TWI703078B - Electronic component conveying device, electronic component inspection device and suction member - Google Patents

Abstract

The present invention provides an electronic component conveying device and an electronic component inspection device which facilitate the replacement operation of an adsorption member. The electronic component conveying device of the present invention is characterized by having a conveying section for conveying electronic components, and the conveying section has: an adsorbing member capable of adsorbing the electronic component; and a mounting section detachably mounting the adsorbing member to the adsorbing member The component is provided with a first buckling portion, and the mounting portion is provided with a second buckling portion. The second buckling portion can be shifted to the first position of the first buckling portion and not buckled in The second position of the first engaging portion.

Description

Electronic component conveying device, electronic component inspection device and suction member

The present invention relates to an electronic component conveying device and an electronic component inspection device.

Conventionally, an IC processor capable of performing electrical tests on IC devices has been known (for example, refer to Patent Document 1). The IC processor described in Patent Document 1 has a metallic pad adapter and a rubber pad attached to the metallic pad adapter as a conveyance section for conveying IC devices. In addition, IC devices can be absorbed by rubber pads and transported directly. In addition, the rubber pad is replaced with a different size or the like according to the size or type of the IC device. [Prior Art Document] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 08-267383

[The problem to be solved by the invention]

For the IC processor constructed in this way, there is, for example, one that is installed by screwing a metallic pad adapter and a rubber pad. In this case, when replacing the rubber pad, it is necessary to rotate the rubber pad to fasten it to the metal pad adapter, or perform torque management, and the replacement operation is complicated. [Technical means to solve the problem]

The present invention is accomplished to solve at least a part of the above-mentioned problems, and can be realized as the following.

The electronic component conveying device of the present invention is characterized by having a conveying section for conveying electronic components, and the conveying section has: an adsorbing member capable of adsorbing the electronic component; and a mounting section for detachably mounting the adsorbing member to the adsorbing member The member is provided with a first buckling portion, and the mounting portion is provided with a second buckling portion, and the second buckling portion can be displaced to buckle with the first buckling portion to become an installation state where the suction member is installed The first position, and the second position to release the above installation state.

As a result, the suction member can be easily and quickly detached from the installation part by stretching the suction member installed in the installation state of the installation part. In addition, for the attachment part in the state where the adsorption member has not been attached, the adsorption member can be easily and quickly mounted to the attachment part by pushing in the adsorption member. As described above, the attachment and detachment of the suction member to the mounting part becomes quick and easy. Thereby, it can correspond to the type of electronic parts, and the operation of replacing the suction member can be easily performed.

In the electronic component conveying device of the present invention, it is preferable that the suction member has a tubular portion inserted into the mounting portion in the mounted state, and the first engaging portion is constituted by a concave portion provided on an outer peripheral portion of the tubular portion, The second engaging portion is constituted by a convex portion that is engaged with the concave portion at the first position.

Thereby, the attaching and detaching operation of the suction member to the mounting part can be easily performed, and as a result, the replacement operation of the suction member corresponding to the type of electronic component becomes easy.

In the electronic component conveying device of the present invention, it is preferable that the concave portion is formed by a groove formed along the circumferential direction of the outer peripheral portion of the tubular portion, and the convex portion is arranged in plural along the groove at the first position The sphere constitutes.

Thereby, the attaching and detaching operation of the suction member to the mounting part can be easily performed, and as a result, the replacement operation of the suction member corresponding to the type of electronic component becomes easy.

In the electronic component conveying device of the present invention, it is preferable that the mounting portion has an operation portion that can perform an operation for displacing the second engaging portion from the first position to the second position.

Thereby, when the operation part is operated, the suction member mounted on the mounting part can be detached, or, conversely, the suction member can be mounted on the mounting part where the suction member has not yet been mounted.

In the electronic component conveying device of the present invention, it is preferable that the mounting portion has an elastic pushing portion that elastically pushes the operating portion to restrict the displacement of the second engaging portion.

Thereby, the suction member in the installed state can be prevented from being accidentally separated from the installation part.

In the electronic component conveying device of the present invention, it is preferable that the adsorption member prepares a plurality of different ones of at least one of shape and size corresponding to the type of the electronic component, and selects one of the plurality of adsorption members, and Install in the above-mentioned mounting part.

Thereby, the suction member suitable for various electronic components can be mounted on the mounting part, whereby the electronic component can be stably suctioned by the suction member.

In the electronic component transport device of the present invention, it is preferable that the suction member includes: a first member having a tubular portion inserted into the mounting portion in the mounted state; and a second member used in connection with the first member, It has an adsorption pad that can adsorb the above electronic parts.

Thereby, for example, if the first member is a common member and a plurality of second members having different shapes or sizes are prepared, the suction member suitable for various electronic components can be attached to the mounting portion.

In the electronic component transport device of the present invention, it is preferable that the second member prepares a plurality of different ones of at least one of shape and size corresponding to the type of the electronic component, and selects one of the plurality of second members , And installed in the first member above.

Thereby, the suction member suitable for various electronic parts can be mounted on the mounting part.

In the electronic component conveying device of the present invention, it is preferable that the connection operation of the second member to the first member and the disconnection operation of the first member and the second member are performed by causing the suction member to be removed from the mounting portion Carried out in a state of being separated.

Thereby, when connecting and disconnecting, for example, the operation can be performed more easily than when it is set in the installed state.

In the electronic component transfer device of the present invention, it is preferable that the first member is provided with an internal thread, and the second member is provided with an external thread that is screwed to the internal thread when connected to the first member.

Thereby, for example, as the second member, the conventional screw-in suction member can be connected to the first member and used.

In the electronic component conveying device of the present invention, it is preferable that the mounting portion has a restricting portion that restricts the rotation of the electronic component sucked to the suction member about a vertical axis.

By this, for example, when the electronic components are quadrangular in plan view, it is possible to prevent adjacent electronic components from interfering with each other.

The electronic component inspection device of the present invention is characterized in that it includes a conveying part that conveys electronic parts; and an inspection part that inspects the electronic parts. The conveying part has: an adsorption member that can adsorb the electronic parts; and a mounting part that can The suction member is detachably mounted, a first engaging portion is provided on the suction member, and a second engaging portion is provided on the mounting portion, and the second engaging portion can be displaced to engage with the first engaging portion It becomes the first position in the installation state where the suction member is installed, and the second position in the installation state released.

Thereby, by stretching the suction member installed in the installation state of the installation part, the suction member can be easily and quickly detached from the installation part. In addition, for the attachment part in the state where the adsorption member has not been attached, the adsorption member can be easily and quickly mounted to the attachment part by pushing in the adsorption member. As described above, the attachment and detachment of the suction member to the mounting part becomes quick and easy. Thereby, it can correspond to the type of electronic parts, and the operation of replacing the suction member can be easily performed.

In addition, the electronic component can be transported to the inspection unit, whereby the inspection unit can inspect the electronic component. In addition, electronic parts after inspection can be transported from the inspection department.

Hereinafter, the electronic component transport device and the electronic component inspection device of the present invention will be described in detail based on the preferred embodiments shown in the accompanying drawings.

<First Embodiment> Hereinafter, with reference to FIGS. 1 to 8, the first embodiment of the electronic component conveying device and the electronic component inspection device of the present invention will be described. In addition, in the following, for convenience of explanation, as shown in FIG. 1, the three axes orthogonal to each other are referred to as X axis, Y axis, and Z axis. In addition, the XY plane including the X axis and the Y axis becomes horizontal, and the Z axis becomes vertical. In addition, the direction parallel to the X axis is also called "X direction (first direction)", the direction parallel to the Y axis is called "Y direction (second direction)", and the direction parallel to the Z axis is called "Z direction (3rd direction)". In addition, the direction in which the arrows of each direction face is called "positive", and the opposite direction is called "negative". In addition, the "level" mentioned in the specification of this case is not limited to a complete level, as long as it does not hinder the transportation of electronic components, it also includes a state slightly inclined (for example, less than ±5°) relative to the level. In addition, the upper side in FIGS. 1, 3 to 8 (the same as in FIGS. 9 to 13), that is, the positive side in the Z-axis direction is called "upper" or "upper", and the lower side, that is, the Z-axis direction The negative side is called "down" or "down".

The electronic component conveying device 10 of the present invention has the appearance shown in FIG. 1. The electronic component conveying apparatus 10 includes a conveying unit 25 that conveys an IC device 90 that is an electronic component. The conveying part 25 has an adsorption member 3 which can adsorb an IC device 90 (electronic component), and a mounting part 4 which mounts the adsorption member 3 detachably. The suction member 3 is provided with a first engaging portion 331. The mounting portion 4 is provided with a second buckling portion 42 which is shifted to the first position where the suction member 3 is installed by buckling with the first buckling portion 331 and the second position when the suction member 3 is installed. .

In addition, in this embodiment, as the IC device 90 that is sucked and conveyed, the conveyance section 25 includes the device transfer head 13, the device transfer head 17, and the device transfer head 20. Hereinafter, an example in which the present invention is applied to the device transfer head 13 will be described, but the application location is not limited to the device transfer head 13 and may be applied to the device transfer head 17 or the device transfer head 20.

According to the present invention in this way, as described later, by stretching the suction member 3 in the mounted state attached to the mounting portion 4, the suction member 3 can be easily and quickly detached from the mounting portion 4. In addition, for the attachment part 4 in the state where the adsorption member 3 has not been attached, the adsorption member 3 can be pushed in, so that the adsorption member 3 can be easily and quickly attached to the attachment part 4. As described above, the attachment and detachment of the suction member 3 to the mounting portion 4 becomes quick and easy. Thereby, it can correspond to the type of IC device 90, and the work of replacing the suction member 3 can be easily performed.

Furthermore, as shown in FIG. 2, the electronic component inspection apparatus 1 of the present invention has an electronic component transport device 10 and further includes a test system (test system) of an inspection unit 16 for inspecting electronic components. That is, the electronic component inspection apparatus 1 is a test system provided with the conveyance part 25 which conveys the IC device 90 which is an electronic part, and the inspection part 16 which inspects the IC device 90 (electronic part). The conveying part 25 has an adsorption member 3 which can adsorb an IC device 90 (electronic component), and a mounting part 4 which is detachably mounted to the adsorption member 3. The suction member 3 is provided with a first engaging portion 331. The mounting portion 4 is provided with a second buckling portion 42 which can be displaced to the first position in the mounting state where the suction member 3 is mounted by buckling with the first buckling portion 331, and the second in the dismounting state position.

Thereby, an electronic component inspection device 1 having the advantages of the above-mentioned electronic component conveying device 10 is obtained. In addition, the IC device 90 (electronic component) can be transported to the inspection unit 16, whereby the inspection unit 16 can inspect the IC device 90. In addition, the IC device 90 after the inspection can be transported from the inspection unit 16.

Hereinafter, the structure of each part will be described in detail. As shown in Figures 1 and 2, the electronic component inspection device 1 with the electronic component transport device 10 is the following device: for example, electronic components such as BGA (Ball Grid Array) packages that are IC devices are transported during the transport process. During inspection and testing (hereinafter referred to as "inspection") the electrical characteristics of electronic parts. In addition, in the following, for convenience of description, the case where an IC device is used as the above-mentioned electronic component is described as a representative, and the IC device is referred to as "IC device 90". The IC device 90 has a flat plate shape in this embodiment (see FIG. 4).

In addition, as IC devices, in addition to the above, for example, "LSI (Large Scale Integration: large integrated circuit)", "CMOS (Complementary Metal Oxide Semiconductor: Complementary Metal Oxide Semiconductor)", "CCD (Charge Coupled Device: Charge-coupled device)”, “Modular IC”, “Quartz Device”, “Pressure Sensor”, “Inertial Sensor (Acceleration Sensor)”, “Module IC”, “Quartz Device”, “Pressure Sensor”, “Inertial Sensor (Acceleration Sensor)”, “ "Gyro Sensor", "Fingerprint Sensor", etc.

The electronic component inspection device 1 (electronic component conveying device 10) is provided with: a tray supply area A1, a component supply area A2, an inspection area A3, a component recovery area A4, and a tray removal area A5. These areas are described below, and each wall part Separated. In addition, the IC device 90 passes through the above-mentioned areas from the tray supply area A1 to the tray removal area A5 in the direction of the arrow α90, and is inspected in the inspection area A3 in the middle. In this way, the electronic component inspection device 1 is provided with the following: an electronic component transport device 10 having a transport unit 25 that transports the IC device 90 through each area; an inspection unit 16 that performs inspection in the inspection area A3; and control Department 800. In addition, the electronic component inspection device 1 includes a monitor 300, a signal lamp 400, and an operation panel 700.

In addition, the electronic component inspection apparatus 1 arranges the tray supply area A1 and the tray removal area A5, that is, the lower side in FIG. 2 is the front side, and the inspection area A3 is arranged, that is, the upper side in FIG. 2 is used as the back side.

In addition, the electronic component inspection apparatus 1 is used by pre-installing a so-called "replacement kit" that is replaced by the type of IC device 90. In this replacement kit, there is a mounting portion (electronic component mounting portion) on which an IC device 90 (electronic component) is mounted. In the electronic component inspection apparatus 1 of the present embodiment, the placement portion is provided at a plurality of locations, such as the temperature adjustment portion 12, the component supply portion 14, and the component recovery portion 18 described later. In addition, in the placement section (electronic component placement section) where IC devices 90 (electronic components) are placed, in addition to the above-mentioned replacement kit, there are also trays 200 prepared by the user, trays 19 for recycling, and an inspection section. 16.

The tray supply area A1 is the material supply part of the tray 200 which is supplied with a plurality of IC devices 90 in an unchecked state. The tray supply area A1 can also be said to be a mounting area where a plurality of trays 200 can be stacked and mounted. In addition, in this embodiment, in each tray 200, a plurality of recesses (grooves) are arranged in a matrix. The IC devices 90 can be housed and placed one by one in each recess.

The device supply area A2 transports and supplies a plurality of IC devices 90 on the tray 200 from the tray supply area A1 to the inspection area A3. In addition, tray conveying mechanisms 11A and 11B that convey the tray 200 piece by piece in the horizontal direction are provided so as to span the tray supply area A1 and the device supply area A2. The tray transport mechanism 11A is a part of the transport unit 25, and can move the tray 200 together with the IC device 90 placed on the tray 200 on the positive side of the Y direction, that is, in the direction of the arrow α11A in FIG. 2. Thereby, the IC device 90 can be stably sent to the device supply area A2. In addition, the tray transport mechanism 11B is a moving part that can move the empty tray 200 on the negative side of the Y direction, that is, in the direction of the arrow α11B in FIG. 2. Thereby, the empty tray 200 can be moved from the device supply area A2 to the tray supply area A1.

In the device supply area A2, a temperature adjustment section (soak plate (English: soak plate)) 12, a device transfer head 13, and a tray transfer mechanism 15 are provided. In addition, a device supply unit 14 that moves so as to span the device supply area A2 and the inspection area A3 is also provided.

The temperature adjustment part 12 is a mounting part on which a plurality of IC devices 90 are mounted, and is called a "heating plate" that can heat or cool the mounted IC devices 90 together. With the uniform temperature plate, the IC device 90 before the inspection by the inspection section 16 can be preheated or cooled, and adjusted to a temperature suitable for the inspection (high temperature inspection).

The temperature adjustment part 12 as such a mounting part is fixed. Thereby, the temperature of the IC device 90 on the temperature adjustment part 12 can be stably adjusted.

In addition, the temperature adjustment unit 12 is grounded. In the structure shown in FIG. 2, the temperature adjustment part 12 is arrange|positioned and fixed to two in the Y direction. In addition, the IC device 90 on the tray 200 carried in from the tray supply area A1 by the tray transport mechanism 11A is transported to any temperature adjustment unit 12.

The device transfer head 13 is a holding portion that holds and transfers the IC device 90, and is movably supported in the device supply area A2. The device transfer head 13 is also a part of the transfer section 25, and is responsible for the transfer of IC devices 90 between the tray 200 and the temperature adjustment section 12 carried in from the tray supply area A1, and between the temperature adjustment section 12 and the device supply section 14 described later The transfer of IC device 90. In addition, in FIG. 2, the movement of the component transfer head 13 in the X direction is represented by arrow α13X, and the movement of the component transfer head 13 in the Y direction is represented by arrow α13Y.

The component supply part 14 is a mounting part where the temperature-adjusted IC component 90 is placed, and it is called a "supply shuttle" or simply a "supply shuttle" that can transport the IC component 90 to the vicinity of the inspection unit 16. The device supply part 14 may also become a part of the conveying part 25. In the device supply section 14, a plurality of recesses (grooves) are arranged in a matrix. The IC devices 90 can be housed and placed one by one in each recess.

In addition, the component supply section 14 as the placement section is supported in the X direction, that is, along the arrow α14 direction, between the component supply area A2 and the inspection area A3 of the inspection section 16 so as to be movable (movable). Thereby, the device supply unit 14 can stably transport the IC device 90 from the device supply area A2 to the vicinity of the inspection unit 16 in the inspection area A3, and can also remove the IC device 90 from the inspection area A3 by the device transfer head 17 Return to the device supply area A2 again.

In the structure shown in FIG. 2, there are two component supply sections 14 arranged in the Y direction. The component supply section 14 on the negative side in the Y direction is called "device supply section 14A", and the component supply section 14 on the positive side in the Y direction is called It is "device supply part 14B". In addition, the IC device 90 on the temperature adjustment portion 12 is transported to the device supply portion 14A or the device supply portion 14B in the device supply area A2. In addition, the device supply unit 14 is configured to be able to heat or cool the IC device 90 placed on the device supply unit 14 similarly to the temperature adjustment unit 12. Thereby, the IC device 90 whose temperature has been adjusted by the temperature adjustment unit 12 can be maintained in its temperature adjustment state, and it can be transported to the vicinity of the inspection unit 16 in the inspection area A3. In addition, the device supply unit 14 is also grounded in the same manner as the temperature adjustment unit 12.

The tray transport mechanism 15 is a mechanism for transporting the empty tray 200 in the device supply area A2 in the state where all the IC devices 90 have been removed, on the positive side of the X direction, that is, in the direction of arrow α15. And after this conveyance, the empty tray 200 is returned from the component supply area A2 to the tray supply area A1 by the tray conveyance mechanism 11B.

The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, an inspection unit 16 for inspecting the IC device 90 and a device transfer head 17 are provided.

The device transfer head 17 is a part of the transfer section 25, and, like the temperature adjustment section 12, is configured to be able to heat or cool the held IC device 90. Thereby, it is possible to hold the IC device 90 maintained in the aforementioned temperature-adjusted state to maintain the aforementioned temperature-adjusted state, and transport the IC device 90 in the inspection area A3.

Such a device transfer head 17 is supported reciprocally in the Y direction and the Z direction in the inspection area A3, and becomes a part of a mechanism called an "indexing arm". Thereby, the device transfer head 17 can lift the IC device 90 from the device supply unit 14 carried in from the device supply area A2, and can transfer it and place it on the inspection unit 16.

In addition, in FIG. 2, the reciprocating movement of the device transfer head 17 in the Y direction is indicated by an arrow α17Y. In addition, the device transfer head 17 is supported reciprocally in the Y direction, but it is not limited to this, and may be supported reciprocally in the X direction. In addition, in the structure shown in FIG. 2, two device transfer heads 17 are arranged in the Y direction. The device transfer head 17 on the negative side of the Y direction is called "device transfer head 17A", and the device on the positive side of the Y direction is transferred. The head 17 is referred to as the "device transfer head 17B". The device transfer head 17A can be in charge of the inspection area A3 to transfer the IC device 90 from the device supply unit 14A to the inspection unit 16, and the device transfer head 17B can be in charge of the inspection area A3, so that the IC device 90 is transferred from the device supply unit 14B to the inspection area A3. Transport of inspection section 16.

The inspection portion 16 (slot) is a mounting portion (electronic component mounting portion) for mounting an IC device 90 that is an electronic component, and inspecting the electrical characteristics of the IC device 90. The inspection part 16 has a recess for storing and placing the IC device 90, and a plurality of probe pins are provided at the bottom of the recess. Furthermore, by electrically connecting the terminals of the IC device 90 and the probe pin, that is, contacting, the inspection of the IC device 90 can be performed. The inspection of the IC device 90 is performed based on a program memorized in the inspection control section of the tester connected to the inspection section 16. In addition, the inspection unit 16 in this manner, like the temperature adjustment unit 12, can heat or cool the IC device 90 and adjust the IC device 90 to a temperature suitable for inspection.

The device recovery area A4 is an area where the inspection will be performed in the inspection area A3, and a plurality of IC devices 90 that have completed the inspection will be recovered. In this device collection area A4, a collection tray 19, a device transfer head 20, and a tray transfer mechanism 21 are provided. In addition, there is also a device recovery section 18 that moves across the inspection area A3 and the device recovery area A4. In addition, an empty tray 200 is also prepared in the device recovery area A4.

The device recovery part 18 is used to mount the IC device 90 that has been inspected by the inspection part 16, and the IC device 90 can be transported to the placement part of the device recovery area A4, which is called "recycling shuttle" or simply "recycling shuttle" . The device recovery part 18 may also become a part of the conveying part 25.

In addition, the device recovery part 18 is supported so as to move back and forth between the inspection area A3 and the device recovery area A4 along the X direction, that is, the α18 direction. In the structure shown in FIG. 2, the device recovery part 18 is arranged in the Y direction as two parts as the device supply part 14, and the device recovery part 18 on the negative side of the Y direction is called the "device recovery part 18A". The device recovery part 18 on the positive side in the Y direction is referred to as "device recovery part 18B". In addition, the IC device 90 on the inspection unit 16 is transported and placed in the device collection unit 18A or the device collection unit 18B. The transfer of the IC device 90 from the inspection unit 16 to the device recovery unit 18A is performed by the device transfer head 17A, and the transfer from the inspection unit 16 to the device recovery unit 18B is performed by the device transfer head 17B. In addition, the device recovery unit 18 is also grounded like the temperature adjustment unit 12 or the device supply unit 14.

The tray 19 for recovery is a mounting part where the IC device 90 inspected by the inspection part 16 is placed, and is fixed so as not to move in the device recovery area A4. Thereby, even in the collection area A4 where a large number of various movable parts such as the device transfer head 20 are arranged, the IC device 90 that has been inspected is stably placed on the collection tray 19. In addition, in the configuration shown in FIG. 2, three collection trays 19 are arranged along the X direction.

In addition, three empty trays 200 are also arranged along the X direction. The empty tray 200 also becomes a placement part where the IC device 90 inspected by the inspection part 16 is placed. In addition, the IC device 90 moved to the device recovery section 18 of the device recovery area A4 is transported and placed on either the recovery tray 19 or the empty tray 200. In this way, the IC devices 90 are classified according to the inspection results and recycled.

The device transfer head 20 has a part that is movably supported in the X direction and the Y direction in the device recovery area A4, and is further movable in the Z direction. The device transfer head 20 is a part of the transfer part 25, and can transfer the IC device 90 from the device recovery part 18 to the recovery tray 19 or the empty tray 200. In addition, in FIG. 2, the movement of the component transfer head 20 in the X direction is indicated by arrow α20X, and the movement of the component transfer head 20 in the Y direction is indicated by arrow α20Y.

The tray transport mechanism 21 is a mechanism that transports the empty tray 200 carried in from the tray removal area A5 in the X direction, that is, the arrow α21 direction in the device recovery area A4. And, after the conveyance, the empty tray 200 is placed at the position where the IC device 90 is collected, that is, it can be any of the three empty trays 200 described above.

The tray removal area A5 is a removal part for collecting and removing the tray 200 on which a plurality of IC devices 90 in the inspected state are arranged. In the tray removal area A5, a plurality of trays 200 can be stacked.

In addition, a tray transport mechanism 22A and a tray transport mechanism 22B that transport the tray 200 piece by piece in the Y direction are provided so as to span the device recovery area A4 and the tray removal area A5. The tray conveying mechanism 22A is a part of the conveying part 25, and is a moving part that allows the tray 200 to move back and forth in the Y direction, that is, in the direction of the arrow α22A. Thereby, the IC device 90 that has been inspected can be transported from the device recovery area A4 to the tray removal area A5. In addition, the tray conveying mechanism 22B can move the empty tray 200 used to collect the IC device 90 on the positive side of the Y direction, that is, in the direction of the arrow α 22B. Thereby, the empty tray 200 can be moved from the tray removal area A5 to the device recovery area A4.

The control unit 800 has at least one processor that performs various judgments, various commands, and the like. The control unit 800 can control the actions of the following parts, for example: the tray transport mechanism 11A, the tray transport mechanism 11B, the temperature adjustment unit 12, the device transfer head 13, the device supply unit 14, the tray transfer mechanism 15, the inspection unit 16, the device transfer head 17, The device collection unit 18, the device transfer head 20, the tray transfer mechanism 21, the tray transfer mechanism 22A, the tray transfer mechanism 22B, and the like.

In addition, in this embodiment, the control part 800 is built in the electronic component inspection apparatus 1, but it is not limited to this. For example, the control unit 800 may also be installed in an external device such as an external computer. In addition, the external device includes, for example, a case of communicating with the electronic component inspection device 1 via a cable or the like, a case of wireless communication, and a case of connecting to the electronic component inspection device 1 via a network (Internet).

The operator can set and confirm the operating conditions and the like of the electronic component inspection device 1 via the monitor 300. The monitor 300 has a display screen 301 composed of, for example, a liquid crystal screen, and is arranged on the upper part of the front side of the electronic component inspection device 1. As shown in FIG. 1, on the right side of the figure of the tray removal area A5, there is a mouse station 600 on which a mouse is placed. The mouse is used when operating the screen displayed on the monitor 300.

In addition, an operation panel 700 is arranged on the lower right of the monitor 300 in FIG. 1. The operation panel 700 is separated from the monitor 300, and commands a desired action to the electronic component inspection device 1.

In addition, the signal lamp 400 can notify the operation status of the electronic component inspection device 1 and the like by the combination of the light-emitting colors. The signal lamp 400 is arranged on the upper part of the electronic component inspection device 1. In addition, the electronic component inspection device 1 has a built-in speaker 500, and the operation state of the electronic component inspection device 1 and the like can also be notified by the speaker 500.

In the electronic component inspection apparatus 1, the tray supply area A1 and the component supply area A2 are separated by a first partition 231, the component supply area A2 and the inspection area A3 are separated by a second partition 232, and the inspection area A3 is separated from The device recovery area A4 is separated by a third partition 233, and the device recovery area A4 and the tray removal area A5 are separated by a fourth partition 234. In addition, the device supply area A2 and the device recovery area A4 are also separated by a fifth partition 235.

The outermost of the electronic component inspection device 1 is covered by a cover, which includes, for example, a front cover 241, a side cover 242, a side cover 243, a rear cover 244, and a top cover 245.

As described above, the electronic component inspection device 1 is used by pre-installing a so-called "replacement kit" that is replaced by the type of IC device 90.

At the device transfer head 13, there is also an adsorption member 3 that can adsorb IC devices 90 (electronic parts) as a replacement kit. The suction member 3 prepares a plurality of different ones in at least one of the shape and size (the size of the suction pad 31 in this embodiment) corresponding to the type of the IC device 90 (electronic component) (see FIG. 3). As an example, FIG. 3 shows the suction member 3A and the suction member 3B. In addition, one of the plurality of suction members 3 (the suction member 3A and the suction member 3B) is selected and mounted on the mounting portion 4. Thereby, the adsorption member 3 suitable for various IC devices 90 can be mounted on the mounting portion 4, and therefore, the adsorption member 3 can stably adsorb the IC device 90. In this embodiment, according to the size of the IC device 90, which of the suction member 3A and the suction member 3B is selected. When the IC device 90 is "small", the suction member 3A is selected, and when the IC device 90 is "large", the suction member 3B is selected. Hereinafter, the state in which the suction member 3 is mounted on the mounting portion 4 is simply referred to as "mounted state".

In addition, in this embodiment, two adsorption members 3 are prepared, but the number is not specifically limited, For example, it may be three or more.

In addition, in the present embodiment, the plurality of adsorption members 3 are partially different in size, but it is not limited to this. For example, they may have different overall sizes, may have different partial shapes, may have different overall shapes, or may have different shapes ( Part or all is acceptable) and size (part or all is acceptable) is different.

In addition, the plurality of adsorption members 3 are different in size in this embodiment, but it is not limited to this. For example, in addition to the different sizes, the shapes (parts or all of them) may be different, or only the shapes (parts, All can be different).

As shown in FIG. 3, the suction member 3A and the suction member 3B have the same structure except for the size of the suction pad 31. Therefore, the suction member 3A is representatively described below.

As shown in FIG. 4, the adsorption member 3A has: an adsorption pad 31 that can adsorb the IC device 90; a support portion (suction pad support portion) 32 that supports the adsorption pad 31; and a tubular portion 33 that is inserted into the mounting portion in a mounted state 4; and the support portion (tubular portion support portion) 34, which supports the tubular portion 33.

The suction pad 31 is a cylindrical (circular tube) part having an opening 312 opened at the lower end surface 311. The lower end surface 311 of the adsorption pad 31 abuts against the upper surface of the IC device 90, and the IC device 90 can be attracted by the suction force generated by the opening 312. In addition, while maintaining this suction state, the device transfer head 13 can transfer the IC device 90 in the device supply area A2.

In addition, by operating the pump 131 connected through the mounting portion 4, an adsorption force can be generated in the opening portion 312.

In addition, the outer shape of the suction pad 31 is cylindrical in this embodiment, but it is not limited to this, and may be, for example, a rectangular cylindrical shape. As shown in FIG. 3, in this embodiment, the outer diameter of the suction pad 31 of the suction member 3A and the suction pad 31 of the suction member 3B are different, that is, the size of the lower end surface 311 is different.

In addition, a mask may be provided on the outer peripheral side of the suction pad 31. As a result, the contact area with the suction pad 31 can be increased, thereby stably suctioning the IC device 90. The outer shape of the mask is not particularly limited, and for example, it may be round or angular in plan view.

The supporting part 32 is a part that supports the upper end of the suction pad 31 and has a larger diameter than the outer diameter of the suction pad 31. Thereby, the suction pad 31 can be firmly supported. In addition, a flange portion 321 protruding in a plate shape is formed on the outer periphery of the support portion 32. When attaching the suction member 3A to the attaching portion 4, if the flange portion 321 is grasped and held by fingertips, the attaching operation can be easily performed.

On the opposite side of the suction pad 31, a tubular portion 33 having a circular tube shape is provided. The tubular portion 33 is a portion inserted into the installation portion 4 in the installed state. The outer peripheral portion 332 of the tubular portion 33 is provided with a first engaging portion 331 for engaging the second engaging portion 42 of the mounting portion 4 in the installed state. By this engagement, the attached state is maintained, thereby preventing the suction member 3A from being accidentally separated from the attaching portion 4.

In addition, in the present embodiment, the first engaging portion 331 is formed with an annular groove (recess) formed along the circumferential direction of the outer peripheral portion 332 of the tubular portion 33, but it is not limited to this, and for example, the second engaging portion The configuration (shape) of the portion 42 is, for example, a recess formed at a plurality of locations on the outer peripheral portion 332 of the tubular portion 33, a protrusion formed along the circumferential direction of the outer peripheral portion 332 of the tubular portion 33, and an outer circumference of the tubular portion 33 The portion 332 is configured by a plurality of convex portions formed by protruding multiple parts of the portion 332.

The supporting part 34 is a part that supports the lower end of the tubular part 33 and has a larger diameter than the outer diameter of the tubular part 33. Thereby, the tubular portion 33 can be firmly supported. In addition, the insertion limit of the tubular portion 33 into the mounting portion 4 may be restricted (see FIG. 4).

The suction member 3A constructed as above is connected from the upper tubular portion 33 to the lower suction pad 31 inside.

In addition, the adsorption member 3A may be one in which the adsorption pad 31, the support portion 32, the tubular portion 33, and the support portion 34 are integrally formed, or may be one that separately constitutes at least a part of these and joins the separate bodies.

The constituent material of the adsorption member 3A is not particularly limited. For example, various hard metal materials or various resin materials can be used. Moreover, the adsorption member 3A can also be made of an elastic material to form the adsorption pad 31.

The suction member 3A configured as described above is detachably attached to the mounting portion 4. As shown in FIG. 3, the mounting portion 4 is provided at the lower end of the base portion 132 of the device transfer head 13. Moreover, the arrangement number of the mounting part 4 is not specifically limited, For example, it may be one, and may be multiple. When a plurality of mounting parts 4 are arranged, the number of arrangements along the X direction and the number of arrangements along the Y direction are not particularly limited. For example, they may be the same or different.

As shown in Figures 4 to 8, the mounting portion 4 has an inner cylindrical portion 41; a second buckling portion 42 that is displaceably supported on the inner cylindrical portion 41; an operating portion 43 that can be displaced second The operation of the buckling portion 42; and the elastic pushing portion 44, which elastically pushes the operating portion 43. In addition, as shown in FIG. 3, the mounting portion 4 further has a restricting portion 45 that restricts the rotation of the suction member 3A (the same for the suction member 3B) in the mounted state around the Z axis.

The inner cylindrical portion 41 is a portion formed by projecting a circular tube downward from the base portion 132. In the inner space 411 of the inner cylindrical portion 41, the tubular portion 33 of the suction member 3A is inserted in an installed state. Thereby, the internal space 411 of the inner cylindrical portion 41 communicates with the internal space 35 of the adsorption member 3A. In addition, the pump 131 is operated in this communication state, so that the portion of the base 132 connecting the pump 131 to the internal space 35 of the adsorption member 3A can be decompressed. Thereby, the opening 312 of the suction pad 31 of the suction member 3A generates suction force, and the IC device 90 can be suctioned.

As shown in FIG. 4 (the same for FIGS. 5 to 8), the inner peripheral portion 412 of the inner cylindrical portion 41 is provided with a sealing member (pad) 46 having an annular shape along the circumferential direction. The sealing member 46 is made of an elastic material, and in the installed state, it is compressed between the inner peripheral portion 412 of the inner tubular portion 41 and the outer peripheral portion 332 of the tubular portion 33 of the adsorption member 3A, and is elastically deformed. Thereby, the inner peripheral portion 412 of the inner cylindrical portion 41 and the outer peripheral portion 332 of the tubular portion 33 of the suction member 3A are hermetically sealed. Therefore, when the pump 131 is activated, it is possible to prevent air from leaking between the inner peripheral portion 412 of the inner cylindrical portion 41 and the outer peripheral portion 332 of the tubular portion 33 of the adsorbing member 3A, thereby causing suction to occur in the opening 312 of the adsorbing pad 31 Power reduction. Thereby, the IC device 90 can be sucked stably and continuously.

In addition, the inner cylindrical portion 41 has a groove 413 formed radially from the inner space 411 at a portion lower than the sealing member 46. In each groove 413, the ball 421 constituting the second engaging portion 42 is housed one by one. The ball 421 can move between a first position and a second position described below along the direction formed by the groove 413 that accommodates the ball 421.

The first position is when the second engaging portion 42 (sphere 421) is engaged with the first engaging portion 331 of the suction member 3 (the suction member 3A or the suction member 3B), and becomes the position where the suction member 3 is installed (refer to Figure 4). The second position is the position where the installation is released (refer to Figure 6).

As described above, the suction member 3 has the tubular portion 33 inserted into the mounting portion 4 in the mounted state. In addition, the first engaging portion 331 (recessed portion) is configured by a groove (recessed portion) formed in the circumferential direction of the outer peripheral portion 332 of the tubular portion 33. In addition, the second engaging portion 42 is constituted by a convex portion that is engaged with the first engaging portion 331 (concave portion) at the first position. The convex portion is composed of a plurality of balls 421 arranged along the first engagement portion 331 (groove) at the first position (refer to FIG. 4). In this way, by forming the second engaging portion 42 with the ball 421 (convex portion), as will be described later, the attaching and detaching operation of the suction member 3 to the mounting portion 4 can be easily performed. As a result, the suction member 3 corresponding to the type of IC device 90 The replacement work, that is, the replacement work of the adsorption member 3A and the adsorption member 3B becomes easy.

In addition, the constituent material of the ball 421 is not particularly limited. For example, various metal materials such as stainless steel can be used.

In addition, the second engaging portion 42 is configured to be movable in a direction orthogonal to the central axis of the inner cylindrical portion 41 in this embodiment, but it is not limited to this. For example, it may be configured to be formed on the inner cylindrical portion 41. It is movable in the direction of the central axis, and may be configured to be rotatable around the central axis of the inner cylindrical portion 41.

The mounting portion 4 has an operating portion 43 that performs a single operation for moving (displacement) of each ball 421 (the second engaging portion 42) from the first position to the second position. The operating portion 43 is located on the outer peripheral side of the inner cylindrical portion 41 and is constituted by a cylindrical body arranged concentrically with the inner cylindrical portion 41. The operating portion 43 can be moved to an upper position (refer to FIGS. 5 to 7) and a lower position (refer to FIGS. 4 and 8) in the direction of the central axis of the inner cylindrical portion 41, that is, along the z direction. In addition, the operating portion 43 at the upper position restricts the upper movement limit, and at the lower position, also restricts the lower movement limit.

In addition, the operation portion 43 has a pressing portion 431 that can press the balls 421 together when it is located in the lower position. The pressing portion 431 is constituted by a ring-shaped protrusion formed along the circumferential direction of the inner peripheral portion of the operating portion 43. Thereby, each ball 421 is restricted from moving from the first position to the second position, thereby preventing the suction member 3 in the mounted state from detaching from the mounting portion 4.

In addition, when the operation portion 43 is located at the upper position, the pressing portion 431 is retracted from each ball 421. Thereby, the pressing force of the pressing portion 431 on each ball 421 is released, whereby each ball 421 can be moved from the first position to the second position. And, in this state, for example, the suction member 3 attached to the attachment portion 4 can be detached (see FIGS. 5 to 7). Conversely, the suction member 3 can be attached to the attachment portion 4 where the suction member 3 has not been attached.

The mounting portion 4 has an elastic pushing portion 44 that pushes the operating portion 43 downward to restrict the displacement of the second engaging portion 42. In the present embodiment, the elastic pushing portion 44 is connected between the inner cylindrical portion 41 and the operating portion 43, and is composed of a coil spring 441 arranged concentrically with this. The upper end 442 of the coil spring 441 abuts against the protrusion 414 protrudingly formed on the outer periphery of the inner cylindrical portion 41 from below, and the lower end 443 abuts against the pressing portion 431 of the inner cylindrical portion 41 from above. In addition, the coil spring 441 is in a compressed state between the protruding portion 414 and the pressing portion 413. Thereby, a downward elastic thrust is applied to the operation part 43. With this elastic thrust, the state of the operating portion 43 at the lower position is maintained. Thereby, each ball 421 is restricted from moving from the first position to the second position, thereby preventing the suction member 3 in the mounted state from being inadvertently separated from the mounting portion 4.

As shown in Figure 3, the mounting portion 4 has a restricting portion 45, which, together with the suction member 3, restricts the rotation of the IC device 90 (electronic component) adsorbed to the suction member 3 around the Z axis (vertical axis) (about "IC device 90 suction In the state of the suction member 3", refer to FIG. 4). The restricting portion 45 is provided on the positive side in the Y direction with respect to the mounting portion 4, and is constituted by a rod-shaped portion 451 formed by protruding from the base portion 132 of the device transfer head 13 to the negative side (downward) in the Z direction. In the configuration shown in FIG. 3, the rod-shaped portion 451 has a fixed outer diameter (thickness) along the Z direction (longitudinal direction), but it is not limited to this, and may have a portion that changes along the Z direction.

On the other hand, in the flange portion 321 of the suction member 3, a notch portion 322 is formed in the portion on the positive side in the Y direction. In the installed state, the rod-shaped portion 451 can be inserted through and snapped onto the notch portion 322. Thereby, the IC device 90 is restricted from rotating with the suction member 3 around the central axis of the mounting portion 4 (the suction member 3), that is, around the Z axis, in a state where the IC device 90 is adsorbed to the suction member 3. With such a rotation restriction, for example, when the IC device 90 is a quadrangular shape when viewed from above, the adjacent IC devices 90 can be prevented from interfering with each other. In addition, since the posture of the IC device 90 is maintained, the IC device 90 is smoothly placed at its transfer destination (for example, the storage of the device supply portion 14 and the recessed portion where the IC device 90 is placed).

Next, the operation of replacing the suction member 3A with the suction member 3B for the mounting portion 4 will be described with reference to FIGS. 4 to 8.

As shown in FIG. 4, the adsorption member 3A is in the mounted state to be mounted on the mounting portion 4. In this mounting state, as described above, the internal space 35 of the adsorption member 3A and the internal space 411 of the mounting portion 4 communicate. In this way, the IC device 90 can be sucked by the pump 131.

In addition, the operating portion 43 of the mounting portion 4 is located at the lower position and is urged by the coil spring 411 (the urging portion 44). The pressing portion 431 of the operating portion 43 presses each ball 421 (the second engaging portion 42) at the first position together. Thereby, the movement of each ball 421 to the second position is restricted, thereby maintaining the mounted state.

Then, as shown in FIG. 5, opposing the elastic thrust of the coil spring 411 (the elastic pushing portion 44), the operating portion 43 is moved to the upper position. Thereby, each ball 421 releases the pressing force of the pressing portion 431, thereby becoming a state where it can move to the second position.

Then, as shown in FIG. 6, the suction member 3A is pulled downward. Thereby, each ball 421 moves over the inclined surface 331a on the upper side of the first engaging portion 331 of the suction member 3A and moves to the second position. In addition, when the suction member 3A is further extended downward, each ball 421 slides on the outer peripheral portion 332 of the tubular portion 33 of the suction member 3A. Therefore, as shown in FIG. 7, the suction member 3A is detached from the mounting portion 4.

Then, when the force for moving the operating portion 43 to the upper position is released, as shown in FIG. 8, the operating portion 43 quickly returns to the lower position by its own weight and the elastic force of the coil spring 44. In addition, at this time, the pressing portion 431 of the operating portion 43 can press the balls 421 at the second position together and return to the first position.

In this way, the suction member 3A can be easily and quickly detached from the mounting portion 4 by the simple operation of pulling the suction member 3A downward while keeping the operation portion 43 raised to the upper position.

In addition, when attaching the suction member 3B to the attaching portion 4, the attaching can be performed by performing the above-mentioned reverse operation. That is, the suction member 3B can be easily and quickly mounted to the mounting portion 4 by a simple operation of inserting the suction member 3B into the mounting portion 4 while keeping the operating portion 43 raised to the upper position. In addition, if grooves are provided on the inner cylindrical portion 41 on the sealing member 46 side of each ball 421 to allow each ball 421 to move, it is not necessary to lift the operating portion 43 upward, and the outer peripheral portion 332 of the tubular portion 33 is pushed into each球体421. Thereby, the suction member 3B can be easily and quickly mounted on the mounting portion 4 by a simple operation of pushing the suction member 3B into the mounting portion 4 without lifting the operating portion 43 upward.

As mentioned above, the electronic component inspection device 1 (electronic component conveying device 10) can correspond to the type of IC device 90, and it is easy to replace the suction member 3A with the suction member 3B (or replace the suction member 3B with the suction member 3A). operation. Thereby, when moving to the inspection of IC devices 90 of different types, the moving can be performed quickly and smoothly.

<Second Embodiment> Hereinafter, referring to Figs. 9 and 10, the second embodiment of the electronic component transport device and the electronic component inspection device of the present invention will be described, but the description will be focused on the differences from the above-mentioned embodiment. The description of the same matters is omitted.

This embodiment is the same as the above-mentioned first embodiment except that the mounting portion omits the restricting portion that restricts the rotation of the IC device adsorbed to the suction member.

As shown in FIG. 9, the IC device 90 is adsorbed by the adsorption member 3. In the state shown in FIG. 9, the central axis O3 of the suction member 3 and the central axis O141 of the concave portion 141 of the device supply portion 14 are not on the same straight line, and positional deviation occurs.

In addition, in the present embodiment, the part of the restricting portion 45 is omitted from the mounting portion 4, and a "clearance" that allows the suction member 3 in the mounted state to move slightly in any of the X direction, Y direction, and Z direction is generated. As a result, as shown in FIG. 10, when the IC device 90 is placed in the recess 141 of the device supply portion 14, the IC device 90 can be along the tapered side wall 142 of the recess 141, offsetting the central axis O3 by the above-mentioned clearance. Offset from the position of the central axis O141. Thereby, the IC device 90 can be smoothly placed in the recess 141 of the device supply part 14.

<Third Embodiment> Hereinafter, referring to FIG. 11, a third embodiment of the electronic component conveying device and electronic component inspection device of the present invention will be described, but the description will focus on the differences from the above-mentioned embodiment, and the same items will be omitted Its description. This embodiment is the same as the above-mentioned first embodiment except for the difference in the structure of the suction member.

As shown in FIG. 11, in this embodiment, the adsorption|suction member 3 is comprised so that it may be equipped with two members for assembly. That is, the adsorption member 3 includes: a first member 30A having a tubular portion 33 inserted into the mounting portion 4 in an installed state, and a supporting portion 34 supporting the tubular portion 33; and a second member 30B connected to the first member 30A, it has an adsorption pad 31 that can adsorb IC devices 90 (electronic components), and a support portion 32 that supports the adsorption pad 31.

In addition, the second member 30B prepares a plurality of different ones in at least one of the shape and size (the size of the suction pad 31 in this embodiment) corresponding to the type of the IC device 90 (electronic component). In FIG. 11, as an example, the second member 30B1 and the second member 30B2 of which the size of the suction pad 31 is larger than the second member 30B1 are shown. Then, one of the plural second members 30B (the second member 30B1 and the second member 30B2) is selected and connected to the first member 30A. The suction member 3 assembled by connecting the second member 30B1 to the first member 30A becomes the suction member 3A. In addition, the suction member 3 assembled by connecting the second member 30B2 to the first member 30A becomes the suction member 3B. In this way, if the first member 30A is a common member and the second members 30B of multiple sizes are prepared, the suction member 3 (the suction member 3A or the suction member 3B) suitable for various IC devices 90 can be mounted on the mounting portion 4 .

In addition, in this embodiment, two second members 30B are prepared, but the number is not particularly limited, and for example, three or more may be used.

In addition, the plurality of second members 30B in this embodiment are parts of different sizes, but it is not limited to this. For example, they may be of different sizes, parts of shapes may be different, all shapes may be different, or shapes may be different. (Part or all is acceptable) and size (part or all) are different.

In addition, the plurality of second members 30B are different in size in this embodiment, but it is not limited to this. For example, in addition to the different sizes, they may also have different shapes (partially or entirely), or only the shape ( Some or all of them can be different.

As shown in FIG. 11, in this embodiment, the male screw 36 is protrudingly formed in the lower part of the support part 34 in 30 A of 1st members. On the other hand, in the second member 30B, the support portion 32 is formed with an internal thread 37 that is screwed to the external thread 36 when connecting with the first member 30A.

In addition, at the boundary portion between the external thread 36 and the support portion 34, a sealing member (pad) 38 having an annular shape along the circumferential direction of the external thread 36 is provided. The sealing member 38 is an elastic material member, and in a state where the first member 30A and the second member 30B are assembled, the sealing member 38 is compressed between the support portion 34 and the support portion 32 to be elastically deformed. Thereby, the space between the support portion 34 and the support portion 32 is hermetically sealed. Therefore, it is possible to prevent the air from leaking between the supporting portion 34 and the supporting portion 32 when the pump 131 is activated, so that the suction force generated in the opening 312 of the suction pad 31 is reduced. Thereby, the IC device 90 can be sucked stably and continuously.

In addition, the connection operation of the second member 30B to the first member 30A and the connection release operation of the first member 30A and the second member 30B are preferably performed in a state where the suction member 3 is detached from the mounting portion 4. Thereby, when connecting and disconnecting, for example, the operation can be performed more easily than when it is set in the installed state.

<Fourth Embodiment> Hereinafter, referring to FIG. 12, the fourth embodiment of the electronic component conveying device and the electronic component inspection device of the present invention will be described in detail, but the description will focus on the differences from the above-mentioned embodiment. The same matters The description is omitted.

This embodiment is the same as the above-mentioned third embodiment except that the configuration of the first member and the second member included in the suction member are different.

As shown in FIG. 12, in this embodiment, the internal thread 37 is formed in the support part 34 in 30 A of 1st members. On the other hand, in the second member 30B, on the upper portion of the support portion 32, an external thread 36 is formed to be screwed with the internal thread 37 when connecting with the first member 30A. In addition, the second member 30B has the flange portion 321 omitted.

With such a configuration, for example, as the second member 30B, the conventional screw-in suction member can be connected to the first member 30A and used.

<Fifth Embodiment> Hereinafter, referring to FIG. 13, the fifth embodiment of the electronic component conveying device and the electronic component inspection device of the present invention will be described in detail, but the description will focus on the differences from the above-mentioned embodiment, and the same matters The description is omitted.

This embodiment is the same as the above-mentioned first embodiment except that the shape of the suction pad of the suction member is different.

As shown in FIG. 13, in the present embodiment, the suction pad 31 of the suction member 3 has an enlarged diameter portion 313 whose inner diameter is enlarged. Accordingly, for example, when the IC device 90 has the stepped portion 901 on the upper side, the stepped portion 901 is accommodated in the enlarged diameter portion 313 when the IC device 90 is adsorbed to the suction member 3. Thereby, the IC device 90 is stably attracted to the adsorption member 3, thereby preventing it from being separated from the adsorption member 3 during transportation.

Above, the electronic component conveying device and the electronic component inspection device of the present invention have been described based on the illustrated embodiment, but the present invention is not limited to this, and the parts constituting the electronic component conveying device and the electronic component inspection device can be replaced to perform the same function Of arbitrary constituents. Moreover, other arbitrary structures may be added.

In addition, the electronic component transport device and the electronic component inspection device of the present invention may also be a combination of any two or more configurations (features) of the above-mentioned embodiments.

1‧‧‧Electronic component inspection device 3‧‧‧Adsorption member 3A‧‧‧Adsorption member 3B‧‧‧Adsorption member 4‧‧‧Mounting part 10‧‧‧Electronic component conveying device 11A‧‧‧Tray conveying mechanism 11B‧‧ ‧Tray transport mechanism 12‧‧‧Temperature adjustment unit 13‧‧‧Device transport head 14‧‧‧Device supply unit 14A‧‧‧Device supply unit 14B‧‧‧Device supply unit 15‧‧‧Tray transport mechanism 16‧‧‧ Inspection Department 17‧‧‧Device Transfer Head 17A‧‧‧Device Transfer Head 17B‧‧‧Device Transfer Head 18‧‧‧Device Recycling Section 18A‧‧‧Device Recycling Section 18B‧‧‧Device Recycling Section 19‧‧‧For Recycling Tray 20‧‧‧Device transport head 21‧‧‧Tray transport mechanism 22A‧‧‧Tray transport mechanism 22B‧‧‧Tray transport mechanism 25‧‧‧Transport section 30A‧‧‧First member 30B‧‧‧Second member 30B1 ‧‧‧Second member 30B2‧‧‧Second member 31‧‧‧Adsorption pad 32‧‧‧Support part (suction pad support part) 33‧‧‧Tubular part 34‧‧‧Support part (tubular support part) 35‧ ‧‧Internal space 36‧‧‧External thread 37‧‧‧Internal thread 38‧‧‧Sealing member (liner) 41‧‧‧Inner cylindrical part 42‧‧‧Second engagement part 43‧‧‧Operation part 44 ‧‧‧Pushing part 45‧‧‧Restricting part 46‧‧‧Sealing member (liner) 90‧‧‧IC device 131‧‧‧Pump 132‧‧‧Base 141‧‧‧Concave part 142‧‧‧Side wall 200‧ ‧‧Tray 231‧‧‧The first partition 232‧‧‧The second partition 233‧‧‧The third partition 234‧‧‧The fourth partition 235‧‧‧The fifth partition 241‧‧‧Front cover 242 ‧‧‧Side cover 243‧‧‧Side cover 244‧‧‧Back cover 245‧‧‧Top cover 300‧‧‧Monitor 301‧‧ Display screen 311‧‧‧Lower end surface 312‧‧‧Opening 313‧‧ ‧Expanded part 321‧‧‧Flange part 322‧‧‧Notch part 331‧‧‧First engagement part 331a‧‧‧Slanted surface 332‧‧‧Outer peripheral part 400‧‧‧Signal light 411‧‧‧Internal space 412 ‧‧‧Inner peripheral part 413‧‧‧Slot 414‧‧‧Protrusion part 421‧‧Sphere 431‧‧‧Pressing part 441‧‧Coil spring 442‧‧‧Upper end 443‧‧‧Lower end 451‧‧Bar shape Unit 500‧‧‧Speaker 600‧‧‧Mouse station 700‧‧‧Operation panel 800‧‧‧Control unit 901‧‧‧Step unit A1‧‧‧Tray supply area A2‧‧‧Device supply area A3‧‧‧ Inspection area A4‧‧‧Device recovery area A5‧‧‧Tray removal area O3‧‧‧Center axis O141 ‧‧Arrow α15‧‧‧Arrow α17Y‧‧‧Arrow α18‧‧‧Arrow α20X‧‧‧Arrow α20Y‧‧‧Arrow α21‧ ‧‧Arrow α22A‧‧‧Arrow α22B‧‧‧Arrow α90‧‧‧Arrow

Fig. 1 is a schematic perspective view of the first embodiment of the electronic component inspection apparatus of the present invention viewed from the front side. FIG. 2 is a schematic plan view showing the operating state of the electronic component inspection device shown in FIG. 1. FIG. FIG. 3 is an exploded perspective view showing the device transfer head in the device supply area of the electronic component inspection apparatus shown in FIG. 1. FIG. 4 is a vertical cross-sectional view showing the process of detaching the suction member from the mounting portion of the device transfer head in the device supply area of the electronic component inspection device shown in FIG. 1 in sequence. 5 is a vertical cross-sectional view sequentially showing the process of detaching the suction member from the mounting portion of the device transfer head in the device supply area of the electronic component inspection device shown in FIG. 1. 6 is a vertical cross-sectional view showing the process of detaching the suction member from the mounting portion of the device transfer head in the device supply area of the electronic component inspection device shown in FIG. 1 in sequence. 7 is a vertical cross-sectional view showing the process of detaching the suction member from the mounting portion of the device transfer head in the device supply area of the electronic component inspection device shown in FIG. 1 in sequence. FIG. 8 is a vertical cross-sectional view showing the process of detaching the suction member from the mounting part of the device transfer head in the device supply area of the electronic component inspection device shown in FIG. 1 in sequence. Fig. 9 is a front view sequentially showing the operating state of the component transfer head in the component supply area of the electronic component inspection apparatus (second embodiment) of the present invention. FIG. 10 is a front view sequentially showing the operating state of the component transfer head in the component supply area of the electronic component inspection apparatus (second embodiment) of the present invention. 11 is an exploded vertical cross-sectional view showing the suction member of the component transfer head in the component supply area of the electronic component inspection apparatus (third embodiment) of the present invention. 12 is an exploded vertical cross-sectional view showing the suction member of the device transfer head in the device supply area of the electronic component inspection apparatus (the fourth embodiment) of the present invention. 13 is a vertical cross-sectional view showing the suction member of the component transfer head in the component supply area of the electronic component inspection apparatus (the fifth embodiment) of the present invention.

1‧‧‧Electronic parts inspection device

3‧‧‧Adsorption component

3A‧‧‧Adsorption component

3B‧‧‧Adsorption component

4‧‧‧Installation Department

10‧‧‧Electronic parts handling device

13‧‧‧Device transfer head

31‧‧‧Adsorption pad

32‧‧‧Support part (adsorption pad support part)

33‧‧‧Tube

34‧‧‧Support Department (Tube Support Department)

41‧‧‧Inner cylindrical part

43‧‧‧Operation Department

45‧‧‧Restriction Department

131‧‧‧Pump

132‧‧‧Base

311‧‧‧lower end surface

312‧‧‧Opening

321‧‧‧Flange

322‧‧‧Notch

331‧‧‧The first fastening part

451‧‧‧Bar

A2‧‧‧Device supply area

Claims (13)

An electronic component conveying device, comprising: a conveying part that conveys electronic parts; wherein the conveying part has: an adsorption member that adsorbs the electronic part; and a mounting part that mounts the adsorption member; and the adsorption member is provided with a first Fastening part; a second fastening part is provided on the above-mentioned installation part, and the second fastening part is inside the above-mentioned installation part, shifted to the first position of the first fastening part, and not fastened At the second position of the above-mentioned first engaging part. The electronic component conveying device according to claim 1, wherein the suction member has a tubular portion which is inserted into the mounting portion; the first engaging portion is constituted by a concave portion provided on the outer periphery of the tubular portion; the second engaging The part is constituted by a convex part that is engaged with the concave part when it is displaced to the first position. The electronic component conveying device of claim 2, wherein the concave portion is formed by a groove provided along the circumferential direction of the outer periphery of the tubular portion; when the convex portion is displaced to the first position, along the groove A plurality of spheres are arranged and buckled with the above grooves. Such as the electronic component conveying device of claim 1, wherein the mounting part has an operating part, which can Perform an operation to restrict the second engaging portion to the first position. An electronic component conveying device according to claim 4, wherein the mounting part has an elastic pushing part that pushes the operating part to restrict the second engaging part to the first position. For example, the electronic component conveying device of claim 1, which has a plurality of the above-mentioned suction members corresponding to the type of the above-mentioned electronic component but different in at least one of shape and size; select one of the above-mentioned plural suction members and install it in The above installation part. The electronic component conveying device of claim 1, wherein the suction member includes: a first member having a tubular portion inserted into the mounting portion; and a second member having a suction pad for adsorbing the electronic component and connected to the The first member. For example, the electronic component conveying device of claim 7, which has a plurality of the second members that are different in at least one of shape and size corresponding to the type of the electronic component; select one of the plurality of second members, and Connected to the above-mentioned first member. The electronic component conveying device of claim 7, wherein the connection operation of the second member to the first member, and the connection release operation of the first member and the second member are performed by removing the suction member from the mounting portion Under the state. Such as the electronic component conveying device of claim 7, wherein the first member is provided with an internal thread, and the second member is provided with a threaded connection with the internal thread and connected to the first member External thread. The electronic component conveying device according to claim 1, wherein the mounting portion has a restricting portion that restricts the rotation of the electronic component adsorbed to the suction member about a vertical axis. An electronic component inspection device, comprising: a conveying part that conveys electronic parts; and an inspection part that inspects the electronic parts; wherein the conveying part has: an adsorption member that adsorbs the electronic part; and a mounting part that mounts the adsorption The first buckling part is provided on the adsorption member; the second buckling part is provided on the mounting part, and the second buckling part is attached to the inside of the mounting part and shifted to be fastened to the first buckling The first position of the part and the second position of the above-mentioned first buckling part. A suction member which is installed in the mounting part provided in the conveying part for conveying electronic parts and sucks the above-mentioned electronic parts; wherein the suction member is provided with a first engaging part; and the mounting part is provided with a second engaging part Part, the second buckling part is inside the installation part, shifted to the first position that is buckled in the first buckling part, and the second position that is not buckled in the first buckling part; The member has a tubular part inserted into the mounting part; the first buckling part is constituted by a groove provided along the circumferential direction of the outer periphery of the tubular part; The second engaging portion is constituted by a plurality of balls arranged along the groove when displaced to the first position and engaging with the groove.

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