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CN1477238A - Electroplanting device - Google Patents

Electroplanting device Download PDF

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Publication number
CN1477238A
CN1477238A CNA021298777A CN02129877A CN1477238A CN 1477238 A CN1477238 A CN 1477238A CN A021298777 A CNA021298777 A CN A021298777A CN 02129877 A CN02129877 A CN 02129877A CN 1477238 A CN1477238 A CN 1477238A
Authority
CN
China
Prior art keywords
anode
electroplate liquid
electroplating
film
electroplanting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA021298777A
Other languages
Chinese (zh)
Inventor
李守宰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SMC CO Ltd
Original Assignee
SMC CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SMC CO Ltd filed Critical SMC CO Ltd
Priority to CNA021298777A priority Critical patent/CN1477238A/en
Publication of CN1477238A publication Critical patent/CN1477238A/en
Pending legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Abstract

The new type electroplating equipment has an electroplating tank for holding electroplating solution, material to be plated as cathode, metal which is not dissolved in electroplating solution as anode and electric current device for applying current into electroplating solution. The electroplating equipment of the described anode is equipped with the film for preventing the O2 produced from anode in the course of electroplating from contacting with organic additives of brightening agent, etc., mixed in the electroplating solution.

Description

Electroplanting device
Technical field
The present invention relates to a kind of electroplanting device that has novel texture cheaply that has not only improved electroplating quality and reduced the pharmaceutical chemicals expense.
Background technology
In general, when electric plating, in electroplate liquid, mix organic additive such as gloss-imparting agent in order to improve electroplating quality.Then, passing to galvanic current between by the negative electrode of electronplate and anodic two electrodes, the metallic cation in the electroplate liquid moves, separating out plating on by the cathode surface of electronplate to negative electrode, and the negatively charged ion OH in the electroplate liquid -And SO 4 2-Generate O in anodic oxidation 2
But, because such O that generates 2Oxidizing power make that the organic additive of blended gloss-imparting agent and so on is oxidized in the electroplate liquid, organic additive rotten, becoming does not have the function of self.Therefore, electroplating quality reduces, in order to improve electroplating quality, consider that the rotten amount of organic additive then must mix a large amount of organic additives, so the expense of pharmaceutical chemicals rises, the cost of goods rises.
Summary of the invention
The present invention is exactly in order to solve the above problems, and the purpose of this invention is to provide a kind of O that produces from anode when electroplating 2Hardly be blended in electroplate liquid in organic additive contact, thereby galvanized quality improves, the pharmaceutical chemicals expense reduces makes goods have the electroplanting device of novel texture cheaply.
According to the present invention, provide a kind of plating tank that comprises the electroplate liquid that is used for packing into, with by electronplate as negative electrode, with the metal that is insoluble to electroplate liquid as anode, to the electroplanting device of the alive current device of electroplate liquid, this electroplanting device is characterised in that, is equipped with the O that produces from anode when preventing to electroplate around described anodic 2The film that contacts with organic additives such as gloss-imparting agent in being blended in electroplate liquid.
Brief description of drawings
Fig. 1 is the sketch chart of expression one embodiment of the present of invention.
The description of embodiment
According to appended accompanying drawing the preferred embodiments of the present invention are described below.Fig. 1 is the sketch chart of expression one embodiment of the present of invention.
The present invention relates to a kind of plating tank 10 that comprises the electroplate liquid that is used for packing into, with by electronplate as negative electrode 30, with the metal that is insoluble to electroplate liquid as anode 20, to the electroplanting device of the alive current device 50 of electroplate liquid.In described electroplate liquid, mix organic additives such as gloss-imparting agent in order to improve electroplating quality.Described then negative electrode 30 becomes the transfer roller form, and its formation makes and transmitted by this transfer roller by electronplate electronegatively, applies galvanic current by the current device 50 that is connected on the power supply on described anode 20 and negative electrode 30.
Then, around described anode 20, be equipped with only selection and see through H +Film 40.This film 40 portion within it has the passage that diameter is about 4-5 nanometer, H +Be moved in the mode of passing through from this passage.This kind film is to utilize to have (CF 2-SO 3H) polytetrafluoroethylene (PTFE) of side chain is made with the thickness with about 50-250 nanometer, but preferred commodity in use name Nafion (DUPONT company of manufacturers).At this moment, supply with the supply-pipe 62 of groove 60 and be connected with being connected to another sulphuric acid soln that the storage sulphuric acid soln uses by described film 40 isolated spaces, by the sulfuric acid concentration that keeps constant level in film 40 space at interval.This kind film 40 is according to being fixedly installed by the other holding components 49 of configuration in the described anode 20 residing positions of inside, but holding components 49 is the simplified shapes that become a side opening, fixedly installs film 40 at the peristome of this holding components 49.
So the present invention who constitutes, when plating is carried out, the negatively charged ion OH in the plating -And SO 4 2-On anode 20, produce O 2Described film 40 is because only select to see through H +So, at the O of anode 20 generations 2Be not by film 40, but be discharged to the outside by the supply-pipe 62 that is connected with sulphuric acid soln supply groove 60.Prevented O thus 2With the organic additive reaction of adding in the electroplate liquid.
As mentioned above, according to the invention provides a kind of O that produces at anode can prevent to electroplate the time 2With the organic additive reaction of adding in the electroplate liquid, thereby can access high-quality galvanized electroplanting device with new texture.And in the occasion of using this electroplanting device, can reduce the usage quantity of the additive of gloss-imparting agent and so on, thereby the pharmaceutical chemicals expense reduces the cost reduction.

Claims (1)

1, a kind of plating tank (10) that comprises the electroplate liquid that is used for packing into, with by electronplate as negative electrode (30), with the metal that is insoluble to electroplate liquid as anode (20), to the electroplanting device of the alive current device of electroplate liquid (50), this electroplanting device is characterised in that, is equipped with the O that produces from anode when preventing to electroplate around described anode (20) 2The film (40) that contacts with organic additives such as gloss-imparting agent in being blended in electroplate liquid.
CNA021298777A 2002-08-20 2002-08-20 Electroplanting device Pending CN1477238A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNA021298777A CN1477238A (en) 2002-08-20 2002-08-20 Electroplanting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNA021298777A CN1477238A (en) 2002-08-20 2002-08-20 Electroplanting device

Publications (1)

Publication Number Publication Date
CN1477238A true CN1477238A (en) 2004-02-25

Family

ID=34144316

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA021298777A Pending CN1477238A (en) 2002-08-20 2002-08-20 Electroplanting device

Country Status (1)

Country Link
CN (1) CN1477238A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104685112A (en) * 2012-12-18 2015-06-03 尼霍夫机械制造公司 Device and method for electrolytically coating object
CN107604426A (en) * 2007-12-04 2018-01-19 株式会社荏原制作所 Electroplanting device and electro-plating method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107604426A (en) * 2007-12-04 2018-01-19 株式会社荏原制作所 Electroplanting device and electro-plating method
CN107604426B (en) * 2007-12-04 2019-08-30 株式会社荏原制作所 Electroplating apparatus and electroplating method
CN104685112A (en) * 2012-12-18 2015-06-03 尼霍夫机械制造公司 Device and method for electrolytically coating object
US10047449B2 (en) 2012-12-18 2018-08-14 Maschinenfabrik Niehoff Gmbh & Co. Kg Device and method for electrolytically coating an object

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C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication