transfers the IC element 90 from the first inspection portion 16A to the second inspection portion 16B.

As shown in FIG. 2, the electronic component inspection device 1 of the present invention is a test system including an electronic component transfer device 10, and further includes a first inspection unit 16A for inspecting an IC element 90 (electronic component) ( (First socket) and second inspection unit 16B (second socket). That is, the electronic component inspection apparatus 1 according to the present invention includes a transporting section 25 that transports an IC element 90 as an electronic component, and a first inspection section 16A that mounts an IC element 90 (electronic component), and carries the IC element 90 (electronic component). Parts) for the first inspection; the first area A3-1 is provided with the first inspection section 16A; the second inspection section 16B is mounted with the IC component 90 (electronic component), and the IC component 90 (electronic component) is The second inspection is different from the first inspection; and the second area A3-2 is provided with a second inspection unit 16B. In addition, the transporting section 25 includes a holding section 171 which holds the IC element 90 (electronic component) in the inspection area A3 and sequentially places the IC element 90 (electronic component) in the first inspection section 16A and the second inspection section 16B.

Thereby, the electronic component inspection apparatus 1 which has the advantage of the said electronic component transfer apparatus 10 is obtained. In addition, since the IC element 90 can be transported to the first inspection unit 16A and the second inspection unit 16B, the first inspection of the IC element 90 can be performed by the first inspection unit 16A, and the second inspection unit 16B can be performed by the first inspection unit 16A. The IC device 90 is subjected to a second inspection. In addition, the IC components 90 after inspection can be transported from the first inspection section 16A and the second inspection section 16B.

Hereinafter, the configuration of each unit will be described in detail.
As shown in FIG. 1 and FIG. 2, the electronic component inspection device 1 having the electronic component transfer device 10 transfers, for example, electronic components such as IC components packaged as a BGA (Ball Grid Array), and is in the process of transferring A device for inspecting and testing the electrical characteristics of electronic parts (hereinafter referred to as "inspection"). In the following, for convenience of explanation, a case where an IC element is used as the above-mentioned electronic component will be described as a representative, and it will be referred to as "IC element 90". The IC element 90 has a flat plate shape in this embodiment.

In addition, as the IC element, in addition to the above, for example, "LSI (Large Scale Integration)", "CMOS (Complementary Metal Oxide Semiconductor)", "CCD (Charge Coupled Device, charge)" Coupling element) ", or" module IC ", which is formed by packaging a plurality of IC element modules, and" crystal element "," pressure sensor "," inertial sensor (acceleration sensor) ", "Gyroscope sensor", "Fingerprint sensor", etc.

The electronic component inspection device 1 (electronic component transfer device 10) includes a tray supply area A1, a component supply area A2 (feed area), an inspection area A3, a component recovery area A4 (recovery area), and a tray removal area A5, as described below. These areas are separated by walls. In addition, the IC device 90 inspects the inspection area A3 on the way from the tray supply area A1 to the tray removal area A5 in the direction of the arrow α90 in this order. As described above, the electronic component inspection device 1 includes the electronic component transfer device 10 including a transfer unit 25 that transfers the IC component 90 through each area, and the first inspection portion 16A and the second inspection portion 16B are within the inspection area A3. Perform inspection; and control section 800, including an industrial computer. In addition, the electronic component inspection apparatus 1 further includes a monitor 300, a signal lamp 400, and an operation panel 700.

In addition, the electronic component inspection apparatus 1 sets the side where the tray supply area A1 and the tray removal area A5 are arranged, that is, the lower side in FIG. 2 as the front side, and the side where the inspection area A3 is arranged, that is, in FIG. 2. The upper side is used as the rear side.

In addition, the electronic component inspection apparatus 1 is used by mounting in advance a so-called "change kit" that is replaced according to each type of the IC element 90. In this replacement kit, as the mounting member on which the IC component 90 is mounted, there are, for example, a temperature adjustment section 12, a component supply section 14, and a component recovery section (a recovery section or an electronic component recovery section) 18. In addition to this type of replacement kit, as the replacement according to each type of the IC element 90, there are, for example, a tray 200 prepared by a user, a recycling tray 19, a first inspection unit 16A, and a second inspection unit 16B.

The tray supply area A1 is a material supply section for supplying a tray 200 in which a plurality of IC components 90 are arranged in an unchecked state. The tray supply area A1 may also be referred to as a mounting area where a plurality of trays 200 can be stacked. In this embodiment, a plurality of recesses (cavities) are arranged in a matrix in each tray 200. One IC element 90 can be housed and placed in each of the recesses.

The component supply area A2 is an area where a plurality of IC components 90 on the tray 200 transferred from the tray supply area A1 are respectively transferred and supplied to the inspection area A3. Further, a tray conveying mechanism 11A and a tray conveying mechanism 11B for conveying the tray 200 piece by piece in the horizontal direction are provided so as to straddle the tray supply area A1 and the component supply area A2. The tray transfer mechanism 11A is a part of the transfer unit 25 and can move the tray 200 together with the IC components 90 placed on the tray 200 to the positive side of the Y direction, that is, the direction of the arrow α11A in FIG. 2. Thereby, the IC component 90 can be stably fed into the component supply area A2. In addition, the tray conveyance mechanism 11B can move the empty tray 200 to the negative side of the Y direction, that is, the direction of the arrow α11B in FIG. 2. Thereby, the empty tray 200 can be moved from the component supply area A2 to the tray supply area A1.

In the component supply area A2, a temperature adjustment section (a soaking plate (English expression: soap plate, Chinese expression (one example): temperature uniform plate)) 12, a component transfer head 13 (supply head), and a tray transfer mechanism 15 are provided. In addition, a component supply unit 14 is also provided that moves across the component supply area A2 and the inspection area A3.

The temperature adjustment unit 12 is referred to as a "hot-melt plate", and a plurality of IC elements 90 can be placed thereon, and the placed IC elements 90 can be heated or cooled together. By using the soaking plate, the IC element 90 before the inspection by the first inspection portion 16A and the second inspection portion 16B is heated or cooled in advance, so that the temperature can be adjusted to a temperature suitable for the inspection (high temperature inspection or low temperature inspection). .

The temperature adjustment section 12 as such a mounting member is fixed. Thereby, the temperature of the IC element 90 on the temperature adjustment section 12 can be stably adjusted.

The temperature adjustment unit 12 is grounded.
In the configuration shown in FIG. 2, two temperature adjustment sections 12 are arranged and fixed in the Y direction. Further, the IC components 90 on the tray 200 carried in from the tray supply area A1 by the tray transfer mechanism 11A are transferred to any one of the temperature adjustment sections 12.

The component transfer head 13 is supported so as to be movable in the X direction and the Y direction within the component supply area A2, and is further supported so as to be movable in the Z direction. The component transfer head 13 is also a part of the transfer section 25, and is responsible for transferring the IC components 90 between the tray 200 and the temperature adjustment section 12 carried in from the tray supply area A1, and the IC components 90 in the temperature adjustment section 12 and below. The transfer between the component supply sections 14 is described. In FIG. 2, the movement of the component transfer head 13 in the X direction is represented by an arrow α13X, and the movement of the component transfer head 13 in the Y direction is represented by an arrow α13Y.

As shown in FIGS. 3 to 29, in the present embodiment, the component transfer head 13 includes a holding portion 131 at a lower portion thereof to hold the IC component 90 by suction. The total number and arrangement of the holding portions 131 in the component transfer head 13 (how many are arranged in the X direction and how many are arranged in the Y direction) are not limited to those shown in FIGS. 3 to 29 By. In the case where a plurality of holding portions 131 are arranged, it is preferable that the distance between the centers of the holding portions 131, that is, the pitch is variable.

The component supply unit 14 is referred to as a "supply shuttle plate" or simply "supply shuttle", and can mount an IC component 90 that has been temperature-adjusted by the temperature adjustment unit 12 and transport the IC component 90 to the first inspection unit Near 16A and the second inspection unit 16B. The component supply section 14 is also supported to be movable and is a part of the transport section 25. The component supply section 14 includes a recessed portion (movable mounting portion) 141 that houses and mounts the IC component 90.

The component supply unit 14 is supported to be reciprocable (movable) between the component supply area A2 and the inspection area A3 in the X direction, that is, in the direction of the arrow α14. With this, the component supply section 14 can stably transport the IC component 90 from the component supply area A2 to the vicinity of the first inspection section 16A and the second inspection section 16B of the inspection area A3, and the component transport head in the inspection area A3. 17 After removing the IC component 90, the component supply area A2 can be returned again.

As shown in FIGS. 30 to 42, in this embodiment, the recessed portion (moving placement portion) 141 includes (includes) the first recessed portion (first supply in the X direction) which is arranged side by side in the moving direction of the component supply portion 14. (Moving placement portion) 141A and a second recessed portion (second supply moving placement portion) 141B. The first recessed portion 141A and the second recessed portion 141B are arranged such that the first recessed portion 141A is disposed on the negative side in the X direction, and the second recessed portion 141B is disposed on the positive side in the X direction. The total number and arrangement of the recesses 141 in the component supply section 14 (how many are arranged in the X direction and how many are arranged in the Y direction) are not limited to those shown in FIGS. 30 to 42. .

In the configuration shown in FIG. 2, two component supply sections 14 are arranged in the Y direction. The component supply section 14 on the negative side in the Y direction may be referred to as a “component supply section 14A”, and the components on the positive side in the Y direction may be used. The supply unit 14 is referred to as a "component supply unit 14B". The IC component 90 on the temperature adjustment section 12 is transported to the component supply section 14A or the component supply section 14B in the component supply area A2. The component supply unit 14 is configured similarly to the temperature adjustment unit 12 so that the IC device 90 placed on the component supply unit 14 can be heated or cooled. Accordingly, the IC device 90 that has been temperature-adjusted by the temperature adjustment unit 12 can be transported to the inspection area A3 while maintaining the temperature adjustment state. The component supply section 14 is also grounded in the same manner as the temperature adjustment section 12.

As described above, the conveyance unit 25 includes the component supply unit 14 having a recessed portion (moving mounting portion) 141 that is supported to move and mounts the IC component 90 (electronic component). Further, as described below, the operation of the component supply section 14 and the operation of the component transfer head 17 cooperate to smoothly transfer (transfer) the IC component 90 from the first inspection section 16A to the second inspection section 16B. (See, for example, FIGS. 3 to 29).

As shown in FIGS. 30 to 42, a posture detection unit 26 is provided in the component supply area A2, and the posture detection unit 26 detects the posture of the IC component 90 placed in the recessed portion 141 at the stop position of the component supply portion 14. (Protrusion). The posture detection unit 26 has a structure including a light-emitting unit 261 having a light-emitting diode capable of emitting light L26, and a light-receiving unit 262 which is disposed on the positive side in the Y direction with respect to the light-emitting unit 261 and has a receivable portion. Photodiodes of the light L26; and two groups corresponding to the first concave portion 141A and the second concave portion 141B.

For example, as shown in FIG. 31, when the IC element 90 in the first concave portion 141A is correctly placed, that is, the IC element 90 is not inclined with respect to the XY plane, the light L26 from the light emitting portion 261 can be received by the light receiving portion 262. When the control unit 800 detects the light receiving condition of the light receiving unit 262, the posture of the IC element 90 in the first concave portion 141A is set to be correct, and the component supply unit 14 can be moved to the inspection area A3. On the other hand, when the IC element 90 in the first concave portion 141A is inclined with respect to the XY plane, the light L26 from the light emitting portion 261 is blocked by the IC element 90 and cannot be received by the light receiving portion 262. When the control unit 800 does not detect the light reception of the light receiving unit 262, it is assumed that the IC element 90 in the first concave portion 141A is inclined, and the purpose can be reported, for example, by the monitor 300 or the like. In this case, the component supply unit 14 is not moved to the inspection area A3.

In addition, the posture detection unit 26 prevents, for example, when the IC element 90 is already placed in the recessed portion 141 in an appropriate posture, another IC element 90 is further placed on the IC element 90.

The tray transfer mechanism 15 is a mechanism that transfers the empty tray 200 in a state where all IC components 90 have been removed, to the positive side in the X direction, that is, in the direction of arrow α15, in the component supply area A2. After the transfer, the empty tray 200 is returned from the component supply area A2 to the tray supply area A1 by the tray transfer mechanism 11B.

The inspection area A3 is an area where the IC element 90 is inspected. In this inspection area A3, a first inspection section 16A and a second inspection section 16B for inspecting the IC component 90, and a component transfer head 17 are provided.

The component transfer head 17 is a part of the transfer section 25 and is configured similarly to the temperature adjustment section 12 so as to heat or cool the held IC component 90. As shown in FIGS. 3 to 29, the component transfer head 17 includes a holding portion 171 at a lower portion thereof to hold the IC component 90 by suction. In this embodiment, the holding portion 171 includes (including) the first holding portion 171A and the second holding portion arranged side by side in the moving direction of the component supply portion 14 (the recessed portion (moving placement portion) 141), that is, in the X direction. 171B). The first holding portion 171A and the second holding portion 171B are arranged on the negative side in the X direction, and the second holding portion 171B is arranged on the positive side in the X direction. Moreover, both the first holding portion 171A and the second holding portion 171B can hold the IC element 90 in the temperature-adjusted state, and transport the IC element 90 in the inspection area A3 while maintaining the temperature-adjusted state.

The component transfer head 17 is preferably configured such that the distance between the centers of the first holding portion 171A and the second holding portion 171B, that is, the pitch is variable.

The total number and arrangement of the holding portions 171 in the component transfer head 17 (how many are arranged in the X direction and how many are arranged in the Y direction) are not limited to those shown in FIGS. 3 to 29 .

Such a component transfer head 17 is supported to be able to move back and forth in the Y direction and the Z direction within the inspection area A3, and becomes a part of a mechanism called an "index arm". Thereby, the component transfer head 17 can pick up the IC component 90 from the component supply part 14 carried in from the component supply area A2, and can transfer and place it to the 1st inspection part 16A or the 2nd inspection part 16B.

Furthermore, in FIG. 2, the reciprocating movement of the component transfer head 17 in the Y direction is indicated by an arrow α17Y. The component transfer head 17 is supported to be capable of reciprocating in the Y direction, but is not limited to this, and may be supported to be capable of reciprocating in the X direction.

Moreover, in this embodiment, two component transfer heads 17 are arrange | positioned in the Y direction (refer FIG. 2). Hereinafter, the component transfer head 17 on the negative side in the Y direction may be referred to as a "component transfer head 17A", and the component transfer head 17 on the positive side in the Y direction may be referred to as a "component transfer head 17B". The component transfer head 17A is responsible for transferring the IC component 90 from the component supply section 14A to the first inspection section 16A or the second inspection section 16B in the inspection area A3, and the component transfer head 17B is responsible for transferring the IC component 90 from the inspection area A3. The component supply unit 14B is transported to the first inspection unit 16A or the second inspection unit 16B. The component transfer head 17A may be responsible for transferring the IC component 90 from the second inspection section 16B to the component recovery section 18A in the inspection area A3, and the component transfer head 17B may be responsible for transferring the IC component 90 from the second inspection section 16B to the component in the inspection area A3. The collection unit 18B is transported.

The first inspection unit 16A may mount the IC element 90 (electronic component), and perform the first inspection of the electrical characteristics of the IC element 90 (electronic component). This 1st inspection part 16A is arrange | positioned in the 1st area A3-1 set in the inspection area A3, and it is detachably fixed. The attachment and detachment can be achieved by using bolts, for example. The first inspection unit 16A is connected to the first tester 900A. The first inspection is performed based on a program stored in an inspection control unit provided in the first tester 900A.

The second inspection unit 16B can mount the IC element 90 (electronic component) and perform a second inspection of the electrical characteristics of the IC element 90 (electronic component) different from the first inspection. The second inspection unit 16B is disposed in the second region A3-2 adjacent to the X-direction positive side of the first region A3-1 in the inspection region A3, and is detachably fixed. This attaching and detaching can be performed by using a bolt, for example, similarly to the attaching and detaching of the first inspection portion 16A. The second inspection unit 16B is connected to the second testing machine 900B. The second inspection is performed based on a program stored in an inspection control unit provided in the second testing machine 900B.

In addition, the first inspection unit 16A and the second inspection unit 16B are unitized into a single structure. Similar to the temperature adjustment unit 12, the IC element 90 can be heated or cooled, and the IC element 90 can be adjusted to a suitable temperature. Check the temperature.

As shown in FIGS. 3 to 42, each of the first inspection section 16A and the second inspection section 16B has a recess (recess) 161 for accommodating and placing the IC device 90, and a plurality of probes are provided inside the recess 161 ( (Not shown). In addition, the IC element 90 can be inspected by connecting the terminals of the IC element 90 and the probes in a conductive manner, that is, in contact. In addition, the first inspection unit 16A and the second inspection unit 16B each have one recess 161 in this embodiment, but the total number and configuration of the recesses 161 (how many are arranged in the X direction and in the Y direction) How many are arranged) is not limited to those shown in FIGS. 3 to 42.

With such a first inspection unit 16A and a second inspection unit 16B, two types of inspections can be performed on one IC component 90 using one electronic component inspection apparatus 1.

The first inspection and the second inspection are not particularly limited, and examples thereof include a disconnection inspection of a circuit in the IC element 90 and a resistance value inspection of a circuit in the IC element 90. In this case, the above-mentioned inspection contents and the above-mentioned inspection items of the disconnection inspection and the resistance value inspection are different from each other.

The electronic component inspection apparatus 1 may further include a third inspection, a fourth inspection, and the like that perform inspection of electrical characteristics different from those of the first inspection and the second inspection.

The component recovery area A4 is an area where a plurality of IC components 90 are to be inspected in the inspection area A3 and the inspection is completed. In this component recovery area A4, a recovery tray 19, a component transfer head 20 (recovery head), and a tray transfer mechanism 21 are provided. In addition, a component recovery unit 18 is also provided that moves across the inspection area A3 and the component recovery area A4. An empty tray 200 is also prepared in the component recovery area A4.

The component recovery unit 18 is called a "recycling shuttle" or simply "recycling shuttle", and mounts the IC component 90 after the inspection, and transfers the IC component 90 to the component recovery area A4. The component recovery section 18 is also a part of the transport section 25. The component recovery portion 18 includes a recessed portion (recess) 181 in which the IC component 90 is housed and placed.

The component recovery unit 18 is supported so as to be able to move back and forth between the inspection region A3 and the component recovery region A4 in the X direction, that is, in the direction of the arrow α18. With this, the component recovery unit 18 can stably transport the IC component 90 from the inspection area A3 to the component recovery area A4. After removing the IC component 90 from the component transport head 20 in the component recovery area A4, it can return to the inspection area A3 again. .

As shown in FIGS. 30 to 42, in the present embodiment, the recessed portion 181 includes (includes) the first recessed portion 181A (the first recovered moving placement portion) arranged side by side in the moving direction of the component recovery portion 18, that is, the X direction. And a second recessed portion 181B (a second recovery moving placement portion). The first recessed portion 181A and the second recessed portion 181B are the first recessed portion 181A disposed on the negative side in the X direction, and the second recessed portion 181B is disposed on the positive side in the X direction. The total number and arrangement of the recesses 181 in the component recovery section 18 (how many are arranged in the X direction and how many are arranged in the Y direction) are not limited to those shown in FIGS. 30 to 42. .

In the configuration shown in FIG. 2, two component recovery units 18 are arranged in the Y direction in the same manner as the component supply unit 14. The component recovery unit 18 on the negative side in the Y direction may be referred to as a “component recovery unit 18A”. The component recovery section 18 on the positive side in the Y direction is referred to as "component recovery section 18B". The IC component 90 on the second inspection section 16B is transported and placed in the component recovery section 18A or the component recovery section 18B. The component recovery section 18 is also grounded in the same manner as the temperature adjustment section 12 and the component supply section 14.

In addition, the component recovery section 18 is connected to the component supply section 14 via a connection section 27. That is, the component recovery part 18A is connected to the component supply part 14A via the connection part 27, and the component recovery part 18B is connected to the component supply part 14B via the connection part 27. Thereby, the component supply part 14A and the component collection part 18A can move integrally in the same direction, and the component supply part 14B and the component collection part 18B can move integrally in the same direction.

Further, in the present embodiment, the first inspection section 16A and the second inspection are arranged between the connection body of the component supply section 14A and the component recovery section 18A, and the connection body of the component supply section 14B and the component recovery section 18B. Department 16B.

The collection tray 19 is an IC component 90 on which the inspection is completed, and is fixed so as not to move in the component collection area A4. Accordingly, even in a relatively large number of component recovery areas A4 where various movable parts such as the component transfer head 20 are arranged, the inspected IC components 90 are stably placed on the recovery tray 19. In the configuration shown in FIG. 2, three collection trays 19 are arranged in the X direction.

Three empty trays 200 are also arranged in the X direction. The empty tray 200 also contains the IC components 90 after the inspection. Then, the IC components 90 on the component collection section 18 moved to the component collection area A4 are transferred and placed on any one of the collection tray 19 and the empty tray 200. Thereby, the IC components 90 are sorted and recovered based on each inspection result.

The component transfer head 20 is supported to be movable in the X direction and the Y direction within the component recovery area A4, and is further supported to be movable in the Z direction. The component transfer head 20 is a part of the transfer unit 25, and can transfer the IC components 90 from the component collection unit 18 to the collection tray 19 and the empty tray 200. In FIG. 2, the movement of the component transfer head 20 in the X direction is indicated by an arrow α20X, and the movement of the component transfer head 20 in the Y direction is indicated by an arrow α20Y.

As shown in FIG. 3 to FIG. 29, in the present embodiment, the component transfer head 20 has a holding portion 201 at a lower portion thereof to hold the IC component 90 by suction. The total number and arrangement of the holding portions 201 in the component transfer head 20 (how many are arranged in the X direction and how many are arranged in the Y direction) are not limited to those shown in FIGS. 3 to 29 By. In the case where a plurality of holding portions 201 are arranged, it is preferable that the distance between the centers of the holding portions 201, that is, the pitch is variable.

The tray transfer mechanism 21 is a mechanism that transfers the empty tray 200 carried in from the tray removal area A5 in the X direction, that is, in the direction of the arrow α21 in the component recovery area A4. After the transfer, the empty tray 200 is disposed at a position where the IC components 90 are collected, and it can be any of the three empty trays 200 described above.

The tray removal area A5 is a material removal section that collects and removes the trays 200 in which the plurality of IC components 90 in the inspected state are arranged. In the tray removing area A5, a plurality of trays 200 can be stacked and stacked.

In addition, a tray transfer mechanism 22A and a tray transfer mechanism 22B are provided so as to straddle the component recovery area A4 and the tray removal area A5, one by one, in the Y direction. The tray transfer mechanism 22A is a part of the transfer unit 25, and can move the tray 200 back and forth in the Y direction, that is, in the direction of arrow α22A. Thereby, the inspected IC component 90 can be transferred from the component recovery area A4 to the tray removal area A5. The tray transfer mechanism 22B can be used to move the empty tray 200 for collecting the IC components 90 to the positive side in the Y direction, that is, in the direction of the arrow α22B. Thereby, the empty tray 200 can be moved from the tray removal area A5 to the component recovery area A4.

The control unit 800 can control, for example, the tray transfer mechanism 11A, the tray transfer mechanism 11B, the temperature adjustment unit 12, the component transfer head 13, the component supply unit 14, the tray transfer mechanism 15, the first inspection unit 16A, the second inspection unit 16B, and the component transfer The operations of the head 17, the component recovery unit 18, the component transfer head 20, the tray transfer mechanism 21, the tray transfer mechanism 22A, and the tray transfer mechanism 22B are performed.

The control unit 800 may be built in the electronic component inspection device 1 (electronic component transfer device 10), or may be installed in an external device such as an external computer. For example, the external device may communicate with the electronic component inspection device 1 via a cable or the like, wirelessly communicate with the electronic component inspection device 1, or be connected to the electronic component inspection device 1 via a network (for example, the Internet). Situation, etc.

As shown in FIG. 2, in the present embodiment, the control unit 800 includes at least one processor 801 (at least one processor) and at least one memory 802 (see FIG. 2). The processor 801 can read various information (for example, a program for judgment, an instruction, a program for instruction, etc.) stored in the memory 802, and execute the judgment or instruction (command).

The operator can set or confirm the operating conditions and the like of the electronic component inspection apparatus 1 via the monitor 300. The monitor 300 includes, for example, a display screen 301 having a liquid crystal screen, and is arranged on the upper portion of the front side of the electronic component inspection device 1. As shown in FIG. 1, on the right side in the drawing of the tray removal area A5, a mouse stage 600 for placing a mouse is provided. This mouse is used when operating a screen displayed on the monitor 300.

The monitor 300 is provided with an operation panel 700 in the lower right of FIG. 1. The operation panel 700 is different from the monitor 300 in that it instructs the electronic component inspection apparatus 1 to perform a desired operation.

In addition, the signal light 400 can report the operation status of the electronic component inspection device 1 and the like by the combination of the emitted colors. The signal lamp 400 is arranged on the upper part of the electronic component inspection device 1. Furthermore, a speaker 500 is built into the electronic component inspection device 1, and the speaker 500 can also report the operation status of the electronic component inspection device 1 and the like.

In the electronic component inspection device 1, the tray supply area A1 and the component supply area A2 are separated by a first partition wall 231, and the component supply area A2 and the inspection area A3 are separated by a second partition wall 232. The inspection area A3 and the component recovery area A4 are separated by a third partition wall 233, and the component recovery area A4 and the tray removal area A5 are separated by a fourth partition wall 234. The component supply area A2 and the component recovery area A4 are also separated by a fifth partition wall 235.

The outermost layer of the electronic component inspection device 1 is covered by a casing, and the casing includes, for example, a front casing 241, a side casing 242, a side casing 243, a rear casing 244, and a top casing 245.

As described above, the IC device 90 performs the first inspection by the first inspection unit 16A, and performs the second inspection by the second inspection unit 16B. At this time, the IC device 90 is transferred (conveyed) from the first inspection section 16A to the second inspection section 16B. Here, an operation of transferring the IC element 90 from the first inspection unit 16A to the second inspection unit 16B will be described with reference to FIGS. 3 to 42. Hereinafter, the IC element 90 transferred first is referred to as “IC element 90A”, and the IC element 90 transferred later is referred to as “IC element 90B”. In addition, the component transfer head 17A, the component supply section 14A, and the component recovery section 18A have the same configuration and can perform the same operations except for the different locations of the component transfer head 17B, the component supply section 14B, and the component recovery section 18B. Therefore, the following components transfer The head 17B, the component supply part 14B, and the component collection part 18B are demonstrated as a representative.

As shown in FIG. 3, the IC component 90A is held by the holding portion 131 of the component transfer head 13. In addition, the component supply portion 14B is stopped in the component supply area A2, and the entirety thereof, that is, the first concave portion 141A and the second concave portion 141B are located in the component supply area A2 so as to be exposed. The IC component 90A held by the component transfer head 13 is in a state of being disposed on the first recessed portion 141A of the component supply portion 14B.

As shown in FIG. 30 (the same applies to FIG. 3), an empty state in which the IC component 90 is not placed on any of the component supply section 14B, the component recovery section 18B, the first inspection section 16A, and the second inspection section 16B is shown.

Next, as shown in FIG. 4, the component transfer head 13 holds the IC component 90A and descends toward the first recessed portion 141A of the component supply portion 14B (moves to the negative side in the Z direction). Thereby, the IC element 90A can be placed (received) in the first concave portion 141A.

Next, as shown in FIG. 5, the component transfer head 13 releases the holding state of the IC component 90A and rises (moves toward the positive side in the Z direction). Thereby, the component transfer head 13 can be separated from the IC component 90A.

As shown in FIG. 31, as described above, the posture of the IC element 90A placed in the first recessed portion 141A is detected by the posture detection unit 26. In the state shown in FIG. 31, the light receiving portion 262 receives the light L26 from the light emitting portion 261. In this case, the posture of the IC component 90A in the first recessed portion 141A is appropriate (correct), and the component supply portion 14B can be moved to the inspection area A3 by the next operation.

Next, as shown in FIG. 6, the component supply unit 14B moves to the inspection area A3 (positive side in the X direction) and stops. The stop position of the component supply portion 14B is the position of the first recessed portion 141A of the component supply portion 14B in the X direction (the X coordinate of the center of the first recessed portion 141A) becomes the X direction of the recessed portion 161 of the first inspection portion 16A. The upper position (the X coordinate of the center of the recess 161) is the same position. Thereby, as shown in FIG. 32, in the inspection area A3, the IC element 90A in the first recessed portion 141A is positioned on the positive side in the Y direction with respect to the recessed portion 161 of the first inspection portion 16A. In the state shown in FIG. 6, the first holding portion 171A of the component transfer head 17B is located above the first recessed portion 141A of the component supply portion 14B, and the second holding portion 171B of the component transfer head 17B is located above the component supply portion 14B. Above the second concave portion 141B.

Next, as shown in FIG. 7, the component transfer head 17B is lowered and then stopped. The stop position of the component transfer head 17B is a position where the first holding portion 171A abuts the IC component 90A in the first recessed portion 141A of the component supply portion 14B. Then, in a state where the component transfer head 17B is stopped, the first holding portion 171A holds the IC device 90A in the first recessed portion 141A.

Next, as shown in FIG. 8, the component transfer head 17B rises while maintaining the holding state of the IC component 90A. With this, the component transfer head 17B lifts the IC component 90A, and the IC component 90A can be released from the first recessed portion 141A of the component supply portion 14B. Meanwhile, in the component supply area A2, the component transfer head 13 is preferably moved toward the IC component 90B to be held next.

Next, as shown in FIG. 9, the component transfer head 17B moves toward the recessed portion 161 of the first inspection portion 16A while holding the IC component 90A. Then, as shown in FIG. 33 (also shown in FIG. 9), the IC element 90A can be pressed against and placed in the recessed portion 161 of the first inspection portion 16A. This allows the first inspection of the IC element 90A. As shown in FIG. 9, in the component supply area A2, the component transfer head 13 stands by while holding the IC component 90B at the same position as the component transfer head 13 shown in FIG. 3.

Next, as shown in FIG. 10, the component supply unit 14B moves back to the component supply region A2 (negative side in the X direction), and then stops. The stop position of the component supply unit 14B is the same position as the component supply unit 14B shown in FIG. 3. In the meantime, the first inspection of the IC element 90A was continued.

Next, as shown in FIG. 11, the component transfer head 13 holds the IC component 90B and descends toward the first recessed portion 141A of the component supply portion 14B. Thereby, the IC element 90B can be placed in the first concave portion 141A.

Next, as shown in FIG. 12, the component transfer head 13 releases the holding state of the IC component 90B and rises. Thereby, the component transfer head 13 can be separated from the IC component 90B.

In the state shown in FIG. 12, the first inspection of the IC element 90A is completed. Therefore, the component transfer head 17B can hold the IC component 90A and leave the first inspection section 16A. Then, the component transfer head 17B stands by at the same position as the component transfer head 17B shown in FIG. 6.

As shown in FIG. 34, the posture of the IC element 90B placed in the first recessed portion 141A is detected by the posture detection unit 26. In the state shown in FIG. 34, the light receiving portion 262 receives the light L26 from the light emitting portion 261. In this case, the posture of the IC component 90B in the first recessed portion 141A is appropriate, and the component supply portion 14B can be moved to the inspection area A3 by the next operation.

Next, as shown in FIG. 13, the component supply unit 14B moves to the inspection area A3 and stops. The stop position of the component supply portion 14B is the position of the second recessed portion 141B of the component supply portion 14B in the X direction (the X coordinate of the center of the second recessed portion 141B) becomes the X direction of the recessed portion 161 of the first inspection portion 16A. The upper position (the X coordinate of the center of the recess 161) is the same position.

Next, as shown in FIG. 14, the component transfer head 17B is lowered and then stopped. The stop position of the component transfer head 17B is a position where the IC component 90A held in the first holding portion 171A is placed in the second concave portion 141B of the component supply portion 14B.

Next, as shown in FIG. 15, the component transfer head 17B releases the holding state of the IC component 90A by the first holding portion 171A and rises. Thereby, the component transfer head 17B can be separated from the IC component 90A. At this time, as shown in FIG. 35 (also the same as FIG. 15), the component supply unit 14B is in a state where the IC element 90B is placed on the first concave portion 141A and the IC element 90A is placed on the second concave portion 141B.

Next, as shown in FIG. 16, the component supply unit 14B moves back to the component supply area A2 and stops. The stop position of the component supply section 14B is the same position as the component supply section 14B shown in FIG. 3.

As shown in FIG. 36, the posture of the IC element 90B in the first recessed portion 141A and the posture of the IC element 90A in the second recessed portion 141B are detected by the posture detection unit 26. In the state shown in FIG. 36, the light L26 from the light-emitting portion 261 is received by the light-receiving portion 262. In this case, the posture of the IC element 90B in the first recessed portion 141A and the posture of the IC element 90A in the second recessed portion 141B are both appropriate. The component supply portion 14B can be moved to the inspection area A3 by the next operation. mobile.

Next, as shown in FIG. 17, the component supply unit 14B moves to the inspection area A3 and stops. The stop position of the component supply section 14B is the same as the position of the component supply section 14B shown in FIG. 6. As a result, as shown in FIG. 37, in the inspection area A3, the IC element 90B in the first concave portion 141A is positioned on the positive side in the Y direction with respect to the concave portion 161 of the first inspection portion 16A, and the IC element in the second concave portion 141B 90A is a state in which the concave portion 161 of the second inspection portion 16B is located on the positive side in the Y direction.

Next, as shown in FIG. 18, the component transfer head 17B is lowered and stopped. The stop position of the component transfer head 17B is that the first holding portion 171A is in contact with the IC component 90B in the first recessed portion 141A of the component supply portion 14B, and the second holding portion 171B is in contact with the second portion of the component supply portion 14B. The position of the IC element 90A in the recess 141B. Then, in a state where the component transfer head 17B is stopped, the first holding portion 171A holds the IC element 90B in the first recessed portion 141A, and the second holding portion 171B holds the IC element 90A in the second recessed portion 141B.

Next, as shown in FIG. 19, the component transfer head 17B rises while maintaining the holding state of the IC components 90A and 90B. With this, the component transfer head 17B lifts the IC element 90A and the IC element 90B, so that the IC element 90B can be separated from the first recessed portion 141A, and the IC element 90A can be separated from the second recessed portion 141B.

Next, as shown in FIG. 20, the component transfer head 17B moves toward the first inspection unit 16A and the second inspection unit 16B while holding the IC element 90A and the IC element 90B. Then, as shown in FIG. 38 (also shown in FIG. 20), the IC element 90B can be pressed against and placed in the recessed portion 161 of the first inspection portion 16A, and the IC element 90A can be pressed against and loaded as shown in FIG. The recessed portion 161 is placed in the second inspection portion 16B. Thereby, the first inspection of the IC element 90B and the second inspection of the IC element 90A can be performed simultaneously.

Next, after the first inspection of the IC element 90B and the second inspection of the IC element 90A are completed, as shown in FIG. 21, the component recovery unit 18B moves to be located in the inspection area A3. At this position, the position of the first recessed portion 181A in the X direction (the X coordinate of the center of the first recessed portion 181A) in the component recovery portion 18B is the position in the X direction (the recessed portion 161) of the recessed portion 161 of the first inspection portion 16A. The X coordinate of the center) is the same, and the position of the second recessed portion 181B in the X direction (the X coordinate of the center of the second recessed portion 181B) becomes the position of the second inspection portion 16B in the X direction (the center of the recessed portion 161). (X coordinate).

At this time, the component transfer head 17B maintains the state in which the IC component 90B is pressed against the recessed portion 161 of the first inspection portion 16A, and the IC element 90A is pressed against the recessed portion 161 of the second inspection portion 16B.

Next, as shown in FIG. 22, the component transfer head 17B raises while holding the IC element 90A and the IC element 90B. Thereby, the IC element 90B is separated from the first inspection portion 16A, and the IC element 90A is separated from the second inspection portion 16B. Thereafter, the component transfer head 17B stands by at the same position as the component transfer head 17B shown in FIG. 6.

Next, as shown in Fig. 23, the component transfer head 17B is lowered and then stopped. The stop position of the component transfer head 17B is to place the IC component 90B held in the first holding portion 171A in the first recessed portion 181A of the component recovery portion 18B, and to hold the IC component 90A in the second holding portion 171B. It is placed in a position in the second recessed portion 181B of the component recovery portion 18B.

Next, as shown in FIG. 24, the component transfer head 13 maintains the holding state of the IC element 90B by the first holding portion 171A, and releases the holding state of the IC element 90A by the second holding portion 171B and rises. Thereby, the component transfer head 13 can be separated from the IC component 90A. At this time, as shown in FIG. 39 (also the same as FIG. 24), the component recovery portion 18B is in a state where the IC component 90A is placed on the second concave portion 181B.

Next, as shown in FIG. 25, the component recovery part 18B moves to the component recovery area A4 (positive side in the X direction) and stops. At this position, the entire component recovery portion 18B, that is, the first recessed portion 181A and the second recessed portion 181B are exposed in the component recovery area A4. Thereby, as shown in FIG. 40 (also the same as FIG. 25), the IC device 90A in the second recessed portion 181B is arranged in the device recovery area A4. In the component recovery area A4, the holding portion 201 of the component transfer head 20 is positioned above the second recessed portion 181B (IC component 90A).

Next, as shown in FIG. 26, the component transfer head 20 is lowered and stopped. The stop position of the component transfer head 20 is a position where the holding portion 201 abuts the IC component 90A in the second recessed portion 181B of the component recovery portion 18B. In a state where the component transfer head 20 is stopped, the holding portion 201 holds the IC component 90A in the second recessed portion 181B.

Next, as shown in FIG. 27, the component transfer head 20 is raised while maintaining the holding state of the IC component 90A. Thereby, the component transfer head 20 lifts up the IC component 90A, and the IC component 90A can be released from the second recessed portion 181B of the component recovery portion 18B. At this time, as shown in FIG. 41 (also the same as FIG. 27), the IC supply unit 14B, the component collection unit 18B, the first inspection unit 16A, and the second inspection unit 16B are in a state where no IC element 90A or IC element 90B is placed. .

Next, as shown in FIG. 28, the component supply part 14B stops after moving. The stop position of the component supply portion 14B is the position of the second recessed portion 141B of the component supply portion 14B in the X direction (the X coordinate of the center of the second recessed portion 141B) becomes the X direction of the recessed portion 161 of the first inspection portion 16A. The upper position (the X coordinate of the center of the recess 161) is the same position.

Next, as shown in FIG. 29, the component transfer head 17B is lowered and stopped. The stop position of the component transfer head 17B is a position where the IC component 90B held in the first holding portion 171A is placed in the second concave portion 141B of the component supply portion 14B. At this time, as shown in FIG. 42 (also the same as FIG. 29), the component supply portion 14B is in a state where the IC component 90B is placed on the second concave portion 141B.

And, the transfer operation after the IC element 90B is the same as the above-mentioned transfer operation after the IC element 90A (the operation after FIG. 15).

Here, when the first inspection and the second inspection of the IC element 90 were performed, two electronic component inspection devices were prepared. Among the two electronic component inspection devices, a first inspection tester is connected to one electronic component inspection device, and a second inspection tester is connected to the other electronic component inspection device. In addition, when the first inspection using the above-mentioned one electronic component inspection device is completed, the operator moves the IC component 90 after the first inspection from the one electronic component inspection device to the other electronic component inspection device. An electronic parts inspection device performs the second inspection. Therefore, the inspection procedure for the IC device 90 becomes complicated, and it takes a lot of time from the start of the first inspection to the end of the second inspection.

In contrast, in the electronic component inspection device 1 (electronic component transfer device 10), the holding portion 171 of the component transfer head 17 can hold the IC component 90, and the IC component 90 is sequentially placed in the first inspection portion 16A and The second inspection unit 16B. Thereby, the first inspection and the second inspection of the IC element 90 can be performed by one electronic component inspection device 1, and therefore, the inspection steps performed on the IC element 90 can be speeded up.

As described above, the first inspection portion 16A is fixed in the first area A3-1, and the second inspection portion 16B is fixed in the second area A3-2. The component transfer head 17 (holding portion 171) is supported to move in the moving direction of the component supply portion 14 (the recessed portion (moving placement portion) 141), that is, in the Y direction crossing the X direction. In addition, the holding portion 171 of the component transfer head 17 can sequentially place the IC component 90 (electronic component) from the movable component supply portion 14 (recessed portion (moving placement portion) 141) on the fixed first inspection portion 16A. , A movable component supply section 14 (a recessed section (movable placement section) 141), and a fixed second inspection section 16B.

In this way, in the electronic component inspection device 1, the operation of the component supply section 14 and the operation of the component transfer head 17 cooperate to smoothly transfer (transfer) the IC component 90 from the first inspection section 16A to the second inspection section 16B. ). In addition, although it differs depending on the mechanical configuration of the electronic component inspection apparatus 1, when the existing electronic component inspection apparatus 1 is used, for example, the IC element 90 can be changed from the first inspection unit by changing software. 16A transfer operation to the 2nd inspection part 16B.

As described above, the recessed portion (moving placement portion) 141 includes the first recessed portion (first supply moving placement portion) arranged in the moving direction of the component supply portion 14 (recessed portion (moving placement portion) 141) side by side. 141A and the second recessed portion (second supply moving placement portion) 141B. In addition, the holding portion 171 of the component transfer head 17 includes a first holding portion 171A and a second holding portion 171B which are arranged side by side in the moving direction of the component supply portion 14 (recessed portion (moving placement portion) 141).

As described above, the first holding portion 171A can sequentially place the IC component 90 (electronic component) 141A from the first recessed portion (first supply moving placement portion) 141A in the first inspection portion 16A and the second recessed portion (second supply) Mobile mounting section) 141B.

On the other hand, the second holding portion 171B disposed on the positive side in the X direction with respect to the first holding portion 171A can move the IC component 90 (electronic component) from the second recessed portion (after placing the first holding portion 171A). The second mobile placement section) 141B is placed on the second inspection section 16B.

For example, in the component supply area A2, the component transfer head 13 rearranges the arrangement of the IC components 90 (IC components 90A, 90B) on the component supply section 14, and moves the component supply section 14 to the inspection area A3. This configuration can shorten the moving time of the IC device 90 from the first inspection section 16A to the second inspection section 16B compared to the configuration of the first inspection and the second inspection. Thereby, the first inspection and the second inspection can be performed quickly.

When it is determined that the result of the first inspection of the IC element 90A is "No (defective)", the IC element 90A is placed in the second inspection portion 16B, but the second inspection may be omitted. In addition, when it is determined that the result of the first inspection of the IC element 90A is "No", the placement of the IC element 90A on the second inspection portion 16B may be omitted.

In addition, the case where two IC elements 90 (IC element 90A, ICB 90B) are transferred in parallel during the transfer operation of the IC element 90 from the first inspection unit 16A to the second inspection unit 16B has been described, but It is not limited to this, and can also be applied to a case where one IC element 90 is transferred. In this case, actions related to the transfer of the IC element 90B may be omitted. As operations related to the transfer of the IC component 90B, for example, the component supply unit 14 shown in FIG. 10 moves to the component supply area A2, and the component transfer head 13 shown in FIG. 11 loads the IC component 90B in the component supply. The operation of the unit 14 and the operation of raising and lowering the IC component 90B by the component transfer head 17 shown in FIGS. 18 to 29.

In addition, in FIGS. 31, 34, and 36, the posture of the IC element 90 is detected by the posture detection unit 26, but it is not limited to this. For example, the posture detection may be omitted. In this case, the step of returning the component supply unit 14B to the component supply area A2 for posture detection can be omitted.

In addition, the component transfer head 13 may hold another IC component 90 after placing the IC component 90B on the component supply section 14B, that is, after the state shown in FIG. 12. In this case, the other IC device 90 also performs the first inspection and the second inspection in this order.

<Second Embodiment> Hereinafter, a second embodiment of the electronic component transfer device and the electronic component inspection device of the present invention will be described with reference to FIG. 43. However, the differences from the above embodiment will be mainly described, and the same matters are omitted. Instructions.

This embodiment is the same as the first embodiment described above except that the number of the concave portions of the first inspection portion and the number of the concave portions of the second inspection portion are different.

As shown in FIG. 43, in the present embodiment, the first inspection portion 16A includes two recessed portions 161 arranged side by side in the Y direction. Hereinafter, the concave portion 161 on the negative side in the Y direction is referred to as "concave portion 161A", and the concave portion 161 on the positive side in the Y direction is referred to as "concave portion 161B". The second inspection portion 16B also includes two recessed portions 161 arranged side by side in the Y direction. Hereinafter, the concave portion 161 on the negative side in the Y direction is referred to as a "concave portion 161C", and the concave portion 161 on the positive side in the Y direction is referred to as a "concave portion 161D". Thus, in the present embodiment, a total of four recessed portions 161 of the first inspection portion 16A and the recessed portions 161 of the second inspection portion 16B are arranged. In this case, it is preferable that the total number and arrangement of the holding portions 171 of the component transfer head 17 also correspond to the recessed portions 161 of this embodiment.

With the above configuration, for example, it is possible to improve the production capacity of the electronic component inspection device 1 (electronic component transfer device 10) (the number of IC components 90 transferred per unit time).

The distance (pitch) between the centers of the recessed portions 161A and 161B and the distance (pitch) between the centers of the recessed portions 161C and 161D are the same in the configuration shown in FIG.

The distance (pitch) between the centers of the recessed portions 161A and 161C and the distance (pitch) between the centers of the recessed portions 161B and 161D are the same in the configuration shown in FIG. 43, but they are not limited to this and may be different.

The total number and arrangement of the recessed portions 161 of the first inspection portion 16A are not limited to those shown in FIG. 43.

The total number and arrangement of the recessed portions 161 of the second inspection portion 16B are not limited to those shown in FIG. 43.

<Third Embodiment> Hereinafter, a third embodiment of the electronic component transfer device and the electronic component inspection device according to the present invention will be described with reference to FIG. 44. However, the differences from the above embodiment will be mainly described, and the same matters will be omitted. Instructions.

This embodiment is the same as the first embodiment described above, except that the operation when an IC component is placed in the component supply section is different in the component supply area.

As shown in FIG. 44, in this embodiment, in the component supply area A2, when the component transfer head 13 (supply head) mounts the IC component 90A on the first recessed portion 141A of the component supply section 14B, the component supply section 14B is not as As in the first embodiment described above, the first recessed portion 141A and the second recessed portion 141B are located in the component supply area A2 in an exposed manner, but the first recessed portion 141A (the first supply moving placement portion) is located in the component supply area in an exposed manner. In A2 (supply area), the second recessed portion 141B (second supply moving placement portion) is exposed in the inspection area A3.

With this state, compared with the first embodiment described above, the moving time and moving distance until the entire component supply portion 14B is located in the inspection area A3 can be shortened. Thereby, the productivity of the electronic component inspection device 1 (electronic component transfer device 10) can be improved.

<Fourth Embodiment> Hereinafter, a fourth embodiment of the electronic component transfer device and the electronic component inspection device of the present invention will be described with reference to FIG. 45. However, the differences from the above embodiment will be mainly described, and the same matters are omitted. Instructions.

This embodiment is the same as the above-mentioned first embodiment except that the operation when removing an IC component from the component recovery section in the component recovery area is different.

As shown in FIG. 45, in this embodiment, in the component recovery area A4, when the component transfer head 20 (recycling head) recovers the IC component 90A from the second recess 181B of the component recovery section 18B, the component recovery section 18B is not as described above Like the first embodiment, the first recessed portion 181A and the second recessed portion 181B are located in the component recovery area A4 so as to be exposed, but the second recessed portion 181B (the second recovery moving placement portion) is located in the component recovery area A4 so as to be exposed In the (recovery area), the first recessed portion 181A (the first collection moving placement portion) is located in the inspection area A3 so as to be exposed.

With this state, compared with the first embodiment described above, it is possible to shorten the moving time and moving distance until the component recovery section 18B moves from the inspection area A3 to the component recovery area A4 to a state where the IC component 90A can be recovered. . Thereby, the productivity of the electronic component inspection device 1 (electronic component transfer device 10) can be improved. In addition, since the first recessed portion 181A is not exposed in the element recovery area A4, it is possible to prevent another IC element 90 from being placed on top of the first recessed portion 181A. For example, the component transfer head 20 fails to place the IC component 90A on the collection tray 19 due to failure to achieve vacuum destruction, and the IC component 90A is moved to the component collection unit 18B. In this case, As described above, there is a possibility that another IC element 90 is placed on top of the first recessed portion 181A.

The electronic component transfer device and the electronic component inspection device according to the present invention have been described above with reference to the illustrated embodiments. However, the present invention is not limited to this, and each part constituting the electronic component transfer device and the electronic component inspection device can be replaced with a device capable of performing Arbitrary constituents of the same function. In addition, an arbitrary structure may be added.

The electronic component transfer device and the electronic component inspection device of the present invention may be a combination of any two or more configurations (features) in each of the above embodiments.

1‧‧‧Electronic parts inspection device

10‧‧‧Electronic parts transfer device

11A‧‧‧Tray transfer mechanism

11B‧‧‧Tray transfer mechanism

12‧‧‧Temperature Adjustment Department

13‧‧‧component transfer head

14‧‧‧Component Supply Department

14A‧‧‧Component Supply Department

14B‧‧‧Component Supply Department

15‧‧‧pallet transfer mechanism

16A‧‧‧The first inspection department

16B‧‧‧ 2nd Inspection Department

17‧‧‧ component transfer head

17A‧‧‧component transfer head

17B‧‧‧component transfer head

18‧‧‧Component Recycling Department

18A‧‧‧Component Recycling Department

18B‧‧‧Component Recycling Department

19‧‧‧Recycling tray

20‧‧‧component transfer head

21‧‧‧Tray transfer mechanism

22A‧‧‧Tray transfer mechanism

22B‧‧‧Tray transfer mechanism

25‧‧‧Transportation Department

26‧‧‧ Posture detection section

27‧‧‧Link Department

90‧‧‧IC components

90A‧‧‧IC components

90B‧‧‧IC components

131‧‧‧holding department

141‧‧‧Concave part (mobile placement part)

141A‧‧‧1st recessed portion (first supply moving placement portion)

141B‧‧‧2nd recessed part (second supply moving placement part)

161‧‧‧concave (concave)

161A‧‧‧Concave

161B‧‧‧Concave

161C‧‧‧Concave

161D‧‧‧Concave

171‧‧‧holding department

171A‧‧‧The first holding section

171B‧‧‧Second Holder

181‧‧‧concave (concave)

181A‧‧‧1st recess

181B‧‧‧2nd recess

200‧‧‧tray

201‧‧‧ Holding Department

231‧‧‧The first partition

232‧‧‧Second partition

233‧‧‧ 3rd partition

234‧‧‧ 4th partition

235‧‧‧ 5th partition

241‧‧‧Front housing

242‧‧‧side shell

243‧‧‧side shell

244‧‧‧ rear shell

245‧‧‧Top case

261‧‧‧Lighting Department

262‧‧‧Light receiving section

300‧‧‧ monitor

301‧‧‧display

400‧‧‧ signal light

500‧‧‧Speaker

600‧‧‧Mouse Station

700‧‧‧ operation panel

800‧‧‧ Control Department

801‧‧‧ processor

802‧‧‧Memory

900A‧‧‧The first test machine

900B‧‧‧ 2nd Tester

A1‧‧‧Tray supply area

A2‧‧‧component supply area

A3‧‧‧ Inspection area

A3-1‧‧‧Area 1

A3-2‧‧‧ Zone 2

A4‧‧‧component recycling area

A5‧‧‧Tray removal area

L26‧‧‧light

α11A‧‧‧Arrow

α11B‧‧‧Arrow

α13X‧‧‧arrow

α13Y‧‧‧Arrow

α14‧‧‧Arrow

α15‧‧‧Arrow

α17Y‧‧‧Arrow

α18‧‧‧ Arrow

α20X‧‧‧Arrow

α20Y‧‧‧Arrow

α21‧‧‧ Arrow

α22A‧‧‧Arrow

α22B‧‧‧Arrow

α90‧‧‧ Arrow

FIG. 1 is a schematic perspective view of a first embodiment of the electronic component inspection device according to the present invention as viewed from the front side.

FIG. 2 is a schematic plan view showing an operating state of the electronic component inspection device shown in FIG. 1. FIG.

FIG. 3 is an enlarged vertical cross-sectional view sequentially showing the inspection area of the electronic component inspection device shown in FIG. 1 and the operation states before and after.

FIG. 4 is an enlarged vertical cross-sectional view sequentially showing an inspection area of the electronic component inspection device shown in FIG. 1 and an operation state before and after the inspection area.

FIG. 5 is an enlarged vertical cross-sectional view sequentially showing an inspection area of the electronic component inspection device shown in FIG. 1 and an operation state before and after the inspection area.

FIG. 6 is an enlarged vertical cross-sectional view sequentially showing an inspection area of the electronic component inspection device shown in FIG. 1 and an operation state before and after the inspection area.

FIG. 7 is an enlarged vertical cross-sectional view sequentially showing an inspection area of the electronic component inspection device shown in FIG. 1 and an operation state before and after the inspection area.

FIG. 8 is an enlarged vertical cross-sectional view sequentially showing an inspection area of the electronic component inspection device shown in FIG. 1 and an operation state before and after the inspection area.

FIG. 9 is an enlarged vertical cross-sectional view sequentially showing an inspection area of the electronic component inspection device shown in FIG. 1 and an operation state before and after the inspection area.

FIG. 10 is an enlarged vertical cross-sectional view sequentially showing an inspection area of the electronic component inspection device shown in FIG. 1 and an operation state before and after the inspection area.

FIG. 11 is an enlarged vertical cross-sectional view sequentially showing an inspection area of the electronic component inspection device shown in FIG. 1 and an operation state before and after the inspection area.

FIG. 12 is an enlarged vertical cross-sectional view sequentially showing the inspection area of the electronic component inspection device shown in FIG. 1 and the operation states before and after.

FIG. 13 is an enlarged vertical cross-sectional view sequentially showing an inspection area of the electronic component inspection device shown in FIG. 1 and an operation state before and after the inspection area.

FIG. 14 is an enlarged vertical cross-sectional view sequentially showing an inspection area of the electronic component inspection device shown in FIG. 1 and an operation state before and after the inspection area.

FIG. 15 is an enlarged vertical cross-sectional view sequentially showing the inspection area of the electronic component inspection device shown in FIG. 1 and the operation states before and after.

FIG. 16 is an enlarged vertical cross-sectional view sequentially showing an inspection area of the electronic component inspection device shown in FIG. 1 and an operation state before and after the inspection area.

FIG. 17 is an enlarged vertical cross-sectional view sequentially showing the inspection area of the electronic component inspection device shown in FIG. 1 and the operation states before and after.

FIG. 18 is an enlarged vertical cross-sectional view sequentially showing an inspection area of the electronic component inspection device shown in FIG. 1 and an operation state before and after the inspection area.

FIG. 19 is an enlarged vertical cross-sectional view sequentially showing an inspection area of the electronic component inspection device shown in FIG. 1 and an operation state before and after the inspection area.

FIG. 20 is an enlarged vertical cross-sectional view sequentially showing an inspection area of the electronic component inspection device shown in FIG. 1 and an operation state before and after the inspection area.

FIG. 21 is an enlarged vertical cross-sectional view sequentially showing the inspection area of the electronic component inspection device shown in FIG. 1 and the operation states before and after.

FIG. 22 is an enlarged vertical cross-sectional view sequentially showing an inspection area of the electronic component inspection device shown in FIG. 1 and an operation state before and after the inspection area.

FIG. 23 is an enlarged vertical cross-sectional view sequentially showing an inspection area of the electronic component inspection device shown in FIG. 1 and an operation state before and after the inspection area.

FIG. 24 is an enlarged vertical cross-sectional view sequentially showing the inspection area of the electronic component inspection device shown in FIG. 1 and the operation states before and after.

FIG. 25 is an enlarged vertical cross-sectional view sequentially showing the inspection area of the electronic component inspection device shown in FIG. 1 and the operation states before and after.

FIG. 26 is an enlarged vertical cross-sectional view sequentially showing the inspection area of the electronic component inspection device shown in FIG. 1 and the operation states before and after.

FIG. 27 is an enlarged vertical cross-sectional view sequentially showing the inspection area of the electronic component inspection device shown in FIG. 1 and the operation states before and after.

FIG. 28 is an enlarged vertical cross-sectional view sequentially showing an inspection area of the electronic component inspection device shown in FIG. 1 and an operation state before and after the inspection area.

FIG. 29 is an enlarged vertical cross-sectional view sequentially showing an inspection area of the electronic component inspection device shown in FIG. 1 and an operation state before and after the inspection area.

FIG. 30 is a plan view of the state shown in FIG. 3.

FIG. 31 is a plan view of the state shown in FIG. 5.

FIG. 32 is a plan view of the state shown in FIG. 6.

FIG. 33 is a plan view of the state shown in FIG. 9.

FIG. 34 is a plan view of the state shown in FIG. 12.

Fig. 35 is a plan view of the state shown in Fig. 15.

FIG. 36 is a plan view of the state shown in FIG. 16.

FIG. 37 is a plan view of the state shown in FIG. 17.

FIG. 38 is a plan view of the state shown in FIG. 20.

FIG. 39 is a plan view of the state shown in FIG. 24.

FIG. 40 is a plan view of the state shown in FIG. 25.

FIG. 41 is a plan view of the state shown in FIG. 27.

FIG. 42 is a plan view of the state shown in FIG. 29.

Fig. 43 is an enlarged plan view showing the inspection area of the electronic component inspection device (second embodiment) of the present invention.

FIG. 44 is an enlarged vertical cross-sectional view showing an inspection area of the electronic component inspection apparatus (third embodiment) of the present invention, and an operation state before and after the inspection area.

FIG. 45 is an enlarged vertical cross-sectional view showing an inspection area of the electronic component inspection apparatus (the fourth embodiment) of the present invention, and its operating states before and after.

Claims (18)

An electronic component conveying device for conveying the electronic component to a first inspection unit that performs a first inspection of the electronic component and a second inspection unit that performs a second inspection different from the first inspection to the electronic component, have: A holding portion that holds the above-mentioned electronic component; A mobile mounting section on which the above-mentioned electronic components are mounted; and A control section that controls the holding section; and The above control section Causing the holding section to transport the electronic component from the mobile placement section to the first inspection section, Causing the holding unit to transport the electronic component after the first inspection from the first inspection unit to the mobile placement unit, and The holding unit is configured to transport the electronic component from the mobile placement unit to the second inspection unit. For example, the electronic parts transfer device of item 1, wherein When a straight line extending in a direction in which the moving mounting portion moves is set as a first axis and a straight line orthogonal to the first axis is set as a second axis, the holding portion moves along the second axis. If the electronic parts transfer device of item 2 is requested, in which The moving mounting section includes an electronic component supply section and an electronic component recovery section arranged along the first axis, The above control section Causing the holding section to transport the electronic component from the electronic component supply section to the first inspection section, and The holding unit is configured to transport the electronic component after the first inspection from the first inspection unit to the electronic component supply unit. If the electronic parts transfer device of item 3 is requested, in which The above control section Causing the holding section to transport the electronic component from the electronic component supply section to the second inspection section, and The holding unit is configured to transport the electronic component after the second inspection from the second inspection unit to the electronic component recovery unit. If the electronic parts transfer device of item 3 or 4 is requested, where The electronic component supply section includes a first supply moving mounting section and a second supply moving mounting section arranged along the first axis, The holding portion includes a first holding portion and a second holding portion arranged along the first axis, The above control section Holding the first holding part with the electronic component placed on the first supply moving placing part, Holding the second holding portion to hold the electronic component placed on the second supply moving placing portion, Causing the first holding section to transport the electronic component to the first inspection section, and The second holding unit is configured to transport the electronic component to the second inspection unit. If the electronic part transfer device of claim 5 is provided, it has: An inspection area in which the first inspection section and the second inspection section are arranged; and The supply area is arranged side by side with the inspection area along the first axis; The supply region includes a supply head for mounting the electronic component on the first supply moving mounting section, The above control section Moving the mobile mounting section so that the first supply moving mounting section is located in the supply area and the second supply moving mounting section is located in the inspection area, and The supply head is configured to mount the electronic component on the first supply moving mounting portion. If the electronic parts transfer device of item 3 or 4 is requested, where The electronic component recovery unit includes a first recovery movement placement unit and a second recovery movement placement unit arranged along the first axis, The holding portion includes a first holding portion and a second holding portion arranged along the first axis, The above control section Holding the first holding part with the electronic component placed on the first recovery moving placing part, Holding the second holding portion of the electronic component placed on the second recovery moving placing portion, Causing the first holding section to transport the electronic component to the first inspection section, and The second holding unit is configured to transport the electronic component to the second inspection unit. If the electronic parts transfer device of item 7 is provided, it has: An inspection area in which the first inspection section and the second inspection section are arranged; and The recovery area is arranged side by side with the inspection area along the first axis; and The collection area includes a collection head for holding the electronic component placed on the second collection moving placement section, The above control section Moving the mobile placement unit such that the first recovery mobile placement unit is located in the inspection area and the second recovery mobile placement unit is located in the recovery area, The recovery head is configured to hold the electronic component mounted on the second recovery moving mounting portion. An electronic component conveying device for conveying the electronic component to a first inspection unit that performs a first inspection of the electronic component and a second inspection unit that performs a second inspection different from the first inspection to the electronic component, have: A holding portion that holds the above-mentioned electronic component; A mobile mounting section on which the above-mentioned electronic components are mounted; and A control unit that controls the holding unit; The above control section Causing the holding section to transport the electronic component from the mobile placement section to the first inspection section, Causing the holding unit to transport the electronic component after the first inspection from the first inspection unit to the second inspection unit, and The holding unit is configured to transport the electronic component after the second inspection from the second inspection unit to the mobile placement unit. An electronic component inspection device includes: A first inspection unit that performs a first inspection on electronic parts; A second inspection unit that performs a second inspection on the electronic component different from the first inspection; A holding unit that holds the electronic components and transports them to the first inspection unit and the second inspection unit; A mobile mounting section on which the above-mentioned electronic components are mounted; and A control section that controls the holding section; and The above control section Causing the holding section to transport the electronic component from the mobile placement section to the first inspection section, Causing the holding unit to transport the electronic component after the first inspection from the first inspection unit to the mobile placement unit, and The holding unit is configured to transport the electronic component from the mobile placement unit to the second inspection unit. The electronic component inspection device of claim 10, wherein When a straight line extending in a direction in which the moving mounting portion moves is set as a first axis, and a straight line orthogonal to the first axis is set as a second axis, the holding portion moves along the second axis. The electronic component inspection device as claimed in item 11, wherein The moving mounting section includes an electronic component supply section and an electronic component recovery section arranged along the first axis, The above control section Causing the holding section to transport the electronic component from the electronic component supply section to the first inspection section, and The holding unit is configured to transport the electronic component after the first inspection from the first inspection unit to the electronic component supply unit. The electronic component inspection device of claim 12, wherein The above control section Causing the holding section to transport the electronic component from the electronic component supply section to the second inspection section, and The holding unit is configured to transport the electronic component after the second inspection from the second inspection unit to the electronic component recovery unit. The electronic parts inspection device of claim 12 or 13, wherein The electronic component supply section includes a first supply moving mounting section and a second supply moving mounting section arranged along the first axis, The holding portion includes a first holding portion and a second holding portion arranged along the first axis, The above control section Holding the first holding part with the electronic component placed on the first supply moving placing part, Holding the second holding portion to hold the electronic component placed on the second supply moving placing portion, Causing the first holding section to transport the electronic component to the first inspection section, and The second holding unit is configured to transport the electronic component to the second inspection unit. If the electronic component inspection device of claim 14 is provided with: An inspection area in which the first inspection section and the second inspection section are arranged; and The supply area is arranged side by side with the inspection area along the first axis; The supply region includes a supply head for mounting the electronic component on the first supply moving mounting section, The above control section Moving the mobile mounting section so that the first supply moving mounting section is located in the supply area and the second supply moving mounting section is located in the inspection area, and The supply head is configured to mount the electronic component on the first supply moving mounting portion. The electronic parts inspection device of claim 12 or 13, wherein The electronic component recovery unit includes a first recovery movement placement unit and a second recovery movement placement unit arranged along the first axis, The holding portion includes a first holding portion and a second holding portion arranged along the first axis, The above control section Holding the first holding part with the electronic component placed on the first recovery moving placing part, Holding the second holding portion of the electronic component placed on the second recovery moving placing portion, Causing the first holding section to transport the electronic component to the first inspection section, and The second holding unit is configured to transport the electronic component to the second inspection unit. If the electronic component inspection device of claim 16 is provided with: An inspection area in which the first inspection section and the second inspection section are arranged; and The recovery area is arranged side by side with the inspection area along the first axis; The collection area includes a collection head for holding the electronic component placed on the second collection moving placement section, The above control section Moving the mobile placement unit such that the first recovery mobile placement unit is located in the inspection area and the second recovery mobile placement unit is located in the recovery area, The recovery head is configured to hold the electronic component mounted on the second recovery moving mounting portion. An electronic component inspection device that transports the electronic component to a first inspection unit that performs a first inspection of electronic components, and a second inspection unit that performs a second inspection different from the first inspection on the electronic components, and have: A holding portion that holds the above-mentioned electronic component; A mobile mounting section on which the above-mentioned electronic components are mounted; and A control section that controls the holding section; and The above control section Causing the holding section to transport the electronic component from the mobile placement section to the first inspection section, Causing the holding unit to transport the electronic component after the first inspection from the first inspection unit to the second inspection unit, and The holding unit is configured to transport the electronic component after the second inspection from the second inspection unit to the mobile placement unit.