WO2008114973A1

WO2008114973A1 - Probe card having planarization means

Info

Publication number: WO2008114973A1
Application number: PCT/KR2008/001468
Authority: WO
Inventors: Jong Hyeon Chae
Original assignee: M2N Inc
Current assignee: M2N Inc
Priority date: 2007-03-16
Filing date: 2008-03-14
Publication date: 2008-09-25
Anticipated expiration: 2009-09-16
Also published as: KR100851392B1

Abstract

Disclosed is a probe card capable of adjusting the planarization thereof. The probe card includes a printed circuit board; a probe substrate electrically connected to the printed circuit board and having a plurality of probes; a first planarization adjusting member for adjusting the planarization of the probe substrate by applying a force to a central area of the probe substrate; a second planarization adjusting member for adjusting the planarization of the probe substrate by applying a force to an outer peripheral area of the probe substrate; and a floating mounting member disposed on the probe substrate to be spaced apart from the printed circuit board, wherein the first planarization adjusting member is disposed at a central area of the floating mounting member.

Description

PROBE CARD HAVING PLANARIZATION MEANS Technical Field

[1] The present disclosure relates to a probe card; and, more particularly, to a probe card capable of adjusting the planarization thereof. Background Art

[2] In general, a probe card is an apparatus to be used in testing a semiconductor device such as a semiconductor memory, a display, and the like during or after a manufacturing process thereof. The probe card electrically connects a wafer with a semiconductor device inspection apparatus to transmit electrical signals from the inspection apparatus to semiconductor dies formed on the wafer and, also, to transmit electrical signals from the semiconductor dies to the inspection apparatus.

[3] FIG. 1 is a cross sectional view of a conventional probe card.

[4] The conventional probe card includes a printed circuit board 30, a space transformer

10 on which a plurality of probes 20 are mounted, an interposer 40 which electrically connects the printed circuit board 30 with the space transformer 10, an orientation adjusting member 60 which adjusts the orientation of the space transformer 10 by applying a pulling force or a pressing force to an outer peripheral area of the space transformer 10, and a deformation compensating member 50 for compensating for a geometrical deformation of the space transformer 10 by applying a pulling force or a pressing force to a central area of the space transformer 10.

[5] The printed circuit board 30 receives an electrical signal transmitted from a semiconductor inspection apparatus, and then relays the received signal to the probes 20.

[6] The space transformer 10 serves to change pitches. That is, an interval between a plurality of contact terminals formed on an upper surface of the space transformer 10 is set to be different from an interval between a multiplicity of contact terminals formed on a lower surface of the space transformer 10. For example, the pitch on the lower surface is narrower than that on the upper surface.

[7] In addition, the space transformer 10 has the probes 20 mounted thereon. The probes 20 make one-to-one contact with a plurality of pads on a wafer so as to transmit electrical signals transmitted from the semiconductor inspection apparatus to semiconductor dies on the wafer. The probes 20 generally have elasticity and have various shapes such as a cantilever beam shape, a bump shape, or the like.

[8] The interposer 40 serves to electrically connect the printed circuit board 30 with the space transformer 10. For example, the interposer 40 has elastic contact structures disposed on upper and lower surfaces of a board. [9] When some of the probes cannot be brought into contact with the pads on the wafer because a surface formed by tips of the probes 20 on the space transformer 10 is not parallel to a surface formed by the pads on the wafer, the orientation adjusting member 60 adjusts the orientation of the space transformer 10 so that all of the probes may come into contact with the pads on the wafer.

[10] When some of the probes cannot be brought into contact with the pads on the wafer because the space transformer 10 is distorted or the central area of the space transformer 10 is deformed in a vertical direction, the deformation compensating member 50 compensates for such distortion or deformation so that all of the probes may come into contact with the pads on the wafer.

[11] Hereinafter, a mechanism for adjusting the planarization of the probes of the conventional probe card having the above configuration will be described in detail.

[12] The conventional probe card includes the orientation adjusting member 60 and the deformation compensating member 50 as a means to achieve the planarization of the probes.

[13] If the probe card is slantingly mounted on a prober or the wafer is slantingly placed on a wafer chuck, the orientation of the space transformer 10 is adjusted by using the orientation adjusting member 60 mounted on the outer peripheral area of the space transformer 10 so that the space transformer 10 becomes parallel to the wafer.

[14] Meanwhile, when the space transformer 10 is geometrically deformed due to an external factor such as pressure from the interposer 40 or the like, the deformation of the space transformer 10 cannot be compensated for only by using the orientation adjusting member 60. Such geometrical deformation can be compensated for by the deformation compensating member 50 provided on the central area of the space transformer 10. That is, the deformation compensating member 50 compensates for the deformation of the space transformer 10, which is geometrically deformed due to the distortion or the like, by applying a pulling force or a pressing force to the central area of the space transformer 10.

[15] However, there is a limit in the degree of planarization of the conventional probe card because the orientation adjusting member 60 and the deformation compensating member 50 are not sufficiently separated from each other.

[16] The deformation compensating member 50 employs a spring element so as to allow freedom against momentum which is applied to the deformation compensating member 50 when the orientation of the space transformer 10 is adjusted by the orientation adjusting member 60. However, since the spring element also needs to stand the pressure from the interposer 40 while allowing such freedom, the degree of freedom in adjusting the orientation of the space transformer 10 is restricted.

[17] Moreover, in case of a large-size probe card capable of including a plurality of de- formation compensating members, the orientation adjusting member and the deformation compensating members are strongly engaged with each other, so that it is actually difficult to adjust the orientation of the probes which are slantingly arranged. In such case, the degree of freedom for the orientation adjustment is more restricted. For this reason, in the prior art, it is difficult to find a case in which more than one deformation compensating member is adopted.

[18] From the above consideration, it is necessary to carry out the orientation adjustment more precisely to inspect the wafer accurately, and requested to meet this requirement is a development of a probe card having a planarization adjusting member without having a restriction in the orientation adjustment. Disclosure of Invention Technical Problem

[19] In view of the foregoing, the present disclosure provides a probe card capable of easily adjusting the planarization thereof by means of an orientation adjustment member and a deformation compensation member which are separated from each other so that, even for a large-size probe card, planarization can be carried out easily by using the orientation adjustment member and the deformation compensation member independently without being restricted by an interference therebetween. Technical Solution

[20] In accordance with an embodiment of the present invention, there is provided a probe card for probing a semiconductor device which comprises a printed circuit board; a probe substrate electrically connected to the printed circuit board and having a plurality of probes; a first planarization adjusting member for adjusting the planarization of the probe substrate by applying a force to a central area of the probe substrate; a second planarization adjusting member for adjusting the planarization of the probe substrate by applying a force to an outer peripheral area of the probe substrate; and a floating mounting member disposed on the probe substrate to be spaced apart from the printed circuit board, wherein the first planarization adjusting member is disposed at a central area of the floating mounting member.

[21] In accordance with another embodiment of the present invention, there is provided a probe card for probing a semiconductor device which comprises a printed circuit board; a probe substrate electrically connected to the printed circuit board and having a plurality of probes; a reinforcing plate disposed on the printed circuit board to reinforce the printed circuit board; a first planarization adjusting member for adjusting the planarization of the probe substrate by applying a force to a central area of the probe substrate; a second planarization adjusting member for adjusting the planarization of the probe substrate by applying a force to an outer peripheral area of the probe substrate; and a floating mounting member disposed on the probe substrate to be spaced apart from the reinforcing plate, wherein the first planarization adjusting member is disposed at a central area of the floating mounting member.

[22] In accordance with still another embodiment of the present invention, there is provided a probe card for probing a semiconductor device which comprises a printed circuit board; a space transformer electrically connected to the printed circuit board; a probe substrate electrically connected to the space transformer and having a plurality of probes; a coupling member for coupling the probe substrate with the space transformer; a first planarization adjusting member for adjusting the planarization of the probe substrate by applying a force to a central area of the probe substrate; a second planarization adjusting member for adjusting the planarization of the probe substrate by applying a force to an outer peripheral area of the probe substrate; and a floating mounting member disposed on the coupling member and spaced apart from the printed circuit board, wherein the first planarization adjusting member is disposed at a central area of the floating mounting member.

[23] In accordance with still another embodiment of the present invention, there is provided a probe card for probing a semiconductor device which comprises a printed circuit board; a space transformer electrically connected to the printed circuit board; a probe substrate electrically connected to the space transformer and having a plurality of probes; a coupling member for coupling the probe substrate with the space transformer; a reinforcing plate disposed on the printed circuit board to reinforce the printed circuit board; a first planarization adjusting member for adjusting the planarization of the probe substrate by applying a force to a central area of the probe substrate; a second planarization adjusting member for adjusting the planarization of the probe substrate by applying a force to an outer peripheral area of the probe substrate; and a floating mounting member disposed on the coupling member to be spaced apart from the reinforcing plate, wherein the first planarization adjusting member is disposed at a central area of the floating mounting member. Brief Description of the Drawings

[24] Fig. 1 is a cross sectional view of a probe card having a mechanism for adjusting the planarization of probes in a conventional probe card;

[25] Fig. 2 is a cross sectional view of a probe card for probing a semiconductor device in accordance with a first embodiment of the present invention;

[26] Fig. 3 is a plan view of a probe card for probing a semiconductor device in accordance with a second embodiment of the present invention;

[27] Fig. 4 is a cross sectional view of a probe card for probing a semiconductor device in accordance with a third embodiment of the present invention; [28] Fig. 5 is a cross sectional view of a probe substrate in a probe card for probing a semiconductor device in accordance with a fourth embodiment of the present invention;

[29] Fig. 6 is a cross sectional view of a probe substrate in a probe card for probing a semiconductor device in accordance with a fifth embodiment of the present invention;

[30] Fig. 7 is a cross sectional view of a probe substrate in a probe card for probing a semiconductor device in accordance with a sixth embodiment of the present invention;

[31] Fig. 8 is a cross sectional view of a first planarization adjusting member in a probe card for probing a semiconductor device in accordance with a seventh embodiment of the present invention;

[32] Fig. 9 is a cross sectional view of a first planarization adjusting member in a probe card for probing a semiconductor device in accordance with an eighth embodiment of the present invention;

[33] Fig. 10 is a cross sectional view of a floating mounting member in a probe card for probing a semiconductor device in accordance with a ninth embodiment of the present invention;

[34] Fig. 11 is a cross sectional view of a printed circuit board unit in a probe card for probing a semiconductor device in accordance with a tenth embodiment of the present invention; and

[35] Fig. 12 is a cross sectional view of a printed circuit board unit in a probe card for probing a semiconductor device in accordance with an eleventh embodiment of the present invention. Mode for the Invention

[36] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that the present invention may be readily implemented by those skilled in the art. However, it is to be noted that the present invention is not limited to the embodiments but can be realized in various other ways. In the drawings, parts irrelevant to the description are omitted for the simplicity of explanation, and like reference numerals denote like parts through the whole document.

[37] Fig. 2 is a cross sectional view of a probe card for inspecting a semiconductor device in accordance with a first embodiment of the present invention.

[38] A plurality of contact probes 101 are coupled to a wafer contact surface on a

MEMS (Micro Electro Mechanical Systems) probe substrate 102 at a constant interval. The contact probes 101 receive electrical signals of an external inspection apparatus from the MEMS probe substrate 102 and transmit the received electrical signals to a wafer. Also, the contact probes 101 receive signals sent from the wafer and transmit them to the MEMS probe substrate 102. The contact probes 101 make direct contact with pads on the wafer to inspect the wafer. Preferably, the contact probes 101 are made of an elastic material so as to prevent the wafer from being damaged when the contact probes 101 make contact with the pads on the wafer.

[39] The MEMS probe substrate 102 is coupled to the contact probes 101 and a space transformer 103. The MEMS probe substrate 102 receives the electrical signals of the external inspection apparatus from the space transformer 103 and transmits the received electrical signals to the contact probes 101. Also, the MEMS probe substrate 102 receives the signals sent from the wafer from the contact probes 101 and transmits them to the space transformer 103.

[40] The space transformer 103 is coupled to the MEMS probe substrate 102 and an interposer 104. The space transformer 103 receives the electrical signals of the external inspection apparatus from the interposer 104 and transmits the signals to the MEMS probe substrate 102. Also, the space transformer 103 receives the signals sent from the wafer from the MEMS probe substrate 102 and transmits them to the interposer 104.

[41] The interposer 104 is coupled to a printed circuit board 109 and the space transformer 103. The interposer 104 receives the electrical signals of the external inspection apparatus from the printed circuit board 109 and transmits the signals to the space transformer 103. Also, the interposer 104 receives the signals sent from the wafer from the space transformer 103 and transmits them to the printed circuit board 109. Preferably, portions of the interposer 104 being in contact with the printed circuit board 109 and the space transformer 103 are made up of an elastic material. Therefore, the interposer 104 serves to facilitate the planarization adjustment of the MEMS probe substrate 102 and the space transformer 103 by means of a first planarization bolt 110 or a second planarization bolt 115 while the printed circuit board 109 is fixed. The interposer 104 includes one or more pathways through which the first planarization bolt 110, a planarization adaptor 111 or a planarization screw 112 can be inserted.

[42] A frame 105 is coupled to the MEMS probe substrate 102 and the space transformer

103. The frame 105 fixes the MEMS probe substrate 102 and the space transformer 103. The frame 105 is also coupled to a floating substrate post 114, the second planarization bolt 115 and a clamping spring 106.

[43] The spring 106 is coupled to the frame 105 and a lower reinforcing plate 107. The spring 106 applies an elastic force between the frame 105 and the lower reinforcing plate 107 such that the influence of the lower reinforcing plate 107 is reduced when the frame 105 is moved due to a pressing force or a pulling force applied thereto by the first planarization bolt 110 or the second planarization bolt 115.

[44] The lower reinforcing plate 107 is coupled to the spring 106 and the printed circuit board 109. The lower reinforcing plate 107 fixes the printed circuit board 109 and connects the printed circuit board 109 to the frame 105 via the spring 106. Ac- cordingly, the lower reinforcing plate 107 prevents a direct application of a force to the printed circuit board 19 when the planarization adjustment is carried out by the second planarization bolt 115.

[45] An upper reinforcing plate 108 is coupled to the printed circuit board 109. The upper reinforcing plate 108 prevents the printed circuit board 109 from being bent or broken by fixing the printed circuit board 109. In addition, the upper reinforcing plate 108 includes a plurality of pathways through which the first planarization bolt 110, the planarization adaptor 111, the planarization screw 112, the floating substrate post 114 and the second planarization bolt 115 can be inserted.

[46] The printed circuit board 109 is coupled to the interposer 104, the lower reinforcing plate 107 and the upper reinforcing plate 108. The printed circuit board 109 is fixed by the lower reinforcing plate 107 and the upper reinforcing plate 108. The printed circuit board 109 receives the electrical signals from the external inspection apparatus and transmits them to the interposer 104. Also, the printed circuit board 109 receives the signals sent from the wafer from the interposer 104 and transmits them to the external inspection apparatus. The printed circuit board 109 includes a plurality of pathways through which the first planarization bolt 110, the planarization adaptor 111, the planarization screw 112, the floating substrate post 114 and the second planarization bolt 115 can be inserted.

[47] The first planarization bolt 110 is coupled to the space transformer 103 and the planarization adaptor 111. The first planarization bolt 110 is coupled to the space transformer 103 through a coupling structure in the space transformer 103, or by bonding in case the space transformer 103 is not provided with the coupling structure.

[48] The planarization adaptor 111 is coupled to the first planarization bolt 110 and the planarization screw 112. The planarization adaptor 111 transfers the pressing force or the pulling force, which is generated by the planarization screw 112, to the first planarization bolt 110.

[49] The planarization screw 112 is coupled to the planarization adaptor 111 and a floating substrate 113. Preferably, the planarization screw 112 has a spiral shape. Therefore, the pressing force or the pulling force can be applied to the space transformer 103 by turning the planarization screw 112 in clockwise or counterclockwise direction.

[50] The first planarization bolt 110, the planarization adaptor 111 and the planarization screw 112 are placed at central areas of the respective substrates. In this case, more than one first planarization bolts 110, more than one planarization adaptors 111 and more than one planarization screws 112 may be provided. Here, the central area refers to an area of each substrate other than an outer peripheral area thereof.

[51] The floating substrate 113 is coupled to the planarization screw 112 and the floating substrate post 114. The floating substrate 113 is spaced apart from the upper reinforcing plate 108 and is coupled to the floating substrate post 114 so as to connect the planarization screw 112 to the frame 105.

[52] The floating substrate post 114 is coupled to the floating substrate 113 and the frame 105. The floating substrate post 114 is not connected to any parts other than the floating substrate 113 and the frame 105.

[53] In this manner, since the floating substrate 113 and the floating substrate post 114 are exclusively connected to the frame 105 and the planarization screw 112, the first planarization bolts 110, the planarization adaptor 111 and the planarization screw 112 are separated from the second planarization bolt 115.

[54] The second planarization bolt 115 adjusts the planarization of the MEMS probe substrate 102 and the space transformer 103 by applying the pulling force or the pressing force to the frame 105. The second planarization bolt 115 is inserted through the upper reinforcing plate 108 and the printed circuit board 109 to be connected only to the frame 105. In other words, the second planarization bolt 115 is not connected to any other members than the upper reinforcing plate 108 and the printed circuit board 109. Thus, the second planarization bolt 115 is separated from the first planarization bolts 110, the planarization adaptor 111 and the planarization screw 112. More than one second planarization bolt 115 can be used for more accurate adjustment of planarization.

[55] In accordance with the first embodiment of the present invention, the first planarization bolts 110, the planarization adaptor 111 and the planarization screw 112 are exclusively coupled to the space transformer 103 via the floating substrate 113 and the floating substrate post 114, and the second planarization bolt 115 is directly coupled only to the frame 105. Accordingly, since the first planarization bolts 110, the planarization adaptor 111 and the planarization screw 112 are separated from the second planarization bolt 115, the planarization adjustment of the MEMS probe substrate 102 and the space transformer 103 by the first planarization bolts 110, the planarization adaptor 111 and the planarization screw 112 does not exert any influence upon the planarization adjustment of the MEMS probe substrate 102 and the space transformer 103 by the second planarization bolt 115, and vice versa. That is, the degree of freedom in carrying out the planarization adjustment by the second planarization bolt 115 is not restricted by the first planarization bolts 110, the planarization adaptor 111 and the planarization screw 112.

[56] Fig. 3 is a plan view of a probe card for probing a semiconductor device in accordance with a second embodiment of the present invention.

[57] One or more planarization screws 121 are placed at central areas of a floating substrate 122 and an upper reinforcing plate 124. Preferably, more than one pla- narization screws 121 are placed to adjust the planarization more accurately.

[58] The floating substrate 122 is supported by a floating substrate post and is spaced apart from the upper reinforcing plate 124. In addition, the floating substrate 122 is provided with, in its central area, one or more pathways through which the planarization screws 121 can be inserted, wherein the number of the pathways is equal to the number of the planarization screws 121.

[59] A plurality of second planarization bolts 123 are placed at an outer peripheral area of the upper reinforcing plate 124. Preferably, three or more second planarization bolts 123 are provided.

[60] The upper reinforcing plate 124 is coupled to a printed circuit board and is spaced apart from the floating substrate 122. In addition, the upper reinforcing plate 124 is provided with, in its outer peripheral area, a plurality of pathways through which the second planarization bolts 123 can be inserted, wherein the number of the pathways is equal to the number of the second planarization bolts 123.

[61] Fig. 4 is a cross sectional view of a probe card for probing a semiconductor device in accordance with a third embodiment of the present invention.

[62] A probe substrate 211 makes contact with pads on a wafer so as to transmit electrical signals of an external inspection apparatus to the wafer, and then to transmit the signals received from the wafer to a printed circuit board unit 212. The probe substrate 211 is coupled to a first planarization adjusting member 213, a floating mounting member 214 and the printed circuit board unit 212.

[63] The first planarization adjusting member 213 adjusts the planarization of the probe substrate 211 by applying a pulling force or a pressing force to a central area of the probe substrate 211. The first planarization adjusting member 213 is connected to the probe substrate 211 through a floating mounting member 214 without being connected to any other parts. Thus, the first planarization adjusting member 213 is separated from a second planarization adjusting member 215. More than one first planarization adjusting members may be used to adjust the planarization more accurately.

[64] The floating mounting member 214 connects the probe substrate 211 with the first planarization adjusting member 213. The floating mounting member 214 is exclusively coupled to the probe substrate 211 and the first planarization adjusting member 213 without being connected to any other parts.

[65] The printed circuit board unit 212 receives the electrical signals from the external inspection apparatus and transmits the received electrical signals to the probe substrate 211. Also, the printed circuit board unit 212 receives the signals of the wafer from the probe substrate 211 and transmits the received signals to the external inspection apparatus. The printed circuit board unit 212 includes a pathway through which the first planarization adjusting member 213, the floating mounting member 214 and the second planarization adjusting member 215 can be inserted.

[66] The second planarization adjusting member 215 adjusts the planarization of the probe substrate 211 by applying the pressing force or the pulling force to an outer peripheral area of the probe substrate 211. The second planarization adjusting member 215 is inserted through the printed circuit board unit 212 to be connected only to the probe substrate 211 without being connected to any other members. Thus, the second planarization adjusting member 215 is separated from the first planarization adjusting member 213. More than one second planarization adjusting members may be used to adjust the planarization more accurately.

[67] In accordance with the third embodiment of the present invention, the first planarization adjusting member 213 is exclusively coupled to the probe substrate 211 through the floating mounting member 214, and the second planarization adjusting member 215 is directly coupled only to the probe substrate 211. Accordingly, since the first planarization adjusting member 213 is separated from the second planarization adjusting member 215, the planarization adjustment of the probe substrate 211 by the first planarization bolts 110 does not exert any influence upon the planarization adjustment of the probe substrate 211 by the second planarization adjusting member 215, and vice versa. That is, the degree of freedom in carrying out the planarization adjustment by the second planarization adjusting member 215 is not restricted by the first planarization adjusting member 213.

[68] Fig. 5 is a cross sectional view of a probe substrate in a probe card for probing a semiconductor device in accordance with a fourth embodiment of the present invention.

[69] In accordance with the fourth embodiment of the present invention, the probe substrate includes a plurality of contact probes 311, an MEMS probe substrate 312, a spacer transformer 313 and a frame 314.

[70] The contact probes 311 are coupled to a wafer contact surface on the spacer transformer 313 at a constant interval. The contact probes 311 make direct contact with a wafer to inspect the wafer. Preferably, the contact probes 311 are made of an elastic material so as to prevent the wafer from being damaged when the contact probes 311 make contact with the wafer.

[71] The MEMS probe substrate 312 is coupled to the contact probes 311, the spacer transformer 313 and the frame 314. The MEMS probe substrate 312 receives electrical signals of an external inspection apparatus from the spacer transformer 313 and transmits the signals to the contact probes 311. Also, the MEMS probe substrate 312 receives the signals of the wafer from the contact probes 311 and transmits them to the spacer transformer 313.

[72] The spacer transformer 313 is coupled to the MEMS probe substrate 312 and the frame 314. The spacer transformer 313 receives the electrical signals of the external inspection apparatus from a printed circuit board and transmits the signals to the MEMS probe substrate 312. Also, the spacer transformer 313 receives the signals of the wafer from the MEMS probe substrate 312 and transmits them to the printed circuit board.

[73] The frame 314 is coupled to the MEMS probe substrate 312 and the spacer transformer 313. The frame 314 fixes the MEMS probe substrate 312 and the spacer transformer 313. The frame 314 is also coupled to a floating mounting member and a second planarization adjusting member.

[74] Fig. 6 is a cross sectional view of a probe substrate in a probe card for probing a semiconductor device in accordance with a fifth embodiment of the present invention.

[75] In accordance with the fifth embodiment of the present invention, the probe substrate includes a plurality of contact probes 321, an MEMS probe substrate 322, a spacer transformer 323.

[76] The contact probes 321 are coupled to a wafer contact surface on the spacer transformer 323 at constant intervals. The contact probes 321 make direct contact with a wafer to inspect the wafer. Preferably, the contact probes 321 are made of an elastic material so as to prevent the wafer from being damaged when the contact probes 321 make contact with the wafer.

[77] The MEMS probe substrate 322 is coupled to the contact probes 321 and the spacer transformer 323. The MEMS probe substrate 322 receives electrical signals of an external inspection apparatus from the spacer transformer 323 and transmits the signals to the contact probes 321. Also, the MEMS probe substrate 322 receives signals of the wafer from the contact probes 321 and transmits them to the spacer transformer 323.

[78] The spacer transformer 323 is coupled to the MEMS probe substrate 322 and a printed circuit board. The spacer transformer 323 receives the electrical signals of the external inspection apparatus from the printed circuit board and transmits the signals to the MEMS probe substrate 322. Also, the spacer transformer 323 receives the signals of the wafer from the MEMS probe substrate 322 and transmits them to the printed circuit board.

[79] Fig. 7 is a cross sectional view of a probe substrate in a probe card for probing a semiconductor device in accordance with a sixth embodiment of the present invention.

[80] In accordance with the sixth embodiment of the present invention, the probe substrate of the probe card includes a plurality of contact probes 331 and a spacer transformer 332.

[81] The contact probes 321 are coupled to a wafer contact surface on the spacer transformer 332 at a constant interval. The contact probes 331 make direct contact with a wafer to inspect the wafer. Preferably, the contact probes 321 are made of an elastic material so as to prevent the wafer from being damaged when the contact probes 331 make contact with the wafer.

[82] The spacer transformer 332 is coupled to the contact probes 331 and a printed circuit board. The spacer transformer 332 receives electrical signals of an external inspection apparatus from the printed circuit board and transmits the signals to the contact probes 331. Also, the spacer transformer 332 receives signals sent from the wafer from the contact probes 331 and transmits them to the printed circuit board. The spacer transformer 332 serves to change pitches. That is, an interval between a plurality of contact terminals formed on an upper surface of the space transformer 332 is set to be different from an interval between a multiplicity of contact terminals formed on a lower surface of the space transformer 332. For example, the pitch on the lower surface is narrower than that on the upper surface. As a result, it is possible to manufacture a probe card capable of keeping up with a microscopic pitch between the pads on the wafer.

[83] Fig. 8 is a cross sectional view of a first planarization adjusting member in a probe card for probing a semiconductor device in accordance with a seventh embodiment of the present invention.

[84] In accordance with the seventh embodiment of the present invention, the first planarization adjusting member includes a first planarization bolt 413, a planarization adaptor 412 and a planarization screw 411.

[85] The planarization screw 411 is coupled to the planarization adaptor 412 and a floating mounting member. Preferably, the planarization screw 411 has a spiral shape. Therefore, a pulling force or a pressing force can be applied to a probe substrate by turning the planarization screw 411 in clockwise or counterclockwise direction.

[86] The planarization adaptor 412 is coupled to the first planarization bolt 413 and the planarization screw 411. The planarization adaptor 412 transfers the pressing force or the pulling force, which is generated by the planarization screw 411, to the first planarization bolt 413.

[87] The first planarization bolt 413 is coupled to the probe substrate and the planarization adaptor 412. The first planarization bolt 413 is coupled to the probe substrate through a coupling structure in the probe substrate, or by bonding in case the probe substrate is not provided with the coupling structure.

[88] Fig. 9 is a cross sectional view of a first planarization adjusting member in a probe card for probing a semiconductor device in accordance with an eighth embodiment of the present invention.

[89] In accordance with the eighth embodiment of the present invention, the first planarization adjusting member includes a first planarization bolt 422 and a planarization screw 421. [90] The planarization screw 421 is coupled to the first planarization bolt 422 and a floating mounting member. Preferably, the planarization screw 421 has a spiral shape. Therefore, a pulling force or a pressing force can be applied to a probe substrate by turning the planarization screw 421 in clockwise or counterclockwise direction.

[91] The first planarization bolt 422 is coupled to the probe substrate and the planarization screw 421. The first planarization bolt 422 is coupled to the probe substrate through a coupling structure in the probe substrate, or by bonding in case the probe substrate is not provided with the coupling structure.

[92] Fig. 10 is a cross sectional view of a floating mounting member in a probe card for probing a semiconductor device in accordance with a ninth embodiment of the present invention.

[93] In accordance with the ninth embodiment of the present invention, the floating mounting member includes a floating substrate 511 and a floating substrate post 512.

[94] The floating substrate 511 is coupled to a planarization adjusting member and the floating substrate post 512. In addition, the floating substrate post 512 is coupled to the floating substrate 511 and a probe substrate. By adopting this configuration in which the floating mounting member is made up of the floating substrate 511 and the floating substrate post 512, it becomes easy to manufacture the probe card and replace parts thereof.

[95] Fig. 11 is a cross sectional view of a printed circuit board unit in a probe card for probing a semiconductor device in accordance with a tenth embodiment of the present invention.

[96] In accordance with the tenth embodiment of the present invention, the printed circuit board unit includes a printed circuit board 611, an interposer 612, an upper reinforcing plate 613 and a lower reinforcing plate 614.

[97] The printed circuit board 611 is coupled to the upper reinforcing plate 613, the lower reinforcing plate 614 and the interposer 612. The printed circuit board 611 is fixed by the upper reinforcing plate 613 and the lower reinforcing plate 614. The printed circuit board 611 receives electrical signals from an external inspection apparatus and transmits the signals to the interposer 612. Also, the printed circuit board 611 receives signals of the wafer from the interposer 612 and transmits the signals to the external inspection apparatus. The printed circuit board 611 includes a plurality of pathways (not shown) through which a first planarization adjusting member, a floating mounting member and a second planarization adjusting member can be inserted.

[98] The upper reinforcing plate 613 is coupled to the printed circuit board 611. The upper reinforcing plate 613 prevents the printed circuit board 611 from being bent or broken by fixing the printed circuit board 611. The upper reinforcing plate 613 includes a plurality of pathways (not shown) through which the first planarization adjusting member, the floating mounting member and the second planarization adjusting member can be inserted.

[99] The lower reinforcing plate 614 is coupled to the printed circuit board 611. The lower reinforcing plate 614 fixes the printed circuit board 611 and connects the printed circuit board 611 to a probe substrate. Accordingly, the lower reinforcing plate 614 prevents a direct application of a force to the printed circuit board 611 when the planarization adjustment is carried out by the second planarization adjusting member.

[100] The interposer 612 is coupled to the printed circuit board 611 and the probe substrate. The interposer 612 receives electrical signals from the printed circuit board 611 and transmits the signals to the probe substrate. Also, the interposer 612 receives the signal of the wafer from the probe substrate, and transmits them to the printed circuit board 611. Preferably, portions of the interposer 612 being in contact with the printed circuit board 611 and the probe substrate are made up of an elastic material. Therefore, the interposer 612 serves to facilitate the planarization adjustment of the probe substrate by means of the first planarization adjusting member, the floating mounting member or the second planarization adjusting member while the printed circuit board 611 is fixed. The interposer 612 includes one or more pathways (not shown) through which the first planarization adjusting member can be inserted.

[101] Fig. 12 is a cross sectional view of a printed circuit board unit in a probe card for probing a semiconductor device in accordance with an eleventh embodiment of the present invention.

[102] In accordance with the eleventh embodiment of the present invention, the printed circuit board unit includes a printed circuit board 621, an upper reinforcing plate 622 and a lower reinforcing plate 623.

[103] The printed circuit board 621 is coupled to the upper reinforcing plate 622, the lower reinforcing plate 623 and a probe substrate. The printed circuit board 621 is fixed by the upper reinforcing plate 622 and the lower reinforcing plate 623. The printed circuit board 621 receives electrical signals from an external inspection apparatus and transmits the signals to the probe substrate. Also, the printed circuit board 621 receives signals of a wafer from the probe substrate and transmits them to the external inspection apparatus. The printed circuit board 621 includes a plurality of pathways (not shown) through which a first planarization adjusting member, a floating mounting member and a second planarization adjusting member can be inserted.

[104] The upper reinforcing plate 622 is coupled to the printed circuit board 621. The upper reinforcing plate 622 prevents the printed circuit board 621 from being bent or broken by fixing the printed circuit board 621. The upper reinforcing plate 622 includes a plurality of pathways (not shown) through which the first planarization adjusting member, the floating mounting member and the second planarization adjusting member can be inserted.

[105] The lower reinforcing plate 623 is coupled to the printed circuit board 621. The lower reinforcing plate 623 fixes the printed circuit board 621 and connects the printed circuit board 621 to the probe substrate. Accordingly, the lower reinforcing plate 623 prevents a direct application of a force to the printed circuit board 621 when the pla- narization adjustment is carried out by the second planarization adjusting member.

[106] The above description of the present invention is provided for the purpose of illustration, and it would be understood by those skilled in the art that various changes and modifications may be made without changing technical conception and essential features of the present invention. Thus, it is clear that the above-described embodiments are illustrative in all aspects and do not limit the present invention. Industrial Applicability

[107] In accordance with the present invention, the first planarization adjusting member and the second planarization adjusting member are coupled to the probe substrate while the first planarization adjusting member and the second planarization adjusting member are separated from each other. Therefore, there occurs no interference between the first planarization adjusting member and the second planarization adjusting member, so that the degree of planarization is not restricted, and the freedom in adjusting the planarization can be obtained. Accordingly, even for a large-size probe card, its planarization can be easily achieved by using more than one planarization adjusting member independently.

Claims

[1] A probe card for probing a semiconductor device, comprising: a printed circuit board; a probe substrate electrically connected to the printed circuit board and having a plurality of probes; a first planarization adjusting member for adjusting the planarization of the probe substrate by applying a force to a central area of the probe substrate; a second planarization adjusting member for adjusting the planarization of the probe substrate by applying a force to an outer peripheral area of the probe substrate; and a floating mounting member disposed on the probe substrate to be spaced apart from the printed circuit board, wherein the first planarization adjusting member is disposed at a central area of the floating mounting member.

[2] The probe card of claim 1, further comprising a space transformer disposed between the printed circuit board and the probe substrate.

[3] The probe card of claim 1, wherein the probe substrate is a space transformer.

[4] The probe card of claim 1, wherein the first planarization adjusting member includes a planarization bolt and a planarization screw.

[5] The probe card of claim 1, wherein the floating mounting member includes a plurality of posts and a substrate.

[6] The probe card of claim 2, further comprising an interposer disposed between the printed circuit board and the space transformer.

[7] A probe card for probing a semiconductor device, comprising: a printed circuit board; a probe substrate electrically connected to the printed circuit board and having a plurality of probes; a reinforcing plate disposed on the printed circuit board to reinforce the printed circuit board; a first planarization adjusting member for adjusting the planarization of the probe substrate by applying a force to a central area of the probe substrate; a second planarization adjusting member for adjusting the planarization of the probe substrate by applying a force to an outer peripheral area of the probe substrate; and a floating mounting member disposed on the probe substrate to be spaced apart from the reinforcing plate, wherein the first planarization adjusting member is disposed at a central area of the floating mounting member.

[8] The probe card of claim 7, further comprising a space transformer disposed between the printed circuit board and the probe substrate.

[9] The probe card of claim 7, wherein the probe substrate is a space transformer.

[10] The probe card of claim 7, wherein the first planarization adjusting member includes a planarization bolt and a planarization screw. [11] The probe card of claim 7, wherein the floating mounting member includes a plurality of posts and a substrate. [12] The probe card of claim 8, further comprising an interposer disposed between the printed circuit board and the space transformer. [13] A probe card for probing a semiconductor device, comprising: a printed circuit board; a space transformer electrically connected to the printed circuit board; a probe substrate electrically connected to the space transformer and having a plurality of probes; a coupling member for coupling the probe substrate with the space transformer; a first planarization adjusting member for adjusting the planarization of the probe substrate by applying a force to a central area of the probe substrate; a second planarization adjusting member for adjusting the planarization of the probe substrate by applying a force to an outer peripheral area of the probe substrate; and a floating mounting member disposed on the coupling member and spaced apart from the printed circuit board, wherein the first planarization adjusting member is disposed at a central area of the floating mounting member. [14] The probe card of claim 13, further comprising an interposer disposed between the printed circuit board and the space transformer. [15] The probe card of claim 13, wherein the first planarization adjusting member includes a planarization bolt and a planarization screw. [16] The probe card of claim 13, wherein the floating mounting member includes a plurality of posts and a substrate. [17] A probe card for probing a semiconductor device, comprising: a printed circuit board; a space transformer electrically connected to the printed circuit board; a probe substrate electrically connected to the space transformer and having a plurality of probes; a coupling member for coupling the probe substrate with the space transformer; a reinforcing plate disposed on the printed circuit board to reinforce the printed circuit board; a first planarization adjusting member for adjusting the planarization of the probe substrate by applying a force to a central area of the probe substrate; a second planarization adjusting member for adjusting the planarization of the probe substrate by applying a force to an outer peripheral area of the probe substrate; and a floating mounting member disposed on the coupling member to be spaced apart from the reinforcing plate, wherein the first planarization adjusting member is disposed at a central area of the floating mounting member. [18] The probe card of claim 17, further comprising an interposer disposed between the printed circuit board and the space transformer. [19] The probe card of claim 17, wherein the first planarization adjusting member includes a planarization bolt and a planarization screw. [20] The probe card of claim 17, wherein the floating mounting member includes a plurality of posts and a substrate.