TW201813133A - LED packaging device and packaging method thereof capable of preventing electricity jumping causing short-circuiting - Google Patents

Abstract

The invention provides an LED packaging device and packaging method thereof. The packaging device comprises a metal substrate that is arranged and attached with a plurality of LED dies on the front surface; an insulation layer disposed on the front surface of the metal substrate and having an appropriate thickness, which is arranged thereon with a plurality of through holes corresponding to the plurality of LED dies one on one; an electrode layer formed on the front surface of the insulation layer for externally connecting to a power source; multiple sets of bonding wires which are electrically connected between the electrode of each LED die and the electrode layer, respectively; and, a plurality of lenses, each of which is correspondingly formed and filled in each through hole for covering each LED die. In which, the electrode of each LED die is lower than the electrode layer, such that a height difference is formed between the electrode and the electrode layer as a barrier for preventing electricity jumping. Thus, the packaging device is suitable for direct external connection to an AC power source, such as 110V or 120V, for enhancing the utilization efficiency of the packaging device. Moreover, the present invention may effectively control the amount of resin used for manufacturing the lens, so as to simplify the manufacturing process of the lens and reduce the manufacturing cost.

Description

   Light emitting diode packaging device and packaging method   

The present invention relates to a light-emitting diode packaging device and a packaging method thereof, and more particularly to a LED die set on a metal substrate correspondingly disposed in a through hole of an insulating layer to make the LED die The electrode is lower than the electrode layer to form a height drop for preventing short circuit caused by electric jump.

Conventional LED package devices generally include: a heat-dissipating substrate, an insulating layer, a chip-type LED light-emitting chip, metal electrodes, and lenses, wherein each LED die can choose a flip-chip method according to the needs of the process (Flip Chip or wire bond, but is not limited to be electrically connected to a heat sink substrate to complete an LED package; the LED package is then connected to a heat sink fixed in a light emitting device On the surface, an LED light emitting device is formed. Generally, a conventional heat dissipation substrate is formed by sequentially laminating a circuit layer (copper layer), an insulating layer, and a substrate (such as an aluminum substrate or a ceramic substrate). When the LED die emits light, heat energy is generated. The heat energy is generally used to dissipate heat through the heat sink substrate and the heat sink of the connected light emitting device, so as to avoid excessive heat energy accumulation that may affect the LED package or Use efficiency and life of LED lighting device.

However, in the related fields such as LED packaging or used heat-dissipating carrier boards or LED light-emitting devices, there has been a long history of how to prevent electrical jumps (electrical jumpers are directly isolated from each other because the distance between different electrodes is too close). Cause short circuit; in particular, the conventional LED packages are designed for low voltage or low current, making the LED package device not suitable for direct external AC power supply such as 110V or 220V, so a transformer or transformer device must be added to the circuit design , Which relatively reduces the use efficiency of the packaging device and increases the manufacturing cost. Therefore, how to make the LED package device achieve a good heat dissipation effect and effectively overcome the problem of power jump is the main subject of the present invention.

In the technical field of LED packages and the heat dissipation substrates they use, there are currently a variety of previous technologies, such as US6,914,268, US8,049,230, US7,985,979, US7,939,832, US7,713,353, US7,642,121, US7,462,861 , US 7,393,411, US 7,335,519, US 7,294,866, US 7,087,526, and the like. However, when each LED die is selected to be electrically connected to a heat-dissipating substrate by a wire bond method, the above-mentioned prior art does not propose an effective solution to overcome the problem that the bonding wires in the wire method are liable to be caused by high voltage. And the problem of short circuit occurred.

It can be known from the above that the structure of the foregoing prior art is still difficult to meet the requirements in practical use, so there is still a need for further improvement in the related field of LED packaging. The present invention proposes a light-emitting diode packaging device and a packaging method thereof in the field where the space for technological development is limited, so that the LED package can avoid the trouble of short circuit caused by power jump.

The main object of the present invention is to provide a light emitting diode (LED) packaging device and a packaging method thereof. The LED packaging device includes a metal substrate, an insulating layer, an electrode layer, a plurality of LED dies, a plurality of sets of bonding wires, And a plurality of lenses, wherein each LED die set on the metal substrate is correspondingly provided in a through hole of an insulating layer, so that the electrode of each LED die can be lower than the electrode layer to form a height difference, So that the LED package can solve the problem of short circuit caused by power jump.

In order to achieve the above object, a preferred embodiment of the LED packaging device of the present invention includes: a metal substrate which is arranged on the front side and attached with a plurality of LED dies; an insulating layer having an appropriate thickness and disposed on the metal substrate; On the front side, a plurality of through holes are arranged on the front side to correspond to the LED dice; an electrode layer is formed on the front side of the insulating layer for external power connection; a plurality of sets of bonding wires The electrodes are electrically connected between the electrodes of each LED die and the electrode layer; and a plurality of lenses are respectively correspondingly formed and filled through holes for covering each LED die; wherein the electrodes of each LED die It is lower than the electrode layer so as to form a high drop between the two as a barrier to prevent electrical jumps, so that the packaging device can be suitable for direct external AC power supply such as 110V or 220V to improve the efficiency of the packaging device. , And can effectively control the amount of resin used to make the lens.

To achieve the above object, the light emitting diode packaging method of the present invention includes the following steps:

Step 1: A metal substrate is provided, and a plurality of LED dies are arranged and bonded on the front surface thereof.

Step 2: An insulating layer is provided, which has a thickness and a plurality of through-holes are arranged thereon to correspond to the LED dies one-to-one.

Step 3: Provide an electrode layer, which is formed on the front side of the insulating layer for external power supply, wherein the electrode layer includes a plurality of electrode groups consisting of a positive electrode and a negative electrode, and each electrode group is arranged and distributed on the Near the periphery of each through hole.

Step 4: The insulating layer having the electrode layer is bonded and disposed on the front surface 11 of the metal substrate, so that each LED die can be accommodated in a through hole of the insulating layer respectively.

Step 5: Making multiple sets of bonding wires, wherein each set of bonding wires is electrically connected between the electrode provided on the front side of each LED die and the corresponding electrode group, so as to provide power to each LED die. .

Step 6: making a plurality of lenses, wherein each lens is respectively formed correspondingly and filled in each through hole for covering each LED die.

10‧‧‧ metal substrate

11‧‧‧ positive

12‧‧‧ back

20‧‧‧ Insulation

21‧‧‧ Positive

22‧‧‧ back

23‧‧‧Through Hole

24‧‧‧ peripheral location

30‧‧‧ electrode layer

31‧‧‧electrode set

40‧‧‧LED die

41‧‧‧ Positive

42‧‧‧ electrode

50‧‧‧ bonding wire

60‧‧‧ lens

FIG. 1 is a schematic structural cross-sectional view of an embodiment of a light emitting diode packaging device according to the present invention.

FIG. 2 is a schematic structural view of an upper surface of an insulating layer in an embodiment of a light emitting diode packaging device according to the present invention.

FIG. 3 is a schematic cross-sectional view taken along the line 3-3 in FIG. 2. .

FIG. 4 is a schematic top view structure of an embodiment of a light emitting diode packaging device according to the present invention.

FIG. 5 is a schematic diagram of actual manufacturing dimensions of an embodiment of the light emitting diode packaging device of the present invention.

In order to make the present invention clearer and more detailed, the preferred embodiments and the following figures are listed, and the structure and technical features of the present invention will be described in detail as follows: Referring to Figures 1-5, the present invention provides a light-emitting diode The polar package device includes a metal substrate 10, an insulating layer 20, an electrode layer 30, a plurality of LED dies 40, a plurality of sets of bonding wires 50, and a plurality of lenses 60.

The metal substrate 10 has a front surface 11 and an opposite rear surface 12.

The insulating layer 20 has a thickness and is disposed on the front surface 11 of the metal substrate 10. A plurality of through holes 23 are formed on the front surface 21 and the back surface 22 of the insulating layer 20. The plurality of through holes 23 are An array is provided on the insulating layer 20. In an embodiment of the present invention, the thickness of the insulating layer 20 is greater than or equal to 0.5 mm and less than or equal to 2.5 mm; wherein the diameter of the through hole 23 is greater than or equal to 1.2 mm and less than or equal to 1.45 mm; The distance between the two through holes 23, that is, the distance between one of the through holes 23 and the edge of two adjacent through holes 23 is greater than or equal to 0.12 mm, but the above dimensions are not intended to limit the present invention.

The electrode layer 30 is formed on the front surface 21 of the insulating layer 20 for external power supply. The electrode layer 30 includes a plurality of electrode groups 31 composed of a positive electrode and a negative electrode, and each electrode group 31 is arranged near The peripheral position 24 of each through hole 23 is shown in Figs. 1 and 4.

The plurality of LED dies 40 are distributed on the front surface 11 of the metal substrate 10, and each of the LED dies 40 is respectively accommodated in a through hole 23 of the insulating layer 20 and corresponds to the electrode layer 30. An electrode group 31 is provided at the peripheral position 24 of the through hole 23; the front surface 41 of each LED die 40 is lower than the corresponding electrode group 31, so that a height difference can be formed between the two as shown in FIG. 1 As shown, this is the main feature of the present invention.

Among the plurality of sets of bonding wires 50, each group of bonding wires 50 includes two bonding wires 50, and the two bonding wires 50 are respectively electrically connected to an electrode 42 provided on the front surface 41 of each LED die 40 and a corresponding one of them. Between the electrode groups 31, the bonding wires 50 can be used to provide power to the LED dies 40.

Among the plurality of lenses 60, each lens 60 is formed correspondingly and filled in each of the through holes 23, and is used for covering the LED dies 40.

In an embodiment of the present invention, when the diameter of the through hole 23 is equal to or close to 1.2 mm, the external power source connected to the electrode layer 30 may be 110V; and when the diameter of the through hole 23 is equal to approximately 1.45 mm, The power source externally connected to the electrode layer 30 may be 220V.

In one embodiment of the present invention, a material of the insulating layer 20 is an epoxy glass cloth substrate FR4. FR4 is a code defined by the NEMA-Nationl Electrical Manufacturers Association, where the meaning of FR stands for the addition of non-flammable substances to make the PCB board have Flame Retardent or Flame Resistance For example, FR1 uses a paper substrate, while FR4 uses a glass cloth substrate.

In an embodiment of the present invention, as shown in FIG. 5, the light-emitting diode packaging device of the present invention is formed by using a metal substrate 10 and an insulating layer 20 with a length of 32 mm and a width of 26 mm. There are seven through holes 23 (LED die 40) in the vertical direction to form an array, that is, there are seventy through holes 23 (LED die 40) in total, and the vertical spacing of two through holes 23 (LED die 40) can be It is 2.7mm, and the lateral distance between the through holes 23 (LED die 40) may be 2.6mm, but the above dimensions are not intended to limit the present invention.

Referring to Figures 1-4, the present invention further provides a light emitting diode packaging method, including the following steps:

Step 1: A metal substrate 10 is provided, and a plurality of LED dies 40 are arranged and bonded on the front surface 11 thereof.

Step 2: An insulating layer 20 is provided, which has a thickness, and a plurality of through-holes 23 are arranged thereon to correspond to the LED dies 40 one-to-one.

Step 3: Provide an electrode layer 30, which is fabricated on the front surface 21 of the insulating layer 20 for external power supply. The electrode layer 30 includes a plurality of electrode groups 31 composed of a positive electrode and a negative electrode, and each electrode group The 31 series is arranged near the peripheral position 24 of each through hole 23.

Step 4: Laminating the insulating layer 20 having the electrode layer 30 on the front surface 11 of the metal substrate 10, so that each LED die 40 can be accommodated in one of the through holes 23 of the insulating layer 20 respectively. bottom of.

Step 5: Making multiple sets of bonding wires 50, wherein each group of bonding wires 50 is electrically connected between the electrode 42 provided on the front surface 41 of each LED die 40 and the corresponding electrode group 31 for borrowing Each bonding wire 50 supplies electric power for light emission to each LED die 40.

Step 6: A plurality of lenses 60 are fabricated, wherein each lens 60 is respectively formed correspondingly and filled in each through hole 23 for covering and encapsulating each LED die 40.

In addition, as shown in FIGS. 4 and 5, the circuit pattern of the electrode layer 30 includes the layout of a plurality of groups of electrode groups 31 and the electrical connection lines between the electrode groups 31. Those who can achieve the existing circuit design technology will not repeat them here.

In addition, as shown in FIG. 1, each lens 60 is formed correspondingly and filled in each through hole 23 for covering and encapsulating each LED die 40. Due to the size and volume of each through hole 23 such as the circle diameter and depth All are set, so when making the lens, the amount of resin used to make the lens 60 can be effectively controlled in advance, so that the amount of ingredients (such as the percentage of light mixing ingredients) mixed in the amount of resin can be more effectively controlled. Concentration), which is helpful to simplify the lens manufacturing process and reduce manufacturing costs.

The above descriptions are merely preferred embodiments of the present invention, and are only illustrative, not restrictive, for those skilled in the art. Those skilled in the art understand that they can be modified within the spirit and scope defined by the claims of the present invention. Many changes, modifications, and even equivalent changes will be made, but all will fall into the protection scope of the present invention.

Claims (8)

    A light-emitting diode packaging device includes: a metal substrate having a front surface and an opposite back surface; an insulating layer having a thickness and provided on the front surface of the metal substrate, and having a plurality of through-insulations provided thereon A through hole 23 on the front and back of the layer; an electrode layer which is fabricated on the front of the insulating layer for external power supply, the electrode layer includes a plurality of electrode groups consisting of a positive electrode and a negative electrode, and each electrode group The LED chips are arranged near the periphery of each through hole; a plurality of LED chips are distributed on the front surface of the metal substrate, wherein each LED chip is respectively accommodated in a through hole of the insulating layer and Corresponding to an electrode group provided in the electrode layer at the peripheral edge position of the through hole, wherein the front face of each LED die is lower than the corresponding electrode group so that the front face of each LED die and the corresponding electrode group There is a height drop between them; multiple sets of bonding wires, where each group of bonding wires includes two bonding wires, and the two bonding wires are respectively electrically connected to an electrode provided on the front surface of each LED die and a corresponding electrode group between For each of the LED dies may be provided for emitting electric energy; and a plurality of lenses, wherein each lens and full lines respectively formed corresponding to the respective through holes for use in encapsulating each LED die.         The light emitting diode packaging device according to claim 1, wherein the plurality of through holes are arranged on the insulating layer in an array manner.         The light emitting diode packaging device according to claim 1, wherein the thickness of the insulating layer is greater than or equal to 0.5 mm and less than or equal to 2.5 mm.         The light emitting diode packaging device according to claim 1, wherein a diameter of the through hole is greater than or equal to 1.2 mm and less than or equal to 1.45 mm.         The light-emitting diode packaging device according to claim 4, wherein when the diameter of the through hole is equal to or close to 1.2 mm, the power source connected to the electrode layer is 110 V; and when the diameter of the through hole is equal to or close to 1.45 mm At this time, the external power supply of this electrode layer is 220V.         The light emitting diode packaging device according to claim 1, wherein a distance between the two through holes is greater than or equal to 0.12 mm.         The light emitting diode packaging device according to claim 1, wherein the material of the insulating layer is an epoxy glass cloth substrate FR4.         A light emitting diode packaging method includes the following steps: step 1: providing a metal substrate, and arranging and bonding a plurality of LED dies on its front surface; step 2: providing an insulating layer having a thickness above A plurality of through-holes are arranged in a row to correspond to the LED dies one by one; Step 3: Provide an electrode layer, which is fabricated and formed on the front surface of the insulating layer for external power supply, wherein the electrode layer contains A plurality of electrode groups composed of a positive electrode and a negative electrode, and each electrode group is arranged to be distributed near the peripheral position of each through hole; Step 4: The insulating layer having the electrode layer is attached to the metal substrate. On the front side, so that each LED die can be respectively accommodated in a through hole of the insulating layer; step 5: making multiple sets of bonding wires, wherein each set of bonding wires is electrically connected to each LED die Between the electrode provided on the front side and the corresponding electrode group, the LED chip can be used to provide electric energy for light emission; and Step 6: making a plurality of lenses, wherein each lens is correspondingly formed and filled in each through hole For packaging individual LEDs Grain.