TWI708991B - Object stage apparatus, exposure apparatus, flat-panel display manufacturing method, device manufacturing method, and holding method - Google Patents

Abstract

To support a substrate so that the substrate is highly flat, provided is a holding device that holds an object, the holding device including: an object holding member that holds the object; a supporting member that supports the object holding member; and a supporting device that supports the object holding member and the supporting member, wherein the object holding member is supported by the supporting member through a plurality of first supported parts of the object holding member, and the supporting member is supported by the supporting device through a second supported part of the supporting member, and the first supported part is located at a lower position than the second supported part.

Description

Object stage device, exposure device, flat panel display manufacturing method, element manufacturing method, and holding method

The present invention relates to a holding device, an exposure device, a manufacturing method of a flat panel display, a device manufacturing method, and a holding method.

In the lithography step of manufacturing electronic components such as liquid crystal display devices and semiconductor devices, energy beams are used to transfer the pattern formed on the mask (or mask) to the substrate (substrate made of glass or plastic, etc., semiconductor wafer) Etc.) on the exposure device.

Among such exposure devices, there is known a substrate holding device that vacuum sucks and holds a substrate using a substrate holder of the substrate stage device (for example, refer to Patent Document 1).

The substrate holding device is required to hold the substrate with high flatness.

[Prior Technical Literature] [Patent Literature]

[Patent Document 1] Specification of U.S. Patent Application Publication No. 2010/0266961

According to the first aspect, an object carrier device is provided, which is for holding objects and has Prepared by: an object holder, which holds the above-mentioned object; a stage body, which supports the above-mentioned object holder; and a self-weight supporting device, which supports the above-mentioned object holder and the above-mentioned stage body; the above-mentioned object holder passes through the object holder A plurality of support portions are supported by the stage body, the stage body is supported by the self-weight support device through the support surface of the stage body, and the support portion is provided at a position lower than the support surface.

According to a second aspect, there is provided an exposure apparatus including: the object stage device described above; and a pattern forming device that uses an energy beam to form a predetermined pattern on an object held by the object stage device.

According to a third aspect, a method for manufacturing a flat panel display is provided, which includes the following steps: exposing the object using the exposure device; and developing the object after the exposure.

According to a fourth aspect, a device manufacturing method is provided, which includes the following steps: exposing the object using the exposure device; and developing the object after the exposure.

According to a fifth aspect, there is provided a holding method, which includes the steps of: holding an object by an object holder; and supporting the stage body supporting the object holder by its own weight support device; and performing the above-mentioned supporting step Wherein, the stage body supports the object holder through a plurality of support portions of the object holder, and the self-weight support device supports the stage body through the support surface of the stage body provided at a position higher than the support portion .

In addition, the structure of the following embodiments may be appropriately modified, and at least a part may be replaced with another structure. Furthermore, the configuration requirements that are not particularly limited to the arrangement are not limited to the arrangement disclosed in the embodiment, and may be arranged at a position capable of achieving its function.

10: Exposure device

40: Voice coil motor

62: Leveling the sensor

64: target board

20, 20C, 420B~420E: substrate stage device

22, 22A~22C, 422, 422A~422E: Micro-motion stage

32, 32A~32D, 432, 432A, 432D: substrate holder

34, 34A~34D, 234E, 234F: stage body

42, 42A, 242, 242A, 242B: weight elimination device

243: Weight Elimination Mechanism

431, 431B~431E: Suction cup

438B: Plug part

439, 439C~439E: jack part

JB1: Ball joint

SC1: Support

Fig. 1 is a diagram schematically showing the configuration of the exposure apparatus of the first embodiment.

FIG. 2 is a diagram showing a substrate stage device included in the exposure device (part of which is omitted) in FIG. 1.

Fig. 3(A) is a diagram showing an example of a conventional micro-motion stage and a weight reduction device, and Fig. 3(B) is a diagram showing the processing of the conventional substrate holder and the flatness of the upper surface of the processed substrate holder Fig. 3(C) is a diagram obtained by mounting the substrate holder of Fig. 3(B) on the main body of the stage. Fig. 3(D) shows the processing and alignment of the conventional substrate holder A diagram of another example of the inspection of the flatness of the upper surface of the processed substrate holder. FIG. 3(E) is a diagram obtained by mounting the substrate holder of FIG. 3(D) on the stage body.

Fig. 4(A) is a bottom view and a side view showing an example of the substrate holder after the rigidity is increased, and Fig. 4(B) is a view obtained by mounting the substrate holder of Fig. 4(A) on the stage body.

Fig. 5(A) is a bottom view of the substrate holder of the first embodiment, Fig. 5(B) is a cross-sectional view of AA in Fig. 5(A), and Fig. 5(C) is a top view of the stage body of the first embodiment , Figure 5(D) is the BB cross-sectional view of Figure 5(C).

Figure 6(A) is an exploded view of the micro-motion stage and the weight elimination device, and Figure 6(B) is an assembly diagram of the micro-motion stage and the weight elimination device.

Fig. 7(A) is a cross-sectional view of the substrate holder of Modification 1 of the first embodiment, Fig. 7(B) is a cross-sectional view of the stage body of Modification 1 of the first embodiment, and Fig. 7(C) is A diagram showing the schematic structure of the weight elimination device. FIG. 7(D) is a diagram showing the assembly diagram of the micro-motion stage of the first embodiment of the modification 1 and FIG. 7(E) is the first embodiment of the modification 1 A diagram of another example of the substrate holder.

8(A) and 8(B) are the bottom view of the substrate holder of Modification 2 of the first embodiment and the AA cross-sectional view of FIG. 8(A), and FIGS. 8(C) and 8(D) These are a plan view of the stage main body of Modification 2 of the first embodiment and a cross-sectional view of BB in FIG. 8(C), respectively.

Fig. 9 is an assembly diagram of the micro-motion stage of Modification 2 of the first embodiment.

Fig. 10(A) is a cross-sectional view of the substrate holder of Modification 3 of the first embodiment, and Fig. 10(B) is A cross-sectional view of the main body of the stage of Modification 3.

Fig. 11 is a diagram showing a schematic configuration of a substrate stage device of Modification 3 of the first embodiment.

12(A) is a cross-sectional view of the substrate holder of Modification 4 of the first embodiment, and FIG. 12(B) is a cross-sectional view of the stage main body of Modification 4.

Figure 13 is a diagram showing the relationship between the position of the support point of the substrate holder and the position of the center of gravity of the substrate holder.

Fig. 14 is a diagram showing a schematic configuration of the substrate stage device of the second embodiment.

Fig. 15(A) is a plan view of the micro-movement stage of the second embodiment, and Fig. 15(B) is a cross-sectional view of the micro-movement stage.

Figure 16 is an exploded view of the micro-motion stage.

Fig. 17(A) is a top view of the substrate holder, and Fig. 17(B) is a bottom view of the substrate holder.

Figure 18 (A) is a plan view of the weight elimination device, and Figure 18 (B) and Figure 18 (C) are partial cross-sectional views of the weight elimination device.

Fig. 19 is a diagram showing the relationship between the weight elimination device and the X coarse motion stage.

Fig. 20 is a diagram showing a schematic configuration of a substrate stage device according to Modification 1 of the second embodiment.

Fig. 21 is an exploded view of the micro-motion stage of Modification 1 of the second embodiment.

Fig. 22(A) is a plan view of the weight reduction device of Modification 2 of the second embodiment, Fig. 22(B) is a side view of the weight reduction device, and Fig. 22(C) is a substrate of Modification 3 of the second embodiment Bottom view of the holder.

FIG. 23(A) is an assembly diagram of the micro-motion stage, and FIG. 23(B) is a diagram obtained by modeling the weight reduction device of Modification 2 of the second embodiment.

Fig. 24 is a diagram showing a schematic configuration of a substrate stage device of Modification 3 of the second embodiment.

Fig. 25 is a side view in the Y-axis direction of the substrate stage device of Modification 3 of the second embodiment.

Fig. 26 is a plan view of a substrate stage device of Modification 3 of the second embodiment.

Fig. 27 is a diagram showing a Y step guide, a base frame, and a weight reduction device of Modification 3 of the second embodiment.

Fig. 28 is a plan view of a substrate stage device of Modification 4 of the second embodiment.

Fig. 29 is a side view of a substrate stage device of Modification 4 of the second embodiment.

Fig. 30 is a diagram showing a substrate stage device according to Modification 5 of the second embodiment.

Fig. 31 is a diagram showing a schematic configuration of a substrate stage device according to Modification 6 of the second embodiment.

Fig. 32(A) is a plan view of the micro-motion stage of the third embodiment, Fig. 32(B) is a cross-sectional view of the micro-motion stage, and Fig. 32(C) is an exploded view of the micro-motion stage.

Fig. 33(A) and Fig. 33(B) are respectively a plan view and a bottom view of the substrate holder of the third embodiment.

Fig. 34(A) is an enlarged exploded view of the sucker part, and Fig. 34(B) is an assembly view of the sucker part.

Figure 35 (A) ~ Figure 35 (C) are diagrams showing the method of assembling the micro-movement stage (Part 1).

Figure 36 (A) ~ Figure 36 (C) are diagrams showing the method of assembling the micro-motion stage (Part 2).

Figure 37 (A) ~ Figure 37 (C) are diagrams showing how to replace the suction cup.

Fig. 38(A) is a plan view showing the structure of the micro-movement stage of Modification 1 of the third embodiment, and Fig. 38(B) is a partial cross-sectional view of the micro-movement stage.

Fig. 39 is a diagram showing a schematic configuration of a substrate stage device according to Modification 2 of the third embodiment.

Fig. 40(A) is a diagram showing the structure of the suction cup part of Modification 3 of the third embodiment, and Fig. 40(B) is a plan view of the receptacle part of Modification 3 of the third embodiment.

Fig. 41 is a diagram showing a schematic configuration of a substrate stage device according to Modification 4 of the third embodiment.

Fig. 42 is a plan view of a substrate holder of Modification 4 of the third embodiment.

FIG. 43(A) is an exploded view of the suction cup part of Modification 4 of the third embodiment, and FIG. 43(B) is an assembly view of the suction cup part of Modification 4. FIG.

Figure 44 (A) and Figure 44 (B) show the case where the gap between the clamp plugs is wide Illustrative diagrams, Fig. 44(C) and Fig. 44(D) are diagrams illustrating the case where the interval between the fastening plugs is narrow.

FIG. 45 is a diagram showing a schematic configuration of a substrate stage device according to Modification 5 of the third embodiment.

Fig. 46(A) is an exploded view of the suction cup part of Modification 5 of the third embodiment, Fig. 46(B) is a plan view of the receptacle part of Modification 5 of the third embodiment, and Fig. 46(C) is the third A bottom view of the plug portion of the modification 5 of the embodiment, and FIG. 46(D) is an assembly view of the sucker portion of the modification 5 of the third embodiment.

Fig. 47 is a diagram for explaining another example of the replacement method of the suction cup part.

≪First Embodiment≫

First, the first embodiment of the present invention will be described based on FIGS. 1 to 6(B).

Fig. 1 schematically shows the structure of the exposure apparatus 10 of the first embodiment.

The exposure device 10 is a step and scan projection method using a rectangular (square) glass substrate P (hereinafter referred to as substrate P) used in, for example, a liquid crystal display device (flat panel display) as the exposure target Exposure device, the so-called scanner.

As shown in FIG. 1, the exposure apparatus 10 has an illumination system 12, a mask stage 14 for holding a mask M formed with patterns such as circuit patterns, a projection optical system 16, and a holding surface (the surface facing the +Z side in FIG. 1) The substrate stage device 20 of the substrate P coated with a resist (sensor), and its control system, etc. Hereinafter, as shown in FIG. 1, the X-axis, Y-axis, and Z-axis orthogonal to each other are set for the exposure device 10, and the mask M and the substrate P are set to scan relative to the projection optical system 16 in the X-axis direction during exposure. , And assume that the X axis and Y axis are set in the horizontal plane for description. At this time, the Z axis direction corresponds to the vertical direction and the gravity direction. In addition, the rotation (tilt) directions around the X axis, the Y axis, and the Z axis will be described as the θx, θy, and θz directions, respectively. In addition, the positions in the X-axis, Y-axis, and Z-axis directions will be described as X position, Y position, and Z position, respectively.

The illumination system 12 is configured in the same manner as the illumination system disclosed in the specification of U.S. Patent No. 5,729,331, etc., and irradiates the mask M with illumination light (illumination light) IL for exposure. As the illumination light IL, for example, light containing at least one wavelength of I-ray (wavelength 365nm), G-ray (wavelength 436nm), and H-ray (wavelength 405nm) is used. In addition, the light source used in the illumination system 12 and the wavelength of the illumination light IL irradiated from the light source are not particularly limited. For example, ArF excimer laser light (wavelength 193nm), KrF excimer laser light (wavelength 248nm) Equal ultraviolet light or vacuum ultraviolet light such as F2 laser light (wavelength 157nm).

The mask stage 14 holds a light-transmitting mask M. The mask stage 14 is driven with a predetermined stroke at least in the scanning direction (X-axis direction) by, for example, a mask stage driving system (not shown) including a linear motor. In addition, in order to adjust the relative position of the mask stage 14 with at least any one of the illumination system 12, the substrate stage device 20, and the projection optical system 16, it is driven by a micro motion that moves the X position or the Y position with a stroke The system is driven. The position information of the mask stage 14 can be obtained, for example, by a mask stage position measurement system (not shown) including a linear encoder system or an interferometer system.

The projection optical system 16 is arranged under the mask stage 14. The projection optical system 16 is, for example, a so-called multi-lens projection optical system having the same configuration as the projection optical system disclosed in the specification of U.S. Patent No. 6,552,775. Multiple optical systems. Furthermore, the projection optical system 16 may not be a multi-lens type. It can also be composed of a projection optical system as used in a semiconductor exposure device.

In the exposure device 10, if the mask M located in the predetermined illumination area caused by the illumination light IL from the illumination system 12 is illuminated, the projected image of the pattern of the mask M in the illumination area (part of the pattern The image is formed in the exposure area formed by the projection optical system 16. Furthermore, the mask M is relatively moved in the scanning direction with respect to the illumination area (illumination light IL), and the substrate P is relatively moved in the scanning direction with respect to the exposure area, and scanning exposure is performed on the substrate P, thereby forming the mask M The pattern (the entire pattern corresponding to the scanning range of the mask M) is transferred.

(Device body 18)

The device body 18 supports the mask stage 14 and the projection optical system 16, and is installed on the floor F of the clean room through the anti-vibration device 19. The device body 18 has the same structure as the device body disclosed in the specification of U.S. Patent Application Publication No. 2008/0030702, and has an upper seat portion 18a, a pair of middle seat portions 18b, and a lower seat portion 18c. Since the upper mount portion 18a is a member that supports the projection optical system 16, hereinafter, in this specification, the upper mount portion 18a will be referred to as an "optical platen 18a" for description. Here, in the scanning exposure operation using the exposure apparatus 10 of this embodiment, the substrate P is positionally controlled with respect to the illumination light IL irradiated by the projection optical system 16, so the optical platen 18a supporting the projection optical system 16 is It functions as a reference member when controlling the position of the substrate P.

(Substrate stage device 20)

The substrate stage device 20 is a device for controlling the position of the substrate P with respect to the projection optical system 16 (illumination light IL) with high precision, and moves the substrate P along a horizontal plane (X-axis direction and Y-axis direction) with a predetermined long stroke It is driven, and the micro-drive is performed in the directions of 6 degrees of freedom (X-axis, Y-axis, Z-axis, θx, θy, and θz directions). The structure of the substrate stage device used in the exposure apparatus 10 is not particularly limited. In the first embodiment, a bracket-containing type as disclosed in the specification of US Patent Application Publication No. 2012/0057140 is used as an example. A two-dimensional coarse motion stage (gantry type), and a so-called coarse motion stage device 20 of a fine motion stage that is micro-driven with respect to the two-dimensional coarse motion stage.

The substrate stage device 20 includes a fine movement stage 22, a Y coarse movement stage 24, an X coarse movement stage 26, a self-weight support device 28, a pair of base frames 30 (one of which is not shown in FIG. 1), for A substrate drive system for driving each element constituting the substrate stage device 20, a measurement system for measuring the position information of each element described above, and the like.

FIG. 2 is a diagram showing a substrate stage device 20 included in the exposure apparatus 10 of FIG. 1. As shown in FIG. 2, the micro-motion stage 22 includes a substrate holder 32 and a stage body 34. The substrate P is placed on the substrate and held 器32 upper surface. The dimensions in the X-axis and Y-axis directions of the upper surface of the substrate holder 32 are set to the same extent as the substrate P (in fact, slightly shorter). The substrate P is vacuum sucked and held by the substrate holder 32 in a state of being placed on the upper surface of the substrate holder 32, and substantially the entire surface (the entire surface) is flattened along the upper surface of the substrate holder 32.

The stage body 34 supports the substrate holder 32. A part of the following elements of the voice coil motor 40 (for example, a rotor) is mounted on the stage main body 34. Furthermore, the detailed structure of the substrate holder 32 and the stage main body 34 is described below.

Returning to FIG. 1, the Y coarse motion stage 24 is arranged under the fine motion stage 22 (-Z side) and is on a pair of base frames 30. As shown in FIG. 2, the Y coarse motion stage 24 has a pair of X beams 36. The X beam 36 is composed of a rectangular member with a YZ cross-section extending in the X-axis direction. The pair of X beams 36 are arranged in parallel at a predetermined interval in the Y-axis direction.

The X coarse motion stage 26 is supported by the Y coarse motion stage 24 from below (-Z side), and is arranged below the fine motion stage 22 (between the fine motion stage 22 and the Y coarse motion stage 24). The X coarse motion stage 26 is a rectangular plate-shaped member in the top view, and is loaded relative to the Y coarse motion through a plurality of mechanical linear guide devices 38 provided on a pair of X beams 36 of the Y coarse motion stage 24 The stage 24 is relatively movable in the X-axis direction. The X coarse motion stage 26 moves integrally with the Y coarse motion stage 24 in the Y-axis direction.

The substrate drive system includes: a first drive system for moving the fine motion stage 22 relative to the X coarse motion stage 26 in 6 degrees of freedom directions (X axis, Y axis, Z axis, θx, θy, and θz) Direction) for small driving; the second driving system 50, which is used to drive the Y coarse motion stage 24 on the base frame 30 along the Y-axis direction with a long stroke; and the third driving system 60, which is used The X coarse motion stage 26 is driven on the Y coarse motion stage 24 along the X axis direction for a long stroke. The types of actuators constituting the second drive system 50 and the third drive system 60 are not particularly limited, and as an example, a linear motor, a ball screw drive device, or the like can be used.

The type of actuators constituting the first drive system is not particularly limited, for example, as shown in the figure In Fig. 2, a plurality of voice coil motors 40 are shown as linear motors that generate thrust in each of the X-axis, Y-axis, and Z-axis directions. The stator of each voice coil motor 40 is mounted on the X coarse motion stage 26, and the rotor is mounted on the stage body 34 of the fine motion stage 22. For example, a part of the plurality of voice coil motors 40 imparts a driving force to the stage main body 34 to move the substrate holder 32 and the stage main body 34 relative to the weight reduction device 42. In addition, a part of the plurality of voice coil motors 40 applies a driving force to the stage main body 34 to move the substrate holder 32, the stage main body 34, and the weight elimination device 42 relative to the X coarse motion stage 26.

Each voice coil motor 40 is attached to the X coarse motion stage 26 and the fine motion stage 22 at the approximate center of gravity position of the fine motion stage 22 in the Z-axis direction so as not to generate torque on the fine motion stage 22. For example, the rotor of each voice coil motor 40 is mounted on the stage main body 34 at a position higher than the support portion SC1 of the substrate holder 32 described below.

The fine motion stage 22 is given a thrust in the direction of 6 degrees of freedom with respect to the X coarse motion stage 26 through each voice coil motor 40. The detailed configuration of the first to third drive systems is disclosed in the specification of U.S. Patent Application Publication No. 2010/0018950 and the like as an example, so the description is omitted.

The self-weight support device 28 is provided with a weight elimination device 42 which supports the own weight of the micro-movement stage 22 from below, and a Y step guide 44 which supports the weight elimination device 42 from below.

The weight elimination device 42 (also called the center column, etc.) is in the shape of a cone or cylinder, inserted in the opening formed in the X coarse motion stage 26, and at the height of the center of gravity, through a plurality of connecting structural members 46 ( It is also called a flexure device and is mechanically connected to the X coarse motion stage 26. The X coarse motion stage 26 and the weight elimination device 42 are connected by a plurality of connecting structures 46 in a vibrating (physically) separated state in the Z-axis direction, the θx direction, and the θy direction. By being pulled by the X coarse motion stage 26, the weight elimination device 42 relatively moves in the X axis direction integrally with the X coarse motion stage 26 on the Y step guide 44.

The weight elimination device 42 supports the own weight of the micro-motion stage 22 from below through a pseudo spherical bearing device called a leveling device 48. More specifically, the weight elimination device 42 exerts an upward force on the stage main body 34 to support the micro-movement stage 22. The weight elimination device 42 has elastically supported micro-motion The stage 22 supports the micro-movement stage 22 so as to be elastically deformable. Thereby, the relative movement of the micro-movement stage 22 with respect to the weight elimination device 42 in the X-axis, Y-axis, and θz directions, and the swing with respect to the horizontal plane (relative movement in the θx and θy directions) are allowed. The structure and function of the weight elimination device 42 and the leveling device 48 are disclosed in the specification of U.S. Patent Application Publication No. 2010/0018950 and the like as an example, so the description is omitted.

The Y step guide 44 is composed of a member extending parallel to the X axis, and is arranged between a pair of X beams 36 of the Y coarse motion stage 24 in the Y axis direction. The upper surface of the Y step guide 44 is set to be parallel to the XY plane (horizontal plane), and the weight reduction device 42 is supported on the Y step guide 44 through the air bearing 51 without contacting the Y step guide 44. The Y step guide 44 functions as a moving reference plane when the weight removing device 42 (that is, the fine movement stage 22 and the substrate P) moves in the X-axis direction (scanning direction). The Y step guide 44 can move in the Y-axis direction with respect to the lower frame portion 18c, and relative movement in the X-axis direction is restricted.

The Y step guide 44 is mechanically connected to the Y coarse motion stage 24 (a pair of X beams 36) through a plurality of connecting structures 54 at the height position of the center of gravity. The connecting structure 54 is a so-called flexure device which is the same as the above connecting structure 46. The Y coarse motion stage 24 and the Y step guide 44 are arranged in 5 directions of the 6 degrees of freedom except the Y axis direction. The state of vibration (physical) separation in the direction of the degree of freedom is connected. The Y coarse motion stage 24 pulls the Y step guide 44 of the supporting weight elimination device 42 through the connecting structure 54 to thereby move it in the Y-axis direction. Since the X coarse motion stage 26 is supported by the Y coarse motion stage 24, the Y coarse motion stage 24 moves in the Y axis direction along with the movement of the Y coarse motion stage 24. The weight elimination device 42 moves in the Y axis direction through the connecting structure 46 while being supported by the Y step guide 44 in accordance with the movement of the X coarse motion stage 26 in the Y axis direction. Therefore, the Y coarse motion stage 24 has the Y step guide 44, the X coarse motion stage 26 supported by the Y coarse motion stage 24, and the Y step guide 44 supported by the Y step guide 44 and are connected to each other through the connecting structure 46 The weight elimination device 42 of the X coarse motion stage 26 moves in the Y axis direction.

A pair of base frames 30 are respectively composed of members extending in the Y-axis direction, and are mutually flat It is arranged on the floor F in a row. The base frame 30 is physically separated from the device body 18 (or vibratingly), and is installed on the floor F.

The substrate measurement system includes: a fine movement stage measuring system 76, which includes an upstream scale 72 of the Y coarse movement stage 24, and a first head 74 of the fine movement stage 22; and a coarse movement stage measuring system 82 , Which includes the downstream scale 78 of the optical platen 18a and the second head 80 of the Y coarse motion stage 24. The fine movement stage measuring system 76 measures the position of the fine movement stage 22 in the X-axis direction, the Y-axis direction, and the θz direction relative to the Y coarse movement stage 24. The coarse motion stage measurement system 82 measures the position of the Y coarse motion stage 24 with respect to the optical platen 18a, that is, the reference member in the X-axis direction, the Y-axis direction, and the θz direction when the position control of the substrate P is performed. The main control device, not shown, is based on the measurement results of each of the fine movement stage measuring system 76 and the coarse movement stage measuring system 82, and measures the X axis direction and the Y axis direction of the fine movement stage 22 relative to the optical platen 18a , The position in the θz direction. The measurement method will be described below.

First, the micro-motion stage measuring system 76 will be described. The upstream scale 72 is fixed to the upper surface of the vernier base 84. The vernier base 84 is fixed to the X beam 36 of the Y coarse motion stage 24 through an arm member 86 formed in an L shape when viewed from the X axis direction. Therefore, the vernier base 84 (and the upstream scale 72) can move in the Y-axis direction with a predetermined long stroke integrally with the Y coarse motion stage 24.

The vernier base 84 is a member extending along the X-axis direction, and its length in the X-axis direction is set to be about twice the length of the substrate holder 32 (ie, substrate P) in the X-axis direction (with the Y step guide 44 The same degree). The vernier base 84 is preferably formed of a material that is not easily deformed by heat, such as ceramics. The same applies to the other vernier base 92 and head bases 88 and 96 described below.

The upstream scale 72 is a plate-shaped (belt-shaped) member extending in the X-axis direction. On its upper surface (the surface facing the +Z side (upper side)), two axial directions orthogonal to each other (in this embodiment) are formed X-axis and Y-axis directions) are reflective two-dimensional diffraction gratings (so-called gratings) with periodic directions.

At the center of the side surface of the +Y side and -Y side of the substrate holder 32, and the vernier base 84 Correspondingly, the head base 88 is fixed through the arm member 90, respectively. The first head 74 is fixed to the lower surface of the head base 88.

In the micro-motion stage measuring system 76 of the first embodiment, the first head 74 includes an X head arranged on the -Y side in the Y axis direction, and a Y head arranged on the +Y side in the Y axis direction. Two X heads and Y heads are arranged spaced apart in the X-axis direction. The X head and Y head pair correspond to the upstream scale 72 irradiating the measuring beam, and receive light from the upstream scale 72 (here, diffracted light). The light from the upstream scale 72 is supplied to a detector not shown, and the output of the detector is supplied to the main control device. Based on the output of the detector, the main control device obtains the relative movement amount of the X head and Y head with respect to the upstream scale 72. Furthermore, the term "head" in this specification refers to the extent to which the diffraction grating emits the measuring beam and the light from the diffraction grating enters. The head shown in each figure may not have a light source and Detector.

In this way, in the micro-motion stage measurement system 76 of the first embodiment, a total of 4 (2 on the +Y side and -Y side of the substrate P) X heads and the corresponding upstream scale 72 are composed of 4 X linear encoder systems, and a total of four (2 on the +Y side and -Y side of the substrate P) Y heads and the corresponding upstream scale 72 constitute four Y linear encoder systems. The main control device appropriately uses the outputs of the above 4 X linear encoder systems and 4 Y linear encoder systems to obtain the X axis direction and Y axis of the micro-movement stage 22 (substrate P) relative to the Y coarse-movement stage 24 Direction and position information in the θz direction.

The coarse motion stage measurement system 82 has two downstream scales 78 spaced along the X-axis direction on each of the +Y side and the -Y side of the projection optical system 16. The downstream scale 78 is fixed to the lower surface of the optical platen 18a through the vernier base 92. The vernier base 92 is a plate-shaped member extending in the Y-axis direction, and its length in the Y-axis direction is set to be the same as the distance that the micro-movement stage 22 (ie, the substrate P) can move in the Y-axis direction (actually Slightly longer).

The downstream scale 78 is a plate-shaped (belt-shaped) member extending in the Y-axis direction, and its lower surface (the surface facing the -Z side (lower side)) and the upper surface of the upstream scale 72 are formed to mutually The two orthogonal axis directions (the X-axis and Y-axis directions in this embodiment) are a reflective two-dimensional diffraction grating (so-called grating) in the periodic direction. Furthermore, the grating pitch of the diffraction grating of the downstream scale 78 may be the same as or different from the grating pitch of the diffraction grating of the upstream scale 72.

Each of the vernier bases 84 included in the Y coarse motion stage 24 is fixed with a head base 96 through an arm member 94 formed in an L shape when viewed from the X-axis direction. The second head 80 is fixed to the upper surface of the head base 96. Therefore, the head base 96 can move in the Y-axis direction integrally with the Y coarse motion stage 24.

In the coarse motion stage measuring system 82 of the first embodiment, the second head 80 includes an X head arranged on the -X side in the X-axis direction and a Y head arranged on the +X side. Two X heads and Y heads are arranged spaced apart in the Y-axis direction. The X head and Y head pair irradiate the measurement beam to the downstream scale 78 and receive light (here, diffracted light) from the downstream scale 78. The light from the downstream scale 78 is supplied to a detector not shown, and the output of the detector is supplied to a main control device not shown. The main control device obtains the relative movement amount of the X head and Y head with respect to the downstream scale 78 based on the output of the detector.

In this way, in the coarse motion stage measurement system 82 of the first embodiment, a total of four X heads and a corresponding downstream scale 78 constitute four X linear encoder systems, and a total of four Y The head and the corresponding downstream scale 78 constitute 4 Y linear encoder systems. The main control device appropriately uses the outputs of the above 4 X linear encoder systems and 4 Y linear encoder systems to obtain the X axis direction, Y axis direction, and θz of the Y coarse motion stage 24 relative to the optical platen 18a Location information of the direction.

The main control device is based on the measurement result of the micro-motion stage measurement system 76 (the position of the micro-motion stage 22 relative to the Y coarse-motion stage 24) and the measurement result of the coarse-motion stage measurement system 82 (the relative position of the coarse-motion stage 24 The position of the optical platen 18a), the position information of the micro-movement stage 22 relative to the optical platen 18a in the X-axis direction, Y-axis direction, and the θz direction is obtained.

In addition, the substrate measurement system is equipped to measure the position and tilt of the micro-movement stage 22 in the Z-axis direction. Z tilt measurement system for tilt (rotation in θx and θy directions). The Z tilt measurement system includes a target plate 64 and a leveling sensor 62.

The target plate 64 is installed on the upper surface of the arm member 68 of the weight elimination device 42, and is installed on the lower surface of the stage body 34 of the micro-movement stage 22 (installed at least 3 positions that are not on the same straight line). A) The leveling sensor 62 is set correspondingly. The leveling sensor 62 is a light-reflective sensor. The leveling sensor 62 measures the position of the micro-movement stage 22 in the Z-axis direction and the amount of tilt (the amount of rotation in the θx and θy directions).

(Substrate holder 32 and stage body 34)

Before describing the substrate holder 32 and the stage main body 34 of the first embodiment, the conventional substrate holder and the stage main body will be described. FIG. 3(A) is a diagram showing an example of a conventional micro-motion stage 122 and a weight elimination device 142. In addition, FIG. 3(B) is a diagram showing the processing of the conventional substrate holder 132 and the inspection of the flatness of the upper surface of the processed substrate holder 132. FIG. 3(C) is a diagram of mounting the substrate holder 132 of FIG. 3(B) on the stage body 134. FIG. 3(D) is a diagram showing another example of the processing of the conventional substrate holder 132 and the inspection of the flatness of the upper surface of the processed substrate holder 132. FIG. 3(E) is a diagram of mounting the substrate holder 132 of FIG. 3(D) on the stage body 134.

In the fine movement stage 122 shown in FIG. 3(A), the substrate holder 132 is arranged at the front end (+Z direction side) of the fine movement stage 122 that must be precisely positioned. Assuming that the weight of the substrate holder 132 becomes heavier or the thickness of the substrate holder 132 becomes thicker, the position of the center of gravity becomes higher, and it becomes difficult to accurately position the micro-movement stage 122. Therefore, the substrate holder 132 is required to be lightweight and low in height (to make the thickness thinner). On the other hand, if the weight and height of the substrate holder 132 are reduced, the rigidity of the substrate holder 132 becomes lower. The substrate holder 132 with lower rigidity is difficult to achieve higher flatness. In addition, even if the substrate holder 132 is processed with high accuracy, if the substrate holder 132 is mounted on the stage main body 134, the flatness may deteriorate, that is, the flatness may not be reproduced. About holding on the substrate The reason why the higher flatness cannot be achieved in the device 132 and the reason why the flatness during processing cannot be reproduced will be explained in detail below.

FIG. 3(B) is a diagram showing the processing of the substrate holder 132 and the inspection of the flatness of the upper surface of the processed substrate holder 132. The substrate holder 132 has four or more support portions SC1. The support portion SC1 is provided at the lowest part (-Z side end) of the substrate holder 132. During processing or inspection, the substrate holder 132 is performed in a state where the substrate holder 132 is supported by the processing platen PP1 with higher rigidity and better flatness through the support portion SC1. The posture of the substrate holder 132 relative to the processing platen PP1 is determined by the three support parts SC1. Therefore, originally the substrate holder 132 only needs to have the three-point support portion SC1. However, in order to reduce weight and height, the substrate holder 132 is configured to have four or more support portions SC1. The reason is that the rigidity of the substrate holder 132 is reduced due to the lower height of the substrate holder 132, and the substrate holder 132 cannot withstand the processing machine when the substrate holder 132 is processed (processing to show the flatness of the upper surface of the substrate holder 132) The substrate holder 132 cannot maintain the position of the substrate holder 132 on the processing pressure plate PP1. For example, when only the 3-point support portion SC1 is provided near the center of the substrate holder 132, and the substrate holder 132 is processed on the processing platen PP1, when the substrate holder 132 is processed near the center of the substrate holder 132, the substrate The holder 132 can maintain its posture on the processing platen PP1. On the other hand, it cannot maintain its posture when processing near the outer periphery. As a result, although the substrate holder 132 originally only needs to have the support portion SC1 with three points, in order to withstand the processing pressure of the processing machine, the support portion SC1 is also provided around the substrate holder 132, which has more than four points. The structure of the support portion SC1. As shown in the lower diagram of FIG. 3(B), the substrate holder 132 having the support portion SC1 with more than 4 points has good flatness, that is, is processed such that the upper surface of the substrate holder 132 is substantially parallel to the XY plane. After the processing is completed, the flatness of the substrate holder 132 is checked on the processing platen PP1. At the time of inspection, that is, in a state where processing pressure is not applied to the substrate holder 132, three of the supporting portions SC1 having four or more points determine the posture of the substrate holder 132.

The substrate holder 132 that has been processed with good flatness through processing and inspection is placed The stage main body 134, as shown in FIG. 3(C), may not reproduce the flatness during processing when it is placed on the stage main body 134. The posture of the substrate holder 132 is determined by three points supported on the stage body 134. Therefore, when the three points supported by the processing platen PP1 are directly supported on the stage body 134 during the inspection of the substrate holder 132, the posture of the substrate holder 132 during inspection, that is, the posture with good flatness, is on the stage It can also be reproduced on the main body 134. However, since the substrate holder 132 has four or more support portions SC1, the support portion SC1 that is not supported by the processing platen PP1 during the processing of the substrate holder 132 may be supported by the stage main body 134. In this case, The posture of the substrate holder 132 during processing cannot be reproduced on the stage body 134. The greater the number of support portions SC1, the higher the possibility that the support points during processing and inspection of the substrate holder 132 will be different from the support points during mounting of the substrate holder 132 on the stage body 134. Furthermore, compared with the processing platen PP1, the stage body 134 of the micro-movement stage 122 is smaller and has lower rigidity, and the flatness is also poor. Therefore, when the substrate holder 132 is supported on the stage body 134 with low flatness, the posture of the substrate holder 132 during inspection cannot be reproduced. That is, as shown in FIG. 3(B), regarding the substrate holder 132 that is supported by 4 or more support portions SC1 and is processed and inspected, even if the flatness is high during processing and inspection, if it is mounted on a low rigidity The stage main body 134 also cannot reproduce the flatness as shown in FIG. 3(C), and the possibility of deterioration of the flatness becomes higher.

On the other hand, for example, as shown in FIG. 3(D), the substrate holder 132 has only a 3-point support portion SC1, and the processing and inspection are performed in a state where the support point is supported by the processing platen PP1 When the substrate holder 132 is processed, the support portion SC1 during processing is the same as the support portion SC1 when mounted on the stage body 134, so even if the substrate holder 132 is mounted on the stage body 134, it is as shown in FIG. 3(E) Generally, the flatness during processing and inspection is reproduced to some extent. However, when the substrate holder 132 is only supported by the processing platen PP1 by the support portion SC1 at three points, as described above, the substrate holder 132 is difficult to withstand the processing pressure of the processing machine, and it is difficult to show the substrate holder during processing. 132 higher flatness.

In order to process the substrate holder 132 into a higher flatness, one side is set to When the substrate holder is mounted on the stage main body 134, the flatness during processing can be reproduced. Consider the substrate holder 132 that increases the rigidity by increasing the thickness of the substrate holder 132 as shown in FIG. 4(A) It is supported by the 3-point support portion SC1, processed and inspected, and is mounted to the stage body 134 as shown in FIG. 4(B). The reason is that by increasing the rigidity of the substrate holder 132, the substrate holder 132 can withstand the processing pressure of the processing machine, and can be processed and inspected with improved flatness. Since the support portion SC1 has only 3 points, it becomes a substrate holder The three points of the support portion SC1 during processing of 132 are the same as the three points of the stage main body 134, and the flatness of the substrate holder 132 during processing can be reproduced when mounted on the stage main body 134. However, in this case, although the flatness of the substrate holder 132 is improved, the substrate holder 132 becomes thicker as shown in FIG. 4(A). Furthermore, if the substrate holder 132 is mounted to the stage main body 134, the upper side of the micro-movement stage 122 becomes heavier, so as shown in FIG. 4(B), the position of the center of gravity of the micro-movement stage 122 is as shown in FIG. 3(A) Compared with the position of the center of gravity of the conventional micro-movement stage 122, the position in the Z-axis direction becomes higher, and the controllability of the micro-movement stage 122 becomes worse.

Therefore, in the first embodiment, when the substrate holder 32 is mounted on the stage main body 34, the substrate holder 32 is performed on the substrate holder 32 in order to utilize the 3-point support portion SC1, which has a high reproducibility of flatness during processing. Processing and inspection make the substrate holder 32 thicker to increase rigidity. Furthermore, by setting the substrate holder 32 and the stage main body 34 into a nested structure, the position of the center of gravity of the fine movement stage 22 is lowered, and the controllability of the fine movement stage 22 is improved. The details of the nesting structure of the substrate holder 132 and the stage body 134 are described below.

FIG. 5(A) is a bottom view of the substrate holder 32 of the first embodiment, FIG. 5(B) is a cross-sectional view of AA in FIG. 5(A), and FIG. 5(C) is the stage main body 34 of the first embodiment The top view of FIG. 5(D) is the BB cross-sectional view of FIG. 5(C).

The substrate holder 32 is composed of lightweight components such as aluminum alloy, aluminum alloy castings, or CFRP (Carbon Fiber Reinforced Plastics). As shown in FIG. 5(B), the inside of the substrate holder 32 may have a rib structure for weight reduction.

As shown in FIG. 5(B), the width of the upper surface of the substrate holder 32 in the X-axis direction is greater than the width of the lower surface of the substrate holder 32 in the X-axis direction. The same is true in the Y-axis direction. Therefore, the substrate holder 32 has a tapered side surface that tapers from the upper surface to the lower surface. The side surface of the substrate holder 32 is recessed toward the center from the middle. The central part of the substrate holder 32 has a thinner thickness than the peripheral part, but at least has a rigidity that can withstand the processing pressure of the processing machine.

On the lower surface of the substrate holder 32, there are formed three protrusions that serve as the support portion SC1 of the substrate holder 32 during processing and inspection. That is, the support portion SC1 is located at the lowest part of the substrate holder 32. The central portion of the lower surface of the substrate holder 32 (the area surrounded by the support portion SC1) is recessed in a quadrangular pyramid (cone shape) when viewed from the lower surface of the substrate holder 32 (when viewed from the upper surface of the substrate holder 32) Protruding in a quadrangular pyramid shape). That is, the area surrounded by the support portion SC1 of the lower surface of the substrate holder 32 (the surface on the -Z side) protrudes toward the +Z side so as to be a higher position than the support portion SC1.

Three fixing holes 160 for fixing the substrate holder 32 to the stage body 34 are formed on the lower surface of the substrate holder 32, and the substrate holder 32 and the stage body 34 are connected and fixed by, for example, bolts. The fixing holes 160 are respectively provided in the three support parts SC1.

The carrier body 34 is made of cast iron or ceramics with higher rigidity. As shown in FIG. 5(D), the stage main body 34 has a cross-sectional hat shape, and three abutting portions 166 are formed on the inner bottom surface of the stage main body 34 for the three supporting portions SC1 of the substrate holder 32 to abut. The contact portion 166 is a member that supports the load of the substrate holder 32. The plurality of abutting portions 166 are arranged in such a manner that they are not arranged on a straight line in the carrier body 34. The plurality of abutting parts 166 are arranged to surround the center of the stage body 34. Each of the contact portions 166 is formed with a fixing hole 165 for fixing the substrate holder 32 with bolts or the like.

The side surface of the stage main body 34 rises substantially perpendicularly from the lower surface of the stage main body 34. When the substrate holder 32 is supported through the abutment portion 166, the position in the vertical direction (Z-axis direction) is the same as the substrate holder 32 At least part of it overlaps. In addition, the center part of the lower surface of the stage main body 34 (the area surrounded by the abutting portion 166) is the same as the lower surface of the substrate holder 32, which is from the lower surface of the stage main body 34 When viewed from the surface, it is recessed in a quadrangular pyramid shape (cone shape) (protruding in a quadrangular pyramid shape when viewed from the upper surface of the stage body 34). That is, the area surrounded by the contact portion 166 of the lower surface of the stage main body 34 (the surface on the −Z side) protrudes toward the +Z side so as to be a higher position than the contact portion 166.

6(A) is an exploded view of the micro-movement stage 22 and the weight elimination device 42, and FIG. 6(B) is an assembly view of the micro-motion stage 22 and the weight elimination device 42.

As shown in FIG. 6(B), the substrate holder 32 is attached to a support portion SC1 that supports the substrate holder 32 when the substrate holder 32 is processed, and is fixed (supported) to the stage main body 34 by bolts B1 and the like. Thereby, when the substrate holder 32 is mounted on the stage main body 34, the flatness during processing and inspection of the substrate holder 32 can be reproduced. In addition, the substrate holder 32 is fixed by bolts B1 at three supporting parts SC1 from the lower surface of the stage main body 34, so the flatness of the substrate holder 32 is not affected.

Furthermore, as shown in FIG. 6(B), the stage main body 34 is a part of the lower surface of the stage main body 34 protruding to the +Z side inserted into the +Z side protruding part of the substrate holder 32 to support the substrate holder 32. That is, the substrate holder 32 and the stage main body 34 have a nested structure. Thereby, compared with the micro-movement stage 122 shown in FIG. 4(B), the height of the micro-movement stage 22 can be suppressed and the center of gravity position of the micro-movement stage 22 can be lowered, so the controllability of the micro-movement stage 22 is improved. That is, as shown in FIG. 6(B), in this embodiment, from the moving reference plane (for example, the upper surface of the Y step guide 44) to the center of gravity position CG1 of the micro-motion stage 22 (where the voice coil motor 40 is installed) The distance H1 in the Z-axis direction to the position) is longer than the distance H2 in the Z-axis direction from the moving reference plane to the position where the substrate holder 32 is supported by the stage body 34. Since the center of gravity of the micro-motion stage 22 is relatively low, the micro-motion stage 22 has better controllability than the micro-motion stage 122 shown in FIG. 4(B).

In addition, the upper end of the weight elimination device 42 is inserted into the portion protruding toward the +Z side of the lower surface of the stage body 34 to support the stage body 34. In other words, the distance H3 in the Z-axis direction from the moving reference surface to the position where the weight elimination device 42 supports the stage body 34 is longer than the Z-axis direction from the moving reference surface to the position where the substrate holder 32 is supported by the stage body 34 The distance above H2. That is, the weight The removing device 42 and the carrier body 34 are in a nested structure. Thereby, the substrate stage device 20 including the weight reduction device 42 and the fine movement stage 22 can be reduced in height. Furthermore, the thickness near the center of the substrate holder 32 may be thickened, and the distance H3 and the distance H2 may be equal to form the substrate holder 32.

In addition, in the first embodiment, the target plate 64 of the Z tilt measurement system that measures the position and tilt of the micro-movement stage 22 in the Z-axis direction is installed on the weight reduction device 42, and the leveling sensor 62 is installed on the stage The bottom surface of the body 34. Therefore, the distance H4 in the Z-axis direction from the moving reference surface to the leveling sensor 62 is shorter than the Z-axis direction from the moving reference surface to the supporting surface of the weight elimination device 42 supporting the weight of the micro-movement stage 22 The distance H2. Thereby, the distance between the target plate 64 and the leveling sensor 62 can be shortened, so the measurement accuracy is improved.

As described in detail above, according to the first embodiment, the substrate stage device 20 includes: a substrate holder 32 that holds the substrate P; a stage body 34 that supports the substrate holder 32; an X coarse motion stage 26, It supports the substrate holder 32 and the stage body 34; and the voice coil motor 40, which makes the substrate holder 32 and the stage body 34 move relative to the X coarse motion stage 26. The stage main body 34 supports the substrate holder 32 through a plurality of support portions SC1 of the substrate holder 32, and the voice coil motor 40 is at a higher position than the support portion SC1. The substrate holder 32 and the stage main body 34 are provided to the stage main body 34 The driving force for the relative movement of the X coarse motion stage 26. Therefore, even when the substrate holder 32 whose rigidity is increased by thickening the thickness in the Z-axis direction is used, the substrate holder 32 and the stage main body 34 are arranged in a nested shape, so that the substrate holder 32 is slightly moved. The position of the center of gravity of the stage 22 is lowered, and the controllability of the micro-motion stage 22 is improved.

In addition, according to the first embodiment, the stage main body 34 includes a portion having a plurality of abutting portions 166 for the support portion SC1 to abut, and the position in the vertical direction and the substrate holder 32 supported by the abutting portion 166 At least a part of the overlapping portion (side surface), the voice coil motor 40 is located at a position higher than the abutting portion 166 to apply driving force to a predetermined position on the side surface.

In addition, according to the first embodiment, the abutting portion 166 is provided on the inner bottom surface of the stage main body 34 so as not to be aligned on a straight line. Thereby, the flatness of the substrate holder 32 can be maintained.

Furthermore, according to the first embodiment, the abutting portion 166 is provided so as to surround the center of the inner bottom surface of the stage main body 34. Thereby, the center of the inner bottom surface of the stage main body can be located in the polygon (triangle) formed by the connecting and abutting portion 166.

Furthermore, according to the first embodiment, the voice coil motor 40 is a linear motor including a stator and a rotor that can move relative to the stator, and the stator is installed on the X coarse motion stage 26 at a position higher than the contact portion 166. Thereby, the height position of the center of gravity of the micro-movement stage 22 can be driven.

Furthermore, according to the first embodiment, the substrate holder 32 and the stage main body 34 are connected by the bolt B1, and the voice coil motor 40 provides the substrate holder 32 and the stage main body 34 connected by the bolt B1 thicker than X. The driving force for the relative movement of the movable stage 26.

In addition, according to the first embodiment, the substrate stage device 20 includes a weight reduction device 42 (third support portion) that supports the substrate holder 32 and the stage body 34, and the voice coil motor 40 provides the stage body 34 to hold the substrate. The driving force of the relative movement of the device 32, the stage main body 34 and the weight elimination device 42 with respect to the X coarse motion stage 26 (ie, the driving force of at least one of the X-axis and Y-axis directions).

Furthermore, according to the first embodiment, the weight reduction device 42 is installed to face the area surrounded by the contact portion 166 from below, and supports the stage main body 34.

In addition, according to the first embodiment, the lower surface of the stage main body 34 is formed such that the area surrounded by the plurality of abutting portions 166 is located higher than the abutting portion 166. Thereby, the substrate holder 32 and the stage main body 34 can be arranged in a nested shape.

Furthermore, according to the first embodiment, the substrate holder 32 has three support portions SC1. Thereby, when the substrate holder 32 which is supported by the three support parts SC1 and processed and inspected is mounted on the fine movement stage 22, the flatness during processing and inspection can be reproduced.

Furthermore, according to the first embodiment, the support portion SC1 is located at the lowest part of the substrate holder 32. Thereby, the thickest part of the substrate holder 32 in the Z-axis direction is supported. Therefore, the section coefficient (rigidity) of the substrate holder 32 for bending becomes larger, and the plane processing accuracy of the upper surface is improved. High, when the substrate holder 32 is mounted on the micro-motion stage 22, the flatness of the substrate holder 32 during processing and inspection can be reproduced.

In addition, according to the first embodiment, the substrate holder 32 is processed in a state supported by the processing platen PP1 through the plurality of support portions SC1. With this, when the substrate holder 32 that has been processed and inspected, supported by the support portion SC1, is mounted on the micro-motion stage 22, the flatness during processing and inspection can be reproduced.

Furthermore, according to the first embodiment, the substrate stage device 20 is a substrate stage device that holds the substrate P, and includes: a substrate holder 32 that holds the substrate P; a stage body 34 that supports the substrate holder 32; and weight The elimination device 42 supports the substrate holder 32 and the stage body 34. The substrate holder 32 is supported by the carrier body 34 through a plurality of support portions SC1 of the substrate holder 32, the carrier body 34 is supported by the weight reduction device 42, and the support portion SC1 is provided on the stage body 34 by the weight reduction device 42 The position where the supporting surface of the support is low. Thereby, even when the substrate holder 32 whose rigidity is increased by thickening the thickness in the Z-axis direction is used, the substrate holder 32, the stage main body 34, and the weight reduction device 42 are arranged to be embedded Because of the sleeve shape, the substrate stage device 20 can be reduced in height.

In addition, according to the first embodiment, the stage main body 34 has a plurality of abutting portions 166 that are respectively abutted by the plurality of supporting portions SC1, and the substrate holder 32 is located in a region surrounded by the plurality of supporting portions SC1. SC1 is high, so that the lower surface protrudes toward the +Z side. The carrier body 34 is positioned higher than the abutting portion 166 so that the area surrounded by the abutting portions 166 is positioned higher than the abutting portion 166, so that the lower surface faces +Z Side protruding. Furthermore, the stage body 34 is inserted into the portion protruding toward the +Z side of the substrate holder 3 to support the substrate holder 32. Accordingly, even when the substrate holder 32 whose rigidity is increased by thickening the thickness in the axial direction is used, since the substrate holder 32 and the stage main body 34 are arranged in a nested shape, the stage 22 is slightly moved. The position of the center of gravity is lowered, and the controllability of the micro-motion stage 22 is improved.

Furthermore, according to the first embodiment, the stage main body 34 is formed so as to eliminate the device by weight. The supporting surface of the support 42 is located at a higher position than the plurality of abutting parts 166, so that the lower surface protrudes toward the +Z side, and the weight elimination device 42 is inserted into the lower surface of the carrier body 34 to face +Z The side protruding part is formed to support the carrier body 34. Thereby, the substrate holder 32, the stage main body 34, and the weight reduction device 42 are arranged in a nested shape, so that the substrate stage device 20 can be reduced in height.

Furthermore, according to the first embodiment, the substrate stage device 20 includes a voice coil motor 40 for relatively moving the substrate holder 32 and the stage body 34 with respect to the weight reduction device 42. The voice coil motor 40 is higher than the support portion SC1. The position gives the stage main body 34 a driving force (that is, a driving force in the Z-axis direction) to move the substrate holder 32 and the stage main body 34 relative to the weight reduction device 42.

In addition, the voice coil motor 40 is a linear motor including a stator and a rotor that can move relative to the stator, and the rotor is installed on the stage main body 34 at a position higher than the support portion SC1.

Furthermore, according to the first embodiment, the substrate stage device 20 includes a substrate holder 32 that holds the substrate P, and is capable of moving within a movement reference plane including the X-axis direction and the Y-axis direction orthogonal to the X-axis direction. The micro-movement stage 22, the distance H1 in the Z-axis direction orthogonal to the moving reference surface from the moving reference surface to the center of gravity position CG1 of the micro-moving stage 22 is longer than the distance from the moving reference surface to the position where the substrate holder 32 is supported The distance H2 in the Z axis direction. Therefore, even when the substrate holder 32 whose rigidity is increased by thickening the thickness in the Z-axis direction is used, the substrate holder 32 and the stage main body 34 are arranged in a nested shape, so that the substrate holder 32 is slightly moved. The position of the center of gravity of the stage 22 is lowered, and the controllability of the micro-motion stage 22 is improved.

In addition, according to the first embodiment, the substrate stage device 20 includes: an X coarse motion stage 26 that can move in the X-axis direction; and a substrate drive system including a stator as at least a part of the element provided on the X coarse motion carrier The stage 26 provides a plurality of voice coil motors 40 with thrust in the X-axis direction and the Y-axis direction to the micro-movement stage 22, and uses the plurality of voice coil motors 40 to control the position in the XY plane of the micro-motion stage 22. Furthermore, the micro-motion stage 22 includes a support substrate holder 32, and a stage body 34 that is mounted with a rotor as another element of a plurality of voice coil motors 40. The micro-motion stage 22 supports the substrate holder 32. The position of the stage body 34 to support the substrate holder 32 is set. Therefore, even when the substrate holder 32 whose rigidity is increased by thickening the thickness in the Z-axis direction is used, the substrate holder 32 and the stage main body 34 are arranged in a nested shape, so that the substrate holder 32 is slightly moved. The position of the center of gravity of the stage 22 is lowered, and the controllability of the micro-motion stage 22 is improved.

In addition, according to the first embodiment, the substrate stage device 20 includes a micro-motion stage 22 that includes a substrate holder 32 for holding the substrate P, and a stage body 34 for supporting the substrate holder 32, and is capable of including the X-axis The direction and the Y-axis direction orthogonal to the X-axis direction move within the reference plane of movement; and the weight elimination device 42, which has a supporting surface supporting the weight of the micro-motion stage 22; and the movement from the moving reference surface to the supporting surface The distance H3 in the Z-axis direction orthogonal to the reference plane is longer than the distance H2 in the Z-axis direction from the moving reference plane to the position where the stage main body 34 supports the substrate holder 32. Thereby, since the micro movement stage 22 and the weight elimination device 42 are arranged in a nested shape, the substrate stage device 20 including the weight elimination device 42 and the micro movement stage 22 can be reduced in height.

Furthermore, according to the first embodiment, the substrate stage device 20 is in the weight reduction device 42, and is provided with a partial element (target plate 64) of the Z tilt measurement system that measures the position of the micro-movement stage 22 in the Z-axis direction, The distance H4 in the Z-axis direction from the moving reference surface to another element of the Z tilt measurement system (leveling sensor 62) is shorter than the distance H2 in the Z-axis direction from the moving reference surface to the supporting surface. Thereby, the distance between the target plate 64 and the leveling sensor 62 can be shortened, so the measurement accuracy is improved.

Furthermore, according to the first embodiment, the substrate stage device 20 includes a substrate holder 32 that holds the substrate P, and is capable of moving within a movement reference plane including the X-axis direction and the Y-axis direction orthogonal to the X-axis direction. The micro-motion stage 22, the substrate holder 32 is in the Z-axis direction orthogonal to the movement reference plane, and has three support parts SC1 on the surface opposite to the surface holding the substrate P. The substrate holder 32 is mounted on the micro-motion In the case of the stage 22, it is supported by three support parts SC1. Thereby, when the substrate holder 32 which is supported by the three support parts SC1 and processed and inspected is mounted on the fine movement stage 22, the flatness during processing and inspection can be reproduced.

Furthermore, according to the first embodiment, the fine movement stage 22 includes a stage main body 34 that supports the substrate holder 32, and the substrate holder 32 is supported by the stage main body 34 on the three supporting parts SC1. Thereby, when the substrate holder 32 is mounted on the stage main body 34, the flatness during processing and inspection of the substrate holder 32 can be reproduced.

Furthermore, according to the first embodiment, the substrate stage device 20 includes a substrate holder 32 that holds the substrate P, and is capable of moving within a movement reference plane including the X-axis direction and the Y-axis direction orthogonal to the X-axis direction. The micro-movement stage 22 is supported at the thickest part in the Z-axis direction orthogonal to the movement reference plane. Thereby, the cross-sectional coefficient (rigidity) of the substrate holder 32 for bending is increased, and the plane processing accuracy of the upper surface is improved. When the substrate holder 32 is mounted on the micro-motion stage 22, the processing of the substrate holder 32 can be reproduced The flatness of time and inspection.

In addition, according to the first embodiment, a micro-movement stage measurement system 76 is provided. The micro-movement stage measurement system 76 has an upstream scale 72 including measurement components in the X-axis direction and the Y-axis direction, and one surface relative to the upstream scale 72 Moving in the X-axis direction, the first head 74 is irradiated with the measurement beam, and the position information of the micro-movement stage 22 in the X-axis direction and the Y-axis direction is measured. The first head 74 is set on the substrate holder 32. Thereby, even if the position of the substrate holder 32 is shifted relative to the stage main body 34, it will not affect the exposure position accuracy. Furthermore, it is also possible to provide an upstream scale 72 on the substrate holder 32.

Furthermore, in the above-mentioned first embodiment, in FIG. 6(B), the distance H3 from the moving reference surface in the Z-axis direction to the position where the weight elimination device 42 supports the stage body 34 is shorter than the self-moving reference surface The distance H1 to the center of gravity position CG1 of the micro-motion stage 22, but the distance H3 may be longer than the distance H1. Thereby, the height of the substrate stage device 20 can be further reduced.

(Modification 1)

Modification 1 of the first embodiment is obtained by changing the structure of the micro-movement stage. Fig. 7(A) is a cross-sectional view of the substrate holder 32A of Modification 1, Fig. 7(B) is a cross-sectional view of the stage body 34A of Modification 1, and Fig. 7(C) is a schematic configuration of the weight reduction device 42A Fig. 7(D) shows Modification Example 1 Fig. 7(E) is a diagram showing another example of the substrate holder of the modification 1 of the assembly diagram of the micro-motion stage 22A.

As shown in FIG. 7(A), the center of the lower surface of the substrate holder 32A of Modification 1 is not a quadrangular pyramid (cone shape) but a quadrangular prism depression when viewed from the lower surface of the substrate holder 32A ( When viewed from the upper surface of the substrate holder 32A, it protrudes in a quadrangular column shape). By recessing the substrate holder 32A into a quadrangular prism shape, the structure is simpler than that of a quadrangular pyramid shape, so that the substrate holder 32A can be easily manufactured.

As shown in FIG. 7(B), the center part of the lower surface of the stage body 34A of Modification 1 is not a quadrangular pyramid (cone shape) but a quadrangular cylindrical depression when viewed from the lower surface of the stage body 34A ( When viewed from the upper surface of the carrier body 34A, it protrudes in a quadrangular column shape).

As shown in FIG. 7(C), the shape of the weight elimination device 42A of Modification 1 is a quadrangular column shape.

Even if the substrate holder, the stage main body, and the weight reduction device are configured as shown in Figs. 7(A) to 7(C), the substrate holder 32A and the stage main body 34A can be configured as shown in Fig. 7(D) , And the weight elimination device 42A is arranged in a nested shape. Thereby, the position of the center of gravity of the fine movement stage 22A can be lowered, the center of gravity can be driven, and the controllability of the fine movement stage 22A is improved. Furthermore, the height of the substrate stage device can be reduced.

Furthermore, the skeleton structure (rib structure) of the substrate holder can also be a structure like the substrate holder 32A' of FIG. 7(E). Even with this configuration, the substrate holder 32A', the stage main body 34A, and the weight reduction device 42A may be arranged in a nested shape.

(Modification 2)

Modification 2 of the first embodiment is also obtained by changing the structure of the micro-motion stage. 8(A) and 8(B) are respectively a bottom view of the substrate holder 32B of modification 2 and a cross-sectional view of AA in FIG. 8(A), and FIGS. 8(C) and 8(D) are respectively modified examples 2 The top view of the carrier body 34B and the BB section of Figure 8(C) 面图。 Face map. FIG. 9 is an assembly diagram of the micro-motion stage 22B of the second modification.

The substrate holder 32B of the modification 2 is different from the substrate holder of the first embodiment and the modification 1 in that the tapered side surface is continuous from the upper surface to the lower surface. That is, the substrate holder 32B has a downward quadrangular pyramid shape (the cross-sectional shape is an inverted trapezoid shape). Since the other structure is the same as that of the first embodiment, detailed description is omitted. The structure in which the tapered side surface is continuous from the upper surface to the lower surface makes the structure simpler than the substrate holder 32 shown in the first embodiment, and therefore the substrate holder 32B is easier to manufacture.

The stage body 34B of the modification 2 is different from the stage body of the first embodiment and the modification 1 in that the side surface is inclined into a tapered shape along the shape of the substrate holder 32B. Moreover, as shown in FIG. 9, a voice coil motor 40 is installed on the inclined side surface of the stage main body 34. The voice coil motor 40 is mounted on the stage main body 34B in such a manner that the mounting position in the Z-axis direction and the center of gravity position CG1 of the fine movement stage 22B substantially overlap.

Even if the substrate holder, the stage main body, and the weight elimination device are configured as shown in Fig. 8(A) to Fig. 8(D), the substrate holder 32B, the stage main body 34B, and the weight can be configured as shown in Fig. 9 The elimination device 42 is arranged in a nested shape. Thereby, the position of the center of gravity of the fine movement stage 22B can be lowered, and the center of gravity can be driven by the voice coil motor 40, so the controllability of the fine movement stage 22B is improved. Furthermore, the height of the substrate stage device can be reduced.

(Modification 3)

Modification 3 of the first embodiment is obtained by changing the structure of the support portion of the substrate holder.

In the above-mentioned first embodiment and modification examples 1 and 2, if the bottom area of each of the support portions SC1 of the substrate holder is large to a certain extent, when the substrate holder is mounted on the stage body, there is one support portion There is a concern that the position of the abutting portion 166 contacting the stage body in the bottom surface of the SC1 changes, which may cause the substrate holder to deform. That is, there is a possibility that on the bottom surface of the supporting portion SC1, the supporting point during processing of the substrate holder and the supporting point during mounting on the stage body are respectively located at different positions.

Therefore, in Modification 3 of the first embodiment, the structure of the support portion of the substrate holder is changed. 10(A) is a cross-sectional view of the substrate holder 32C of Modification 3, and FIG. 10(B) is a cross-sectional view of the stage main body 34C of Modification 3. 11 is a diagram showing a schematic configuration of a substrate stage device 20C of Modification 3.

As shown in FIG. 10(A), three ball joints JB1 (for example, ball joints such as steel balls) are fixed to the bottom surface of the substrate holder 32C of Modification 3 by adhesion or the like. The processing and inspection of the substrate holder 32C are performed on the processing platen PP1 with the ball joint JB1 as a supporting point. That is, with the ball joint JB1 in contact with the processing platen PP1, the upper surface of the substrate holder 32C is processed to be flat, and the processed substrate holder 32C is placed on the stage main body 34C. That is, compared with the support portion SC1 shown in the first embodiment and the modification examples 1 and 2, the bottom area of the support portion SC1 can be reduced more significantly, and the support point and the direction of the substrate holder during processing can be improved. The supporting point of the main body is close to the same position infinitely.

As shown in FIG. 10(B), a ball receiving surface 165c for receiving the ball joint JB1 is formed on the inner bottom surface of the carrier body 34C. The ball receiving surface 165c is formed by, for example, a conical hole or a V-shaped groove. Thereby, it is possible to suppress the positional deviation of the substrate holder 32C with respect to the stage main body 34C in the X-axis direction and the Y-axis direction. However, since the substrate holder 32C and the stage main body 34C are not mechanically connected, there is a possibility that the substrate holder 32C moves relative to the stage main body 34C in the Z-axis direction. Therefore, it is preferable to install the leveling sensor 62 of the Z tilt measurement system on the bottom surface of the substrate holder 32C of the supporting substrate instead of the stage main body 34C. In this case, a through hole 167 for allowing the light from the leveling sensor 62 to pass is provided in the stage body 34C.

With this configuration, when the substrate holder 32C is mounted on the stage main body 34C, the flatness of the substrate holder 32C during single processing can be reproduced. In addition, since the substrate holder 32C is not fixed to the stage main body 34C, assembly and maintenance are easy.

As shown in FIG. 11, the voice coil motor 40 is provided on the stage main body 34C, and the first head 74 or adjuster The flat sensor 62 and other sensors for specifying the position of the substrate holder 32C are provided on the substrate holder 32C. Thereby, even if the position of the substrate holder 32C is shifted relative to the stage main body 34C, it will not affect the exposure position accuracy. Furthermore, in the first embodiment and Modifications 1 and 2, since the substrate holder 32C and the stage main body 34C are mechanically connected by bolts or the like, the substrate holder 32C and the stage main body 34C can also be viewed As a whole, the arm member 90 with the head base 88 fixed to the substrate holder 32 can also be installed on the stage body 34C. In this case, the position of the micro-motion stage measurement system 76 in the Z-axis direction becomes approximately the same height as the position in the Z-axis direction of the substrate to be measured, and the arm member 90 is compared in the Z-axis direction. The long component is sufficient.

Since the other structure is the same as that of the first embodiment, detailed description is omitted.

According to Modification 3, the ball joint JB1 connects the substrate holder 32C and the stage body 34C so that one of the substrate holder 32C and the stage body 34C can move relative to the other in the vertical direction. Since the substrate holder 32C is not fixed to the stage main body 34C, assembly and maintenance become easy.

(Modification 4)

Modification 4 of the first embodiment is obtained by changing the configuration of the stage main body of Modification 3. 12(A) is a cross-sectional view of the substrate holder 32D of Modification 4, and FIG. 12(B) is a cross-sectional view of the stage body of Modification 4. Since the structure of the substrate holder 32D of Modification 4 is the same as that of the substrate holder 32C of Modification 3, detailed descriptions are omitted.

The stage main body 34D of Modification 4 has a ball receiving member 168 that is different from the stage main body 34D. The ball receiving member 168 has a ball receiving surface 168d for receiving the ball joint JB1 of the substrate holder 32C. The ball receiving member 168 is to enable the ball joint JB1 fixed on the bottom surface of the substrate holder 32C to be accurately positioned relative to the stage main body 34D, and can be fixed to the stage by bolts B1 after adjusting the position in the horizontal plane. The body 34D. Furthermore, as the ball receiving member 168, a metal member of high hardness after heat treatment (quenching) can be used.

Since the other structure is the same as that of Modified Example 3, detailed description is omitted.

Furthermore, in the above-mentioned first embodiment and its modifications 1 to 4, the position of the three support portions SC1 on the bottom surface of the substrate holder or the ball joint JB1 in the XY plane is based on the position of the center of gravity of the substrate holder as a whole. It is set in the triangle obtained from the center of the 3 support parts SC1 or the ball joint JB1. Furthermore, for example, in Modification 2 of the first embodiment, it is preferable that the center of gravity position CG2 of the triangle TR1 obtained by connecting the three support portions SC1 as shown in FIG. 13 and the center of gravity position CG3 of the substrate holder 32B as a whole Anastomosis when looking down. The length of the side of the triangle TR1 obtained by connecting the supporting portion SC1 is preferably 1/4 to 2/5 of the length of the diagonal of the substrate holder 32. The same applies to the first embodiment and other modified examples.

≪Second Embodiment≫

In the first embodiment and its modification examples, the substrate holder is supported by the stage body at three supporting points, and the stage body is supported by one weight reduction device 42. In the second embodiment, by abolishing the stage body and eliminating the influence of the deformation of the stage body, the flatness of the upper surface of the substrate holder, that is, the substrate placing surface, is further improved. In addition, in the following description, the same components as those of the first embodiment and its modification examples are denoted by the same reference numerals, and detailed descriptions thereof are omitted.

FIG. 14 is a diagram showing a schematic configuration of a substrate stage device 220 of the second embodiment. 15(A) is a plan view of the micro-movement stage 222 of the second embodiment, and FIG. 15(B) is a cross-sectional view of the micro-movement stage 222. FIG. 16 is an exploded view of the micro-motion stage 222. FIG. 17(A) is a top view of the substrate holder 232, and FIG. 17(B) is a bottom view of the substrate holder 232.

As shown in FIG. 15(B), the micro-movement stage 222 of the second embodiment includes a substrate holder 232 and a weight reduction device 242.

As shown in FIG. 14, the substrate holder 232 is directly supported by the weight elimination device 242, and its supporting surface is located at a position lower than the center of gravity position CG1 of the micro-motion stage 222 in the Z-axis direction.

As shown in FIG. 15(B), the substrate holder 232 has a substantially inverted quadrangular pyramid like the first embodiment and its modification. On the side of the substrate holder 232, on the Z of the substrate holder 232 The rotor of the voice coil motor 40 is installed at the approximate center of gravity position CG1 in the axial direction. In addition, the inside of the substrate holder 232 may have a rib structure for weight reduction.

As shown in FIG. 15(B) and FIG. 17(B), three support portions SC1 are formed on the bottom surface of the substrate holder 232. That is, the support portion SC1 is located at the lowest part of the substrate holder 232. As shown in FIG. 15(B), three air bearings 245 are each rotatably attached to the support portion SC1. Furthermore, as shown in FIG. 17(B), three leveling sensors 62 are mounted downwardly on the bottom surface of the substrate holder 232. Furthermore, at least three leveling sensors 62 may be installed.

Next, the weight elimination device 242 will be described. 18(A) is a plan view of the weight elimination device 242, and FIGS. 18(B) and 18(C) are partial cross-sectional views of the weight elimination device 242. FIG. 19 is a diagram showing the relationship between the weight elimination device 242 and the X coarse motion stage 26.

The weight elimination device 242 exerts an upward force on the substrate holder 232 to support the substrate holder 232. The weight elimination device 242 has the ability to elastically support the substrate holder 232, that is, to support the substrate holder 232 in an elastically deformable manner.

As shown in FIG. 18(A), the weight elimination device 242 has three weight elimination mechanisms 243 connected to each other by a connecting plate 246.

As shown in Figure 18 (B) and Figure 18 (C), each weight elimination mechanism 243 includes a body portion 274 having: a housing 270; an air spring 271, which is provided inside the housing 270; and sliding The portion 273 is slidable in the Z-axis direction in the housing 270. Each weight elimination mechanism 243 is supported by one base pad 281.

The sliding portion 273 is configured to be able to slide in the Z-axis direction with low friction by air bearings or leaf springs not shown. The upper surface of the sliding portion 273 serves as a guide surface of the air bearing 245 and is finished to be extremely flat and smooth and parallel to the XY plane.

The air spring 271 can be supplied and exhausted from a gas supply device not shown, and can support the substrate holder placed on the sliding part 273 through the air bearing 245 with a lower spring constant The weight of 232. Thereby, in accordance with the driving of the Z-axis direction and/or tilt (thetax direction and thetay direction) of the substrate holder 232, the air spring 271 in each weight reduction mechanism 243 expands and contracts. Furthermore, by changing the amount of air supplied to the air spring 271, the sliding portion 273 can be driven in the Z-axis direction to adjust the posture of the substrate holder 232 (Z-axis direction, θx direction, θy direction).

As shown in Figure 18 (B) and Figure 18 (C), the base pad 281 includes: a base pad body 283; and a ball bearing (or ball joint) 282, which connects the base pad body 283 to the housing 270 Below the surface. Thereby, the weight elimination device 242 can rotate the base pad body 283 with the ball bearing 282 as the center of rotation corresponding to the flatness (slope) of the Y step guide 44 as the moving reference surface of the micro-movement stage 222, And in a state where there is a predetermined interval between the moving reference surface and the base pad body 283, it moves on the Y step guide 44.

As shown in FIG. 18(A), the three weight elimination mechanisms 243 configured as described above are connected by a connecting plate 246 such that the weight elimination mechanism 243 is located at the apex of the triangle. By connecting three weight elimination mechanisms 243, each weight elimination mechanism 243 supported at one point by the ball bearing (or ball joint) 282 of the base pad 281 can be erected.

Each connecting plate 246 is provided with a target plate 64 corresponding to the leveling sensor 62.

Four (or three) flexible members 247 are installed on the connecting plate 246 to pull the center of gravity of the triangle in the XY direction. The flexure 247 is connected to the X coarse motion stage 26 as shown in FIG. 19. Thereby, the weight elimination device 242 is connected to the X coarse motion stage 26 through the flexible member 247. Thereby, when the X coarse motion stage 26 is driven in the X direction, the weight elimination device 242 is pulled by the X coarse motion stage 26 and moves on the Y step guide 44.

As shown in FIG. 15(B), each weight elimination mechanism 243 supports each support portion SC1 of the substrate holder 232 through an air bearing 245. The support portion SC1 is a point at which the substrate holder 232 abuts and is supported by the processing platen PP1 when the substrate holder 232 is processed. Thereby, even if the substrate holder 232 is mounted on the weight reduction device 242, the support portion SC1 of the substrate holder 232 that is supported by the processing platen during processing also matches The points supported by the weight elimination device 242 are the same, so the flatness of the substrate holder 232 supported by the three-point support portion SC1 and processed and inspected can be reproduced on the weight elimination device 242. In addition, each weight elimination mechanism 243 directly supports the substrate holder 232 without passing through the object holding the substrate holder 232 (for example, the stage body in the first embodiment, etc.), so the influence of deformation of the object can be eliminated.

As described in detail above, according to the second embodiment, the substrate stage device 220 includes: a substrate holder 232 that holds the substrate P; a weight reduction device 242 that supports the substrate holder 32 from below; and an X coarse movement stage 26. It supports the substrate holder 32 and the weight elimination device 242; and the voice coil motor 40, which makes the substrate holder 32 and the weight elimination device 242 relatively move relative to the X coarse motion stage 26. Furthermore, the weight reduction device 242 supports the substrate holder 232 through the plurality of support portions SC1 of the substrate holder 32, and the voice coil motor 40 is at a position higher than the support portion SC1 to provide the substrate holder 232 with the substrate holder 232 relative to X The driving force for the relative movement of the coarse motion stage 26. As a result, since there is no object for holding the substrate holder 232, the number of parts is reduced, and the weight, height, and cost can be reduced.

In addition, according to the second embodiment, the voice coil motor 40 is positioned higher than the support portion SC1 to apply a driving force to the substrate holder 32 to move the substrate holder 232 relative to the weight reduction device 242 (that is, the Z-axis direction The driving force).

Furthermore, according to the second embodiment, the substrate holder 232 has three support portions SC1. Thereby, when the substrate holder 232, which is supported by the three support parts SC1 and processed and inspected, is mounted on the fine movement stage 222, the flatness during processing and inspection can be reproduced.

Furthermore, according to the second embodiment, the support portion SC1 is located at the lowest part of the substrate holder 232. Thereby, the substrate holder 232 is supported at the thickest part in the Z-axis direction. Therefore, the cross-sectional coefficient (rigidity) of the substrate holder 232 with respect to bending is increased, and the plane processing accuracy of the upper surface is improved. When the substrate holder 232 is mounted on the micro-movement stage 222, the processing time of the substrate holder 232 can be reproduced. Flatness during inspection.

Furthermore, according to the second embodiment, the substrate holder 232 is connected to a plurality of supports The portion SC1 is processed while being supported by the platen. Thereby, when the substrate holder 232 that is supported by the support portion SC1 and processed and inspected is mounted on the fine movement stage 222, the flatness during processing and inspection can be reproduced.

In addition, according to the second embodiment, the substrate stage device 220 includes: a substrate holder 232 that can move in a horizontal plane; and a weight reduction device 242 that has a supporting surface that supports the weight of the substrate holder 232. Three weight elimination mechanisms 243, and a connecting plate 246 connecting the three weight elimination mechanisms 243 in a state of being arranged at the apex of the triangle. Since there is no object to hold the substrate holder 232, the number of parts is reduced, and the weight, height, and cost can be reduced. In addition, since the substrate holder 232 having the three support portions SC1 is supported on the support portion SC1 by the three weight elimination mechanisms 243, the flatness during processing of the substrate holder 232 can be faithfully reproduced. In addition, the weight elimination mechanism 243 disperses the weight of the substrate holder 232 into 3 parts, and receives them directly under the substrate holder 232, so that the parts can be miniaturized, lowered, and lowered one by one. Furthermore, since the substrate holder 232 is not fixed to other components, the flatness of the substrate holder 232 will not deteriorate due to the difference in thermal expansion coefficient between the substrate holder 232 and other components. In addition, since the three weight elimination mechanisms 243 are provided, it is not necessary to strictly align the position of the center of gravity of the substrate holder 232, and assembly adjustment becomes easy.

In addition, according to the second embodiment, each of the three weight elimination mechanisms 243 includes the base pad body 283 and the ball bearing (or ball joint) 282 for tilting the support surface of the weight elimination mechanism 243 supporting the substrate holder 232. Thereby, even if the lower surface of the supporting portion SC1 of the substrate holder 232 is inclined, the supporting surface can be tilted according to the slope.

In addition, according to the second embodiment, the substrate stage device 220 includes: an X coarse movement stage 26 that supports the substrate holder 232 and can move in the X-axis direction; and a pair of drive systems that coarsely move the X The stage 26 is driven in the X-axis direction. Moreover, in the XY plane, the weight elimination device 242 is positioned within the triangle formed by the weight elimination mechanism 243 with the center of gravity in the XY plane of the substrate holder 232 Side-wise configuration, a pair of drive systems are located on both sides of the weight elimination device 242. Thereby, the three weight elimination mechanisms 243 can be made to function as one weight elimination device.

Furthermore, according to the second embodiment, three support portions SC1 are provided on the lower surface of the substrate holder 232, and three weight elimination mechanisms 243 are connected to the three support portions SC1 to support the substrate holder 232. Thereby, even if the substrate holder 232 is mounted on the weight reduction device 242, the flatness during processing of the substrate holder 232 can be reproduced.

Furthermore, according to the second embodiment, the three weight elimination mechanisms 243 support the thickest portion of the substrate holder 232 in the Z-axis direction. Thereby, even if the substrate holder 232 is mounted on the weight reduction device 242, the deformation of the substrate holder 232 can be suppressed, such as reproducing the flatness of the substrate holder 232 during processing.

Furthermore, according to the second embodiment, each weight elimination mechanism 243 of the weight elimination device 242 has an air spring 271, and the weight elimination device 242 can adjust the posture of the substrate holder 232 by adjusting the amount of gas supplied to the air spring 271. That is, by adjusting the amount of gas supplied to the air spring 271, the sliding portion 273 can be independently moved up and down and moved with low friction, for example, the leveling device 48 of the first embodiment can be omitted.

In addition, according to the second embodiment, the substrate stage device 220 includes the leveling sensor 62 that measures the position of the substrate holder 232 in the Z-axis direction, the number of the leveling sensor 62 and the weight elimination mechanism 243 The number is the same. Thereby, the air volume of the air spring 271 of each weight elimination mechanism 243 and the measurement result obtained by the corresponding leveling sensor 62 can be easily correlated, so that the posture control of the substrate holder 232 becomes easy.

Furthermore, according to the second embodiment, the substrate stage device 220 includes a substrate holder 232 that holds the substrate P, and is capable of moving within a movement reference plane including the X-axis direction and the Y-axis direction orthogonal to the X-axis direction. The micro-movement stage 222, and the distance from the moving reference plane to the center of gravity of the micro-movement stage 222 in the Z axis direction orthogonal to the moving reference plane is longer than the distance from the moving reference plane to the substrate holder 232 The distance in the Z-axis direction from the supporting position. Thereby, the substrate holder 232 whose rigidity is increased by thickening the thickness in the Z-axis direction can be used to maintain the substrate P with a higher flatness.

(Modification 1)

20 is a diagram showing a schematic configuration of a substrate stage device 220A of Modification 1 of the second embodiment. FIG. 21 is an exploded view of the micro-movement stage 222A of Modification 1.

As shown in FIG. 21, a ball joint (ball joint) 275 is attached to the upper surface of the sliding portion 273A of each weight reduction mechanism 243A of the weight reduction device 242A of Modification 1.

On the other hand, the support portion SC1 of the substrate holder 232A of Modification 1 is formed with a receiving surface 232b that receives the ball joint 275 through a conical hole, a V-shaped groove, or the like.

Each weight elimination mechanism 243A is embedded in the substrate holder 232A through the ball joint 275, so the weight elimination device 242A is mechanically connected to the substrate holder 232A. Thereby, with the voice coil motor 40 installed on the substrate holder 232A, the weight reduction device 242A also moves together with the substrate holder 232A, so the flexible member 247 can be omitted. Thereby, it is possible to suppress the interference generated by the X coarse motion stage 26 from being transmitted to the weight elimination device 242A through the flexible member 247.

Furthermore, in Modification 1, the voice coil motor 40 is installed at the height of the center of gravity of the micro-movement stage 222A where the substrate holder 232A and the weight elimination device 242A are connected, and drives the micro-movement stage 222A, so that the substrate holder 232A and the weight Compared with the second embodiment in which the cancellation device 242A is not connected, the mounting position to the substrate holder 232A is lower.

Since the other structure is the same as that of the second embodiment, detailed description is omitted.

(Modification 2)

In Modification 2 of the second embodiment, the structure of the weight elimination device and the substrate holder is changed. 22(A) is a top view of the weight reduction device 242B of Modification 2, FIG. 22(B) is a side view of the weight reduction device 242B, and FIG. 22(C) is a bottom view of the substrate holder 232B of Modification 2. In addition, FIG. 23(A) is an assembly diagram of the micro-movement stage 222B, and FIG. 23(B) is a summary of the modification 2 of the second embodiment The figure obtained by modeling the quantity elimination device 242B.

The weight elimination device 242B of the modification 2 includes the weight elimination device 242A of the modification 1 and a weight 244 for adjusting the center of gravity. The weight 244 includes three weight portions 244a and a connecting plate 244b, and the three weight portions 244a are connected into a triangular shape by the connecting plate 244b. A target plate 64 is provided on each of the connecting plates 244b.

The weight 244 is adhered to the weight elimination device 242A in such a way that the position of the center of gravity in the XY plane overlaps with the weight elimination device 242A, and the weight elimination device 242 and the weight 244 are integrated.

A through hole 232c is provided on the bottom surface of the substrate holder 232B corresponding to the weight portion 244a.

The weight elimination device 242B is equipped with a weight 244, so in the Z-axis direction, its center of gravity position is approximately the same as the position where the weight elimination device 242A and the substrate holder 232 are connected as shown in FIG. 23(B). As a result, even if the substrate holder 232B is driven in the horizontal direction as shown by the arrow AR1, the weight reduction device 242B does not follow it without swinging. When the X coarse motion stage 26 is driven, especially during acceleration and deceleration, the fine motion stage The positioning accuracy of 222B is also stable.

Furthermore, in Modification 2, the weight portion 244a has a function as an air box for storing air inside, and may also be configured to communicate with the air spring 271 of each weight elimination mechanism 243. Thereby, even if each air spring 271 is small, the volume can be increased, and the spring constant (rigidity) of the air spring 271 can be reduced. This can suppress the transmission of vibration in the Z-axis direction.

(Modification 3)

In Modification 3 of the second embodiment, the so-called bracket type X coarse-movement stage that moves following the substrate holder is abolished, and the coarse-movement stage is configured to have only a single-axis stage driven in the Y-axis direction .

FIG. 24 is a diagram showing a schematic configuration of a substrate stage device 220C according to Modification 3 of the second embodiment. FIG. 25 is a side view in the Y-axis direction of the substrate stage device 220C. Figure 26 series substrate stage mounting Top view of 220C. FIG. 27 is a diagram showing the Y step guide 244C, the base frame 230C, and the weight reduction device 242A.

The substrate stage device 220C of the modification 3 includes a fine movement stage 222C, a Y coarse movement stage 224C, and a pair of base frames 230C.

The stator 276b of the following Y linear motor 276 is fixed to the base frame 230C.

As shown in FIG. 24, the micro-movement stage 222C includes a substrate holder 232C and a weight reduction device 242A. The rotor 235a of the X/Y axis 2DOF motor 235 is fixed to the side surfaces of the substrate holder 232C on the +Y side and -Y side in parallel with the Y axis, respectively. In addition, the rotor 237a of the X/Z axis 2DOF motor 237 is fixed downward on the +Y side and -Y side of the substrate holder 232C, respectively. Furthermore, the so-called 2DOF motor is a linear motor capable of generating driving forces in two orthogonal axial directions by a pair of stators and rotors. Therefore, the X/Y-axis 2DOF motor 235 is a motor that generates driving forces in the two axis directions of the X-axis and the Y-axis.

The Y coarse motion stage 224C is arranged under the fine motion stage 222C (-Z side) and is on a pair of base frames 230C. As shown in FIG. 24, the Y coarse motion stage 224C has a pair of X beams 236C configured in an L shape. The X beam 236C is combined with a member having a rectangular YZ cross section to form an L-shape. The pair of X beams 236C are arranged in parallel at a predetermined interval in the Y-axis direction. A pair of X beams 236C are placed on a pair of base frames 230C through a mechanical linear guide device 238C. The rotor 276a of the Y linear motor 276 is fixed on the lower surface of the Y coarse motion stage 224C. With the Y linear motor 276, the Y coarse motion stage 224C is freely movable along the Y axis direction on the pair of base frames 230C.

A stator 235b of an X/Y axis 2DOF motor 235 is fixed to each of the inner surfaces of the X beam 236C of the Y coarse motion stage 224C on the +Y side and the -Y side corresponding to the rotor 235a. In addition, the stator 237b of the X/Z axis 2DOF motor 237 is fixed to the inner bottom surface of the X beam 236C of the Y coarse motion stage 224C corresponding to the rotor 237a.

The rotor 235a and the stator 235b constitute an X/Y axis 2DOF motor 235 of a Lorentz force driving method as disclosed in, for example, Japanese Patent Application Laid-Open No. 2000-078830. X/Y axis 2DOF motor 235 can drive the micro-motion stage 222C with a long stroke along the X-axis direction, and can drive with a small stroke along the Y-axis direction. In addition, the rotor 237a and the stator 237b constitute the X/Z-axis 2DOF motor 237 of the Lorentz force driving method similarly to the X/Y-axis 2DOF motor 235. The X/Z-axis 2DOF motor 237 can drive the micro-motion stage 222C with a long stroke in the X-axis direction and can drive with a small stroke in the Z-axis direction.

In addition, an upstream scale 72 is attached to the upper surface of the X beam 236C.

As shown in FIGS. 24 and 25, the Y step guide 244C is placed on the seat frame 18c through a mechanical linear guide device 239C. In addition, the rotor 276a of the Y linear motor 276 is fixed to the Y step guide 244C, whereby the Y step guide 244C is separated from the Y coarse motion stage 224C on the seat frame 18c to move freely in the Y axis direction. Furthermore, the stator 276b of the Y linear motor 276 is used together with the rotor 276a installed on the Y coarse motion stage 224C.

Since the other structure is the same as that of Modification 2, detailed description is omitted.

In Modification 3, the two-axis holder stage that moves in the XY direction following the substrate holder is a single-axis stage that can move only in the Y-axis direction. It is to achieve the following structure, that is, by connecting three weight elimination mechanisms, the weight elimination device can be erected, and the substrate holder can be erected by mechanically connecting with the substrate holder, and the weight is not pulled separately Elimination device. That is, it can be realized because the coarse motion stage does not need to follow the substrate holder and assist the substrate holder.

In addition, in Modification 3, the stators of the 2DOF motor are arranged in pairs in the configuration Y so that the substrate holder 232C can be driven in the X-axis direction and the Y-axis direction, and the X-axis direction and the Z-axis direction. One of the coarse movement stages 224C is a pair of X beams 236C. A plurality of rotors mounted on the substrate holder 232C are arranged correspondingly so as to be able to drive θz and θx and θy. In addition, the X driving position and the Y driving position are located near the height of the overall center of gravity after the substrate holder 232C and the weight elimination device 242A are aligned.

Furthermore, in Modification 3, the Y coarse motion stage 224C including a pair of X beams 236C extends in the Y-axis direction, and can move along the linear guide rails provided on a pair of base frames 230C on the floor. The movement in the Y-axis direction is driven by a pair of Y linear motors 276, and positioning control is performed by a Y linear encoder not shown. In addition, the Y step guide 244C that can be moved in the Y-axis direction on the exposure apparatus body is also driven by the stator 276b of the Y linear motor 276 and a plurality of individually installed rotors 276a. Furthermore, the arrangement height of the Y linear motor 276 is arranged so as to be near the height of the center of gravity of the Y step guide 244C.

With this configuration, the mechanical connection between the Y coarse motion stage 224C and the substrate holder 232C and the weight reduction device 242A is completely blocked, and vibration from the outside or driving reaction force will not enter the substrate holder 232C. Therefore, precise positioning control can be performed. In addition, the structure of the coarse movement stage becomes simple.

Furthermore, the coarse motion stage of the substrate stage device 220C is a uniaxial stage that can move in the horizontal scanning (Y-axis) direction. Since the Y step guide 244C moves along the Y-axis direction, the common linear motor stator 276b can be used for simultaneous driving. Furthermore, since the Y step guide and the coarse motion stage are both stationary during scanning, there will be no vibration during scanning.

(Modification 4)

In the above-mentioned modification 3, the Y coarse motion stage is a single-axis stage, but the X coarse motion stage may be a single-axis stage. FIG. 28 is a plan view of a substrate stage device 220D of Modification 4 of the second embodiment, and FIG. 29 is a side view of the substrate stage device 220D.

In Modification 4, the stators of the 2DOF motor are arranged in pairs to form X coarse motion so that the substrate holder 232D can be driven in the X-axis direction, the Y-axis direction, and the Y-axis direction and the Z-axis direction. A pair of Y beam 250 is one of carrier 226D.

In Modification 4, the Y step guide is set as a fixed large platen 244D. Thereby, the Y beam 250, which is the main structure of the X coarse motion stage 226D, can be shortened in accordance with the step movement distance.

In addition, instead of using the fixed platen, the Y step guide may be used in the same way as before. In this case, only need to install a drive device to drive the Y step guide along the Y axis OK. In addition, the position and number of linear encoders for positioning the substrate holder can be freely determined. Also, instead of using an encoder, a laser interferometer may be used.

(Modification 5)

The micro-motion stage of the first embodiment and its modified examples can also be supported by the weight reduction device 242 of the second embodiment.

FIG. 30 is a diagram showing a substrate stage device 220E of Modification 5 of the second embodiment. The central portion of the lower surface of the substrate holder 232E and the stage body 234E of Modification 5 does not form a quadrangular pyramid or a quadrangular prism depression when viewed from the lower surface of the substrate holder 232E and the stage body 234E, but is substantially flat. The substrate holder 232E is fixed to the stage body 234E by bolts B1. In addition, on the lower surface of the carrier body 234E, three supporting surfaces are provided corresponding to the weight elimination mechanisms 243 of the weight elimination device 242, and the carrier body 234E is supported by the weight elimination device 242 through an air bearing 245 .

The voice coil motor 40 and the leveling sensor 62 are mounted on the stage body 234E. Thereby, when replacing the substrate holder 232E, the bolt B1 can be removed, and the substrate holder 232E can be removed from the stage body 234E, so there is no need to remove the voice coil motor 40 and leveling from the substrate holder 232E. The detector 62 is removed, and the substrate holder 232E can be easily replaced.

Moreover, by separately controlling the pressure of the air spring in the weight reduction device 242, the substrate holder 232E and the stage body 234E can be driven in the Z-axis direction and the tilt direction (thetax direction and thetay direction), so there is no need for the stage body The 234E is provided with a leveling device that drives the stage body 234E in the Z-axis direction, for example, at least 3 voice coil motors capable of Z-drive. Furthermore, it can also be set as a configuration with a leveling device. By separately controlling the pressure of the air spring in the weight elimination device 242, the stage body 234E can be driven in the Z-axis direction and the tilt direction (θx direction and θy direction), but there is a problem that precise Z-axis position alignment cannot be performed The possibility. Therefore, it is also possible to use the air spring in the weight elimination device 242 as a coarse motion drive system for driving the substrate holder 232E in the Z-axis direction, and a voice coil motor as a fine motion drive system. In this configuration, the drive of the voice coil motor drive substrate holder 232E can be reduced. Momentum, therefore, it is sufficient to install a small voice coil motor on the stage body 234E.

(Modification 6)

Modification 6 of the second embodiment is obtained by changing the configuration of Modification 5. FIG. 31 is a diagram showing a schematic configuration of a substrate stage device 220F of Modification 6. FIG.

As shown in FIG. 31, a ball joint JB1 is adhered to the lower surface of the substrate holder 232F of Modification 6. In addition, a leveling sensor 62 is provided downwardly on the lower surface of the substrate holder 232F. On the inner bottom surface of the carrier body 234F, a receiving surface 234a is formed by a conical hole or a V-shaped groove corresponding to the ball joint JB1. Thereby, the substrate holder 232F and the stage body 234F are embedded, so there is no need to fix the two with bolts or the like. Therefore, the position where the substrate holder 232F is supported by the stage body 234F and the position where the weight reduction device 242 supports the stage body 234F can be aligned in the XY plane. That is, in the movement reference plane, the position where the weight reduction device 242 supports the stage body 234F is the position where the stage body 234F supports the three ball joints JB1 of the substrate holder 232F. Thereby, the flatness of the substrate holder 232 is not easily affected by the deformation of the carrier body (that is, the carrier body is not easily deformed). Furthermore, the reason why the leveling sensor 62 is disposed downward on the lower surface of the substrate holder 232F is as described in the modification 3 of the first embodiment.

≪The third embodiment≫

In the third embodiment, in order to improve the yield and workability of the replacement operation of the substrate holder, the substrate stage device forms a substrate mounting surface with a plurality of suction cups that can be attached to and detached from the substrate holder. When the substrate holder directly supports and holds the substrate, the upper surface of the substrate is worn away by friction or the like due to the replacement of the substrate. It is hard to say that the upper surface of the worn-out substrate holder has a higher flatness. The substrate holder can be appropriately replaced with a higher flatness, but the replacement operation is hard to say. Therefore, in the third embodiment, the substrate mounting surface is formed by using a plurality of suction cups that can be attached to and detached from the substrate holder, which facilitates maintenance. In addition, in the third embodiment, the same or similar components as those in the first and second embodiments and their modifications are denoted by the same reference numerals, and the details are omitted. Description.

32(A) is a top view of the micro-movement stage 422 of the third embodiment, FIG. 32(B) is a cross-sectional view of the micro-movement stage 422, and FIG. 32(C) is an exploded view of the micro-movement stage 422. 33(A) and 33(B) are respectively a plan view and a bottom view of the substrate holder 432 of the third embodiment. 34(A) is an exploded view of the suction cup 431 enlarged, and FIG. 34(B) is an assembly diagram of the suction cup 431.

As shown in FIG. 32(B), the micro-movement stage 422 is equipped with the insertion hole part 439, the suction cup part 431, the board|substrate holder 432, and the weight elimination device 442. Furthermore, the substrate holder 432 is different from the substrate holders shown in the first embodiment (including its modification examples) and the second embodiment (including its modification examples), and is not a device that directly supports and holds the substrate P.

The substrate holder 432 is provided with a through hole 432a for inserting a tool for rotating the adjustment screw 437 described below. In addition, a leveling sensor 62 is installed on the lower surface of the substrate holder 432 as shown in FIG. 33(B). Furthermore, the material of the substrate holder 432 is preferably CFRP material or nickel steel material with higher rigidity and smaller linear expansion coefficient.

As shown in FIG. 32(C), the suction cup portion 431 includes a suction portion 435 for sucking and holding the substrate, a pivot bearing connecting member 436, an adjustment screw 437, and a plug portion 438.

As shown in FIG. 33(A), the insertion hole 439 is installed on the upper surface of the substrate holder 432. As shown in Figure 33(A) and Figure 34, the insertion hole 439 is formed with a hole 439a for inserting a tool for rotating the adjustment screw 437 from below the substrate holder 432; a plurality of fastening inserts Hole (clamp socket) 439b, which fits with the fastening plug 438b of the plug portion 438 described below; and the air connector 439c (refer to FIG. 34(A)), which is used to draw the plug portion 438 Suction is fixed to the socket part 439.

As shown in FIG. 34(A), the suction part 435 has a recess 435a into which the pivot bearing connecting member 436 is fitted. In addition, a plurality of minute holes (not shown) are formed on the upper part of the suction part 435, which can be used by passing air supplied through the air connector 435b or sucking the air between the suction part 435 and the substrate P. On the other hand, the substrate P is sucked or released to float the substrate P. As the material of the adsorption part 435, although it is difficult to increase in size, ceramics which are high in rigidity and hardness and suitable for high-precision processing are preferable.

The pivot bearing connecting member 436 has a pivot bearing connecting surface 436a for receiving a spherical pivot 437a formed at the front end of the adjusting screw 437 described below.

The plug portion 438 has a screw hole 438 a to be coupled with the adjusting screw 437. In addition, the plug portion 438 has a fastening plug 438b fitted with the fastening hole 439b of the socket portion 439.

As shown in FIG. 34(B), the suction cup part 431 can adjust the height of the suction part 435 by rotating the adjustment screw 437 screwed to the screw hole 438a of the plug part 438 having a plurality of fastening plugs 438b ( Position in the Z-axis direction). In addition, by adjusting the pivot 437a of the screw 437 and the pivot bearing contact surface 436a, the suction portion 435 can perform a head swing movement. Therefore, the posture (θx, θy) of the suction unit 435 can be adjusted.

After adjusting the height and posture of the suction portion 435, the pivot 437a of the adjusting screw 437 and the pivot bearing connecting member 436 are fixed with an adhesive, and the adjusting screw 437 and the plug portion 438 are fixed with an adhesive. Thereby, the height and posture of the suction part 435 can be fixed.

The plug portion 438 and the socket portion 439 can be easily attached and detached by supplying air to the air joint 439c. As the fixing device including the plug portion 438 and the socket portion 439, for example, Zero Clamp manufactured by ZeroClamp, Germany, or Pallet clamp, Pascal, Japan, can be used.

(Assembly method of micro-motion stage 422)

Next, an assembling method of the micro-motion stage 422 having the above-mentioned configuration will be described with reference to FIGS. 35(A) to 36(C).

First, as shown in FIG. 35(A), the surface grinder or lapping is performed on each of the suction parts 435 on the processing platen PP1, and the flatness of the upper surface is finished on the suction part 435 alone. . Furthermore, since the height can be adjusted by the adjustment screw 437, in this step, the height of the suction portion 435 may not be uniform.

Next, as shown in FIG. 35(B), the substrate holder 432 is processed individually, and the insertion hole 439 is mounted on the upper surface of the substrate holder 432 while positioning. Furthermore, the processing of the upper surface of the substrate holder 432 does not require high-precision processing for precise processing of the overall flatness. However, when the insertion hole 439 is mounted on the upper surface of the substrate holder 432, it is more effective to process the upper surface of the substrate holder 432 to a certain degree (flatness finishing). The height of the upper surface of the receptacle portion 439 is approximately equal, so that the adjustment time can be shortened when adjusting the posture of the suction portion 435 described below.

Next, as shown in FIG. 35(C), in a state where the adjustment screw 437 is temporarily assembled to the plug portion 438, the plug portion 438 is attached to the socket portion 439. The plug portion 438 can be installed in the plug portion 439 in a state where high-pressure air is supplied through the air connector 439c. If the supply of air is stopped, the plug portion 438 is fixed to the plug portion 439.

Next, as shown in FIG. 36(A), the suction portion 435 with the pivot bearing connecting member 436 is turned upside down, that is, so that the surface of the substrate is placed in contact with the upper surface of the processing platen PP1 whose flatness has been achieved The way is arranged in a row. Furthermore, the pivot bearing connecting member 436 is described as being detachable from the suction part 435, but it may be integrally formed as the suction part 435. The flatness of the processing platen PP1 is more than the flatness calculated using the flatness of the mounting surface of the substrate P. The processing platen PP1 is, for example, a stone platen of grade 00 or higher.

Next, as shown in FIG. 36(B), the substrate holder 432 is turned upside down and placed on the suction part 435. Next, through the through hole 432a of the substrate holder 432, use the jig JG1 to turn the adjustment screw 437 to adjust the height and posture (angle) of the suction part 435 relative to the substrate holder 432 in a way that imitates the flatness of the processing platen PP1 . At this time, since the pivot 437a of the adjusting screw 437 is pre-coated with adhesive, the adhesive is hardened after adjustment, so that the height and posture of the suction portion 435 are fixed. Furthermore, after adjusting the height and posture of the suction part 435 by the adjustment screw 437, an adhesive is also applied to the adjustment screw 437 to fix the adjustment screw 437 to the plug part 438.

After the adhesive is hardened, the substrate holder 432 is reversed up and down as shown in FIG. 36(C), and the flatness is measured. The flatness of the substrate suction surface formed by the upper surface of the plurality of suction parts 435 is replicated with the flatness of the processing platen PP1 for confirmation and inspection. The flatness inspection can be carried out using a three-dimensional measuring machine or a height measuring machine, a high-precision level, an automatic collimator system, etc. In addition, the substrate holder 432 has a structure with an increased thickness in order to have a predetermined rigidity. The reason is that if the substrate holder 432 is deformed due to thermal deformation or the like, the suction cup portion 431 placed on the substrate holder 432 is also enlarged and deformed.

(How to replace the suction cup 431)

Next, the replacement method of the suction cup part 431 will be described using FIGS. 37(A) to 37(C).

In the case of replacing the suction cup 431, first, as shown in FIG. 37(A), air is supplied to the insertion hole 439 through the air connector 439c, the insertion of the insertion hole 439 and the plug portion 438 are released, and the suction cup 431 Unload.

Next, as shown in FIG. 37(B), the new suction cup part 431 is attached to the insertion hole part 439.

Next, as shown in Figure 37(C), the reference rod JG2 that has achieved flatness (equivalent to the flatness of the processing platen PP1) is placed on the upper surface of the suction part 435 so as to span a plurality of suction parts 435. , Press the replaced suction cup part 431 against the reference rod JG2 to adjust the height and posture (angle) of the suction part 435. Thereby, the flatness of the reference rod JG2 can be copied to the suction part 435. Furthermore, the height and posture of the suction part 435 in the center can be adjusted by inserting the jig JG1 into the horizontal hole 432b formed in the substrate holder 432 (refer to FIG. 37(C)), without making the substrate holder 432 up and down In reverse. Thereby, it is also possible to replace the suction cup part 431 not on the processing platen PP1, but in a state where the substrate holder 432 is placed on the weight removing device 442.

As described in detail above, according to the third embodiment, the fine movement stage 422 has: a substrate holder 432 having a support portion SC1; and a plurality of suction cup portions 431 (object holding structure Parts), which form a placement surface on which the substrate P (object) is placed; the suction cup portion 431 is detachably installed with respect to the substrate holder 432. With this, when a part of the suction cup part 431 is defective, it is not necessary to replace the substrate holder 432, but only the suction cup part 431 that has the defective part needs to be replaced. Therefore, maintenance becomes easy and maintenance costs can be reduced. .

Specifically, since the suction portion 435 of each suction cup portion 431 has a relatively high flatness, it is possible to locally readjust the flatness of the substrate placement surface in a short time. In addition, since the substrate holder 432 to which the suction cup part 431 is installed does not require particularly high-precision planar processing and the like and can be manufactured separately, the manufacturing cost can be reduced. Furthermore, since the suction part 435 of the suction cup part 431 only needs to be machined separately to complete the flatness separately, the processing can be easily performed and the processing can be performed with high precision.

Furthermore, according to the third embodiment, the plurality of suction cup parts 431 can be adjusted in posture with respect to the substrate holder 432. In this way, the flatness of the substrate mounting surface is not only achieved by the mechanical processing of the substrate holder 432, but can be achieved by both processing and assembly adjustment.

In addition, according to the third embodiment, the micro-movement stage 422 is provided with a plurality of insertion holes 439 provided on the upper surface of the substrate holder 432, and a plurality of suction cup parts 431, which have a holding surface for holding the substrate P , And can be attached to and detached from the plurality of insertion holes 439 respectively. With this, when a part of the suction cup part 431 is defective, it is not necessary to replace the substrate holder 432, but only the suction cup part 431 that has the defective part needs to be replaced. Therefore, maintenance becomes easy and maintenance costs can be reduced. .

Furthermore, according to the third embodiment, each of the suction cup parts 431 can adjust the posture with respect to the substrate holder 432. Specifically, the suction cup portion 431 has an adjustment mechanism (pivot 437a and pivot bearing connecting member 436) for adjusting the height and posture of the suction portion 435, and the suction portion 435 is finely adjusted by each having a higher flatness ( Assembly) Achieve the flatness of the substrate placement surface (the overall flatness). In this way, the flatness of the substrate mounting surface is not only achieved by the mechanical processing of the substrate holder 432, but can be achieved by both processing and assembly adjustment. Furthermore, the height and posture of the suction part 435 are adjusted It can be performed only by pressing against the moving reference surface (processing platen PP1), so the work can be simplified.

(Modification 1)

FIG. 38(A) is a plan view showing the structure of the micro-movement stage 422A of Modification 1 of the third embodiment, and FIG. 38(B) is a partial cross-sectional view of the micro-movement stage 422A. As shown in FIG. 38(B), on the bottom surface of the substrate holder 432A, similarly to the substrate holder 232 of the second embodiment, three air bearings 245 may be respectively rotatably mounted. Since the other structure is the same as that of the third embodiment, detailed description is omitted.

(Modification 2)

FIG. 39 is a diagram showing a schematic configuration of a substrate stage device 420B of Modification 2 of the third embodiment. As shown in FIG. 39, the suction cup part 431B may have a socket part 439B, and the plug part 438B is mounted on the substrate holder 432. Furthermore, the substrate measurement system is installed in the substrate holder 432 such that the height of the measurement position is substantially equal to the front surface of the suction part 435.

(Modification 3)

FIG. 40(A) is a diagram showing the structure of a suction cup portion 431C of Modification 3 of the third embodiment, and FIG. 40(B) is a plan view of a receptacle portion 439C of Modification 3 of the third embodiment.

The plug portion 438C of the suction cup portion 431C of Modification 3 is provided with a slope adjustment screw 438d for adjusting the slope of the suction portion 435. The adjustment screw 438d has 3 points on the socket 439C.

As shown in FIG. 40(B), the insertion hole 439C of Modification 3 is provided with a hole 439a for inserting a tool for rotating the adjustment screw 437 from below, a fastening hole 439b, and a hole 439d for the slope adjustment screw.

In Modification 3, the posture of the suction part 435 can be adjusted not only by pressing the upper surface of the suction part 435 against the processing platen with the adjustment screw 437 in the center, but also by pushing and pulling the 3 slope adjustment screws 438d respectively. get on. According to this configuration, after adjusting the posture of the suction part 435, the slope adjustment screw 438d can be adhered to the lower surface of the suction part 435 to fix the posture of the suction part 435 and Maintain with higher strength.

(Modification 4)

FIG. 41 is a diagram showing a schematic configuration of a substrate stage device 420D of Modification 4 of the third embodiment. FIG. 42 is a top view of the substrate holder 432D of Modification 4. FIG. 43(A) is an exploded view of the suction cup part 431D of Modification 4, and FIG. 43(B) is an assembly view of the suction cup part 431D of Modification 4.

As shown in FIG. 42, the insertion holes 439D of Modification 4 each have one fastening insertion hole 439b, which is provided on the upper surface of the substrate holder 432D at a position corresponding to the fastening plug 438b.

In addition, in Modification 4, as shown in FIGS. 43(A) and 43(B), the height of the plug portion 438D that can replaceably support the suction cup portion 431D is lower than that of the third embodiment and its modification 1~ 3. The interval between the fastening plugs 438b is widened. Therefore, it is less likely to be affected by the local deformation (time-dependent, due to heat) of the substrate holder 432D, and the deformation amount of the upper surface of the suction portion 435 can be suppressed to be smaller than that of the third embodiment and its modifications 1 to 3.

More specifically, in the case where the interval W between the fastening plugs 438b is wide as shown in FIG. 44(A), it is not easy to receive the partial time of the substrate holder 432D as shown in FIG. 44(B) The influence of deformation or thermal deformation. In addition, since the height H from the upper surface of the substrate holder 432D to the upper surface of the suction portion 435 is low, the error in the Z-axis direction becomes smaller. On the other hand, for example, in the suction cup part 431 of the third embodiment, since the interval W between the fastening plugs 438b is narrow as shown in FIG. 44(C), it is easy as shown in FIG. 44(D) Affected by partial temporal deformation or thermal deformation of the substrate holder 432. In addition, since the height H from the upper surface of the substrate holder 432 to the upper surface of the suction portion 435 is relatively high, the error in the Z-axis direction is relatively large.

In addition, in Modification 4, in order to reduce the height of the plug portion 438D, the tapered portion 435e of the suction portion 435 and the tapered hole 438e of the plug portion 438D are arranged with a gap G1 as shown in FIG. 43(B) . Therefore, after the posture of the suction portion 435 is adjusted, the suction portion 435 and the plug portion 438D can be firmly fixed with an adhesive.

(Modification 5)

FIG. 45 is a diagram showing a schematic configuration of a substrate stage device 420E of Modification 5 of the third embodiment. Fig. 46(A) is an exploded view of the suction cup part 431E of Modification 5, Fig. 46(B) is a plan view of the receptacle part 439E of Modification 5, and Fig. 46(C) is a bottom view of the plug part 438E of Modification 5 Fig. 46(D) is an assembly diagram of the suction cup part 431E of Modification 5.

In Modification 5, instead of using one adjustment screw 437 to support the suction portion 435E, the point supported by a plurality of (3 or more) adjustment screws 437 is different from the suction cup portion 431 of the third embodiment.

As shown in FIG. 46(A), the suction portion 435E of the suction cup portion 431E of Modification 5 is provided with a plurality of recesses 435a for accommodating the pivot bearing member 436 corresponding to the plurality of adjustment screws 437, respectively. Furthermore, the suction portion 435E and the pivot bearing connecting member 436 may also be integrally formed.

As shown in FIG. 46(C), the plug portion 438E of Modification 5 is located outside the tightening plug 438b and has a plurality of screw holes 438a (3 in Modification 5) for screwing with the adjustment screw 437 . In addition, the fastening plugs 438b are arranged at a small pitch at a center and not to deform the substrate holder 432E due to the reaction force when the suction portion 435E is pressed by the adjustment screw 437.

In addition, as shown in FIG. 46(B), the insertion hole portion 439E is formed to be smaller than the screw hole 438a of the plug portion 438E in order not to block the through hole 432a formed in the substrate holder 432E and the screw hole 438a of the plug portion 438E. C) The trapezoidal shape of the plug portion 438E shown.

In Modification 5, the suction cup part 431E does not have the adjustment screw 437 at the center, but three adjustment screws 437 are used to adjust the height and posture (θx, θy) of the suction part 435E. Furthermore, in Modification 5, θz is uniquely determined by the positional relationship between the three adjusting screws 437 and the pivot bearing connecting member 436, so no adjustment is required.

Therefore, in Modification 5, the height and posture (θx, θy) of the suction portion 435E are adjusted by pushing and pulling each of the plurality of adjustment screws 437, and the posture after adjustment is not only relying on the adhesive but firmly. Fix and maintain.

Moreover, in Modification 5, since it is not necessary to arrange the adjustment screw 437 at the center of the plug portion 438E, the air supply port AP1 can be arranged at the center as shown in FIGS. 45 and 46(D).

Since the other structure is the same as that of the third embodiment, detailed description is omitted.

(Modification 6)

Modification 6 is another example of the replacement method of the suction cup part. In Modification 6, using the tool JG3 shown in FIG. 47, the suction cup portion 431E is removed. In addition, since the structure of the substrate stage device is the same as that of Modification 5, detailed description is omitted.

The suction portion 435E of each suction cup portion 431E is provided with a plurality of micro holes, and the suction portion 435E can suck or de-adsorb the substrate P by blowing/suction air from the micro holes. In Modification 6, this mechanism is used to replace the suction cup 431E.

That is, the tool JG3 is used to vacuum suck the chuck portion 431E to be removed on the tool JG3, and the fine movement stage 422E is driven in the -Z direction. Thereby, only the suction cup part 431E to be removed is left without falling while maintaining the state of being sucked to the tool JG3. In this way, the suction cup part 431E can be easily removed. Furthermore, instead of driving the micro-movement stage 422E in the -Z direction, the suction cup part 431E may be sucked to the tool JG3, and the tool JG3 may be lifted in the +Z direction to remove the suction cup part 431E.

Furthermore, in the above-mentioned third embodiment and its modification examples, the smaller area of the upper surface of the suction part is not easily affected by the deformation of the substrate holder, but considering the operability, it is preferable to arrange on the upper surface of the substrate holder 6 to 20 suction parts.

Furthermore, in the above-mentioned first to third embodiments and their modifications, the arrangement of the leveling sensor 62 and the target plate 64 may be reversed.

Furthermore, in the above-mentioned first to third embodiments and their modification examples, the substrate holder may be provided with two or more support portions SC1.

In addition, it is also possible to appropriately combine the above-mentioned first to third embodiments and their modifications. For example, it can also be used as a substrate that can be used in the first embodiment and its modifications, and the second embodiment and its modifications. The socket part 439 of the third embodiment is mounted on the upper surface of the holder, and the suction cup part 431 is mounted. Thereby, as long as the flatness of the substrate placement surface can be completed by assembling the suction cup part 431, it is not necessary to process the flatness of the substrate holder with high precision. In addition, since the suction cup part 431 is separated from the substrate holder, assembly and replacement operations can be easily performed.

In addition, in each of the above-mentioned embodiments, an equal magnification system is used as the projection optical system 16, but it is not limited to this, and a reduction system or an enlargement system may be used.

The exposure device is described as a projection exposure device that is a step-and-scan method of exposure objects, so-called scanners, but it can also be a step-type exposure device in which the projection area is approximately the same size as the exposure object area .

The use of the exposure device is not limited to the exposure device for liquid crystal that transfers the pattern of the liquid crystal display device to the square glass plate. For example, it can also be widely used in exposure devices and semiconductors for the manufacture of organic EL (Electro-Luminescence) panels. Exposure devices for manufacturing, exposure devices for manufacturing thin film magnetic heads, micromachines, and DNA chips. In addition, it can be applied not only to micro-elements such as semiconductor devices, but also to make masks or photomasks used in photoexposure equipment, EUV exposure equipment, X-ray exposure equipment, and electron beam exposure equipment. The pattern is transferred to the exposure device such as glass substrate or silicon wafer.

In addition, the substrate to be exposed is not limited to a glass plate, and may be, for example, wafers, ceramic substrates, film members, or other objects such as mask blanks. In addition, when the exposure target is a substrate for a flat panel display, the thickness of the substrate is not particularly limited. For example, a film-like (a flexible sheet-like member) is also included. Furthermore, the exposure apparatus of the present embodiment is particularly effective when the length of one side or the substrate with a diagonal length of 500 mm or more is the object of exposure. In addition, when the substrate to be exposed is a flexible sheet, the sheet may also be formed in a roll shape.

"Component Manufacturing Method"

Next, a description will be given of a method of manufacturing a micro device using the exposure device equipped with the substrate stage device of the above-mentioned embodiments in the lithography step. In the exposure apparatus equipped with the substrate stage device of the above-mentioned embodiment, by forming a predetermined pattern (circuit pattern, electrode pattern, etc.) on the substrate, a liquid crystal display device as a micro element can be obtained.

<Pattern Formation Step>

First, a so-called photolithography step is performed to form a pattern image on a photosensitive substrate (a glass substrate coated with a resist, etc.) using an exposure device equipped with the substrate stage device of each of the above-mentioned embodiments. Through this photolithography step, a predetermined pattern including a plurality of electrodes and the like is formed on the photosensitive substrate. After that, the exposed substrate is passed through various steps such as a development step, an etching step, and a resist stripping step, thereby forming a predetermined pattern on the substrate.

<Color filter forming step>

Secondly, a group of 3 points corresponding to R (Red, red), G (Green, green), and B (Blue, green) are arranged in a matrix, or 3 points of R, G, and B are arranged in a matrix. A group of striped filters is a color filter formed by arranging multiple groups along the horizontal scanning line.

<Unit assembly steps>

Next, a liquid crystal panel (liquid crystal cell) is assembled using the substrate with a predetermined pattern obtained in the pattern forming step, and the color filter obtained in the color filter forming step. For example, liquid crystal is injected between the substrate with a predetermined pattern obtained in the pattern forming step and the color filter obtained in the color filter forming step to manufacture a liquid crystal panel (liquid crystal cell).

<Module assembly steps>

After that, various parts such as a circuit and a backlight device to perform the display operation of the assembled liquid crystal panel (liquid crystal cell) are installed to complete the liquid crystal display device.

In this case, in the pattern formation step, since the exposure device equipped with the substrate stage device of each of the above-mentioned embodiments is used to expose the substrate with high accuracy, it is possible to improve the liquid The productivity of crystal display devices.

The above-mentioned embodiment is the preferred embodiment of the present invention. However, it is not limited to this, and various modifications can be implemented without departing from the gist of the present invention.

18a: Upper frame

18c: Lower seat frame

20: substrate stage device

22: Micro-motion stage

24: Y coarse movement stage

26: X coarse motion stage

28: Self-weight support device

32: substrate holder

34: Carrier body

36: X beam

38: Linear guide device

40: Voice coil motor

42: weight elimination device

44: Y step guide

46: connecting member

48: leveling device

51: Air bearing

54: connecting member

60: 3rd drive system

62: Leveling the sensor

64: target board

68: arm member

72: Upstream Ruler

74: first head

76: Micro-motion stage measurement system

78: Downstream Ruler

80: 2nd head

82: Coarse motion stage measuring system

84: Vernier base

86: Arm member

88, 96: head base

90: arm member

92: Vernier base

94: arm member

P: substrate

Claims (19)

An object carrier device that holds an object, and includes: an object holder that holds the object; a carrier body that supports the object holder; and a self-weight support device that supports the object holder and the carrier The table body; the object holder is supported by the carrier body through a plurality of supporting portions of the object holder, and the carrier body is supported by the self-weight supporting device through the supporting surface of the carrier body, the supporting portion is provided In a position lower than the above supporting surface. The object stage device according to claim 1, wherein the stage body has a plurality of abutting portions respectively abutting on the plurality of the support portions, and the object holder is located in an area surrounded by the plurality of the support portions A first recess is formed at a position higher than the support part, and a convex part is formed in the stage main body so that the area surrounded by a plurality of the contact parts is located at a higher position than the contact part. The convex portion is inserted into the first concave portion to support the object holder. The object carrier device according to claim 2, wherein the carrier body has a second recessed portion formed so that the supporting surface is located at a higher position than the plurality of abutting portions, and the self-weight supporting device is the self-weight The upper end of the support device is inserted into the second recess and supports the support surface. The object carrier device according to any one of claims 1 to 3, wherein the plurality of abutting portions are provided in a manner not to be linearly arranged in the carrier body. The object carrier device according to claim 3, wherein the plurality of abutting parts are It is arranged to surround the center of the above-mentioned carrier body. The object stage device according to claim 2 or 3, which includes a drive device for relatively moving the object holder and the stage body with respect to the self-weight support device, and the drive device is located higher than the support portion In a position, a driving force is applied to the stage body to move the object holder and the stage body relative to the self-weight support device. The object stage device according to claim 6, wherein the drive device is a linear motor including a stator and a rotor that is relatively movable with respect to the stator, and the rotor is installed on the stage at a position higher than the support portion Ontology. The object carrier device according to any one of claims 1 to 3, wherein the object holder has three supporting parts. The object carrier device according to any one of claims 1 to 3, wherein the support portion is located at the lowest part of the object holder. The object stage device according to any one of claims 1 to 3, wherein the object holder is processed in a state of being supported by the pressure plate through the plurality of supporting parts. The object carrier device according to any one of claims 1 to 3, wherein the object holder has: a holding member having the support portion; and a plurality of object holding portions, which form a structure for placing the object Placement surface; The object holding portion is detachably provided with respect to the holding member. The object stage device according to claim 11, wherein the plurality of object holding parts can be adjusted in posture with respect to the holding member. An exposure apparatus comprising: the object stage device according to any one of claims 1 to 3; and a pattern forming device that uses an energy beam to form a predetermined pattern on the object held by the object stage device . The exposure apparatus according to claim 13, comprising a measurement system for measuring the position of the object stage device with respect to the pattern forming device, and the measurement system is at a position substantially equal to the height of the object held by the object holder, Measure the position of the above object carrier device. The exposure apparatus according to claim 13, wherein the above-mentioned object system is a substrate used in a flat panel display. The exposure apparatus according to claim 15, wherein the length or diagonal length of at least one side of the substrate is 500 mm or more. A method for manufacturing a flat panel display includes the following steps: exposing the above-mentioned object using the exposure device as described in claim 13; and developing the above-mentioned object after the exposure. A method for manufacturing an element, which includes the steps of: exposing the above-mentioned object using the exposure device as described in claim 13; and developing the above-mentioned object after the exposure. A holding method, comprising the following steps: holding an object by an object holder; and supporting the carrier body supporting the object holder by its own weight support device; in the supporting step, the carrier body passes through The plurality of support portions of the object holder support the object holder, and the self-weight support device supports the stage body through the support surface of the stage body provided at a higher position than the support portion.

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