HK1188032A - Substrate-replacement device - Google Patents

Description

Substrate replacing device

Technical Field

The present invention relates to an object exchange system, an object exchange method, an object carrying-out method, an object holding device, an exposure apparatus, a flat panel display manufacturing method, and a device manufacturing method, and more particularly, to an object exchange system and a method for exchanging an object held by an object holding device, an object carrying-out method for carrying out an object from an object holding device, an object exchange method including the object carrying-out method, an object holding device for holding an object, an object exchange system including the object holding device, an exposure apparatus including the object holding device or the object exchange system, a scanning type exposure apparatus, a flat panel display manufacturing method using the exposure apparatus, and a device manufacturing method using the exposure apparatus.

Background

In a photolithography process for manufacturing electronic devices (microdevices) such as liquid crystal display devices and semiconductor devices (integrated circuits), an exposure apparatus of a step & scan (so-called scanning stepper (also called a scanner)) is used which moves a mask or a reticle (hereinafter, collectively referred to as a "mask") and a glass plate or a wafer (hereinafter, collectively referred to as a "substrate") in synchronization with each other in a predetermined scanning direction (scanning direction) and transfers a pattern formed on the mask onto the substrate using an energy beam.

Such an exposure apparatus carries a substrate to be exposed in and out of a substrate stage by using a substrate carrying device (see, for example, patent document 1).

Here, when the exposure process for the substrate held by the substrate stage is completed, the exposure apparatus carries out the substrate from the substrate stage and carries another substrate onto the substrate stage, thereby continuously performing the exposure process for the plurality of substrates. Therefore, when a plurality of substrates are continuously subjected to exposure processing, it is desirable that the substrates can be quickly carried out from the substrate stage.

Prior art documents

Patent document 1: specification of U.S. Pat. No. 6,559,928

Disclosure of Invention

In view of the above circumstances, the present invention provides an object exchange system 1 according to claim 1 for exchanging an object mounted on an object holding member included in an object holding device, the object exchange system including: a carrying-in device for carrying the object to be carried in to the upper part of the object holding member; a carrying-out device for carrying out the object to be carried out loaded on the object loading surface of the object holding member from the object holding member in a direction along the object loading surface; an object receiving device provided in the object holding device and configured to receive the object to be carried in from the carrying-in device; and a guide provided in the object holding device and defining a guide surface for guiding the object to be carried out by the carrying-out device.

Accordingly, when the object to be carried out is carried out from the object holding member, the object is guided by the guide provided in the object holding device and carried out along the object mounting surface of the object holding member, and therefore, it is not necessary to position a member for collecting the object from the object holding member above the object holding member. Therefore, the object can be carried out quickly. In addition, a space in which the carry-in device can be located is only required to be provided above the object holding member.

The 1 st object replacing method according to the 2 nd aspect of the present invention is an object to be replaced loaded on an object holding member included in an object holding device, including: an operation of conveying the object to be carried in to the upper part of the object holding member; receiving the object to be carried in which the object is carried to the upper side of the object holding member by using an object receiving device provided in the object holding device; and an operation of guiding the object to be carried out loaded on the object loading surface of the object holding member to a guide surface defined by a guide provided in the object holding device, and carrying out the object from the object holding device in a direction along the object loading surface from above the object holding member.

An object carrying out method according to claim 3 of the present invention is an object carrying out method for carrying out an object loaded on an object holding member of an object holding device from the object holding member, including: an operation of moving the object holding device holding the object toward an object carry-out position at which the object is carried out from the object holding member; and an operation of starting a carrying-out operation of carrying out the object from the object holding member before the object holding device reaches the object carrying-out position.

Accordingly, since the object carrying-out operation is started before the object holding device reaches the object carrying-out position, the object can be carried out from the object holding member quickly.

The object replacing method of claim 2 according to claim 4, comprising: starting the operation of the carrying-out operation by the object carrying-out method according to the aspect 3 of the present invention; an operation of waiting for another object at a predetermined waiting position before the object holding device reaches the object carry-out position; an operation of carrying out the object from the object holding device in a state where the object holding device is located at the object carry-out position; and an operation of carrying the other object located at the standby position into the object holding device.

A 3 rd object replacing method according to claim 5 of the present invention is a method for replacing an object mounted on an object holding member included in an object holding device, the method including: an operation of conveying the object to be carried in to the upper part of the object holding member; receiving the object to be carried in which the object is carried to the upper side of the object holding member by using an object receiving device provided in the object holding device; and guiding the object to be carried out mounted on the object mounting surface of the object holding member to a guide surface defined by a guide provided in the object holding device, and carrying out the object from the object holding member in a direction of the object mounting surface by using an object carrying-out device provided in the object holding device.

An object holding device according to claim 6 of the present invention includes: an object holding member having an object loading surface on which an object to be carried in is loaded, the object holding member being capable of holding the object loaded on the object loading surface; and a carrying-out device for carrying out the object held by the object holding member from the object holding member to the outside.

Accordingly, since the object holding device includes the carrying-out device, the carrying-out operation of the object can be performed at an arbitrary timing. Therefore, the object can be quickly carried out from the object holding device.

The 2 nd object exchange system according to claim 7 includes: the object holding device according to claim 6 of the present invention; a carrying-in device for carrying the object to be carried in to the upper part of the object holding member; an object receiving device provided in the object holding device and configured to receive the object to be carried in from the carrying-in device; and a guide provided in the object holding device and defining a guide surface for guiding the object to be carried out by the carrying-out device.

The 1 st exposure apparatus according to claim 8 of the present invention includes: any one of the object holding device according to claim 6, the 1 st object exchange system according to claim 1, and the 2 nd object exchange system according to claim 7; and a patterning device for forming a predetermined pattern on the object held by the object holding device by using an energy beam.

The 2 nd exposure apparatus according to claim 9 of the present invention is a scanning type exposure apparatus for moving an object in a scanning direction with respect to an energy beam during exposure, comprising: a 1 st moving body movable in a 1 st direction orthogonal to the scanning direction on a predetermined two-dimensional plane; a 2 nd moving body movable in a 2 nd direction parallel to the scanning direction on the 1 st moving body and movable in the 1 st direction together with the 1 st moving body; an object holding device that is provided so as to be capable of holding the object, is disposed above the 2 nd movable body, and is guided in a direction parallel to the predetermined two-dimensional plane integrally with the object by the movement of the 2 nd movable body; and a carrying-out device provided in the 1 st moving body and driving the object in a predetermined carrying-out direction with respect to the object holding device.

Accordingly, since the carrying-out device for carrying out the object is provided in the 1 st moving body that moves in the direction orthogonal to the scanning direction, the inertial mass of the 2 nd moving body that moves in the scanning direction increases, and the position of the object can be controlled with high accuracy particularly at the time of scanning exposure.

The method for manufacturing a flat panel display according to claim 10 of the present invention comprises: exposing the object by using the 1 st exposure apparatus according to the 8 th aspect of the present invention or the 2 nd exposure apparatus according to the 9 th aspect of the present invention; and an operation of developing the exposed object.

The device manufacturing method according to claim 11 of the present invention includes: exposing the object by using the 1 st exposure apparatus according to the 8 th aspect of the present invention or the 2 nd exposure apparatus according to the 9 th aspect of the present invention; and an operation of developing the exposed object.

Drawings

Fig. 1 is a view schematically showing the configuration of a liquid crystal exposure apparatus according to embodiment 1.

Fig. 2 is a plan view of a substrate stage (substrate holder), a substrate carry-in device, and a substrate carry-out device included in the liquid crystal exposure apparatus of fig. 1.

Fig. 3 is a cross-sectional view of the substrate stage of fig. 2 taken along line a-a.

Fig. 4(a) and 4(B) are views (1 and 2) for explaining the substrate replacement operation according to embodiment 1.

Fig. 5(a) and 5(B) are diagrams (3 and 4 thereof) for explaining the substrate replacement operation according to embodiment 1.

Fig. 6(a) and 6(B) are views (5 and 6) for explaining the substrate replacement operation according to embodiment 1.

Fig. 7(a) and 7(B) are views (7 and 8) for explaining the substrate replacement operation according to embodiment 1.

Fig. 8a and 8B are views (9 and 10) for explaining the substrate replacement operation according to embodiment 1.

Fig. 9 is a plan view of the substrate stage (substrate holder), the substrate carry-in device, and the substrate carry-out device according to embodiment 2.

Fig. 10 is a cross-sectional view taken along line B-B of fig. 9.

Fig. 11 is a view schematically showing the configuration of the liquid crystal exposure apparatus according to embodiment 3.

Fig. 12 is a plan view of a substrate stage (substrate holder), a substrate loading device, and a port unit included in the liquid crystal exposure apparatus of fig. 11.

Fig. 13 is a cross-sectional view of the substrate stage of fig. 12 taken along the line C-C (cross-sectional view of fig. 12).

Fig. 14(a) and 14(B) are diagrams (1 and 2 thereof) for explaining the substrate replacement operation according to embodiment 3.

Fig. 15(a) and 15(B) are views (3 and 4 thereof) for explaining the substrate replacement operation according to embodiment 3.

Fig. 16(a) and 16(B) are views (5 and 6) for explaining the substrate replacement operation according to embodiment 3.

Fig. 17(a) and 17(B) are views (7 and 8) for explaining the substrate replacement operation according to embodiment 3.

Fig. 18(a) and 18(B) are views (9 and 10) for explaining the substrate replacement operation according to embodiment 3.

Fig. 19 is a diagram for explaining the relationship between the substrate stage and the port portion when the substrate of embodiment 3 is carried out.

Fig. 20(a) to 20(C) are views (1 to 3) for explaining the substrate operation at the time of carrying out the substrate according to embodiment 3.

Fig. 21 is a plan view of the substrate stage (substrate holder), the substrate loading device, and the port unit according to embodiment 4.

Fig. 22 is a cross-sectional view of the substrate stage (substrate holder), the substrate carry-in device, and the port portion of fig. 21.

Fig. 23 is a plan view of the substrate stage (substrate holder), the substrate loading device, and the port unit according to embodiment 5.

Fig. 24 is a sectional view of the substrate stage according to embodiment 6.

Fig. 25(a) to 25(C) are views (1 to 3) for explaining the substrate replacement operation according to embodiment 6.

Fig. 26(a) to 26(C) are views (1 to 3) for explaining the substrate replacement operation according to modification 1.

Fig. 27(a) to 27(C) are views (4 to 6) for explaining the substrate replacement operation according to the modification 1.

Fig. 28 is a plan view of the substrate stage device (substrate holder and substrate carry-out device) according to modification 2.

Fig. 29 a and 29B are views (1 and 2) for explaining the substrate replacement operation according to the modification 3.

Fig. 30(a) and 30(B) are diagrams (3 and 4 thereof) for explaining the substrate replacement operation of the 3 rd modification.

Fig. 31 is a view schematically showing the configuration of a liquid crystal exposure apparatus according to embodiment 7.

Fig. 32 is a plan view of a substrate stage device included in the liquid crystal exposure apparatus of fig. 31.

Fig. 33 is a side view of the substrate stage device of fig. 32, as viewed from + Y side.

Fig. 34 is a cross-sectional view taken along line E-E of the substrate stage device of fig. 33.

Fig. 35 is a plan view of a substrate stage (substrate holder), a substrate loading device, and a port provided in the liquid crystal exposure apparatus according to embodiment 7.

Fig. 36(a) and 36(B) are views (1 and 2) for explaining the substrate replacement operation according to embodiment 7.

Fig. 37 a and 37B are views (3 and 4) for explaining the substrate replacement operation according to embodiment 7.

Fig. 38(a) and 38(B) are views (5 and 6) for explaining the substrate replacement operation according to embodiment 7.

Fig. 39(a) and 39(B) are views (7 and 8) for explaining the substrate replacement operation according to embodiment 7.

Fig. 40(a) and 40(B) are views (9 and 10) for explaining the substrate replacement operation according to embodiment 7.

Fig. 41(a) and 41(B) are views (11 and 12) for explaining the substrate replacement operation according to embodiment 7.

Fig. 42 is a plan view of the substrate stage according to embodiment 8, showing a state before the substrate carry-out operation.

Fig. 43 is a cross-sectional view of the substrate stage of fig. 42.

Fig. 44 is a plan view of the substrate stage according to embodiment 8, showing a state during a substrate carry-out operation.

Fig. 45 is a cross-sectional view of the substrate stage of fig. 44.

Fig. 46 is a diagram showing a substrate stage of modification 4.

Fig. 47 is a plan view of a substrate holder included in a substrate stage device according to modification 5.

Fig. 48(a) is a sectional view taken along line F-F of fig. 47, fig. 48(B) is a sectional view taken along line G-G of fig. 48(a), and fig. 48(C) is a view for explaining the operation of the substrate lifting device according to the 5 th modification.

Fig. 49(a) and 49(B) are views showing the internal structure of the substrate lifting apparatus of fig. 48(a) (1 and 2 thereof).

Fig. 50(a) to 50(D) are views (1 to 4) for explaining the substrate carrying-in and carrying-out operation of the substrate stage according to the modification 5.

Fig. 51(a) and 51(B) are views showing a substrate lifting device according to a modification 6 (1 and 2 thereof).

Fig. 52 is a diagram showing a substrate stage device according to modification 7.

Fig. 53 is a diagram showing a substrate stage device according to modification 8.

Detailed Description

Embodiment 1

Hereinafter, embodiment 1 will be described with reference to fig. 1 to 8 (B).

Fig. 1 schematically shows the structure of a liquid crystal exposure apparatus 10a according to embodiment 1. The liquid crystal exposure apparatus 10a is a projection exposure apparatus using, for example, a rectangular (square) glass substrate P (hereinafter, simply referred to as a substrate P) used in a liquid crystal display device (flat panel display) or the like as an exposure object.

The liquid crystal exposure apparatus 10a includes: illumination system IOP, mask stage MST for holding mask M, projection optical system PL, substrate stage device PSTa for holding substrate P coated with photoresist (sensitive agent) on its surface (surface facing + Z side in fig. 1), substrate carry-in device 80a, port 90 for accepting and transferring substrate with external device, and control systems for these. Hereinafter, the direction in which the mask M and the substrate P are respectively scanned with respect to the projection optical system PL during exposure is referred to as an X-axis direction, a direction orthogonal to the X-axis in a horizontal plane is referred to as a Y-axis direction, and directions orthogonal to the X-axis and the Y-axis are referred to as Z-axis directions, and directions rotated around the X-axis, the Y-axis, and the Z-axis are referred to as θ X, θ Y, and θ Z directions, respectively. The positions in the X-axis, Y-axis, and Z-axis directions are referred to as X position, Y position, and Z position, respectively.

The illumination system IOP has the same configuration as that of the illumination system disclosed in, for example, U.S. Pat. No. 6,552,775 and the like. That is, the illumination system IOP irradiates the mask M with light emitted from a light source (e.g., a mercury lamp), not shown, as exposure illumination light (illumination light) IL via a mirror, a dichroic mirror, a curtain, a filter, various lenses, and the like, not shown, respectively. The illumination light IL is, for example, light of i-line (wavelength 365nm), g-line (wavelength 436nm), h-line (wavelength 405nm), etc. (or synthesized light of the above-mentioned i-line, g-line, h-line).

The mask M having a pattern surface on which a circuit pattern or the like is formed is held by suction on the mask stage MST, for example, by vacuum suction. The mask stage MST is mounted on a lens barrel stage 16 which is a part of the apparatus main body (body), and is driven in the scanning direction (X-axis direction) by a predetermined long stroke by a mask stage drive system (not shown) including, for example, a linear motor, and is finely driven in the Y-axis direction and the θ z direction as appropriate. Positional information of mask stage MST in the XY plane (including rotation information in the θ z direction) is measured by a mask interferometer system including a laser interferometer (not shown).

Projection optical system PL is disposed below mask stage MST and supported by barrel stage 16. The projection optical system PL has the same configuration as that of the projection optical system disclosed in, for example, U.S. Pat. No. 6,552,775. That is, the projection optical system PL includes a plurality of projection optical systems in which the pattern image projection area of the mask M is arranged in a zigzag shape, and can exhibit the same function as a projection optical system having a rectangular single image field with the Y-axis direction as the longitudinal direction (so-called multi-lens projection optical system). In this embodiment, the plural projection optical systems form erect images using, for example, a bilateral telecentric system with an equal magnification system.

Therefore, when the illumination area on the mask M is illuminated with the illumination light IL from the illumination system IOP, the projection image (partial erected image) of the circuit pattern of the mask M in the illumination area is formed on the substrate P through the projection optical system PL in the projection image (exposure area) of the illumination light IL, which is conjugate to the illumination area, by the illumination light IL passing through the mask M. Then, by synchronously driving mask stage MST and substrate stage device PSTa, mask M is moved in the scanning direction with respect to the illumination area (illumination light IL), and substrate P is moved in the scanning direction with respect to the exposure area (illumination light IL), so that scanning exposure is performed on 1 illumination area on substrate P, and the pattern formed on mask M is transferred to the illumination area. That is, in the present embodiment, a pattern of the mask M is formed on the substrate P by the illumination system IOP and the projection optical system PL, and the pattern is formed on the substrate P by exposure of the sensitive layer (resist layer) on the substrate P to the illumination light IL.

Substrate stage device PSTa includes a stage 12 and a substrate stage 20a disposed above stage 12.

The surface plate 12 is formed of a plate-like member having a rectangular shape in a plan view (as viewed from the + Z side), and its upper surface is processed to have a very high flatness. Platform 12 is mounted on a substrate stage mounting 13 which is a part of the apparatus main body. The apparatus main body including substrate stage mount 13 is mounted on vibration isolator 14 provided on floor surface 11 of the clean room, and thus mask stage MST, projection optical system PL, and the like are separated in terms of vibration from floor surface 11.

The substrate stage 20a includes: x coarse movement stage 23X, Y coarse movement stage 23Y mounted on X coarse movement stage 23X and constituting a so-called gantry (gantry) -type XY dual-axis stage device together with X coarse movement stage 23X, fine movement stage 21 arranged on the + Z side (above) of Y coarse movement stage 23Y, substrate holder 30a holding substrate P, weight cancellation device 26 supporting fine movement stage 21 from below on stage 12, and a plurality of substrate lift devices 46a (not shown in fig. 1, see fig. 3) for separating substrate P from substrate holder 30a, and the like.

X coarse movement stage 23X is formed of a rectangular member whose longitudinal direction is the Y-axis direction in a plan view, and has an elongated hole-shaped opening (not shown) whose longitudinal direction is the Y-axis direction formed in the center portion thereof. X coarse movement stage 23X is mounted on a guide, not shown, provided on floor surface 11 separately from the apparatus main body and extending in the X axis direction, and is driven in the X axis direction by a predetermined stroke by an X stage drive system including a linear motor and the like, for example, at the time of scanning operation at the time of exposure, substrate replacement operation, and the like.

Y coarse movement stage 23Y is formed of a member having a rectangular shape in plan view, and has an opening (not shown) formed in the center thereof. Y coarse movement stage 23Y is mounted on X coarse movement stage 23X through Y linear guide 25, and is driven in the Y axis direction by a predetermined stroke on X coarse movement stage 23X by a Y stage drive system including a linear motor and the like, for example, at the time of Y stepping operation at the time of exposure. Further, Y coarse movement stage 23Y moves in the X-axis direction integrally with X coarse movement stage 23X by the action of Y linear guide 25.

The fine movement stage 21 is composed of a low-height rectangular parallelepiped member having a substantially square shape in plan view. Fine movement stage 21 is fine-driven in the 6-degree-of-freedom direction (X-axis, Y-axis, Z-axis, θ X, θ Y, and θ Z directions) with respect to Y coarse movement stage 23Y by a fine movement stage drive system including a plurality of voice coil motors (or linear motors) composed of a stator fixed to Y coarse movement stage 23Y and a mover fixed to fine movement stage 21. The plurality of voice coil motors include a plurality of X voice coil motors 29X that micro-drive the micro-movement stage 21 in the X-axis direction (overlapped in the depth direction of the drawing in fig. 1), a plurality of Y voice coil motors (not shown) that micro-drive the micro-movement stage 21 in the Y-axis direction, and a plurality of Z voice coil motors 29Z that micro-drive the micro-movement stage 21 in the Z-axis direction (for example, arranged at positions corresponding to the four corners of the micro-movement stage 21).

Fine movement stage 21 is guided by Y coarse movement stage 23Y through the plurality of voice coil motors, and moves in the X-axis direction and/or the Y-axis direction along the XY plane with a predetermined stroke. The positional information in the XY plane of fine movement stage 21 is obtained by a substrate interferometer system including interferometers (including an X interferometer that measures the X position of fine movement stage 21 using X movement mirror 22X and a Y interferometer that measures the Y position of fine movement stage 21 using Y movement mirror), not shown, that irradiate a distance measuring beam onto a movement mirror (including X movement mirror 22X having a reflection surface orthogonal to the X axis and Y movement mirror (not shown)) fixed to fine movement stage 21 through mirror base 24. The structure of the micro stage drive system and the substrate interferometer system is disclosed in, for example, U.S. patent application publication No. 2010/0018950.

As shown in fig. 3, on fine movement stage 21, a plurality of holes 21a having openings (penetrating in the Z-axis direction) on the upper surface (+ Z-plane) and the lower surface (-Z-plane) thereof are formed at positions corresponding to a plurality of substrate lifting devices 46a described later. In addition, a hole 24a corresponding to the substrate lifting device 46a is also formed in the mirror base 24.

The substrate holder 30a is formed of a low-height rectangular parallelepiped member having a rectangular shape in a plan view with the X-axis direction as the longitudinal direction, and is fixed to the upper surface of the fine movement stage 21. A plurality of holes, not shown, are formed in the upper surface of the substrate holder 30 a. The substrate holder 30a is selectively connected to a vacuum device and a compressor (both not shown) provided outside the substrate stage 20a, and can hold the substrate P (not shown in fig. 3, see fig. 1) by suction by the vacuum device and suspend the substrate P with a small gap therebetween by discharging a pressurized gas supplied from the compressor. The suction and discharge of the gas may be performed using a common hole, or may be performed using dedicated holes.

Further, in the substrate holder 30a, a plurality of holes 31a opened (penetrating in the Z-axis direction) in the upper surface (+ Z-plane) and the lower surface (-Z-plane) thereof are formed at positions corresponding to the plurality of substrate lifting devices 46a described later. As can be seen from fig. 2 and 3, a notch 32 is formed in the center of the + X side end portion in the Y axis direction on the upper surface of the substrate holder 30a, the notch opening to the + Z side and the + X side.

As shown in fig. 3, the weight cancellation device 26 is formed of a pillar-shaped member (also referred to as a stem) extending in the Z-axis direction, and supports the central portion of the fine movement stage 21 from below via a device referred to as a leveling device 27. Weight cancellation device 26 is inserted into an opening of each of X coarse movement stage 23X (not shown in fig. 3, see fig. 1) and Y coarse movement stage 23Y. The weight eliminating device 26 is suspended on the stage 12 with a slight gap by a plurality of air bearings 26a mounted on the lower portion thereof. Weight cancellation device 26 is connected to Y coarse movement stage 23Y at the height position of the center of gravity in the Z-axis direction thereof via a plurality of connection devices 26b, and is moved on table 12 in the Y-axis direction and/or the X-axis direction together with Y coarse movement stage 23Y by being pulled by Y coarse movement stage 23Y.

The weight canceling device 26 includes, for example, an air spring (not shown), and cancels (cancels) the weight (vertical downward force) of the system including the fine movement stage 21, the leveling device 27, the substrate holder 30a, and the like by the vertically upward force generated by the air spring, thereby reducing the load on the plurality of voice coil motors included in the fine movement stage drive system. The leveling device 27 supports the fine movement stage 21 from below so as to be swingable (tilt-operate) with respect to the XY plane. The leveling device 27 supports the weight cancellation device 26 from below in a non-contact manner via an air bearing, not shown. The tilt information of the fine movement stage 21 with respect to the XY plane is obtained by using a target 26d attached to the weight cancellation device 26 by a plurality of Z sensors 26c attached to the lower surface of the fine movement stage 21. Including the leveling device 27 and the connecting device 26b, the detailed structure and operation of the weight reducing device 26 are disclosed in, for example, U.S. patent publication No. 2010/0018950.

Each of the plurality of substrate lift-up devices 46a includes a Z actuator 47 fixed to the upper surface of the Y coarse movement stage 23Y, and a lift pin (lift pin)48a driven in the Z-axis (vertical) direction by the Z actuator 47 between a position protruding from the upper surface (substrate mounting surface) of the substrate holder 30a toward + Z side and a position retracted from the upper surface of the substrate holder 30a toward-Z side. Substrate lift-up device 46a includes lift-up pin 48a, and its + Z side end portion is inserted into hole 21a formed in fine movement stage 21 (or hole 24a formed in mirror base 24) and hole 31a formed in substrate holder 30 a. Between substrate lift device 46a and the wall surfaces of predetermined holes 21a, 24a, and 31a, a gap is set to such an extent that fine movement stage 21 does not contact each other when it is micro-driven on Y coarse movement stage 23Y.

As shown in fig. 2 (however, only the lift pins 48a are shown in fig. 2, and the Z actuator 47 (see fig. 3) is not shown), the plurality of substrate lift devices 46a are disposed apart from each other at a predetermined interval so as to support the lower surface of the substrate P substantially uniformly. In embodiment 1, a substrate lifter array including a plurality of (e.g., 4) substrate lifters 46a arranged at predetermined intervals in the Y-axis direction has a plurality of (e.g., 6) rows arranged at predetermined intervals in the X-axis direction. In embodiment 1, for example, 24 substrate lifting devices 46a are used in total to separate (lift) the substrate P from the substrate holder 30a, but the number and arrangement of the substrate lifting devices 46a are not limited thereto, and may be appropriately changed depending on the size of the substrate P, for example. The type of the Z actuator 47 is not particularly limited, and for example, a cylinder device, a feed screw device, a cam device, or the like can be used.

Returning to fig. 1, the substrate loading device 80a is disposed above (on the + Z side) the port 90 described later. As shown in fig. 2, the substrate loading device 80a includes a pair of X travel guides 81, a pair of X sliders 82 provided corresponding to the pair of X travel guides 81, and a loading arm 83 disposed between the pair of X sliders 82.

The pair of X travel guides 81 are each formed of a member extending in the X axis direction, and the longitudinal dimension thereof is set to be slightly longer than the X axis dimension of the substrate P. The pair of X travel guides 81 are arranged parallel to each other at a predetermined interval (an interval slightly wider than the dimension of the substrate P in the Y axis direction) in the Y axis direction. Each of the pair of X-sliders 82 is engaged with the corresponding X-travel guide 81 so as to be slidable in the X-axis direction, and is driven synchronously along the X-travel guide 81 by an actuator (not shown) (e.g., a feed screw device, a linear motor, a belt drive device, etc.) at a predetermined stroke.

A loading arm 83 having a base 83 with a plate-like portion parallel to an XY plane extending in the Y-axis direction₁And a plurality of (e.g., 4) support parts 83 for supporting a plate-like portion parallel to an XY plane extending in the X-axis direction₂. Base 83₁The dimension in the longitudinal direction (Y-axis direction) of the substrate P is set to be slightly shorter than the dimension of the substrate P in the Y-axis direction. Plural support parts 83₂Are arranged in parallel with each other at a predetermined interval in the Y-axis direction, and the respective + X-side end and base 83₁Are integrally connected to the X-side end of the base. Base 831 and a plurality of support portions 83₂For example, CFRP (carbon Fiber Reinforcement plastics) and the like are integrated. Plural support parts 83₂Is set to be slightly shorter than the substrate P in the X-axis direction, and the base 83 of the substrate P₁the-X side region and a plurality of supporting parts 83₂Supported from below. The Z position of the loading arm 83 is set to the-Z side of the X travel guide 81 as shown in fig. 1.

Returning to FIG. 2, a plurality of supporting portions 83₂A plurality of (e.g., 3) suction pads 84 are attached to the upper surfaces of the respective substrates and arranged at predetermined intervals in the X-axis direction. The loading arm 83 is connected to a non-illustrated armIn the vacuum apparatus shown, the substrate P can be held by suction using the plurality of suction pads 84. Loading arm 83 with base 83₁Positive Y side and negative Y side end parts of (2) penetrate through the mounting member 83₃The X sliders 82 connected to the + Y side and the-Y side, respectively, are driven in synchronization with each other in the X axis direction by the pair of X sliders 82, so that the substrate P can be moved in parallel with the XY plane and in a predetermined stroke in the X axis direction between the upper region of the port 90 shown in fig. 1 and the upper region near the + X side end of the stage 12. In the substrate loading device 80a, the loading arm 83 may be configured to be movable up and down with respect to the pair of X travel guides 81 (or the pair of X travel guides 81 may be integrated).

Returning to fig. 1, the port 90 includes a mount 91, a plurality of guides 92, and a substrate unloading device 93. Stage 91 is provided on floor surface 11 at a position on the + X side of stage 12, and is accommodated in a chamber (chamber) not shown together with substrate stage device PSTa.

The plurality of guides 92 are each formed of a plate-like member parallel to the XY plane, and support the substrate P from below. The plurality of guides 92 are synchronously driven in the Z-axis (vertical) direction by Z actuators 94 fixed to the mount 91. A plurality of not-shown minute holes are formed in the upper surface of the guide 92, and pressurized gas (for example, air) is ejected from the holes to levitate and support the substrate P with a minute gap therebetween. The guide 92 may be configured to suck and hold the substrate P through the plurality of holes (or other holes).

As shown in fig. 2, the plurality of guides 92 are arranged at predetermined intervals apart from each other to support the lower surface of the substrate P substantially uniformly. In embodiment 1, a guide row composed of a plurality of (e.g., 3) guides 92 arranged at predetermined intervals in the X-axis direction has a plurality of (e.g., 4) rows arranged at predetermined intervals in the Y-axis direction. As described above, the port 90 according to embodiment 1 supports the substrate P from below by using the guide 92 having a total of, for example, 12 stages.

Here, the plurality of guides 92 are disposed in the Y-axis direction in a state where the loading arm 83 of the substrate loading device 80a is positioned above the port 90 (in a state where the loading arm 83 is positioned at the + X-side stroke end point)A plurality of supporting parts 83 which are not positioned with the loading arm 83₂And (4) overlapping. In this way, when the plurality of guides 92 are synchronously driven in the + Z direction in a state where the loading arm 83 is positioned above the port 90, the plurality of guides 92 can pass through the adjacent support portions 83 without contacting the loading arm 83₂In the meantime. Further, the intervals in the Y axis direction of the plurality of substrate lifting devices 46a of the substrate stage 20a are substantially the same as the intervals in the Y axis direction of the plurality of guides 92, and when the plurality of lift pins 48a are driven in the + Z direction in a state where the loading arm 83 is positioned above the substrate holder 30a, the plurality of lift pins 48a can pass through the adjacent support portions 83 without contacting the loading arm 83₂And (3) removing the solvent.

Returning to fig. 1, the substrate unloading device 93 includes an X travel guide 95, a plurality of Z actuators 96 for moving the X travel guide 95 up and down, an X slider 97 moving in the X axis direction by a predetermined stroke on the X travel guide 95, and an adsorption pad 98 mounted on the X slider 97.

The X-travel guide 95 is formed of a member extending in the X-axis direction, and is disposed between the 2 nd row and the 3 rd row among the plurality of rows (for example, 4 rows) of guides as shown in fig. 2. Returning to fig. 1, the Z actuator 96 is provided with, for example, 2 stages separated in the X-axis direction. The X-slider 97 is engaged with the X-travel guide 95 so as to be slidable in the X-axis direction, and is driven by an actuator (not shown) (e.g., a feed screw device, a linear motor, a belt drive device, etc.) along the X-travel guide 95 by a predetermined stroke (a stroke having a dimension substantially equal to the X-axis dimension of the substrate P). The suction pad 98 is formed of a plate-like member parallel to the XY plane, and has a hole for vacuum suction formed on its upper surface (surface facing the + Z side). In the substrate carrying-out device 93, the X slider 97 and the suction pad 98 are moved in the Z-axis direction (up-and-down movement) by being driven by the plurality of Z actuators 96 via the X travel guide 95.

The liquid crystal exposure apparatus 10a (see fig. 1) configured as described above is configured to load the mask M onto the mask stage MST by the mask loader (not shown) and to load the substrate P onto the substrate holder 30a by the substrate loading device 80a under the control of the main controller (not shown). After that, the main controller performs alignment measurement using an alignment detection system (not shown), and after the alignment measurement is completed, the step & scan exposure operation is performed successively on the plurality of irradiation areas set on the substrate P. Since this exposure operation is the same as the step-and-scan type exposure operation that has been performed conventionally, a detailed description thereof will be omitted. Next, the substrate after the exposure processing is carried out of the substrate holder 30a, and another substrate to be exposed next is carried to the substrate holder 30a, whereby the substrate on the substrate holder 30a is replaced, and the exposure operation and the like are continuously performed on the plurality of substrates.

Hereinafter, the substrate P on the substrate holder 30a of the liquid crystal exposure apparatus 10a (for convenience, the plurality of substrates P will be referred to as "substrates P")₀Substrate P₁Substrate P₂Substrate P₃) The replacement operation (c) will be described with reference to fig. 4(a) to 4 (B). The following substrate replacement operation is performed under the management of a main control device, not shown.

In fig. 4(a), a substrate P is held by a substrate holder 30a of a substrate stage 20a₁. The substrate P is held by the loading arm 83 of the substrate loading device 80a₁After being carried out of the substrate holder 30a, the substrate P to be carried into the substrate holder 30a next time₂(the next substrate P₂). Further, the substrate P subjected to exposure is held by a transfer arm 19 of a substrate carrying-out robot provided outside the liquid crystal exposure apparatus 10a (see fig. 1)₀. Here, the shape of the transfer arm 19 of the substrate carrying-out robot and the transfer arm 18 of the substrate carrying-in robot described later are substantially the same as the loading arm 83 of the substrate carrying-in device 80a, but the transfer arm 19 and the transfer arm 18 are moved in the X-axis direction along the X-travel guide 81 with respect to the loading arm 83, and the vicinity of the + X-side end of each of the transfer arm 19 and the transfer arm 18 is supported (cantilever-supported) by the robot arms 19a and 18a, and the robot arms 19a and 18a are appropriately controlled to move in the X-axis direction.

The main control device is set on the substrate P₁In a plurality of irradiation regions,After the exposure process for the last shot area is completed, substrate stage 20a is moved from below projection optical system PL (see fig. 1) to a position (hereinafter referred to as a substrate replacement position) on stage 12 in the vicinity of the + X-side end and adjacent to port 90. At the substrate replacement position, as shown in fig. 2, the Y position of the substrate stage 20a, which is positioned in the Y-axis direction so that the notch 32, substantially coincides with the Y position of the substrate carry-out device 93. The substrate replacement position may be a substrate carry-out position (object carry-out position) at which the substrate P held by the substrate holder 30a (substrate stage 20a) is carried out from the substrate holder 30a (substrate stage 20a) as described later.

In parallel with the movement of the substrate stage 20a to the substrate replacement position, the loading arm 83 is driven in the-X direction in the substrate loading device 80a as shown in fig. 4(B), and the substrate P is thereby caused to move₂Is located above the substrate replacement position. In the substrate unloading device 93, the X slider 97 is driven in the-X direction by the X travel guide 95, and the suction pad 98 is inserted into the notch 32 of the substrate holder 30a located at the substrate replacement position.

Thereafter, as shown in fig. 5a, in the substrate carrying-out apparatus 93, the X travel guide 95 and the X slider 97 are driven in the + Z direction (the substrate holder 30a may be driven in the-Z direction) by the plurality of Z actuators 96 until the upper surface of the suction pad 98 contacts the substrate P₁The lower position of (a). The adsorption pad 98 adsorbs and holds the substrate P₁In the vicinity of the end of the lower + X side of the substrate. Further, the substrate holder 30a is released from the substrate P on the substrate stage 20a₁And the substrate P is held by suction from the upper surface of the substrate holder 30a₁The pressurized gas is ejected from the lower surface of the nozzle. The Z positions of the plurality of guides 92 are controlled so that the Z positions of the upper surfaces thereof are substantially the same as the Z positions of the upper surfaces of the substrate holders 30 a.

Next, as shown in fig. 5(B), in the substrate carrying-out device 93, the X slider 97 is driven in the + X direction on the X travel guide 95. Accordingly, the substrate P sucked and held by the suction pad 98₁Moves along a plane (guide surface) parallel to the XY plane formed by the upper surface of the substrate holder 30a and the upper surfaces of the plurality of guides 92In the + X direction, the substrate is carried out from the substrate holder 30a onto the plurality of guides 92. At this time, the substrate P is also faced from the upper surfaces of the plurality of guides 92₁The pressurized gas is ejected from the lower surface of the nozzle. Thus, the substrate P can be made to emit dust at a high speed and with low dust emission₁And (4) moving.

When the substrate P is₁When the carrying-out of (b) is finished, as shown in fig. 6(a), on the substrate stage 20a, the Z actuator 47 is synchronously controlled to move the lift pins 48a of the plurality of substrate lift devices 46a in the + Z direction, and the plurality of lift pins 48a pass through the support portions 83 of the loading arms 83₂Press the substrate P from below₂Below. Furthermore, the loading arm 83 releases the plural suction pads 84 from the substrate P₂The adsorption of (1) is maintained. Thus, the substrate P₂Away from the loading arm 83.

Substrate P₂After being separated from the loading arm 83, as shown in fig. 6(B), the loading arm 83 is driven in the + X direction in the substrate loading device 80a and retreats from above the substrate replacement position. In addition, in the substrate carrying-out apparatus 93, the X travel guide 95 and the X slider 97 are driven in the-Z direction by a plurality of Z actuators 96. Accordingly, a large space is formed between the substrate carry-in device 80a and the substrate carry-out device 93. In addition, the plurality of guides 92 are also slightly driven on the-Z side, the substrate P₁Slightly moving in the-Z direction. Further, the substrate P mounted on the transfer arm 19 of the substrate unloading robot₀Is conveyed to an external device (for example, a coating and developing device), and the substrate P is conveyed from the external device by the conveying arm 18 of the substrate carrying-in robot₂Is next scheduled to carry in the substrate P of the substrate holder 30a₃。

Thereafter, as shown in fig. 7(a), on substrate stage 20a, substrate P is moved in the-Z direction by synchronously controlling Z actuator 47 to move lift pin 48a of each of a plurality of substrate lift devices 46a₂Is mounted on the upper surface of the substrate holder 30 a. At this time, the Z position of the lift pin 48a is controlled so that the lift pin 48a and the substrate P are aligned₂The following is separated. Substrate P₂Is sucked and held by the substrate holder 30 a. Further, the support substrate P₃The transfer arm 18 of the substrate carrying-in robot is drivenIn the X direction, the substrate loading device 80a is inserted between a pair of X travel guides 81 (only one is shown in fig. 7a, see fig. 2). Thus, the transfer arm 18 of the substrate loading robot and the loading arm 83 of the substrate loading device 80a are arranged to overlap in the vertical direction. The transfer arm 19 of the substrate unloading robot is driven in the-X direction and inserted into a space between the loading arm 83 and the substrate unloading device 93. As described above, the transfer arm 19 and the loading arm 83 have substantially the same shape and therefore do not contact the guide 92. Accordingly, the transfer arm 19 of the substrate unloading robot and the loading arm 83 of the substrate loading device 80 are arranged to overlap in the vertical direction.

Then, the plurality of guides 92 are driven in the-Z direction, respectively, to thereby form the substrate P₁And delivered to a transfer arm 19 of a substrate carrying-out robot. Is supported with a substrate P₁The transfer arm 19 (2) is driven in the + X direction to transfer the substrate P as shown in FIG. 7(B)₁Is transported to an external device. Alternatively, the substrate P may be driven in the-Z direction instead of driving the plurality of guides 92 in the-Z direction₁The substrate P can be received by the transfer arm 19 by driving the substrate unloading robot in the + Z direction by the transfer arm 19₁. In addition, the plurality of guides 92 and the substrate carrying-out robot may be driven in the Z direction to carry out the substrate P₁Is delivered.

In the process of placing the substrate P₁After being delivered to the transfer arm 19, the guides 92 are driven in the + Z direction in synchronization as shown in fig. 8 (a). Each of the plurality of guides 92 is in contact with the substrate P on the upper surface thereof without contacting the loading arm 83 and the transfer arm 18₃The substrate P is placed₃To lift it away from the transfer arm 18.

Thereafter, as shown in fig. 8(B), the transfer arm 18 of the substrate carry-in robot is driven in the + X direction and retreats from the upper region of the substrate carry-out device 93. Then, the substrate P is supported from below₃The plurality of guides 92 are driven in the-Z direction by Z actuators 96, respectively. At this time, the guides 92 pass through the adjacent supporting portions 83 of the loading arms 83₂A substrate P₃The support portion 83 of the loaded arm 83₂The lower support (is handed over to this). Thereby, the state shown in FIG. 4(A) is returned (however, the substrate P₀Is changed to a substrate P₁Substrate P₁Is changed to a substrate P₂Substrate P₂Is changed to a substrate P₃). In fig. 7(B) to 8(B), the substrate P is shown to be held₂The substrate stage 20a of (1), the substrate P may be held by suction₂After (see fig. 7 a), the alignment measurement and exposure process are started immediately after moving away from the substrate replacement position.

As described above, according to embodiment 1, substrate P (fig. 4a to 8B) is substrate P₁) Since the upper surface of the substrate holder 30a is used as a guide surface, the substrate carrying-out operation on the substrate holder 30a can be performed quickly. When the substrate P is separated from the substrate holder 30a in order to carry out the substrate, the movement amount (rising amount) of the substrate P may be small. Therefore, in a state where the substrate stage 20a is positioned at the substrate replacement position, a space into which the loading arm 83 can be inserted is sufficient above the substrate holder 30a of the substrate stage 20 a. As described above, the substrate exchange system according to embodiment 1 (including the substrate loading device 80a and the substrate unloading device 93 using the upper surface of the substrate holder 30a as a part of the guide surface) can be used suitably even when the space between the substrate holder 30a and the lens barrel stage 16 (see fig. 1) is narrow.

EXAMPLE 2 embodiment

Next, embodiment 2 will be described with reference to fig. 9 and 10. The liquid crystal exposure apparatus according to embodiment 2 is the same as the liquid crystal exposure apparatus 10a (see fig. 1) according to embodiment 1 except for the configurations of the substrate holder 30b and the substrate lift-up device 46b, and therefore only differences will be described below, and the same reference numerals as those in embodiment 1 are given to the same components and functions as those in embodiment 1, and the description thereof will be omitted.

In the above-described embodiment 1, the substrate P is moved with the upper surface of the substrate holder 30a as a guide surface at the time of carrying out the substrate (see fig. 5a and 5B), whereas in the present embodiment 2, as shown in fig. 10, the difference is that the guide 48B attached to the Z actuator 47 of each of the plurality of substrate lifting devices 46B is moved with the guide surface.

As shown in FIG. 9, on the upper surface of the substrate holder 30b, X-grooves 31b extending in the X-axis direction are formed₁A plurality of lines (for example, 4 lines) are formed at predetermined intervals in the Y-axis direction. In addition, the X groove 31b is defined₁As shown in fig. 10, a through hole 31b penetrating the substrate holder 30b in the vertical direction₂Formed at predetermined intervals (e.g., 3) in the X-axis direction, and formed in the through-hole 31b₂Through a portion of the Z actuator 47.

The guide member 48b is in one of the grooves 31b₁A plurality of (e.g., 3) containers are accommodated at predetermined intervals in the X-axis direction. The guide 48b is formed of a plate-like member parallel to the XY plane, and is driven in the Z-axis (vertical) direction between a position on the upper surface of the substrate holder 30b (substrate mounting surface) projecting to the + Z side and a position retracting to the-Z side from the upper surface of the substrate holder 30b by the Z actuator 47. A plurality of fine holes (not shown) are formed in the upper surface of the guide 48b, and pressurized gas (for example, air) is ejected from the holes to suspend and support the substrate P (substrate P in fig. 10) through the fine gaps₁). The guide 48b may be configured to attract and hold the substrate P using the plurality of holes (or other holes). In embodiment 2, the X-groove 31b₁X-shaped grooves 31b are formed, for example, in 4 rows₁The number of the guide members 48b and the number and arrangement of the guide members are not limited to these, and may be changed as appropriate depending on the size of the substrate.

In embodiment 2, as shown in fig. 10, a substrate P to be carried out (substrate P in fig. 10)₁) When the substrate holder 30b is released, the substrate P is carried out₁The plurality of guides 48b are driven in the + Z direction synchronously in the state of being held by suction, and the substrate P₁Is separated from the upper surface of the substrate holder 30 b. The suction pad 98 of the substrate unloading device 93 is inserted into the upper surface of the substrate holder 30b and the substrate P₁Between the lower faces of (a). In addition, the present embodiment is described in 2 ndThe substrate holder 30b of the embodiment is not provided with the notch 32 as in the substrate holder 30a of the embodiment 1 shown in fig. 2.

Returning to FIG. 10, when the suction pad 98 is inserted between the upper surface of the substrate holder 30b and the substrate P₁In the plurality of substrate lifting devices 46b, the guide 48b is micro-driven in the-Z direction, whereby the substrate P is₁Is sucked and held by the suction pad 98. Then, the substrate P is aligned from the plurality of guides 48b₁To discharge pressurized gas to the lower surface of the substrate P₁The X slider 97 is driven in the + X direction in a floating state to drive the substrate P₁From above the guide 48b of the substrate stage 20b to the guide 92 of the port portion 90. Further, the next substrate P is referred to₂The loading operation into the substrate holder 30B is performed by supporting (suction-holding) the substrate P from below by the plurality of guides 48B in place of the plurality of pins 48a (see fig. 6a and 6B)₂Otherwise, the explanation is omitted because the same as the embodiment 1 (the plurality of guides 48b have the function of the plurality of knock pins 48 a).

In addition to the effects of embodiment 1, embodiment 2 described above does not require a notch for inserting the suction pad 98 in the substrate holder 30b, and therefore can suppress the substrate P mounted on the substrate holder 30b from being deflected. Further, since it is not necessary to drive the suction pad 98 in the Z-axis direction when the suction pad 98 sucks and holds the substrate P (see fig. 5a in embodiment 1 described above), the control of the port 90 can be easily performed. Further, since it is not necessary to discharge a pressurized gas for floating the substrate P from the upper surface of the substrate holder 30b, it is not necessary to provide a line or the like for supplying the pressurized gas, and the substrate holder 30b can be reduced in weight.

Embodiment 3

Next, embodiment 3 will be described with reference to fig. 11 to 20 (C). While embodiment 1 described above has a substrate carry-out device 93 at a port 90 provided outside substrate stage device PSTa as shown in fig. 1, the liquid crystal exposure apparatus 10c of embodiment 3 shown in fig. 11 is different in that a substrate carry-out device 70a is provided at a substrate stage 20c of substrate stage device PSTc. Hereinafter, embodiment 3 is described mainly for differences from embodiment 1, and the same reference numerals as those in embodiment 1 are given to the same elements having the same configurations and functions as those in embodiment 1, and the description thereof will be omitted.

The liquid crystal exposure apparatus 10c according to embodiment 3 includes an illumination system IOP, a mask stage MST, a projection optical system PL, a substrate stage device PSTc, a substrate loading device 80c, a port 60, and control systems thereof. Substrate stage 20c of substrate stage device PSTc includes X coarse movement stage 23X, Y coarse movement stage 23Y, fine movement stage 21, substrate holder 30c, weight cancellation device 26, and a plurality of substrate lift devices 46a (not shown in fig. 11, see fig. 13). The configuration of the substrate stage 20c is the same as that of the substrate stage 20a (see fig. 1 and the like) of embodiment 1 described above except that the substrate holder 30c has a substrate unloading device 70a, and therefore, the description thereof is omitted here.

As shown in fig. 12, a plurality of (e.g., 2) X grooves 73X parallel to the X axis are formed at predetermined intervals in the Y axis direction on the upper surface (substrate mounting surface) of the substrate holder 30 c. The X-groove 73X is open on each side surface of the substrate holder 30c on the + X side and the-X side.

The substrate unloading device 70a is housed in each of the plurality of X-grooves 73X. The substrate carrying-out device 70a includes an X travel guide 71 and an adsorption device 77 a. The X travel guide 71 is formed of a member extending in the X axis direction, and is fixed to a bottom surface defining the X groove 73X as shown in fig. 13. The dimension of the X travel guide 71 in the longitudinal direction (X axis) is set longer than the dimension of the substrate holder 30c in the X axis direction, and both ends in the longitudinal direction protrude outside the substrate holder 30 c. The suction device 77a has a suction pad 77a for sucking and holding the lower surface of the substrate P (not shown in fig. 13, see fig. 11)₁And an adsorption pad 77a on the X travel guide 71₁Z actuator 77a driven in the vertical (Z-axis) direction₂. Adsorption pad 77a₁A plate-like member parallel to the XY plane, and a vacuum unit (not shown) connected to the outside of the substrate stage 20cAnd (4) placing.

The adsorption device 77a is engaged with the X travel guide 71 so as to be slidable in the X axis direction, and is driven in the X axis direction by a predetermined stroke on the X travel guide 71. The type of the driving device for driving the adsorption device 77a is not particularly limited, and for example, an X linear motor including a stator provided in the X travel guide 71 and a movable element provided in the adsorption device 77a, a feed screw device including a feed screw provided in the X travel guide 71 and a nut provided in the adsorption device 77a, or the like can be used. Further, a belt driving device that pulls the suction device 77a with a belt (or a rope) or the like may be used.

Port 60 is provided on the + X side of substrate stage device PSTc as shown in fig. 11, and is housed in a chamber, not shown, together with substrate stage device PSTc. The port portion 60 has a stage 61 and a substrate guide 62.

The substrate guide device 62 includes a base 63, a plurality of Z actuators 64 mounted on the base 63, and a plurality of guides 65 provided corresponding to the Z actuators 64 and driven in the vertical (Z-axis) direction by the corresponding Z actuators 64. The base 63 is formed of a planar rectangular plate-like member parallel to the XY plane, and a plurality of X linear guide devices each including a plurality of X linear guides 66 fixed to the upper surface of the stand 61 and an X slider 67 fixed to the lower surface of the base 63 and slidably engaged with the X linear guides 66 are linearly guided in the X axis direction. The base 63 is driven in the X-axis direction by an X actuator (not shown) (e.g., a feed screw device, a linear motor, etc.) with a predetermined stroke. The type of the Z actuator 64 is not particularly limited, and for example, a cam device, a feed screw device, an air cylinder, or the like can be used. The plurality of Z actuators 64 are driven synchronously by a main control device not shown. The guide 65 is the same as the guide 92 (see fig. 1 and the like) of embodiment 1, and is capable of supporting the substrate P in a floating manner from below and holding the substrate P by suction.

Here, the arrangement of the plurality of Z actuators 64 and the plurality of guides 65 of the substrate guide apparatus 62 will be described with reference to fig. 12. In fig. 12, the Z actuator 64 is hidden under the guide 65 (on the (-Z side) and is not shown. In fig. 12, the mount 61, the base 63, and the like are not shown.

The plurality of guides 65 are arranged such that the guide surface of the substrate P formed by the plurality of guides 65 is trapezoidal in a plan view. Specifically, the substrate guide device 62 has, for example, 3 guide rows at predetermined intervals in the X-axis direction, each guide row being composed of a plurality of guides 65 arranged at predetermined intervals in the Y-axis direction. The guide row on the most-X side is constituted by, for example, 8 guides 65. In addition, the middle guide row among the 3 guide rows is composed of, for example, 6 guides 65. The guide row on the most + X side is constituted by, for example, 4 guides 65. As described above, the guide rows on the-X side and the guide rows on the + X side, which are larger in number, are wider on the-X side (the substrate stage 20c side) than on the + X side in the Y-axis direction in the range in which the substrate P can be supported by the substrate guide device 62 from below. The length (width) of the guide row on the most-X side (substrate stage 20a side) composed of, for example, 8 guides 65 in the Y axis direction is set to be longer (for example, about 1.5 to 2 times longer) than the length (width) of the substrate P in the Y axis direction.

Further, each of the plurality of guides 65 is arranged so as to be in a state where the loading arm 83 of the substrate loading device 80c is positioned above the port 60 (a state where the loading arm 83 is positioned at the stroke end on the + X side) and so as to be in contact with the plurality of support portions 83 of the loading arm 83, similarly to the guide 92 (see fig. 2) of the embodiment 1 described above₂The positions in the Y-axis direction do not overlap. The shape, number, and arrangement of the plurality of guides 65 are not limited thereto, and may be appropriately changed as long as the dimension of the guide surface defined by the plurality of guides in the Y axis direction is set to be larger than the dimension of the substrate P in the Y axis direction (the guide surface may be formed in a rectangular shape in plan view).

The substrate loading device 80c is disposed above the port 60 (+ Z side), as shown in fig. 11. The substrate loading device 80c according to embodiment 3 is provided with a wide interval between the pair of X travel guides 81 and a mounting member 83 for connecting the loading arm 83 to the pair of X sliders 82₃Slightly longerThe configuration is the same as that of the substrate loading device 80a (see fig. 2) of embodiment 1, and therefore, the description thereof is omitted here.

Hereinafter, the substrate P on the substrate holder 30c is referred to as a substrate P (for convenience, the plurality of substrates P are referred to as "substrates P" hereinafter) when exposure operations are continuously performed on the plurality of substrates P₀Substrate P₁Substrate P₂Substrate P₃) The replacement operation (c) will be described with reference to fig. 14(a) to 18 (B). The following substrate replacement operation is performed under the management of a main control device, not shown. For easy understanding, substrate stage 20C is shown in a cross-sectional view taken along line D-D of fig. 12 in fig. 14(a) to 15(a) and 16(B) to 18(B), and in a cross-sectional view taken along line C-C of fig. 12 in fig. 15(B) and 16 (a).

In fig. 14(a), a substrate P is held by a substrate holder 30c of a substrate stage 20c₁. The loading arm 83 of the substrate loading device 80c holds the substrate P₁After being carried out of the substrate holder 30c, the substrate P is then carried into the substrate holder 30c₂(the next substrate P₂). The substrate P exposed is held by the transfer arm 19 of the substrate unloading robot₀。

A main control device for setting the substrate P₁After the exposure process for the last irradiation region out of the plurality of irradiation regions is completed, as shown in fig. 14B, the substrate stage 20c is moved from below the projection optical system PL (see fig. 11) to the substrate replacement position.

In parallel with the movement of the substrate stage 20c to the substrate replacement position, the loading arm 83 is driven in the-X direction in the substrate loading device 80c, and the substrate P is thereby moved₂Is located above the substrate replacement position. Further, in the port portion 60, in order to reduce the interval (gap) between the guide 65 on the most-X side and the substrate holder 30c, the base 63 is driven in the-X direction (the direction approaching the substrate stage 20 c). The Z positions of a plurality of guides 65 on the base 63 are controlled so that the Z positions of the upper surfaces thereof are substantially the same as the Z positions of the upper surfaces of the substrate holders 30 c.

When the substrate stage 20c is at the substrate replacement position, the main controller releases the substrate holder 30c from the substrate P as shown in fig. 15(a)₁And the substrate P is held by suction, and pressurized gas is discharged from the upper surface of the substrate holder 30c₁And (4) suspending. Further, for example, each of the suction pads 77a of the 2 substrate unloading devices 70a (one is not shown in fig. 15 a)₁(not shown in FIG. 15A, see FIG. 13) is driven in the + Z direction to suction-hold the substrate P₁Below.

Thereafter, as shown in fig. 15(B), the adsorption device 77a is driven in the + X direction on the X travel guide 71. Accordingly, the liquid is sucked and held by the suction pad 77a₁Substrate P of₁Moves in the + X direction along the upper surface of the substrate holder 30c and a surface (guide surface) parallel to the XY plane formed by the upper surfaces of the plurality of guides 65, and is carried out from the substrate holder 30c to the port 60. At this time, the pressurized gas is also ejected from the upper surfaces of the plurality of guides 65. Thus, the substrate P can be made to emit dust at a high speed and with low dust emission₁And (4) moving.

When the substrate P is₁When the carrying-out of (b) is finished, as shown in fig. 16(a), each of the plurality of substrate lifting devices 46a is synchronously controlled to move the lift pin 48a in the + Z direction on the substrate stage 20 c. At this time, the plurality of knock pins 48a pass through the support portions 83 of the loading arms 83, respectively₂Press the substrate P from below₂Below. Furthermore, the plurality of suction pads 84 are released from the substrate P by the loading arm 83₂The adsorption of (1) is maintained. Accordingly, the substrate P₂Separated from the loading arm 83. In addition, the substrate P is supported by the port portion 60₁The substrate guide 62 (base 63) is driven in the + X direction (direction away from the substrate stage 20 c).

When the substrate P is₂When separated from the loading arm 83, as shown in fig. 16(B), the loading arm 83 is driven in the + X direction, retreats from above the substrate replacement position, and returns to a position above the port 60. Furthermore, in the port portion 60, the cutting guide 65 is slightly driven on the-Z side, the substrate P₁Slightly displaced in the-Z direction. Further, the substrate is loaded on the transfer arm 19 of the substrate carrying-out robotPlate P₀The transfer arm 18 of the substrate transfer robot transfers the next substrate P from the external device₃And then conveyed.

Thereafter, as shown in fig. 17(a), in the substrate stage 20c, the plurality of substrate lift devices 46a are synchronously controlled to move the lift pins 48a in the-Z direction, whereby the substrate P is moved₂Is loaded on the upper surface of the substrate holder 30c (the lift pins 48a and the substrate P)₂Following separation). Substrate P₂Is sucked and held by the substrate holder 30 c. Further, the substrate P is bonded to the substrate P₂In parallel with the suction holding operation of (1), the suction device 77a (see fig. 12, respectively) located in the vicinity of the + X-side end of the X travel guide 71 is driven in the-X direction by the substrate unloading device 70a, and returns to a position in the vicinity of the-X-side end of the X travel guide 71.

In addition, a substrate P is supported above the port portion 60₃The transfer arm 18 of the substrate loading robot (b) is driven in the-X direction and inserted between a pair of X travel guides 81 (not shown in fig. 17a, see fig. 12) of the substrate loading device 80 c. Accordingly, the transfer arm 18 of the substrate loading robot and the loading arm 83 of the substrate loading device 80c are arranged to overlap in the vertical direction. Further, the transfer arm 19 of the substrate carrying-out robot is driven in the-X direction to insert the substrate P₁Below (c). As described above, the transfer arm 19 and the loading arm 83 have substantially the same shape, and therefore do not contact the guide 65. Accordingly, the transfer arm 19 of the substrate unloading robot and the loading arm 83 of the substrate loading device 80c are arranged to overlap in the vertical direction.

Then, the plurality of guides 65 are driven in the-Z direction, respectively, to thereby form the substrate P₁And delivered to a transfer arm 19 of a substrate carrying-out robot. Substrate P₁The transfer arm 19 is supported and driven in the + X direction as shown in FIG. 17B to transfer the substrate P₁Is transported to an external device.

On the substrate P to be exposed₁After being delivered to the transfer arm 19 of the substrate carrying robot, the plurality of guides 65 are driven in the + Z direction in synchronization as shown in fig. 18 (a). Each of the plurality of guides 65 is provided separatelyThe upper surface of the loading arm 83 and the transfer arm 18 is not in contact with the substrate P₃Faces and faces the substrate P₃Is lifted up and separated from the transfer arm 18. At this time, the substrate P₃Is sucked and held by the plurality of guides 65.

Thereafter, as shown in fig. 18(B), the transfer arm 18 of the substrate transfer robot is driven in the + X direction and retreats from the upper region of the port 60. Further, the substrate P is supported from below₃The plurality of guides 65 are driven in the-Z direction synchronously, respectively. At this time, the plurality of guides 65 pass through the supporting portions 83 where the loading arms 83 are adjacent to each other, respectively₂Opposite to this, the substrate P₃The support portion 83 is supported from below on the loading arm 83₂. Accordingly, the substrate P₃The substrate P is transferred from the guide 65 to the loading arm 83, and returns to the state shown in FIG. 14A (however, the substrate P₀Is replaced by a substrate P₁Substrate P₁Is replaced by a substrate P₂Substrate P₂Is replaced by a substrate P₃)。

The liquid crystal exposure apparatus 10c according to embodiment 3 can also obtain the same effects as those of embodiment 1. In addition, in embodiment 3, since the substrate stage 20c includes the substrate carry-out device 70a, when the substrate stage 20c is moved to the substrate replacement position before reaching the substrate replacement position, that is, before the exposure process to the final irradiation region is completed, the carry-out operation of the substrate P can be started in parallel with this movement. Therefore, the substrate replacement cycle time of the substrate holder 30c can be shortened, and the number of substrates P processed per unit time can be increased.

In addition, for example, when a plurality of irradiation regions are set for the substrate P, the irradiation region to be subjected to the final exposure processing is generally set on the + Y side or the-Y side of the substrate P in order to reduce the total movement amount of the substrate P (substrate stage 20 c). Therefore, the substrate stage 20c after the exposure processing for the final shot area is moved in the X-axis direction and also in the Y-axis direction (in a direction oblique to the X-axis) when moving to the substrate replacement position. In contrast, in embodiment 3, as shown in fig. 19, the dimension of the guide arrangement in the Y axis direction, which is configured by, for example, 8 guides 65 arranged on the most-X side among the plurality of guides 65, is set longer than the dimension of the substrate P in the Y axis direction, so that when the substrate stage 20c moves in an oblique direction with respect to the X axis, the portion of the substrate P protruding from the + X side end portion of the substrate holder 30c is also supported from below by the guides 65. Accordingly, the substrate P can be carried out more quickly.

The following description will be specifically made with reference to fig. 20(a) to 20 (C). In fig. 20a to 20C, the substrate unloading device 70a, the port 60 (see fig. 12, respectively), and the like are not shown. For convenience, in fig. 20a to 20C, the illumination region (exposure region) is described by being given the same reference numeral as the projection optical system PL (see fig. 11).

As shown in fig. 20(a), for example, 6 shot regions are set on the substrate P, and the last shot region is set as a shot region S on the + Y side and the + X side of the substrate P₆. In addition, in the contrast irradiation region S₆The center of the substrate P before the start of the exposure operation is located at the position CP₁The center of the substrate P is located at the position CP at the end of the exposure operation₂。

Here, if the dimension of the guide row on the most-X side (see fig. 19) in the Y axis direction is approximately the same as the dimension of the substrate P in the Y axis direction, the substrate P moves parallel to the X axis direction when the substrate P is carried out, so the Y position of the substrate stage 20c must be controlled so that the center of the guide row on the most-X side substantially coincides with the center of the substrate P in the Y axis direction, and in this case, the center of the substrate holder 30c must sequentially pass through the position CP of fig. 20(B)₁→CP₂→CP₄(position CP₄A substrate replacement position) of the substrate stage 20 c.

In contrast, in embodiment 3, the + X-side end of the substrate P is supported by the guide 65 (see fig. 19) regardless of the Y position of the substrate stage 20c, and therefore the position of the substrate stage 20c at the end of the exposure process from the final irradiation region (position CP)₂) Move to the substrate replacement position (position CP)₄) In this case, the substrate P can be carried out simultaneously with the movement, and the center of the substrate P can sequentially pass through the position CP shown in FIG. 20(B)₁→CP₂→CP₃The substrate P is carried out in the manner described above (the center of the substrate stage 20c is in accordance with CP)₁→CP₂→CP₄In the order of (d). Therefore, the substrate P can be carried out quickly. After the substrate stage 20C is positioned at the substrate replacement position, the substrate P moves parallel to the X axis as shown in fig. 20 (C).

EXAMPLE 4 embodiment

Next, embodiment 4 will be described with reference to fig. 21 and 22. The liquid crystal exposure apparatus according to embodiment 4 is the same as the liquid crystal exposure apparatus 10c (see fig. 11) according to embodiment 3 described above except for the configuration of the substrate holder 30d, and therefore only differences will be described below, and the same reference numerals as those in embodiment 3 are given to the same components and functions as those in embodiment 3, and the description thereof will be omitted.

In the above-described embodiment 3, the substrate P is moved with the upper surface of the substrate holder 30c as a guide surface at the time of substrate unloading (see fig. 15 a and 15B), whereas the present embodiment 4 shown in fig. 21 is different in that the substrate P is unloaded along the guide surface formed by the plurality of guides 48B (see fig. 22) in the same manner as the above-described embodiment 2 (see fig. 9). The substrate unloading device 70a has the same configuration as that of embodiment 3. As shown in fig. 22, the configuration of the guide 48b and the substrate lifting device 46b is the same as that of embodiment 2, and therefore, the description thereof is omitted here. According to embodiment 4, it is not necessary to form a hole for ejecting the pressurized gas so that the substrate P floats on the upper surface of the substrate holder 30 d. Further, since it is not necessary to incorporate a gas ejection line or the like in the substrate holder 30d, the substrate holder 30d can be reduced in weight.

EXAMPLE 5 embodiment

Next, embodiment 5 will be described with reference to fig. 23. While the substrate holders 30c and 30d (see fig. 12 and 21, respectively) in the above-described embodiments 3 and 4 include the substrate carry-out device 70a, in the present embodiment 5, as shown in fig. 23, the substrate stage 20e is provided with the substrate carry-out device 70a on the + Y side and the-Y side, respectively, outside the substrate holder 30 e. For example, the configuration of each of the 2 substrate unloading devices 70a is the same as that of embodiment 3. Since the portions other than the arrangement of the substrate unloading device 70a are the same as those in the above-described embodiment 4, only the differences will be described below, and the components having the same configurations and functions as those in the above-described embodiments 3 and 4 are given the same reference numerals as those in the above-described embodiments 3 and 4, and the description thereof will be omitted.

In embodiment 5, the amount of protrusion of the substrate P from each end of the + Y side and the-Y side of the substrate holder 30e is set to be larger than that in embodiments 3 and 4, and one substrate carry-out device 70a is disposed below the portion of the substrate P protruding from the substrate holder 30e toward the + Y side, and the other substrate carry-out device 70a is disposed below the portion of the substrate P protruding from the substrate holder 30e toward the-Y side. Although not shown in fig. 23, for example, each of the 2 substrate unloading devices 70a is attached to the Y coarse movement stage 23Y via a support member fixed to the upper surface of the Y coarse movement stage 23Y (see fig. 11) disposed below the substrate holder 30 e. That is, for example, each of the 2 substrate carry-out devices 70a is disposed separately from the substrate holder 30 e.

In embodiment 5, for example, since 2 substrate carry-out devices 70a are disposed outside the substrate holder 30e, it is not necessary to form a groove or the like for accommodating the substrate carry-out device 70a in the substrate holder 30e, and a decrease in rigidity of the substrate holder 30e can be suppressed. Further, since the substrate P can be held by suction in a large area, the flatness of the substrate P can be improved. Further, the substrate holder 30e can be made light in business, and the reaction force when the suction device 77a is driven does not act on the substrate holder 30e, so that the position controllability of the substrate holder 30e (substrate P) can be improved. Further, since the substrate carry-out device 70a is disposed outside the substrate holder 30e, the maintenance property is also excellent.

EXAMPLE 6 embodiment

Next, embodiment 6 will be described with reference to fig. 24 to 25 (C). In the 5 th embodiment (see fig. 23), the configuration of the substrate unloading device 70a is the same as that in the 3 rd embodiment, whereas in the 6 th embodiment shown in fig. 24, the configuration of the substrate unloading device 70d is different. Since the components other than the configuration of the substrate unloading device 70d are the same as those of the above-described embodiment 5, only the differences will be described below, and the same reference numerals as those of the above-described embodiment 5 (or embodiments 3 and 4) are given to the components having the same configuration and functions as those of the above-described embodiment 5, and the description thereof will be omitted.

As shown in fig. 24, in substrate stage 20f according to embodiment 6, substrate carry-out device 70d is disposed separately from substrate holder 30e on the + Y side and the-Y side of substrate holder 30e, respectively, as in embodiment 5 (see fig. 23). The substrate carrying-out device 70d includes an X-travel guide 71 supported from below by a support member 28 fixed to the upper surface of the Y coarse movement stage 23Y, a Y-linear guide 78 movable in the X-axis direction on the X-travel guide 71 by a predetermined stroke, and an adsorption device 77d mounted on the X-travel guide 71 through the Y-linear guide 78. The adsorption device 77d includes an adsorption holding substrate P₁The lower absorbent pad. The Y linear guide 78 includes a Y actuator, not shown, and can drive the suction device 77d in the Y axis direction with respect to the X travel guide 71 by a predetermined stroke. The Z position of the lower surface of the suction device 77d is slightly on the + Z side than the Z position of the upper surface of the substrate holder 30 e. The type of the X actuator for driving the Y linear guide 78 in the X axis direction and the type of the Y actuator for driving the suction device 77d in the Y axis direction are not particularly limited, and for example, a feed screw device, a linear motor, or the like can be used. Unlike the embodiments 1 to 5, the suction device 77d does not include a Z actuator for driving the suction pad in the Z axis direction.

In embodiment 6, a substrate is loaded from a substrate holder 30e shown in FIG. 25(A)In the state of the plate P, the substrate P (in fig. 24, the substrate P) is moved by a plurality of guides 48b incorporated in the substrate holder 30e (or by driving the fine movement stage 21 (see fig. 24) in the-Z direction)₁) After being lifted from the upper surface of the substrate holder 30e, as shown in fig. 25B, the suction devices 77d of the 2 substrate unloading devices 70d are driven in a direction approaching the substrate holder 30e (see the arrow in fig. 25B). Accordingly, the suction device 77d is inserted between the upper surface of the substrate holder 30e and the lower surface of the substrate P (see fig. 24. however, in fig. 24, the suction device 77d is inserted into the substrate P₁Between the lower surface of the substrate holder 30 e) and the upper surface of the substrate holder 30 e).

Thereafter, the plurality of guides 48b are lowered in the substrate holder 30e, whereby the suction device 77d can suction and hold the substrate P. For example, 2 adsorption devices 77d that adsorb and hold the substrate P are synchronously driven to the + X side as shown in fig. 25 (C). Accordingly, the substrate P is carried out from the substrate holder 30e toward the port, not shown. Further, the substrate P on the substrate holder 30e shown in FIG. 24₁And another (next) substrate P loaded on the loading arm 83₂The replacement operation (2) is the same as that in the above embodiment 2, and therefore, the description thereof is omitted. According to embodiment 6, since the suction device 77d can move in the Y-axis direction, the substrate P can be miniaturized without greatly protruding from both ends in the Y-axis direction of the substrate holder 30 e.

The structure of the embodiments 3 to 6 can be modified as appropriate. For example, in the substrate carrying-out device 70d according to embodiment 6 described above, the suction device 77d is movable in the Y axis direction with respect to the X travel guide 71, but the present invention is not limited to this, and the suction device 77d may protrude from the X travel guide 71 toward the substrate holder 30e in advance (the substrate carrying-out device 70e does not include a Y actuator for driving the suction device 77d in the Y axis direction with respect to the X travel guide 71), as in the substrate carrying-out device 70e according to modification 1 shown in fig. 26(a) to 27(C), for example. In this case, as shown in fig. 26(a), in a state where the substrate P is mounted on the substrate holder 30e, the suction device 77d is positioned on the-X side of the substrate P, and after exposure is completed, the substrate P is lifted up from the substrate holder 30e by using the plurality of guides 48B, and then driven in the + X direction as shown in fig. 26(B), so as to be inserted between the substrate holder 30e and the substrate P. Thereafter, the substrate P is lowered, and the suction device 77d suctionally holds the substrate P and is driven in the + X direction as shown in fig. 26(C) in this state. Accordingly, the substrate P is carried out from the substrate holder 30 e. After the substrate P is carried out, the suction device 77d is positioned at the + X side position of the substrate P in the exposure process for another substrate P, as shown in fig. 27 (a). When the exposure process of the substrate P is completed and the substrate P is lifted up from the substrate holder 30e by the plurality of guides 48B for carrying out the unloading operation, the suction device 77d returns to the initial position (the position on the-X side of the substrate P) shown in fig. 26a through the lower side of the substrate P as shown in fig. 27B. As shown in fig. 27(C), the processes shown in fig. 26(B) and thereafter are repeated. According to the modification 1, the structure and control of the substrate unloading device 70e can be simplified.

Further, in the substrate stage 20f of embodiment 6 described above, the substrate carry-out device 70d is disposed on both sides (+ Y side and-Y side) of the substrate holder 30e, but as shown in fig. 28 (hereinafter, referred to as modification 2), the substrate carry-out device 70f may be disposed only on one side (+ Y side or-Y side) of the substrate holder 30 e. In this case, in order to suction-hold the substrate P with a stronger suction-holding force, it is preferable that the suction-holding surface of the suction pad of the suction device 77f be wider than the suction device 77a (see, for example, fig. 12) of the above-described embodiments 3 to 6. In this case, the suction device 77f may be movable in the Y axis direction with respect to the X travel guide 71 as in the above embodiment 6, or may be fixed in a state of protruding from the X travel guide 71 toward the substrate holder 30e as in the above modification 1.

In the substrate unloading apparatus according to embodiments 3 to 6, the suction pad may be driven in the Z-axis direction or the Y-axis direction with respect to the substrate P to be positioned at a position capable of sucking the lower surface of the substrate P, but the substrate unloading apparatus is not limited to this, and the substrate P may be moved with respect to the suction device 77g as shown in fig. 29 a to 30B (hereinafter, referred to as "modification 3"). As shown in fig. 29 a, the substrate unloading device 70g is disposed on the + Y side of the substrate holder 30e (the suction device 77g cannot move in the Y axis direction). On the-Y side of the substrate holder 30e, for example, 2 positioning devices 17a are disposed apart in the X-axis direction, and on the + Y side of the substrate holder 30e, for example, 1 positioning device 17b is disposed. The plurality of positioning devices 17a and 17b are mounted on Y coarse movement stage 23Y (see fig. 11) through a support member (not shown) and arranged at substantially the same Z position as substrate P (so as not to interfere with X travel guide 71). The positioning devices 17a, 17b have actuators such as air cylinders, and press the end portions of the substrate P to control the position of the substrate P.

In the present modification 3, in a state where the substrate P after exposure is suspended and supported by the plurality of guides 48B, the substrate P is driven in the + Y direction by, for example, 2 positioning devices 17a as shown in fig. 29 (B). At this time, the movement preventing pins 17c attached to the suction device 77g and the positioning device 17b prevent the substrate P from excessively moving due to inertia in the + Y direction. Further, a plurality of notches 17d for preventing interference with the positioning means 17a are formed on the upper surface of the substrate holder 30 e. When the substrate P is positioned at a position where the suction device 77g can perform suction holding of the substrate P, as shown in fig. 30(a), the positioning devices 17a and 17B are retracted from the substrate P, and thereafter, as shown in fig. 30(B), the substrate P is sucked and held by the suction device 77g and carried out from the substrate holder 30 e. In the present modification 3, since the substrate P is moved relative to the substrate carry-out apparatus 70g, the amount of protrusion of the substrate P from the substrate holder 30e can be reduced in advance.

Embodiment 7

Next, embodiment 7 will be described with reference to fig. 31 to 41. Although substrate stages 20a to 20f of embodiments 1 to 6 described above are configured to mount Y coarse movement stage 23Y on X coarse movement stage 23X, substrate stage 120a of liquid crystal exposure apparatus 100 of embodiment 7 shown in fig. 31 is different in that X coarse movement stage 123X is not mounted on Y coarse movement stage 123Y (the upper coarse movement stage moves in the scanning direction). Further, substrate carrying-out device 170 is provided on Y coarse movement stage 123Y (lower coarse movement stage). Hereinafter, embodiment 7 will be described only with respect to the differences from embodiments 1 to 6, and the same reference numerals as in embodiments 1 to 6 are given to the same elements as in embodiments 1 to 6 and the description thereof will be omitted if they have the same configurations and functions as in embodiments 1 to 6.

In embodiment 7, as shown in fig. 31, apparatus main body 130 includes a lens barrel stage 131, a pair of side posts 132, and a substrate stage mount 133. Lens barrel stage 131 is formed of a plate-like member arranged parallel to the XY plane, and supports projection optical system PL, mask stage MST, and the like. The pair of side posts 132 are disposed apart in the Y axis direction, and support the lens barrel platform 131 from below near the + Y side end and near the-Y side end, respectively. Substrate stage mount 133 is a member extending in the Y-axis direction, and as is clear from fig. 32 and 33, for example, 2 pieces are provided so as to be separated in the X-axis direction. Returning to fig. 31, + Y side post 132 is mounted on, for example, the vicinity of the + Y side end of 2 substrate stage stages 133, and-Y side post 132 is mounted on, for example, the vicinity of the-Y side end of 2 substrate stage stages 133. Substrate stage mount 133 is supported from below near its longitudinal end by vibration isolator 134 provided on clean room floor 11. Accordingly, apparatus main body 130 (and projection optical system PL, mask stage MST, and the like) is separated from floor surface 11 in terms of vibration.

As shown in fig. 33, substrate stage device 200 includes a pair of base 114, auxiliary base 115, and substrate stage 120 a.

One base 114 is located on the + X side of substrate stage 133 on the + X side, the other base 114 is located on the-X side of substrate stage 133 on the-X side, and auxiliary base 115 are disposed between the pair of substrate stage stages 133 with a predetermined distance (in a non-contact state) from substrate stage 133. The pair of bases 114 and the auxiliary base 115 are each formed of a plate-like member extending in the Y-axis direction in parallel with the YZ plane, and are provided on the floor surface 11 so that the height position (Z position) can be adjusted by a plurality of adjusting devices. As shown in fig. 32, a Y linear guide 116a, which is a mechanical Y linear guide (uniaxial guide) component extending in the Y axis direction, is fixed to the upper end surface (+ Z side end) of each of the pair of base 114 and the auxiliary base 115.

Returning to fig. 31, substrate stage 120a includes Y coarse movement stage 123Y, X coarse movement stage 123X, fine movement stage 21, substrate holder 30b, a plurality of substrate lift devices 46b, Y step stage 150, weight cancellation device 26, and substrate carry-out device 170.

Y coarse movement stage 123Y is mounted on a pair of base 114 and auxiliary base 115, as shown in fig. 33. Y coarse movement stage 123Y includes a pair of X beams 125, as shown in fig. 32. The pair of X beams 125 are each formed of a member having a rectangular YZ cross section extending in the X-axis direction, and are arranged parallel to each other at a predetermined interval in the Y-axis direction. The pair of X beams 125 are connected to each other by Y brackets 126 at the + X side and near the-X side end, respectively. The Y carriage 126 is formed of a plate-like member extending in the Y axis direction in parallel with the XY plane, and a pair of X beams 125 are mounted on the upper surface thereof. As shown in fig. 33, the pair of X-beams 125 are connected to each other at their longitudinal center portions by an auxiliary bracket 126 a.

As is clear from fig. 31 and 33, a plurality of Y sliders 116b (overlapped in the depth direction of the sheet in fig. 33) constituting the Y linear guide 116 together with the Y linear guide 116a are fixed to the lower surface of the Y carriage 126 and the lower surface of the auxiliary carriage 126 a. Y slider 116b is slidably engaged with corresponding Y linear guide 116a with low friction, and Y coarse movement stage 123Y is movable on the pair of base 114 and auxiliary base 115 with low friction and with a predetermined stroke in the Y axis direction. The Z position of the lower surfaces of the pair of X beams 125 is set to be more + Z side than the upper surfaces of the pair of substrate stage mounts 133, and Y coarse movement stage 123Y is vibrationally separated from the pair of substrate stage mounts 133 (i.e., device main body 130).

Y coarse movement stage 123Y is driven in the Y-axis direction by a pair of Y feed screw devices 117, as shown in fig. 32. The pair of Y feed screw devices 117 each include a screw shaft 117a rotatably driven by a motor attached to the outer surface of the base 114 and a nut 117b having a plurality of recirculating balls (not shown) attached to the Y carriage 126. The type of Y actuator for driving Y coarse movement stage 123Y (pair of X beams 125) in the Y axis direction is not limited to the ball screw device described above, and may be, for example, a linear motor, a belt drive device, or the like. In addition, a Y actuator having the same configuration (or different type) as the Y feed screw device 117 may be disposed on the sub base 115. The Y feed screw device 117 may be one.

As shown in fig. 34, on the upper surface of each of the pair of X beams 125, X linear guides 127a, for example, 2 mechanical single-axis guide elements extending in the X axis direction, are fixed in parallel to each other with respect to one X beam 125 at a predetermined interval in the Y axis direction. In addition, a magnet unit 128a (X stator) including a plurality of permanent magnets arranged at a predetermined interval in the X axis direction is fixed to a region between the pair of X linear guides 127a on the upper surfaces of the pair of X beams 125.

X coarse movement stage 123X is formed of a plate-like member having a rectangular shape in a plan view, and has an opening formed in the center thereof. An X slider 127b constituting an X linear guide 127 together with the X linear guide 127a is fixed to the lower surface of the X coarse movement stage 123X. The X slider 127b is provided with, for example, 4 pieces of X linear guides 127a at predetermined intervals in the X axis direction (see fig. 33). X slide 127b is slidably engaged with corresponding X linear guide 127a with low friction, and X coarse movement stage 123X is movable on a pair of X beams 125 with low friction in the X axis direction by a predetermined stroke. Further, a pair of coil units 128b (X movers) which face the respective pair of magnet units 128a with a predetermined gap therebetween and constitute a pair of X linear motors 128 for driving the X coarse movement stage in the X axis direction by a predetermined stroke together with the pair of magnet units 128a are fixed to the lower surface of the X coarse movement stage 123X.

X coarse movement stage 123X is restricted from moving in the Y axis direction with respect to Y coarse movement stage 123Y by X linear guide 127, and moves in the Y axis direction integrally with Y coarse movement stage 123Y. That is, X coarse movement stage 123X and Y coarse movement stage 123Y together constitute a gantry (gantry) type dual-axis stage apparatus. Y position information of Y coarse movement stage 123Y and X position information of X coarse movement stage 123X are obtained by a linear encoder system, not shown. The configuration of the fine movement stage 21 (including the drive system and the measurement system) is the same as that of embodiment 1 described above (including the fine movement stage drive system including the plurality of voice coil motors 29X, 29Y, and 29z and the substrate interferometer system using the X-moving mirror 22X and the Y-moving mirror 22Y), as shown in fig. 33 and 34, and therefore, the description thereof is omitted here.

The substrate holder 30b has substantially the same configuration as that of embodiment 2, and therefore, the description thereof is omitted here. In embodiment 7, the X-grooves 31b₁The substrate holder 30b is opened at both ends, but may not be opened. The configuration of the plurality of substrate lifting devices 46b is substantially the same as that of embodiment 2, and therefore, the description thereof is omitted here. However, in embodiment 7, the substrate lifting device 46b is provided in plural (for example, 4) at predetermined intervals in the X-axis direction as shown in fig. 33, and the guide 48b corresponds to one X-groove 31b as shown in fig. 32₁For example, 4 (16 in total) units are stored.

The Y-stage 150 is, as shown in fig. 32, a member having a YZ cross-sectional rectangular shape extending in the X-axis direction, and is inserted between the pair of X-beams 125 at a predetermined distance (in a non-contact state) from each of the pair of X-beams 125. The dimension of Y-stage 150 in the longitudinal direction is set to be slightly longer than the movement stroke of fine movement stage 21 in the X-axis direction. The upper surface of Y-step stage 150 is machined to a very high flatness. As shown in fig. 34, Y-step stage 150 is linearly guided in the Y-axis direction by a predetermined stroke on a pair of substrate stage mounts 133 by a plurality of Y-linear guides 135a fixed to the upper surfaces of the pair of substrate stage mounts 133 and a plurality of Y-sliders 135b fixed to the lower surface of Y-step stage 150.

As shown in fig. 32, the Y-stage 150 is mechanically connected to the pair of X-beams 125 through a pair of devices called flexure devices 151 in the vicinity of the + X-side end and the-X-side end, respectively. Accordingly, Y step stage 150 moves in the Y-axis direction integrally with Y coarse movement stage 123Y. The flexure unit 151 includes, for example, a thin, strip-shaped steel plate disposed parallel to the XY plane, and hinge units (e.g., ball joints or hinge units) provided at both ends of the steel plate, and the steel plate is erected between the Y stepping stage 150 and the X beam 125 through the hinge units. Therefore, flexure device 151 has lower rigidity in the other 5-degree-of-freedom directions (X, Z, θ X, θ Y, and θ Z directions) than the rigidity in the Y axis direction, and Y step stage 150 and Y coarse movement stage 123Y are separated in terms of vibration in the 5-degree-of-freedom directions. The Y position of Y stepping stage 150 may be controlled independently of Y coarse movement stage 123Y by using an actuator such as a linear motor or a feed screw device.

The configuration of the weight balance device 26 (including the leveling device 27) is substantially the same as that of the above embodiment 1, and therefore, the description thereof is omitted here. However, in embodiment 7, the weight cancellation device 26 is mounted on the Y-stage 150 in a non-contact state through a plurality of air bearings 26a mounted on the lower surface thereof as shown in fig. 34, and therefore, the dimension in the Z-axis direction is shorter than that in embodiment 1. Weight cancellation device 26 is mechanically connected to X coarse movement stage 123X via a plurality of flexure devices 26b, and moves on Y step stage 150 when moving integrally with X coarse movement stage 123X in the X-axis direction. In contrast, when weight removing device 26 moves integrally with X coarse movement stage 123X in the Y-axis direction, it moves integrally with Y coarse movement stage 123Y and Y step stage 150 in the Y-axis direction, and therefore does not fall off Y step stage 150.

The substrate carrying-out device 170 is mounted on an outer surface (surface facing the + Y side) of the X beam 125 on the + Y side of the pair of X beams 125, and carries out the substrate P loaded on the substrate holder 30b to the outside of the substrate stage device 200 (in the present embodiment, the substrate guide device 62 (see fig. 35) of the port 60 described later) described later. The substrate unloading device 170 includes an adsorption pad 171 for adsorbing and holding the lower surface of the substrate P to be unloaded, a support member 172 for supporting the adsorption pad, a pair of X linear guides 173 for linearly guiding the support member 172 (and the adsorption pad 171) in the X axis direction, and an X linear motor 174 for driving the support member 172 (and the adsorption pad 171) in the X axis direction. Fig. 34 is a cross-sectional view taken along line E-E of fig. 33, showing a state where the suction pad 171 and the support member 172 are positioned at the-X-side stroke end, in order to explain the configuration of the substrate unloading apparatus 170.

The suction pad 171 is formed of a member having a YZ cross section in an inverted L shape as shown in fig. 34, and a portion parallel to the XY plane is formed of a plate-like member having a rectangular shape in a plan view with the X-axis direction as a longitudinal direction as shown in fig. 32. The suction pad 171 is connected to an unillustrated vacuum device provided outside, and the upper surface of the portion parallel to the XY plane functions as a substrate suction surface portion. As shown in fig. 33, the support member 172 is formed of a plate-like member extending in the Z-axis direction in parallel with the XZ plane, and has an adsorption pad 171 attached near its upper end (+ Z-side end). The support member 172 has a structure in which the rigidity in the X-axis direction is higher than the rigidity in the Y-axis direction. The support member 172 is formed such that a portion on the + Z side is slightly bent toward the + X side from the center portion in the Z axis direction, and an upper end portion thereof protrudes toward the + X side (i.e., toward the port portion 60 (not shown in fig. 33, see fig. 35)) from a lower end portion (-Z side end). As shown in fig. 34, a gap is set between the support member 172 and the substrate holder 30b to such an extent that the substrate holder 30b does not contact each other even when the substrate holder 30b is slightly driven in the Y-axis direction and/or the θ z direction with respect to the X coarse movement stage 123X in a state where the support member 172 and the substrate holder 30b are adjacent to each other.

Here, the adsorption pad 171 is disposed so that the-Y side end portion protrudes from the surface of the support member 172 facing the-Y side (the substrate holder 30b side) to the-Y side (the Y position of the-Y side end portion is located on the-Y side with respect to the + Y side end portion of the substrate holder 30b) by connecting the vicinity of the + Y side end portion to the support member 172. That is, when substrate stage 120a is viewed from the + Z side, although the X position of substrate holder 30b is considered, suction pad 171 is positioned above (overlapping in the Z-axis direction) substrate holder 30 b. The suction pad 171 is supported by the support member 172 such that the Z position of the lower surface thereof is located higher than the Z position of the upper surface of the substrate holder 30b (for example, the Z position of the substrate holder 30b is located higher than the Z position of the upper surface of the substrate holder 30b in a state where the substrate holder 30b is located at the neutral position in the Z axis direction because the Z position of the substrate holder 30b varies within a slight range). Accordingly, the suction pad 171 can be inserted between the substrate P and the substrate holder 30b in a state where the substrate P is driven by the plurality of substrate lifting devices 46b and lifted (lifted) from the upper surface of the substrate holder 30 b.

One surface of the support member 172 near the lower end portion faces the outer surface of the X beam 125 on the + Y side. On the other hand, as shown in fig. 33, 2 (a pair of) X linear guides 173a extending in the X axis direction are fixed to the outer surface of the X beam 125 on the + Y side at predetermined intervals in the Z axis direction. The pair of X linear guides 173a are arranged in a region on the + X side (port 60 (not shown in fig. 33, see fig. 35)) of the X beam 125 at the center of the X beam 125 in the X axis direction, with the length (dimension in the X axis direction) thereof set to be approximately half of the length of the X beam 125 (or the same as the length of the substrate P in the X axis direction). Further, on one surface (a surface facing the X beam 125) of the support member 172, for example, 2X sliders 173b including rolling elements (for example, circulating balls) not shown and mechanically slidably engaged with the X linear guides 173a are fixed to one X linear guide 173a at predetermined intervals in the X axis direction. The X linear guide 173a and 2X sliders 173b corresponding to the X linear guide 173a, for example, constitute an X linear guide 173 for linearly guiding the support member 172 (and the suction pad 171) in the X axis direction.

A magnet unit 174a including a plurality of permanent magnets arranged at predetermined intervals in the X-axis direction is fixed between the pair of X linear guides 173 a. On the other hand, a coil unit 174b including a coil is fixed to one surface of the support member 172 (the surface facing the X-beam 125) so as to face the magnet unit 174a at a predetermined interval. The magnet unit 174a (X stator) and the coil unit 174b (X mover) corresponding to the magnet unit 174a constitute an X linear motor 174 for driving the support member 172 (and the suction pad 171) in the X axis direction. Further, the actuator for driving the support member 172 (and the suction pad 171) in the X-axis direction is not limited to this, and other single-axis actuators such as a ball screw (feed screw) device, a traction device using a rope (or a belt), and the like may be used. Further, stoppers (stoppers) 175 that mechanically define the movable range of the support member 172 are fixed to the outer surface of the X beam 125 on the + Y side and the vicinity of both ends of the magnet unit 174 a.

When the substrate P is carried out on the substrate stage 120a, the plurality of Z actuators 47 are controlled so that the Z position of the upper surface of the guide 48b of each of the plurality of substrate lift devices 46b is located on the + Z side with respect to the upper surface of the substrate holder 30 b. Next, in the substrate carrying-out apparatus 170, the lower surface of the substrate P on the-X side and near the + Y side end (corner) is sucked and held by the suction pad 171, and in this state, the support member 172 is driven by the X linear motor 174, and the substrate P is carried out to the port 60 in the + X direction while being moved on the substrate holder 30 b. At this time, pressurized gas is ejected from each of the plurality of guides 48b to the lower surface of the substrate P to levitate and support the substrate P. Accordingly, the substrate P moves on the substrate holder 30b with low friction.

Here, in substrate carrying-out apparatus 170, as shown in fig. 33, the shape (amount of curvature) of support member 172 is set so that the X position of adsorption pad 171 when support member 172 is positioned at the stroke end on the + X side is set to be on the + X side of substrate holder 30b when X coarse movement stage 123X is positioned at the stroke end on the + X side. Accordingly, while exposure processing or the like is being performed on substrate P, adsorption pad 171 can be retracted to the outside of the movable range of X coarse movement stage 123X. In the present embodiment, the intermediate portion of the support member 172 is formed by bending, but the shape of the support member 172 is not limited thereto as long as the suction pad 171 can be retracted to the outside of the movable range of the substrate holder 30b in the X-axis direction.

The configurations of the substrate loading device 80c and the port 60 (including the substrate guide 62) shown in fig. 35 are the same as those of embodiment 3, and therefore, the description thereof is omitted here.

Hereinafter, the substrate P on the substrate holder 30b of the liquid crystal exposure apparatus 100 (for convenience, the plurality of substrates P will be referred to as "substrates P")₁Substrate P₂Substrate P₃) The replacement operation will be described with reference to fig. 36(a) to 41 (B). The following substrate replacement operation is performed under the management of a main control device, not shown. In fig. 36(a) to 41(B), the substrate holder 30B is shown in cross-section for the sake of easy understanding, and a portion of the substrate stage 120a including a plurality of voice coil motors and the like is not shown.

In fig. 36(a), the substrate holder on substrate stage 120a30b hold a substrate P₁. The substrate P is held by the loading arm 83₁After being carried out of the substrate holder 30b, the next substrate P to be held by the substrate holder 30b is₂(the next substrate P₂)。

A main control device for controlling the operation of the substrate P₁After the exposure process for the last irradiation field among the plurality of irradiation fields is completed, the substrate stage 120a is controlled to move from the exposure completion position to the substrate replacement position, as shown in fig. 36 (B). During the exposure process, the support member 172 of the substrate unloading device 170 is positioned at the end of the stroke on the + X side, and the suction pad 171 is retracted outside the movable range of the substrate P in the X axis direction. Thus, to carry out the substrate P₁X coarse movement stage 123X (and substrate holder 30b) moves in the X-axis direction, and substrate P₁And does not contact the adsorption pad 171. In parallel with this, the loading arm 83 is driven in the-X direction, whereby the substrate P₂Is located above the substrate replacement position. Further, at the port portion 60, the substrate guide 62 is driven in a direction approaching the substrate stage 120 a.

When the substrate stage 120a reaches the substrate replacement position, the main control device releases the substrate holder 30b from the substrate P as shown in fig. 37(a)₁The plurality of substrate lifting devices 46b are held and controlled by suction, and the guide 48b is driven to ascend. Accordingly, the substrate P₁A gap is formed between the lower surface of the substrate holder 30b and the upper surface of the substrate holder. Next, as shown in fig. 37(B), the support member 172 of the substrate unloading device 170 is driven in the-X direction, and the suction pad 171 passes through the substrate P₁Is located at the substrate P with a gap between the lower surface of the substrate holder 30b and the upper surface of the substrate holder 30b₁And a part near the end (corner) on the-X side and the + Y side of the substrate. Thereafter, the plurality of guides 48b are driven to descend, and the substrate P₁Is sucked and held by the suction pad 171. Also, a plurality of guides 48b are provided for the substrate P₁To support the substrate P in a floating manner by jetting pressurized gas from the lower surface of the substrate P₁. At this time, the plurality of guides 48b of the substrate stage 120a and the plurality of guides 65 of the port 60 are controlled so that the Z positions of the upper surfaces are substantially the same.

Thereafter, as shown in fig. 38(a), the support member 172 of the substrate unloading device 170 is driven in the + X direction, and the substrate P held by the suction pad 171 is sucked and held₁The substrate is carried out from the substrate holder 30b to the port 60 by moving along a plane (guide surface) parallel to the XY plane formed by the upper surfaces of the plurality of guides 48b and the plurality of guides 65 in the + X direction. At this time, the substrate P is also faced from the upper surfaces of the plurality of guides 65₁Pressurized gas is ejected. Thus, the substrate P can be made to generate high speed and low dust₁And (4) moving.

When the substrate P is placed₁When the substrate P is transferred from the substrate holder 30B to the plurality of guides 65, the suction pad 171 is released from the substrate P as shown in FIG. 38(B)₁The adsorption of (2) holds and stops the ejection of the pressurized gas from the plurality of guides 65. Accordingly, the substrate P₁"" is mounted on a plurality of guides 65, and then supports the substrate P₁The substrate guide 62 is driven in the + X direction. In addition, as long as the substrate unloading device 170 can unload the substrate P₁When the substrate is transferred to the substrate guide 62 located at the position shown in fig. 38B, the substrate guide 62 does not need to be moved to the substrate stage 120a side (may be immovable). Further, the plurality of guides 48b are driven to ascend on the substrate stage 120a, and the substrate P is pressed from below₂Below. The substrate P is released from the loading arm 83₂By which the substrate P is held₂Away from the loading arm 83. In addition, the loading arm 83 may be lowered to move the substrate P downward₂To a plurality of guides 48 b.

When the substrate P is₂When separated from the loading arm 83, as shown in fig. 39(a), the loading arm 83 is driven in the + X direction, retreats from above the substrate replacement position, and returns to the position above the substrate guide 62. In addition, the plurality of guides 65 are driven slightly downward at the port portion 60. Next, as shown in fig. 39(B), the plurality of guides 48B are driven to descend on the substrate stage 120a, and the substrate P is placed₂And loaded onto the substrate holder 30 b. In addition, in the port portion 60, the substrate P is inserted into the transfer arm 19 of the substrate carrying-out robot₁Below (c).

Thereafter, as shown in FIG. 40(A), a substrate P is formed₂Is sucked and held by the substrate holder 30b to perform the process of aligning the substrate P₂The alignment operation, the exposure operation, and the like, the X coarse movement stage 123X is driven in a direction away from the port portion 60. In addition, in the port part 60, the substrate P is recovered from the port part 60 by the conveying arm 19 of the substrate carrying-out robot₁And is transported to an external device not shown. In addition, the plurality of guides 65 are driven to ascend. The transfer arm 18 of the substrate transfer robot holds the substrate P₃。

Thereafter, as shown in fig. 40(B), the transfer arm 18 of the substrate loading robot transfers the substrate P₃The substrate P is transported to the upper side of the plurality of guides 65, as shown in FIG. 41(A)₃To a plurality of guides 65. Thereafter, as shown in FIG. 41(B), the plurality of guides 65 are driven to descend, and the plate P is placed₃Loaded on the loading arm 83 (return to the state shown in fig. 36 a). In this case, the substrate P may be used₃The loading arm 83 is aligned while being suspended on the plurality of guides 65. The alignment is performed by detecting the substrate P with an edge sensor or a camera₃Pressing the substrate P at the end (edge) position of the substrate₃A plurality of points.

As described above, according to embodiment 7, since substrate carry-out device 170 is mounted on Y coarse movement stage 123Y which is in a stationary state during the scanning operation on substrate stage 120a, the position control of X coarse movement stage 123X is not affected, and the X position of substrate P can be controlled with high accuracy during the scanning operation. Further, since substrate stage 120a has a structure in which X coarse movement stage 123X and fine movement stage 21 are mounted on Y coarse movement stage 123Y having substrate carry-out device 170 (a structure in which Y coarse movement stage 123Y is at the lowermost surface), maintenance of substrate carry-out device 170 is also easy. Further, the substrate unloading device 170 moves the suction pad 171 (and the support member 172) only in the X-axis (uniaxial) direction, and therefore, the configuration and control are simple, and the cost is low compared to, for example, a multi-joint robot. Further, the substrate unloading device 170 can retract the suction pad 171 to the outside of the movable range of the substrate P in the X-axis direction, and therefore, even if the height position (Z position) of the suction pad 171 and the substrate P (or the substrate holder 30b) is the same, the contact therebetween can be prevented.

Further, since the substrate stage 120a includes the substrate carry-out device 170, the port portion 60 only needs to be provided with the substrate carry-in device 80c for carrying the substrate P to the substrate stage 120 a. That is, in the present embodiment 7, at the time of the exchange operation of the substrate held by the substrate stage 120a, only the loading arm 83 of the substrate carry-in device 80c needs to be positioned above the substrate stage 120a positioned at the substrate exchange position, and therefore, as compared with the case where a known substrate exchange device having a substrate carry-out robot and a substrate carry-in robot is provided in the port portion 60, as shown in fig. 34, the exchange operation of the substrate P can be easily performed even in the case where the space between the substrate holder 30b and the lens barrel table 131 is narrow.

Further, since the substrate stage 120a includes the substrate carry-out device 170, the substrate carry-out operation from the substrate stage 120a can be performed regardless of the position (X position and/or Y position) of the substrate stage 120 a. Therefore, similarly to embodiment 3, the unloading operation of the substrate P is started after the exposure of the final irradiation region is completed and before the substrate stage 120a reaches the substrate replacement position (including during the movement of the substrate stage 120 a). Further, in the port portion 60, the guide surface of the substrate P formed by the plurality of guides 65 is set to be wider than the substrate P, and therefore, it is not necessary to precisely perform the alignment of the substrate stage 120a and the substrate guide 62 in the Y-axis direction (when the substrate holder 30b is moved obliquely with respect to the X-axis, the carrying-out operation can be started). Therefore, the cycle time for substrate replacement can be shortened.

Further, in substrate lift-up device 46b, since Z actuator 47 for moving guide 48b up and down is mounted on X coarse movement stage 123X, fine movement stage 21 can be made thinner and lighter, and a Z actuator having a long stroke in the Z-axis direction can be used, compared to a case where a Z actuator is built in fine movement stage 21 (or substrate holder 30b), and therefore, guide 48b can be driven with a long stroke.

EXAMPLE 8

Next, embodiment 8 will be described with reference to fig. 42 to 45. The substrate stage 120b of embodiment 8 is different from that of embodiment 7 in the configurations of the substrate holder 30a, the substrate lift-up device 46a (not shown in fig. 42, see fig. 43), and the substrate carry-out device 270. Hereinafter, the same reference numerals as those in embodiment 7 (or those common to the end) are given to members having the same configurations and functions as those in embodiment 7, and the description thereof will be omitted.

As shown in fig. 42, the substrate holder 30a of the substrate stage 120b of embodiment 8 is the same as that of embodiment 1 except for the small number of the hole portions 31a for the lift pins 48a and the points where the notches 133 described later are formed, and therefore, for convenience, the same reference numerals as those of the substrate holder 30a of embodiment 1 are given here and the description thereof will be omitted. As is clear from fig. 42 and 43, in embodiment 8, a total of 16 substrate lifting devices 46a are provided.

The substrate stage 120b includes a substrate slide device 180 for sliding the substrate P mounted on the substrate holder 30a in the Y-axis direction with respect to the substrate holder 30 a. As shown in fig. 42, the substrate slide device 180 is arranged, for example, 2 in the X-axis direction at a predetermined interval. However, the number and arrangement of the substrate slide devices 180 are not limited thereto, and may be appropriately changed.

As shown in fig. 43, a notch 133 is formed in the substrate holder 30a at a position corresponding to the substrate slide device 180. The notch 133 is formed to open on the upper surface side of the substrate holder 30a and on the side surface side of the-Y side.

The substrate slide device 180 includes a base 181, a Y linear guide 182, a Y slider 183, and a pressing pin 184. The base 181 is formed of a flat plate-like member extending in the Y-axis direction and having a rectangular shape in plan view, and the end portion side on the + Y side thereof is inserted into the notch 133, and the end portion side on the-Y side protrudes from the-Y side end portion of the substrate holder 30a toward the-Y side (outer side). The lower surface of the base 181 is fixed to the substrate holder 30 a. The Y-linear guide 182 is fixed to the base 181. The Y slider 183 is mechanically engaged with the Y linear guide 182 to be freely slidable. The pressing pin 184 is formed of a columnar member extending in the Z-axis direction, and is fixed to the Y slider 183. The Z position of the + Z side end of the pressing pin 184 is set to be on the + Z side of the upper surface of the substrate holder 30 a. The substrate slide device 180 includes a Y actuator, not shown, for driving the pressing pin 184 in the Y axis direction, and the pressing pin 184 is driven between a position where the outer side of the substrate holder 30a shown in fig. 43 does not contact the substrate P and a position where a part thereof shown in fig. 45 is accommodated in the notch 133.

As in the case of embodiment 7, the substrate carrying-out device 270 is mounted on the support member 172 of the X beam 125 on the + Y side through a pair of X linear guides 173, and driven in the X axis direction by the X linear motor 174 with a predetermined stroke. As shown in fig. 34, the suction pad 271 of the above-described embodiment 7 is formed in an inverted L shape in YZ cross section, and the substrate suction surface portion protrudes from the-Y side surface of the support member 172 to the-Y side, and the Y position thereof overlaps with the substrate holder 30b, but as is clear from fig. 42 and 43, the substrate suction surface portion of the suction pad 271 of the present embodiment 8 is disposed outside (+ Y side) the substrate holder 30a, and is moved in the X axis direction without contacting the substrate P in a state where the substrate P is mounted on the substrate holder 30 a. The Z position of the upper surface (suction surface) of the suction pad 271 is set to be slightly on the-Z side (lower side) than the upper surface (substrate mounting surface) of the substrate holder 30 a.

In addition, in the above-described embodiment 7, as shown in fig. 32, the adsorption pad 271 waits outside the movable range of the substrate P (substrate holder 30b) in the X axis direction (specifically, outside the + X side) during the exposure process for the substrate P, whereas in the present embodiment 8, as shown in fig. 42, the adsorption pad 271 is disposed within the movable range of the substrate holder 30a even during the exposure process for the substrate P. Even in this case, the substrate P (and the substrate holder 30a) does not contact the suction pads 271 when the substrate P is moved in the X-axis direction (see fig. 43). Further, the pressing pin 184 of the substrate slide apparatus 180 is located at the stroke end of the-Y side to avoid contact with the substrate P.

As shown in fig. 45, the substrate P is carried out on the substrate stage 120b in a state where the substrate P is floated by ejecting pressurized gas from the substrate holder 30a to the lower surface of the substrate P. In the substrate stage 120b, the pressing pin 184 of the substrate slide device 180 is driven to the + Y side, whereby the + Y side end portion of the substrate P protrudes by a predetermined amount from the + Y side end portion of the substrate holder 30a to the + Y side. Next, the fine movement stage 21 and the substrate holder 30a are lowered by the Z voice coil motor 29Z (or by the inside of an air spring (not shown) provided in the weight balancing device 26 being depressurized). Accordingly, the substrate P is lowered while being floated on the substrate holder 30a, and is sucked and held by the suction pad 27 located in advance below the substrate P on the + Y side and in the vicinity of the-X side end. In embodiment 8, the substrate lift-up device 46a is used only when receiving the substrate P from the substrate carry-in device 80c (not shown in fig. 45, see fig. 35), and is not used for carrying out the substrate P.

Thereafter, as shown in fig. 44, the suction pad 271 is driven in the + X direction, and the substrate P is carried out to the port portion 60 along the upper surface of the substrate holder 30a (not shown in fig. 44, see fig. 35).

In embodiment 8 described above, since it is not necessary to wait for the suction pad 271 to be outside the movable range of the substrate P in the X-axis direction, the unloading operation of the substrate P can be started quickly after the exposure process is completed. Therefore, the cycle time for substrate replacement can be shortened. In addition, although the present embodiment 8 has been described with respect to the case where the substrate holder 30a is driven to descend so as to bring the substrate P into contact with the suction pads 271, the present invention is not limited to this, and the substrate unloading device 270 may be provided with a driving device for driving the suction pads 271 in the vertical direction, and the substrate P may be brought into contact with the suction pads 271 by driving the suction pads 271. Substrate slide device 180 may be provided on fine movement stage 21 or X coarse movement stage 123X.

The configurations of the above-described embodiments 7 and 8 can be modified as appropriate. For example, in the embodiment 7, as shown in fig. 34, the suction pad 171 of the substrate unloading device 170 is arranged to protrude from the support member 172 toward the substrate holder 30b so as to be inserted between the substrate P and the substrate holder 30 b. However, for example, as in the substrate stage 120c of the 4 th modification shown in fig. 46, the suction pad 371 may be withdrawn from the substrate P when exposure processing of the substrate P is performed, and may be inserted between the substrate P and the substrate holder 30b only when the substrate P is carried out, by mounting the Y drive device 375 that drives the suction pad 371 in the Y axis direction on the support member 172. In the above embodiment 7, when the substrate P is transferred to the port portion, as shown in fig. 37(B), it is necessary to move the suction pad 171 to a position capable of sucking the substrate P through between the substrate P and the substrate holder 30B after the substrate P is separated from the upper surface of the substrate holder 30B, but as shown in fig. 46, the substrate carry-out apparatus 370 can move the suction pad 371 to a position capable of sucking the substrate P on the-X side and near the + Y side end in a state where the substrate P is mounted on the substrate holder 30B. Therefore, the time required for carrying out the substrate can be shortened.

The configuration of the substrate lift device for lifting the substrate P from the substrate holder 30b is not limited to that described in embodiment 7. For example, a plurality of substrate lift-up devices 140 included in a substrate stage 120d of modification 5 shown in fig. 47 are respectively provided with a plurality of grooves accommodated in the X-grooves 31b₁The base member 141, a plurality of (e.g., 6) porous members 142 attached to the upper surface of the base member 141 at predetermined intervals in the X-axis direction, and a pair of Z actuators 143 (not shown in fig. 47, see fig. 48 a) for driving the base member 141 in the Z-axis direction (up-down movement). The base member 141 is formed of a rod-like member extending in the X-axis direction, and the longitudinal dimension is set to be approximately the same as (slightly shorter in the present modification 5) the longitudinal dimension of the substrate P (not shown in fig. 47, see fig. 50B)).

The substrate lifting device 140, as shown in fig. 48(B), is spaced apart from each other in the Y-axis direction (and formed with a plurality of X-grooves 31B of the substrate holder 30B)₁Corresponding intervals) are provided with, for example, 5 stations. Further, the substrate holder 30b of the present modification example 5 is provided in the X-groove 31b₁And the number of X grooves 31b₁The points not opened to the + X side and the-X side of the substrate holder 30b are different from those of the embodiment 7, and the same reference numerals as those of the embodiment 7 are used for convenience sake.

As shown in fig. 48(a), leg portions 144 extending in the Z-axis direction are fixed to the lower surface of the base member 141 near both ends in the longitudinal direction of the base member 141. For defining the X-groove 31b₁A pair of through holes 31b penetrating the substrate holder 30b in the vertical direction are formed on the bottom surface of (1)₂The leg 144 is inserted into the pair of through holes 31b₂Each of (a). For defining the X groove 31b₁Between the wall surface and the base member 141, and defines the through hole 31b₂The wall surfaces of (3) and the leg portions 144 are set with gaps to such an extent that the fine movement stage 21 does not contact each other when the fine movement stage 123X is driven finely with respect to the X coarse movement stage 123X.

A pair of Z actuators 143 is fixed to the upper surface of X coarse movement stage 123X at positions corresponding to the pair of leg portions 144. The Z actuator 143 may use a pneumatic cylinder or the like. A stay (stay)145 formed of an L-shaped member is fixed near the Z actuator 143 on the upper surface of the X coarse movement stage 123X. Base member 141 is guided linearly in the Z-axis direction (vertical direction) with respect to X coarse movement stage 123X as shown in fig. 48C by the action of a Z linear guide device constituted by Z linear guide 146 fixed to leg 144 and Z slider 147 attached to rod 145.

Here, the base member 141 is formed to be hollow as shown in fig. 49(a), and has a plurality of holes on its upper surface. The porous member 142 (not shown in fig. 49 a, see fig. 47) is attached to close the plurality of holes. The base member 141 is supplied with pressurized gas from an external permeation line member 148 of the substrate holder 30b (not shown in fig. 49 a, see fig. 47), and the pressurized gas is ejected to the lower surface of the substrate P through the plurality of holes and the porous member 142. The line member 148 may be connected to one leg portion 144 by forming the leg portion 144 to be hollow and communicating with the base member 141 as shown in fig. 49(a), or may be connected to one end portion in the longitudinal direction of the base member 141 as shown in fig. 49 (B). The porous member 142 may not be attached to the base member 141. That is, the surface of the seat member may be not formed as a porous throttling air bearing, but a surface throttling or orifice (fitting) throttling formed by hole or groove machining, or a composite throttling air bearing combining these (integral molding machining).

In the substrate stage 120d, as shown in fig. 50 a, in a state where the base member 141 is driven to ascend, the loading arm 83 of the substrate loading device 80c transports the substrate P above the substrate holder 30B (the base member 141 may be driven to ascend after the substrate P is transported above the substrate holder 30B), and then, as shown in fig. 50B, the loading arm 83 is driven to descend and be driven in the + X direction (a direction away from the substrate holder 30B) (the base member 141 may be further driven to ascend without the descending drive of the loading arm 83), and the substrate P is delivered to the substrate lifting device 140. Thereafter, as shown in fig. 50(C), the pedestal member 141 is driven to descend, and the substrate P is loaded on the upper surface of the substrate holder 30 b. When the substrate P is carried out, as shown in fig. 50(D), the base member 141 is driven to rise, and the pressurized gas is ejected from the porous member 142 toward the lower surface of the substrate P in a state where the substrate P is spaced apart from the upper surface of the substrate holder 30 b. Thereafter, the substrate P is carried out by the substrate carrying-out device 170 (not shown in fig. 50D, see fig. 33, etc.).

According to the present modification 5, only one line for supplying the pressurized gas needs to be connected to one base member 141, and therefore the apparatus configuration is simple (in contrast, in the above-described embodiment 7 (see fig. 34), the line for supplying the pressurized gas needs to be connected to each guide 48b of the plurality of substrate lifting devices 46 b). Further, since it is not necessary to form a through hole in fine movement stage 21, a decrease in rigidity of fine movement stage 21 can be prevented. Even when the Z actuator 143 cannot be disposed below the fine movement stage 21 (for example, when the weight cancellation device 26 is large), it can be used suitably. In addition, in the modification 5, for example, 2Z actuators 143 separated in the X axis direction are provided for one base member 141, but the present invention is not limited thereto, and for example, all the plurality of base members 141 may be driven by the 2Z actuators 143. Further, the substrate lifting device 140 according to modification 5 can also be applied to a substrate stage device that does not have a substrate carry-out device (for example, in the case where the substrate carry-out device is disposed on the port side).

In the 5 th modification, as in the 6 th modification shown in fig. 51 a, one end of the tension coil spring 149 may be connected to the outer side (end side) of the leg 144 near both ends of the base member 141. An intermediate portion of tension coil spring 149 is inserted into through hole 31c formed in substrate holder 30b, and the other end is connected to fulcrum 145 (i.e., X coarse movement stage 123X). Accordingly, as shown in fig. 51(B), when the base member 141 is driven to move upward, a moment acts on the vicinity of each of the two ends of the base member 141, the moment causing the end of the base member 141 to move downward, with the vicinity of the connection between the base member 141 and the leg portion 144 being the center. In this way, the base member 141 can be prevented from being deflected by its own weight at the center in the longitudinal direction.

The configuration of the substrate unloading device 170 for unloading the substrate P from the substrate holder 30b may be appropriately changed. Fig. 52 shows a substrate stage 120e according to modification 7. In substrate stage 120e, X beam 425 is narrower (longer in dimension in the height direction and wider in dimension in the width direction) than that of embodiment 7 (see fig. 31 and the like), and magnet units 128a constituting X linear motor 128 for driving X coarse movement stage 123X are fixed to both side surfaces of X beam 425. Further, a pair of X brackets 129 is fixed to the lower surface of X coarse movement stage 123X corresponding to a pair of X beams 425. The X bracket 129 is formed of a member having an inverted U-shape in YZ cross section, and the corresponding X beam 425 is inserted between a pair of opposing surfaces. A coil unit 128b is fixed to a pair of opposing surfaces of the X bracket 129 so as to oppose the magnet unit 128 a.

In the substrate carrying-out apparatus 470, the support member 172 supporting the suction pad 171 is driven in the X-axis direction by a predetermined stroke by the X-drive unit 176 including the fixed portion 176b fixed to the Y coarse movement stage 123Y and the movable portion 176a fixed to the fixed portion 176b in the vicinity of the lower end of the support member 172. On substrate stage 120e, Y bracket 126 and auxiliary bracket 126a (not shown in fig. 52, see fig. 33) connecting the vicinity of the + X-side end of a pair of X beams 425 to each other protrude from the + Y side surface of the + Y-side X beam 425. The fixing portion 176a is formed by a member extending in the X axis direction, and is bridged near the + Y-side end of each of the Y bracket 126 and the auxiliary bracket 126 a. Although not shown, the X driving unit 176 includes elements (e.g., a fixed element and a movable element of the X linear motor, and a guide and a slider of the X linear guide device) for driving the supporting member 172 in the X axis direction by a predetermined stroke. Accordingly, as in the above-described embodiment 7, the support member 172 is driven in the X-axis direction by a stroke equal to the length of the substrate P in the X-axis direction. Further, as in substrate stage 120f of modification 8 shown in fig. 53, fixing portion 176b of X drive unit 176 of substrate unloading device 570 may be fixed to X bracket 129.

In the substrate stages 120e and 120f, although the substrate lift-up device for separating the substrate P from the substrate holder 30b is not shown in the drawings to avoid complication of the drawing, any of the substrate lift-up device 46b (see fig. 33) of the above-described embodiment 7, the substrate lift-up device 46a (see fig. 43) of the above-described embodiment 8, and the substrate lift-up device 140 (see fig. 48) of the above-described modification 5 may be used.

The configuration of the liquid crystal exposure apparatus is not limited to that described in the above-described embodiments 1 to 8 (including the modifications 1 to 8, and the same applies hereinafter), and may be appropriately changed. For example, in the above-described 7 th and 8 th embodiments (including the above-described 4 th to 8 th modified examples, the same applies hereinafter), one substrate carry-out device 170 to 570 is attached to each of the outer surfaces of the X beam 125 on the + Y side (one side surface of the Y coarse movement stage 123Y), but the number and arrangement of the substrate carry-out devices 170 to 570 are not limited to this, and for example, a plurality of (for example, 2) support members 172 and adsorption pads 171 may be arranged at predetermined intervals in the X axis direction on the outer surface of the X beam on the + Y side so as to hold the substrates P at mutually different plural positions separated in the X axis direction. Further, substrate carrying-out devices 170 to 570 may be additionally mounted on the X-beam 125 on the-Y side so as to hold the vicinity of the end on the-Y side (or only the vicinity of the end on the-Y side) in addition to the vicinity of the + Y side end of the substrate P.

In addition, in the above-described embodiments 3 to 8, the substrate P is carried out to the port portion 60 only by the substrate carry-out devices 70a to 570 included in the substrate stages 20c to 120f, but for example, a substrate carry-out device may be disposed in parallel to the substrate P in the port portion 60, and the substrate P may be carried out from the substrate holders 30a and 30bThe substrate P is carried out while holding the substrate P in a state where the substrate P is carried out by a predetermined amount (for example, about half of the above-described embodiment 8). In this case, the suction pads 77a on the substrate stages 20c to 120f side can be shortened₁371 is the X-axis direction of travel.

In the above-described embodiments 3 to 8, the substrate P can be received (carried in and carried out) between each of the substrate stages 20c to 120f and the port 60 by using, for example, a substrate support member disclosed in U.S. Pat. No. 6,559,928 for supporting the substrate P from below. In this case, the substrate P can be carried out from the substrate stages 20c to 120f by driving the substrate support members using the substrate carrying-out devices 70a to 570, as in the above-described embodiments 3 to 8. The substrate unloading devices 70a to 570 according to embodiments 3 to 8 hold the substrate P by vacuum suction, but are not limited thereto, and may hold the substrate P by other holding methods (e.g., mechanical holding).

In addition, although the plurality of substrate lifting devices 46a and 46b are arranged on Y coarse movement stage 23Y or X coarse movement stage 123X in embodiments 1 to 8, they are not limited to this, and may be incorporated in substrate holders 30a and 30b or fine movement stage 21.

In the substrate stage according to embodiments 2 and 4 to 6 (including modifications 1 to 3), the substrate lifting device 140 according to modification 5 can be used instead of the plurality of substrate lifting devices 46 b. In addition, in the substrate stage according to embodiments 1 and 3, a substrate lifting device in which a plurality of lift pins 48a are attached to one base member 141 such as the substrate lifting device 140 according to the 5 th modification can be used instead of the plurality of substrate lifting devices 46 a.

In addition, although the lower surface of the substrate P is sucked and held by the suction pads in the above-described embodiments 1 to 8, the apparatus for holding the substrate P is not limited to this, and may be, for example, a clamp apparatus for mechanically holding the substrate P. In the embodiments 3 to 8, the means for driving the substrate is not limited to the suction means moving in the Y-axis direction, and for example, a roller capable of abutting on the outer peripheral surface of the substrate may be provided, and the substrate may be fed from the substrate holder by rotating the roller.

The illumination light may be ultraviolet light such as ArF excimer laser light (wavelength 193nm) and KrF excimer laser light (wavelength 248nm), or F₂Vacuum ultraviolet light such as laser light (wavelength 157 nm). Further, as the illumination light, for example, a single wavelength laser light in an infrared band or a visible light band emitted from a DFB semiconductor laser or a fiber laser may be amplified by a fiber amplifier doped with, for example, erbium (or both erbium and ytterbium), and wavelength-converted into a harmonic of ultraviolet light by using a nonlinear optical crystal. Furthermore, solid-state lasers (wavelength: 355nm, 266nm) and the like can also be used.

In addition, although the above-described embodiments 1 and 2 have been described with respect to the case where the projection optical system PL is a multi-lens type projection optical system including a plurality of projection optical units, the number of projection optical units is not limited to this, and may be one or more. Further, the projection optical system is not limited to the multi-lens type, and may be a projection optical system using an offner type large mirror, for example. In the above embodiment, the case where the projection optical system PL is used at the same magnification has been described, but the projection optical system PL is not limited to this, and may be either a reduction system or an enlargement system.

In addition, although the above-described embodiments 1 and 2 use a light transmissive mask in which a predetermined light shielding pattern (or phase pattern, or light reduction pattern) is formed on a light transmissive mask substrate, an electronic mask (variable forming mask) in which a transmission pattern, a reflection pattern, or a light emitting pattern is formed based on electronic data of a pattern to be exposed as disclosed in, for example, U.S. Pat. No. 6,778,257, such as a DMD (Digital Micro-mirror Device) variable forming mask which is one type of non-light emitting type image display Device (also called a spatial light modulator), may be used instead of this mask.

The exposure apparatus is particularly effective for exposing a substrate having a size (including at least one of an outer diameter, a diagonal line, and a side) of 500mm or more, for example, a large-sized substrate for a flat panel display such as a liquid crystal display device.

Further, the exposure apparatus can be applied to an exposure apparatus of step & repeat (step & repeat) system or an exposure apparatus of step & stitch (step & stitch) system. In the exposure apparatus, the object carried out by the carrying-out device is not limited to a substrate or the like of the exposure target object, and may be a pattern holder (original plate) such as a mask.

The exposure apparatus is not limited to the exposure apparatus for liquid crystal that transfers a liquid crystal display element pattern onto a square glass plate, and can be widely applied to, for example, an exposure apparatus for semiconductor manufacturing, an exposure apparatus for manufacturing a thin film magnetic head, a micromachine, a DNA wafer, and the like. The present invention is applicable not only to microdevices such as semiconductor device devices, but also to exposure apparatuses that transfer a circuit pattern onto a glass substrate, a silicon wafer, or the like in order to manufacture a mask or a reticle used in a light exposure apparatus, an EUV exposure apparatus, an X-ray exposure apparatus, an electron beam exposure apparatus, or the like. The object to be exposed is not limited to a glass plate, but may be other objects such as a wafer, a ceramic substrate, a thin film member, and a mask substrate (mask). When the exposure target is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and for example, a film (flexible sheet member) is also included.

An electronic device such as a liquid crystal display device (or a semiconductor device) is manufactured through a step of designing the functional performance of the device, a step of fabricating a mask (or a reticle) based on the designing step, a step of fabricating a glass substrate (or a wafer), a photolithography step of transferring a mask (reticle) pattern to the glass substrate by the exposure apparatus and the exposure method thereof according to the above embodiments, a development step of developing the exposed glass substrate, an etching step of removing an exposed member except for a portion of the remaining resist by etching, a resist removal step of removing the resist unnecessary for the completion of the etching, a device assembling step, an inspection step, and the like. In this case, since the exposure method is performed using the exposure apparatus of the above embodiment in the photolithography step to form the device pattern on the glass substrate, a device with high integration can be manufactured with good productivity.

Further, the disclosures of the U.S. patents and U.S. patent application publications cited in the above description relating to exposure apparatuses and the like are incorporated as part of the present description.

Industrial applicability

As described above, the object exchange system and method of the present invention are suitable for exchanging an object held by an object holding device. Further, the object carry-out method of the present invention is suitable for carrying out an object from an object holding device. Further, the object holding device of the present invention is suitable for carrying out an object. Further, the exposure apparatus of the present invention is suitable for exposing an object. In addition, the manufacturing method of the flat panel display is suitable for manufacturing the flat panel display. Furthermore, the device manufacturing method of the present invention is suitable for manufacturing a micro device.

Claims (72)

1. An object replacement system for replacing an object loaded on an object holding member included in an object holding device, the object replacement system comprising:

a carrying-in device for carrying the object to be carried in to the upper part of the object holding member;

a carrying-out device for carrying out the object to be carried out loaded on the object loading surface of the object holding member from the object holding member in a direction along the object loading surface;

an object receiving device provided in the object holding device and configured to receive the object to be carried in from the carrying-in device; and

and a guide provided in the object holding device and defining a guide surface for guiding the object to be carried out by the carrying-out device.

2. The object exchanging system according to claim 1, wherein the object to be carried out is moved with the object holding member as the guide and the object loading surface as the guide surface.

3. The object exchange system according to claim 2, wherein the carry-out device includes a carry-out holding member that holds a part of the object to be carried out;

the object holding member has an opening formed in the object mounting surface into which the carry-out holding member is inserted.

4. The object changing system according to claim 1, wherein the guide is provided to the object receiving device;

the object to be carried in is delivered from the carrying-in device to the guide.

5. The object changing system according to claim 4, wherein the guide is provided to be movable between a protruding position protruding from the object loading surface and a housed position housed in the object holding member;

the object to be carried out moves on the guide located at the protruding position.

6. The object replacing system according to any one of claims 1 to 5, wherein the guide supports the object to be carried out in a non-contact manner.

7. The object replacing system according to any one of claims 1 to 6, wherein the carry-out device moves the carry-out target object along a two-dimensional plane parallel to the object loading surface.

8. The object changing system according to any one of claims 1 to 7, wherein the carry-in device moves the object along a two-dimensional plane parallel to the object loading surface;

the object receiving device has a movable member movable in a direction orthogonal to the two-dimensional plane, and receives the object to be carried in from the carrying-in device using the movable member.

9. The object exchanging system according to claim 8, wherein the carry-in device has a supporting member that supports the object to be carried in;

the support member is formed with a notch that opens toward the front in the moving direction when the object to be carried in is carried in, and the movable member is inserted into the notch when the object to be carried in is received and transferred.

10. The object exchanging system according to claim 9, wherein the carry-in device includes guide members for guiding movement of the support member on one side and the other side of the support member in a direction orthogonal to a moving direction of the support member in a plane parallel to the two-dimensional plane.

11. The object exchange system according to claim 10, wherein a delivery member for delivering the object to be carried in from an external device to the support member of the object carrying-in device is inserted between the guide members disposed on one side and the other side of the support member.

12. The object exchange system according to any one of claims 1 to 11, wherein the object holding device includes an inducing device that induces at a given stroke along a two-dimensional plane parallel to the object loading surface;

the object bearing device is arranged on the induction device.

13. The object replacing system according to any one of claims 1 to 12, wherein a position of the object holding device when the object to be carried in is carried out from the carry-in device to the object receiving device is the same as a position of the object holding device when the object to be carried out is carried out by the carry-out device.

14. An object replacement method for replacing an object loaded on an object holding member provided in an object holding device, comprising:

an operation of conveying the object to be carried in to the upper part of the object holding member;

receiving the object to be carried in which the object is carried to the upper side of the object holding member by using an object receiving device provided in the object holding device; and

and a carrying-out operation of guiding the object to be carried on the object carrying surface of the object holding member to a guide surface defined by a guide provided in the object holding device, and carrying out the object from the object holding member in a direction along the object carrying surface.

15. The object replacing method according to claim 14, wherein the carry-out moves the object to be carried out with the object holding member as the guide and the object loading surface as the guide surface.

16. The object changing method according to claim 14, wherein the guide is provided to the object receiving device;

the receiving is to receive the object to be carried in from the carrying-in device to the guide.

17. The object replacing method according to any one of claims 14 to 16, wherein a position of the object holding device when the object receiving device receives the object to be carried in is the same as a position of the object holding device when the object to be carried out is carried out.

18. An object carrying-out method for carrying out an object loaded on an object holding member of an object holding device from the object holding member, comprising:

an operation of moving the object holding device holding the object toward an object carry-out position at which the object is carried out from the object holding member; and

before the object holding device reaches the object carry-out position, an operation of carrying out the object from the object holding member is started.

19. The object carrying out method according to claim 18, wherein the carrying out operation is started, and the object is moved relative to the object holding member by using a carrying out device provided in the object holding member.

20. The object carrying out method according to claim 18 or 19, wherein the object is carried out from the object holding member by guiding the object loaded on the object loading surface of the object holding member to a guide surface defined by a guide provided in the object holding device so as to move from the object holding member in a direction along the object loading surface.

21. The object carrying out method according to any one of claims 18 to 20, wherein the object is moved in the 1 st direction at the object carrying out position to be carried out from the object holding device;

the carrying-out operation is performed in parallel with the movement of the object holding device in the 2 nd direction intersecting the 1 st direction.

22. A method of object exchange on an object holding device, comprising:

an operation of starting the carrying-out operation by the object carrying-out method according to any one of claims 18 to 21;

an operation of waiting for another object at a predetermined waiting position before the object holding device reaches the object carry-out position;

an operation of carrying out the object from the object holding device in a state where the object holding device is located at the object carry-out position; and

and an operation of carrying the other object located at the standby position into the object holding device.

23. The object replacement method according to claim 22, wherein the carry-out is to move the object along a two-dimensional plane parallel to the object loading surface;

the carrying-in is to move the other object in a direction orthogonal to the two-dimensional plane.

24. The object replacing method according to claim 22 or 23, wherein the carrying in of the other object is to receive the other object using an object receiving device provided to the object holding device.

25. An object replacement method for replacing an object loaded on an object holding member of an object holding device, comprising:

an operation of conveying the object to be carried in to the upper part of the object holding member;

receiving the object to be carried in which the object is carried to the upper side of the object holding member by using an object receiving device provided in the object holding device; and

the object to be carried out loaded on the object loading surface of the object holding member is guided to the guide surface defined by the guide provided in the object holding device, and carried out from the object holding member in the direction of the object loading surface by using the object carrying-out device provided in the object holding device.

26. The object replacing method according to claim 25, further comprising an operation of moving an object holding device holding the object to be carried out toward an object carrying-out position at which the object is carried out from the object holding member;

the carrying-out is a carrying-out operation of starting carrying out the object from the object holding member before the object holding device reaches the object carrying-out position.

27. The object replacing method according to claim 25 or 26, wherein the carry-out is performed by moving the object to be carried out with the object holding member as the guide and the object loading surface as the guide surface.

28. The object changing method according to claim 25 or 26, wherein the guide is provided to the object bearing device;

the carrying-in is to transfer the object to be carried in to the guide.

29. An object holding device is provided with:

an object holding member having an object loading surface on which an object to be carried in is loaded, the object holding member being capable of holding the object loaded on the object loading surface; and

and a carrying-out device for carrying out the object held by the object holding member from the object holding member to the outside.

30. The object holding device according to claim 29, wherein a recess is formed in the object loading surface of the object holding member;

the carrying-out device is accommodated in the recess.

31. The object holding device according to claim 30, wherein the carry-out device is disposed outside the object holding member.

32. The object holding device according to claim 31, further comprising a guide device for guiding the object holding member along a predetermined two-dimensional plane by a predetermined stroke;

the carrying-out device is arranged on the inducing device.

33. The object holding device according to any one of claims 29 to 32, wherein a plurality of the carry-out devices are provided.

34. The object holding device according to any one of claims 29 to 33, wherein the carry-out device has a holding device that holds the object;

the holding device is arranged to be movable relative to the object between a position in which the object can be held and a position in which the holding device is separated from the object.

35. The object holding device according to claim 34, wherein the holding device is capable of relative movement in at least one of a direction parallel to the surface of the object and a direction orthogonal to the surface of the object.

36. The object holding device according to any one of claims 29 to 35, wherein the object holding member is provided so as to be movable between an object processing position at which a predetermined process is performed on the object and an object carrying-out position at which the object is carried out;

the carrying-out device starts a carrying-out operation of carrying out the object from the object holding member before the object holding member reaches the object carrying-out position.

37. An object replacement system is provided with:

the object holding device according to any one of claims 29 to 36;

a carrying-in device for carrying the object to be carried in to the upper part of the object holding member;

an object receiving device provided in the object holding device and configured to receive the object to be carried in from the carrying-in device; and

and a guide provided in the object holding device and defining a guide surface for guiding the object to be carried out by the carrying-out device.

38. The object replacing system according to claim 37, wherein the object to be carried out is moved with the object holding member of the object holding device as the guide and the object loading surface of the object holding member as the guide surface.

39. The object changing system according to claim 37, wherein the guide is provided to the object receiving device;

the object to be carried in is delivered from the carrying-in device to the guide.

40. The object changing system according to claim 39, wherein the guide is provided to be movable between a protruding position protruding from the object loading surface and a housed position housed in the object holding member;

the object to be carried out is moved on the guide located at the protruding position.

41. The object replacing system according to any one of claims 37 to 40, wherein the guide supports the object to be conveyed out in a non-contact manner.

42. The object replacement system according to any one of claims 37 to 41, wherein the carry-out device moves the carry-out object along a two-dimensional plane parallel to the object loading surface.

43. The object replacing system according to any one of claims 37 to 42, wherein the carry-in device moves the carry-in target object along a two-dimensional plane parallel to the object loading surface;

the object receiving device has a movable member movable in a direction orthogonal to the two-dimensional plane, and receives the object to be carried in from the carrying-in device using the movable member.

44. The object replacing system according to claim 43, wherein the carry-in device has a supporting member that supports the object to be carried in;

the support member is formed with a notch that opens toward the front in the moving direction when the object to be carried in is carried in, and the movable member is inserted into the notch when the object to be carried in is received and transferred.

45. The object replacing system according to claim 44, wherein the carry-in device includes guide members for guiding movement of the support member on one side and the other side of the support member in a direction orthogonal to a moving direction of the support member in a plane parallel to the two-dimensional plane.

46. The object replacing system according to claim 45, wherein a delivery member for delivering the object to be carried in from an external device to the supporting member of the object carrying-in device is inserted between the guide members disposed on one side and the other side of the supporting member.

47. The object exchange system according to any one of claims 37 to 46, further provided with an inducing device that induces the object holding member along a given two-dimensional plane with a given stroke;

the object bearing device is arranged on the induction device.

48. The object exchange system according to any one of claims 37 to 47, further comprising a carrying-out receiving member that guides the object to be carried out by the carrying-out device together with the guide to receive the object to be carried out by the object holding device;

the carrying-out receiving member has a guide surface set to be wider than the width of the object.

49. The object replacing system according to any one of claims 37 to 48, wherein a position of the object holding device when the object to be carried in is carried out from the carry-in device to the object receiving device is the same as a position of the object holding device when the object to be carried out is carried out by the carry-out device.

50. An exposure apparatus includes:

the object holding device according to any one of claims 29 to 36; and

a patterning device for forming a predetermined pattern on the object held by the object holding device by using an energy beam.

51. An exposure apparatus includes:

the object changing system of any one of claims 1 to 13, 37 to 49; and

a patterning device for forming a predetermined pattern on the object held by the object holding device by using an energy beam.

52. A scanning exposure apparatus for moving an object in a scanning direction with respect to an energy beam during exposure, comprising:

a 1 st moving body movable in a 1 st direction orthogonal to the scanning direction on a predetermined two-dimensional plane;

a 2 nd moving body movable in a 2 nd direction parallel to the scanning direction on the 1 st moving body and movable in the 1 st direction together with the 1 st moving body;

an object holding device that is provided so as to be capable of holding the object, is disposed above the 2 nd movable body, and is guided in a direction parallel to the predetermined two-dimensional plane integrally with the object by the movement of the 2 nd movable body; and

and a carrying-out device provided in the 1 st moving body and configured to drive the object in a predetermined carrying-out direction with respect to the object holding device.

53. The exposure apparatus according to claim 52, wherein the carry-out direction is the 2 nd direction.

54. The exposure apparatus according to claim 53, wherein the carry-out device includes a holding member that holds the object, and a driving device that drives the holding member in the 2 nd direction.

55. The exposure apparatus according to claim 54, wherein the drive device drives the holding member in the 2 nd direction between a position overlapping with a range in which the 2 nd movable body is movable on the 1 st movable body and a position outside the range.

56. The exposure apparatus according to claim 55, wherein the holding member is located outside the movement possible range at least at the time of exposure.

57. The exposure apparatus according to claim 56, further comprising an object driving device that drives the object in a direction away from the object holding device;

the holding member is interposed between the object driven by the object driving device and the object holding device.

58. The exposure apparatus according to claim 56, wherein the object driving apparatus includes: a 1 st member extending in the 2 nd direction and capable of supporting the object from below, and a plurality of 2 nd members provided in the 1 st direction in one side and the other side regions of a central portion of the object holding device, respectively, for driving the 1 st member in a direction intersecting the two-dimensional plane.

59. The exposure apparatus according to claim 57 or 58, wherein the object driving device supports the object in a non-contact manner from below in a state where the object is separated from the object holding device;

the carrying-out device drives the object supported in a non-contact manner in the 2 nd direction by the object driving device.

60. The exposure apparatus according to claim 59, wherein the object driving device ejects gas from a face opposed to the object to levitate the object.

61. The exposure apparatus according to any one of claims 57 to 60, wherein the carry-out device further comprises a holding member driving device that drives the holding member in a direction approaching or separating from the object holding device within the two-dimensional plane.

62. The exposure apparatus according to claim 54, further comprising an object driving device that drives the object relative to the object holding device in a direction intersecting the 2 nd direction;

the holding member holds a portion of the object to be driven by the object driving device to protrude from the object holding device.

63. The exposure apparatus according to claim 62, wherein the object holding device ejects gas from a surface opposed to the object to levitate the object when the object is driven in the carry-out direction.

64. The exposure apparatus according to any one of claims 54 to 63, wherein the holding member holds the object by suction.

65. The exposure apparatus according to any one of claims 52 to 64, further comprising a micro-drive system that micro-drives the object holding device in a 6-degree-of-freedom direction with respect to the 2 nd movable body.

66. The exposure apparatus according to any one of claims 52 to 65, further comprising a support device that is provided so as to be movable in parallel with the predetermined two-dimensional plane integrally with the object holding device, and that supports a central portion of the object holding device from below in a non-contact manner.

67. The exposure apparatus according to claim 66, further comprising a guide extending in the 2 nd direction, supporting the support device from below, for defining a guide surface when the support device moves in the 2 nd direction;

the guide moves in the 1 st direction together with the support device in a state of supporting the support device from below.

68. The exposure apparatus according to any one of claims 52 to 67, wherein the 2 nd mobile body induces the object from an exposure end position to a replacement position where replacement of the object with another object is performed after the exposure ends;

the carrying-out device starts the carrying-out operation of the object before the object reaches the replacement position.

69. The exposure apparatus according to any one of claims 50 to 68, wherein the object is used for a substrate of a flat panel display device.

70. The exposure apparatus according to claim 69, wherein the substrate has at least one side length or a diagonal length of 500mm or more.

71. A method for manufacturing a flat panel display includes:

an act of exposing the object using the exposure apparatus according to claim 69 or 70; and

and developing the exposed object.

72. A device manufacturing method, comprising:

an act of exposing the object using the exposure apparatus according to any one of claims 50 to 68; and

and developing the exposed object.