TWI765999B - Object exchange device, object handling device, manufacturing method of flat panel display, component manufacturing method, object exchange method, and object processing method - Google Patents

Abstract

The object exchange apparatus, the object processing apparatus, the manufacturing method of a flat panel display, the component manufacturing method, the object exchange method, and the object processing method of this invention shorten the time which a board|substrate exchange takes. The object exchange device includes: a first support part that supports a first surface of an object; and a second support part that receives the object from the first support part and supports a second surface of the object different from the first surface a surface; and a driving part for driving the object toward the object exchange position where another object different from the object is carried on the first support part to transfer the object to the first support part on the second support part support.

Description

Object exchange devices, object handling devices, flat panel displays Manufacturing method, component manufacturing method, object exchange method, and object processing method

The present invention relates to an object exchange device, an object processing device, a manufacturing method of a flat panel display, a component manufacturing method, an object exchange method and an object processing method.

In the lithography step of manufacturing electronic components such as liquid crystal display elements and semiconductor elements, an exposure apparatus is used that uses an energy beam to transfer patterns formed on a mask (or photomask) onto a glass substrate (or wafer).

As such an exposure apparatus, there is known an exposure apparatus in which, after carrying out the exposed glass substrate on the substrate stage apparatus using a predetermined substrate conveying apparatus, another glass substrate is carried on the substrate stage apparatus using the substrate conveying apparatus. , whereby the glass substrates held on the substrate stage apparatus are sequentially exchanged, and exposure processing is continuously performed on a plurality of glass substrates (for example, refer to Patent Document 1). When exposing a plurality of glass substrates continuously, in order to increase the overall throughput, it is preferable to quickly exchange the glass substrates on the substrate stage device.

[Prior Art Literature] [Patent Literature]

[Patent Document 1] US Patent Application Publication No. 2010/0266961

According to a first aspect, there is provided an object exchange device (20, 150, 130) comprising: a first support part (68) for supporting the first surface of the object (P1); and a second support part (150) from the A first support part receives the object and supports a second surface of the object different from the first surface; and a driving part (43) is carried into the object toward another object (P2) different from the object The object exchange position drive on the first support part is used to transfer the object to the first support part on the second support part.

According to a second aspect, there is provided an object processing device (10) comprising: the object exchange device; and a processing unit (16) for providing the first support unit to the first support section at a processing position different from the object exchange position. The predetermined processing is performed on the second surface of the object (P1) or the other object (P2) above.

Another object processing device is provided, comprising: the object exchange device; and a processing unit at a processing position different from the object exchange position, using an energy beam to the object or the object held by the holding device. The second surface of the other object is subjected to scanning exposure to form a predetermined pattern on the second surface. In the scanning exposure, the holding device is relatively driven with respect to the first support portion.

According to a third aspect, there is provided a method of manufacturing a flat panel display including: exposing an object using the object processing apparatus; and developing the exposed object.

According to a fourth aspect, there is provided a device manufacturing method comprising: exposing an object using the object processing apparatus; and exposing the exposed object development.

According to a fifth aspect, there is provided an object exchange method comprising: receiving an object whose first surface is supported by a first support portion, and supporting a second surface of the object different from the first surface by the second support portion and driving toward the object exchange position where another object different from the object is carried on the first support part to transfer the object to the first support part on the second support part.

According to a sixth aspect, there is provided an object processing method, comprising: the object exchange method; and at a processing position different from the object exchange position, the object on the first support portion or the other The second surface of the object is subjected to predetermined processing.

Another object processing method is provided, comprising: the object exchange method; and at a processing position different from the object exchange position, using an energy beam to treat the object or the other object held on the holding device The second surface is subjected to scanning exposure to form a predetermined pattern on the second surface. When the other object is relatively driven, in the scanning exposure, the other object is relatively driven with respect to the first support portion.

In addition, in order to facilitate the understanding of the description, the above description is made in correspondence with the symbols in the drawings representing one embodiment, but the present invention is not limited to this, and the configuration of the embodiment described later may be appropriately improved. At least a part is replaced with other constituents. Furthermore, the components whose arrangement is not particularly limited are not limited to the arrangements disclosed in the embodiments, and may be arranged at positions that can achieve their functions.

10. 10a~10g: Liquid crystal exposure device (object processing device)

11: Flooring

12: Lighting system

14: Mask Platform

16: Projection Optical System

17: Anti-vibration device

18: Platform base

20: Substrate platform device

30:Y coarse motion platform

33: Y drive mechanism

40:X coarse motion platform

43: X drive mechanism

50: Weight offset device

60: Substrate stage

64:Z voice coil motor

66: Guide plate

68: Substrate holder

70: Substrate bracket

72: Pedestal

74: Bracket body

78: Air bearing

100: Benchmark Plate

130, 130a, 130b: substrate carrying device

133: Air guide drive mechanism

136: Substrate moving device

137, 148: Z actuator

138: Air guide device

140:X drive mechanism

142: Pillar

144: Adsorption pad

145: Drive

146: Z-axis drive mechanism

150, 150a~150f: Suspended support device

151: Suspended support device mounting bracket

152, 152a~152c: Non-contact support device

153: Drive

154: Base plate stopper

158: Substrate transfer device

158a: Retention Department

158b: Drive member

159: Guiding Mechanism

AIR1: pressurized gas

IL: Illuminating Light

M: mask

P, P1, P2: substrate

X, Y, Z: direction

FIG. 1 is a diagram schematically showing the configuration of a liquid crystal exposure apparatus according to the first embodiment.

FIG. 2 is a plan view of the liquid crystal exposure apparatus (a part is omitted) of FIG. 1 .

FIGS. 3( a ) to 3 ( c ) are diagrams for explaining the operation of the substrate carrying device included in the liquid crystal exposure apparatus of FIG. 1 .

4(a) to 4(c) are diagrams (Part 1) for explaining the substrate exchange operation in the first embodiment.

FIGS. 5( a ) to 5 ( c ) are diagrams (Part 2 ) for explaining the substrate exchange operation in the first embodiment.

FIGS. 6( a ) and 6 ( b ) are diagrams for explaining the substrate exchange operation in Modification 1 of the first embodiment.

7( a ) is a diagram schematically showing the configuration of a liquid crystal exposure apparatus according to Modification 2 of the first embodiment, and FIG. 7( b ) is a view of the liquid crystal exposure apparatus of FIG. 7( a ) viewed from the −Z side (a part is omitted). ) floor plan.

8 is a diagram schematically showing the configuration of a liquid crystal exposure apparatus according to Modification 3 of the first embodiment.

Fig. 9(a) is a diagram schematically showing the configuration of a liquid crystal exposure apparatus according to the second embodiment, and Figs. 9(b) and 9(c) are diagrams for explaining the substrate exchange operation in the second embodiment.

FIG. 10( a ) is a diagram schematically showing the configuration of a liquid crystal exposure apparatus according to the third embodiment, and FIG. 10( b ) is for explaining the substrate exchange operation in the third embodiment Figure (its 1).

FIGS. 11( a ) and 11 ( b ) are diagrams (Part 2) for explaining the substrate exchange operation in the third embodiment.

FIG. 12 is a diagram schematically showing the configuration of a liquid crystal exposure apparatus according to the fourth embodiment.

FIGS. 13( a ) and 13 ( b ) are diagrams for explaining the substrate exchange operation in Modification 1 of the fourth embodiment.

"First Embodiment"

First, the first embodiment will be described with reference to FIGS. 1 to 5( c ).

In FIG. 1, the structure of the liquid crystal exposure apparatus 10 of 1st Embodiment is shown schematically. In addition, in FIG. 2, the top view (a part is omitted) of the liquid crystal exposure apparatus 10 of 1st Embodiment is shown. The liquid crystal exposure apparatus 10 is, for example, a step-and-scan in which a rectangular (square) glass substrate P (hereinafter, simply referred to as a substrate P) used in a liquid crystal display device (flat panel display) or the like is an exposure object. A type of projection exposure device, the so-called scanner.

The liquid crystal exposure apparatus 10 includes an illumination system 12, a mask stage 14 holding a mask M having a pattern such as a circuit pattern formed thereon, a projection optical system 16, a pair of stage bases 18, and a holding surface (the surface facing the +Z side in FIG. 1 ). ), the substrate stage device 20, the suspension support device 150, the substrate carrying device 130, the control system of the above-mentioned members, and the like on the substrate P coated with the resist (sensing agent). Hereinafter, with respect to the projection optical system 16 during exposure, the directions relative to the scanning mask M and the substrate P, respectively, are set as X The axis direction will be described with the direction orthogonal to the X axis in the horizontal plane as the Y axis direction, and the direction orthogonal to the X axis and the Y axis as the Z axis direction. The directions of rotation (tilt) around the Z-axis are set to be the θx direction, the θy direction, and the θz direction, respectively, for description. In addition, the positions related to the X-axis direction, the Y-axis direction, and the Z-axis direction will be described as the X position, the Y position, and the Z position, respectively.

The lighting system 12 is configured similarly to the lighting system disclosed in, for example, US Pat. No. 5,729,331. The illumination system 12 uses light emitted from a light source (for example, a mercury lamp) not shown as exposure illumination light (illumination light) IL, and passes through a reflector, a dichroic mirror, and a shutter not shown, respectively. , wavelength selective filters, various lenses, etc., and irradiate the mask M. As illumination light IL, light such as i-line (wavelength 365 nm), g-line (wavelength 436 nm), h-line (wavelength 405 nm) (or composite light of the i-line, g-line, and h-line) can be used, for example.

The mask platform 14 holds the light-transmitting mask M. The mask stage 14 drives the mask M with a predetermined long stroke in the X-axis direction (scanning direction) with respect to the illumination system 12 (illumination light IL) via, for example, a drive system (not shown) including a linear motor, and is Microdrive is performed in the Y-axis direction and the θz direction. The position information in the horizontal plane of the mask M is obtained, for example, by a mask stage position measurement system (not shown) including a laser interferometer or an encoder.

The projection optical system 16 is disposed below the mask platform 14 . The projection optical system 16 is, for example, a so-called multi-lens type projection optical system having the same configuration as the projection optical system disclosed in US Pat. No. 6,552,775 and the like, and includes, for example, A plurality of optical systems that form an erect erect image on both sides of the telecentric.

In the liquid crystal exposure apparatus 10, when the mask M located in the predetermined illumination area is illuminated by the illumination light IL from the illumination system 12, the illumination light passing through the mask M is passed through the projection optical system. 16. In the exposure area on the board|substrate P, the projection image (image of a part of the pattern) of the pattern of the mask M in this illumination area is formed. Also, the mask M is relatively moved in the scanning direction with respect to the illumination area (illumination light IL), and the substrate P is relatively moved in the scanning direction with respect to the exposure area (illumination light IL), whereby one exposure irradiation on the substrate P is performed. The scanning exposure of the area is performed, and the pattern formed in the mask M (the whole of the pattern corresponding to the scanning range of the mask M) is transferred into the exposure irradiation area. Here, the illumination area on the mask M and the exposure area (irradiation area of illumination light) on the substrate P are in an optically conjugated relationship with each other by the projection optical system 16 .

Each of the pair of stage bases 18 includes members extending in the Y-axis direction, and is disposed apart from each other in the X-axis direction. The platform base 18 is installed on the floor 11 of the clean room via a plurality of vibration isolation devices 17 .

(Substrate stage device 20)

The board|substrate stage apparatus 20 is comprised like the board|substrate stage apparatus disclosed in, for example, International Publication No. 2016/169176. The substrate stage device 20 includes an X coarse movement stage 40 , a Y coarse movement stage 30 , a weight offset device 50 , a substrate stage 60 , a substrate holder 68 , and a substrate holder 70 .

The X coarse motion stage 40 and the Y coarse motion stage 30 are devices for driving the substrate stage 60 with predetermined long strokes in the X-axis direction and the Y-axis direction, respectively. powered by X The mechanism 43 drives the X coarse motion stage 40 with a predetermined stroke in the X-axis direction. In addition, the Y coarse motion stage 30 is driven by a predetermined stroke in the Y-axis direction by the Y drive mechanism 33 .

The weight cancellation device 50 generates an upward force in the direction of gravity to support the self-weight of the system including the substrate stage 60 and the substrate holder 68 . As the configuration of the weight canceling device 50, for example, the same configuration as the weight canceling device disclosed in the specification of US Patent Application Publication No. 2010/0018950 can be used.

The substrate stage 60 includes a member that is rectangular in plan view with the X-axis direction as the longitudinal direction. The central portion of the substrate stage 60 is supported from below by the weight cancellation device 50 via a spherical bearing device (not shown).

The substrate stage 60 is mechanically connected to the X coarse motion stage 40 via a plurality of flexures. The substrate stage 60 is constrained relative to the X coarse motion stage 40 in a direction parallel to the XY plane (X-axis direction, Y-axis direction, θz direction) due to the plurality of curved portions, and relative to the X coarse motion stage 40 In the direction (Z-axis direction, θx direction, θy direction) intersecting with the XY plane, it is in a state of being relatively movable within a small range. The substrate stage 60 is pulled by the X coarse motion stage 40 via, for example, any one of the four curved portions, and thereby moves integrally with the X coarse motion stage 40 in at least one of the X-axis direction and the Y-axis direction.

The substrate stage 60 is minutely driven in the Z axis direction, the θx direction, and the θy direction (hereinafter referred to as the Z tilt direction) with respect to the X coarse motion stage 40 via a plurality of Z voice coil motors 64 . The Z voice coil motors 64 may correspond to the four corners of the substrate stage 60 , for example, four Z voice coil motors 64 may be provided, but not limited to this, as long as at least four Z voice coil motors 64 are provided It can be done on three parts that are not on the same straight line. The position information in the Z tilt direction of the substrate stage 60 is obtained by using a plurality of Z sensors including a probe fixed on the lower surface of the substrate stage 60 and a target fixed on the weight offset device 50 , and It is calculated|required by the main control apparatus which is not shown in figure. For example, four (at least three) Z sensors are arranged at predetermined intervals around an axis parallel to the Z axis. A main control device (not shown) controls the Z tilt position of the substrate stage 60 (ie, the substrate P) based on the outputs of the plurality of Z sensors.

A plurality of (for example, four) guide plates 66 are fixed to the lower surface of the substrate stage 60 in a suspended state. For example, the four guide plates 66 are arranged to protrude radially (cross-like) toward the outside of the substrate table 60 from the respective ends of the +X side, the -X side, the +Y side, and the -Y side of the substrate table 60 . The flatness of the upper surface of the guide plate 66 is trimmed to be very high.

The substrate holder 68 supporting the substrate P includes a rectangular plate-shaped member in a plan view with the X-axis direction as the longitudinal direction, and is fixed to the upper surface of the substrate stage 60 . The dimensions in the longitudinal direction and the width direction of the substrate holder 68 are longer than the dimensions in the longitudinal direction and the width direction of the substrate stage 60 , and are set to be approximately the same as the dimensions in the longitudinal direction and the width direction of the substrate P (actually). slightly shorter). The substrate P is placed on the upper surface of the substrate holder 68 . The upper surface of the board|substrate holder 68 is formed with several minute hole parts which are not shown in figure.

A pressurized gas supply device for supplying pressurized gas (eg, air) and a vacuum suction device (both not shown) are connected to the substrate holder 68 . The substrate holder 68 ejects the pressurized gas (compressed air) supplied from the pressurized gas supply device to the lower surface of the substrate P through a part of the plurality of minute holes, thereby allowing the gas to be interposed between the substrates. Between the lower surface of the plate P and the upper surface of the substrate holder 68 (ie, a gas film is formed). In addition, the substrate holder 68 uses a vacuum suction device to suck the gas between the upper surface of the substrate holder 68 and the lower surface of the substrate P through the remaining minute holes, thereby causing a downward force in the direction of gravity (preliminary). load) acts on the substrate P, thereby imparting rigidity in the direction of gravity to the gas film.

Furthermore, the substrate holder 68 supports the substrate P in a non-contact manner by floating the substrate P through a small gap in the direction of gravity (Z-axis direction) by the balance between the pressure and flow rate of the pressurized gas and the vacuum suction force. A force for controlling the flatness (for example, a force for correcting or correcting the flatness) is caused to act on the substrate P. Therefore, the substrate holder 68 restricts the substrate P in the Z-inclined direction, but does not restrict the substrate P in the three-degree-of-freedom direction in the horizontal plane. In addition, in the substrate holder 68, the substrate P and the substrate holder 68 can be controlled by the balance adjustment (hereinafter, referred to as air adjustment) of the ejection (air supply) and the vacuum suction (intake) of the pressurized gas. interval. In addition, the air adjustment can be controlled corresponding to the position of the upper surface of the substrate holder 68 . Further, the substrate holder 68 is arranged so as to support at least a portion of the lower surface of the substrate P corresponding to the exposure shot area on the substrate P (ie, the area where the pattern of the mask M is transferred). Therefore, the upper surface of the substrate holder 68 for supporting the substrate P is preferably set to a size capable of supporting at least one exposure irradiation area formed on the substrate P. As shown in FIG. Furthermore, in the present embodiment, the substrate P is supported in a non-contact manner while the force acting on the substrate P in the downward direction of gravity by the ejection of the pressurized gas and the vacuum suction is not limited thereto. In this case, for example, the gas can be passed between the substrate P and the substrate holder 68 at a high speed, and the Bernoulli effect can be used to A downward force in the direction of gravity acts on the substrate P, and the substrate P is supported on one side without contact.

The substrate holder 70 has a base 72 and a holder body 74 . As shown in FIG. 2 , the base 72 includes a rectangular frame-shaped member in plan view (viewed from the +Z side). The substrate stage 60 is arranged in an opening portion formed in the base 72 which is rectangular in plan view.

For example, four air bearings 78 are fixed to the lower surface of the base 72 corresponding to, for example, four guide plates 66 fixed to the substrate stage 60 . For example, four air bearings 78 are arranged to face the upper surfaces of the guide plates 66 corresponding to the bearing surfaces (gas ejection surfaces), respectively, and eject pressurized gas (eg, compressed air) from the bearing surfaces to the corresponding guide plates 66 on the upper surface. The base 72 floats up on the four guide plates 66 through small gaps, for example, by the static pressure of the pressurized gas ejected from each of the four air bearings 78 onto the corresponding guide plates 66 .

On the wall surface defining the opening of the base 72, for example, a drive mechanism (eg, a voice coil motor of electromagnetic drive type) that drives the substrate holder 70 in the X-axis direction and the Y-axis direction is attached.

As shown in FIG. 2 , the bracket body 74 includes, for example, a U-shaped member in a plan view that is open on the +X side. The bracket body 74 is placed on the upper surface of the base 72 and fixed to the base 72 . A board holder 68 is arranged inside the bracket body 74 . In addition, between the inner wall surface of the carrier body 74 and the side surface of the substrate holder 68, three-degree-of-freedom directions (X-axis direction, Y-axis direction, θz) are formed even if the substrate carrier 70 is in the horizontal plane with respect to the substrate stage 60 . direction) is slightly driven and does not come into contact with each other.

As shown in FIG. 1 , the substrate P is placed on the carrier body 74 . Put the substrate P The vicinity of each end of the +X side, the -X side, the +Y side, and the -Y side is a region where the mask pattern is not transferred (hereinafter, referred to as a blank region), and the substrate P is placed on the carrier. In the state on the main body 74 , the blank area is supported by the bracket main body 74 from below. In addition, a plurality of minute hole portions (not shown) are formed on the upper surface of the bracket body 74 . The carrier body 74 is connected to a vacuum suction device (not shown), and can suck and hold the blank area of the substrate P through the plurality of holes.

As described above, the substrate holder 68 restricts the substrate P in the Z-inclined direction, but does not restrict the substrate P in the three-degree-of-freedom directions (X direction, Y direction, and θz direction) in the horizontal plane. Therefore, the substrate P is driven in the three-degree-of-freedom direction using the substrate holder 70 . The main control device (not shown) uses a drive mechanism (for example, a voice coil motor of an electromagnetic force drive type) that drives the substrate holder 70 in the X-axis direction and the Y-axis direction, relative to the substrate stage 60 in the X-axis direction and the Y-axis direction. The substrate carriers 70 are driven in small amounts in the axial direction, respectively. In addition, the main control device (not shown) uses a drive mechanism (for example, a voice coil motor of an electromagnetic force drive system) for driving the substrate holder 70 in the X-axis direction or the Y-axis direction, and is driven in a small manner in the θz direction with respect to the substrate stage 60 . Substrate carrier 70 .

In the substrate stage apparatus 20, the substrate holder 68 and the substrate holder 70 are arranged in a non-contact manner, and are physically (mechanically) separated from each other, and the substrate holder 70 can be minutely driven without driving the substrate holder 68. even the substrate P. That is, the substrate holder 70 can drive the substrate P relative to the substrate holder 68 . Thereby, even if the board|substrate P is hold|maintained in non-contact, positioning can be performed with high precision.

(Suspended support device 150)

The suspension support device 150 is used for holding the substrate together with the substrate carrying device 130 The unloading operation of the substrate P on the holder 68 from the substrate holder 68 . The suspension support device 150 is arranged so as to be positioned above the substrate holder 68 in a state where the substrate stage device 20 is positioned at the substrate exchange position.

The suspension support device 150 includes a non-contact support device 152 . In the first embodiment, the non-contact support device 152 is attached to the reference plate 100 (not shown in FIG. 1 , see FIG. 4( a ) and the like) on which the projection optical system 16 is attached.

A plurality of small holes (not shown) are formed on the lower surface of the non-contact support device 152, and a pressurized gas supply device for supplying pressurized gas (for example, air) and a vacuum pump are connected to the non-contact support device 152. suction device (neither shown). The non-contact support device 152 ejects the pressurized gas (compressed air) supplied from the pressurized gas supply device to the upper surface of the substrate P through a part of the plurality of fine holes, and uses the vacuum suction device to The gas between the lower surface of the non-contact support device 152 and the upper surface of the substrate P is sucked through the remaining minute holes. Furthermore, the non-contact support device 152 supports the substrate P in a non-contact manner through a small gap in the gravitational direction (Z-axis direction) by the balance between the pressure and flow rate of the pressurized gas and the vacuum suction force. Furthermore, in the present embodiment, the substrate P is supported in a non-contact manner while the substrate P is supported in a non-contact manner by the combined force of the ejection of the pressurized gas and the vacuum suction for causing the upward force in the gravitational direction to act on the substrate P, but the present invention is not limited to this. For example, gas can be passed between the substrate P and the non-contact support device 152 at high speed, and the Bernoulli effect can be used to make the upward force of gravity act on the substrate P to support the substrate P non-contact. That is, the supporting method is not limited as long as the upper surface of the substrate P is supported so that the non-contact supporting device 152 does not come into contact with it.

In addition, the suspension support device 150 is provided with the non-contact support device 152 in the vicinity of the end portions on the +X side, the -X side, the +Y side, and the -Y side for restricting the direction of the non-contact supported substrate P to be parallel to the XY plane Inadvertent movement in the direction of the substrate stopper (not shown). The reason for this is that the non-contact support device 152 restrains the substrate P in the Z-inclined direction, whereas the substrate P cannot be restrained in the three-degree-of-freedom directions (X direction, Y direction, and θz direction) in the horizontal plane, and is supported by non-contact support. The substrate P moves. The board|substrate stopper is arrange|positioned so that the outer periphery of the board|substrate P may be surrounded. The number of substrate stoppers is not particularly limited as long as the inadvertent movement of the substrate P can be restricted.

In addition, in this 1st Embodiment, although one non-contact support apparatus 152 is arrange|positioned, the size, number, and arrangement|positioning of the non-contact support apparatus 152 are not limited to this. The non-contact support device 152 only needs to be able to form a space between the exposed substrate and the substrate holder 68 for carrying a new substrate P onto the substrate holder 68 , and it can be appropriately changed according to the size of the substrate P, for example. .

(Substrate carrying device 130)

The board|substrate carrying-in apparatus 130 carries out carrying-in of the board|substrate P to the board|substrate holder 68 which is empty (the board|substrate P is not hold|maintained). Moreover, the board|substrate carrying-in apparatus 130 carries out unloading of the board|substrate P which completed the exposure which is supported by the said suspension support apparatus 150. As shown in FIG. 1 , the substrate carrying device 130 is arranged in a region on the +X side of the substrate stage device 20 , and is installed on the floor 11 . Thereby, the vibration generated by the substrate carrying device 130 is not transmitted to the substrate stage device 20 . The board|substrate stage apparatus 20 and the board|substrate carrying apparatus 130 are accommodated in the chamber which is not shown in the figure which the liquid crystal exposure apparatus 10 has.

The substrate carrying device 130 includes a substrate moving device 136 and an air guide device 138. The drive mechanism 133 of the air guide device.

The board|substrate moving apparatus 136 moves the board|substrate P of the carrying-in object or the carrying-out object at the time of the replacement|exchange operation|movement of the board|substrate P on the board|substrate holder 68. The board|substrate moving apparatus 136 is comprised like the board|substrate moving apparatus disclosed by WO 2014/024483, for example. The substrate moving device 136 includes an X drive mechanism 140 , a support column 142 , and a suction pad 144 . The X drive mechanism 140 linearly drives the suction pad 144 in the X-axis direction with a stroke approximately the same as the size of the substrate P in the X-axis direction, for example. As the X drive mechanism 140, for example, a linear motor, a feed screw device, a belt drive device, or the like may be used.

The suction pad 144 includes a member whose XZ cross section is an inverted L-shape, and a portion parallel to the XY plane is formed into a rectangular plate shape in plan view. The suction pad 144 is connected to a vacuum device (not shown), and the upper surface of the portion parallel to the XY plane functions as a substrate suction surface. The surface of the part parallel to the YZ plane of the adsorption|suction pad 144 opposes the surface (surface facing the -X side) of the upper end part vicinity of the support|pillar 142. The suction pad 144 is attached so as to be movable in the Z-axis direction with respect to the support column 142 via a Z-axis drive mechanism 146 fixed to one surface (-X side surface) of the support column 142 . In addition, by the Z actuator 148 (for example, an air cylinder, etc.), the upper surface (substrate suction surface) protrudes to the +Z side from the upper surfaces of the substrate holder 68 and the two air guides 138, respectively, and the Between the substrate holder 68 and the positions where the upper surfaces of the two air guides 138 are further lowered, the suction pads 144 are driven in the Z-axis direction.

The air guide 138 in the present embodiment includes a rectangular parallelepiped member whose longitudinal direction is the X-axis direction. Through the air guide device driving mechanism 133, in the X-axis direction The air guide device 138 is appropriately driven by the predetermined stroke. In addition, the air guide device 138 can be driven in the Z-axis direction by the Z actuator 137 (eg, an air cylinder, etc.).

As shown in FIG. 2 , the air guides 138 are arranged to be separated from each other at predetermined intervals so that the lower surface of the substrate P can be substantially equally supported. In this 1st Embodiment, the board|substrate P is supported from the downward direction by the two air guides 138. As shown in FIG. In addition, the size, number, and arrangement of the air guides 138 , the shape of the substrate guide surface formed by the air guides 138 , and the like can be appropriately changed according to the size of the substrate P, for example.

As shown in FIG. 2 , a plurality of tiny holes are formed on the upper surface of the air guide device 138, and a pressurized gas supply device and a vacuum suction device (not shown) are selectively connected to the air guide device 138. are not shown). The air guide device 138 can suspend (support in a non-contact manner) the substrate P placed on the upper surface thereof by means of the pressurized gas supplied from the pressurized gas supply device through the plurality of holes, and can The substrate P placed on the upper surface thereof is adsorbed and held by the vacuum suction force supplied from the vacuum suction device through the plurality of holes (or other holes). It is also possible to configure the air guide device 138 with a size in the Y direction slightly shorter than that of the substrate P, and the substrate moving device 136 can be disposed on both sides of the air guide device 138 in the Y direction. As a result, when the substrate moving device 136 is installed in the center of the air guide device 138 , the pressurized gas is not blown to the center of the substrate P of the X drive mechanism 140 and the substrate P is bent.

Here, the carrying-in operation of the board|substrate P by the board|substrate carrying-in apparatus 130 is demonstrated using FIG.3(a) - FIG.3(c). In the liquid crystal exposure apparatus 10 of 1st Embodiment, the carrying-in operation of the board|substrate P on the board|substrate holder 68 is a board|substrate fixation. This is performed in a state where the device 68 is located at a predetermined substrate exchange position. The board exchange position is set in the vicinity of the +X side end portion of the movable region of the X coarse motion stage 40 , for example.

When the substrate P is loaded onto the substrate stage device 20 by the substrate loading device 130, the Z position of the upper surface of the substrate holder 68 and the Z position of the upper surfaces of the two air guides 138 become substantially the same (or The substrate holder 68 side is slightly lowered), and the Z position of the substrate holder 68 is positioned. Thereby, a continuous guide surface is formed by the substrate guide surface formed by the two air guides 138 and the upper surface of the substrate holder 68 .

The substrate carrying device 130 drives, in the −X direction, the suction pad 144 that suctions and holds the central portion in the Y-axis direction near the end portion on the +X side of the substrate P. As shown in FIG. Thereby, the board|substrate P moves along the said guide surface.

Then, as shown in FIG. 3( b ), when the end portion on the +X side of the substrate P reaches a predetermined position, as shown in FIG. 3( c ), the suction pad 144 releases the suction and holding of the substrate P, and at +X driven in the direction. Furthermore, the adsorption and holding of the substrate P by the adsorption pad 144 can be released during the movement of the substrate P shown in FIG. 3( a ), so that the adsorption pad 144 is separated from the substrate P, and the The substrate P moves.

In the liquid crystal exposure apparatus 10 (refer to FIG. 1 ) constructed as described above, under the management of the main control device (not shown), the mask loader (not shown in the figure) is used to perform loading to the mask stage. The mask M on the 14 is loaded, and the substrate P on the substrate holder 68 is loaded by the substrate carrying device 130 . Thereafter, the main control device performs alignment measurement using an alignment detection system (not shown), and after the alignment measurement is completed, a plurality of exposure shot areas set on the substrate P are performed in accordance with the The exposure operation in the step-and-scan mode is performed each time. In addition, since this exposure operation is the same as the exposure operation of the step-and-scan method performed conventionally, the detailed description is abbreviate|omitted. Then, the substrate P whose exposure processing has been completed is retracted from the substrate holder 68 by the suspension support device 150 , and another substrate P to be exposed next is conveyed to the substrate holder 68 by the substrate carrying device 130 . Thereby, the exchange of the board|substrate P on the board|substrate holder 68 is performed, and exposure operation etc. are performed continuously with respect to the some board|substrate P.

Hereinafter, the replacement|exchange operation of the board|substrate P on the board|substrate holder 68 in the liquid crystal exposure apparatus 10 of 1st Embodiment is demonstrated using FIG.4(a) - FIG.5(c). In addition, let the exposed board|substrate on the board|substrate holder 68 be the board|substrate P1, and let the new board|substrate conveyed on the board|substrate holder 68 be the board|substrate P2. The following board replacement operations are performed under the management of a main control device (not shown). Furthermore, in order to simplify the drawings, in FIGS. 4( a ) to 5 ( c ), the substrate stage device 20 , the substrate loading device 130 , and the suspension support device 150 are respectively simplified (some components are not shown) and shown.

As shown in FIG. 4( a ), when the substrate stage device 20 after the exposure process reaches the substrate exchange position, the substrate holder 68 weakens the vacuum suction force, and the substrate carrier 70 releases the substrate P1 by the carrier body 74 . Adsorption hold.

Then, as shown in FIG. 4( b ), the substrate holder 68 increases the pressure and/or flow rate of the pressurized gas supplied from the pressurized gas supply device, and increases the distance between the lower surface of the substrate P1 and the substrate holder 68 , a levitation force is imparted to the lower surface of the substrate P1. Thereby, the substrate P1 is placed on the substrate holder 68 Float up. The floated substrate P1 is received by the pendant support device 150 by vacuum suction of the non-contact support device 152 of the pendant support device 150 . Thereby, the lower surface of the substrate P1 is separated from the upper surface of the substrate holder 68 .

On the other hand, in the substrate carrying device 130 , the pressurized gas is ejected from the two air guides 138 to the lower surface of the substrate P2 , and the substrate P2 is floated on the two air guides 138 . In addition, the suction pad 144 suction-holds the lower surface of the substrate P2.

Thereafter, as shown in FIG. 4( c ), the suction pad 144 is driven in the −X direction. Thereby, the board|substrate P2 moves along the guide surface formed by the upper surface of the two air guides 138 and the upper surface of the board|substrate holder 68. FIG.

As shown in FIG. 5( a ), after the substrate P2 is carried into the substrate holder 68 , the carrier body 74 sucks and holds the substrate P2 , as shown in FIG. 5( b ), for the exposure operation for the substrate P2 , The substrate stage device 20 moves from the substrate exchange position to a predetermined exposure operation start position.

When the substrate stage device 20 is separated from the substrate exchange position, as shown in FIG. 5( b ), the air guide device 138 and the suction pad 144 of the substrate carrying device 130 are driven upward. At this time, the suction pad 144 is positioned at a height (Z position) at which the upper surface of the suction pad 144 can suction and hold the lower surface of the substrate P1.

Thereafter, as shown in FIG. 5( c ), the suction pads 144 that adsorb and hold the lower surface of the substrate P1 are driven in the +X direction, whereby the substrate P1 follows the lower surface of the non-contact supporting device 152 and the two air guides. The guide surface formed by the upper surface of the device 138 moves. That is, the board|substrate carrying-in apparatus 130 can carry out the board|substrate P1. Thereby, the board carrying-in device 130 functions as a board carrying-out device, and the carrying-in operation and carrying of the board can be further performed. Therefore, it can be collectively referred to as a substrate transfer device.

Then, the board|substrate P1 is carried out to the outside of the liquid crystal exposure apparatus 10 (refer FIG. 1) by the hand member of the external conveyance robot which is not shown in figure.

As described in detail above, according to the first embodiment, the liquid crystal exposure apparatus 10 includes: the substrate holder 68 for supporting the lower surface of the substrate P1; P1 supports the upper surface of the substrate P1 ; and the X drive mechanism 43 drives the substrate holder 68 toward the substrate exchange position where the substrate P2 is carried into the substrate holder 68 . Thereby, in a state where the substrate P1 that has been exposed is made to wait at the substrate exchange position (retracted from the carrying path of the substrate P2 to be exposed next), the carrying operation of the substrate P2 is performed, and the substrate P2 is carried out to the substrate. Since the substrate P1 is unloaded from the standby position after the transfer on the stage device 20, for example, compared with the case where the carrying-in operation of the substrate P2 to the substrate stage device 20 is started after the unloading operation of the exposed substrate P1 is completed. The time taken for board exchange can be shortened.

Furthermore, in the above description, after the substrate stage device 20 reaches the substrate exchange position, the substrate holder 68 reduces the vacuum suction force and imparts a levitation force to the lower surface of the substrate P1, but it is not limited to this. The substrate holder 68 may also be used before the substrate stage device 20 reaches the substrate exchange position (for example, when the +X side end of the substrate holder 68 has reached the vicinity of the center of the non-contact support device 152 in the X-axis direction), The vacuum suction force is weakened, and a levitation force is imparted to the lower surface of the substrate P1. In this way, before the substrate stage device 20 reaches the substrate exchange position, the transfer to the substrate P1 on the non-contact support device 152 can be started, and the time spent on the substrate exchange can be further shortened. time. Furthermore, the substrate holder 68 weakens the vacuum suction force, and the timing of imparting a levitation force to the lower surface of the substrate P1 can be within the range where the substrate P1 can be properly received by the non-contact support device 152 without contacting other components such as the reference plate 100 . appropriate decision.

Further, according to the first embodiment, the substrate holder 68 imparts a levitation force to the substrate P1 so that the substrate P1 is supported by the non-contact support device 152 . Thereby, the substrate holder 68 can move the substrate P1 to a position where the non-contact support device 152 can support the substrate P1 using an existing device (pressurized gas supply device), thereby simplifying the configuration of the substrate stage device 20 .

Moreover, in this 1st Embodiment, the board|substrate holder 68 gives the levitation force to the board|substrate P1 so that the distance between the lower surface of the board|substrate P1 and the board|substrate holder 68 may be enlarged. When the lower surface of the board|substrate P1 is separated from the board|substrate holder 68, since a new board|substrate P2 can be carried in, the time taken for board|substrate exchange can be shortened further.

Moreover, in this 1st Embodiment, the board|substrate carrying apparatus 130 carries in the board|substrate P2 between the board|substrate holder 68 and the board|substrate P1 so that it may be supported by the board|substrate holder 68. Thereby, even if the board|substrate P1 is not carried out, since the board|substrate P2 can be carried in to the board|substrate holder 68, the time taken for board|substrate exchange can be shortened.

In addition, in the first embodiment, the substrate holder 68 applies force to the substrate P1 or the substrate P2 to support the substrate P1 or the substrate P2 in a levitating manner, and the substrate carrying device 130 carries the suspended and supported substrate P2 onto the substrate holder 68 . . Thereby, the board|substrate P1 and the board|substrate P2 can be exchanged without damaging.

Moreover, in this 1st Embodiment, the board|substrate carrying apparatus 130 carries out the board|substrate P1 from the non-contact support apparatus 152. As a result, there is no need to provide a separate board carry-out The structure of the liquid crystal exposure apparatus 10 can be simplified.

In addition, in the first embodiment, the liquid crystal exposure apparatus 10 includes the substrate holder 70 that holds the substrate P2 carried by the substrate carrying device 130 onto the substrate holder 68 and supported by the substrate holder 68 in a floating manner , and the substrate P2 is driven relative to the substrate holder 68 . As a result, the floating-supported substrate P2 can be positioned with high accuracy.

Moreover, in this 1st Embodiment, the non-contact support apparatus 152 supports the board|substrate P1 whose hold|maintenance by the board|substrate holder 70 is cancelled|released. Thereby, the substrate P1 can be transferred from the substrate holder 68 to the non-contact supporting device 152 .

Moreover, in this 1st Embodiment, the non-contact support apparatus 152 controls the gas between the upper surface of the board|substrate P1 and the non-contact support apparatus 152, and supports the upper surface of the board|substrate P1 non-contact. Thereby, the board|substrate P1 can be supported without damaging the exposure surface of the board|substrate P1 after exposure.

(Variation 1)

In the liquid crystal exposure apparatus 10a of the modification 1 of 1st Embodiment, the board|substrate carrying apparatus 130a is further provided with the pressurized gas supply apparatus (not shown) which supplies pressurized gas (for example, air). The other structures are the same as those of the liquid crystal exposure apparatus 10 of the first embodiment, so detailed descriptions are omitted.

Referring to FIGS. 6( a ) and 6 ( b ), the substrate exchange operation in the modification 1 will be described.

In the liquid crystal exposure apparatus 10a, when the substrate stage device 20 reaches the substrate exchange position, as shown in FIG. The lower surface of the +X side end portion of the substrate P1 on 68 is blown with the pressurized gas AIR1, thereby imparting an upward force to the lower surface of the substrate P1. That is, the board|substrate carrying-in apparatus 130a assists the conveyance of the +X side edge part of the board|substrate P1 to the non-contact support apparatus 152. Thereby, the board|substrate P1 is supported by the non-contact support apparatus 152 in order from the +X side edge part to the -X side edge part.

When the lower surface of the +X side end portion of the substrate P1 is separated from the upper surface of the substrate holder 68 , as shown in FIG. 6( b ), the substrate carrying device 130 a carries the substrate P2 into the substrate from the +X side to the −X side. on the holder 68. The substrate holder 68 is transferred from the substrate P1 to the position on the non-contact support device 152, reduces the pressure and/or flow rate of the pressurized gas, and starts gas suction without contacting the non-contact support substrate P2. Thereby, the substrate P2 can be sequentially carried onto the substrate holder 68 from the substrate P1 to the portion on the non-contact support device 152 (the portion separated from the substrate P1 and the substrate holder 68 ). The substrate holder 68 can also be transferred from the substrate P1 to the position on the non-contact support device 152 to reduce the pressure and/or flow rate of the pressurized gas, and after the entire substrate P2 is transferred to the substrate holder 68, the gas extraction can be started. suction without contacting the support substrate P2.

As described in detail above, according to Modification 1 of the first embodiment, the board carrying device 130a carries the board P2 onto the board holder 68 supported by a part of the board P1 (the end on the -X side in this Modification 1). . Thereby, even when a part of the board|substrate P1 is supported by the board|substrate holder 68, the carrying-in of the board|substrate P2 to the board|substrate holder 68 can be started, and the time taken for board exchange can be shortened further.

In addition, in this modification 1, the board|substrate carrying apparatus 130a is from a board|substrate In the holder 68 , the substrate P2 is loaded into the side supporting the one end (+X side end) of the substrate P1 toward the side supporting the other end (−X side end). Thereby, even in the state in which the other end part of the board|substrate P1 is supported, since the carrying-in of the board|substrate P2 can be started, the time taken for board|substrate exchange can be shortened further.

In addition, in this modification 1, the board carrying device 130a carries the board P2 on the board holder 68, and the board P1 is transferred to the non-contact support device 152 while carrying the board P1 to the lower surface (the first surface) of the board P1. ) endows the force. As a result, the substrate P2 can be carried into the substrate holder 68 while the substrate P1 is transferred to the non-contact support device 152, so that the time required for substrate exchange can be further shortened.

In addition, in the board|substrate carrying apparatus 130a of the said modification 1, the air guide apparatus 138 is equipped with the pressurized gas supply apparatus (not shown), and may blow the pressurized gas which applies force to the lower surface of the board|substrate P1.

Moreover, in the said modification 1, the board|substrate carrying apparatus 130a may blow the pressurized gas AIR1 to the lower surface of the board|substrate P1 before the board|substrate stage apparatus 20 arrives at the board|substrate exchange position.

(Variation 2)

The structure of the liquid crystal exposure apparatus 10b of the modification 2 of the said 1st Embodiment is shown to FIG.7(a) and FIG.7(b). The suspension support device 150 a included in the liquid crystal exposure apparatus 10 b of the modification 2 includes a plurality of (for example, four) substrate conveying devices 158 . The other structures are the same as those of the liquid crystal exposure apparatus 10 of the first embodiment, so detailed descriptions are omitted.

The board|substrate conveyance apparatus 158 is provided with the holding part 158a which hold|maintains a part of the lower surface of the board|substrate P1, and the drive member 158b which drives the holding part 158a in the Y-axis direction and Z-axis direction. The drive member 158b is mounted on the reference plate 100 . The holding part 158a is, for example, a suction pad connected to a vacuum device (not shown).

In the liquid crystal exposure apparatus 10b of Modification 2, when the substrate stage device 20 reaches the substrate exchange position, the driving member 158b drives the holding portion 158a in the −Z direction so that the Z position of the upper surface of the holding portion 158a becomes higher than that of the substrate P1. The Z position of the lower surface is positioned in such a way that it is slightly lower. At this time, the Y position of the end portion on the substrate P1 side of the holding portion 158a is adjusted so as not to touch the substrate P1.

Then, after the holding portion 158a is driven in the Y-axis direction by the driving member 158b so that the holding portion 158a can hold the lower surface of the substrate P1, the holding portion 158a is driven in the +Z direction, and the holding portion 158a is driven by the holding portion 158a. to hold a part of the substrate P1. Thereby, a part of the board|substrate P1 is hold|maintained by the suspension support apparatus 150a. Thereafter, the driving member 158b further drives the holding portion 158a in the +Z direction (substrate exchange position side) so that the other part of the substrate P1 is non-contact supported by the non-contact support device 152 . Thereby, since the board|substrate P1 is isolate|separated from the board|substrate holder 68, the board|substrate carrying apparatus 130 can carry in the board|substrate P2 to the board|substrate holder 68.

After that, the upper surface of the substrate P1 is held in a non-contact manner by the non-contact support device 152 . At this time, the holding portion 158a functions as a drop prevention portion for holding the lower surface of the substrate P1 so that the substrate P1 non-contact supported by the non-contact support device 152 does not drop.

Furthermore, the driving member 158b may not only be in the Y-axis direction and the Z-axis direction The holding portion 158a is driven upward, and the holding portion 158a is driven in the X-axis direction. Before the substrate stage apparatus 20 reaches the substrate exchange position, the driving member 158b drives the holding portion 158a in the −Z direction so that the Z position of the upper surface of the holding portion 158a becomes slightly lower than the Z position of the lower surface of the substrate P1. After positioning, the holding portion 158a is driven in the Y-axis direction, and a part of the substrate P1 is held. Thereafter, while driving the substrate holder 68 in the X-axis direction toward the substrate exchange position, the holding portion 158a holding a part of the substrate P1 may be driven in the +Z direction and the +X direction. In addition, the length of the holding portion 158a may be approximately the same as that of the substrate P1, and the substrate P1 may be driven so as to slide on the holding portion 158a without being driven in the +X direction. Thereby, when the substrate holder 68 reaches the substrate exchange position, since the substrate holder 68 is in a state without a substrate, the substrate P2 can be carried in. Thereby, the time taken for board exchange can be shortened.

As described in detail above, according to Modification 2 of the first embodiment, the overhanging support device 150a includes the holding portion 158a that holds a part of the substrate P1 and a drive that drives the holding portion 158a so that the portion of the substrate P1 is held by the overhanging support device 150a member 158b. Furthermore, the drive member 158b drives the holding part 158a for holding a part of the board|substrate P1 toward the board|substrate exchange position side so that the other part of the board|substrate P1 is supported by the suspension support apparatus 150a (non-contact support apparatus 152). Thereby, the substrate P1 can be separated from the substrate holder 68 without increasing the pressure and flow rate of the pressurized gas supplied from the pressurized gas supply device in the substrate holder 68 to raise the substrate P1. The substrate P1 is supported by the non-contact support device 152 .

In addition, the suspension support device 150a includes a substrate supported in a non-contact manner The holding part 158a on the lower surface side of the board|substrate P1 is hold|maintained so that P1 may not fall. Thereby, it can prevent that the board|substrate P1 non-contact supported by the non-contact support apparatus 152 falls, and the situation of the new board|substrate P2 being damaged, etc. can be prevented.

Furthermore, in the modification 2 of the first embodiment described above, the holding portion 158a also serves as a drop preventing portion, but the overhang support device 150a may be provided with a non-contact supporting substrate P1 which is different from the holding portion 158a so as not to drop. A drop prevention device that holds the lower surface side of the substrate P1 in a manner.

(Variation 3)

In the above-described first embodiment and Modifications 1 and 2, the suspension support device is attached to the reference plate 100 to which the projection optical system 16 is attached, but the suspension support device may be arranged separately from the reference plate 100 .

In FIG. 8, the structure of the liquid crystal exposure apparatus 10c of the modification 3 of 1st Embodiment is shown schematically. In the liquid crystal exposure apparatus 10c of the modification 3, as shown in FIG. 8, the overhang support apparatus 150b is provided with the overhang support apparatus mounting frame 151, and is arrange|positioned separately from the reference plate 100 to which the projection optical system 16 is attached. Thereby, the vibration from the suspension support device 150 b can be prevented from being transmitted to the projection optical system 16 . The other structures are the same as those of the liquid crystal exposure apparatus 10 of the first embodiment, so detailed descriptions are omitted.

"Second Embodiment"

Next, 2nd Embodiment is demonstrated using FIG.9(a) - FIG.9(c). In addition, in the 2nd Embodiment described below, the same code|symbol as the said 1st Embodiment is attached|subjected to the member with the same structure as the said 1st Embodiment and its modification, and the description is abbreviate|omitted. Furthermore, in the second embodiment, the X drive is also used. The mechanism 43 drives the substrate stage device 20 (substrate holder 68 ) toward the substrate exchange position.

Fig. 9(a) is a diagram schematically showing the configuration of a liquid crystal exposure apparatus 10d according to the second embodiment. As shown in FIG. 9( a ), in the second embodiment, the overhanging support device 150 c is arranged separately from the reference plate 100 on which the projection optical system 16 is attached. The suspension support device 150c includes a drive device 153 for moving the non-contact support device 152 up and down. The driving device 153 is mounted on the suspension support device mounting frame 151 .

Next, the board replacement operation|movement in 2nd Embodiment is demonstrated with reference to FIG.9(b) and FIG.9(c).

In the liquid crystal exposure apparatus 10d of the second embodiment, when the substrate stage device 20 holding the exposed substrate P1 is driven toward the substrate exchange position, the non-contact support device 152 by the drive device 153 starts to descend. In addition, the timing of driving the substrate stage device 20 to the substrate exchange position and the timing of starting the lowering of the non-contact support device 152 may be the same or different. The non-contact support device 152 may be lowered to the position where the substrate P1 is received from the substrate holder 68 before the +X side end of the substrate stage device 20 reaches the -X side end of the substrate exchange position.

Further, for example, when the +X side end of the substrate P1 overlaps the -X side end of the substrate exchange position or the -X side end of the non-contact support device 152 , the substrate holder 68 weakens the vacuum suction force. Thereby, as shown in FIG.9(b), the +X side edge part of the board|substrate P1 is conveyed to the non-contact support apparatus 152 which has descended, and is supported. That is, the non-contact support device 152 receives the substrate P1 from the substrate holder 68 while the substrate holder 68 is moving toward the substrate exchange position. If the +X side end of the substrate P1 is When the contact support device 152 is supported, the non-contact support device 152 starts to ascend by the drive device 153 , and on the other hand, the substrate holder 68 continues to move toward the substrate exchange position. Therefore, in the direction in which the substrate holder 68 is driven toward the substrate exchange position, the distance between the substrate holder 68 and the non-contact support device 152 changes continuously. Then, as the substrate stage device 20 moves toward the substrate exchange position, the substrate P1 is transferred to the non-contact support device 152 and supported in the order from the +X side end to the -X side end.

By the control, when the substrate stage device 20 reaches the substrate exchange position (below the suspension support device 150c), as shown in FIG. 9( c ), the substrate P1 has been retracted from the substrate stage device 20 . Thereby, the new board|substrate P2 can be carried in to the board|substrate holder 68 immediately, and the time required for board|substrate exchange can be shortened further.

As described in detail above, according to the second embodiment, the liquid crystal exposure apparatus 10 d includes: the substrate holder 68 for supporting the lower surface of the substrate P1 ; , and supports the upper surface of the substrate P1 ; and the X drive mechanism 43 drives the substrate P1 to the substrate holder 68 on the non-contact support device 152 toward the substrate exchange position where the substrate P2 is carried into the substrate holder 68 . Thereby, the substrate P1 on the substrate holder 68 can be evacuated to the non-contact support device 152, and a new substrate P2 can be loaded into the substrate holder 68 at the substrate exchange position, so it is not the same as the removal of the substrate P1 and the loading of a new one. Compared with the case of the substrate P2, the cycle time of the substrate exchange can be shortened.

In addition, in the second embodiment, the non-contact support device 152 is in the process of driving the substrate holder 68 toward the substrate exchange position by the X drive mechanism 43 , the substrate P1 is received from the substrate holder 68 . As a result, the substrate P1 can be retracted to the non-contact support device 152 before the substrate holder 68 reaches the substrate exchange position (below the suspension support device 150c ), and a new substrate can be replaced immediately after the substrate holder 68 reaches the substrate exchange position. The substrate P2 is carried into the substrate holder 68 . Therefore, the time taken for substrate exchange can be further shortened.

In addition, in the second embodiment, the non-contact support device 152 extends from one end (+X side end in this second embodiment) to the other end (−X side) of the substrate P1 located on the substrate exchange position side. end) in order to support the substrate P1. Thereby, the non-contact support device 152 can smoothly receive the substrate P1 in conjunction with the movement of the substrate holder 68 toward the substrate exchange position.

In addition, in the second embodiment, the suspension support device 150c includes a drive device 153 for driving the substrate P1 from the substrate holder 68 to the non-contact support device 152 in the direction (Z-axis direction) in which the substrate P1 is transferred. The non-contact supporting device 152 is driven so that the relative distance between the holder 68 and the non-contact supporting device 152 is shortened. Thereby, the substrate P1 can be stably transferred from the substrate holder 68 to the non-contact support device 152 .

Furthermore, in the second embodiment, the distance between the substrate holder 68 and the non-contact support device 152 changes continuously in the direction in which the substrate holder 68 is driven toward the substrate exchange position. As a result, the substrate P1 can be retracted from the substrate holder 68 as shown in FIG. 9( c ) before the substrate holder 68 reaches the substrate exchange position (below the hanging support device 150 c ). Thereby, the new board|substrate P2 can be carried in to the board|substrate holder 68 immediately, and the time required for board|substrate exchange can be shortened further.

Furthermore, in the second embodiment, the non-contact supporting device 152 is lowered by the driving device 153 so that the relative distance between the substrate holder 68 and the non-contact supporting device 152 is shortened, but it is not limited to this. For example, the substrate holder 68 can also be raised by the drive device so that the relative distance between the substrate holder 68 and the non-contact support device 152 is shortened. In addition, the non-contact support device 152 may be lowered by the driving device 153, and the substrate holder 68 may be raised by the driving device.

In addition, in the second embodiment, after the substrate stage device 20 reaches the substrate exchange position, the non-contact support device 152 may be lowered to transfer the substrate P1 from the substrate holder 68 to the non-contact support device 152 .

In addition, in the above-described second embodiment, the driving device 153 may be attached to the reference plate 100 .

In addition, after the substrate P2 is loaded into the substrate holder 68, the substrate stage device 20 may be driven in the -X direction so that the exposure start position may be driven, so that the height of the air guide device 138 may be approximately the same as that of the air guide device 138. The substrate P1 supported by the non-contact support device 152 is driven in the −Z direction by the drive device 153 . As a result, the substrate P1 supported by the non-contact supporting device 152 can be carried out without driving the substrate moving device 136 and the air guide device 138 in the +Z direction.

"Third Embodiment"

Fig. 10(a) is a diagram schematically showing the configuration of a liquid crystal exposure apparatus 10e according to the third embodiment. As shown in FIG. 10( a ), in the suspension support device 150d of the third embodiment, the Z position of the lower surface of the +X side end portion of the non-contact support device 152a becomes It is lower than the Z position of the lower surface of the end portion on the -X side. Moreover, the board|substrate stopper 154 is attached to the edge part of the +X side of the non-contact support apparatus 152a. Furthermore, in this 3rd Embodiment, the board|substrate carrying apparatus 130b is provided with the drive apparatus 145 which moves the edge part of the -X side of the air guide apparatus 138 up and down. The drive device 145 is, for example, an air cylinder.

The board|substrate exchange operation in the liquid crystal exposure apparatus 10e of 3rd Embodiment is demonstrated with reference to FIG.10(b) - FIG.11(b).

In the liquid crystal exposure apparatus 10e of the third embodiment, as shown in FIG. 10(b), when the substrate P1 that has been exposed is supported by the non-contact support device 152a, a new substrate P2 is carried in by the substrate carrying device 130b to the substrate fixation. device 68. At this time, the exposed substrate P1 supported by the non-contact support device 152 a is always moved to the +X side by the action of gravity, and contacts the substrate stopper 154 . Therefore, the substrate stopper on the -X side can be omitted.

When the new board|substrate P2 is carried into the board|substrate holder 68, as shown to Fig.11 (a), the adsorption|suction pad 144 will move to +X direction. Furthermore, the board|substrate carrying apparatus 130b raises the edge part of the -X side of the air guide 138 by the drive apparatus 145. As shown in FIG.

Then, as shown in FIG.11(b), when the board|substrate stopper 154 is removed, the board|substrate P1 is carried out to +X direction by the self-weight and gravity of the board|substrate P1. In addition, in this case, the substrate P1 may be moved while the substrate P1 is held by the adsorption pad 144, or the adsorption pad 144 may not be used.

As described in detail above, according to the third embodiment, the substrate P1 supported by the non-contact supporting device 152a is carried out from the non-contact supporting device 152a by the own weight and gravity of the substrate P1. Thereby, the self-contact supporting device 152a can be simplified Mechanism for unloading the board P1.

Furthermore, in the third embodiment, the non-contact support device 152a may be attached to the reference plate 100 .

Furthermore, when the new substrate P2 is loaded into the substrate holder 68, the drive device 145 may be driven in the -Z direction, thereby inclining the air guide device 138. As a result, the substrate P2 can be easily carried into the substrate holder 68 by gravity.

"4th Embodiment"

FIG. 12 is a diagram schematically showing the configuration of a liquid crystal exposure apparatus 10f according to the fourth embodiment. The fourth embodiment changes the shape of the non-contact support device. In the suspension support device 150e of the fourth embodiment, as shown in FIG. 12, the non-contact support device 152b has a semi-cylindrical shape curved in the Y-axis direction, and the central part in the Y-axis direction becomes the lowest (in the -Z-axis direction). most prominent). Therefore, since the board|substrate P1 supported by the non-contact support apparatus 152b always tries to approach the center of the Y-axis direction as shown by an arrow, the board|substrate stopper in the Y-axis direction can be omitted. Furthermore, in this case, a board stopper in the X-axis direction is required.

(Variation 1)

FIG. 13( a ) is a diagram schematically showing the configuration of a liquid crystal exposure apparatus 10 g according to Modification 1 of the fourth embodiment. In the liquid crystal exposure apparatus 10g of the modification 1, the suspension support apparatus 150f is provided with the guide mechanism 159 which guides the non-contact support apparatus 152c in the X-axis direction. Furthermore, the shape of the non-contact support device 152c is a part of a spherical body with a large curvature that is curved not only in the Y-axis direction but also in the X-axis direction.

The substrate exchange operation in the liquid crystal exposure apparatus 10g of this modification 1 is demonstrated using FIG.13(a) and FIG.13(b).

When the non-contact support device 152 c supports the exposed substrate P1 , a new substrate P2 is carried into the substrate holder 68 by the substrate carrying device 130 . At this time, as shown by the arrows in FIGS. 13( a ) and 13 ( b ), the substrate P1 supported by the non-contact support device 152c always tends to be close to the center portion, so the substrate stopper in the X-axis direction and the Y-axis direction can be omitted. moving device.

When the non-contact support device 152c supports the exposed substrate P1, as shown in FIG. At this time, the non-contact support device 152c is moved to the upper side of the substrate carrying device 130 by the guide mechanism 159 .

As described above in detail, according to Modification 1 of the fourth embodiment, the non-contact support device 152c carries out the substrate P1 in a state of supporting the upper surface of the substrate P1. Thereby, the mechanism for carrying out the board|substrate P1 from the non-contact support apparatus 152c can be abbreviate|omitted in the board|substrate carrying-in apparatus 130.

In addition, in the modification 1 of the said 4th Embodiment, you may use the non-contact support apparatus 152 of 1st Embodiment and 2nd Embodiment instead of the non-contact support apparatus 152c. That is, the lower surface of the non-contact support device may also be a flat surface.

Furthermore, in the above-described first to fourth embodiments and their modifications, the larger the size of the substrate P1 and the substrate P2 (for example, 500 mm or more), the greater the effect of shortening the time required for the replacement of the substrate. Remarkably.

Furthermore, the above-described first to fourth embodiments and their modifications may also be used. Appropriate combination of forms. For example, the second embodiment may be combined with the modification 2 of the first embodiment, and the suspension support device 150b of the second embodiment may be configured to include the board conveying device 158 . In this case, the drive member 158b of the substrate conveying device 158 may be mounted on the suspension support device mounting frame 151 .

In addition, for example, the first embodiment and the third embodiment may be combined, and the non-contact support device of the first embodiment may be made so that the Z position of the +X side end portion is lower than the Z position of the −Z side end portion. 152 tilt. In addition, the first embodiment may be combined with the fourth embodiment or the modification 1 of the fourth embodiment, and the shape of the non-contact support device 152 of the first embodiment may be a semi-cylindrical shape curved in the Y-axis direction. , a part of a sphere with a large curvature that is curved not only in the Y-axis direction but also in the X-axis direction may be used. In addition, the guide mechanism 159 may be attached to the reference plate 100, and the substrate P2 may be carried out in a state in which the substrate P2 is supported by the non-contact support device 152 of the first embodiment.

In addition, in the said 1st - 4th embodiment and its modification, although the liquid crystal exposure apparatus was demonstrated as an example, it is not limited to this. The 1st - 4th embodiment and its modification can also be applied to the inspection apparatus which inspects the surface of the board|substrate P.

In addition, although the liquid crystal exposure apparatus of the said 1st - 4th embodiment and its modification uses the glass substrate used for a liquid crystal display device as an exposure object, it is not limited to this. The liquid crystal exposure apparatus 10 may use a wafer etc. used for a semiconductor element etc. as an exposure object.

In addition, the above-mentioned first to fourth embodiments and their modifications The liquid crystal exposure apparatus includes one substrate stage device, but the configurations of the first to fourth embodiments and their modifications can also be applied to an exposure apparatus including a plurality of substrate stage devices.

In addition, in the above-described first to fourth embodiments and their modifications, the bracket body 74 included in the substrate bracket 70 is formed in a U-shape in plan view (see FIG. 2 ), but it is not limited to this. The bracket body 74 may be formed in a rectangular frame shape in plan view, or may be formed in a triangular frame shape in plan view, as long as the substrate can be adsorbed and held on the upper surface thereof. In addition, the bracket body 74 may include, for example, a pair of members having a rectangular cross-section that sandwich the substrate holder 68 in the X-axis direction or the Y-axis direction, or may include a rod-shaped member that is arranged in the X-axis direction. Only the vicinity of one end of the substrate P is adsorbed and held in the direction or the Y-axis direction. In addition, the substrate holder 70 may have the same structure as the substrate holder disclosed in, for example, US Pat. No. 8,699,001 or the like, or may have a suction portion for sucking an end portion of a substrate and a main body to which the suction portion is attached. composition of the department. The number of adsorption parts is not limited. In addition, the suction part may be provided so as to be relatively drivable in the X direction, the Y direction, and the Z direction with respect to the main body part.

"Component Manufacturing Method"

Next, the liquid crystal exposure apparatus 10, the liquid crystal exposure apparatus 10a - the liquid crystal exposure apparatus 10g of each said embodiment are demonstrated to the manufacturing method of the micro-element of the lithography process. In the liquid crystal exposure apparatus 10, the liquid crystal exposure apparatus 10a - the liquid crystal exposure apparatus 10g of the said embodiment, a predetermined pattern (circuit pattern, electrode pattern, etc.) is formed on the board (glass substrate), thereby obtaining as a micro device. of liquid crystal display elements.

<Pattern forming step>

First, a so-called photolithography step of forming a pattern image on a photosensitive substrate (a resist-coated glass substrate, etc.) is performed using the exposure apparatus of each of the above-described embodiments. By this photolithography step, a predetermined pattern including many electrodes and the like is formed on the photosensitive substrate. Thereafter, the exposed substrate is subjected to various steps such as a development step, an etching step, and a resist stripping step, whereby a predetermined pattern is formed on the substrate.

<Color filter forming step>

Next, a color filter in which a number of combinations of three dots corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix is formed, or formed in A color filter in which a plurality of filters of three stripes of R, G, and B are arranged in the horizontal scanning line direction.

<Cell assembly step>

Next, a liquid crystal panel (liquid crystal cell) is assembled using the substrate having a predetermined pattern obtained in the pattern forming step, the color filter obtained in the color filter forming step, and the like. For example, a liquid crystal panel (liquid crystal cell) is produced by injecting liquid crystal between the substrate having a predetermined pattern obtained in the pattern forming step and the color filter obtained in the color filter forming step.

<Module assembly steps>

Then, each component, such as a circuit which performs the display operation|movement of the assembled liquid crystal panel (liquid crystal cell), a backlight, etc. is attached, and it is completed as a liquid crystal display element.

In this case, in the pattern forming step, using the liquid crystal exposure apparatus of each of the above-described embodiments, the exposure of the plate is performed with high throughput and high precision. In other words, the productivity of the liquid crystal display element can be improved.

The above-described embodiments are suitable examples of the present invention. However, it is not limited to this, Various deformation|transformation can be implemented in the range which does not deviate from the summary of this invention.

10: Liquid crystal exposure device (object processing device)

16: Projection Optical System (Processing Section)

20: Substrate platform device (object exchange device)

68: Substrate holder (1st support part)

74: Bracket body

100: Benchmark Plate

130: Substrate loading device (object exchange device)

138: Air guide device

144: Adsorption pad

150: Suspended support device (second support part, object exchange device)

152: Non-contact support device

P1, P2: substrate

X, Y, Z: direction

Claims (45)

An object exchange device, comprising: a first support part for supporting a first surface of an object; a second support part for receiving the object from the first support part and supporting a surface of the object different from the first surface A second surface; a driving part that drives the object for transferring the object to the second support part toward an object exchange position where another object different from the object is carried on the first support part a first support portion; and a loading device for loading the other object onto the first support portion along a mounting surface on the first support portion facing the first surface; wherein the first support portion 2. The support section supports the object in order from one end side of the object on the object exchange position side to the other end side, and the carry-in device supports the object from the first support section. The other object is carried in toward the side supporting the other end portion on one side of the one end portion. The object exchange device according to claim 1, wherein the second support part is moved from the second support part to the object exchange position by the drive part in the process of driving the first support part toward the object exchange position. 1 The support part receives the object. The object exchange device according to claim 1 or 2, wherein the second support part includes: a holding part that holds a part of the object; and a driving member that is held by the part of the object by the object The holding portion is driven so as to be supported by the second support portion. The object exchange device according to claim 3, wherein the The drive member drives the holding part for holding the part of the object toward the object exchange position side so that the other part of the object is supported by the second support part. The object exchange device according to claim 1 or 2, wherein the first support portion imparts a levitation force to the first surface so that the object is supported by the second support portion. The object exchange device according to claim 5, wherein the first support portion imparts the levitation to the object such that the distance between the first surface and the first support portion increases force. The object exchange device according to claim 1, wherein the carrying-in device carries the other object in between the first support part and the object so as to be supported by the first support part . The object exchange device according to claim 1 or 7, wherein the carrying-in device carries in the other object toward the first support portion where a part of the object is supported. The object exchange device according to claim 1 or 2, wherein the carrying-in device transfers the object to the first support while carrying the other object into the first support part. 2 The method on the support portion imparts force to the first surface. The object exchange device according to claim 1 or 2, wherein the first support portion imparts a force capable of levitatingly supporting the object or the other object, and the carrying-in device transfers the levitatingly supported object. said other objects are brought into the place on the first support part. The object exchange device according to claim 1 or 2, wherein the carrying device for carrying the other object into the first support portion carries out the object from the second support portion. The object exchange device according to claim 1 or claim 2, further comprising: a holding device for holding the object carried in by the carrying device onto the first support part and suspended by the first support part The other object drives the other object relative to the first support portion. The object exchange device according to claim 12, wherein the second support portion supports the object from which the holding by the holding device is released. The object exchange device according to claim 1 or 2, wherein the object supported by the second support portion is carried out from the second support portion by the self-weight and gravity of the object . The object exchange device according to claim 1 or 2, wherein the second support portion carries out the object in a state of supporting the second surface. The object exchange device according to claim 1 or 2, wherein the second support portion controls the gas between the second surface and the second support portion, and supports the object in a non-contact manner of the second side. The object exchange device according to claim 1 or 2, wherein in the direction of driving the first support portion toward the object exchange position, The distance between the first support portion and the second support portion changes continuously. The object exchange device according to claim 16, wherein the second support portion includes a fall prevention portion that holds the first surface side so that the object supported by the non-contact support does not fall down . The object exchange device according to claim 1 or claim 2, further comprising: a driving device, so that in the direction of transferring the object from the first support part to the second support part, the Either of the first support portion and the second support portion is driven so that the relative distance between the first support portion and the second support portion is shortened. An object processing device, comprising: the object exchange device according to any one of items 1 to 19 of the scope of the application; 1. The second surface of the object or the other object on the support portion is subjected to predetermined processing. The object processing apparatus according to claim 20, wherein the drive unit drives the first support for supporting the object subjected to the predetermined processing from the processing position to the object exchange position department. The object processing apparatus according to claim 20, wherein the processing section scans and exposes the second surface of the object with an energy beam to form a predetermined pattern on the second surface. Patterning device. The object processing apparatus according to claim 22, wherein in the scanning exposure, the driving part drives the object on the first support part. The object processing apparatus according to claim 22, wherein in the scanning exposure, the drive unit drives the other object carried in by the first support unit. An object processing device, comprising: the object exchange device as described in claim 12; and a processing unit that is held on the holding device by a pair of energy beams at a processing position different from the object exchange position The second surface of the object or the other object is scanned and exposed, and a predetermined pattern is formed on the second surface; and during the scanning exposure, it is relatively driven with respect to the first support portion the holding device. The object processing apparatus according to claim 20, wherein the processing unit is an inspection apparatus for inspecting the second surface of the object. The object processing device of claim 20, wherein the object and the other objects are substrates for a display panel of a display device. The object processing apparatus of claim 27, wherein the object and the other objects are substrates having a size greater than or equal to 500 mm. A method of manufacturing a flat panel display, comprising: exposing the object by using the object processing device as described in item 27 of the patent application scope; and developing the exposed object. A component manufacturing method, comprising: exposing the object using the object processing apparatus described in claim 27; and developing the exposed object. A method for exchanging objects, comprising: receiving an object whose first surface is supported by a first support part, and supporting a second surface of the object different from the first surface by the second support part; Different other objects are carried into the object exchange position on the first support part, and the first support part for transferring the object to the second support part is driven; The other object is carried on the first support part along the mounting surface on the first support part facing the first surface, wherein the second support part is exchanged with the object from the self-positioning The object is supported in order from one end side to the other end side of the object on the position side, and the carrying device supports the other end portion of the first support portion from a side that supports the one end portion of the object. The other object is carried into one side of one end. The object exchange method according to claim 31, wherein when the object is supported, the first support portion is received from the first support portion in the process of driving the first support portion toward the object exchange position. object. The object exchange method according to claim 31 or 32, further comprising: driving the holding part so that a part of the object held on the holding part is supported by the second support part. The object exchange method according to claim 33, wherein when the holding portion is driven, the object is driven toward the object exchange position side so that the other part of the object is supported by the second support portion. the holding part. The object exchange method according to claim 31 or claim 32, further comprising: replacing the first surface with the object on the first support portion in such a manner that the object on the first support portion is supported by the second support portion Gives suspension. The object exchange method according to claim 35, wherein when the levitation force is imparted, the object is imparted with the object so that the distance between the first surface and the first support portion increases. the suspension force. The object exchange method according to claim 31, wherein when the other object is carried in, the other object is carried into the first support part and the first support part so as to be supported by the first support part between the objects. The object exchange method according to claim 31 or 37, wherein, when the other object is carried in, the other object is carried in toward the first support portion where a part of the object is supported. The object exchange method according to claim 31, wherein when the other object is carried in, the object is transferred to the first support while the other object is carried on the first support portion. 2 The method on the support portion imparts force to the first surface. The method for exchanging objects according to claim 31, further comprising: holding, by means of a holding device, the object carried in by the carrying device onto the first support portion and suspended by the first support portion. other objects, and with respect to the The first support portion relatively drives the other object. The object exchange method according to claim 31 or 32, wherein when the object is supported, gas between the second surface and the second support portion is controlled, and the object is supported in a non-contact manner. the second side of the object. A method for handling objects, comprising: the method for exchanging objects according to any one of items 31 to 40 of the scope of application; The second surface of the object above or the other object is subjected to predetermined processing. The object processing method according to claim 42, wherein when the first support portion is driven, the object is driven from the processing position to the object exchange position to support the object subjected to the predetermined processing of the first support portion. The object processing method according to claim 42, wherein when the predetermined processing is performed, the second surface of the object is scanned and exposed with an energy beam, and the second surface is formed on the second surface. Specifies the pattern. An object processing method, comprising: the object exchange method as described in claim 40; and at a processing position different from the object exchange position, using an energy beam to pair the object held on the holding device The second surface of the object or the other object is subjected to scanning exposure to form a predetermined pattern on the second surface; and when the other object is relatively driven, in the scanning exposure, relative to the second surface 1 to drive the other objects relatively.

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