TW200936818A - Plating apparatus and plating method - Google Patents

Abstract

A plating apparatus can form a bump having a flat top or can form a metal film having a good in-plane uniformity even when the plating of a plating object (substrate) is carried out under high-current density conditions. The plating apparatus includes a plating tank for holding a plating solution; an anode to be immersed in the plating solution in the plating tank; a holder for holding a plating object and disposing the plating object at a position opposite the anode; a paddle, disposed between the anode and the plating object held by the holder, which reciprocates parallel to the plating object to stir the plating solution; and a control section for controlling a paddle drive section which drives the paddle. The control section controls the paddle drive section so that the paddle moves at a velocity whose average absolute value is 70 cm/sec to 100 cm/sec.

Description

200936818 VI. Description of the Invention: [Technical Field] The present invention relates to a plating apparatus and a plating method for performing surface plating of a plated article (substrate) (for example, a semiconductor wafer), and more particularly </ RTI> relating to electrodes that can be used to form a coating in a fine interconnect recess or aperture or photoresist opening disposed on a surface of a semiconductor wafer, or for forming an electrode on a surface of a semiconductor wafer for electrical connection to, for example, a package A plating device and a plating method for bumps (protruding electrodes). ❹[Prior Art] For example, ΙΑβ (tape-type automatic bonding) or flip-chip package (fUp chip: formed by a predetermined portion (electrode) on the surface of a semiconductor wafer (with interconnects formed therein) formed of gold and copper , tin or nickel or a plurality of layers of such metal-made protruding electrodes (bumps) whereby the semiconductor wafer can be electrically connected to the electrodes of the package or the TAB electrode via the bumps. Various methods are available = Convex, 'for example, electric clock method, vapor deposition method, printing method, and ball-planting method=7, among them, as the number of semiconductor wafers increases by 1/0 and the electrode pitch becomes smaller, the most common method is to stably perform electricity. Inspection. w fine bumps and metal films that can be phase-electricized ==!==. In addition, ground control. Easy to meet the in-plane uniformity of the thickness of the metal film (=1 metal film, (4) 〇nnity In order to achieve high-density packaging and high-power method to form gold light, it can be used to reduce the potential. If used to feed the catch rate and the plating solution, 320840 4 200936818% potential is evenly distributed. Therefore, (4) plating method A metal with excellent in-plane uniformity of thickness can be obtained In the keying device using the so-called impregnation method, it is known that a (four) coating device comprises: a plating tank for accommodating a plating solution; for vertically covering an object) and thereby sealing the peripheral portion thereof by watertightness Substrate holder soil; the anode and the pole's - the anode holder is vertically held and configured to face the substrate in the ore; the crucible adjustment plate made of dielectric material and having a central hole (regulation, which is disposed between the anode and the substrate; and a paddle disposed between the conditioning plate and the substrate for mixing the plating solution (please refer, for example, International Publication No.: World Patent No. WO 2004/009879 pamphlet, patent document 丨). In the operation of the plating apparatus described in Patent Document 1, the anode, the substrate, and the adjustment plate are all immersed in the plating bath of the plating tank. Simultaneously connecting the anode to the anode of the plating power source via a wire and connecting the substrate to the cathode of the plating power source, and applying a predetermined plating voltage between the anode and the substrate, Metal and metal film (mine On the surface of the substrate. During the plating, the liquid is mixed with the scramble pad disposed between the adjustment plate and the substrate to uniformly supply a sufficient amount of ions to the substrate, thereby forming a metal film having a more uniform thickness. According to the plating apparatus of Patent Document 1, the potential distribution of the plating tank can be controlled by placing the anode between the substrates opposite to the anode and the plating liquid in the cylindrical body. The control of the thickness distribution of the metal ruthenium formed on the surface of the substrate becomes possible. Furthermore, a plating apparatus has been proposed which is an adjustment plate and plating which minimizes the plating solution immersed in the plating tank by 5 320840 200936818 The distance of the object, so that the entire surface of the plated article has a more uniform potential distribution, thereby forming a metal crucible having a more uniform thickness (refer to, for example, Japanese Patent Laid-Open Publication No. 2001-329400, Patent Document 2) ). At present, in order to increase productivity, it is strongly required to shorten the plating time for a coating having a given thickness to about two-eighth of the conventional plating time. In order to form a coating having a given thickness and a given area in a relatively short period of time, it must be plated at a faster plating rate by applying a higher current (i.e., higher = turbulent density). cover. However, if it is used, it is known that the usual plating apparatus and its operation method are covered by a high current density, and the in-plane uniformity of the coating thickness tends to be deteriorated. People ^ need to have a higher degree of in-plane uniformity than before. Therefore, as described in Patent Document 2, shortening the distance between the regulating plate and the ore covering member is important for performing the ore coating under the ancient current density plating condition. The present inventors have discovered that when plating is performed under high current density conditions using conventional conventional plating apparatus and its method 4, the convexity formed by plating has a tendency to have a convex top rather than a flat top. . The formation of such a convex type of block causes the following problems: in the case of the WL_csp (a wafer-level cover-size package) currently under development, after the bump is formed by the plating method, the bump is coated by the tree) cover. If the bumps are convex, you must apply an excessive amount of resin to the entire bump to increase the cost. After the resin is applied, the squeegee blade is usually used to level the surface of the resin. When using a scraper (the high bump with a convex top may collapse when the plate is flattened to the surface of the resin. After the bump is coated with a tree), the resin and the bump are usually ground by mechanical grinding to avoid 320840 6 200936818 If the bump has a convex top and thus an excessive amount of resin is applied, the excess resin must be worn away, which leads to an increase in cost. A plating apparatus and method have been proposed which are used for printing with through holes. The board is plated while driving a pair of stirring rods in the key solution (one speed is 5 cm/sec to 2 cm/s, and the other is 25 mm/shirt to 70 mm/sec) (Please refer to, for example, Japanese Laid-Open Publication No. 2006-41172, Patent Document 3). However, if the pair of stirring rods are moved at these speeds during plating, it is still impossible to form a flat top. SUMMARY OF THE INVENTION In view of the above prior art, we have made cost inventions. Therefore, it is an object of the present invention to provide a plating apparatus and a plating method for performing a plating object (substrate) (for example, Semiconductor wafer In the case of plating, it is possible to form a bump having a flat top or a metal film which can be formed with excellent in-plane uniformity even under high current density conditions. ❹ In order to achieve the object, the present invention provides A plating apparatus comprising: a plating tank for accommodating a plating solution; an anode to be immersed in the plating solution in the plating tank, a holder for holding the plating object and the The plated article is disposed at a position opposite to the anode; the paddle is disposed between the % pole and the mirror object held by the holder, and reciprocates parallel to the plated object To agitate the plating solution; and, a control section 'for controlling a stirring paddle driving part for driving the scrambled purple. The control part controls the paddle driving part so that the paddle is averaged 320840 7 200936818 * speed shift from 70 cm / sec to 1 〇〇 cm / sec. By making the interference between the anode and the plated object, for example, the average absolute value is 7 〇 cm / sec to 1〇〇cm/sec The (high) speed is moved to thereby agitate the plating solution, and a sufficient amount of ions can be uniformly supplied to the previously formed resist hole for bump formation, which makes it possible to form a bump having a flat top even It is also possible to carry out plating under conditions of southern current density.

φ The mixing paddle is preferably a plate-like member having a plurality of strip portions. The plate member preferably has a thickness of 3 to 5 mm. Preferably, each of the strips of the scrambled violet is inclined at 30 to 60 degrees with respect to a vertical plane parallel to the mirror covering, preferably 4 to 5 degrees.

Each of the strip-shaped portions of the blended purple is preferably from 2 mm to 8 mm in width, preferably from 3 mm to 6 mm. Preferably, the distance between the hybrid violet and the mineral-coated article is from 5 mm to U mm. In the preferred embodiment of the invention, the shaft is coated with: a plate made of a dielectric material. The == the cylindrical portion of the profile of the plated article; and the flange portion of the anode material _ (anQde_side perlpheralend) connected to the die portion for adjusting the electric field between the plated articles.珉 (4) The anode has a more uniform potential distribution with the entire surface of the anode and the wrap, and the metal film (recording film) on the object of the ore covering object is lifted into two shapes. The metal film is formed under the flow density plating condition, even if it is in the same electric power 320840 8 200936818, the column of the plating object and the adjusting plate is preferably 8 mm to 25 mm, and 12 mm = more good. In a preferred aspect of the invention, the retainer has an outwardly projecting retainer arm and the money slot has a retainer support (header s_(4) for contacting the retainer arm (4) The holder is hung and supported thereon. A mosquito member is disposed on the contact portion of the holder arm and the holder bracket, and the wire is used to define the holder arm to the holder holder. The structure prevents the retainer suspended and supported on the plating tank from swinging or tilting, even if the retainer is subjected to a reverse pressure caused by the high-speed movement of the stirring paddle. The solid structure member is a magnet mounted on at least one of the holder arm portion and the holder bracket. The magnetic force ensures excellent fixation. In a preferred aspect of the invention, the holder arm portion and the holder The retainer brackets have contacts that contact and close each other when at least a portion of their contact areas are engaged and supported on the plating tank, and allow power to be supplied when the contacts are closed The plated article. The holder is suspended When hanging and supporting on the plating tank, this ensures an excellent connection between the joint of the retainer arm and the joint of the retainer bracket. The present invention also provides a method of mineral coating. Arranging the anode and the plated article opposite to each other in the ore bath of the mirror slot; and arranging the agitating paddle disposed between the anode and the plated article to be parallel to the plated article 9 320840 200936818 The absolute value is 70 cm, and the agitating paddle is reciprocated at a speed of the anode and 誃a / sec. Preferably, the pad is applied with a voltage between the members. The member has a plate having a strip of 3 milligrams. The thickness of the plate is preferably 2. The vertical plane of the object is inclined by 3 () sound" and is 40 degrees relative to the parallel to the clock. It is better to 50 degrees. The mother of the slaughter is preferably a strip-shaped portion, preferably 3 mm to a width of 3 mm to 8 mm. Preferably, the stirring paddle is preferred.

Millimeter. &gt;,, the distance of the plated article is 5 mm to U in a preferred plate ==:::::::::: portion of the invention; and connecting to the cylindrical portion of the ore cover The "electric field:" between the objects is preferably used to adjust the side of the key member formed on the anode and the portion of the column. House ten to 25 millimeters is not preferred, and 12 to 18 millimeters of the present invention are also provided - a type of plating comprising: a groove 'anode' for accommodating the forged 4, which is to be immersed in the ore tank In the mirror liquid; = holding, which is used to hold the plated article and the plated article is disposed at two opposite positions of the anode; fresh _ ' is configured to remain in the anode and the sub Between the covering members, and reciprocating in parallel with the key covering member to agitate the plating solution; and, a control member, 10 320840 200936818 for controlling the stirring paddle driving member for driving the stirring paddle. The plating tank is separated into a plating material processing chamber and a plating liquid distribution chamber by a separation plate having a plurality of mineral liquid passage holes. The plating solution distribution chamber is provided with a shield plate for adjusting the electric field while ensuring the dispersed flow of the plating solution. By separating the plating tank into the upper plating material processing chamber and the lower plating liquid distribution chamber by using the separating plate in this manner, and installing the shielding plate in the plating liquid distribution chamber to suppress the distribution of the money liquid An electric field from the anode toward the plated article is formed in the chamber, thereby preventing an electric field from being formed under the plated article, thereby preventing the electric field from affecting the in-plane uniformity of the coating. When plating is carried out under conventional low current density conditions, the effect of the electric field formed under the article on the in-plane uniformity of the coating is not a problem. On the other hand, in the case of high current density conditions, this - the influence of the electric field causes problems, = because the thickness of the portion of the bottom portion of the coating (4) is rapidly increased. (4) In one of the preferred aspects of the invention, the plating The overhanging device further comprises a matching plate made of a dielectric material between the _ pole and the __, and the adjusting plate comprises: an inner diameter matching the plate of the plated object. The flange portion is connected to the peripheral end of the anode portion of the cylindrical portion; that is, the gap between the anode and the plated article is used for adjusting the gap contact, and the field shielding member is Attached to the lower end of the flange portion, the separating plate is connected to provide the adjusting plate to be controlled to be formed on the two: field. Further, the electric field shielding member is provided between the plates between the objects to prevent an electric field from being convex. The edge portion and the:: and the separation 32〇84〇11 200936818, in a preferred aspect of the invention, the mineral liquid distribution chamber is partitioned by the shielding plate/knife into an anode side solution distribution chamber and a cathode side solution distribution room. The key liquid system and the ore supply route are supplied to the anode side solution distribution turn to the pole side solution distribution chamber. _ By this method (10), the plating solution distribution chamber is completely 2 anode side solution distribution chamber and the cathode side solution distribution chamber, which makes it possible to prevent the remaining line generated by the electrode from passing through the frequency distribution chamber. The liquid in the tank and the plated object as the cathode. Stirring is easily separated by the coupler from the stirring of the (four) rod by which it can be quickly rotated. The replacement of the sputum is: for::!: in the system: for accommodating the plating 掊 /, waiting for several times in the plating bath in the plating tank; plating with the anode And the covering member is disposed to be held by the holder=purple, and the money is disposed between the anode and the parallel covering member and is configured to drive the liquid with the bonding member; the control component, It is used to control the between the mixers and is controlled by the electric==piece:: the anode and the plate moving mechanism, the 1 system is used for the second: the squeaking of the squatting '· and, the adjustment moves the adjustment in parallel The plate is perpendicular to the money covering member or 320840 12 200936818 a The adjusting plate moving mechanism can finely adjust the vertical or horizontal position of the adjusting plate relative to the plated article, thereby increasing the thickness of the coating formed on the surface of the plated article Uniformity in the plane. Since the adjustment plate is disposed adjacent to the plated article, fine-tuning the vertical or horizontal position of the adjustment plate relative to the plated article is important to increase the in-plane uniformity of the thickness of the coating formed on the plated article. . Preferably, the adjustment plate moving mechanism includes a press member for pressing the adjustment plate to move the adjustment plate. ❹ For example, the press-in member is a press bolt. The adjustment can be easily controlled by controlling the degree of pressure applied by the press-in member (in particular, when the press-in bolt having a predetermined pitch is used as the press-in member, by controlling the number of revolutions of the press-in bolt) The moving distance of the board. Preferably, a guide member is provided on the inner peripheral surface of the plating tank for guiding the movement of the regulating plate. The guiding member enables the adjustment plate to be moved in parallel with the ore-covering member while maintaining the distance between the two. Further, by using a guiding member having a groove into which the peripheral portion of the regulating plate is inserted, it is possible to prevent an electric field from leaking from the periphery of the regulating plate. Preferably, the adjustment plate is provided with a mounting component (m〇unting

SeCtl〇 = auxiliary adjustment plate for wire adjustment of the electric field. The combination of the adjustment plate and the auxiliary adjustment plate can be adapted to the optimal electric field of the ore-covering object without changing the installation position of the adjustment plate or replacing the 5-week plate. In a preferred aspect of the present invention, the plating apparatus further includes a positioning/320840 13 200936818 holding member (P〇sitioning/h〇1 e holding the holder, the adjusting plate, and for positioning and securing An anode holder is provided by positioning the positioning/holding member for holding the substrate board and the anode holder in the plating tank, so that the == holder, the adjustment plate, and the anode can be held The position is easily aligned in the orientation of the device. The position of the u is in the vertical m (four) of the plating tank. When the coating is applied, the shaft has a flat top == a metal film with excellent in-plane hooking. The preferred embodiment of the present invention will now be described with reference to the accompanying drawings. The following description illustrates the implementation of the copper on the surface of the substrate by using the substrate as a mineral coated article. In the following description, the same or equivalent elements are denoted by the same element symbols and will not be repeated. ❹, Fig. 1 is a vertical cross-sectional front view of a present embodiment of the present invention. As shown in Figure 1, the money cover device The keyway 10 is provided with a plating solution Q. An overflow tank 12 for receiving the plating solution Q overflowing the edge of the plating tank 10 is provided around the upper end of the plating tank 1〇. One end of the plating liquid supply path and the line 16 is connected to the bottom of the overflow tank 12, and (4): the other end of the line 16 is connected to the plating liquid supplier σ 18 provided at the bottom of the lag 1 (). The plating solution Q in the tank 2 is sent back to the plating tank 10 by the pump 14. Below the pump 14, the thermostat unit 2 for controlling the temperature of the plating solution Q is used for the extraction. The filter 22 containing the material other than the plating solution 14 320840 200936818 is inserted in the plating liquid supply route 16. The plating apparatus also includes a substrate holder 24 for detachably holding the substrate (plating object) W and The vertical position of the substrate is immersed in the plating solution Q of the plating tank 10. The anode 26 held by the anode holder 28 and immersed in the plating bath Q of the plating tank 1 is configured to be held by the substrate holder 24 and immersed in The opposite side of the substrate w in the plating solution Q. In this embodiment, phosphorus-containing copper is used as the anode 26. The substrate W and the anode 26 are plated. The electric power source 30 is electrically connected, and a plating film (copper film) is formed on the surface of the substrate W by circulating a current between the substrate w and the anode 26. The reciprocating movement in parallel with the surface of the substrate W to agitate the plating solution Q The agitating paddle 32 is disposed between the substrate W and the anode 26 which are fixed by the substrate holder 24 and immersed in the plating solution Q. By stirring the plating solution q with the stirring paddle 32, a sufficient amount of copper ions can be uniformly supplied. To the surface of the substrate w. The distance between the stirring paddle 32 and the substrate W is preferably from 5 mm to 11 mm. Further, a regulation plate made of a dielectric material having a more uniform potential distribution on the entire surface of the substrate W is provided. The 34 series is configured to be positioned between the paddle 32 and the anode 26. As shown in Figs. 2 and 3, the agitating paddle 32 is composed of a rectangular plate-like member having a uniform thickness "t" of 3 mm to 5 mm and a plurality of parallels defining a vertically extending strip portion 32b. Slit 32a. The hybrid violet 32 is formed of, for example, titanium coated with Teflon. The vertical length Li of the paddle 32 and the vertical length L2 of the slit 32a are both sufficiently larger than the vertical dimension of the substrate W. Further, the agitating paddle 32 is designed such that its sum of the lateral length η and the reciprocating distance (stroke "St") is sufficiently larger than the lateral rule of the substrate # 320840 15 200936818 inches. It is preferable to determine the width of the slit 32a and the range of the necessary rigidity in the following manner. The liquid (4)-shaped portion can effectively disturb the plating solution, and the money slit 32a. The strip of the narrow coffee 32 is recorded. (4) 32 is close to the end of its reciprocating movement. (When the end of the lamp is temporarily stopped and decelerated, the electric field shadow formed on the substrate w is reduced (not affected by the electric field or small spots). In this embodiment, as shown in Fig. 3, the slits 32a are formed vertically so that each strip portion 32b has a rectangular cross section. The width of each strip portion is "B" Preferably, it is 2 mm to 8 mm, preferably 3 mm to 6 mm. As shown in Fig. 4A, the four corners of each strip-shaped cross-face can be chamfered. As shown in the 4th figure, the cross section of each strip portion may be in the form of a parallelogram such that it is inclined by a predetermined angle 相对 with respect to a plane perpendicular to the plane of the substrate W. The strip portion is parallel to the substrate w. The inclination angle 0 of the vertical plane is preferably 3" to 60' with 40 S 50. This structure can enhance the effect of the drop of purple 32. The thickness of the mixer 32 (thickness) "t , 'It is better to be 3 mm to 5 mm, and the physical example is 4 mm, so that the adjustment plate % can be placed on the substrate. It is recognized that if the thickness (plate thickness) "t" of the mixing music 32 is 1 mm or 2 mm, the drug % does not have sufficient strength. By making the lion 32 have a uniform thickness, it is possible to prevent the liquid collar or 320840 200936818 Fig. 5 is a diagram showing the driving mechanism of the stirring paddle 32 and the plating tank 1 . The stirring paddle 32 is fixed to the horizontally extending shaft 38 by a clip % fixed to the upper end of the scrambler _ 32. The shaft holder 4 is fixed and horizontally slidable. The end of the shaft 38 is coupled to a stirring drive member 42 for linearly and horizontally reciprocating the stirring paddle 32. The stirring music driving member 42 is provided with a crank mechanism (not The rotation of the motor 44 is converted into a linear reciprocating movement of the shaft 38. In this embodiment, a control member 46 is provided which controls the agitation by controlling the rotational speed of the motor 44 of the agitating paddle drive member 42. The moving speed of the paddle 32. It is also possible to use a paddle drive member that converts the rotation of the servo motor into a linear reciprocating movement of the shaft by means of a ball screw, or a paddle drive member that linearly reciprocates the shaft with a linear motor instead of using song The paddle drive member 42 of the shank mechanism. In this embodiment, as shown in Fig. 6, the reciprocating stroke St of the paddle 32 is such that the strip portion 32b of the paddle 32 at the end of one stroke is not located At the end of the other stroke, the agitating blade portion 32b © overlaps. This reduces the influence of the mixing paddle 32 on the formation of the electric field shadow on the substrate f. In this embodiment, the search paddle 32 is high. It is known to reciprocate the speed of the mixing paddle, especially at a speed of an average absolute value of 7 〇 cm/sec to 1 〇〇 = min/sec. This is based on the following experimental findings of the inventors: When using 8ASD ( The current density (amplitude current density higher than 5 ASD) of ampere/square decimeter ^/2)) can be used to form a bump coating, by using a stirring paddle (which is higher than the conventional paddle) Speed shifting) The bath is agitated to form a bump with a flat top, especially at an average absolute value of 7 〇 cm/sec to 100 17 320840 200936818 cm/sec. In this case, the rotational movement of the motor Μ is converted into &amp; / / with a crank mechanism to make the above; and the motor is rotated one turn, = raw: hyperactive ', I make a reciprocating movement. When the row of this minute is rotated at 250 rpm, it can be formed into the best (four), although the optimum average absolute value of the moving speed of the motor 44 is, therefore, _ purple 32 ο (iv) by the cylindrical portion 5: and the second The material is made of polyethylene. Adjustment board 3 = and :: electricity =: part 5. The front end is arranged on the substrate side to limit the widening of the electric field. Here, the ==, and the axial length chargeable resistor 52 are configured in the plating tank 1G so as to be formed between the anode 26 and the substrate w = 25 亳 is not preferred, 12 mm to 18 mm. Better. «In the past, in the adjustment plate % of the present embodiment, the flange portion 52 is attached to the end of the cylindrical portion 5〇, as shown in the figure, the extremely elongated cylindrical portion 50 makes the cylindrical portion Part 5 of the portion 50, 〇2 protrudes toward the anode side surface of the positive portion 52, as shown in Fig. 8. 3Flange parts As shown in the figure, 'substrate? It is fixed with the substrate holder ^. The two ^, 2 4 series are designed to be able to supply power to the substrate W + with a surface conduction film ', sputtered copper film) around the area. The substrate holder 24 has a plurality of electrical contacts and the total width of the electrical contacts is not less than the circumference of the area around the area where the electrical contacts can be connected to 18 320840 200936818. The electrical contacts are in equal distances to 5 cases, and the substrate protection is thus implemented here. This will protect the door from the reverse pressure of the flow of the plating solution. The in-plane uniformity of ο ^ ° ^ has an adverse effect. The knife cloth is not uniform'. As shown in the money film, the # substrate protection system 24 is set to be used when the conveyor is placed (not shown) to hold the w &quot; support:: on the delivery device. ; the retainer branch 64 on the protruding heart ^ is suspended and supported in the ore tank 1 〇 1G _ magnified perspective view shows the retainer arm and ❿

The Hi diagram is a cross-sectional view of the holder arm portion 64 and the holder bracket 62, and the 12th diagram is the u 12®^^ , f#J#I, (arni_side cJact) 6^° 6 2: = facing the surface of the holder bracket 62. The arm side contacts are electrically connected to the cathode for power supply to the substrate w by wires not shown: on the other hand, the bracket side contacts (su_rt_side c〇ntac (10) are mounted on the holder arm portion 64 of the holder bracket 62 The side contact 68 is electrically connected to an external power source (not shown). When the substrate holder = suspension and support, (4) the contact 66 and the frame side contact, 相互 contact and close 'by The external power source and the cathode contact are electrically connected 320840 19 200936818 so that the cathode voltage can be applied to the cathode contacts. The arm side contacts 66 and the bracket side contacts 68 are typically disposed in the left and right holder arms 64, respectively. One of the left and right holder brackets 62 corresponding thereto. The arm-side magnet (arm_side attachment) 7 作为 as the fixing member is provided on the surface of the holder arm portion 64 facing the holder bracket 62, Further, the branch (four) magnet 72 as a fixing member is provided on the surface of the yoke H bracket 62 facing the holding arm portion 64. For example, the concentrating magnet can be used as the magnets 70, 72. By ❹ ',: the field substrate holder When the suspension and support are carried out on the plating tank 1 , the arm side magnet 70 and the bracket side The magnets 72 will contact and attract each other, whereby the substrate holders can be more stably fixed to the ore tank 10 via the substrate holder 62 and the holder arm. Therefore, the substrate holder 24 can be prevented from swinging due to the movement of the mirror liquid. Or tilting. The arm side magnet 7Q and the rack side magnet 72 are typically sighed on both the right and left retainer arms 64 and the right and left retainer brackets. Positioning of the substrate holder 24 relative to the plating tank 10 This is accomplished by the delivery of the conveyor. As shown in Fig. 13, a groove-shaped opening 62a having a tapered surface may be provided in the holder holder 62, and the holder of the S 24 may be held by the opening 62a as a substrate. A guide for the arm portion 64. When the opening (guide = ) 62a is provided on the substrate holder 62 for positioning the substrate holder 24 and the plating tank (7), the opening 62a is required for the positioning and transportation of the substrate holder 24. Small size "backlash, when the substrate holder 24 is rocked or tilted within the "gap," range, the arm side contact 66 and the bracket side contact 68 may be permanently or intermittently disconnected. Retaining the substrate by magnets 70 72 near contacts 66, 68 The device 24 is firmly supported on the plating tank iq so that it can be touched by 320840 20 200936818. In addition, the restraining and reinforcing joints enable the arm side contact 66 and the bracket side contact 68 to be tightly connected due to the contacts 66, 68. Wear due to friction, durability of 66, 68. One of the f-side magnet 70 and the bracket-side magnet 72 can be replaced with a magnetic material. The magnet can also be coated with a magnetic material to prevent the magnet from being damaged by contact. The magnetic material covers the periphery of the magnet to expose the magnet and part of the impurity material is protruded from the surface of the magnet, thereby increasing the magnetic force. The plating plate is located at the bottom of the plating tank and the shielding plate 80 and the shielding plate 82 are removed. In order to allow the plating solution Q (which is supplied from the liquid supply supply inlet 18 provided at the bottom of the key groove) to form a uniform flow over the entire surface of the substrate W, a space for dispersing the plating solution is provided at the bottom of the plating tank 10, and A separation plate having a plurality of ore passage holes is horizontally arranged in the space. Therefore, the separation plate 10 can divide the inside of the plating tank 10 into the upper substrate processing chamber 84 and the lower clock liquid distribution chamber 86. Fig. 14 is a plan view of the separating plate 8'', which has substantially the same shape as the inner shape of the ore groove 10, and has a plurality of plating liquid passage holes 80a extending through the plate body. The plating bath 10 can be formed into a flow direction by dividing the plating tank 10 into the substrate processing chamber 84 and the plating solution distribution chamber 86 by using the separating plate 80, and providing the separating plate 80' having the plating liquid passage hole 8 &amp; allowing the passage of the ore liquid. Substrate? Uniform flow. If the plating liquid passage hole 8〇a provided in the separating plate 8〇 has a large diameter 'the electric field originating from the anode 26 passes through the plating liquid distribution chamber 86 and leaks into the substrate W side', which affects the plating film formed on the substrate w. In-plane uniformity. Therefore, the plating liquid passage hole 8〇a used in the present embodiment has a small diameter of 2.5 mm. 21 320840 200936818 Although in this embodiment, the plating liquid passage hole 80a is provided throughout the separation plate 80, it is not necessary to provide the small hole 80 line in the manner of the plate body. For example, as shown in Fig. 15, a dispersed money liquid passage hole 80a may be provided in the substrate side region bounded by the position A of the adjustment plate 34, and an opposite region (at the anode) bounded by the position B of the anode 26 A plating passage hole 80a is also provided in the rear portion. The use of the separating plate 80 shown in Fig. 15 can more effectively prevent the electric field of the anode 26 from passing through the mineral liquid distribution chamber 86 and leaking into the substrate W side. Further, when the plating liquid passage hole 80a is also provided behind the anode 26, the plating solution Q can be reliably discharged by the plating tank 10. As shown in Fig. 16, the separating plate 80 is horizontally supported on the separating plate holder 90 provided on the side plate 10a of the ore 10. The separating plate 8 and the separating plate holder 90 can be in close contact by the spacer 92 provided therebetween. Although the separation plate 80 is used, the electric field originating from the anode 26 may still pass through the plating solution distribution chamber 86 and leak into the substrate w side, which affects the in-plane uniformity of the mineral film formed on the substrate W. Therefore, in this embodiment, the shield plate 82 extending vertically downward is mounted on the lower surface of the separation plate 80. The drum screen panel 82 can more effectively prevent the electric field originating from the anode 26 from passing through the money liquid distribution chamber 86 and leaking into the substrate w side, while ensuring that the plating solution Q is dispersed in the plating liquid distribution chamber 86 and forming the plating solution Q. The flow into the substrate processing chamber 84 is uniform. In this regard, as shown in Fig. 17, the shield plate 82 is attached to the lower surface of the separation plate 80 in such a manner that the shield plate 82 is disposed directly above the plating solution supply inlet 18, and is provided in the shield plate 82 and the plating tank. A gap "S" is formed between the bottoms. In order to prevent electric field leakage, the gap "s, as small as possible is preferred. 320840 22 200936818 * As shown in Fig. 18, a shield plate 82' that is in contact with the bottom of the plating tank can also be disposed and set in the shield plate 82. The semicircular opening 82a ensures a flow path for the plating solution. Further, in this case, the opening 82a is as small as possible to prevent leakage of the electric field. The shielding plate 82 is configured to be positioned under the separation plate 80. In the region of the 有a ,a, for example, in the region of the adjustment plate 34 directly below the flange portion 52. Although in this embodiment, the shield plate 82 is disposed in the plating solution. Directly above the supply port 18, the shield plate 82 does not have to be disposed directly above the plating solution supply inlet 18. Alternatively, a plurality of shield plates 82 may be used. In the plating apparatus of Fig. 1, the substrate W and the anode are used. 26. The positional relationship of the adjustment plate 34 and the agitating paddle 32 in the plating tank 10 affects the in-plane uniformity of the mineral film formed on the substrate w. In this embodiment, the substrate W, the anode 26, and the conditioning plate 34 Is configured such that the center of the substrate W, the center of the anode 26 The axis of the cylindrical portion 50 of the adjustment plate 34 is substantially aligned. In this embodiment, the pole-t〇-pole ❾distance of the anode 26 and the substrate W is 90 mm; and the distance between the poles is substantially It can be set in the circumference of the 6 〇 ^ 宅 house card. In this embodiment, the distance between the substrate W and the cylindrical portion 50 of the adjustment plate 34 at the end of the substrate W side is 15 , meters, and the column shape The length of the portion 5G is 2G mm, so the distance between the substrate W and the flange portion 52 of the regulating plate 34 is 35 mm. As shown in Fig. 19, the electric field shielding member 94 whose lower end is in elastic contact with the separating plate 8 is (for example The rubber sheet is made at the lower end of the flange portion 52 of the regulating plate 34 on the anode side. The electric field shielding member 94 prevents the motor from being disposed between the separating plate 8 and the flange portion 52. The gap is leaked out. 23 320840 200936818 The lower surface of the flange portion 52 is brought into close contact with the upper surface of the separating plate 80 so that the flange portion 52 can also function as an electric field shielding member.

调节 The adjustment plate 34 can be placed in the plating tank 10 in such a manner that the distance between the adjustment plate 34 and the substrate w can be adjusted. In particular, as shown by the second circle, the adjustment plate fixing slit plate 96 having a plurality of vertical slits 96a arranged at a predetermined pitch may be mounted on the side plate 10a of the plating plate 10, and the regulating plate may be Each side end of the flange portion 52 is inserted into any slit = a of the adjusting plate fixing slit plate %. The adjusting plate fixing slit plate 916 can be attached to the sloping side plate 10a by the slit 9 β b and the fixing screw. This - the mounting method makes it possible to finely distort the copper, 8 gusset plate 34 from the substrate w so that the adjustment plate 34 can be positioned at the optimum position of the entire substrate. Preferably, the pair of electric field shielding members 1 由 made of a rubber seal are bitten at the flange portion near the adjusting plate fixing slit plate 96, and the second portion is formed by the anode 26 toward the substrate W. The electric field passes through the flange portion to prevent a gap with the slit 96a. The electric field shielding members 1 are each located on the anode side of the adjusting plate fixing slit plate 96. &quot;Installation In the plating apparatus of the present invention, the diameter of the substrate formed on the substrate was 150 μm, and the target thickness of the plating was 11 μm. The type II bump is preferably formed using a copper sulfate concentration of not less than 15 g/l: the exemplary plating solution includes an in-situ solution having a lower compound, and a plating solution. Additives 'especially polymer components (inhibitors), carrier: seed just), and leveling agent components (inhibitors): Treasury (combination of sulfuric acid steel pentahydrate (CuS〇4- 5H2〇): 2 gram/liter 320840 24 200936818 Sulfuric acid (H2SO4): 100 g/L chlorine (Cl): 60 mg/L Although the conventional plating method is conventionally carried out at a current density of 3 ASD to 5 ASD. The plating of the bumps is formed by the present invention at a current density of, for example, 8 ASD. The plating apparatus and the plating method of the present invention can perform plating at a current density of up to 14 ASD. Unless otherwise stated, In the following description, the 'mineralization operation is performed at a current density of 8 ASD. Figure 21 illustrates a copper plating process for forming bumps. First, pre-cleaning with water by immersing the substrate in pure water, for example, for 1 minute. Substrate. Next, the substrate is pretreated by immersing the substrate in 5 volume percent (v% by weight) of sulfuric acid, for example, for 1 minute. The substrate is then washed with pure water for, for example, 30 seconds. The pure water cleaning system is performed twice. After that, the copper plating of the base is implemented in the following manner. First, immerse the substrate in the liquid without holding current, 'only 1 knife 麴, and then apply current to the plating system. Clean the substrate after washing with pure water, then _ if by (4) blowing to dry _ Substrate. Know ma#J', J^^^(resist-tripping solutio) is stripped from the substrate, and is washed and dried by water. Figures 22 and 23 show that the convex current density of different shapes is also 8 ASD. However, different mineral deposit methods with different degrees of staining are used. The shape of the bumps formed in the following manners is shown in the following way. The image of the brother 22 shows the average (four) Μ when the solid surface is covered, so that the stirring purple is dreaming 2G cm/sec. The speed (which is the conventional speed) is shifted! By this, the plating solution is formed. The 23rd_phase is formed by the following method. - 320840 25 200936818 Shape: When performing plating, make the stirring purple to the average absolute value. The plating solution was stirred at a speed of 83 cm/sec. As shown in Fig. 22, the stirring paddle which was plated with a high current density of 8 ASD while stirring the plating solution was moved at a known low speed, thereby forming a convex shape. In the case of a block, the height hl of the convex top of the bump is 30 mm, however, as shown in Fig. 23, the same is used. The high current density of the mineral coating and the mixing of the plating solution are at a significantly higher speed (average absolute value of 83 cm / sec) to form a bump in the case where the convex portion is convex The 9 degree h2 is 15 micrometers and is significantly lower than the height of the conventional bumps. ^ Figures 24 to 28 illustrate plating by using the same plating apparatus as the plating apparatus shown in Fig. 1 A photomicrograph of a bump formed on a substrate (wafer) in which the plating method is performed using different inductive music and at different moving speeds. Specifically, the bump shown in Fig. 24 is formed by performing the mineral coating while the mixing of the bonding liquid (thickness of 2 mm) is an average absolute value of 4 〇 / The speed shift of the second can observe defects in the bumps formed on the entire surface of the substrate. The bump shown in Fig. 25 was formed by moving the stirring paddle (thickness 4 mm) of the plating solution while moving, with a mean absolute value of 40 cm/sec. The bumps formed on the entire surface of the substrate are defective and have an irregular shape. It can be seen from Figs. 24 and 25 that it is not sufficient to increase the thickness of the mixing paddle. The bump shown in Fig. 26 was formed by moving the stirring paddle (thickness 4 mm) of the plating solution while moving at a speed of an average absolute value of 67 cm/sec. Defects can be observed on the bumps formed on the entire surface of the substrate. The bump shown in Fig. 27 is formed by the following method: 320840 26 200936818 %: At the same time as the implementation of the money cover, the mixing of the plating solution (thickness 4 mm) is an average absolute value of 83 cm / The speed of the second moves. The bumps formed on the entire surface of the substrate are excellent bumps without defects. We believe that the reason for the difference between the bumps in Figure 26 and the bumps in Figure 27 is that when the paddle is moved at a low speed, the supply of copper ions is insufficient under high current density conditions, and the defects of the bumps When the paddle is moved at a high speed, a sufficient amount of copper ions can be supplied to form a defect-free bump. When the shovel is applied under the same high current density conditions, the disturbing purple (thickness 3 mm) of the scrambled liquid is moved at a speed of an average absolute value of 83 cm/sec, and the entire formation on the substrate can be observed. There are no defects on the surface of the bumps, as shown in Figure 28. As can be seen from the comparison of Fig. 27 and Fig. 28, the use of a scrambled purple system having a thickness of 3 mm produces a relatively round top bump as compared with the use of a spoiler having a thickness of 4 mm. Figure 29 is a diagram showing the height distribution of the bumps formed on the substrate by plating using a plating tank without a shield plate under the separation plate, and the Φ 30 map is not used under the separation plate. The plating of the shielding plate is used to perform the height distribution of the bumps formed on the substrate. The value listed in the note is in the order of 'micron (/ΖΠ1). As shown in Fig. 29, when the shield is not used, the plating thickness (bump height) of the edge portion of the substrate near the bottom of the mirror groove is More than the central portion, however, as shown in Fig. 30, when the shield is used, the thickness of the underlying portion of the substrate near the bottom of the bell groove is reduced to approximately the same extent as the plating thickness of the central portion. The graphs of FIGS. 31 and 32 are diagrams showing the in-plane uniformity of the height of the bumps formed on the substrate by different plating methods on the substrate, the squares of the different shapes and arrangements of 27 320840 200936818 m The 32nd half-purple from different distances of the substrate is used to disturb the plating solution with different moving speeds. Fig. 31: The X-axis and the Y-axis are the orthogonal axes in Fig. 33. The in-plane ratio of the height of the bumps formed in the following manner = two and I is the recording system of the bumps, using a 5 mm thick flat adjustment plate at a distance of 35 mm from the substrate, and the stirring paddle is an average absolute value. For a speed of 20 cm / sec 图 32 Graph -: The distribution of the twist (plating thickness) is W-shaped Distribution curve. The second dimension:: In-plane uniformity of the height of the bump: Shape = Γ = is used as shown in Figure 7, and the distance from the substrate is 15 milli' (four) stirring plating (four) (four) 83 movement. The distribution curve of the height of the bump (plating thickness) is flatter than that of Fig. 31, which means that the in-plane uniformity of the bump of Fig. 32 has a hint of south. ❹ Figure 34 is a ship of the invention. The plating device of another specific physical embodiment of the covering device uses a shielding plate 82 which is vertically downwardly t-shaped by the lower surface of the separating plate 8 and reaches the bottom wall of the plating tank 1G by the lower end. Therefore, it is formed under the = plate 80. The plating solution distribution chamber 86 is completely divided by the shield plate into the %-pole solution distribution chamber 110 and the cathode-side solution distribution chamber ι 2. The lower end surface of the shield plate 82 is fixed to the bottom wall of the plating tank 10 by, for example, welding. The supply route 16 is at the weft temperature unit 2〇 and the filter main valve m and the flow meter 116. Downstream of W22, the mineral supply route is forked into two bifurcation routes 16a, 16b, and the bifurcation routes 16a, (10) are each connected to Anode side solution distribution chamber 110 and cathode side solution distribution chamber 320840 28 200936818 112. Bifurcation route 16a And 16b are each provided with valves 118a and 118b. By completely separating the plating solution distribution chamber 86 by the shield plate 82 in this manner from the pole side distribution chamber UG and the cathode side solution distribution chamber 112, the coke can be prevented from being generated by the anode 26. The potential line passes through the clock liquid of the plating solution distribution chamber 86 and enters the cathode (substrate) side. Further, the liquid liquid can be supplied to the anode side solution distribution chamber and the cathode side solution distribution chamber 112 by the plating liquid supply route 16. Ο FIGS. 35 and 36 illustrate another drive mechanism for the agitating paddle 32. The plating tank 10 〇 In this embodiment, the upper end of the agitating paddle 32 is attached to the paddle holding member 12G. The shaft 3 protruded from the secret member 42 = the skin portion, the right portion: the right end supported by the shaft holder 4〇 and the two '38b' respectively, and the two cups 38c located between the end shaft bar and 38b . The intermediate shaft 38c is passed through the (four) holding member i2 〇 two: the middle coupling one

Q coffee. Here, the sinus sinus, such as the sinus, and the sinus 122b, is connected to the end shaft joint. In the case of a non-monthly case, the couplers 122a, 122b are of a screw type but can be used with any coupler, such as a so-called quick coupling, which can be transmitted through the couplers 122a, 122b by means of the couplings 122a, 122b. The mine cover removes the shaft retainer 4〇. Because the accompaniment of the mixer 32 is applied to the plating position, it can be re-arranged at the predetermined position. The re-installation of the paddles by the people can be easily removed and reinstalled by temporarily removing the spoiler 320840 29 200936818 paddles 32 from the ore cover device. Figure 37 illustrates another adjustment plate and another plating tank provided with an adjustment plate moving mechanism. The plating tank 10 of this embodiment includes an inner tank 130 and an outer tank 132 surrounding the outer circumference of the inner tank 130. The adjustment plate 134 is composed of a rectangular plate-like main body portion 138 having a cylindrical portion 136, and a clamping portion 140 which is wider than the main body portion 138 and integrally formed with the top portion of the main body portion 138. In this particular embodiment, the positioning of the adjustment plate 134 in the lateral (horizontal) direction parallel to the substrate W is completed by the adjustment plate moving mechanism 142 via the clamping portion 140. The adjustment plate moving mechanism 142 includes: an adjustment plate bracket 144 configured to open across the mirror slot 1; a pair of brackets 146 vertically mounted on the outer peripheral end of the adjustment plate bracket; each of which is formed by each of the brackets a lateral press b lt 148 that is engaged with the female thread of the frame 146 to be horizontally movable; and a horizontally extending horizontally extending bolt that penetrates the unloaded hole of each of the brackets 146 and extends horizontally 15(). When the clamping portion 140 of the spoon plate 134 is placed on the adjusting plate bracket (4) and the adjusting plate 134 is set to the predetermined position, the position of the pressing pin 148 and the lateral fixing bolt 150 will be The outer peripheral end surface of each outer circumference of the nip portion H0 is sandwiched. In the position of the ^ 1Rn ^ . ^ 鳊 opposite to the lateral fixing bolt 15 ,, the respective lateral and female threads are formed. The lateral pressing bolt 1 (10) is in contact with the surface of the threaded spigot, and when it is tightened, it is directed to: pressure = please. Therefore, place the adjusting plate 13 134 134 ° frame 144 and set the adjusting handle, A holding part After the adjustment plate branch 134 is at a predetermined position, the lateral direction of the adjustment plate 134 may be parallel to the substrate W by a lateral pressure of 320840 30 200936818 ', 8 .

The : position ' and the lateral fixing bolts (10) can be used to fix the adjustment plate 134. The positioning of the slab 134 by the lateral pressing of the ride 148 and the lateral fixing 15 经由 can be performed by the other portions of the adjustment plate 134. The distance of the adjustment plate 134 (four) to the (horizontal) movement can be easily adjusted by controlling the number of revolutions of each of the lateral pressing bolts 148 having a predetermined pitch. When the lateral pressing bolt 148 is not in contact with the outer peripheral end surface of the holding portion 140 without pressing the regulating plate 134, each of the lateral fixing screws 15 acts as a draw bolt. The adjustment plate 134 is moved in the lateral direction parallel to the substrate, and a gap is formed between the circumferential surface of the main portion 138 of the adjustment plate 134 and the inner circumferential surface of the groove 13〇 in the plating groove 1〇. In this embodiment, in the inner groove 13〇: opposite to the circumferential surface of the main body portion 138 of the adjusting plate 134: a guiding member having a groove-shaped groove inwardly forming an opening σ is provided The outer peripheral end portion of the main body portion 138 of the adjusting plate 134 is inserted into the recess 52a of the guiding member 152. The guiding member 152 is such that the regulating plate 134 can use the guiding member 152 as a guide to move laterally (horizontally) in parallel with the substrate f while maintaining the distance between the regulating plate 134 and the substrate w. Further, the insertion of the outer peripheral end portion of the main body portion 138 of the adjusting plate 134 into the recess 152a of the guiding member 152 prevents the electric field from being exposed by the periphery of the regulating plate 134. As shown in Fig. 38, a movement gap t1 is provided between the peripheral surface of the main portion 138 of the regulating plate 134 at the bottom of the groove 152a of the guiding member 152. For example, the moving gap tl is preferably from j mm to 5 mm' and is preferably from 1 mm to 2 mm. For structural reasons, pass 320840 200936818 * A gap t2 is often formed between the guiding member 152 and the inner circumferential surface of the inner groove 130. In this embodiment, in order to prevent the potential line from being exposed by the gap t2 The seal holding member 154 and the plurality of fixing bolts 156 fix the electric field shielding member 158 (for example, composed of a rubber seal) to the guide member 152 'where the free end of the electric field shielding member 158 is pressed against the inner peripheral surface of the inner groove 130 Pressure contact. Although in this embodiment, the electric field shielding member 158 is disposed on the anode side of the guiding member 152, it may be disposed on the cathode (substrate) side or both sides of the guiding member 152. Have.慑&amp; In this embodiment, the adjustment plate moving mechanism 142 is used, and the adjustment plate 134 is laterally moved in parallel with the substrate W. However, the second plate 134 may be horizontally and vertically moved in parallel with the substrate w. Fig. 39 is a regulation plate moving mechanism 160 designed to move the adjustment plate 134 horizontally and vertically in parallel with the substrate W. The adjustment plate moving mechanism 16G differs from the 37th _ ❹: plate moving machine in that a heave-sert femaWh is provided in each outwardly protruding portion of the unloading flaw 140 of the adjustment plate 134. ¥穿穿螺旋 reads 1R0^ ei〇alethread)' and vertically presses the lower surface of the screw 162 (which is threaded with the female thread) and the top surface of the adjustment plate bracket 14 Contact, money and money holding department 4 (four): The Ministry has a narrow two out of the width of the mine slot i = the screw inspection 164 inserted into the slit, and Jiang Mu will be straight solid ^ set in the 詷r Cup Gujia 144 dip The lower portion of the vertical solid bolt 164 is laterally fixed to the female body of the female bracket of the plate bracket 144. The embodiment of the bolt 163 is not used. According to this embodiment, the tip of the bolt 162 is aligned with the top surface of the adjusting plate bracket Mi when the 钿 钿 士 士 士 朝 朝 320 320 320 320 320 320 320 320 320 320 320 320 320 320 320 320 320 320 320 320 320 320 320 320 320 320 320 320 320 320 320 320 320 320 320 320 320 320 320 320 320 In contact, the adjustment plate 134 is moved upward by a reaction force with respect to the contact pressure acting on the top surface. On the contrary, when the vertical pressing bolt 162 is rotated in the loosening direction, the regulating plate 134 is moved downward. After the horizontal and vertical positioning of the adjustment plate 134 with respect to the substrate W is completed, the lower portion of the vertical fixing bolt 164 is engaged with the female screw provided on the adjustment plate holder 144 to fix the adjustment plate 134. Instead of the press-in bolts Mg, ❹ 162, a cylinder, a servo motor or the like can be used. Further, the adjustment plate moving mechanism (4) shown in Fig. 37 and the adjustment plate moving mechanism 16A shown in Fig. 39 can be used in combination to adjust the vertical and horizontal positions of the adjustment plate. In this case, the vertically extending slit for the insertion of the lateral fixing screw 4 can be provided on the truss 146, whereby the adjusting plate '丨34 can be fixed by the lateral fixing bolt 150 regardless of the vertical displacement position of the adjusting plate 134. Why? It is also possible to omit the lateral press-in screw 148 of the slab moving mechanism of Fig. 39 to perform only adjustment! 34 with respect to the vertical positioning of the substrate #. By using the adjustment plate moving mechanism 142 to finely adjust the horizontal position of the adjustment plate 134 with respect to the men's plate W or by using the plate movement mechanism (10) to finely adjust the horizontal and vertical positions relative to the substrate W, the plating formed on the substrate evaluation surface can be improved. Long thick red noodles _ (10). (4) Yes, it is important to arrange the in-plane uniformity of the thickness of the substrate on the fineness of the substrate. Further, the splicing plate is added to the adjustment plate I% shown in Fig. 37 shown in Figs. 40 and 41 of the auxiliary adjustment plate 170. With 320840 33 200936818 ❹

The auxiliary adjustment plate mounting member is provided on the anode side surface of the main body portion 138 of the adjustment plate 134. The auxiliary adjustment plate mounting member is fixed at a position corresponding to the peripheral side portion of the auxiliary adjustment plate 170. The pair of side hooks 172a are formed with a pair of bottom hooks 172b fixed to the bottom corners of the auxiliary adjustment plate 170. By placing the auxiliary adjustment plate 170 on the auxiliary adjustment plate mounting member of the adjustment plate 134 (consisting of the pair of side hooks 172a and the pair of bottom hooks 172b), the auxiliary adjustment plate can be placed to be opposed to the adjustment plate 134. At the scheduled location. In this embodiment, an opening 134a# (8 吋 wafer conditioning board) for an 8 吋 wafer is used as the conditioning board 134, and an auxiliary conditioning board having an opening 170a for 6 wafers. (6 吋 wafer conditioning plate) is used as the auxiliary adjustment plate 170. With this configuration, when the substrate W is replaced by an 8-inch wafer (for a wafer, an auxiliary adjustment plate (6-inch wafer conditioning plate) 17A is attached to the adjustment plate (8-inch wafer adjustment plate) 134, that is, This change can be handled without replacing the adjustment plate. The grip opening 170b is provided at the top of the auxiliary adjustment plate 1?. The lateral dimension 't3, t4 and the lower vertical dimension t5 of the overlap between the adjustment plate 134 and the auxiliary adjustment plate 17 are generally not less than 5 mm and not less than 1 Gm. When the auxiliary adjustment plate m is attached to the second 134, this prevents the power line of the anode 26 from passing through the gap of the adjustment plate adjustment plate no and then passing through the opening i3/ of the adjustment plate 134, assisting the opening through the auxiliary adjustment plate 170. a. &amp;&apos; While this particular embodiment uses a combination of eight pairs of wafer conditioning plates and conditioning plates, it is possible to use a combination of any two conditioning plates (second conditioning plates). For example, the second adjustment plate combined with the first adjustment plate can be used when it is necessary to adjust the electric field cloth according to the type of the substrate (the clock cover member) to be used in the case of the use of the first adjustment 320840 34 200936818. Figures 42 and 43 show the main parts of another embodiment of the plating apparatus of the present invention. The plating apparatus of this embodiment differs from the ore coating apparatus of the first embodiment in that the former is used in the top anode holder ❹ adjustment plate 134 (as shown in Fig. 37), and the anode _ n 8 § Zhou Lang board 134 and substrate holder 24 are respectively connected via the clamping portion 8 〇, the clamping portion 14 〇 and the holder arm portion 64 (please refer to the figure, the simple positioning of the top opening of the money (4)/protection ^ : Therefore, it is the holding portion (10) of the pole holder 28 on the positioning/holding portion (four) 2 composed of a single member, the adjusting plate = the ceremony 140, and the holder arm of the substrate holder 24. The central axis of the substrate W fixed by the anode holder 28 and the cylindrical portion 136 of the adjustment plate 134 is overlapped with each other and held by the substrate, although in this embodiment, It is the positioning of the anode holder cow placed on the holding member 182, and the base portion _, the adjustment 6 4 ' however, it is also possible to position the anode holder 2 8 1 section of the arm holder 24 Other parts are located in the positioning/holding part = (4) 4 and the substrate positioning/holding part 182 as a reference. Upper 'As long as the available positioning plate 134 and the vertical positioning holder 28 of the substrate holder 24, the adjustment 44 and 45 illustrate another adjustment plate. _ (4) Add 320840 35 200936818 The adjustment plate 134 shown in Fig. 7. The diaphragm 188 is = C = XingPlate)] 84 and the fixed screw (4) is fixed to the anode side surface (10) of the body portion 38 of the plate 134 to cover the entire central opening 134a. The cation exchanger functional film (which is composed of a neutral coffee) through which the additive is impermeable may be used. In this way, the opening of the adjusting plate 34 is covered with the crucible 188 to decompose and consume the surface of the anode 26 with the additive of the liquid. 3, the plating of 46 to 48 is the other two of the money-covering device of the present invention, which is composed of a cylindrical portion 50 and a pre-section on the inner circumferential surface of the rectangular flange portion. The plate holder is formed in a rectangular frame of a plating tank. The adjustment plate holder is composed of a large portion 202a having a similar/[secret than the adjustment plate 34 = the holder (1). The thickness of the flange portion 52 of the protruding section plate 3 is the same. The degree is about the same as that of the inner circumference of the type 2, and is held at the bottom and the side of the end plate in the ore tank 10 (hinge pi plus movable (four) device 204 The lower end is held by the chain pin 2 = rotatively supported on the mine tank 1 。. When the movable bottom and the two: two == rotation, the movable holder 204 contacts the member, and the second holder moves The protruding portion _ is in the solid-state holder 202 and the movable holder 2〇4 320840 36 200936818, and the adjustment plate 34 to be placed can be formed. The thickness of the flange is about the same as the thickness of the flange portion 52 of the adjusting plate 34. The gate 2 ^ 2 〇 δ ^ prevents the lower end of the material collector 204 from stopping the electric field in the movable holder 204, the bell groove according to the specific embodiment f (1) is exposed. The device 200, wherein the plate 34 is fixed to the adjusting plate by means of the inner lining, and the movable plate is arranged to be crying and the female setting plate 34 is fixed. The holder 202, the movable holding &amp; m, and the movable scale 2 holder 202 is rotated and clamped, for example, with the gripper; 204, the guide holder 204 is fixed and movable. Between the holders m. In the Γ mode holder 202 and the plate holder -., the secret between the electric holders 204 can be prevented.

Q can be 'released from the adjustment plate holder 2q' by first releasing the movable holder 204, and then rotating the plate 34: away from the fixed holder 202, as shown in Fig. 48. The holder 204 is tilted upward to pull out the adjustment plate 34. "," followed by movable protection = detachably arranging the detachable plate holder 200 at a predetermined position of the plating tank 1G, which can be simply and quickly adjusted to the board 34. Although the invention has been described in terms of specific embodiments, : Replacement of the plate 34. = 2 The present invention is not limited to the above-described specific embodiment ',, = = the artist should modify the concept within the concept of the invention. 疋 wish to cover [simple description of the schema] A vertical section of the forging device of the present invention is a front view of a vertical section 320840 37 200936818; a second drawing is a plan view of a stirring paddle used in the plating apparatus of FIG. 1; and a third drawing is taken along a line AA of FIG. A cross-sectional view of the drawing; FIG. 4A and FIG. 4B each illustrate a stirring paddle variant corresponding to FIG. 3; and FIG. 5 is a schematic view showing a paddle driving mechanism and a plating tank of the plating apparatus of FIG. 1; The plan view of Fig. 6 is a view showing the stroke end of the stirring paddle; the seventh drawing is a perspective view of the adjusting plate used in the first drawing device; the eighth drawing is the side of the other adjusting plate. Figure 9 is a diagram showing the substrate holder of the plating apparatus of Fig. 1 and the holder of the plating tank. FIG. 10 is an enlarged perspective view showing the holder arm portion of the plating apparatus of FIG. 1 and its vicinity; 横截 The cross-sectional view of FIG. 11 is a view showing the holder arm and the holder that are in contact with each other. Figure 12 is a right side view of Figure 11; Figure 13 is a perspective view of another holder holder; Figure 14 is a plan view of the separation plate used in the plating apparatus of Figure 1, and Figure 15 is a separation plate A plan view of one of the variants; Fig. 16 is a cross-sectional view showing the side plate of the plating tank in which the separating plate is mounted in the first plating apparatus; the perspective view of Fig. 17 is a plan view of the scraping device Separation plate in the middle, 320840 38 200936818 The relationship between the shielding plate and the bottom of the plating tank; The perspective view in Fig. 18 shows another relationship between the separating plate, the shielding plate and the bottom of the plating tank; the cross-sectional view of Fig. 19 is a diagram The relationship between the flange portion of the adjusting plate in the first plating device and the separating plate; the top view of the plating groove in Fig. 20 shows the specific arrangement of the adjusting plate in the plating tank by adjusting the distance between the adjusting plate and the substrate Embodiments; ❹ , 21 is a copper plating process for forming bumps Cheng;; ^ ^ ^ * Formed bump shape: 8 ASD n X order _ 纟 (4) (four) to move at an average absolute value equal to 20 cm / sec; ^ (four) value for 20 23 The figure does not need to use the following antiques: No lacquer %% - the shape of the bump formed in the following way: at 8 ASD n and at the same time by moving the paddle at an average absolute value equal to 83 cm / sec ;^(四)值松83 Plating HFig.2 is a photomicrograph of a bump formed by the millimeter H method: the moving speed is applied to the plating, and the average absolute value is equal to 40 cm/sec. The picture is formed in the following manner: "When plating, make a thickness of 4 mm and "~ 蹲 micro as a piece. Move at a speed of the order to stir the plating solution; 40 &amp; knife / private = 26 figure is formed in the following manner Convex plating makes a 4 mm thick 嫱41 儆 儆 photo. Move at the speed of the enthalpy to teach the mixing of molten iron; equal to 67 y / s. Figure 27 is a micrograph of the bump axis formed by w: Stir the plating solution with a 4 mm thick paddle at an average absolute value of 83 cm/sec while performing a 320840 39 200936818 clock cover; Figure 28 is a photomicrograph of a bump formed by moving a paddle having a thickness of 3 mm at a speed of an average absolute value of 83 cm/sec to agitate the plating solution when plating; Figure 29 shows the following: The distribution of the height of the bump formed by the method on the substrate: plating is performed using a plating tank in which the shielding plate is not disposed under the separating plate; FIG. 30 is a distribution diagram of the height of the bump formed in the following manner on the substrate: use The bell groove of the shielding plate is provided under the separating plate for plating; the curve of Fig. 31 shows the uniformity of the height of the bump formed in the following manner in the in-plane of the substrate: the opening is opened in the center and is spaced from the substrate 35 A 5 mm thick flat adjustment plate of millimeters is used for plating, while the agitating paddle is moved at an average of 20 cm/sec. The curve of Fig. 32 shows the height of the bump formed in the following manner. In-plane uniformity of the substrate: use the adjustment plate shown in Figure 7 at a distance of 15 mm from the substrate to ride ", (4) to move the plating solution by moving the lion-flat contact value equal to (10) cm/sec; Figure 33 shows the 31st map and the first map The X-axis and the γ-axis are referred to; the 帛34 diagram is a vertical cross-sectional front view of another embodiment of the plating apparatus of the present invention; the plan view of the =35 diagram is an illustration of another-purchasing mechanism and a mining tank; a vertical cross-sectional front view of Fig. 35; a vertical cross-sectional side view of the machine diagram showing another adjustment plate with an adjustment plate moving mechanism and another mining tank; 320840 40 200936818 t Figure 38 is along the 37th The cross-sectional view of the straight line BB of the figure; the 39th part shows the main part of the adjusting plate provided with another adjusting plate moving mechanism; the 40th is the front view of the other adjusting plate; the 41st is the 40th Figure 42 is a plan view; Fig. 42 is a vertical sectional front view showing another embodiment of the plating apparatus of the present invention; and Fig. 43 is a front view showing the anode holding used in the plating apparatus shown in Fig. 42. And the positioning/holding member; Fig. 44 is a front view of another adjusting plate; Fig. 45 is a cross-sectional view taken along line CC of Fig. 44; Fig. 46 is another drawing of the plating device of the present invention A vertical cross-sectional front view of a specific embodiment; a cross-sectional view of FIG. 47 is a cross-sectional view of FIG. The adjustment plate holder and adjustment plate of the illustrated plating apparatus; and the sectional view of Fig. 48 illustrate the adjustment plate holder when the adjustment plate is released by the adjustment plate holder. [Main component symbol description] 10 plating tank 10a side plate 12 overflow tank 14 pump 16 plating liquid supply route 16a, 16fc 1 bifurcation route 18 plating liquid supply inlet 20 thermostatic unit 22 filter 24 substrate holding 26 anode 28 anode holder 41 320840 200936818 30 Plated power supply 32 Stirring paddle 32a Slit 32b Strip 34,134 Adjusting plate 36 Clamp 38 Shaft 38a, 38b Right and left end shaft 38c Intermediate shaft 40 Shaft retainer 42 Stirring paddle drive unit 44 Motor 46 Control part 50 Cylindrical part 50a Part 52 Rectangular flange part® 60 Retainer clamp 62 Retaining bracket 62a Grooved opening 64 Retainer arm 66 Arm side contact 68 Bracket side contact 70 Arm side magnet 72 Bracket side magnet 80 Separation plate 80a Plating liquid passage hole 82 Shielding plate 82a Semicircular opening 84 Substrate processing chamber 86 Plating solution distribution chamber © 90 Separation plate holder 92 Lining 94, 100 Electric field shielding member 96 Adjusting plate fixing opening plate 96a, 96t 1 slit 98 fixing screw 110 anode side solution distribution chamber 112 cathode side solution distribution chamber 114 main valve 116 flow meter 118a, 118b valve 120 Agitating paddle retaining members 122a, 122b Coupling 130 Inner groove 132 Outer groove 134a, 170a Opening 42 320840 200936818 136 Cylindrical portion 138 Rectangular plate body 140 Clamping portion 142, 160 Adjustment plate movement 144 Adjustment plate bracket 146 Bracket 148 Transverse press-in bolt 150 Transverse fixing bolt 152 Guide member 152a Grooved groove 154 Sealing retaining member 156 Fixing bolt 158 Electric field shielding member 162 Vertical press-in bolt 164 Vertical fixing screw 170 Auxiliary adjustment plate ® 170b Clamping opening 172a side Hook 172b bottom hook 180 wide clamping portion 182 positioning/holding member 184 fixing plate 186 fixing bolt 188 diaphragm 200 adjusting plate holder 202 fixed holder 202a protruding portion 204 movable holder 206 hinge lock 208 electric field shielding member ❿B Width Η Lateral length Li, L2 Vertical length Q Key liquid W Substrate (plated object) St reciprocating distance t Thickness (plate thickness) θ Tilt angle tl Moving gap t2 Clearance t3, t4 Transverse dimension t5 Lower vertical dimension 43 320840

Claims (1)

200936818 VII 1. Patent application scope: A plating device for plating articles, comprising: a plating tank for accommodating a plating solution; an anode, the impurity is immersed in the plating tank _ ship; retainer It is used to hold the (4) object and to position the keying member at a position relatively opposite to the anode; e ❹ _, which is disposed between the pole and the bribe object held by the holder, and The plated article moves in parallel to agitate the plating solution; and the control member 'is used to control the search and paddle driving component for driving the mixing paddle; the ship's control component controls the mixing The component makes the average absolute value Μ cm/sec to 1〇° cm/sec. The speed m patent model (4) 1 money covering device, the lion is a plate-shaped member of a plurality of strip portions. 3. The bell covering device of item 2, wherein the plate member has a thickness of from 3 mm to 5 mm. 4. The plating device of the item, wherein the inclination of the mixed music is 30 degrees ° to the horizontal direction of the knife for the vertical plane parallel to the ore-covered object. 5. The patent range of the female I is 2 ^ per part 'The object of the smashing drug has a width of 2 mm to 8 mm. For example, the clock covering device of the scope of claim i, wherein the distance between the (4) and 320840 44 200936818 is 5 mm. 7. For example, please apply the patent, the item d is disposed at the anode and the match. An adjustment plate composed of electricity, the adjustment plate comprises: a field of 7 丨 材料 材料 一份 · · · · 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如f, in the plating material is 8 mm to 25 mm. The distance between the side end portions of the money covering member is as follows: for the plating device of the application for the special home, the retaining arm portion that protrudes outward, and the retaining device of the neck 2, the arm portion is in contact for suspension and support The retention;;^ with: and the protection: two: the 'in the holder arm and the device: the device::: has a fixed member' used to hold the holder arm two:: the recording device of item 9 Wherein the fixing member is at least one of the retainer arm portion and the retainer bracket as claimed in claim 9; the retainer bracket is at least in the four contact regions: a gamma The point is that the holder is suspended and supported on the plating tank and is in contact with each other and is allowed to supply 320840 45 200936818* to the ore covering member when the contacts are closed. 12. A plating method for coating a workpiece, comprising: arranging an anode and a plating member opposite to each other in a plating bath of a plating tank; and agitating between the anode and the plating member The violet reciprocates in a manner parallel to the coated article at an average absolute value of 70 cm/sec to 100 cm/sec while applying a voltage between the anode and the plated article. 13. The plating method of claim 12, wherein the agitating paddle is a plate-like member having a plurality of strip portions. 14. The plating method of claim 13, wherein the plate member has a thickness of from 3 mm to 5 mm. 15. The plating method of claim 12, wherein the distance between the stirring paddle and the recording object is 5 mm to 11 mm. 16. The method of coating of claim 12, wherein each of the strips of the slabs is inclined by 30 to 60 degrees with respect to a vertical plane parallel to the plated article. 17. The plating method of claim 12, wherein each of the strip portions has a width of from 2 mm to 8 mm. ^ 18. The plating method of claim 12, wherein an adjustment plate made of a dielectric material is disposed between the anode and the mixing pad. The adjustment plate comprises: x 'with the contour of the subtracting member And a flange portion connected to the outer peripheral end of the anode portion of the cylindrical portion, wherein the electric field formed between the anode and the covering member is adjusted by 320840 46 200936818*. 19. The method of claim 4, wherein the distance between the ship covering member and the side end portion of the plated article of the positive portion of the adjusting plate is 8 mm to 25 mm. 20, - a mineral coating device 'for mineral coated articles, comprising: a plating tank for containing the plating solution; an anode. . It is to be immersed in the clock liquid in the bell jar; © (5) ^ _ for holding the plated article and arranging the ore cover member at a position opposite to the anode; the raft is configured to be The anode is held between the plated article by the holder and moved with the miscellaneous cover to agitate the plating solution; and the crucible is also used to make the paddle driving component of the material (4); Stir the ❹ 分 = = ============================================================================================= Further, the adjustment plate is disposed on the anode, and the adjustment plate is: and the rim of the plated object is made of a dielectric material, and the anode of the cylindrical portion is connected to the anode. And a portion, which is used for the field of 32 〇S4〇47 200936818 formed on the anode and the portion; the lower end of the flange portion of the electric field screen which is in contact with the separating plate. The shielding member is attached to the 22. The plating cloth of the second aspect of the patent application is set, wherein the plating liquid distribution chamber and the \^ yinyang _ solitude shirt and the cathode side Solution side solution - ^ 1 (four) plating (four) to _ county to the anode side cold liquid knife cloth chamber and the cathode side solution distribution chamber. Ο G 23. The plating device of the ninth application of the patent application, wherein the shaft extending from the smashing-moving member: 糸24. - a type of key covering device for the ore covering object, the system comprising: a plating tank for accommodating the plating solution; an anode: the system is to be immersed in the plating solution in the plating tank; the dispensing unit is configured to inspect the object and place the plating object at a position opposite to the anode Scrambled purple, which is disposed between the anode and the holder to ensure that the plating material is reciprocally moved in parallel with the Wei-coated article to agitate the plating solution; the control member is controlled by sugar To drive the shengle paddle driving component; an adjustment plate disposed between the anode and the agitating paddle and made of a dielectric material; and, an adjustment plate moving mechanism' for aligning the plated object in parallel The adjustment plate is moved vertically or in parallel. 25. The plating apparatus of claim 24, wherein the adjustment plate 320840 48 200936818 * the moving mechanism includes a press-in member for applying pressure to the adjustment plate to move the adjustment plate. 26. The plating apparatus of claim 24, wherein a guide member is provided on an inner circumferential surface of the plating tank. The guide member is for guiding movement of the adjustment plate. 27. The plating apparatus of claim 24, wherein the adjustment plate is provided with a mounting portion for mounting an auxiliary adjustment plate for adjusting the electric field. 28. The plating apparatus of claim 24, further comprising a positioning/® holding member for positioning and holding the holder, the conditioning plate, and the anode holder holding the anode. 49 320840