JP2019164099A - Electronic component conveyance device and electronic component inspection device - Google Patents

Abstract

To provide an electronic component conveyance device which can perform at least two types of inspections with respect to an electronic component in the middle of conveyance of the electronic component, and an electronic component inspection device.SOLUTION: An electronic component conveyance device capable of disposing a placement member on which an electronic component is placed, comprises: a conveyance part conveying the electronic component; a first region in which the electronic component is placed and a first inspection part performing a first inspection with respect to the electronic component is disposed; and a second region in which the electronic component is placed and a second inspection part performing a second inspection different from the first inspection with respect to the electronic component is disposed. The conveyance part includes: a gripping part gripping the electronic component and sequentially placing the first inspection part and the second inspection part; and a recovery part placing the electronic component after the first inspection and the second inspection are performed on the placement member.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  Conventionally, when an electronic component such as an IC device is inspected electrically, an IC handler that conveys the electronic component is used (for example, see Patent Document 1). The IC handler described in Patent Document 1 is in a state where a test socket connected to a tester is installed. In this state, the electronic component is transported, and the electronic component is disposed in the test socket in the middle of the transport, and one type of inspection is performed on the electronic component.

JP 2000-089918 A

  The IC handler described in Patent Document 1 cannot perform a plurality of types of inspection on an electronic component, and after one type of inspection is completed, the electronic component that has been subjected to the inspection is placed on a tray, It was necessary to move the tray to an IC handler that performs another type of inspection.

  The present invention has been made to solve the above-described problems, and can be realized as the following.

The electronic component transport device of the present invention is an electronic component transport device capable of placing a mounting member on which an electronic component is mounted,
A transport unit for transporting the electronic component;
A first region in which the electronic component is placed and a first inspection unit that performs a first inspection on the electronic component is disposed;
A second region on which the electronic component is placed and a second inspection unit that performs a second inspection different from the first inspection is disposed on the electronic component;
The transport unit grips the electronic component and sequentially places the electronic component on the first inspection unit and the second inspection unit, and the electronic after the first inspection and the second inspection are performed. And a collection unit for placing the component on the placement member.

The electronic component inspection device of the present invention is an electronic component inspection device capable of arranging a placement member on which an electronic component is placed,
A transport unit for transporting the electronic component;
A first inspection unit on which the electronic component is mounted and performs a first inspection on the electronic component;
A first region in which the first inspection unit is disposed;
A second inspection unit on which the electronic component is mounted and performs a second inspection different from the first inspection on the electronic component;
A second region in which the second inspection unit is disposed,
The transport unit grips the electronic component and sequentially places the electronic component on the first inspection unit and the second inspection unit, and the electronic after the first inspection and the second inspection are performed. And a collection unit for placing the component on the placement member.

FIG. 1 is a schematic perspective view of a first embodiment of an electronic component inspection apparatus according to the present invention as viewed from the front side. FIG. 2 is a schematic plan view showing an operating state of the electronic component inspection apparatus shown in FIG. FIG. 3 is an enlarged vertical cross-sectional view sequentially illustrating an inspection region of the electronic component inspection apparatus shown in FIG. FIG. 4 is an enlarged vertical cross-sectional view sequentially illustrating an inspection region of the electronic component inspection apparatus shown in FIG. FIG. 5 is an enlarged vertical cross-sectional view sequentially illustrating the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 6 is an enlarged vertical cross-sectional view sequentially illustrating the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 7 is an enlarged vertical cross-sectional view sequentially illustrating the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 8 is an enlarged vertical cross-sectional view sequentially illustrating the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 9 is an enlarged vertical cross-sectional view sequentially illustrating the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 10 is an enlarged vertical cross-sectional view sequentially illustrating the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 11 is an enlarged vertical cross-sectional view sequentially illustrating the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 12 is an enlarged vertical cross-sectional view sequentially illustrating the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 13 is an enlarged vertical cross-sectional view sequentially illustrating the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 14 is an enlarged vertical cross-sectional view sequentially illustrating the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 15 is an enlarged vertical cross-sectional view sequentially illustrating the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 16 is an enlarged vertical cross-sectional view sequentially illustrating the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 17 is an enlarged vertical cross-sectional view sequentially illustrating the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 18 is an enlarged vertical cross-sectional view sequentially illustrating the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 19 is an enlarged vertical cross-sectional view sequentially illustrating the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 20 is an enlarged vertical cross-sectional view sequentially illustrating the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 21 is an enlarged vertical cross-sectional view sequentially illustrating the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 22 is an enlarged vertical cross-sectional view sequentially illustrating an inspection region and an operation state before and after the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 23 is an enlarged vertical cross-sectional view sequentially illustrating an inspection region of the electronic component inspection apparatus shown in FIG. FIG. 24 is an enlarged vertical cross-sectional view sequentially illustrating the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 25 is an enlarged vertical cross-sectional view sequentially illustrating the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 26 is an enlarged vertical cross-sectional view sequentially illustrating the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 27 is an enlarged vertical cross-sectional view sequentially illustrating the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 28 is an enlarged vertical cross-sectional view sequentially illustrating the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 29 is an enlarged vertical cross-sectional view sequentially illustrating the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 30 is a plan view of the state shown in FIG. 31 is a plan view of the state shown in FIG. FIG. 32 is a plan view of the state shown in FIG. FIG. 33 is a plan view of the state shown in FIG. 34 is a plan view of the state shown in FIG. 35 is a plan view of the state shown in FIG. FIG. 36 is a plan view of the state shown in FIG. FIG. 37 is a plan view of the state shown in FIG. FIG. 38 is a plan view of the state shown in FIG. FIG. 39 is a plan view of the state shown in FIG. FIG. 40 is a plan view of the state shown in FIG. 41 is a plan view of the state shown in FIG. FIG. 42 is a plan view of the state shown in FIG. FIG. 43 is an enlarged plan view showing the inside of the inspection region of the electronic component inspection apparatus (second embodiment) of the present invention. FIG. 44 is an enlarged vertical sectional view showing an inspection region and an operation state before and after the inspection region of the electronic component inspection apparatus (third embodiment) of the present invention. FIG. 45 is an enlarged vertical sectional view showing an inspection region and an operation state before and after the inspection region of the electronic component inspection apparatus (fourth embodiment) of the present invention.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

<First Embodiment>
Hereinafter, with reference to FIGS. 1-42, 1st Embodiment of the electronic component conveying apparatus and electronic component inspection apparatus of this invention is described. In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as an “X direction (first direction)”, a direction parallel to the Y axis is also referred to as a “Y direction (second direction)”, and a direction parallel to the Z axis is referred to as “ Also referred to as “Z direction (third direction)”. The direction in which the arrow in each direction is directed is called “positive”, and the opposite direction is called “negative”. In addition, the term “horizontal” in the specification of the present application is not limited to complete horizontal, and includes a state slightly inclined (for example, less than about 5 °) with respect to the horizontal as long as transportation of electronic components is not hindered. In addition, the term “vertical” as used in the present specification is not limited to complete vertical, and includes a state where the electronic component is slightly inclined (for example, less than about 5 °) as long as transportation of electronic components is not hindered. Also, the upper side in FIGS. 1 and 3 to 29 (the same applies to FIGS. 44 and 45), that is, the Z axis direction positive side is “up” or “up”, and the lower side, ie, the Z axis direction negative side. May be referred to as “down” or “down”. 30 to 42, the device transport head in each region is omitted.

  The electronic component conveying apparatus 10 of the present invention is a handler having the appearance shown in FIG. As shown in FIG. 2, the electronic component transport apparatus 10 includes a transport unit 25 that transports an IC device 90 that is an electronic component, and an IC device 90 (electronic component). On the other hand, the first region A3-1 where the first inspection unit 16A for performing the first inspection is disposed and the IC device 90 (electronic component) are placed, and the first inspection is performed on the IC device 90 (electronic component). 2nd area | region A3-2 in which the 2nd test | inspection part 16B which performs a different 2nd test | inspection is provided. As shown in FIGS. 3 to 29, the transport unit 25 holds the IC device 90 (electronic component) in the inspection area A3 and sequentially places the IC device 90 (electronic component) on the first inspection unit 16A and the second inspection unit 16B. A grip 171 is included.

  Here, the first inspection and the second inspection are, for example, inspection conditions such as inspection contents, inspection items, inspection accuracy, inspection level (acceptance criteria), inspection time, number of inspections, inspection method (inspection method), etc. It is preferable that at least one of these is different.

  When the first inspection and the second inspection are performed on the IC device 90, it is conceivable to prepare two electronic component inspection apparatuses. In this case, of these two electronic component inspection devices, one electronic component inspection device is connected to a first inspection tester, and the other electronic component inspection device is connected to a second inspection tester. The When the first inspection by the one electronic component inspection apparatus is completed, the operator places the first inspected IC device 90 on the tray, and the one electronic component inspection apparatus then performs the other electronic component inspection. It moves to an apparatus and will perform a 2nd test | inspection with this other electronic component inspection apparatus. For this reason, the inspection process for the IC device 90 becomes complicated, and the time from the start of the first inspection to the completion of the second inspection is greatly consumed.

  In the electronic component transport apparatus 10 of the present invention, the gripping unit 171 can grip the IC device 90, and the IC device 90 can be sequentially placed on the first inspection unit 16A and the second inspection unit 16B. Thus, after one type of inspection is completed, it is not necessary to place the electronic component that has been inspected again on the tray and move the tray to an electronic component inspection apparatus that performs another type of inspection. The component inspection apparatus 1 can perform the first inspection and the second inspection on the IC device 90, and thus the inspection process for the IC device 90 can be speeded up.

  In the present embodiment, as will be described later, the movement operation in the X direction of the device supply unit 14 and the movement operation in the Y direction and the Z direction of the device transport head 17 (gripping unit 171) are combined. Although transfer from the 1st inspection part 16A to the 2nd inspection part 16B is performed, it is not limited to this. For example, when the device transport head 17 is also movable in the X direction, the second transport operation from the first inspection unit 16A of the IC device 90 is performed by combining the movement operations of the device transport head 17 in the X direction, the Y direction, and the Z direction. You may transfer to the test | inspection part 16B. Further, when the device supply unit 14 is omitted and the first inspection unit 16A and the second inspection unit 16B are movable in the X direction, this movement operation and the Y direction and the Z direction of the device transport head 17 are performed. The IC device 90 may be transferred from the first inspection unit 16A to the second inspection unit 16B by a combination with the movement operation.

  As shown in FIG. 2, the electronic component inspection apparatus 1 of the present invention includes an electronic component transport apparatus 10, and further includes a first inspection unit 16 </ b> A (first socket) that inspects an IC device 90 (electronic component), and This is a test system including a second inspection unit 16B (second socket). That is, in the electronic component inspection apparatus 1 of the present invention, the transport unit 25 that transports the IC device 90 that is an electronic component, and the IC device 90 (electronic component) are placed. A first inspection unit 16A that performs one inspection, a first region A3-1 in which the first inspection unit 16A is disposed, and an IC device 90 (electronic component) are placed. A second inspection unit 16B that performs a second inspection different from the first inspection, and a second region A3-2 in which the second inspection unit 16B is disposed. Further, the transport unit 25 includes a gripping unit 171 that grips the IC device 90 (electronic component) in the inspection region A3 and sequentially places the IC device 90 on the first inspection unit 16A and the second inspection unit 16B.

  Thereby, the electronic component inspection apparatus 1 which has the advantage of the electronic component conveying apparatus 10 mentioned above is obtained. Further, the IC device 90 can be transported to the first inspection unit 16A and the second inspection unit 16B, and therefore, the first inspection for the IC device 90 is performed by the first inspection unit 16A, and the first inspection for the IC device 90 is performed. Two inspections can be performed by the second inspection unit 16B. Further, the inspected IC device 90 can be transported from the first inspection unit 16A and the second inspection unit 16B.

Hereinafter, the configuration of each unit will be described in detail.
As shown in FIGS. 1 and 2, an electronic component inspection apparatus 1 having an electronic component transport apparatus 10 transports an electronic component such as an IC device that is, for example, a BGA (Ball Grid Array) package, and the electronic component is in the middle of the transport. It is a device for inspecting and testing (hereinafter simply referred to as “inspection”) the electrical characteristics of In the following, for convenience of explanation, the case where an IC device is used as the electronic component will be described as a representative, and this will be referred to as “IC device 90”. In this embodiment, the IC device 90 has a flat plate shape.

  In addition to the above-mentioned IC devices, for example, “LSI (Large Scale Integration)”, “CMOS (Complementary MOS)”, “CCD (Charge Coupled Device)”, or “modules” in which a plurality of IC devices are packaged. IC "," quartz device "," pressure sensor "," inertial sensor (acceleration sensor) "," gyro sensor "," fingerprint sensor ", and the like.

The electronic component inspection apparatus 1 (electronic component transport apparatus 10) includes a tray supply area A1, a device supply area A2, an inspection area A3, a device collection area A4, and a tray removal area A5. As will be described later, each wall is divided. Then, the IC device 90 passes through the respective areas in the direction of the arrow α ₉₀ from the tray supply area A1 to the tray removal area A5, and the inspection is performed in the intermediate inspection area A3. As described above, the electronic component inspection apparatus 1 includes the electronic component transport apparatus 10 including the transport unit 25 that transports the IC device 90 so as to pass through each region, the first inspection unit 16A that performs inspection in the inspection region A3, and the first inspection unit 16A. 2 The inspection part 16B and the control part 800 comprised by the industrial computer are provided. In addition, the electronic component inspection apparatus 1 includes a monitor 300, a signal lamp 400, and an operation panel 700.

  In the electronic component inspection apparatus 1, the tray supply area A1 and the tray removal area A5 are arranged, that is, the lower side in FIG. 2 is the front side, and the inspection area A3 is arranged, that is, in FIG. The upper side is used as the back side.

  In addition, the electronic component inspection apparatus 1 is used by mounting in advance a so-called “change kit” that is exchanged for each type of IC device 90. This change kit includes, for example, a temperature adjustment unit 12, a device supply unit 14, and a device recovery unit (collection unit) 18 as mounting members on which the IC device 90 is mounted. In addition to such a change kit, for example, the tray 200 prepared by the user, the collection tray 19, the first inspection unit 16A, and the second are exchanged for each type of IC device 90. There is an inspection unit 16B.

  The tray supply area A1 is a material supply unit to which a tray 200 in which a plurality of untested IC devices 90 are arranged is supplied. The tray supply area A1 can also be said to be a mounting area in which a plurality of trays 200 can be stacked and mounted. In the present embodiment, each tray 200 has a plurality of recesses (pockets) arranged in a matrix. One IC device 90 can be stored and placed in each recess.

The device supply area A2 is an area where a plurality of IC devices 90 on the tray 200 conveyed from the tray supply area A1 are respectively conveyed and supplied to the inspection area A3. Note that a tray transport mechanism 11A and a tray transport mechanism 11B that transport the trays 200 one by one in the horizontal direction are provided so as to straddle the tray supply area A1 and the device supply area A2. The tray transport mechanism 11A is a part of the transport unit 25, and moves the tray 200 together with the IC device 90 placed on the tray 200 in the positive direction in the Y direction, that is, in the direction of the arrow _{α11A in} FIG. be able to. As a result, the IC device 90 can be stably fed into the device supply area A2. Further, the tray transport mechanism 11B can move the empty tray 200 in the negative direction in the Y direction, that is, in the direction of the arrow _{α11B in} FIG. Thereby, the empty tray 200 can be moved from the device supply area A2 to the tray supply area A1.

  In the device supply area A2, a temperature adjustment unit (soak plate (English notation: soak plate, Chinese notation (example): soaking plate)) 12, a device transfer head 13, and a tray transfer mechanism 15 are provided. Yes. Further, a device supply unit 14 that moves so as to straddle the device supply area A2 and the inspection area A3 is also provided.

  The temperature adjustment unit 12 is referred to as a “soak plate” on which a plurality of IC devices 90 are mounted, and the mounted IC devices 90 can be heated or cooled collectively. With this soak plate, the IC device 90 before being inspected by the first inspection unit 16A or the second inspection unit 16B is heated or cooled in advance, and adjusted to a temperature suitable for the inspection (high temperature inspection or low temperature inspection). Can do.

  The temperature adjusting unit 12 as such a mounting member is fixed. As a result, the temperature of the IC device 90 on the temperature adjustment unit 12 can be adjusted stably.

Further, the temperature adjusting unit 12 is grounded (grounded).
In the configuration shown in FIG. 2, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried in from the tray supply area A1 by the tray transport mechanism 11A is transported to any one of the temperature adjustment units 12.

The device transport head 13 is supported so as to be movable in the X direction and the Y direction within the device supply region A2, and is also supported so as to be movable in the Z direction. The device transport head 13 is also a part of the transport unit 25, and transports the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, the temperature adjustment unit 12, and a device described later. The IC device 90 can be transported to and from the supply unit 14. In FIG. 2, the movement of the device transport head 13 in the X direction is indicated by an arrow α _13X , and the movement of the device transport head 13 in the Y direction is indicated by an arrow α _13Y .

  As shown in FIGS. 3 to 29, in the present embodiment, the device transport head 13 has a grip portion 131 that grips the IC device 90 by suction at the lower portion thereof. Note that the total number and arrangement of the grippers 131 in the device transport head 13 (how many are arranged in the X direction and how many are arranged in the Y direction) are not limited to those shown in FIGS. . When a plurality of gripping portions 131 are arranged, it is preferable that the distance between the centers of the gripping portions 131, that is, the pitch is variable.

  The device supply unit 14 is mounted with the IC device 90 temperature-adjusted by the temperature adjustment unit 12 and can transport the IC device 90 to the vicinity of the first inspection unit 16A and the second inspection unit 16B. What is called a “shuttle plate” or simply “feed shuttle”. The device supply unit 14 is also movably supported and is a part of the transport unit 25. The device supply unit 14 includes a recess (moving mounting unit) 141 in which the IC device 90 is housed and mounted.

The device supply unit 14, while the X direction and the inspection area A3 and the device supply area A2, i.e., are supported by a reciprocally movable (movable) in the arrow alpha ₁₄ direction. Thereby, the device supply unit 14 can stably transport the IC device 90 from the device supply region A2 to the vicinity of the first inspection unit 16A and the second inspection unit 16B in the inspection region A3, and the inspection region A3. Thus, after the IC device 90 is removed by the device transport head 17, it can return to the device supply area A2.

  As shown in FIGS. 30 to 42, in the present embodiment, in the recess (moving placement unit) 141, a first recess (first mounting) arranged side by side in the movement direction of the device supply unit 14, that is, in the X direction. There are (contained) a moving placement portion) 141A and a second recess (second moving placement portion) 141B. In the first recess 141A and the second recess 141B, the first recess 141A is disposed on the X direction negative side, and the second recess 141B is disposed on the X direction positive side. Note that the total number and arrangement of the concave portions 141 in the device supply unit 14 (how many are arranged in the X direction and how many are arranged in the Y direction) are not limited to those shown in FIGS.

  In the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y direction. The device supply unit 14 on the Y direction negative side is referred to as “device supply unit 14A”, and the device supply unit on the Y direction positive side. 14 may be referred to as “device supply unit 14B”. Then, the IC device 90 on the temperature adjustment unit 12 is transported to the device supply unit 14A or the device supply unit 14B in the device supply region A2. Further, like the temperature adjustment unit 12, the device supply unit 14 is configured to be able to heat or cool the IC device 90 placed on the device supply unit 14. As a result, the IC device 90 whose temperature has been adjusted by the temperature adjustment unit 12 can be transported to the inspection area A3 while maintaining its temperature adjustment state. The device supply unit 14 is also grounded in the same manner as the temperature adjustment unit 12.

  As described above, the transport unit 25 includes the device supply unit 14 that is supported to move and has a recess (moving mounting unit) 141 on which the IC device 90 (electronic component) is mounted. As will be described later, the operation of the device supply unit 14 and the operation of the device transport head 17 combine to smoothly transfer (transfer) the IC device 90 from the first inspection unit 16A to the second inspection unit 16B. (See, for example, FIGS. 3 to 29).

Further, as shown in FIGS. 30 to 42, in the device supply area A <b> 2, a posture detection unit that detects the posture (floating) of the IC device 90 placed in the recess 141 at the stop position of the device supply unit 14. 26 is provided. The attitude detection unit 26 includes a light emitting unit 261 configured by a light emitting diode capable of emitting the light L _26, and a photodiode disposed on the Y direction positive side with respect to the light emitting unit 261 and capable of receiving the light L _26. The two light receiving portions 262 are disposed in correspondence with the first concave portion 141A and the second concave portion 141B.

For example, as shown in FIG. 31, when the IC device 90 in the first recess 141A is accurately placed, that is, when it is not inclined with respect to the XY plane, the light L ₂₆ from the light emitting unit 261 is displayed. Can be received by the light receiving unit 262. When the light reception by the light receiving unit 262 is detected, the control unit 800 can move the device supply unit 14 to the inspection region A3 on the assumption that the attitude of the IC device 90 in the first recess 141A is accurate. . On the other hand, when the IC device 90 in the first recess 141A is inclined with respect to the XY plane, the light L ₂₆ from the light emitting unit 261 is blocked by the IC device 90, and the light receiving unit 262 receives the light. Absent. When the light reception by the light receiving unit 262 is not detected, the control unit 800 can notify the fact, for example, by the monitor 300 or the like that the IC device 90 in the first recess 141A is inclined. In this case, the device supply unit 14 is not moved to the inspection area A3.

  Further, for example, when the IC device 90 is already placed in an appropriate posture in the recess 141, the posture detection unit 26 prevents another IC device 90 from being placed on the IC device 90 in an overlapping manner. be able to.

Tray transporting mechanism 15, the positive side of the X direction empty tray 200 in a state where all of the IC devices 90 is removed in the device supply area A2, i.e., a mechanism for conveying the arrow alpha ₁₅ direction. After this transport, the empty tray 200 is returned from the device supply area A2 to the tray supply area A1 by the tray transport mechanism 11B.

  The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, a first inspection unit 16A and a second inspection unit 16B that inspect the IC device 90, and a device transport head 17 are provided.

  The device transport head 17 is a part of the transport unit 25 and is configured to be able to heat or cool the gripped IC device 90 in the same manner as the temperature adjustment unit 12. As shown in FIGS. 3 to 29, the device transport head 17 has a grip portion 171 for gripping the IC device 90 by suction at the lower portion thereof. In the present embodiment, the gripper 171 includes a first gripper 171A and a second gripper 171B that are arranged side by side in the movement direction of the device supply unit 14 (concave (moving placement unit) 141), that is, in the X direction. There is (included). In the first gripping part 171A and the second gripping part 171B, the first gripping part 171A is disposed on the X direction negative side, and the second gripping part 171B is disposed on the X direction positive side. Then, in either of the first gripping portion 171A and the second gripping portion 171B, the IC device 90 in which the temperature adjustment state is maintained is gripped, and the IC device 90 is held in the inspection region A3 while maintaining the temperature adjustment state. Can be transported.

  The device transport head 17 is preferably configured such that the distance between the centers of the first gripping part 171A and the second gripping part 171B, that is, the pitch is variable.

  Further, the total number and arrangement of the gripping portions 171 in the device transport head 17 (how many are arranged in the X direction and how many are arranged in the Y direction) are not limited to those shown in FIGS. .

  Such a device transport head 17 is supported so as to be able to reciprocate in the Y direction and the Z direction within the inspection area A3, and is a part of a mechanism called an “index arm”. Thereby, the device transport head 17 lifts the IC device 90 from the device supply unit 14 carried in from the device supply region A2, transports it on the first inspection unit 16A or the second inspection unit 16B, and places it thereon. Can do.

In FIG. 2, the reciprocating movement of the device transport head 17 in the Y direction is indicated by an arrow α _17Y . The device transport head 17 is supported so as to be reciprocally movable in the Y direction, but is not limited thereto, and may be supported so as to be reciprocally movable in the X direction.

  In the present embodiment, two device transport heads 17 are arranged in the Y direction (see FIG. 2). Hereinafter, the device transport head 17 on the Y direction negative side may be referred to as “device transport head 17A”, and the device transport head 17 on the Y direction positive side may be referred to as “device transport head 17B”. The device transport head 17A can carry the transport of the IC device 90 from the device supply unit 14A to the first inspection unit 16A or the second inspection unit 16B in the inspection region A3. The device transport head 17B is in the inspection region A3. The IC device 90 can be transported from the device supply unit 14B to the first inspection unit 16A or the second inspection unit 16B. The device transport head 17A can take charge of transport of the IC device 90 from the second inspection unit 16B to the device collection unit 18A in the inspection area A3. The device transport head 17B is in the inspection area A3. 2 Transport from the inspection unit 16B to the device collection unit 18B can be performed.

  16 A of 1st test | inspection parts can mount IC device 90 (electronic component), and can perform the 1st test | inspection which test | inspects an electrical property with respect to IC device 90 (electronic component). The first inspection unit 16A is disposed in the first area A3-1 set in the inspection area A3, and is detachably fixed. This attachment / detachment is possible by using, for example, a bolt. The first inspection unit 16A is connected to the first tester 900A. And a 1st test | inspection is performed based on the program memorize | stored in the test | inspection control part with which the 1st tester 900A is provided.

  IC device 90 (electronic component) is placed on second inspection unit 16B, and IC device 90 (electronic component) can perform a second inspection that inspects electrical characteristics different from the first inspection. The second inspection unit 16B is disposed in a second region A3-2 set adjacent to the positive side in the X direction of the first region A3-1 in the inspection region A3, and is detachably fixed. This attachment / detachment is also possible by using, for example, a bolt, similarly to the attachment / detachment of the first inspection unit 16A. The second inspection unit 16B is connected to the second tester 900B. And a 2nd test | inspection is performed based on the program memorize | stored in the test | inspection control part with which the 2nd tester 900B is provided.

  Further, the first inspection unit 16A and the second inspection unit 16B are unitized as one structure, and, like the temperature adjustment unit 12, the IC device 90 is heated or cooled, and the IC device 90 is It can be adjusted to a temperature suitable for inspection.

  As shown in FIGS. 3 to 42, each of the first inspection unit 16 </ b> A and the second inspection unit 16 </ b> B has a recess (pocket) 161 in which the IC device 90 is housed and placed, and inside the recess 161. A plurality of probe pins (not shown) are provided. Then, the IC device 90 can be inspected by connecting the terminals of the IC device 90 and the probe pins in a conductive manner, that is, by contacting them. The first inspection unit 16A and the second inspection unit 16B each have one recess 161 in the present embodiment. However, the total number and arrangement of the recesses 161 (how many are arranged in the X direction, Y How many are arranged in the direction) is not limited to that shown in FIGS.

  With such first inspection unit 16A and second inspection unit 16B, one electronic component inspection apparatus 1 can perform two types of inspections on one IC device 90.

  In addition, it does not specifically limit as a 1st test | inspection and a 2nd test | inspection, For example, the disconnection test | inspection of the circuit in the IC device 90, the resistance value test | inspection of the circuit in the IC device 90, etc. are mentioned. In this case, the inspection content and the inspection item are different from each other in the disconnection inspection and the resistance value inspection.

  Moreover, the electronic component inspection apparatus 1 may further include a portion that performs a third inspection, a fourth inspection, or the like that inspects electrical characteristics different from those of the first inspection or the second inspection.

  The device collection area A4 is an area in which a plurality of IC devices 90 that have been inspected in the inspection area A3 and completed the inspection are collected. In the device recovery area A4, a recovery tray 19, a device transport head 20, and a tray transport mechanism 21 are provided. In addition, a device collection unit 18 that moves across the inspection area A3 and the device collection area A4 is also provided. An empty tray 200 is also prepared in the device collection area A4.

  The device collection unit 18 is called a “collection shuttle plate” or simply a “collection shuttle” on which the IC device 90 that has been inspected is placed and transports the IC device 90 to the device collection area A4. The device collection unit 18 is also a part of the transport unit 25. The device collection unit 18 has a recess (pocket) 181 in which the IC device 90 is stored and placed.

The device collecting unit 18, between the examination region A3 and the device collection area A4 X-direction, i.e., are reciprocally movably supported along the arrow alpha ₁₈ direction. Thereby, the device collection unit 18 can stably convey the IC device 90 from the inspection area A3 to the device collection area A4, and the IC device 90 is removed by the device conveyance head 20 in the device collection area A4. After that, it can return to the inspection area A3 again.

  As shown in FIGS. 30 to 42, in the present embodiment, the recess 181 includes a first recess 181 </ b> A and a second recess 181 </ b> B arranged side by side in the movement direction of the device recovery unit 18, that is, the X direction. (include). In the first recess 181A and the second recess 181B, the first recess 181A is disposed on the X direction negative side, and the second recess 181B is disposed on the X direction positive side. Note that the total number and arrangement of the recesses 181 in the device recovery unit 18 (how many are arranged in the X direction and how many are arranged in the Y direction) are not limited to those shown in FIGS. 30 to 42.

  In the configuration shown in FIG. 2, two device recovery units 18 are arranged in the Y direction, similarly to the device supply unit 14, and the device recovery unit 18 on the Y direction negative side is referred to as “device recovery unit 18 </ b> A”. The device collection unit 18 on the Y direction positive side may be referred to as a “device collection unit 18B”. Then, the IC device 90 on the second inspection unit 16B is transported to and placed on the device collection unit 18A or the device collection unit 18B. The device collection unit 18 is also grounded, like the temperature adjustment unit 12 and the device supply unit 14.

  The device collection unit 18 is connected to the device supply unit 14 via the connection unit 27. That is, the device collection unit 18A is connected to the device supply unit 14A through the connection unit 27, and the device collection unit 18B is connected to the device supply unit 14B through the connection unit 27. Thereby, the device supply unit 14A and the device collection unit 18A can integrally move in the same direction, and the device supply unit 14B and the device collection unit 18B can integrally move in the same direction.

  In the present embodiment, the first inspection unit 16A and the second inspection unit are connected between the connection body of the device supply unit 14A and the device recovery unit 18A and the connection body of the device supply unit 14B and the device recovery unit 18B. An inspection unit 16B is arranged.

  The collection tray 19 is loaded with the IC device 90 that has been inspected and fixed so as not to move in the device collection area A4. As a result, the inspected IC device 90 can be stably placed on the collection tray 19 even in the device collection area A4 where a relatively large number of various movable parts such as the device transport head 20 are arranged. It becomes. In the configuration shown in FIG. 2, three collection trays 19 are arranged along the X direction.

  Three empty trays 200 are also arranged along the X direction. This empty tray 200 is also loaded with the IC device 90 that has been inspected. Then, the IC device 90 on the device recovery unit 18 that has moved to the device recovery area A4 is conveyed and placed on either the recovery tray 19 or the empty tray 200. Thereby, the IC device 90 is classified and collected for each inspection result.

The device transport head 20 is supported so as to be movable in the X direction and the Y direction in the device collection area A4, and further supported so as to be movable in the Z direction. The device transport head 20 is a part of the transport unit 25, and can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200. In FIG. 2, the movement of the device transport head 20 in the X direction is indicated by an arrow α _20X , and the movement of the device transport head 20 in the Y direction is indicated by an arrow α _20Y .

  As shown in FIGS. 3 to 29, in the present embodiment, the device transport head 20 has a grip portion 201 that grips the IC device 90 by suction at the lower portion thereof. Note that the total number and arrangement of the gripping portions 201 in the device transport head 20 (how many are arranged in the X direction and how many are arranged in the Y direction) are not limited to those shown in FIGS. . When a plurality of gripping parts 201 are arranged, it is preferable that the distance between the centers of the gripping parts 201, that is, the pitch is variable.

Tray transfer mechanism 21, X-direction empty tray 200 is conveyed from the tray removal area A5 in the device collection region within A4, i.e., a mechanism for conveying the arrow alpha ₂₁ direction. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200.

  The tray removal area A5 is a material removal unit from which the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

Further, a tray transport mechanism 22A and a tray transport mechanism 22B that transport the trays 200 one by one in the Y direction are provided so as to straddle the device collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a part of the transport unit 25, and can reciprocate the tray 200 in the Y direction, that is, the arrow α _22A direction. Thereby, the inspected IC device 90 can be transported from the device collection area A4 to the tray removal area A5. Further, the tray transport mechanism 22B can move the empty tray 200 for collecting the IC device 90 in the positive direction in the Y direction, that is, in the direction of the arrow α _22B . Thereby, the empty tray 200 can be moved from the tray removal area A5 to the device collection area A4.

  The control unit 800 includes, for example, a tray transport mechanism 11A, a tray transport mechanism 11B, a temperature adjustment unit 12, a device transport head 13, a device supply unit 14, a tray transport mechanism 15, a first inspection unit 16A, Control operations of the second inspection unit 16B, the device transport head 17, the device collection unit 18, the device transport head 20, the tray transport mechanism 21, the tray transport mechanism 22A, the tray transport mechanism 22B, and the like. Can do.

  The control unit 800 may be built in the electronic component inspection apparatus 1 (electronic component transport apparatus 10), or may be provided in an external device such as an external computer. The external device may be, for example, communicated with the electronic component inspection apparatus 1 via a cable, wirelessly connected, or connected to the electronic component inspection apparatus 1 via a network (for example, the Internet). is there.

  As shown in FIG. 2, in the present embodiment, the control unit 800 includes at least one processor 801 (at least one processor) and at least one memory 802 (see FIG. 2). The processor 801 can read various information (for example, a determination program, an instruction / command program, etc.) stored in the memory 802 and execute a determination or a command (command).

  The operator can set or confirm the operating conditions of the electronic component inspection apparatus 1 via the monitor 300. The monitor 300 has a display screen 301 composed of, for example, a liquid crystal screen, and is disposed at the upper part on the front side of the electronic component inspection apparatus 1. As shown in FIG. 1, a mouse table 600 on which a mouse is placed is provided on the right side of the tray removal area A5 in the drawing. This mouse is used when operating the screen displayed on the monitor 300.

  In addition, an operation panel 700 is arranged on the lower right side of FIG. The operation panel 700 instructs the electronic component inspection apparatus 1 to perform a desired operation separately from the monitor 300.

  Further, the signal lamp 400 can notify the operating state of the electronic component inspection apparatus 1 and the like by a combination of colors that emit light. The signal lamp 400 is disposed on the electronic component inspection apparatus 1. Note that the electronic component inspection apparatus 1 has a built-in speaker 500, and the operational state of the electronic component inspection apparatus 1 can also be notified by the speaker 500.

  In the electronic component inspection apparatus 1, the tray supply area A1 and the device supply area A2 are separated by a first partition 231 and the device supply area A2 and the inspection area A3 are separated by a second partition 232. The inspection area A3 and the device collection area A4 are separated by a third partition wall 233, and the device collection area A4 and the tray removal area A5 are separated by a fourth partition wall 234. The device supply area A2 and the device collection area A4 are also partitioned by the fifth partition wall 235.

  The outermost exterior of the electronic component inspection apparatus 1 is covered with a cover. Examples of the cover include a front cover 241, a side cover 242, a side cover 243, a rear cover 244, and a top cover 245.

  As described above, the IC device 90 is subjected to the first inspection by the first inspection unit 16A and the second inspection by the second inspection unit 16B. At that time, the IC device 90 is transferred (conveyed) from the first inspection unit 16A to the second inspection unit 16B. Therefore, the operation of transferring the IC device 90 from the first inspection unit 16A to the second inspection unit 16B will be described with reference to FIGS. Hereinafter, the IC device 90 transferred to the first generation is referred to as “IC device 90A”, and the IC device 90 transferred to the second generation is referred to as “IC device 90B”. Further, the device transport head 17A, the device supply unit 14A, and the device collection unit 18A, and the device transport head 17B, the device supply unit 14B, and the device collection unit 18B have the same configuration and the same operation except for the arrangement location. In the following, the device transport head 17B, the device supply unit 14B, and the device collection unit 18B will be representatively handled.

  As shown in FIG. 3, the IC device 90 </ b> A is held by the holding part 131 of the device transport head 13. The device supply unit 14B is stopped in the device supply region A2, and is located so that the entirety thereof, that is, the first recess 141A and the second recess 141B are exposed in the device supply region A2. Then, the IC device 90A gripped by the device transport head 13 is in a state of being disposed on the first recess 141A of the device supply unit 14B.

  Further, as shown in FIG. 30 (the same applies to FIG. 3), the IC supply 90 is mounted on each of the device supply unit 14B, the device collection unit 18B, the first inspection unit 16A, and the second inspection unit 16B. It is not empty.

  Next, as illustrated in FIG. 4, the device transport head 13 moves downward toward the first recess 141 </ b> A of the device supply unit 14 </ b> B while moving the IC device 90 </ b> A (moves to the Z direction negative side). Thereby, the IC device 90A can be placed (stored) in the first recess 141A.

  Next, as shown in FIG. 5, the device transport head 13 lifts (moves to the positive side in the Z direction) by releasing the gripping state with respect to the IC device 90A. Thereby, the device transport head 13 can be separated from the IC device 90A.

In addition, as shown in FIG. 31, the posture detection unit 26 detects the posture of the IC device 90A placed in the first recess 141A as described above. In the state shown in FIG. 31, the light L ₂₆ from the light emitting unit 261 is received by the light receiving unit 262. In this case, assuming that the posture of the IC device 90A in the first recess 141A is appropriate (accurate), the device supply unit 14B can be moved to the inspection region A3 by the following operation.

  Next, as illustrated in FIG. 6, the device supply unit 14 </ b> B moves to the inspection area A <b> 3 (X direction positive side) and then stops. The stop position of the device supply unit 14B is such that the position in the X direction of the first recess 141A of the device supply unit 14B (the X coordinate of the center of the first recess 141A) is the X direction of the recess 161 of the first inspection unit 16A. This is the same position as the position (the X coordinate of the center of the recess 161). Thus, as shown in FIG. 32, in the inspection area A3, the IC device 90A in the first recess 141A is positioned on the Y direction positive side with respect to the recess 161 of the first inspection portion 16A. In the state shown in FIG. 6, the first gripping part 171A of the device transport head 17B is located above the first recess 141A of the device supply unit 14B, and the device supply unit 14B is positioned above the second recess 141B. The second grip 171B of the transport head 17B is located.

  Next, as shown in FIG. 7, the device transport head 17B is lowered and then stopped. The stop position of the device transport head 17B is a position where the first gripper 171A contacts the IC device 90A in the first recess 141A of the device supply unit 14B. Then, with the device transport head 17B stopped, the first gripper 171A grips the IC device 90A in the first recess 141A.

  Next, as shown in FIG. 8, the device transport head 17 </ b> B moves up while maintaining the gripping state with respect to the IC device 90 </ b> A. As a result, the device transport head 17B can lift the IC device 90A and detach the IC device 90A from the first recess 141A of the device supply unit 14B. During this time, it is preferable that the device transport head 13 moves toward the IC device 90B to be gripped next in the device supply region A2.

  Next, as shown in FIG. 9, the device transport head 17B moves toward the concave portion 161 of the first inspection unit 16A while holding the IC device 90A. Then, at the destination, as shown in FIG. 33 (the same applies to FIG. 9), the IC device 90A can be pressed and placed against the recess 161 of the first inspection unit 16A. Thereby, the 1st test | inspection with respect to IC device 90A can be performed. As shown in FIG. 9, in the device supply area A2, the device transport head 13 stands by at the same position as the device transport head 13 shown in FIG. 3 while holding the IC device 90B.

  Next, as shown in FIG. 10, the device supply unit 14B moves back to the device supply region A2 (X direction negative side) and then stops. The stop position of the device supply unit 14B is the same position as the device supply unit 14B illustrated in FIG. During this time, the first inspection for the IC device 90A is continuously performed.

  Next, as shown in FIG. 11, the device transport head 13 descends toward the first recess 141A of the device supply unit 14B while holding the IC device 90B. Thereby, the IC device 90B can be placed in the first recess 141A.

  Next, as shown in FIG. 12, the device transport head 13 is lifted by releasing the gripping state with respect to the IC device 90B. Thereby, the device transport head 13 can be separated from the IC device 90B.

  In the state shown in FIG. 12, the first inspection for the IC device 90A is completed. Therefore, the device transport head 17B can be separated from the first inspection unit 16A while holding the IC device 90A. The device transport head 17B stands by at the same position as the device transport head 17B shown in FIG.

Also, as shown in FIG. 34, the posture of the IC device 90B placed in the first recess 141A is detected by the posture detector 26. In the state shown in FIG. 34, the light L ₂₆ from the light emitting unit 261 is received by the light receiving unit 262. In this case, assuming that the posture of the IC device 90B in the first recess 141A is appropriate, the device supply unit 14B can be moved to the inspection region A3 by the following operation.

  Next, as shown in FIG. 13, the device supply unit 14B moves to the inspection area A3 and then stops. The stop position of the device supply unit 14B is such that the position in the X direction of the second recess 141B of the device supply unit 14B (the X coordinate of the center of the second recess 141B) is the X direction of the recess 161 of the first inspection unit 16A. This is the same position as the position (the X coordinate of the center of the recess 161).

  Next, as shown in FIG. 14, the device transport head 17B descends and then stops. The stop position of the device transport head 17B is a position where the IC device 90A held by the first holding unit 171A is placed in the second recess 141B of the device supply unit 14B.

  Next, as illustrated in FIG. 15, the device transport head 17 </ b> B is lifted by releasing the gripping state of the first gripping portion 171 </ b> A with respect to the IC device 90 </ b> A. Thereby, the device transport head 17B can be separated from the IC device 90A. At this time, as shown in FIG. 35 (the same applies to FIG. 15), in the device supply unit 14B, the IC device 90B is placed in the first recess 141A, and the IC device 90A is placed in the second recess 141B. It becomes.

  Next, as shown in FIG. 16, the device supply unit 14B moves back to the device supply area A2, and then stops. The stop position of the device supply unit 14B is the same position as the device supply unit 14B illustrated in FIG.

Also, as shown in FIG. 36, the posture detection unit 26 detects the posture of the IC device 90B in the first recess 141A and the posture of the IC device 90A in the second recess 141B. In any of the states shown in FIG. 36, the light L ₂₆ from the light emitting unit 261 is received by the light receiving unit 262. In this case, the posture of the IC device 90B in the first recess 141A and the posture of the IC device 90A in the second recess 141B are appropriate, and the device supply unit 14B is moved to the inspection region A3 by the following operation. be able to.

  Next, as shown in FIG. 17, the device supply unit 14B moves to the inspection area A3 and then stops. The stop position of the device supply unit 14B is the same position as the position of the device supply unit 14B illustrated in FIG. Accordingly, as shown in FIG. 37, in the inspection region A3, the IC device 90B in the first recess 141A is located on the Y direction positive side with respect to the recess 161 of the first inspection portion 16A, and the second recess 141B. The IC device 90A is located on the Y direction positive side with respect to the concave portion 161 of the second inspection unit 16B.

  Next, as shown in FIG. 18, the device transport head 17B descends and then stops. The stop position of the device transport head 17B is such that the first gripping portion 171A abuts on the IC device 90B in the first recess 141A of the device supply portion 14B, and the second gripping portion 171B is the second recess of the device supply portion 14B. The position is in contact with the IC device 90A in 141B. Then, with the device transport head 17B stopped, the first gripping portion 171A grips the IC device 90B in the first recess 141A, and the second gripping portion 171B grips the IC device 90A in the second recess 141B. .

  Next, as illustrated in FIG. 19, the device transport head 17 </ b> B moves up while maintaining the gripping state with respect to the IC device 90 </ b> A and the IC device 90 </ b> B. As a result, the device transport head 17B can lift the IC device 90A and the IC device 90B to release the IC device 90B from the first recess 141A, and can release the IC device 90A from the second recess 141B.

  Next, as shown in FIG. 20, the device transport head 17B moves toward the first inspection unit 16A and the second inspection unit 16B while holding the IC device 90A and the IC device 90B. At the destination, as shown in FIG. 38 (the same applies to FIG. 20), the IC device 90B can be pressed and placed against the recess 161 of the first inspection section 16A, and the IC device 90A can be placed in the second position. It can be pressed against the recess 161 of the inspection unit 16B. Thereby, the 1st test | inspection with respect to IC device 90B and the 2nd test | inspection with respect to IC device 90A can be performed collectively.

  Next, after the first inspection for the IC device 90B and the second inspection for the IC device 90A are completed, as shown in FIG. 21, the device collection unit 18B moves and is positioned in the inspection region A3. At this position, the device collection unit 18B is configured such that the position of the first recess 181A in the X direction (X coordinate of the center of the first recess 181A) is the position of the recess 161 of the first inspection unit 16A in the X direction (center of the recess 161). X position of the second concave portion 181B (X coordinate of the center of the second concave portion 181B) is the same as the position of the concave portion 161 of the second inspection portion 16B in the X direction (center of the concave portion 161). X coordinate).

  At this time, the device transport head 17B keeps pressing the IC device 90B against the recess 161 of the first inspection unit 16A and pressing the IC device 90A against the recess 161 of the second inspection unit 16B.

  Next, as illustrated in FIG. 22, the device transport head 17 </ b> B moves up while holding the IC device 90 </ b> A and the IC device 90 </ b> B. Thereby, the IC device 90B is separated from the first inspection unit 16A, and the IC device 90A is separated from the second inspection unit 16B. Thereafter, the device transport head 17B stands by at the same position as the device transport head 17B shown in FIG.

  Next, as shown in FIG. 23, the device transport head 17B descends and then stops. The stop position of the device transport head 17B is such that the IC device 90B gripped by the first gripping portion 171A is placed in the first recess 181A of the device collection portion 18B and is gripped by the second gripping portion 171B. The device 90A is a position where the device 90A is placed in the second recess 181B of the device collection unit 18B.

  Next, as shown in FIG. 24, the device transport head 13 releases the gripping state of the second gripping portion 171B with respect to the IC device 90A while maintaining the gripping state of the first gripping portion 171A with respect to the IC device 90B. To rise. Thereby, the device transport head 13 can be separated from the IC device 90A. At this time, as shown in FIG. 39 (the same applies to FIG. 24), the device collection unit 18B is in a state where the IC device 90A is placed in the second recess 181B.

  Next, as shown in FIG. 25, the device collection unit 18B moves to the device collection region A4 (X direction positive side) and then stops. At this position, the entire device recovery unit 18B, that is, the first recess 181A and the second recess 181B are exposed in the device recovery region A4. As a result, as shown in FIG. 40 (the same applies to FIG. 25), the IC device 90A in the second recess 181B is arranged in the device collection area A4. In the device collection area A4, the grip portion 201 of the device transport head 20 is located above the second recess 181B (IC device 90A).

  Next, as shown in FIG. 26, the device transport head 20 descends and then stops. The stop position of the device transport head 20 is a position where the gripper 201 abuts on the IC device 90A in the second recess 181B of the device recovery unit 18B. Then, with the device transport head 20 stopped, the gripper 201 grips the IC device 90A in the second recess 181B.

  Next, as shown in FIG. 27, the device transport head 20 moves up while maintaining the gripping state with respect to the IC device 90A. As a result, the device transport head 20 can lift the IC device 90A and detach the IC device 90A from the second recess 181B of the device collection unit 18B. At this time, as shown in FIG. 41 (the same applies to FIG. 27), the device supply unit 14B, the device collection unit 18B, the first inspection unit 16A, and the second inspection unit 16B all include the IC device 90A and the IC device. 90B is not placed.

  Next, as shown in FIG. 28, the device supply unit 14B moves and then stops. The stop position of the device supply unit 14B is such that the position in the X direction of the second recess 141B of the device supply unit 14B (the X coordinate of the center of the second recess 141B) is the X direction of the recess 161 of the first inspection unit 16A. This is the same position as the position (the X coordinate of the center of the recess 161).

  Next, as shown in FIG. 29, the device transport head 17B descends and then stops. The stop position of the device transport head 17B is a position where the IC device 90B held by the first holding unit 171A is placed in the second recess 141B of the device supply unit 14B. At this time, as shown in FIG. 42 (the same applies to FIG. 29), the device supply unit 14B is in a state where the IC device 90B is placed in the second recess 141B.

  The subsequent transfer operation for the IC device 90B is the same as the subsequent transfer operation for the IC device 90A described above (the operation after FIG. 15).

  Conventionally, when the first inspection and the second inspection are performed on the IC device 90, two electronic component inspection apparatuses are prepared. Of these two electronic component inspection apparatuses, one electronic component inspection apparatus is connected to a first inspection tester, and the other electronic component inspection apparatus is connected to a second inspection tester. Then, when the first inspection in the one electronic component inspection apparatus is completed, the operator moves the first inspected IC device 90 from the one electronic component inspection apparatus to the other electronic component inspection apparatus. The second inspection was performed by the other electronic component inspection apparatus. For this reason, the inspection process for the IC device 90 becomes complicated, and the time from the start of the first inspection to the completion of the second inspection has been expended.

  On the other hand, in the electronic component inspection apparatus 1 (electronic component transport apparatus 10), the gripping portion 171 of the device transport head 17 grips the IC device 90, and the IC device 90 is moved to the first inspection portion 16A and the second inspection portion. 16B can be sequentially mounted. As a result, the first inspection and the second inspection can be performed on the IC device 90 with one electronic component inspection apparatus 1, and thus the inspection process for the IC device 90 can be speeded up.

  As described above, the first inspection unit 16A is fixed in the first region A3-1, and the second inspection unit 16B is fixed in the second region A3-2. The device transport head 17 (gripping unit 171) is supported so as to move in the movement direction of the device supply unit 14 (recess (moving placement unit) 141), that is, in the Y direction intersecting with the X direction. The gripping portion 171 of the device transport head 17 is configured to fix the IC device 90 (electronic component) from the movable device supply portion 14 (concave portion (moving placement portion) 141) to the fixed first inspection portion 16A, The movable device supply unit 14 (recess (moving mounting unit) 141) and the fixed second inspection unit 16B can be mounted in this order.

  As described above, in the electronic component inspection apparatus 1, the operation of the device supply unit 14 and the operation of the device transport head 17 are combined to transfer (transfer) the IC device 90 from the first inspection unit 16 </ b> A to the second inspection unit 16 </ b> B. ) Can be performed smoothly. Further, although depending on the mechanical configuration of the electronic component inspection apparatus 1, when the electronic component inspection apparatus 1 having an existing configuration is used, the first inspection unit 16A of the IC device 90 can be changed by changing the software, for example. 2 Transfer operation to the inspection unit 16B can be performed.

  Further, as described above, in the recess (moving placement unit) 141, the first recess (first moving placement) arranged side by side in the moving direction of the device supply unit 14 (recess (moving placement unit) 141). Part) 141A and a second recess (second moving placement part) 141B are included. In addition, the gripping portion 171 of the device transport head 17 includes a first gripping portion 171A and a second gripping portion 171B arranged side by side in the movement direction of the device supply portion 14 (concave portion (moving placement portion) 141). It is.

  As described above, the first gripper 171A moves the IC device 90 (electronic component) from the first concave portion (first moving placement portion) 141A to the first inspection portion 16A and the second concave portion (second moving placement portion). ) 141B in this order.

  On the other hand, the second gripping portion 171B disposed on the positive side in the X direction with respect to the first gripping portion 171A allows the IC device 90 (electronic component) to be moved to the second concave portion following the placement operation of the first gripping portion 171A. (Second moving placement unit) 141B can be placed on second inspection unit 16B.

  In such a configuration, for example, the device transport head 13 rearranges the arrangement of the IC devices 90 (IC device 90A, IC device 90B) on the device supply unit 14 in the device supply region A2, and the device supply unit 14 Compared with the case where the first inspection and the second inspection are performed by moving to the inspection region A3, it is possible to shorten the movement time of the IC device 90 from the first inspection unit 16A to the second inspection unit 16B. Thereby, a 1st test | inspection and a 2nd test | inspection can be performed rapidly.

  When the result of the first inspection of the IC device 90A is determined as “No (defect)”, the IC device 90A is placed on the second inspection unit 16B, but the second inspection is performed. May be omitted. When the result of the first inspection of the IC device 90A is determined as “No”, the placement of the IC device 90A on the second inspection unit 16B may be omitted.

  In the transfer operation from the first inspection unit 16A to the second inspection unit 16B of the IC device 90 described above, a case where two IC devices 90 (IC device 90A and IC device 90B) are transferred in parallel will be described. However, the present invention is not limited to this, and can also be applied to the case where one IC device 90 is transferred. In this case, the operation related to the transfer of the IC device 90B can be omitted. As an operation related to the transfer of the IC device 90B, for example, an operation of moving to the device supply area A2 of the device supply unit 14 shown in FIG. 10, and the device transport head 13 shown in FIG. There are a mounting operation, an operation in which the device transport head 17 shown in FIGS.

  31, 34, and 36, the attitude of the IC device 90 is detected by the attitude detection unit 26, but the present invention is not limited to this. For example, this attitude detection can be omitted. In this case, it is possible to omit the device supply unit 14B from returning to the device supply region A2 in order to perform posture detection.

  The device transport head 13 may hold another IC device 90 after placing the IC device 90B on the device supply unit 14B, that is, after the state shown in FIG. Also in this case, the other IC device 90 is subjected to the first inspection and the second inspection in this order.

Second Embodiment
Hereinafter, the second embodiment of the electronic component transport apparatus and the electronic component inspection apparatus of the present invention will be described with reference to FIG. 43, but the description will focus on the differences from the above-described embodiment, and the same matters will be described. Is omitted.

  This embodiment is the same as the first embodiment except that the number of concave portions arranged in the first inspection section is different from the number of concave portions arranged in the second inspection section.

  As shown in FIG. 43, in the present embodiment, the first inspection unit 16A has two recesses 161 arranged side by side in the Y direction. Hereinafter, the concave portion 161 on the negative side in the Y direction is referred to as “concave portion 161A”, and the concave portion 161 on the positive side in the Y direction is referred to as “concave portion 161B”. The second inspection unit 16B also has two recesses 161 arranged side by side in the Y direction. Hereinafter, the concave portion 161 on the negative side in the Y direction is referred to as “concave portion 161C”, and the concave portion 161 on the positive side in the Y direction is referred to as “concave portion 161D”. Thus, in this embodiment, a total of four recesses 161 of the first inspection unit 16A and four recesses 161 of the second inspection unit 16B are arranged. In this case, it is preferable that the total number and arrangement of the gripping portions 171 included in the device transport head 17 also correspond to the concave portions 161 of the present embodiment.

  With the configuration as described above, for example, the throughput of the electronic component inspection apparatus 1 (electronic component transport apparatus 10) (the number of transported IC devices 90 per unit time) can be improved.

  Note that the center-to-center distance (pitch) between the recesses 161A and the recesses 161B and the center-to-center distance (pitch) between the recesses 161C and the recesses 161D are the same in the configuration shown in FIG. 43, but are not limited thereto. May be different.

  Further, the center-to-center distance (pitch) between the recess 161A and the recess 161C and the center-to-center distance (pitch) between the recess 161B and the recess 161D are the same in the configuration shown in FIG. 43, but are not limited thereto. May be different.

  Further, the total number and arrangement of the concave portions 161 of the first inspection unit 16A are not limited to those shown in FIG.

  Further, the total number and arrangement of the concave portions 161 of the second inspection unit 16B are not limited to those shown in FIG.

<Third Embodiment>
Hereinafter, the third embodiment of the electronic component transport apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to FIG. 44. The difference from the above-described embodiment will be mainly described, and the same matters will be described. Is omitted.

  This embodiment is the same as the first embodiment except that the operation when placing the IC device on the device supply unit in the device supply area is different.

  As shown in FIG. 44, in the present embodiment, when the device transport head 13 places the IC device 90A in the first recess 141A of the device supply unit 14B in the device supply region A2, the device supply unit 14B The first recess 141A and the second recess 141B are not positioned so as to be exposed in the device supply region A2 as in the first embodiment, but the first recess 141A is exposed in the device supply region A2. The second recess 141B is positioned so as to be exposed in the inspection area A3.

  In such a state, the movement time and the movement distance until the entire device supply unit 14B is located in the inspection region A3 can be made shorter than in the first embodiment. Thereby, the throughput of the electronic component inspection apparatus 1 (electronic component transport apparatus 10) can be improved.

<Fourth embodiment>
Hereinafter, the fourth embodiment of the electronic component transport device and the electronic component inspection device of the present invention will be described with reference to FIG. 45. The difference from the above-described embodiment will be mainly described, and the same matters will be described. Is omitted.

  The present embodiment is the same as the first embodiment except that the operation when removing the IC device from the device collection unit in the device collection area is different.

  As shown in FIG. 45, in this embodiment, when the device transport head 20 collects the IC device 90A from the second recess 181B of the device collection unit 18B in the device collection region A4, the device collection unit 18B The first recess 181A and the second recess 181B are not positioned so as to be exposed in the device recovery area A4 as in the first embodiment, but the second recess 181B is exposed in the device recovery area A4. The first recess 181A is positioned so as to be exposed in the inspection area A3.

  In such a state, the movement time and the movement distance until the device collection unit 18B moves from the inspection region A3 to the device collection region A4 and becomes capable of collecting the IC device 90A are set in the first embodiment. Can also be shortened. Thereby, the throughput of the electronic component inspection apparatus 1 (electronic component transport apparatus 10) can be improved. In addition, since the first recess 181A is not exposed in the device collection area A4, it is possible to prevent another IC device 90 from being stacked in the first recess 181A. For example, when the device transport head 20 cannot place the IC device 90A on the collection tray 19 and moves to the device collection unit 18B while holding the IC device 90A for some reason, such as being unable to break the vacuum, as described above. There is a possibility that another IC device 90 is placed in the first recess 181A.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated about embodiment of illustration, this invention is not limited to this, Each part which comprises an electronic component conveyance apparatus and an electronic component inspection apparatus Can be replaced with any structure capable of performing the same function. Moreover, arbitrary components may be added.

  Moreover, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be a combination of any two or more configurations (features) of the above embodiments.

DESCRIPTION OF SYMBOLS 1 ... Electronic component inspection apparatus, 10 ... Electronic component conveyance apparatus, 11A ... Tray conveyance mechanism, 11B ... Tray conveyance mechanism, 12 ... Temperature adjustment part, 13 ... Device conveyance head, 131 ... Gripping part, 14 ... Device supply part, 14A ... Device supply part, 14B ... Device supply part, 141 ... Recess (moving placement part), 141A ... First recess (first movement placing part), 141B ... Second recess (second movement placing part), 15 ... Tray transport mechanism, 16A ... first inspection section, 16B ... second inspection section, 161 ... concave (pocket), 161A ... concave, 161B ... concave, 161C ... concave, 161D ... concave, 17 ... device transport head, 17A ... Device transport head, 17B ... Device transport head, 171 ... Gripping part, 171A ... First gripping part, 171B ... Second gripping part, 18 ... Device recovery part, 18A ... Device recovery part 18B ... Device recovery unit, 181 ... Recess (pocket), 181A ... First recess, 181B ... Second recess, 19 ... Collection tray, 20 ... Device transport head, 201 ... Gripping unit, 21 ... Tray transport mechanism, 22A ... Tray transport mechanism, 22B ... Tray transport mechanism, 231 ... first partition, 232 ... second partition, 233 ... third partition, 234 ... fourth partition, 235 ... fifth partition, 241 ... front cover, 242 ... side cover, 243 ... Side cover, 244 ... Rear cover, 245 ... Top cover, 25 ... Conveying unit, 26 ... Attitude detection unit, 261 ... Light emitting unit, 262 ... Light receiving unit, 27 ... Connecting unit, 90 ... IC device, 90A ... IC device, 90B ... IC device 200 ... Tray 300 ... Monitor 301 ... Display screen 400 ... Signal lamp 500 ... Speaker 60 ... Mouse stand, 700 ... Operation panel, 800 ... Control unit, 801 ... Processor, 802 ... Memory, 900A ... First tester, 900B ... Second tester, A1 ... Tray supply area, A2 ... Device supply area, A3 ... Inspection area , A3-1 ... first region, A3-2 ... second region, A4 ... device collection area, A5 ... tray removal region, L _{26 ...} light, alpha _{11A ...} arrows, alpha _{11B ...} arrows, alpha _{13X ...} arrows, alpha _13Y ... arrow, α ₁₄ ... arrow, α ₁₅ ... arrow, α _17Y ... arrow, α ₁₈ ... arrow, α _20X ... arrow, α _20Y ... arrow, α ₂₁ ... arrow, α _22A ... arrow, α _22B ... arrow, α ₉₀ ... arrow

Claims (5)

An electronic component transport apparatus capable of placing a placement member on which an electronic component is placed,
A transport unit for transporting the electronic component;
A first region in which the electronic component is placed and a first inspection unit that performs a first inspection on the electronic component is disposed;
A second region on which the electronic component is placed and a second inspection unit that performs a second inspection different from the first inspection is disposed on the electronic component;
The transport unit grips the electronic component and sequentially places the electronic component on the first inspection unit and the second inspection unit, and the electronic after the first inspection and the second inspection are performed. An electronic component conveying apparatus comprising: a collection unit for placing the component on the placing member.   The electronic component conveying apparatus according to claim 1, wherein the conveying unit includes a moving placement unit that is supported to move and on which the electronic component is placed. The first inspection unit is fixed in the first region,
The second inspection unit is fixed in the second region,
The gripping unit is supported so as to move in a direction crossing the moving direction of the moving mounting unit, grips the electronic component, and moves from the moving mounting unit to the first inspection unit and the moving mounting unit. The electronic component conveying device according to claim 2, wherein the electronic component conveying device is placed in the order of the second inspection unit. The moving mounting unit includes a first moving mounting unit and a second moving mounting unit arranged side by side in the moving direction of the moving mounting unit,
The gripping portion includes a first gripping portion and a second gripping portion that are arranged side by side in the moving direction of the moving placement portion,
The first gripping unit places the electronic component in the order of the first moving placement unit, the first inspection unit, and the second moving placement unit,
The electronic component transport apparatus according to claim 3, wherein the second gripping unit places the electronic component on the second inspection unit from the second moving placement unit. An electronic component inspection apparatus capable of arranging a placement member on which an electronic component is placed,
A transport unit for transporting the electronic component;
A first inspection unit on which the electronic component is mounted and performs a first inspection on the electronic component;
A first region in which the first inspection unit is disposed;
A second inspection unit on which the electronic component is mounted and performs a second inspection different from the first inspection on the electronic component;
A second region in which the second inspection unit is disposed,
The transport unit grips the electronic component and sequentially places the electronic component on the first inspection unit and the second inspection unit, and the electronic after the first inspection and the second inspection are performed. An electronic component inspection apparatus, comprising: a recovery unit that mounts the component on the mounting member.

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