TW201800876A - Object moving apparatus, exposure apparatus, flat-panel display manufacturing method, device manufacturing method, object moving method, and exposure method - Google Patents

Abstract

The substrate (P ₁ ) placed on the substrate stage device (20) is replaced with another substrate (P ₂ ), which includes: positioning the substrate stage device (20) holding the substrate (P ₁ ) in a predetermined object operation switching position; the substrate (P ₁₎ depending supported on provided depending support means (50) of the object exchange positions of operation; make overhang supported by the overhanging support means (50) of the substrate (P ₁₎ from the substrate stage device (20) exiting the operation; substrate (P ₂₎ is inserted in the overhanging supported overhanging support means (50) of the substrate (P ₁₎ between the device and the substrate stage (20) and the substrate (P ₂₎ transferred to the substrate The operation of the stage device (20); and the operation of moving the substrate (P ₁ ) relative to the suspension support device (50) to carry out the substrate (P ₁ ) from the object exchange position.

Description

Object exchange method, object exchange system, exposure device, flat display manufacturing method, and element manufacturing method

The present invention relates to an object exchange method, an object exchange system, an exposure device, a flat display display manufacturing method, and a component manufacturing method. More specifically, the present invention relates to an object exchange method and system held by an object holding device, and the foregoing object exchange The exposure device of the system, the flat display using the aforementioned exposure device, and the manufacturing method of the device.

In the past, an exposure device was used in a lithography process for manufacturing electronic components such as a liquid crystal display element and a semiconductor element. The exposure device used an energy beam to transfer a pattern formed on a photomask (or reticle) to a glass substrate. (Or wafer).

As such an exposure device, there has been a method in which a predetermined substrate transfer device is used to carry out the exposed glass substrate on the substrate stage device, and then other glass substrates are transferred to the substrate stage device by using the substrate transfer device, and sequentially exchanged. A person who holds a glass substrate on a substrate stage device and continuously exposes a plurality of glass substrates (see, for example, Patent Document 1).

Here, when continuously exposing a plurality of glass substrates, in order to improve the overall productivity, it is desirable that the glass substrates on the substrate stage device be quickly moved.

[Prior technical literature]

[Patent Literature]

[Patent Document 1] US Patent No. 6,559,928

The present invention has been completed in view of the foregoing circumstances. From a first point of view, the present invention is an object exchange method, which is to exchange an object arranged at a predetermined object exchange position with another object. The invention includes: The operation of the object holding device at the object exchange position; the operation of causing the first object to be suspended and supported by the supporting device provided at the object exchange position; the movement of the first object suspended and supported by the supporting device from the object holding device An action of inserting a second object between the first object suspended and supported by the supporting device and the object holding device to transfer the second object to the object holding device; and transferring the second object by The operation of moving the first object relative to the support device to the first object holding device to move the first object from the object exchange position.

Thereby, the second object is handed over to the object holding device in a state where the first object is overhanging and supported on the supporting device, and thereafter the first object is carried out from the object exchange device. That is, the second object is carried into the object holding device more preferentially than the end of the first object holding operation of the first object held by the object holding device. Therefore, the exchange operation of the objects on the object holding device can be performed quickly.

From a second perspective, the present invention is an object exchange system that exchanges an object arranged at a predetermined object exchange position with another object. The object exchange system includes: an object holding device capable of holding the aforementioned object; and a supporting device provided on the aforementioned object. Exchange position, can suspend and support the aforementioned object; drive system, the aforementioned object holding device holding the aforementioned object is located at the aforementioned object exchange position And the object is suspended from the object holding device in a state where the object is suspended and supported by the supporting device, and the object exchange device is configured to insert another object into the object and hold the object holding device and the object away from the object holding device; The other object is transferred to the object holding device between the device and the object, and the object is moved from the object to the position by moving the object relative to the support device after the other object is transferred to the object holding device Move out.

Thereby, the other is handed over to the object holding device in a state where the object is draped and supported on the supporting device, and thereafter the object is carried out from the object exchange device. That is, since the transfer of other objects into the object holding device is prioritized over the end of the unloading operation of the object held by the object holding device, it is possible to quickly perform the exchange operation of the objects on the object holding device.

According to a third aspect of the present invention, the present invention is an exposure apparatus including: the object exchange system of the second aspect of the present invention; and a pattern forming device that forms a predetermined pattern on the object held by the object holding device using an energy beam.

The fourth aspect of the present invention is a method for manufacturing a flat panel display, which includes an operation of exposing the object using the exposure device of the third aspect of the present invention, and an operation of developing the object after exposure.

A fifth aspect of the present invention is a method for manufacturing a device, which includes an operation of exposing the object using the exposure apparatus of the third aspect of the present invention, and an operation of developing the object after exposure.

10‧‧‧ LCD exposure device

20‧‧‧ substrate stage device

26‧‧‧ substrate holder

30‧‧‧ substrate exchange device

36‧‧‧ substrate driving device

38‧‧‧air guide

44‧‧‧Adsorption pad

50‧‧‧ Overhanging support device

52‧‧‧ Non-contact fixture device

P‧‧‧ substrate

FIG. 1 is a diagram schematically showing a configuration of a liquid crystal exposure apparatus according to a first embodiment.

FIG. 2 is a plan view of the liquid crystal exposure device (a part of which is omitted) of FIG. 1. FIG.

FIG. 3 (A) is a front view of a substrate exchange device included in the liquid crystal exposure device of FIG. 2, and FIG. 3 (B) is a view showing a modification example thereof.

4 (A) to 4 (C) are diagrams (No. 1 to No. 3) for explaining the operation of the substrate carrying-in device included in the liquid crystal exposure device of FIG. 1.

5 (A) to 5 (C) are diagrams (No. 1 to No. 3) for explaining the substrate exchange operation of the liquid crystal exposure device according to the first embodiment.

6 (A) to 6 (C) are diagrams (4 to 6) for explaining the substrate exchange operation of the liquid crystal exposure device according to the first embodiment.

7 (A) to 7 (C) are diagrams (No. 7 to No. 9) for explaining a substrate exchange operation of the liquid crystal exposure device according to the first embodiment.

8 (A) and 8 (B) are diagrams (No. 10 and No. 11) for explaining a substrate exchange operation of the liquid crystal exposure apparatus according to the first embodiment.

9 is a plan view of a substrate stage device and a substrate exchange device according to a second embodiment.

FIG. 10 (A) is a side cross-sectional view of a substrate stage device according to a second embodiment, and FIG. 10 (B) is a view showing a modification example thereof.

11 (A) to 11 (C) are diagrams (No. 1 to No. 3) for explaining the substrate exchange operation of the liquid crystal exposure device according to the second embodiment.

12 (A) to 12 (C) are diagrams (4 to 6) for explaining the substrate exchange operation of the liquid crystal exposure device according to the second embodiment.

13 (A) to 13 (C) are diagrams (No. 1 to No. 3) for explaining the substrate exchange operation of the liquid crystal exposure device according to the third embodiment.

FIG. 14 (A) is a diagram (No. 4) for explaining a substrate exchange operation of the liquid crystal exposure device according to the third embodiment, and FIG. 14 (B) is a diagram showing a modification example thereof.

15 (A) to 15 (C) are diagrams (No. 1 to No. 3) for explaining the substrate exchange operation of the liquid crystal exposure device according to the fourth embodiment.

16 (A) to 16 (C) are diagrams (4 to 6) for explaining the substrate exchange operation of the liquid crystal exposure apparatus according to the fourth embodiment.

17 (A) and 17 (B) are diagrams (No. 7 and No. 8) for explaining the substrate exchange operation of the liquid crystal exposure apparatus according to the fourth embodiment.

"First Embodiment"

Hereinafter, the first embodiment will be described using FIGS. 1 to 8 (B).

FIG. 1 schematically shows the configuration of a liquid crystal exposure apparatus 10 according to the first embodiment. The liquid crystal exposure device 10 is a projection exposure device of a stepwise scanning method using a rectangular (corner-shaped) glass substrate P (hereinafter referred to as a substrate P) as an exposure object, such as a liquid crystal display device (flat panel display). Device.

The liquid crystal exposure apparatus 10 includes an illumination system 12, a mask stage 14 holding a mask M, a projection optical system 16, and a resist (inductive) coated on a surface (a surface facing the + Z side in FIG. 1). The substrate stage device 20 of the substrate P, the substrate exchange device 30, the overhang support device 50, and the control system and the like. In the following description, the direction in which the mask M and the substrate P are scanned relative to the projection optical system 16 during exposure is the X-axis direction, the direction orthogonal to the X-axis in the horizontal plane is the Y-axis direction, and the X-axis and Y The direction orthogonal to the axial direction is the Z-axis direction. In addition, the positions in the X-axis, Y-axis, and Z-axis directions were set as the X position, the Y position, and the Z position, respectively. Instructions.

The lighting system 12 has the same configuration as the lighting system disclosed in, for example, US Pat. No. 5,729,331. That is, the lighting system 12 is a light emitted from a light source (such as a mercury lamp) that is not shown, and passes through a not-shown mirror, a dichroic mirror, a curtain, a wavelength selection filter, various lenses, etc. The mask M is irradiated as the exposure illumination light (illumination light) IL. For the illumination light IL, light (i.e., i-line, g-line, and h-line combined light) such as i-line (wavelength 365 nm), g-line (wavelength 436 nm), and h-line (wavelength 405 nm) is used.

The mask stage 14 sucks and holds the mask M by, for example, a vacuum suction method. The photomask stage 14 is driven in a scanning direction (X-axis direction) with a predetermined long stroke by, for example, a photomask stage drive system (not shown) including a linear motor. The position information of the mask stage 14 in the XY plane is obtained by a mask interferometer system including a laser interferometer (not shown).

The projection optical system 16 is arranged below the mask stage 14. The projection optical system 16 has the same configuration as the projection optical system disclosed in, for example, U.S. Patent No. 6,552,775, a so-called multi-lens projection optical system, and includes a plurality of projection optics for forming an erect orthographic image with telecentric equal magnifications on both sides system.

When the liquid crystal exposure device 10 illuminates the illumination area on the mask M with the illumination light IL from the illumination system 12, the illumination light IL passing through the mask M passes through the projection optical system 16 to cover the mask in the illumination area. The projection image (partially erect image) of the circuit pattern of M is formed on the irradiation area (exposure area) of the illumination light IL conjugated to the illumination area on the substrate P. The mask M is moved in the scanning direction by the relative illumination area (illumination light IL), and the substrate P is moved in the scanning direction by the relative exposure area (illumination light IL), so that the scanning exposure of an irradiation area on the substrate P is performed. This irradiation area is transferred to a pattern formed on the photomask M.

The substrate stage device 20 includes an XY coarse movement stage 22, a fine movement stage 24, and a substrate holder 26.

The XY coarse movement stage 22 is a device for driving the substrate holder 26 in the X-axis direction and the Y-axis direction with a predetermined long stroke. As the XY coarse movement stage 22, for example, as disclosed in the specification of US Patent Application Publication No. 2010/0018950, an X coarse movement stage capable of moving in a predetermined long stroke in the X-axis direction and capable of moving in a predetermined long stroke can be used. A so-called gate-type (gantry) two-axis stage device combined with a Y coarse movement stage in the Y-axis direction (the illustration of the X and Y coarse movement stages is omitted). The micro-motion stage 24 is disposed above the XY coarse-motion stage 22 and is mounted on the fixed base 18 through a weight-removing device 28 disclosed in, for example, US Patent Application Publication No. 2010/0018950. The fixing base 18 is composed of a rectangular plate-shaped member in plan view, and is provided on the ground 11 through the vibration isolation device 19.

The substrate holder 26 is composed of a rectangular plate-shaped member (or a rectangular parallelepiped with a low height) in plan view, and is integrally fixed to the upper surface of the micro-motion stage 24. The substrate holder 26 is moved in the X-axis direction and / or the Y-axis direction by a predetermined long stroke relative to the projection optical system 16 (illumination light IL) by being induced by the XY coarse motion stage 22. The position information in the XY plane of the substrate holder 26 (that is, the substrate P) is obtained by a substrate interferometer system including a laser interferometer (not shown). The configuration of the XY coarse motion stage 22 is not particularly limited as long as it can drive the substrate P in the scanning direction at least with a predetermined long stroke.

A plurality of minute holes (not shown) are formed on the upper surface of the substrate holder 26 (the surface facing the + Z side). A vacuum suction device and a pressurized gas supply device (neither of which is shown) provided outside the substrate stage device 20 are selectively connected to the substrate holder 26. The substrate holder 26 can be sucked and held by the vacuum suction force supplied from the vacuum suction device through the plurality of holes. The substrate P placed on it and the pressurized gas suspension support (non-contact support) that can be supplied through the plurality of holes (or other holes) from the pressurized gas supply device are placed on it. The substrate P.

As shown in FIG. 2, the dimensions of the substrate holder 26 in the X-axis and Y-axis directions are set to be shorter than the dimensions of the substrate P in the X-axis and Y-axis directions, respectively. In the state, the end portion of the substrate P slightly exceeds the end portion of the substrate holder 26. This is because the resist may be attached to the back surface of the substrate P, so that the resist is not attached to the substrate holder 26.

As shown in FIG. 2, a pair of Y pressing pin devices 25 y are arranged on the −Y side of the substrate holder 26 at a predetermined interval in the Y-axis direction. The Y pressing pin device 25y has a base 25a fixed to the substrate holder 26 (also a micro-moving stage 24 or an XY coarse-moving stage 22 (both refer to FIG. 1)), and can be set (for example, 10 to 100 mm) relative to the base 25a. Degree) The pin 25b, which is moved in the Y-axis direction, and an actuator (not shown) for driving the pin 25b. The front end portion (the end portion on the + Z side) of the pin 25b protrudes toward the + Z side from the upper surface of the substrate holder 26. Further, a pair of Y positioning pin devices 27y are arranged on the + Y side of the substrate holder 26 at a predetermined interval in the X axis direction (symmetrically on the paper surface with the pair of Y pressing pin devices 25y across the substrate holder 26 on the paper). The Y positioning pin device 27y has substantially the same configuration as the Y pressing pin device 25y except that the pin is fixed. In addition, a pair of Y pressing pin devices 25y may be disposed on the + Y side of the substrate holder 26. In this case, a pair of Y positioning pin devices 27y are disposed on the -Y side of the substrate holder 26. In addition, a Y pressing pin device 25y may be disposed on the -Y side and the + Y side of the substrate holder 26, respectively.

Further, a pair of X pressing pin devices 25x are arranged on the + X side of the substrate holder 26 at a predetermined interval in the Y-axis direction. The X press pin device 25x has a fixing to the substrate holder 26 (also It can be the base 25a of the micro-motion stage 24 or the XY coarse-motion stage 22 (both refer to FIG. 1), a pin 25b capable of moving in the Y-axis direction with a predetermined (for example, about 1 to 100 mm) stroke relative to the base 25a, and An actuator (not shown) is used to drive the pin 25b. Here, the pin 25b of the X pressing pin device 25x can be projected from the upper surface of the substrate holder 26 to the + Z side at the front end portion and lowered to the -Z side from the upper surface of the substrate holder 26 at the front end portion. Driven in the up and down direction. Further, a pair of X positioning pin devices 27x are arranged on the -X side of the substrate holder 26 at a predetermined interval in the Y-axis direction (left-right symmetrical with respect to the paper surface through the substrate holder 26 through the pair of X pressing pin devices 25x). The X positioning pin device 27x has substantially the same configuration as the X pressing pin device 25x except that the pin is fixed. The X pressing pin device 25x, the X positioning pin device 27x, the Y pressing pin device 25y, and the Y positioning pin device 27y are used during the pre-alignment operation of the substrate P to the substrate holder 26.

The substrate exchange device 30 carries out the removal of the substrate P held by the substrate holder 26 from the substrate holder 26 and the carry-in of the substrate P to the empty substrate holder 26 without the substrate P. As shown in FIG. 1, the substrate exchange device 30 is disposed on the + X side region of the substrate stage device 20 and is disposed on the ground 11. The substrate stage device 20 and the substrate exchange device 30 are housed in a processing chamber (not shown) included in the liquid crystal exposure device 10.

The substrate exchange device 30 includes a gantry 32, a bottom plate 34, a substrate driving device 36, and a plurality of air guiding devices 38. The stand 32 is constituted by a table-like member having a low height and installed on the floor 11. The bottom plate 34 is composed of a plate-like member arranged parallel to the XY plane. As shown in FIG. 3 (A), it is constituted by an X linear guide 33a fixed on the upper surface of the stand 32 and a plurality of X sliders 33b fixed below the bottom plate 34. A plurality of (for example, four) X linear guides 33 are mounted on the stage 32. The bottom plate 34 is composed of a plurality of (for example, two) X linear motors 31 including a X fixed member 31a fixed on the upper surface of the stand 32 and an X movable member 31b fixed below the bottom plate 34. The stage 32 is appropriately driven in the X-axis direction with a predetermined stroke.

Returning to FIG. 1, the substrate driving device 36 drives the substrate P to be carried in or out during the exchange operation of the substrate P on the substrate holder 26. The substrate driving device 36 includes an X driving unit 40, a support 42, and a suction pad 44. The X driving section 40 includes an X fixed section 40a and an X movable section 40b. The X fixing portion 40a is formed of a member extending in the X-axis direction, and is fixed to a central portion in the Y-axis direction on the upper surface of the bottom plate 34 (see FIGS. 2 and 3 (A)). The X movable portion 40b is mounted on the upper surface of the X fixed portion 40a, and includes, for example, a drive system of an X linear motor composed of a fixed element included in the X fixed portion 40a and a movable element provided in the X movable portion 40b, along the X fixed portion 40a. In the X-axis direction, for example, a straight stroke is driven with a stroke of the same degree as the size of the X-axis direction of the substrate P. The type of the actuator for driving the bottom plate 34 and the X movable portion 40b is not particularly limited, and may be, for example, a feed screw device or a belt drive device.

The pillar 42 is formed of a member extending in the X-axis direction, and a lower end portion is integrally fixed to the X movable portion 40b. The suction pad 44 is formed of a member having an inverse L-shape in the XZ cross section, and a portion parallel to the XY plane is formed in a rectangular plate shape in plan view. The suction pad 44 is connected to a vacuum device (not shown), and the upper surface of the part parallel to the XY plane functions as a substrate suction surface. One of the portions of the suction pad 44 parallel to the YZ plane faces a surface (a surface facing the -X side) near the upper end portion of the support 42. The suction pad 44 is installed to pass through the Z linear guide 46 (the Z linear guide 46a fixed to one side (-X side) of the above-mentioned pillar 42 and the portion parallel to the YZ plane of the suction pad 44 (+ X side) is constituted by a plurality of Z sliding members 46b) which can move in the Z-axis direction with respect to the pillar 42. In addition, the suction pad 44 is mounted on the X movable portion 40b by a Z actuator 48 (for example, a cylinder, etc.), and its upper surface (substrate suction surface) is higher than each of the substrate holder 26 and the plurality of air guides 38. Position protruding toward the + Z side and the substrate holder 26 and a plurality of air guiding devices The position lowered above 38 is driven in the Z-axis direction.

Each of the plurality of air guiding devices 38 is composed of a rectangular parallelepiped member having the X-axis direction as a length direction, and is mounted on the intermediate base plate 37b through the pillar 37a. As shown in FIG. 3 (A), the middle bottom plate 37b is provided with two, for example, two predetermined intervals in the Y-axis direction so as not to hinder the movement of the pillars 42 of the substrate driving device 36. For example, the two middle bottom plates 37b are each connected to the bottom plate 34 through the pillars 37c. Therefore, the plurality of air guiding devices 38 are moved integrally with the bottom plate 34 in the X-axis direction. As shown in FIG. 2, the plurality of air guides 38 are separated from each other at a predetermined interval so as to support the lower surface of the substrate P approximately uniformly. In the first embodiment, a plurality of (e.g., three) air guides 38 arranged in a predetermined interval in the X-axis direction are arranged in an air-guiding device row in the Y-axis direction at a predetermined interval (e.g., three) Six columns), and a total of, for example, eighteen air guides 38 support the substrate P from below. The number and arrangement of the air guides 38 and the shape of the substrate guide surface formed by the plurality of air guides 38 can be appropriately changed depending on, for example, the size of the substrate P and the like.

A plurality of minute holes (not shown) are formed on each of the plurality of air guiding devices 38. In addition, a pressurized gas supply device (not shown) and a vacuum suction device (not shown) are optionally connected to each of the plurality of air guide devices 38. Each of the plurality of air guiding devices 38 can support the substrate P (non-contact support) placed thereon by suspending the pressurized gas supplied from the pressurized gas supply device through the plurality of holes, and can borrow The substrate P placed thereon is sucked and held by the vacuum suction force supplied from the vacuum suction device through the plurality of hole portions (or other hole portions).

Here, the board | substrate P carrying-in operation using the board | substrate exchange apparatus 30 is demonstrated using FIG. 4 (A)-FIG. 4 (C). In the liquid crystal exposure device 10, the substrate P is moved to the substrate holder 26. The carrying-in operation and the carrying-out operation of the substrate from the substrate holder 26 described later (hereinafter collectively referred to as the substrate P exchange operation) are performed with the substrate holder 26 at a predetermined substrate exchange position. The substrate exchange position is set near the + X side end of the fixing base 18. In a state where the substrate holder 26 is located at the substrate exchange position (a state where the substrate holder 26 is disposed at a position shown by a dotted line in FIG. 1), as shown in FIG. 4 (A), a plurality of air guides 38 and the substrate are held. The tool 26 is adjacent to the X-axis direction, and the substrate guide surface formed by the plurality of air guide devices 38 and the upper surface of the substrate holder 26 form a continuous guide surface.

When the substrate P is carried into the substrate stage device 20 using the substrate exchange device 30, the Z position of the substrate holder 26 is positioned to the Z position on the substrate holder 26 and the Z positions on the plurality of air guides 38 become Approximately the same (or slightly lower on the substrate holder 26 side). In addition, the position of the pin 25b of the X pressing pin device 25x is controlled so that the upper end portion is located on the -Z side (not protruding) from the upper surface of the substrate holder 26. In the substrate exchange apparatus 30, as shown in FIG. 4 (A), the central portion of the Y-axis direction near the + X side end portion is sucked and held on the substrate P of the suction pad 44 and is moved to the -X direction by the suction pad 44. It is driven to move along a guide surface formed by the upper surface of the plurality of air guides 38 and the upper surface of the substrate holder 26.

Next, as shown in FIG. 4 (B), after the + X side end portion of the substrate P is located closer to the -X side than the X pressing pin device 25x, as shown in FIG. 4 (C), the suction pad 44 releases the substrate P The adsorption is maintained and is driven in the + X direction. In addition, the pin 25b of the X pressing pin device 25x is driven in the + Z direction and the -X direction. Thereby, the + X side end portion of the substrate P is pressed by the pin 25b, and the -X side end portion of the substrate P abuts against the X positioning pin device 27x, and the substrate P is pre-aligned in the X axis direction. Although not shown, similarly, the -Y side end portion of the substrate P is pressed on the + Y side by the Y pressing pin device 25y to pre-align the substrate P in the Y-axis direction. In addition, the substrate P can be moved as shown in Figure 4 (A). In the process, the adsorption and holding of the substrate P by the adsorption pad 44 is released, the adsorption pad 44 and the substrate P are separated, and the substrate P is moved by the inertial force. In addition, a notch in which a part of the suction pad 44 can be inserted may be formed in the center portion in the Y-axis direction of the + X side end portion of the substrate holder 26. In this case, since the X position of the substrate P on the substrate holder 26 can be adjusted using the substrate driving device 36, the above-mentioned X pressing pin device 25x and X positioning pin device 27x are not needed.

Returning to FIG. 2, the overhanging support device 50 is used for carrying out the unloading operation of the substrate P held by the substrate holder 26 from the substrate holder 26 together with the substrate exchange device 30. The overhang support device 50 is arranged above the substrate holder 26 in a state where the substrate stage device 20 is located at the substrate exchange position.

The suspension support device 50 includes a plurality of non-contact clamp devices 52. The non-contact jig device 52 is also referred to as a Bernoulli jig, and its structure is disclosed in, for example, US Pat. No. 5,067,762. That is, a gas supply device (not shown) is connected to each of the plurality of non-contact fixture devices 52, and a plurality of non-contacts are in a state where the lower surface of the overhanging support device 50 and the upper surface of the substrate P face each other through a predetermined gap. Each of the pair of holder devices 52 ejects a pressurized gas (for example, air) at a high speed on the substrate P. Next, by passing the gas (the so-called Bernoulli effect and the ejector effect) between the respective lower surfaces of the plurality of non-contact fixture devices 52 and the upper surface of the substrate P at a high speed, a force upward on the substrate P is generated ( The attraction force) causes the substrate P to be held by the overhanging support device 50 in a non-contact manner (attraction retention).

In the first embodiment, for example, twenty-five non-contact jig devices 52 are arranged at predetermined intervals in the X-axis direction and the Y-axis direction so that the attractive force acts on the entire substrate P equally. The number and arrangement of the contact fixture devices 52 are not limited to this, and may be appropriately changed depending on, for example, the size of the substrate P and the like.

A plurality of non-contact fixture devices 52 are mounted in a suspended state on a plurality of rod-shaped members arranged parallel to the X axis at a predetermined interval in the Y-axis direction and a plurality of rod-shaped members arranged at a predetermined interval in the X-axis direction. The rod-shaped member parallel to the Y axis is formed as a mesh-shaped support member 54 (see FIG. 1). The support member 54 is driven in the Z-axis direction (up and down direction) with a predetermined stroke by a plurality of (for example, four in the first embodiment) Z actuators 56. The Z actuator 56 includes a Z fixing portion 56 a provided on the ground 11 (see FIG. 1) in a state of being physically separated from the substrate stage device 20 through a support member (not shown), and is driven at Z with respect to the Z fixing portion 56 a. The Z movable portion 56b in the axial direction is connected to the support member 54 to the Z movable portion 56b.

Hereinafter, a surface formed by the lower surface of the plurality of non-contact jig devices 52 will be referred to as a substrate holding surface of the overhang supporting device 50. In the overhanging support device 50, the support member 54 is driven in the Z-axis direction while the substrate P is held in a non-contact manner, and the substrate P and the support member 54 are integrally moved in the Z-axis direction. Thereby, the suspension support device 50 can move the substrate P up and down above the substrate holder 26 located at the substrate exchange position. In addition, the type of the actuator that moves the support member 54 up and down may be appropriately changed. For example, the support member 54 may be suspended by a rope or the like, and the support member 54 may be moved up and down by winding the rope.

Further, as shown in FIG. 1, pins 58 (+ Y side) protruding downward from the support member 54 are arranged near the + X side, the -X side, the + Y side, and the -Y side end portions of the support member 54. And -Y pin 58 is not shown). The plurality of pins 58 are configured to surround the outer periphery of the substrate P in a state where the substrate P is suspended and supported using the plurality of non-contact fixture devices 52 to restrict the substrate P from being unintended relative to the suspension supporting device 50 in a direction parallel to the XY plane. mobile. The number of pins 58 is not particularly limited as long as it can restrict the unintended movement of the substrate P described above. In addition, the pin 58 disposed near the + X side end portion of the support member 54 can be lowered below the substrate holding surface at the lower end portion. It is driven between a protruding position and a position where the lower end portion does not protrude below the substrate holding surface (a position which does not hinder the movement of the substrate P relative to the overhanging support device 50 in the + X direction). In addition, the plurality of pins 58 can also be moved in the X-axis and / or Y-axis directions, and the ends of the substrate P supported by the plurality of non-contact fixture devices 52 can be pressed by using the plurality of pins 58 to carry out the substrate. P is aligned (pre-aligned) in the XY plane.

Further, as shown in FIG. 1, an external transfer robot arm 99 for carrying the substrate P into the liquid crystal exposure apparatus 10 from the outside of the liquid crystal exposure apparatus 10 is disposed outside the liquid crystal exposure apparatus 10 (only external transport machines are shown in FIGS. 1 and 2) The arm member 98 of the arm 99). As shown in FIG. 2, the arm member 98 has a plurality of support portions 98 a composed of a plate-like member extending parallel to the X axis and a connection portion 98 b that connects one end of the plurality of support portions 98 a to each other, which is also referred to as a fork arm ( fork hand) and so on. Although not shown in the figure, the external transport robot arm 99 includes, for example, a driving device (such as a robot arm) that can drive the arm member 98 at least in the X-axis direction and the Z-axis (up-down) direction with a predetermined stroke.

Here, among the arm members 98 of the external transfer robot arm 99, a plurality of support portions 98a are arranged at substantially equal intervals in the Y-axis direction in order to suppress the bending of the substrate P. In addition, the Y-axis direction intervals of the plurality of air guiding devices 38 included in the substrate exchange device 30 described above are determined in consideration of the Y-axis direction intervals of the plurality of support portions 98a. Specifically, the Y-axis direction intervals of the plurality of air guides 38 are set to the Y-axis with respect to the plurality of support portions 98 a of the arm member 98 in a state where the arm member 98 is located on the plurality of air guides 38. The directions do not overlap. Thereby, the air guide 38 can be inserted between adjacent support parts 98a via a predetermined gap.

The liquid crystal exposure device 10 (refer to FIG. 1) configured as described above is under the management of a master control device (not shown) and performs a mask stage device 14 by a mask loader (not shown). The upper mask M is loaded, and the substrate P on the substrate holder 26 is loaded by the substrate exchange device 30. Thereafter, the main control device performs an alignment measurement using an alignment detection system (not shown). After the alignment measurement is completed, the plurality of irradiation areas set on the substrate P are sequentially exposed in a step-and-scan manner. action. In addition, since this exposure operation is the same as the exposure operation of the conventional step-and-scan method, the detailed description is omitted. Then, the substrate P on which the exposure processing has been completed is carried out from the substrate holder 26 by the substrate exchange device 30, and the other substrate P exposed next time is transferred to the substrate holder 26, whereby the substrate P on the substrate holder 26 is carried out. Exchange, continuously performing an exposure operation on the plurality of substrates P, and the like.

Hereinafter, the substrate P on the substrate holder 26 in the liquid crystal exposure device 10 will be described with reference to FIGS. 5 (A) to 8 (B) (for convenience of explanation, a plurality of substrates P are referred to as a substrate P ₁ , a substrate P ₂ , and a substrate). P ₃ ). The following board exchange operations are performed under the management of a main control device (not shown). In addition, in order to simplify the illustration, each of the substrate stage device 20, the substrate exchange device 30, and the overhang support device 50 is simplified and shown in FIG. 5 (A) to FIG. 8 (B) (some elements are not shown). .

FIG. 5 (A) shows a state where the substrate stage device 20 on which the exposed substrate P _{1 is} placed on the substrate holder 26 is moved from the end position of the exposure operation to the substrate exchange position. A plurality of air guide means 30 of the exchange 38 to the substrate, the substrate P is placed after _a predetermined exposure process for the substrate P _2. In addition, although the illustration of the operation is omitted in FIG. 5 (A), in the substrate exchange device 30, a plurality of air guides 38 are driven to -X in correspondence with the movement of the substrate stage device 20 to the substrate exchange position. Direction (direction approaching the substrate stage device 20). After the substrate stage device 20 is located at the substrate exchange position (or while the substrate stage device 20 is moving to the substrate exchange position), the suspension support device 50 descends and drives the plurality of non-contact jig devices 52.

In the state where the substrate stage device 20 is located at the substrate exchange position, as shown in FIG. 5 (B), the substrate holder 26 is released from the adsorption holding of the substrate P ₁ and faces the substrate P from above the substrate holder 26. the pressurized gas ejected ₁ below. In addition, the overhanging support device 50 ejects gas at a high speed from a plurality of non-contact fixture devices 52, thereby exerting upward force (levitation force) on the substrate P ₁ in the direction of gravity (the arrow in FIG. 5 (B) is not a gas display) The flow is the direction in which the force is displayed), and the substrate P ₁ is sucked and held on the overhanging support device 50. In addition, the substrate exchange device 30 ejects a pressurized gas from a plurality of air guides 38 under the substrate P ₂ , and the substrate P ₂ is suspended on the plurality of air guides 38. The suction pad 44 sucks and holds the lower surface of the substrate P ₂ . Next, FIG. 5 (C), the sucking and holding the substrate P ₁ depending support means 50 is raised driven, the substrate P is below the substrate holder ₁ 26 of the above separation.

Thereafter, as shown in FIG. 6 (A), the suction pad 44 is driven in the −X direction. As a result, the substrate P ₂ moves along the guide surfaces formed on the upper surface of the plurality of air guides 38 and the upper surface of the substrate holder 26. Hereinafter, as described above, the X holding pin device 25x and the Y holding pin device 25y are used on the substrate holder 26 (not shown in FIG. 6 (A). Refer to FIGS. 4 (A) to 4 (C)). After the pre-alignment, the substrate P ₂ is sucked and held on the substrate holder 26. During the movement of the above-mentioned substrate P ₂ and during the pre-alignment operation, the exposed substrate P ₁ is waiting at the substrate exchange position while being held and held by the overhanging support device 50. Hereinafter, the substrate stage device 20 in FIG. 6 (B), in order to be moved to a predetermined position of the start of the exposure operation on substrate P from the exposure operation of the substrate ₂ exchange position.

After the substrate stage device 20 is separated from the substrate exchange position, as shown in FIG. 6 (C), the plurality of non-contact jig devices 52 included in the suspension support device 50 are lowered and driven. At this time, the Z position of the substrate P ₁ is positioned so that the suction pad 44 can adsorb and hold the position below the substrate P ₂ , that is, the position of the substrate P ₁ when it is carried into the substrate holder 26 (see FIG. 6 (A)). The Z positions are approximately the same.

Hereinafter, FIG. 7 (A), the sucking and holding of the substrate P below _a suction pad 44 is driven toward the + X direction, whereby the substrate P ₁ along a plurality of non-contact means below the clamp 52 and a plurality of air The guide surface formed on the guide device 38 moves. In this case, the supporting means 50 overhanging the + side of the pin 58 X (in FIG. 7 (A), not shown. Referring to FIG. 1) is not in contact with a substrate ₁ of P retracted. In addition, in FIGS. 7 (A) to 8 (B), although the substrate stage device 20 holding the substrate P ₂ is illustrated for convenience of explanation, the substrate P ₁ and the substrate P on the substrate exchange device 30 described below are illustrated. The exchange operation of ₃ and the exposure operation of the substrate P _{2 are} performed in parallel, and the actual position of the substrate stage device 20 is different.

Next, FIG. 7 (B), the substrate P after being conveyed to _a plurality of upper air guide means 38, i.e., desorbed suction pad 44 of the substrate P held _1, and the suction pad 44 is driven downward. In addition, the ejection of the pressurized gas from the air guide 38 to the lower surface of the substrate P ₁ is stopped. Although the operation is not shown in FIG. 7 (B), in the substrate exchange device 30, a plurality of air guides 38 are driven in the + X direction (direction away from the substrate stage device 20). In addition, the X position of the plurality of air guiding devices 38 may be fixed.

Thereafter, in order to carry out the substrate P ₁ to the outside of the liquid crystal exposure device 10 (see FIG. 1), as shown in FIG. 7 (C), the arm member 98 of the external transfer robot arm 99 is inserted into the space below the substrate P ₁ and is removed. Ascent drive. At this time, as described above, the arm member 98 of the external transfer robot arm 99 is not in contact with the plurality of air guiding devices 38. Thereby, the substrate P ₁ is supported by the arm member 98 from below, and in this state, the arm member 98 is driven in the + X direction, whereby the substrate P ₁ is carried out of the liquid crystal exposure device 10 (see FIG. 1). In addition, in FIG. 7 (B), although the adsorption pad 44 is driven downward to avoid the contact between the adsorption pad 44 and the arm member 98, the adsorption pad 44 may be moved in the -X direction to avoid contact with the arm member 98.

Hereinafter, as shown in FIG. 8 (A), the arm member 98 of the external transfer robot arm 99 (which may be the same as the arm member 98 of the substrate P ₁ that has been carried out above, or may be other), and the substrate P _{2 is} scheduled to be carried out later. After the exposed substrate P _{3 is} conveyed above the plurality of air guides 38, as shown in FIG. 8 (B), the arm member 98 of the external conveying robot arm 99 is driven in the −Z direction and the −X direction, and the substrate P _{3 is} placed on a plurality of air guides 38. Whereby, back to FIG. 5 (A) as shown in the state (however, the substrate P ₁ P ₂ is replaced with the substrate, the substrate is replaced with the substrate P ₂ P _3). In addition, after the substrate P ₃ is handed over to the plurality of air guides 38, the position alignment (alignment) of the substrate P _{3 may} be performed in a state of being suspended on the plurality of air guides 38. The above-mentioned alignment can be performed by, for example, detecting the position of the end portion (edge) of the substrate P ₃ with an edge sensor or a CCD (Charge Coupled Device) camera, and pressing a plurality of positions on the end portion of the substrate P ₃ . Hereinafter, the operations shown in FIGS. 5 (A) to 8 (B) are repeatedly performed to continuously perform exposure operations on the plurality of substrates P.

The above description of the present first embodiment, since the exposure is completed the substrate P ₁ in the state of the substrate exchange position standby (from next predetermined exposure of the substrate P loaded ₂ of path retracted) of, for the substrate P loaded ₂ of the operation, and After the transfer of the substrate P ₂ to the substrate stage device 20 is performed, the substrate P _{1 is carried} out from the above-mentioned standby position. Therefore, for example, after the completion of the unloading operation of the exposed substrate P ₁ , the substrate P _{2 is} started to the substrate stage device. Compared with the loading operation of 20, the cycle time of substrate exchange can be shortened.

And, generally, since the substrate P as compared to the time of exposure operation ₂ is required, the completion of the exposure of the substrate P _{unloaded. 1} to 10 outside the liquid crystal substrate exposure apparatus P operation and a plurality of air guide 38 on the apparatus ₃ The time required for the placing operation can be short (the substrate P ₃ can be prepared before the exposure operation for the substrate P ₂ is completed), so as shown in this embodiment, even if the substrate P ₁ is unloaded after the exposure operation is completed, Prioritizing the carrying-in operation of the substrate P ₂ has no effect on the overall productivity when a plurality of (for example, three or more) substrates P are continuously exposed.

Moreover, in the overhang supporting device 50, since the plurality of non-contact jig devices 52 can move up and down, the carrying path of the substrate P can be made the same as the carrying out path, and the liquid crystal exposure apparatus 10 can save space. In addition, only one driving system (the substrate driving device 36 in the present embodiment) for driving the substrate P (substrates P ₁ to P ₃ ) is required, and it is not necessary to separately provide a driving system for carrying in and a driving system for carrying out. Therefore, the configuration of the liquid crystal exposure device 10 is simple, and the cost can be reduced.

Moreover, although the overhanging support device 50 ejects gas onto the upper surface (exposed surface) of the substrate P, the substrate P held by the overhanging support device 50 has been exposed, so if the pressurized gas contains There is no risk of poor exposure in the dust. Moreover, since the positions of the plurality of non-contact jig devices 52 are fixed in the XY plane, the possibility of dropping the substrate P is also small.

The configuration of the liquid crystal exposure device 10 according to the first embodiment can be appropriately changed. For example, as shown in FIG. 3 (B), the substrate exchange device 30a may be configured such that a plurality of air guide devices 38 can move up and down. Specifically, in the substrate exchange device 30a, a plurality of air guiding devices 38 are supported on the bottom plate 34a by Z actuators 37d instead of the pillars 37c of the substrate exchange device 30 shown in FIG. 3 (A). . When the exposed substrate P is unloaded from the substrate stage device 20 (refer to FIG. 1 and the like), compared with the first embodiment described above, the suspension support device 50 is driven downward (see FIG. 6 (C)). The substrate exchange device 30a only needs to drive the plurality of air guiding devices 38 upward. In addition, at this time, the movable stroke in the Z-axis direction of the suction pad 44 may be set to be longer than the first embodiment to suck and hold the lower surface of the substrate P.

Thereby, since the exposed substrate P can be carried out without changing the Z position of the overhanging support device 50, the operation of the overhanging support device 50 can be simplified. In addition, since it is not necessary to drive the suspension support device 50 downward, it is possible to eliminate the need to wait for the substrate stage device 20 to move from the base. When the board exchange position (below the overhanging support device 50) is completely retracted, the substrate carrying-out operation is started. Therefore, the time for the substrate exchange operation can be shortened. In addition, the X fixing portion 40a for driving the suction pad 44 may be fixed to the stand 32 like the substrate exchange device 30a shown in FIG. 3 (B) (the X fixing portion 40a itself may not move in the X-axis direction). In this case, the bottom plate 34a may be disposed on one side and the other side of the X fixing portion 40a, and the pair of bottom plates 34a may be driven synchronously.

"Second Embodiment"

Next, a second embodiment (and its modification) will be described with reference to Figs. 9 to 12 (C). In addition, in the second to fourth embodiments described below and the modifications thereof, the same components as those in the first embodiment are given the same reference numerals as those in the first embodiment, and descriptions thereof are omitted.

In the liquid crystal exposure device according to the second embodiment shown in FIG. 9, the substrate stage device 60, the overhanging support device 50a (not shown in FIG. 9; see FIG. 10 (A)), and the structure of the substrate exchange device 70 are as described above. The first embodiment is different. As shown in FIG. 10 (A), the substrate stage device 60 includes an XY coarse movement stage 22, a fine movement stage 24, and a substrate holder 62. The configurations of the XY coarse movement stage 22 and the fine movement stage 24 (including the weight removing device 28) are the same as those of the first embodiment described above. The substrate holder 62 is composed of a plate-like member having a rectangular shape in plan view, and is integrally fixed to the upper surface of the micro-motion stage 24.

As shown in FIG. 9, a plurality of X grooves 62 a (for example, six in the second embodiment) extending in the X axis direction are formed on the substrate holder 62 at predetermined intervals in the Y axis direction. An air guide 64 is inserted into each of the plurality of X grooves 62a. The air guiding device 64 is composed of a member extending in the X-axis direction, and the dimension in the longitudinal direction is set to be approximately the same as the dimension in the X-axis direction of the substrate P (it is shorter in the second embodiment). A plurality of minute holes (not shown) are formed on the air guide 64. A pressurized gas supply device (not shown) provided outside the substrate stage device 60 is connected to the air guide device 64, and the plurality of minute hole portions can be connected from the air guide device 64. Spray a pressurized gas.

Further, as shown in FIG. 10 (A), a leg portion 66 extending in the Z-axis direction is fixed below the air guiding device 64 and near the two ends in the longitudinal direction of the air guiding device 64. A pair of through holes 62b penetrating the substrate holder 62 in the up-down direction is formed on the bottom surface for defining the X groove 62a, and a leg portion 66 is inserted into each of the pair of through holes 62b. The XY coarse motion stage 22 has a pair of Z actuators 68 corresponding to the pair of leg portions 66 described above. With the pair of Z actuators 68, the air guide device 64 has a position on the upper surface protruding upward from the upper surface of the substrate holder 26 and a position on the upper surface lowering downward from the upper surface of the substrate holder 26 (air guide The device 64 is housed between the positions of the X grooves 62a) and its Z position is appropriately controlled.

The structure of the overhang support device 50a shown in FIG. 10 (A) is fixed except that the Z position of the support member 54 of the plurality of non-contact fixture devices 52 is fixed (without Z actuator 56 (see FIG. 1)). The other points are the same as the first embodiment.

The substrate exchange device 70 shown in FIG. 9 includes a plurality of air guide devices 74 (for example, six are provided at a predetermined interval in the Y-axis direction in the second embodiment). The air guide device 74 is configured in the same manner (a little wider than the air guide device) 64 of the substrate holder 62. That is, the air guide device 74 is formed of a member extending in the X-axis direction, and as shown in FIG. 11 (A), it has a pair of leg portions 76 on its lower surface. The air guide 74 is driven in the Z-axis direction with a predetermined stroke by a pair of Z actuators 78 fixed to the bottom plate 34.

A plurality of minute holes (not shown) are formed on the air guiding device 74. A pressurized gas supply device (not shown) is connected to the air guiding device 74, and the pressurized gas can be ejected from the plurality of minute holes. In the second embodiment, the substrate P is obtained from a plurality of air guides 64 and / or substrate exchange devices 70 included in the substrate stage device 60 described above. A plurality of air guides 74 are supported from below, and the air guides 64 and 74 eject the pressurized gas below the substrate P to suspend and support the substrate P (non-contact support). In addition, since the configuration of the substrate driving device 36 shown in FIG. 9 is the same as that of the first embodiment described above, description thereof is omitted.

Hereinafter, the substrate exchange operation according to the second embodiment will be described using FIGS. 11 (A) to 12 (C). FIG. 11 (A) shows a state where the substrate stage device 60 holding the exposed substrate P1 is located at the substrate exchange position (below the overhanging support device 50a). A substrate P _{2 is} placed on the air guide 74 of the substrate exchange device 70. As shown in FIG. 11 (B), in the substrate stage device 60 disposed at the substrate exchange position, the overhang support device 50a drives the air guide 64 to a position where the substrate P ₁ can be sucked and held (overhang support). Depending support means attracting and holding the substrate P ₁ 50a, in the first embodiment, in the same manner, the substrate ₁ P ₂ is retracted from the path of movement of the substrate P to the substrate board P ₂ until the end of the base station apparatus 60 of the loading operation. Further, in the substrate exchange device 70, suction pad 44 suction holding the substrate P _2.

After the substrate P ₁ is handed over to the overhanging support device 50 a, as shown in FIG. 11 (C), the air guide device 64 is driven downward. At this time, the Z actuator 68 is controlled so that the Z position on the air guide 64 is substantially the same as (or slightly lower than) the Z position on the air guide 74 of the substrate exchange device 70. In this state, the Z position of the air guide 74 is set so that the upper surface of the air guide 64 is located on the + Z side than the upper surface of the substrate holder 62.

Next, as shown in FIG. 12 (A), the suction pad 44 is driven in the −X direction. Thereby, the substrate P ₂ moves along the guide surface formed by the upper surface of the air guide device 74 and the upper surface of the air guide device 64, and is transferred from the air guide device 74 to the air guide device 64. The following, although not shown, the suction pad 44 suction holding the substrate P after the lifting of _2, is driven by the -Z direction, and the + X direction from the substrate ₂ and the substrate P after being held between the removal tool 62 above As shown in FIG. 12 (B), the air guide 64 is driven downward, and the substrate P _{2 is} placed on the substrate holder 62. Furthermore, although not shown, the suction pad 44 is driven in the + Z direction and the −X direction, and sucks and holds the lower surface of the substrate P ₁ . In addition, in the substrate exchange device 70, the air guide device 74 is driven upward. At this time, the Z actuator 78 is controlled so that the upper side of the air guiding device 74 is slightly closer to the -Z side than the Z position below the base plate P ₁ of the overhang supporting device 50a.

Thereafter, as shown in FIG. 12 (C), the pressurized gas is ejected from the air guide 74, and the adsorption pad 44 is driven in the + X direction. As a result, the substrate P ₁ moves along a predetermined guide surface of each of the plurality of non-contact fixture devices 52 and the plurality of air guide devices 74, and is placed on the plurality of air guide devices 74. Hereinafter, in the same manner as the first embodiment, the plurality of air guides 74 are scheduled after the substrate P ₁ and the substrate P _{2 are} made using an external transfer robot arm 99 (not shown in FIG. 12 (C)). The exchange operation of the other substrate (not shown) that is subjected to the exposure process (see FIGS. 7 (B) to 8 (B)).

According to the second embodiment described above, the since the system in the first embodiment similarly to the completion of the exposure of the substrate P ₁ is retracted from the substrate P _carry-2 of the path, preferentially for the substrate P ₂ than the substrate P unloaded ₁ of operation The loading operation can shorten the exchange time of the substrate P.

In the second embodiment, since the plurality of air guide devices 74 can move up and down, the substrate P ₁ can be directly carried out from the retreat position without driving down the plurality of non-contact jig devices 52. Therefore, as shown in FIG. 12 (C), the substrate P ₁ can be carried out with the substrate stage device 60 at the substrate exchange position (also in parallel with the pre-alignment operation for the substrate P ₂ ). The time required for the exchange operation of the substrate P is shortened. In addition, since the plurality of air guide devices 64 included in the substrate stage device 60 can move up and down, the substrate P can be transferred from the substrate stage device 60 to the overhanging support device 50a. Therefore, the Z positions of the plurality of non-contact clamp devices 52 can be fixed, and the structure of the overhanging support device 50a can be simplified.

The configuration of the liquid crystal exposure device according to the second embodiment can be appropriately changed. For example, as in the substrate stage device 60a shown in FIG. 10 (B), the X-axis dimension may be shorter than the air guide device 64 (see FIG. 10 (A)) of the second embodiment ( In this modification, for example, three) air guides 64a are accommodated in the X groove 62a at a predetermined interval in the X-axis direction. The plurality of air guiding devices 64a are synchronously driven by a Z actuator 69 (for example, a cylinder device) housed in a recessed portion 62c for defining the bottom surface of the X groove 62a. Although not shown, the air guide device 74 (see FIG. 9) of the substrate exchange device 70 may be similarly configured.

"Third Embodiment"

Next, a third embodiment (and its modification) will be described with reference to Figs. 13 (A) to 14 (B). In the third embodiment, although the structure of the substrate stage device 60 is the same as that of the second embodiment described above, and the structure of the overhanging support device 50 is the same as that of the first embodiment described above, the operation during the substrate exchange operation (control by the main control device) ) Departments are different. In addition, the substrate exchange device 70a has a plurality of air guides 74 (hidden in the paper surface depth direction in FIGS. 13 (A) to 14 (B)), as in the second embodiment shown in FIG. 9. However, it does not have an element corresponding to the substrate driving device 36 (see FIG. 9).

In the third embodiment, the substrate P is transported by its own weight. FIG. 13 (A) shows a state after the exposed substrate P _{1 is} transferred to the overhanging support device 50. The air guide device 64 of the substrate stage device 60 (hidden in the paper surface depth direction in FIGS. 13 (A) to 14 (B)) transfers the substrate P ₁ to the overhanging support device 50 and is driven downward. Although the point is the same as the second embodiment described above, in the third embodiment, the Z actuator 68 is controlled so that the Z position of the end portion of the + X side (the substrate exchange device 70a side) of the air guide 64 is relatively The Z position of the X-side end portion is high, that is, the guide surface formed by the plurality of air guide devices 64 becomes an inclined surface with respect to the XY plane.

Similarly, the air guide device 74 of the substrate stage device 70a (hidden in the paper surface depth direction in FIGS. 13 (A) to 14 (B)) similarly controls the Z actuator 78 so that + The Z position of the X side end portion is higher than the Z position of the -X side (substrate stage device 60 side) end portion, that is, the guide surface formed by the plurality of air guide devices 74 becomes an inclined surface with respect to the XY plane. Here, each of the Z actuators 68 and 78 is controlled to form a single guiding surface formed by each of the plurality of air guiding devices 64 and the air guiding devices 74 (no step difference (or the step difference is too small to not Affects the movement of the substrate P ₂ )) guide surface. Specifically, the angles of the guide surfaces (inclined surfaces) formed by each of the plurality of air guides 64 and the air guides 74 are set to be approximately the same as each other, and the guides formed by the plurality of air guides 64 are substantially the same. The Z position of the + X side end portion of the leading surface is set to be approximately the same as the Z position of the -X side end portion of the guide surface formed by the plurality of air guiding devices 74 (actually, by the plurality of air guides) The guide surface formed by the device 74 is slightly higher).

As a result, since the substrate P ₂ is supported by the plurality of air guiding devices 64 and 74 in a non-contact manner (in a state where friction can be substantially ignored), as shown in FIG. 13 (B), the substrate P _{2 is} stretched by its own weight. A guide surface formed by the plurality of air guides 64 and 74 moves from the plurality of air guides 74 to and from the plurality of air guides 64. Hereinafter, as in the first embodiment, after performing a pre-alignment operation using an X pressing pin device 25x (see FIG. 2) and the like, as shown in FIG. 13 (C), a plurality of air guiding devices 74 are driven downward, and This substrate P ₂ is sucked and held by the substrate holder 62.

In the third embodiment, the unloaded substrate P ₁ is also carried out using the weight of the substrate P ₁ . That is, in parallel with the pre-alignment operation of the substrate P ₂ described above, the overhung support device 50 is inclined in a manner that the substrate holding surface formed by the plurality of non-contact fixture devices 52 is inclined with respect to the XY plane, specifically, The Z position of the + X side (substrate exchange device 70a side) end of the substrate holding surface is lower than the Z position of the -X side end to control the plurality of Z actuators 56 (not shown in FIG. 13 (C)). (See Figure 1 and so on).

In the substrate exchange device 70a, each of the plurality of air guiding devices 74 is driven so that the inclination angle of the guiding surface formed by the plurality of air guiding devices 74 and the inclination of the substrate holding surface of the suspension support device 50 described above. The angles become approximately the same. Accordingly, the substrate P ₁ is moved along the substrate holding surface of the overhanging support device 50 and / or the guide surface formed by the plurality of air guide devices 74, and is placed on the plurality of air guide devices 74. In addition, a brake device for stopping the substrate P ₂ carried out from the overhanging support device 50 at a desired position on the plurality of air guide devices 74 may be disposed in the substrate exchange device 70.

According to the third embodiment described above, since the substrate exchange device 70a does not have an element for driving the substrate P, the configuration is simple.

The configuration of the liquid crystal exposure device according to the third embodiment can be appropriately changed. For example, as shown in FIG. 14 (B), the overhanging support device 50b, the support member 54b is configured to be longer so that the + X side end portion of the substrate holding surface formed by the plurality of non-contact fixture devices 52 is longer than the substrate The + X side end portion of the holder 62 protrudes toward the X side, and the protruding portion overlaps the -X side end portion of the air guide 74 of the substrate exchange device 70a in the up-down direction. Accordingly, the substrate P ₁ can be more smoothly transfer from the depending support means 50b to the plurality of air guide 74.

"Fourth Embodiment"

Next, a fourth embodiment will be described with reference to Figs. 15 (A) to 17 (B). In the liquid crystal exposure apparatus of the fourth embodiment, the exchange operation of the substrate P on the substrate stage apparatus 60 is performed by an external transfer robot arm 99 disposed outside the liquid crystal exposure apparatus. The structure of the substrate stage device 60 is the same as the above. The second embodiment described above is the same (however, the control is different). The overhanging support device 50b is the same as the overhanging support device 50 (see FIG. 1) except that the movable stroke in the Z-axis direction is longer. Etc.) The same configuration (however, the control is different). In addition, there is no component equivalent to the substrate exchange device 30 of the first embodiment or the substrate exchange device 70 of the second embodiment.

FIG. 15 (A) shows a state where the substrate stage device 60 holding the exposed substrate P ₁ is located at the substrate exchange position (below the overhanging support device 50 b). In the + X side region of the substrate exchange position, an arm member 98 of the external transfer robot arm 99 that supports the substrate P _{2 is} on standby. In addition, the standby position of the arm member 98 supporting the substrate P ₂ may be the inside of a processing chamber (not shown) in which the substrate stage device 60 and the overhang supporting device 50 b are housed, or the outside of the processing chamber. When the standby position of the arm member 98 supporting the substrate P ₂ is outside the processing chamber, the substrate exchange operation on the substrate stage device 60 described below is performed through the opening formed in the processing chamber.

Here, in the fourth embodiment, the arm member 98 of the external transfer robot arm 99 has a plurality of support portions 98a arranged at predetermined intervals in the Y-axis direction (superimposed on FIG. 15 (A) to FIG. 17 (B). On the deep side of the paper surface), the substrate stage device 60 includes a plurality of air guides 64 (superimposed on the deep side of the paper surface in FIGS. 15 (A) to 17 (B)) arranged at predetermined intervals in the Y-axis direction. In the plurality of support portions 98a and the plurality of air guides 64, the intervals in the Y-axis direction are set so that the positions in the Y-axis direction do not overlap each other when the arm member 98 is positioned above the substrate holder 62 (air guides). The guiding device 64 may pass between the adjacent supporting portions 98a). Therefore, the configuration of the arm member 98 and / or the plurality of air guiding devices 64 of the external transfer robot arm 99 of the fourth embodiment is actually different from that of FIG. 2 or FIG. 9, but it is used here for convenience of explanation. The same symbols are used for explanation.

As shown in FIG. 15 (B), in the fourth embodiment, the plurality of air guides 64 of the substrate stage device 60 located at the substrate exchange position are driven upward to transfer the exposed substrate P ₁ to the overhanging support. Device 50b. Next, as shown in FIG. 15 (C), the plurality of non-contact jig devices 52 holding the substrate P ₁ are driven upward, and the guides formed by the substrate holding surface of the suspension support device 50b and the plurality of air guide devices 64 are raised. A wide space is formed between the leading surfaces. Thereafter, as shown in FIG. 16 (A), an arm member 98 of the external transfer robot arm 99 supporting the substrate P ₂ is inserted into the space.

Hereinafter, as shown by the arrow in FIG. 16 (B), the driving arm member 98 is lowered (the plurality of air guides 64 may also be driven upward), and the substrate P ₂ is supported from below by the plurality of air guides 64, and further, The arm member 98 is driven in the + X direction, and the arm member 98 retracts from below the overhanging support device 50b. Next, as shown in FIG. 16 (C), the plurality of air guides 64 are driven downward, and the substrate P ₂ is placed on the substrate holder 62. In addition, the arm member 98 of the external transfer robot arm 99 is driven in the + Z direction in parallel. In the transfer operation from the arm member 98 of the external transfer robot arm 99 to the substrate P ₂ of the substrate holder 62, the substrate P ₁ stands by at the substrate exchange position in the same manner as in the first to third embodiments.

Hereinafter, as shown in FIG. 17 (A), the substrate stage device 20 holding the substrate P ₂ is separated from the substrate exchange position, and the arm member 98 of the external transfer robot arm 99 is driven in the -X direction in parallel, thereby being disposed in the lower support means 50b depending, in this state, a plurality of non-contact clip device 52 is driven downward, whereby P ₁ is placed on the substrate 99 of the arm member 98 on the outer transporting robot arm. Hereinafter, the support means is released depending on the substrate P depending 50b of the support ₁ and the support substrate P of the arm member ₁₉₈ in the external device after attracting and holding the substrate P to the _driving direction of + X, the substrate ₁ is conveyed to P (e.g. Coating and developing device). In addition, a plurality of non-contact jig devices 52 are driven upward in parallel.

According to the fourth embodiment described above, since the substrate stage device 60 The substrate P is transferred directly to and from the external transfer robot arm 99. Therefore, it is not necessary to provide a device for transferring the substrate P to the liquid crystal exposure device (e.g., equivalent to the first embodiment described above (see FIG. 7 (C) to FIG. 8). (B) The device of the substrate exchange device 30) can simplify the configuration of the liquid crystal exposure device. In addition, in the fourth embodiment, although the substrate stage device 60 has the same air guide device 64 as the second embodiment described above, since the substrate P does not move along the air guide device 64, it can also be used such as lifting Pin device without guide function.

In addition, the configurations of the first to fourth embodiments described above (including modifications thereof. The same applies hereinafter) can be appropriately changed. For example, in the first to fourth embodiments, the non-contact jig device 52 passes a gas at a high speed between the substrate and the upper surface of the substrate P to apply a force in the direction of gravity (+ Z direction) to the substrate P. , But is not limited to this, a so-called vacuum that attracts the gas on the upper side of the substrate P so that a force in the + Z direction acts on the substrate P and ejects gas from the substrate P to maintain a gap with the substrate P Vacuum preload airbearing.

In the above-mentioned first to fourth embodiments, although the substrate P to be carried out is held by the pattern surface (upper surface) from above by the non-contact jig device 52, as long as the substrate P can be removed from the substrate holders 26 and 62, The structure of the overhanging support device can be changed as appropriate. For example, a plurality of support members (for example, an adsorption pad) near the end portion of the support substrate P (the area protruding outward from the end portion of the substrate holder 26) from the lower side 44 (refer to FIG. 1) (L-shaped members opposite to each other) (also used in combination with the non-contact jig device 52) to support the substrate P from above.

In the above-mentioned first and second embodiments, the substrate driving device 36 that moves the substrate P during the loading and unloading of the substrate P is provided in the substrate exchange device 30, but is not limited to this. The substrate driving device 20 may also be used. A device for driving the substrate P is provided on the side (or each of the substrate exchange device 30 and the substrate stage device 20).

In the above-mentioned first to fourth embodiments (and modified examples), the second substrate P ₂ is subjected to the second substrate in a state where the exposed substrate P _{1 is} suspended overhanging on the overhang supporting device 50 (50a, 50b). The carrying-in operation of the holder 26 is not limited to this. For example, the substrate exchange device 30 may be used to transfer the next substrate P ₂ from the plurality of air guides 38 in advance during the exposure operation of the substrate P ₁ . To the overhanging support device 50 (the second substrate P _{2 is} standby at the substrate exchange position in advance), and after the exposure operation for the substrate P ₁ is completed, the movement from the overhanging support device 50 (50a, 50b) to the substrate exchange position is performed The substrate holder 26 is moved out of the substrate P ₁ , and thereafter, the substrate P _{2 is} placed on the substrate holder 26 by driving the non-contact jig device 52 downward.

The illumination light may be ultraviolet light such as ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248 nm), or vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm). In addition, as the illumination light, a single-wavelength laser light such as an infrared band or a visible light band emitted from a DFB semiconductor laser or an optical fiber laser may be used, for example, as a fiber amplifier doped with erbium (or both erbium and mirror) The amplitude is converted to harmonics of ultraviolet light using non-linear optical crystals. Furthermore, a solid laser (wavelength: 355 nm, 266 nm) or the like may be used.

In addition, although the case where the projection optical system 16 is a multi-lens type projection optical system having a plurality of projection optical systems has been described, the number of projection optical systems is not limited to this, as long as it is one or more. The projection optical system is not limited to the multi-lens projection optical system, and may be, for example, a projection optical system using a large reflector of the Ofner type. The projection optical system 16 may be an enlargement system or a reduction system.

In addition, the application of the exposure device is not limited to an exposure device for liquid crystal in which a liquid crystal display element pattern is transferred to an angular glass plate, and it can also be widely applied to, for example, We produce exposure devices for organic EL (Electro-Luminescence) panel manufacturing, exposure devices for semiconductor manufacturing, thin-film magnetic heads, micro-machines, and DNA wafers. In addition to manufacturing micro-devices such as semiconductor devices, photomasks or reticle used for photo-exposure devices, EUV exposure devices, X-ray exposure devices, and electron-ray exposure devices can also be applied to The circuit pattern is transferred to an exposure device such as a glass substrate or a silicon wafer.

The object to be exposed is not limited to a glass plate, and may be, for example, another object such as a wafer, a ceramic substrate, a film member, or a photomask substrate. In addition, when the object to be exposed is a substrate for a flat display, the thickness of the substrate is not particularly limited, and for example, a film shape (a flexible sheet-like member) is also included. In addition, the exposure apparatus of this embodiment is particularly effective when a substrate having a side length or a diagonal length of 500 mm or more is an object to be exposed.

Electronic components such as liquid crystal display elements (or semiconductor elements) are manufactured through the following steps, that is, the steps of designing the function and performance of the elements, the steps of making a photomask (or reticle) according to this design step, and manufacturing The steps of the glass substrate (or wafer), the lithography step of transferring the pattern of the photomask (reticle) to the glass substrate according to the exposure apparatus and the exposure method of the above embodiments, and the development of the exposed glass substrate. A development step, an etching step to remove exposed members other than the remaining portion of the resist by etching, a resist removal step to remove unnecessary resist due to the end of the etching, an element assembly step, an inspection step, and the like. In this case, in the lithography step, since the foregoing exposure method is performed using the exposure apparatus of each of the above-mentioned embodiments to form an element pattern on a glass substrate, it is possible to manufacture a high-integrity element with good productivity.

In addition, the disclosures of all the publications of the exposure device, international publications, US patents, and US patent application publications cited in the above description are cited as part of the description of this specification.

As explained above, the object exchange method of the present invention is suitable for exchanging objects on an object holding device. In addition, the method for manufacturing a flat display of the present invention is suitable for producing a flat display. In addition, the device manufacturing method of the present invention is suitable for the production of micro devices.

20‧‧‧ substrate stage device

26‧‧‧ substrate holder

30‧‧‧ substrate exchange device

38‧‧‧air guide

40‧‧‧X drive unit

44‧‧‧Adsorption pad

50‧‧‧ Overhanging support device

52‧‧‧ Non-contact fixture device

P ₁ , P ₂ ‧‧‧ substrate

Claims (25)

An object exchange method is to exchange an object arranged at a predetermined object exchange position with another object, and includes: an action of placing an object holding device holding a first object at the aforementioned object exchange position; and suspending the first object at the aforementioned position The operation of the supporting device provided at the object exchange position; the operation of removing the first object suspended from the object holding device supported by the supporting device from the object holding device; inserting the second object into the first object suspended and supported by the supporting device; An operation of transferring the second object to the object holding device between the object holding devices; and moving the first object relative to the support device after the second object is transferred to the object holding device to move the first object Movement of the first object from the object exchange position. For example, the object exchange method according to item 1 of the patent application scope, wherein the first object faces the object holding device in a state of being held in the object holding device; the supporting action is to make the first object The other side is suspended and supported by the aforementioned supporting device in a non-contact state. For example, the object exchange method of the second item in the scope of the patent application, wherein the supporting action is performed by passing a gas at a high speed between the supporting device and the first object so that a force upward in the direction of gravity acts on the first object. . For example, the object exchange method according to any one of claims 1 to 3, wherein the loading operation is performed along the object holding device and an external guide member provided outside the object holding device. The carry-in guide surface moves the second object. For example, the object exchange method in the scope of patent application No. 4, wherein the above-mentioned move-in action is the The second object is suspended on the carrying-in guide surface. For example, the object exchange method according to item 4 or 5 of the patent application scope, wherein the carrying out action moves the first object along a carrying-out guide surface formed by the supporting device and the external guide member. For example, the object exchange method according to any one of claims 1 to 6, wherein the aforementioned moving-in operation and the aforementioned moving-out operation use a common driving device to move the aforementioned first and second objects. For example, the object exchange method of the seventh scope of the application for a patent, wherein the movement path of the first object in the aforementioned carrying-out action is the same as the movement path of the second object in the aforementioned carrying-in action. For example, the object exchange method of the sixth scope of the application for a patent, wherein the moving-in operation includes the operation of inclining the guiding surface for moving-in to a horizontal plane and moving the second object by the weight of the second object; The operation includes an operation of inclining the guide surface for carrying out with respect to a horizontal plane, and moving the first object by the weight of the first object. For example, the object exchange method according to any one of claims 1 to 3, in which the aforementioned loading operation is directly transferred to the aforementioned object by an external transfer device provided outside the aforementioned object holding device. Device; the aforementioned unloading action is that the first object is directly received from the supporting device by the external transfer device. An object exchange system, which exchanges objects arranged at a predetermined object exchange position with other objects, which includes: An object holding device capable of holding the aforementioned object; a supporting device provided at the aforementioned object exchange position and capable of suspending and supporting the aforementioned object; a drive train for holding the aforementioned object retaining device at the aforementioned object exchange position and the aforementioned object being suspended and supported by The state of the support device causes the object to be separated from the object holding device; and the object exchange device, by inserting another object between the object holding device and the object while the object holding device is away from the object, The other object is transferred to the object holding device, and the object is moved relative to the support device after the other object is transferred to the object holding device to move the object out of the object exchange position. For example, the object exchange system of the eleventh aspect of the patent application, wherein one side of the aforementioned object faces the object retaining device in a state of being held in the aforementioned object retaining device; and the aforementioned supporting device is to make the other side of the aforementioned object non-contact State overhang support. For example, the object exchange system according to item 12 of the application, wherein the supporting device passes a gas at a high speed to the object so that a force upward in the direction of gravity acts on the object. For example, the object exchange system according to any one of claims 11 to 13, wherein the object holding device includes an external guide provided outside the object holding device and forming an introduction guide surface with the object holding device. The guide member moves the other object along the carrying-in guide surface when the other object is carried into the object holding device. For example, the object exchange system according to item 14 of the application, wherein the object holding device and the external guide member suspend the other objects on the carry-in guide surface. For example, the object exchange system of the scope of application for patent No. 14 or 15, wherein the aforementioned objects are exchanged The changing device moves the object along a guide surface for carrying out formed by the support device and the external guide member to carry out the object. For example, the object exchange system according to any one of claims 11 to 16, wherein the aforementioned object exchange device uses a common driving device to move the aforementioned other objects and the aforementioned objects when the aforementioned other objects are moved in and out of the aforementioned objects. mobile. For example, the object exchange system according to item 17 of the application, wherein the object exchange device moves the other objects and the objects along the same movement path when the other objects are moved in and out. For example, the object exchange system according to item 16 of the application, wherein the object holding device and the object exchange device tilt the guide surface for carrying in with respect to the horizontal plane when the other objects are carried in, and make the Other objects move; the support device and the object exchange device tilt the guide surface for carrying out with respect to a horizontal plane when the object is carried out, and move the object by its own weight. For example, in the object exchange system of claim 19, at least a part of the face of the support device facing the object and the face of the external guide member facing the object overlap at least in a vertical direction. An exposure device includes: an object exchange system according to any of claims 11 to 20; and a pattern forming device for forming a predetermined pattern on an object held by the object holding device using an energy beam. For example, the exposure device according to the scope of patent application No. 21, wherein the aforementioned system is used for a substrate of a flat panel display device. For example, the exposure device according to item 22 of the patent application, wherein the length or diagonal length of at least one side of the substrate is 500 mm or more. A method for manufacturing a flat panel display includes the operation of exposing the aforementioned object using the exposure device of any one of claims 21 to 23, and the operation of developing the aforementioned object after exposure. A component manufacturing method includes the operation of exposing the aforementioned object by using the exposure device of claim 21, and the operation of developing the aforementioned object after exposure.