CN203026556U - Light emitting diode (LED) device - Google Patents
Light emitting diode (LED) device Download PDFInfo
- Publication number
- CN203026556U CN203026556U CN 201220638693 CN201220638693U CN203026556U CN 203026556 U CN203026556 U CN 203026556U CN 201220638693 CN201220638693 CN 201220638693 CN 201220638693 U CN201220638693 U CN 201220638693U CN 203026556 U CN203026556 U CN 203026556U
- Authority
- CN
- China
- Prior art keywords
- emitting diode
- light
- substrate
- backlight unit
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 230000004888 barrier function Effects 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 5
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 238000003466 welding Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000002146 bilateral effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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Abstract
The utility model discloses a light emitting diode (LED) device. The LED device comprises a substrate, a bracket, a plurality of LED chips and a fluorescent adhesive, wherein an insulating layer and a conducting layer arranged on the insulating layer are arranged on the substrate, the conducting layer is electrically connected with an external electronic circuit through a plurality of conducting electrodes, an inwardly concave opening is formed in the bracket, a bowl/cup-shaped structure of the LED device is formed in a manner that the bracket is matched with the substrate, the LED chips are arranged on the substrate and are electrically connected with the conducting layer, and the fluorescent adhesive covers the LED chips and is filled in the bowl/cup-shaped structure of the LED device; and the substrate is square, the conducting electrodes correspond to the LED chips, the LED chips are electrically connected with the conducting electrodes, and the conducting electrodes are arranged around the square substrate. The LED device disclosed by the utility model has the advantages of good heat dissipating effect and high reliability.
Description
Technical field
The utility model relates to light-emitting diode assembly, especially relates to a kind of perfect heat-dissipating, the light-emitting diode assembly that reliability is high.
Background technology
Light-emitting diode (Light Emitting Diode, LED) is as a kind of green light source, has that luminous efficiency is high, power consumption is few, a long service life, safe and reliable and environmentally friendly advantage, is widely used in illumination and field of backlights.Along with the development of science and technology, people are also more and more higher to the requirement of light-emitting diode assembly, and miniaturization, high brightness and high reliability become the development trend of LED.
Along with the raising with brightness dwindled of size, light-emitting diode outer electrode pin number of pads increases, the area reducing of pin pad.The LED of routine techniques, electrode pin is arranged on substrate both sides, the design of this bilateral pin is along with the increase of both sides pin number, Distance Shortened between pin, bonding pad area reduces, cause the firm welding degree to reduce, area of dissipation reduces and easily cause short circuit in welding process, has affected heat radiation and the reliability of LED matrix.
Therefore, be necessary to propose a kind of improvement, to overcome defects.
The utility model content
Technical problem to be solved in the utility model is to provide a kind of good heat dissipation effect, the light-emitting diode assembly that reliability is high.
To achieve these goals, the utility model is by the following technical solutions: a kind of light-emitting diode assembly, comprise: substrate, be provided with insulating barrier on described substrate and be arranged on conductive layer on described insulating barrier, described conductive layer is electrically connected to external electronic circuits by conductive electrode; Support, described support form the indent opening and coordinate with described substrate and form described light-emitting diode assembly bowl cup structure; Light-emitting diode chip for backlight unit, described light-emitting diode chip for backlight unit are arranged on described substrate, and described light-emitting diode chip for backlight unit is electrically connected to described conductive layer; Fluorescent glue, described fluorescent glue coats described light-emitting diode chip for backlight unit, and fills described light-emitting diode bowl cup structure; And: described substrate is square substrate, and described light-emitting diode chip for backlight unit is a plurality of, and described conductive electrode corresponds to a plurality of, and described a plurality of light-emitting diode chip for backlight unit are electrically connected to a plurality of described conductive electrodes, and described square substrate four limits are provided with described conductive electrode.
As a kind of refinement technology scheme, described square substrate three limits are provided with anode electrode, Yi Bian described square substrate residue is provided with negative electrode.
As a kind of refinement technology scheme, described square substrate three limits are provided with negative electrode, Yi Bian described square substrate residue is provided with anode electrode.
As a kind of refinement technology scheme, the described a plurality of conductive electrode both positive and negative polarities that are arranged at described square substrate four limits are corresponding one by one.
The utility model light-emitting diode assembly, substrate four limits are provided with electrode pin, under the prerequisite of same size, have increased the distance of pin number, pin bonding pad area and pin pad.The increase of pin bonding pad area has improved the firmness of welding, has improved simultaneously radiating effect; The increase of pin pad pitch effectively reduces the generation of pin short circuit in pin pad welding process, has improved the reliability of light-emitting diode.Therefore, the utility model light-emitting diode has good heat dissipation effect, the advantage that reliability is high.
Description of drawings
Fig. 1 is the utility model light-emitting diode pin schematic diagram.
Fig. 2 is another execution mode pin schematic diagram of the utility model light-emitting diode assembly.
Embodiment
Below in conjunction with accompanying drawing, describe the utility model light-emitting diode assembly in detail.
The utility model light-emitting diode assembly and conventional art light-emitting diode assembly are similar, comprise substrate, and described substrate comprises insulating barrier and be arranged on conductive layer on insulating barrier, and described conductive layer is electrically connected to conductive electrode; Support, described support form the indent opening and coordinate with described substrate and form described light-emitting diode assembly bowl cup structure; Light-emitting diode chip for backlight unit, described light-emitting diode chip for backlight unit are arranged on described substrate, and described light-emitting diode chip for backlight unit is electrically connected to described conductive layer; Fluorescent glue, described fluorescent glue coats described light-emitting diode chip for backlight unit, and fills described light-emitting diode bowl cup structure; Described conductive electrode welds by pin pad and the external circuit board of electrode pin, thereby described light-emitting diode chip for backlight unit is electrically connected to external electronic circuits, makes external circuit current drives light-emitting diode chip for backlight unit luminous.
Different from the conventional art light-emitting diode, as depicted in figs. 1 and 2, the utility model light-emitting diode assembly is provided with a plurality of conductive electrodes 2, and a plurality of conductive electrodes 2 are arranged on four limits of substrate 1; Fig. 1 is that three anodal conductive electrodes and negative pole conductive electrode are distributed in substrate 1 four limits, and three anodal conductive electrodes share negative pole conductive electrodes; Fig. 2 is another embodiment of the utility model light-emitting diode assembly, and the positive and negative conductive electrode of conductive electrode 2 is corresponding one by one, and a plurality of conductive electrodes 2 are arranged at substrate 1 four limits.The design of the utility model four limit pins under the prerequisite of same size, has increased the distance of pin number, pin bonding pad area and pin pad.The increase of pin bonding pad area has improved the firmness of welding, has improved simultaneously radiating effect; The increase of pin pad pitch effectively reduces the generation of pin short circuit in pin pad welding process, has improved the reliability of light-emitting diode.
These are only the utility model case study on implementation, be not limited to the utility model, as long as the equivalence that those of ordinary skills do according to the utility model institute disclosure is modified or changed, all should include in the protection range of putting down in writing in claims.
Claims (4)
1. light-emitting diode assembly comprises: substrate, and be provided with insulating barrier on described substrate and be arranged on conductive layer on described insulating barrier, described conductive layer is electrically connected to external electronic circuits by conductive electrode; Support, described support form the indent opening and coordinate with described substrate and form described light-emitting diode assembly bowl cup structure; Light-emitting diode chip for backlight unit, described light-emitting diode chip for backlight unit are arranged on described substrate, and described light-emitting diode chip for backlight unit is electrically connected to described conductive layer; Fluorescent glue, described fluorescent glue coats described light-emitting diode chip for backlight unit, and fills described light-emitting diode bowl cup structure; It is characterized in that: described substrate is square substrate, described light-emitting diode chip for backlight unit is a plurality of, described conductive electrode corresponds to a plurality of, and described a plurality of light-emitting diode chip for backlight unit are electrically connected to a plurality of described conductive electrodes, and described square substrate four limits are provided with described conductive electrode.
2. light-emitting diode assembly according to claim 1 is characterized in that: described square substrate three limits are provided with anode electrode, Yi Bian described square substrate residue is provided with negative electrode.
3. light-emitting diode assembly according to claim 1 is characterized in that: described square substrate three limits are provided with negative electrode, Yi Bian described square substrate residue is provided with anode electrode.
4. light-emitting diode assembly according to claim 1 is characterized in that: the described a plurality of conductive electrode both positive and negative polarities that are arranged at described square substrate four limits are corresponding one by one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220638693 CN203026556U (en) | 2012-11-28 | 2012-11-28 | Light emitting diode (LED) device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220638693 CN203026556U (en) | 2012-11-28 | 2012-11-28 | Light emitting diode (LED) device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203026556U true CN203026556U (en) | 2013-06-26 |
Family
ID=48650515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220638693 Withdrawn - After Issue CN203026556U (en) | 2012-11-28 | 2012-11-28 | Light emitting diode (LED) device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203026556U (en) |
-
2012
- 2012-11-28 CN CN 201220638693 patent/CN203026556U/en not_active Withdrawn - After Issue
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20130626 Effective date of abandoning: 20160511 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |