TWI624082B - Light-emitting diode package device and packaging method thereof - Google Patents

Abstract

A light emitting diode (LED) packaging device and a packaging method thereof, the packaging device comprising: a metal substrate arranged on a front surface and disposed with a plurality of LED dies; an insulating layer disposed on a front surface of the metal substrate And having a suitable thickness, and a plurality of through holes are arranged on the one-to-one corresponding to the plurality of LED dies; an electrode layer is formed on the front surface of the insulating layer for external connection power; The bonding wires are respectively electrically connected between the electrodes of the LED dies and the electrode layer; and the plurality of lenses are respectively formed correspondingly and fill the respective holes for covering the LED dies; wherein each LED crystal The electrode of the particle is lower than the electrode layer to form a height difference between the two for use as a barrier against power jump, so that the package device is suitable for direct external AC power source such as 110V or 220V to enhance the package device. The use efficiency, and can effectively control the amount of resin used to make the lens to simplify the lens process and reduce the manufacturing cost.

Description

Light-emitting diode package device and packaging method thereof

The present invention relates to a light emitting diode package device and a packaging method thereof, and more particularly to a LED chip disposed on a metal substrate correspondingly disposed in a constant hole of an insulating layer for making each LED die The electrode is lower than the electrode layer to form a height drop for preventing a short circuit caused by a power jump.

The LED package device generally comprises: a heat dissipation substrate, an insulation layer, a chip LED light emitting chip, a metal electrode, and a lens, wherein each LED die can be flip chip type according to process requirements (Flip) Chip) or wire bond (wire bond) but not limited to electrically connected to a heat dissipation substrate to complete an LED package; the LED package is further connected to a heat sink of a light-emitting device On the surface, an LED light-emitting device is formed. Generally, the conventional heat-dissipating substrate is formed by sequentially pressing a circuit layer (copper layer), an insulating layer, and a substrate (such as an aluminum substrate or a ceramic substrate). When the LED dies are illuminating, heat energy is generated, and the heat is generally dissipated by the heat sink of the heat dissipating substrate and the connected illuminating device, so as to avoid excessive heat energy to affect the LED package or the LED. The efficiency and longevity of the illuminating device.

However, in the related fields such as LED packaging or the use of heat-dissipating carriers or LED lighting devices, there has been a long-standing prevention of power jumps (due to the close distance between different electrodes) Separate the air-electric jumper) to avoid short circuit; in particular, the conventional LED package is designed for low voltage or low current, so that the LED package device cannot be applied to a direct external AC power source such as 110V or 220V, so the line is A transformer or a transformer device must be added to the design to reduce the efficiency of the package and increase the manufacturing cost. Therefore, how to make the LED package device achieve good heat dissipation and effectively overcome the problem of power jump is the main subject of the present invention.

There are a number of prior art in the art of LED packages and the heat sinking substrates therefor, such as US 6,914,268, US 8,049,230, US 7,985,979, US 7,939,832, US 7,713,353, US 7,642,121, US 7,462,861 US 7,393,411, US 7,335,519, US 7,294,866, US 7,087,526, and the like. However, when each of the LED dies is selectively electrically connected to a heat dissipating substrate by a wire bond, the prior art does not provide an effective solution to overcome the problem that the bonding wires in the wire mode are easily exposed to high voltage. The problem of short circuit in the event of a jump.

It can be seen from the above that the structure of the above prior art is still difficult to meet the requirements in actual use, and therefore there is still a need for further improvement in the related field of LED packaging. The invention provides a light emitting diode package device and a packaging method thereof in the field of limited development of the technology, so that the LED package can avoid the short circuit caused by the power jump.

The main purpose of the present invention is to provide a light emitting diode (LED) packaging device and a packaging method thereof, the LED packaging device comprising a metal substrate, an insulating layer, an electrode layer, a plurality of LED dies, a plurality of sets of bonding wires, And a plurality of lenses, wherein each of the LED dies arranged on the metal substrate is disposed in a consistent hole of the insulating layer, so that the electrodes of the LED dies can be lower than the electrode layer to form a height difference, So that the LED package can solve the problem of short circuit caused by power jump.

In order to achieve the above object, a preferred embodiment of the LED package device of the present invention comprises: a metal substrate which is arranged on the front surface and is provided with a plurality of LED dies; an insulating layer having a suitable thickness and disposed on the metal substrate a plurality of through holes arranged in a one-to-one correspondence with the plurality of LED dies on the front surface; an electrode layer formed on the front surface of the insulating layer for externally connecting the power source; and a plurality of sets of bonding wires Electrically connected between the electrodes of the LED dies and the electrode layer; and a plurality of lenses respectively correspondingly formed and filled with the respective holes for covering the LED dies; wherein the electrodes of the LED dies It is lower than the electrode layer to form a height difference between the two as a barrier against power jump, so that the package device can be applied to a direct external AC power source such as 110V or 220V to improve the efficiency of the package device. And can effectively control the amount of resin used to make the lens.

In order to achieve the above object, the LED package method of the present invention comprises the following steps:

Step 1: A metal substrate is provided, and a plurality of LED dies are arranged and attached on the front surface thereof.

Step 2: providing an insulating layer having a thickness, wherein a plurality of through holes are arranged to correspond one-to-one to the plurality of LED dies.

Step 3: providing an electrode layer formed on the front surface of the insulating layer for external power supply, wherein the electrode layer comprises a plurality of sets of electrodes consisting of a positive electrode and a negative electrode, and each electrode group is arranged to be distributed Close to the peripheral position of each through hole.

Step 4: The insulating layer having the electrode layer is disposed on the front surface 11 of the metal substrate so that the LED dies can be respectively accommodated in the consistent holes of the insulating layer.

Step 5: Making a plurality of sets of bonding wires, wherein each group of bonding wires is electrically The connection is provided between the electrode disposed on the front surface of each LED die and the corresponding electrode group for supplying electric energy to each LED die.

Step 6: Making a plurality of lenses, wherein each lens system is correspondingly formed and filled in each of the through holes for covering each of the LED dies.

10‧‧‧Metal substrate

11‧‧‧ positive

12‧‧‧ Back

20‧‧‧Insulation

21‧‧‧ positive

22‧‧‧ Back

23‧‧‧Tongkong

24‧‧‧ Peripheral position

30‧‧‧electrode layer

31‧‧‧Electrode group

40‧‧‧LED dies

41‧‧‧ positive

42‧‧‧Electrode

50‧‧‧Connected wire

60‧‧‧ lens

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing the structure of an embodiment of a light-emitting diode package device of the present invention.

2 is a schematic view showing the structure of the insulating layer in an embodiment of the light-emitting diode package device of the present invention.

Figure 3 is a schematic cross-sectional view of section line 3-3 in Figure 2. .

Fig. 4 is a top plan view showing an embodiment of a light emitting diode package device of the present invention.

Fig. 5 is a schematic view showing the actual fabrication dimensions of an embodiment of the light-emitting diode package device of the present invention.

In order to make the present invention more clear and detailed, the preferred embodiment and the following drawings are used to describe the structure and technical features of the present invention as follows: Referring to Figures 1-5, the present invention provides a luminous second. The polar body package includes a metal substrate 10, an insulating layer 20, an electrode layer 30, a plurality of LED dies 40, a plurality of sets of bonding wires 50, and a plurality of lenses 60.

The metal substrate 10 has a front surface 11 and a counter back surface 12.

The insulating layer 20 has a thickness and is disposed on the front surface 11 of the metal substrate 10, and has a plurality of through holes 23 extending through the front surface 21 and the back surface 22 of the insulating layer 20; wherein the plurality of through holes 23 are The insulating layer 20 is provided in an array. In an embodiment of the invention, wherein the insulation The thickness of the layer 20 is greater than or equal to 0.5 mm and less than or equal to 2.5 mm; wherein the diameter of the through hole 23 is greater than or equal to 1.2 mm and less than or equal to 1.45 mm; wherein the spacing between the two through holes 23, ie The distance between the hole 23 and the edge of the adjacent hole 23 is greater than or equal to 0.12 mm, but the above dimensions are not intended to limit the present invention.

The electrode layer 30 is formed on the front surface 21 of the insulating layer 20 for external power supply. The electrode layer 30 includes a plurality of sets of electrode groups 31 composed of a positive electrode and a negative electrode, and the electrode groups 31 are arranged to be arranged close to each other. The peripheral position 24 of each of the through holes 23 is as shown in Figs.

The plurality of LED dies 40 are disposed on the front surface 11 of the metal substrate 10. The LED dies 40 are respectively received in the common holes 23 of the insulating layer 20 and correspond to the electrode layers 30, respectively. The electrode group 31 is disposed at a peripheral position 24 of the through hole 23; wherein the front surface 41 of each LED die 40 is lower than the corresponding electrode group 31, thereby forming a height difference between the two as shown in FIG. As shown, this is a primary feature of the invention.

In the plurality of sets of bonding wires 50, each set of bonding wires 50 includes two bonding wires 50, which are electrically connected to the electrodes 42 provided on the front surface 41 of each LED die 40 and corresponding thereto. Between the electrode sets 31, the bonding wires 50 can be used to supply electrical energy to the respective LED dies 40.

In the plurality of lenses 60, the lenses 60 are respectively formed correspondingly and filled in the respective through holes 23 for covering the respective LED dies 40.

In an embodiment of the invention, when the diameter of the through hole 23 is equal to or close to 1.2 mm, the power source external to the electrode layer 30 may be 110V; wherein when the diameter of the through hole 23 is equal to 1.45 mm, The power source external to the electrode layer 30 can be 220V.

In an embodiment of the invention, the insulating layer 20 is made of epoxy glass Glass cloth substrate FR4. FR4 is a code defined by the NEMA-National Electrical Manufacturers Association. The meaning of ER is to add a material that is not easy to catch fire to make the PCB board flame retardant or Flame Resistance. For example, FR1 uses a paper substrate, while FR4 uses a glass cloth substrate.

In an embodiment of the present invention, as shown in FIG. 5, the light-emitting diode package device of the present invention is composed of a metal substrate 10 having a length of 32 mm and a width of 26 mm, and an insulating layer 20, which is provided with ten horizontally There are seven through holes 23 (LED dies 40) in the longitudinal direction to form an array, that is, there are a total of seventy through holes 23 (LED dies 40), wherein the longitudinal spacing of the two through holes 23 (LED dies 40) can be It is 2.7 mm, and the lateral spacing of the two through holes 23 (LED dies 40) can be 2.6 mm, but the above dimensions are not intended to limit the present invention.

Referring to Figures 1-4, the present invention further provides a light emitting diode packaging method comprising the following steps:

Step 1: A metal substrate 10 is provided, and a plurality of LED dies 40 are arranged and attached on the front surface 11 thereof.

Step 2: An insulating layer 20 is provided having a thickness on which a plurality of through holes 23 are arranged to correspond one-to-one to the plurality of LED dies 40.

Step 3: providing an electrode layer 30, which is formed on the front surface 21 of the insulating layer 20 for external power supply, wherein the electrode layer 30 includes a plurality of sets of electrode groups 31 composed of a positive electrode and a negative electrode, and each electrode group The 31 series are arranged to be distributed near the peripheral position 24 of each of the through holes 23.

Step 4: The insulating layer 20 having the electrode layer 30 is disposed on the front surface 11 of the metal substrate 10 so that the LED dies 40 can be respectively received in the consistent holes 23 of the insulating layer 20. bottom of.

Step 5: Manufacture a plurality of sets of bonding wires 50, wherein each of the bonding wires 50 is electrically connected between the electrode 42 disposed on the front surface 41 of each LED die 40 and the corresponding electrode group 31 for Each of the bonding wires 50 supplies electric energy for light emission to each of the LED dies 40.

Step 6: A plurality of lenses 60 are formed, wherein each lens 60 is correspondingly formed and filled in each of the through holes 23 for covering and packaging each of the LED dies 40.

Further, as shown in FIGS. 4 and 5, the wiring pattern of the electrode layer 30 includes a layout of a plurality of sets of electrode groups 31 and an electrical connection line between the electrode groups 31, but for the purpose of the present invention, it is utilized. The existing circuit design technology can be achieved, so it will not be described here.

In addition, as shown in FIG. 1 , each of the lenses 60 is formed correspondingly and filled in each of the through holes 23 for covering and encapsulating the LED dies 40 , because the size and volume of each of the through holes 23 is as small as a circle and a depth. All of them have been set, so that when the lens is formed, the amount of resin used to make the lens 60 can be effectively controlled in advance, thereby more effectively controlling the amount of ingredients mixed in the amount of the resin (for example, the percentage of ingredients for light mixing) Concentration), which is advantageous for simplifying the lens process and reducing the manufacturing cost.

The above is only the preferred embodiments of the present invention, and is intended to be illustrative, and not restrictive, and it is understood by those of ordinary skill in the art that Many changes, modifications, and even equivalents may be made without departing from the scope of the invention.

Claims (1)

A light emitting diode package device comprising: a metal substrate having a front surface and a back surface; an insulating layer having a thickness and disposed on a front surface of the metal substrate, wherein the plurality of insulating layers are provided The front and back of the layer; the insulating layer is made of epoxy glass cloth substrate FR4; an electrode layer is formed on the front surface of the insulating layer for external power supply, the electrode layer comprises a plurality of groups from a positive electrode And an electrode group composed of a negative electrode, and each electrode group is arranged to be distributed near a periphery of each of the through holes; a plurality of LED dies are arranged on the front surface of the metal substrate, wherein each LED chip is separately Correspondingly disposed in the consistent holes of the insulating layer and respectively corresponding to one of the electrode layers disposed at a peripheral position of the through hole, wherein the front surface of each LED die is lower than the corresponding electrode group to enable Forming a height difference between the front surface of each of the LED dies and the corresponding electrode group; a plurality of sets of bonding wires, wherein each of the bonding wires comprises two bonding wires, the two bonding wires are electrically connected to each of the LED dies Positive Between the electrode and the corresponding electrode group, for providing energy for illuminating each LED ray; and a plurality of lenses, wherein each lens system is respectively formed and filled in each of the through holes for encapsulating each LED crystal a particle; wherein the thickness of the insulating layer is greater than or equal to 0.5 mm and less than or equal to 2.5 mm; wherein the diameter of the through hole is greater than or equal to 1.2 mm and less than or equal to 1.45 mm; wherein when the diameter of the through hole is equal to or close to 1.2mm, the external power supply of the electrode layer is 110V; When the diameter of the through hole is equal to or close to 1.45 mm, the external power supply of the electrode layer is 220V; wherein the spacing between the two through holes is greater than or equal to 0.12 mm; wherein the light emitting diode is packaged The method includes the following steps: Step 1: providing a metal substrate, arranging and affixing a plurality of LED dies on the front surface thereof; Step 2: providing an insulating layer having a thickness, and arranging a plurality of penetrating thereon The through holes correspond to the plurality of LED dies in a one-to-one manner; Step 3: providing an electrode layer formed on the front surface of the insulating layer for external power supply, wherein the electrode layer comprises a plurality of groups consisting of a positive electrode and a positive electrode An electrode group composed of a negative electrode, and each electrode group is arranged to be distributed near a peripheral edge of each of the through holes; Step 4: affixing the insulating layer having the electrode layer on the front surface of the metal substrate so that each The LED dies can be respectively disposed in the corresponding holes of the insulating layer; Step 5: Manufacture a plurality of sets of bonding wires, wherein each of the bonding wires is electrically connected to the electrodes disposed on the front surface of each LED dies Corresponding electrode group For electrical energy may be provided for each light emitting LED dies; and Step 6: making a plurality of lenses, wherein each lens and full lines respectively formed corresponding to the respective through hole for encapsulating each LED die.