TWI483326B - Chip handler and operation method - Google Patents

Description

Wafer sorting machine and operating method

This art is directed to a wafer sorter that is suitable for testing equipment for testing wafers that take a long time.

The wafer sorter is used to test wafers and can pick out normal and faulty products. The test cycle of the wafer sorter comprises: (1) removing the tested wafer from the test unit and placing it in the receiving tray; (2) drawing the wafer in the stock tray and placing it in the test unit; (3) ) Perform the test. Therefore, each test cycle includes: wafer download, upload, and test.

Depending on the type of wafer, the test time required is roughly different and can be roughly divided into three categories:

(1) Test of logic circuit chip: wafer transfer upload transfer time is about 0.5~1 second, and wafer test time is about 0.5~3 seconds.

(2) Test of hybrid circuit chip: The wafer download upload transfer time is about 1~3 seconds, and the wafer test time is about 3~20 seconds.

(3) Memory chip test: The wafer download upload transfer time is about 3 to 6 seconds, and the wafer test time is about 20 to 70 seconds.

The test time is determined to be constant as long as the test program is unchanged; however, the transfer time of the wafer download upload varies greatly, and can be designed differently depending on factors such as the pickup head and the transfer distance. The transfer time of the wafer download upload is an example that is not an absolute classification.

The highest test throughput of a test device is limited to the slowest step; that is, the time taken for the slowest step determines the maximum amount of the entire test output. Even if the total transfer time of the download and upload of the wafer is extremely short, for example, 0.5 second, if the test time of the wafer is 10 seconds, the maximum test output per hour (UPH) of the wafer is calculated to be 360 (3600 sec/10 sec). =360UPH).

1A~1B, 2A~2B are the configuration and action diagram of a conventional wafer sorting machine

1A shows a conventional wafer sorting machine having a test unit 10 and a reciprocating fast moving buffer 11 disposed on the surface of the machine. The buffer table 11 is provided with a download buffer DBUB and an upload buffer. The download buffer DB is provided with the test completed wafer, and is downloaded from the test unit 10 for temporary placement, and then transferred to the receiving tray 15 for storage. The upload buffer UB is provided for temporary placement of the wafer to be tested transferred from the preparation tray 14, and is ready to be uploaded to the test unit 10.

When the machine is in operation, the buffer table 11 is quickly reciprocated to the left and right, and the frequency of the rapid reciprocating movement of the pressurized suction head 12 is matched, so that the pressurized suction head 12 can suck the tested wafer from the test unit 10 and place it in the download buffer. The area DB; then the wafer located in the upload buffer UB is sucked and placed in the test unit 10, and the pressurized suction head 12 also functions as a pressurization, and the pressed wafer electrically couples the wafer to the test unit 10 under the test circuit (Fig. Not shown), test.

Figure 1A shows the pressurized suction head 12 positioned above the test unit 10 in preparation for placing the test wafer CH in the download buffer DB.

Figure 1B shows the pressurized suction head 12 moving over the download buffer DB to download the wafer CH to the download buffer DB. At this time, an additional suction head (not shown) sucks the wafer in the stock tray 14 and is placed in the upload buffer UB.

2A shows that the buffer table 11 is moved to the right such that the upload buffer UB is located under the pressurized suction head 12. square.

2B shows the pressurized suction head 12 sucking the wafer below the upload buffer UB, and moving forward, transferring the wafer to be tested to the test unit 10, pressurizing the suction head 12 and pressurizing the wafer, and then performing the test. At the same time, the test completed wafer located in the download buffer DB is sucked by another suction head (not shown) and transferred to the receiving tray 15 for sorting. It can be seen from the moving point of view that the pressurized suction head 12 has a fast reciprocating motion before and after; the reciprocating fast moving buffer table 11 is a fast left and right reciprocating motion.

3 to 4 are timing diagrams of the test unit of the prior art FIG. 1A.

Figure 3 shows the test unit 10 waiting for the last test completed wafer download, then waiting for the upload of the wafer to be tested, and the wafer for testing. As shown in FIG. 3, when the test cycle of the wafer (download + upload + test) takes 3 seconds, wherein the test time is assumed to be 1.5 seconds, the maximum test output of the conventional sorter of FIG. 1A is 2400 UPH (3600 sec / 1.5sec=2400UPH). However, as shown in FIG. 4, when the test time of the wafer is long and the entire test cycle takes 15 seconds, the maximum test output of the conventional sorter of FIG. 1A is 240 UPH ( 3600sec/15sec=240UPH), the test output is much reduced.

Figure 4 shows that if the test cycle of a wafer takes 15 seconds, using the results of the conventional classifier of Figure 1A, only one wafer can be tested at 15 seconds.

It can be seen that the prior art is more suitable for use in a wafer with a short test time. The prior art first conceives that for a wafer with a long test time, the structure of the sorter can be redesigned, and the test time can be fully utilized (test Time) increases the yield by the special time.

This technique can reduce the idle time of the suction head and increase the yield by adding a "test unit" and fitting the appropriate "suction head". The suction head of the art is dedicated to sucking and placing the wafer, and is taken away after the wafer is taken and placed. During the testing of the wafer, each test unit has a dedicated electroless pressing unit to pressurize the wafer to avoid Conventional techniques During the test, the pressurized suction head must pressurize the wafer, causing the suction head to be occupied, failing to provide the suction function. The suction head and the pressurizing unit of the present technology are separate components, so that when the pressing member presses the wafer, the suction head can still operate independently without being affected. The technology is appropriately designed according to the length of the wafer test cycle time, and a plurality of test units are arranged, and the appropriate suction head is used to continuously operate the suction head to reduce the idle time, thereby achieving the effect of continuous test output.

FIG. 5 is a timing chart of the operation of the test unit of the first embodiment of the present technology.

Figure 5 assumes that one test cycle of the wafer takes 15 seconds, and only one wafer can be tested for use in accordance with Figure 4 using conventional techniques. If the classifier is configured with three sets of test units, the test cycle of test unit 1 is started at 0th second, the test cycle of test unit 2 is started at 5th second, and the test cycle of test unit 3 is started at 10th second, at 15 seconds. It is possible to test the production of three wafers. The yield is three times that of the Figure 4 product using the prior art of Figure 1.

The number of test units of the present technology can be appropriately adjusted according to different cycle times of different test cycles, and the suction head can be made to have no idle time. This fully utilizes the configuration of the test unit of the suction head to achieve continuous test. The hardware configuration of the output purpose is called the "full match" state.

6A to 6B, 7A to 7B, 8A to 8B, and 9A to 9B are configuration and operation diagrams of the wafer sorting machine of the first embodiment of the present technology.

6A shows that the sorter of the present technology is configured with three sets of test units 101, 102, 103, which are shown in the figure. The hatch 21 of one test unit 101 is opened, the hatch 21 of the second test unit 102 is closed, the inner wafer is tested; the hatch 21 of the third test unit 103 is closed, and the internal wafer is being tested. The wafer test of the first test unit is completed, so the hatch 21 is opened and the wafer is waiting for download.

An integrated pick-up head 22 has an upload pick-up head 22L and a download pick-up head 22R; the pick-up pick-up head 22L is ready to pick up the wafer in the stock tray 14.

FIG. 6B shows that the uploading pick-up head 22L picks up the wafer in the stocking tray 14 and prepares to be uploaded to the first test unit 101. Figure 7A shows the integrated pick-up head 22 displaced onto the first test unit 101, and the download pick-up head 22R is ready to pick up the finished test wafer.

FIG. 7B shows the wafer in which the download pick-up head 22R picks up the test on the test unit 101.

Figure 8A shows the integrated pick-up head 22 moved a distance to the right such that the upload pick-up head 22L is positioned above the wafer positioning recess (Fig. 10) of the test unit 101 and then the wafer to be tested CH is placed in the positioning recess.

Figure 8B shows the integrated pick-up head 22 moving over the take-up tray, ready to collect the tested wafers picked up by the download pick-up head 22R in the take-up tray 15.

FIG. 9A shows that the download pick-up head 22R collects the sampled test wafers that have been taken up in the take-up tray 15. Figure 9B shows the integrated pick-up head 22 moving over the stock tray 14 ready for the next cycle.

10A-10C are configuration and action diagrams of the cross section of the test unit AA' of FIG. 6A of the prior art.

FIG. 10A shows that the hatch 21 of the first test unit 101 is in an open state, and the wafer that has been tested is ready to be sucked and transferred into the receiving tray 15.

FIG. 10B shows that the tested wafer of the first test unit 101 is removed by the suction head.

10C, showing that a new wafer to be tested has been placed in the test unit 101, the hatch 21 of the test unit 101 is closed, and the wafer is electrically coupled to the test circuit on the lower circuit board 30 (not shown). . A test circuit (not shown) is disposed on the circuit board 30 below the test units 101, 102, 103. The elastic probe 31 is disposed above the circuit board 30, and the lower end of the elastic probe 31 is electrically coupled to the circuit on the circuit board 30; After being placed into the positioning recess 33, the upper end of the resilient probe 31 is electrically coupled to the circuit output/input terminal on the wafer.

FIG. 10C shows that after the hatch of the first test unit 101 is closed, the hatch of the second test unit is opened, waiting for the next test cycle of downloading, uploading, testing, and the like.

11A-11B are the configuration and action diagram of the cross section of the test unit BB' of FIG. 6A of the prior art.

Fig. 11A shows that the hatch 21 is fixed to the side wall base 32 of the positioning recess 33 by the rotating shaft 35, and the hatch 21 can be opened and closed like a scallop. Fig. 11A shows that the hatch 21 is in an open state, and after waiting for the wafer to be tested to be downloaded, the new wafer to be tested is uploaded and positioned.

Figure 11B shows the hatch 21 in a closed-to-back, electrical test. When the hatch 21 is depressed, the wafer is depressed such that the output input of the wafer is electrically coupled to the elastomeric probe 31.

12 to 15 are a configuration and an action diagram of a wafer sorting machine according to a second embodiment of the present technology.

Figure 12 is equipped with six sets of test units 51, 52, 53, 54, 55, 56 arranged in a row, placed in the center of the sorter. On the right side, a stocking tray 54 and an uploading suction head 52R are disposed. A receiving tray 55 is disposed on the left side, and a suction head 52L is downloaded. The downloading head 52L on the left side is responsible for downloading and downloading the chips of the processing test units 51-56 in sequence and storing them in the receiving tray 55; the right side picking head 52R is responsible for sequentially processing the uploading of the chips of the testing units 51-56. The uploaded wafer is taken from the wafer in the stock tray 54.

Figure 13 shows that the test completed wafer of test unit 51 has been drawn to the left receiving tray via download suction head 52L. The uploading head 52R on the right has taken the wafer to be tested from the stock tray and is ready to be placed in the test unit 51.

Figure 14 shows that the uploading pick-up head 52R has placed the wafer to be tested into the test unit 51; then the hatch cover 501 is ready to be closed.

Figure 15 shows that the hatch cover 501 has been closed, the hatch cover 502 of the test unit 52 is open, and the left download pick-up head 52L is ready to pick up the tested wafer; at the same time, the right pick-up pick-up head 52R is ready to pick up the wafer in the tray 54 and later placed The test is performed in the test unit 52; it is performed in sequence.

In terms of the operation of the suction head, the suction head 52L is downloaded, linearly, and the wafers that have been tested for suction are placed in the receiving tray 55; the suction head 52R is loaded, and the wafer to be tested is sucked from the preparation tray 54 and placed in sequence. Test units 51-56.

The foregoing description of the preferred embodiments and the embodiments of the embodiments of the invention It is the scope of the applicant's rights to do so without departing from the spirit of the art.

10,101~103,51~56‧‧‧test unit

11‧‧‧Reciprocating fast moving buffer

12‧‧‧Pressure suction head

14,54,54R,54L‧‧‧Material tray

15,55,55R,55L‧‧‧ receiving tray

21,501,502‧‧‧ hatch cover

22‧‧‧Integrated suction head

22L‧‧‧ suction head

22R‧‧‧ suction head

30‧‧‧ boards

31‧‧‧Elastic probe

32‧‧‧Side wall base

33‧‧‧ positioning groove

35‧‧‧ shaft

52R‧‧‧ Uploading the suction head

52L‧‧‧Download suction head

CH‧‧‧ wafer

DB‧‧‧ download buffer

UB‧‧‧ upload buffer

1A~1B, 2A~2B are the configuration and action diagram of a conventional wafer sorting machine

3 to 4 are timing diagrams of the test unit of the prior art FIG. 1A.

FIG. 5 is a timing chart of the operation of the test unit of the first embodiment of the present technology.

6A to 6B, 7A to 7B, 8A to 8B, and 9A to 9B are configuration and operation diagrams of the wafer sorting machine of the first embodiment of the present technology.

10A-10C are configuration and action diagrams of the cross section of the test unit AA' of FIG. 6A of the prior art.

11A-11B are the configuration and action diagram of the cross section of the test unit BB' of FIG. 6A of the prior art.

12 to 15 are a configuration and an action diagram of a wafer sorting machine according to a second embodiment of the present technology.

101,102,103‧‧‧test unit

14‧‧‧Material tray

15‧‧‧ receiving tray

21‧‧‧ hatch cover

22‧‧‧Integrated suction head

22L‧‧‧ suction head

22R‧‧‧ suction head

CH‧‧‧ wafer

Claims (11)

A wafer sorting machine comprising: three or more sets of test units arranged in a linear arrangement; each of the test units of the set further comprises: a test circuit; and an independent positioning groove for positioning the wafer during testing; And a separate electroless pressurization unit, after the wafer to be tested is placed in position, the pressurizing unit applies pressure to the wafer to electrically couple the wafer to the test circuit; the first test unit a first test start time according to a preset test cycle operation; the second test unit operates according to a preset test cycle, having a second test start time; and the second test start The time is later than the first test start time; and the third test unit operates according to a preset test cycle, having a third test start time; and the third test start time is later than The second test start time; the test unit and the test cycle are arranged to be in a fully-fitted state to maximize the test output. The wafer sorting machine according to claim 1, wherein the pressurizing unit is a hatch cover having a side wall base having a rotating shaft on the positioning groove, and the positioning unit can be positioned. The slot performs a scalloped opening and closing action to apply pressure to the wafer when the hatch is closed to electrically couple to the test circuit. The wafer sorting machine of claim 1, further comprising: an electrical coupling unit having a lower end electrically coupled to the test circuit; having an upper end, After the wafer is placed in the test unit for positioning, the wafer is electrically coupled to the upper end of the electrical coupling unit. The wafer sorting machine of claim 3, wherein the electrically coupled unit refers to: an elastic probe. The wafer sorting machine of claim 1, further comprising: an integrated pick-up head, having: a downloading pick-up head for sucking the test finished wafer located in the test unit, downloading; and uploading and sucking The head is used to suck the wafer to be tested and upload it into the test unit. The wafer sorting machine of claim 1, further comprising: an independent downloading picking head disposed on the first side of the testing unit, processing the download of the wafer; and an independent uploading picking head disposed in the On the second side of the test unit, the upload of the wafer is processed. The wafer sorting machine of claim 5, wherein the downloading the picking head sequentially executes the first test unit, the second test unit, and the wafer downloading up to the last test unit. The wafer sorting machine of claim 5, wherein the loading the picking head sequentially performs wafer uploading to the first testing unit, the second testing unit, and up to the last testing unit. The wafer sorting machine of claim 6, wherein the downloading the picking head sequentially performs the wafer downloading of the first test unit, the second test unit, and the last test unit. The wafer sorting machine of claim 6, wherein the loading the picking head sequentially performs wafer uploading to the first test unit, the second test unit, and the last test unit. The wafer sorting machine according to claim 1 is executed according to the following procedure: a first test unit: the pressurizing unit is opened, the test completed wafer is downloaded, the wafer to be tested is uploaded, the pressurizing unit is closed, and the test is performed; The second test unit: the pressurizing unit is opened, the test completed wafer is downloaded, the wafer to be tested is uploaded, the pressurizing unit is turned off, and the test is performed; the next test unit is sequentially operated until the last set of test units: the pressurizing unit Open, download the tested wafer, upload the wafer to be tested; pressurize the unit to turn off the test.