TWI457471B - Plating device and plating method - Google Patents

Description

Plating device and plating method

The present invention relates to a plating apparatus and a plating method for performing surface plating of a plated article (substrate) (for example, a semiconductor wafer), and more particularly to a film that can be used for forming a plating film on a semiconductor wafer. a plating device and a plating device for forming a bump (protrusion electrode) for electrically connecting to an electrode such as a package on a surface of a semiconductor wafer, or a fine hole or a small hole or a photoresist opening in the surface of the chip Overlay method.

For example, TAB (Tape Automated Bonding) or flip chip is usually formed of gold, copper, tin or nickel at a predetermined portion (electrode) of the surface of a semiconductor wafer (with interconnects formed therein) or A plurality of protruding connection electrodes (bumps) made of the metal, whereby the semiconductor wafer can be electrically connected to the electrodes or TAB electrodes of the package via the bumps. There are various methods for forming bumps such as electroplating, vapor deposition, printing, and ball bumping. Among them, as the number of I/Os of the semiconductor wafer increases and the electrode pitch becomes smaller, the most common method is a plating method which can form fine bumps and can be relatively stably completed.

A high-purity metal film (coating film) can be easily obtained by electroplating. Further, the plating method can not only form the metal film at a relatively high rate, but also relatively easily control the thickness of the metal film. When a metal film is formed on a semiconductor wafer, the in-plane uniformity of the thickness of the metal film is strictly required in order to achieve high-density packaging, high efficiency, and high yield. When the metal film is formed by electroplating, the metal ion feed rate and the potential of the plating solution can be uniformly distributed. Therefore, it is expected that a plating method can obtain a metal film having an in-plane uniformity of an excellent thickness.

In a plating apparatus using a so-called impregnation method, there is known a plating apparatus comprising: a plating tank for accommodating a plating solution; for vertically holding a substrate (plating object) and thereby sealing a peripheral portion thereof by watertightness a substrate holder; an anode that is vertically held by an anode holder and configured to face the substrate in the plating tank; a regulation plate made of a dielectric material and having a central aperture Is configured to be positioned between the anode and the substrate; and a paddle disposed between the conditioning plate and the substrate for agitating the plating solution (please refer to, for example, international disclosure) No.: World Patent No. WO 2004/009879 pamphlet, Patent Document 1).

In the operation of the plating apparatus described in Patent Document 1, the anode, the substrate, and the adjustment plate are both immersed in the plating bath of the plating tank while the anode is connected to the anode of the plating power source via a wire and the substrate is connected thereto. A cathode of the power source is plated, and a predetermined plating voltage is applied between the anode and the substrate, thereby depositing a metal and forming a metal film (coating) on the surface of the substrate. During the plating, the plating solution is stirred with a stirring pad disposed between the conditioning plate and the substrate to uniformly supply a sufficient amount of ions to the substrate, whereby a metal film having a more uniform thickness can be formed.

According to the plating apparatus of Patent Document 1, the potential distribution of the plating tank can be controlled by an adjustment plate placed between the anode, the substrate opposite the anode, and the plating channel in the cylindrical body. This makes it possible to control the thickness distribution of the metal film formed on the surface of the substrate.

In addition, a plating apparatus has been proposed which minimizes the potential of the entire surface of the plated article by minimizing the distance between the regulating plate and the plated article which are immersed in the plating bath. Thereby, a metal film having a more uniform thickness is formed (refer to, for example, Japanese Patent Laid-Open Publication No. 2001-329400, Patent Document 2).

At present, in order to increase productivity, it is strongly required to shorten the plating time for forming a coating having a given thickness to about two-thirds of the conventional plating time. In order to form a coating having a given thickness and a given plating area in a relatively short period of time, it is necessary to perform plating at a faster plating rate by applying a higher current (i.e., a higher current density). However, if the conventional plating apparatus and its operation method are used for plating under a high current density condition, the in-plane uniformity of the coating thickness tends to be deteriorated. The thickness of the coating is required to have a higher degree of in-plane uniformity than before. Therefore, as described in Patent Document 2, shortening the distance between the adjustment plate and the plated article is important for plating under high current density plating conditions.

The present inventors have discovered that when plating is performed under high current density conditions using conventional conventional plating apparatus and its method of operation, the bumps formed by plating tend to have a convex top rather than a flat top. The formation of such a convex-type bump causes the following problems: in the case of the WL-CSP (Crystal Scale Wafer Size Package) currently under development, after the bump is formed by the plating method, the bump is coated with the resin. cover. If the bumps are convex, an excessive amount of resin must be applied to cover the entire bump, which increases the cost. After the resin is applied, the surface of the resin is usually flattened with a so-called squeegee blade. When the surface of the resin is flattened with a doctor blade (scraper), the high bump having a convex top may collapse. After the bumps are coated with a resin, the resin and the bumps are usually ground to a predetermined thickness by mechanical grinding. If the bumps have a convex top and thus an excessive amount of resin is applied, the excess resin must be worn away, which leads to an increase in cost.

A plating apparatus and method have been proposed which drive a pair of stirring rods in a plating solution while performing plating of a printed circuit board having through holes (one speed of 5 cm/sec to 20 cm/sec) The other one is 25 cm/sec to 70 cm/sec. (For example, Japanese Laid-Open Publication No.: 2006-41172, Patent Document 3). However, if the pair of stirring rods are moved at these speeds during plating, it is still impossible to form a bump having a flat top.

In view of the above prior art, we have made cost inventions. Accordingly, it is an object of the present invention to provide a plating apparatus and a plating method which can form a bump having a flat top when performing plating of a coated object (substrate) (for example, a semiconductor wafer) A metal film having excellent in-plane uniformity can be formed, even if it is plated under conditions of high current density.

In order to achieve the object, the present invention provides a plating apparatus comprising: a plating tank for containing a plating solution; an anode to be immersed in the plating solution in the plating tank; and a retainer for use And maintaining the plated article and the plated article at a position opposite to the anode; the paddle is disposed between the anode and the plated article held by the holder, and is plated The covering member reciprocates in parallel to agitate the plating solution; and a control section for controlling the agitating paddle driving member for driving the agitating paddle. The control unit controls the paddle drive unit such that the paddle moves at an average absolute value of 70 cm/sec to 100 cm/sec.

By uniformly moving the stirring pad disposed between the anode and the plated article at a (high) speed of an average absolute value of 70 cm/sec to 100 cm/sec to thereby agitate the plating solution, uniformly A sufficient amount of ions is supplied to the previously formed resist holes for bump formation, which makes it possible to form bumps having flat tops, even when plated under high current density conditions.

The agitating paddle is preferably a plate-like member having a plurality of strip portions. The plate member is preferably a thickness of from 3 mm to 5 mm.

Preferably, each strip portion of the paddle is inclined by 30 to 60 degrees with respect to a vertical plane parallel to the plated article, and more preferably 40 to 50 degrees.

Each strip portion of the stirring paddle preferably has a width of 2 mm to 8 mm, more preferably 3 mm to 6 mm.

Preferably, the distance between the stirring paddle and the plated article is 5 mm to 11 mm.

In a preferred aspect of the invention, the plating apparatus further includes an adjustment plate disposed between the anode and the stirring paddle and made of a dielectric material. The adjustment plate includes: a cylindrical portion having an inner diameter matching the contour of the plated article; and a flange portion connected to an anode-side peripheral end of the cylindrical portion for adjusting the formation An electric field between the anode and the plated article.

An adjustment plate is provided between the anode and the agitating paddle to provide a more uniform potential distribution across the entire surface of the plated article. This makes it possible to improve the in-plane uniformity of the metal film (coating film) formed on the plated article, even if the metal film is formed under high current density plating conditions.

The distance between the plated article and the side end of the plated article of the cylindrical portion of the adjustment plate is preferably from 8 mm to 25 mm, more preferably from 12 mm to 18 mm.

In a preferred aspect of the invention, the holder has an outwardly projecting holder arm, and the plating tank has a holder support for contacting the holder arm Suspend and support the retainer thereon. A fixing member is provided in a contact area of the holder arm portion with the holder bracket for fixing the holder arm portion to the holder bracket.

With this configuration, it is possible to prevent the retainer suspended and supported on the plating tank from rocking or tilting even if the retainer is subjected to the reverse pressure of the plating liquid flow caused by the high-speed movement of the stirring blade.

Preferably, the fixing member is a magnet mounted on at least one of the holder arm portion and the holder bracket. The use of magnetic force ensures excellent fixation.

In a preferred aspect of the present invention, the retainer arm portion and the retainer bracket are in contact with each other at least in a portion of their contact area when the retainer is suspended and supported on the plating tank. And closed contacts, and power is supplied to the plated article when the contacts are closed.

This ensures excellent contact between the contacts of the retainer arms and the contacts of the retainer bracket when the retainer is suspended and supported on the plating tank.

The present invention also provides a plating method comprising: arranging an anode and a plated article opposite to each other in a plating bath of a plating tank; and: agitating the paddle disposed between the anode and the plated article The plated articles are reciprocated in a parallel manner at an average absolute value of 70 cm/sec to 100 cm/sec while a voltage is applied between the anode and the plated article.

The agitating paddle is preferably a plate-like member having a plurality of strip portions. The plate member is preferably a thickness of from 3 mm to 5 mm.

Preferably, each strip portion of the paddle is inclined by 30 to 60 degrees with respect to a vertical plane parallel to the plated article, and more preferably 40 to 50 degrees.

Each strip portion of the stirring paddle preferably has a width of 2 mm to 8 mm, more preferably 3 mm to 6 mm.

Preferably, the distance between the stirring paddle and the plated article is 5 mm to 11 mm.

In a preferred aspect of the invention, an adjustment plate made of a dielectric material is disposed between the anode and the agitating paddle. The adjustment plate includes: a cylindrical portion having an inner diameter matching the contour of the plated article; and a flange portion connected to the outer peripheral end of the anode portion of the cylindrical portion for adjusting the anode and the plated article An electric field between.

The distance between the plated article and the side end of the plated article of the cylindrical portion of the adjustment plate is preferably from 8 mm to 25 mm, more preferably from 12 mm to 18 mm.

The present invention also provides a plating apparatus comprising: a plating tank for containing a plating solution; an anode to be immersed in the plating solution in the plating tank; and a holder for maintaining plating And the object is disposed at a position opposite to the anode; the stirring paddle is disposed between the anode and the plated article held by the holder, and is parallel to the plated article Reciprocatingly moving to agitate the plating solution; and control means for controlling a paddle driving member for driving the agitating paddle. The plating tank is separated into a plating object processing chamber and a plating liquid distribution chamber by a separation plate having a plurality of plating liquid passage holes. The plating solution distribution chamber is provided with a shield plate for adjusting the electric field while ensuring the dispersed flow of the plating solution.

By separating the plating tank into the upper plating material processing chamber and the lower plating liquid distribution chamber by using the separating plate in this manner, and installing the shielding plate in the plating liquid distribution chamber to suppress distribution in the plating solution An electric field from the anode toward the plated article is formed in the chamber, thereby preventing an electric field from being formed under the plated article, thereby preventing the electric field from affecting the in-plane uniformity of the coating. When plating is carried out under conventional low current density conditions, the effect of the electric field formed under the plated article on the in-plane uniformity of the coating is not a problem. On the other hand, in the case of high current density conditions, the influence of this electric field causes a problem because the thickness of the portion of the plating film near the bottom of the plating tank is rapidly increased.

In a preferred aspect of the invention, the plating apparatus further includes an adjustment plate disposed between the anode and the stirring paddle and made of a dielectric material. The adjustment plate includes: a cylindrical portion having an inner diameter matching the contour of the plated article; and a flange portion connected to the outer peripheral end of the anode portion of the cylindrical portion for adjusting the anode and the plated article The electric field between. An electric field shielding member that is in contact with the separation plate is attached to a lower end of the flange portion.

Providing the adjustment plate to control an electric field formed between the anode and the plated article, and further providing the electric field shielding member to prevent the electric field from being separated from the flange portion between the flange portion and the separation plate The gap between the plates leaks out.

In a preferred aspect of the invention, the plating solution distribution chamber is partitioned by the shielding plate into an anode side solution distribution chamber and a cathode side solution distribution chamber. The plating solution is supplied to the anode side solution distribution chamber and the cathode side solution distribution chamber through a plating solution supply route.

By completely separating the plating solution distribution chamber into the anode side solution distribution chamber and the cathode side solution distribution chamber by the shield plate in this manner, it is possible to reliably prevent the potential line generated by the anode from passing through the plating. The plating solution in the liquid distribution chamber and the plated article as the cathode.

In a preferred aspect of the invention, the agitating paddle is coupled via a coupler to a shaft extending from the paddle drive member.

With this configuration, the agitating paddle can be easily separated from the shaft projecting from the paddle driving member via the coupler. This allows the replacement of the paddle to be operated quickly and easily.

The present invention also provides a plating apparatus comprising: a plating tank for containing a plating solution; an anode to be immersed in the plating solution in the plating tank; and a holder for maintaining plating And the object is disposed at a position opposite to the anode; the stirring paddle is disposed between the anode and the plated article held by the holder, and is parallel to the plated article Reciprocatingly moving to agitate the plating solution; controlling a member for controlling a stirring paddle driving member for driving the agitating paddle; an adjusting plate disposed between the anode and the agitating paddle and made of a dielectric material; An adjustment plate moving mechanism for moving the adjustment plate vertically or in parallel in a manner parallel to the plated article.

The adjustment plate moving mechanism can finely adjust the vertical or horizontal position of the adjustment plate relative to the plated article, thereby improving the in-plane uniformity of the thickness of the plating film formed on the surface of the plated article. Since the adjustment plate is disposed adjacent to the plated article, fine-tuning the vertical or horizontal position of the adjustment plate relative to the plated article is important to increase the in-plane uniformity of the thickness of the coating formed on the plated article. .

Preferably, the adjustment plate moving mechanism includes a press member for applying pressure to the adjustment plate to move the adjustment plate.

For example, the press-in member is a press bolt. The adjustment can be easily controlled by controlling the degree of pressure applied by the press-in member (in particular, when the press-in bolt having a predetermined pitch is used as the press-in member, by controlling the number of revolutions of the press-in bolt) The moving distance of the board.

Preferably, a guide member is provided on the inner circumferential surface of the plating tank for guiding the movement of the adjustment plate.

The guiding member enables the adjustment plate to move in parallel with the plated article while maintaining the distance between the two. Further, by using the guiding member having a groove into which the peripheral portion of the regulating plate can be inserted, the electric field can be prevented from leaking from the periphery of the regulating plate.

Preferably, the adjustment plate is provided with a mounting section for mounting an auxiliary adjustment plate for adjusting an electric field.

The combination of the adjustment plate and the auxiliary adjustment plate enables an optimum electric field to be formed for the type of the plated article without changing the installation position of the adjustment plate or replacing the adjustment plate.

In a preferred aspect of the invention, the plating apparatus further includes a positioning/holding section for positioning and holding the holder, the adjustment plate, and the anode holder holding the anode.

The central position of the substrate holder, the adjustment plate and the anode holder can be set by positioning the positioning/holding member for holding the substrate holder, the adjustment plate and the anode holder in the plating tank. Easily aligned in the vertical direction of the plating bath.

According to the plating apparatus and the plating method of the present invention, when plating a plated object (substrate) (for example, a semiconductor wafer), a bump having a flat top or a metal having excellent in-plane uniformity can be formed. The film is also coated even under high current density conditions.

Preferred embodiments of the present invention will now be described with reference to the drawings. The following description explains the case where copper plating is applied to the surface of the substrate as a plated article. In the following description, the same or equivalent elements are denoted by the same element symbols and will not be repeated.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a vertical cross-sectional elevational view of one embodiment of a plating apparatus of the present invention. As shown in Fig. 1, the plating apparatus includes a plating tank 10 in which a plating solution Q is accommodated. An overflow tank 12 for receiving the plating solution Q overflowing the edge of the plating tank 10 is provided around the upper end of the plating tank 10. One end of the plating liquid supply path 16 provided with the pump 14 is connected to the bottom of the overflow tank 12, and the other end of the plating liquid supply path 16 is connected to the plating liquid supply inlet 18 provided at the bottom of the plating tank 10. The plating solution Q in the overflow tank 12 is sent back to the plating tank 10 by the pump 14. Downstream of the pump 14, a thermostat unit 20 for controlling the temperature of the plating solution Q and a filter 22 for filtering out substances contained in the plating solution are placed in the plating solution supply path 16.

The plating apparatus also includes a substrate holder 24 for detachably holding the substrate (plating object) W and immersing the substrate W in the plating solution Q of the plating tank 10 at a vertical position. The anode 26 held by the anode holder 28 and immersed in the plating solution Q of the plating tank 10 is configured to be opposed to the substrate W held by the substrate holder 24 and immersed in the plating solution Q. In this embodiment, phosphorus-containing copper is used as the anode 26. The substrate W and the anode 26 are electrically connected via a plating power source 30, and a plating film (copper film) is formed on the surface of the substrate W by causing a current to flow between the substrate W and the anode 26.

The agitating paddle 32 that reciprocates in parallel with the surface of the substrate W to agitate the plating solution Q is disposed between the substrate W and the anode 26 that are fixed by the substrate holder 24 and immersed in the plating solution Q. By stirring the plating solution Q with the stirring paddle 32, a sufficient amount of copper ions can be uniformly supplied to the surface of the substrate W. The distance between the stirring paddle 32 and the substrate W is preferably from 5 mm to 11 mm. Further, a regulation plate 34 made of a dielectric material having a more uniform potential distribution across the entire surface of the substrate W is disposed between the agitating paddle 32 and the anode 26.

As shown in Figs. 2 and 3, the agitating paddle 32 is composed of a rectangular plate-like member having a uniform thickness "t" of 3 mm to 5 mm and a plurality of parallels defining the vertically extending strip portions 32b. Slit 32a. The agitating paddle 32 is formed of, for example, titanium coated with a Teflon coating. Vertical length L ₁ of the stirring blade 32 and the vertical length L ₂ of the slit 32a are sufficiently larger than the vertical dimension of the substrate W. Further, the agitating paddle 32 is designed such that the sum of its lateral length H and reciprocating distance (stroke "St") is sufficiently larger than the lateral dimension of the substrate W.

Preferably, the width and number of the slits 32a are determined in such a manner that each strip portion 32b is as narrow as possible within a range having the necessary rigidity so that the strip portion 32b between the slits 32a can be effectively agitated and plated. The liquid, and the plating solution, can effectively flow through the slit 32a. Another important point of narrowing the strip portion 32b of the agitating paddle 32 is to reduce the electric field shadow formed on the substrate W when the agitating paddle 32 is decelerated near the end (stroke end) of its reciprocating movement or temporarily stopped ( Not affected by electric fields or small spots).

In this embodiment, as shown in Fig. 3, the slits 32a are formed vertically such that each strip portion 32b has a rectangular cross section. The width "B" of each of the strip portions 32b is preferably from 2 mm to 8 mm, more preferably from 3 mm to 6 mm. As shown in Fig. 4A, the four corners of the cross section of each strip portion 32b can be chamfered. Alternatively, as shown in Fig. 4B, each of the strip portions 32b may have a parallelogram in cross section such that it is inclined by a predetermined angle θ with respect to a vertical plane parallel to the substrate W. The inclination angle θ of the strip portion 32b for the vertical plane parallel to the substrate W is preferably from 30 to 60, more preferably from 40 to 50. With this configuration, the effect of the stirring paddle 32 stirring the plating solution can be enhanced.

The thickness (plate thickness) "t" of the agitating paddle 32 is preferably 3 mm to 5 mm, and this embodiment is 4 mm, whereby the regulating plate 34 can be disposed in the vicinity of the substrate W. It has been confirmed that if the thickness (plate thickness) "t" of the agitating paddle 32 is 1 mm or 2 mm, the agitating paddle 32 does not have sufficient strength. By making the stirring paddle 32 have a uniform thickness, the plating solution can be prevented from splashing or having a large wave.

FIG. 5 illustrates the drive mechanism of the agitating paddle 32 and the plating tank 10. The agitating paddle 32 is fixed to the horizontally extending shaft 38 by a clip 36 fixed to the upper end of the paddle 32. The shaft 38 is fixed by the shaft holder 40 and is horizontally slidable. The end of the shaft 38 is coupled to a paddle drive member 42 for reciprocating the agitating paddle 32 linearly and horizontally. The paddle drive member 42 converts the rotation of the motor 44 into a linear reciprocating movement of the shaft 38 by a crank mechanism (not shown). In this embodiment, a control member 46 is provided which controls the speed of movement of the paddle 32 by controlling the rotational speed of the motor 44 of the paddle drive member 42. It is also possible to use a paddle drive member that converts the rotation of the servo motor into a linear reciprocating movement of the shaft by means of a ball screw, or a paddle drive member that linearly reciprocates the shaft with a linear motor instead of the paddle drive that uses the crank mechanism. Component 42.

In this embodiment, as shown in Fig. 6, the reciprocating stroke "St" of the agitating paddle 32 is such that the strip portion 32b of the agitating paddle 32 at the end of one stroke does not overlap with the paddle at the end of the other stroke. The 32 strip portions 32b overlap. This can reduce the effect of the agitating paddle 32 on the formation of electric field shadows on the substrate W.

In this particular embodiment, the agitating paddle 32 is reciprocated at a higher speed than conventional agitating paddles, particularly at an average absolute value of 70 centimeters per second to 100 centimeters per second. This is based on the following experiment by the present inventors: when a coating for forming a bump is performed at a current density of 8 ASD (A/dm ² ) (a conventional current density higher than 5 ASD), The bump having a flat top can be formed by agitating the plating solution by using a stirring paddle which moves at a higher speed than the conventional stirring paddle, especially at a speed of an average absolute value of 70 cm/sec to 100 cm/sec. . In this embodiment, the rotational movement of the motor 44 is converted into a linear reciprocating movement of the agitating paddle 32 by a crank mechanism, as described above; and the rotation of the motor 44 causes the agitating paddle 32 to be made with a stroke "St" of 10 cm. Reciprocating once. In this particular embodiment, the optimum bumps are formed when the motor 44 is rotated at 250 rpm. Therefore, the optimum average absolute value of the moving speed of the stirring blade 32 is 83 cm/sec.

Fig. 7 is a schematic view of the adjustment plate 34 shown in Fig. 1. The regulating plate 34 is composed of a cylindrical portion 50 and a rectangular flange portion 52, and is made of polyvinyl chloride which is a dielectric material. The regulating plate 34 is housed in the plating tank 10, wherein the front end of the cylindrical portion 50 is disposed on the substrate side, and the flange portion 52 is disposed on the anode side. The opening size and axial length of the cylindrical portion 50 can sufficiently limit the widening of the electric field. In this embodiment, the cylindrical portion has an axial length of 20 mm. The flange portion 52 is configured in the plating bath 10 such that it blocks the electric field formed between the anode 26 and the substrate W. Referring to Fig. 1, the distance between the cylindrical portion 50 of the adjusting plate 34 and the substrate W is preferably 8 mm to 25 mm, more preferably 12 mm to 18 mm.

Although in the regulating plate 34 of the present embodiment, as shown in Fig. 7, the flange portion 52 is attached to the end of the cylindrical portion 50, the cylindrical portion 50 may be extended toward the anode to make the columnar shape. The portion 50a of the portion 50 protrudes from the anode side surface of the flange portion 52 as shown in Fig. 8.

As shown in FIG. 1, the substrate W is fixed by the substrate holder 24. The substrate holder 24 is designed to be capable of supplying power to a peripheral region of the substrate W having a surface conductive film (for example, a sputtered copper film). The substrate holder 24 has a plurality of electrical contacts, and the total width of the electrical contacts is not less than 60% of the circumference of the area surrounding the substrate that is in contact with the electrical contacts. The electrical contacts are evenly distributed equidistantly.

Since the agitating paddle 32 is moved at a high speed, for example, at an average absolute value of 70 cm/sec to 100 cm/sec, in this embodiment, the substrate holder 24 receives the counter from the flow of the plating solution. To the pressure. This can cause problems such as the substrate holder 24 swinging or tilting. The sway or tilt of the substrate holder 24 causes uneven potential distribution, which adversely affects the in-plane uniformity of the coating.

As shown in Fig. 9, when the substrate holder 24 is placed in the plating tank 10, a holder grip 60 that is gripped by a conveying device (not shown) is hung on the conveying device, and then utilized. The holder arm portion 64 that is caught on the holder bracket 62 is protruded and supported by the holder bracket 62 fixed to the plating tank 10.

10 is an enlarged perspective view showing the holder arm portion 64 and its surroundings, and FIG. 11 is a cross-sectional view of the holder arm portion 64 in contact with the holder holder 62, and FIG. 12 is an 11th view. Right side view. As shown in Figs. 10 to 12, an arm-side contact 66 is mounted on the surface of the holder arm portion 64 facing the holder holder 62. The arm side contact 66 is electrically connected to a cathode contact for supplying power to the substrate W by a wire (not shown). On the other hand, a support-side contact 68 is mounted on the surface of the holder bracket 62 facing the holder arm portion 64. The bracket side contact 68 is electrically connected to an external power source (not shown). When the substrate holder 24 is suspended and supported on the plating tank 10, the arm side contact 66 and the rack side contact 68 are in contact with each other and closed, whereby the external power source can be electrically connected to the cathode contact. Therefore, a cathode voltage can be applied to the cathode contacts. The arm side contact 66 and the bracket side contact 68 are generally provided in one of the left and right holder arms 64 and the corresponding one of the left and right holder brackets 62, respectively.

An arm-side magnet 70 as a fixing member is provided on a surface of the holder arm portion 64 facing the holder bracket 62, and a holder-side magnet 72 as a fixing member is provided to face the holder holder 62. The surface of the arm portion 64. For example, a neodymium magnet can be used as the magnets 70, 72. With this configuration, when the substrate holder 24 is suspended and supported on the plating tank 10, the arm-side magnet 70 and the holder-side magnet 72 can contact and attract each other, whereby the substrate can be held via the substrate holder 62 and the holder arm portion 64. The device 24 is more firmly fixed to the plating tank 10. Therefore, the substrate holder 24 can be prevented from being swung or tilted due to the flow of the plating solution. The arm side magnets 70 and the rack side magnets 72 are typically mounted on both the right and left retainer arms 64 and the right and left retainer brackets 62.

The positioning of the substrate holder 24 relative to the plating tank 10 is accomplished by transport of the transport device. As shown in Fig. 13, a groove-shaped opening 62a having a tapered surface at the top may be provided in the holder holder 62, and the opening 62a may be used as a guide for the holder arm portion 64 of the substrate holder 24. When the opening (guide) 62a is provided on the substrate holder 62 for positioning the substrate holder 24 and the plating tank 10, the opening 62a requires a small "slip" for positioning and transportation of the substrate holder 24. When the substrate holder 24 is rocked or tilted within the "chuck" range, the arm side contact 66 and the bracket side contact 68 may be permanently or intermittently disconnected. In view of this, the substrate holder 24 is firmly supported on the plating tank 10 by the magnets 70, 72 in the vicinity of the contacts 66, 68, so that the arm side contact 66 can be brought into tight contact with the bracket side contact 68. . In addition, wear due to friction of the contacts 66, 68 can be suppressed, and durability of the joints 66, 68 can be enhanced.

One of the arm side magnet 70 and the holder side magnet 72 may be replaced with a magnetic material. The magnet may also be coated with a magnetic material to prevent the magnet from being damaged by its contact. Further, the periphery of the magnet may be covered with a magnetic material to expose the surface of the magnet and a part of the magnetic material is protruded from the surface of the magnet, thereby increasing the magnetic force.

As shown in Fig. 1, a separating plate 80 and a shield plate 82 are attached to the bottom of the plating tank 10. In order to allow the plating solution Q (which is supplied from the plating liquid supply inlet 18 provided at the bottom of the plating tank 10) to form a uniform flow over the entire surface of the substrate W, a space for dispersing the plating solution is provided at the bottom of the plating tank 10, And a separation plate 80 having a plurality of plating liquid passage holes is horizontally disposed in the space. Therefore, the separating plate 10 can divide the inside of the plating tank 10 into the upper substrate processing chamber 84 and the lower plating liquid distribution chamber 86.

Fig. 14 is a plan view of the separating plate 80 having substantially the same shape as the inner shape of the plating tank 10, and having a plurality of plating liquid passage holes 80a extending through the plate body. The plating solution Q can be formed into the substrate W by dividing the plating tank 10 into the substrate processing chamber 84 and the plating solution distribution chamber 86 by the separation plate 80, and the separation plate 80 having the plating liquid passage hole 80a for allowing the plating liquid to pass therethrough. Flow evenly. If the plating liquid passage hole 80a provided in the separating plate 80 has a large diameter, the electric field originating from the anode 26 passes through the plating liquid distribution chamber 86 and leaks into the substrate W side, which affects the in-plane uniformity of the plating film formed on the substrate W. degree. Therefore, the plating liquid passage hole 80a used in the present embodiment has a small diameter of 2.5 mm.

Although in this embodiment, the plating liquid passage hole 80a is provided throughout the separation plate 80, it is not necessary to provide the small hole 80a in a manner throughout the plate body. For example, as shown in Fig. 15, a dispersed plating liquid passage hole 80a may be provided in the substrate side region bounded by the position A of the regulating plate 34, and an opposite region (at the anode) bounded by the position B of the anode 26 A plating passage hole 80a is also provided in the rear portion. The use of the separation plate 80 shown in Fig. 15 can more effectively prevent the electric field of the anode 26 from passing through the plating solution distribution chamber 86 and leaking into the substrate W side. Further, when the plating solution passage hole 80a is also provided behind the anode 26, the plating solution Q can be reliably discharged by the plating tank 10.

As shown in Fig. 16, the separating plate 80 is horizontally supported on the separating plate holder 90 provided on the side plate 10a of the plating tank 10. The separating plate 80 and the separating plate holder 90 can be in close contact by the spacer 92 provided therebetween.

Although the separation plate 80 is used, the electric field originating from the anode 26 may still pass through the plating solution distribution chamber 86 and leak into the substrate W side, which affects the in-plane uniformity of the plating film formed on the substrate W. Therefore, in this embodiment, the shield plate 82 extending vertically downward is mounted to the lower surface of the separation plate 80. The shielding plate 82 is provided to more effectively prevent the electric field originating from the anode 26 from passing through the plating liquid distribution chamber 86 and leaking into the substrate W side while ensuring that the plating solution Q is dispersed in the plating liquid distribution chamber 86 and forming the plating solution Q into the substrate. The uniform flow of the processing chamber 84. In this regard, as shown in Fig. 17, the shield plate 82 is attached to the lower surface of the separation plate 80 in such a manner that the shield plate 82 is disposed directly above the plating solution supply inlet 18, and is provided in the shield plate 82 and the plating tank. A gap "S" is formed between the bottoms of 10. In order to prevent electric field leakage, the gap "S" is preferably as small as possible.

As shown in Fig. 18, a shield plate 82 that is in contact with the bottom of the plating tank 10 may be disposed, and a semicircular opening 82a is provided in the shield plate 82 to secure a flow path for plating. Further, in this case, it is preferable that the opening 82a is as small as possible to prevent electric field from leaking. The shield plate 82 is configured to be positioned in a region where the plating liquid passage hole 80a is not present in the lower surface of the separation plate 80, for example, in a region of the adjustment plate 34 directly below the flange portion 52.

Although in this embodiment, the shield plate 82 is disposed directly above the plating solution supply inlet 18, the shield plate 82 does not have to be disposed directly above the plating solution supply inlet 18. In addition, a plurality of shielding plates 82 can also be used.

In the plating apparatus of Fig. 1, the positional relationship of the substrate W, the anode 26, the regulating plate 34, and the stirring blade 32 in the plating tank 10 affects the in-plane uniformity of the plating film formed on the substrate W. In this particular embodiment, substrate W, anode 26, and conditioning plate 34 are configured such that the center of substrate W, the center of anode 26, and the axis of cylindrical portion 50 of conditioning plate 34 are substantially aligned. In this embodiment, the pole-to-pole distance of the anode 26 and the substrate W is 90 mm; and the inter-electrode distance can be set substantially in the range of 60 mm to 95 mm. In this embodiment, the distance between the substrate W and the cylindrical portion 50 of the adjustment plate 34 at the end of the substrate W side is 15 mm, and the length of the cylindrical portion 50 is 20 mm, so the substrate W and the adjustment plate 34 The flange portion 52 has a distance of 35 mm.

As shown in Fig. 19, the electric field shielding member 94 (e.g., made of a rubber sheet) whose lower end is in elastic contact with the separating plate 80 is provided at the lower end of the flange portion 52 of the regulating plate 34 on the anode side. The electric field shielding member 94 prevents current from leaking from the gap between the separating plate 80 and the flange portion 52. The lower surface of the flange portion 52 can also be brought into close contact with the upper surface of the separating plate 80 so that the flange portion 52 can also function as an electric field shielding member.

The adjustment plate 34 can be mounted on the plating tank 10 in such a manner that the distance between the adjustment plate 34 and the substrate W can be adjusted. In particular, as shown in Fig. 20, an adjustment plate fixing slit plate 96 having a plurality of vertical slits 96a arranged at a predetermined pitch, and a convex portion of the regulating plate 34 can be attached to the side plate 10a of the plating tank 10. Each side end of the edge portion 52 is inserted into any slit 96a of the slit plate 96 for adjusting the plate. The adjusting plate fixing slit plate 96 is attached to the plating tank side plate 10a by a slit 96b and a fixing screw 98. This mounting method makes it possible to finely adjust the distance of the adjustment plate 34 from the substrate W so that the adjustment plate 34 can be positioned at an optimum position for such a substrate.

Preferably, a pair of electric field shielding members 100 made of a rubber seal are provided in the flange portion 52 near the adjustment plate fixing slit plate 96 to prevent formation of an electric field from the anode 26 toward the substrate W through the flange portion. A gap between each side end of the portion 52 and the slit 96a. The electric field shielding member 100 can be mounted only on the anode side of the adjusting plate fixing slit plate 96.

In the plating apparatus of the present invention, the bump formed on the substrate has a typical diameter of 150 μm and the plating target has a thickness of 110 μm. In order to form the bumps, it is preferred to use a plating solution having a copper sulfate concentration of not less than 150 g/liter. An exemplary bath includes an alkaline solution having the following composition and containing several organic additives, particularly a polymer component (inhibitor), a carrier component (accelerator), and a leveler component (inhibitor):

Alkaline solution composition

Copper sulfate pentahydrate (CuSO ₄ -5H ₂ O): 200 g / liter

Sulfuric acid (H ₂ SO ₄ ): 100 g / liter

Chlorine (Cl): 60 mg / liter

Although the conventional plating method is conventionally performed to form bumps by a current density of 3 ASD to 5 ASD, the present invention performs plating at a current density of, for example, 8 ASD. The plating apparatus and the plating method of the present invention can perform plating at a current density of up to 14 ASD. Unless otherwise stated, in the following description, the plating operation was performed at a current density of 8 ASD.

Figure 21 illustrates a copper plating process for forming bumps. First, the substrate is pre-cleaned with water by immersing the substrate in pure water, for example, for 10 minutes. Next, pretreatment of the substrate is carried out by immersing the substrate in 5 volume percent (vol%) sulfuric acid, for example, for 1 minute. The substrate is then washed with pure water, for example for 30 seconds. The pure water cleaning system was carried out twice. Thereafter, copper plating of the substrate was carried out in the following manner: First, the substrate was immersed in the plating solution for 1 minute without applying a current, and then an electric current was applied to the plating system. The plated substrate is washed with pure water, and then the substrate is dried, for example, by blowing nitrogen gas. After the plating process, the resist is stripped from the substrate with a resist-stripping solution, followed by water washing and drying.

Figs. 22 and 23 illustrate bumps having different shapes which are formed by different plating methods in which the moving speed of the stirring paddle having the same current density of 8 ASD but for stirring the plating solution is different. In particular, Fig. 22 shows the shape of the bump formed in such a manner that when the plating is performed, the stirring blade is moved at an average absolute value of 20 cm/sec, which is a conventional speed. The plating solution was stirred; and Fig. 23 shows the shape of the bump formed in such a manner that, when plating was performed, the stirring blade was moved at an average absolute value of 83 cm/sec to thereby agitate the plating solution. As shown in Fig. 22, the stirring paddle which is plated with a high current density of 8 ASD while stirring the plating solution is moved at a known low speed, whereby the height h1 of the convex top of the bump is 30 when the bump is formed. Micron; however, as shown in Fig. 23, the stirring paddle which is plated while using the same high current density while stirring the plating solution is moved at a significantly higher speed (average absolute value of 83 cm/sec) thereby forming a convex shape. In the case of a block, the height h2 of the convex top is 15 microns and is significantly lower than the height of the conventional bump.

24 to 28 illustrate photomicrographs of bumps formed on a substrate (wafer) by a plating method using a plating apparatus having a structure substantially the same as that of the plating apparatus shown in Fig. 1, wherein These plating methods use different paddles and agitate the bath at different moving speeds. Specifically, the bump shown in Fig. 24 is formed by agitating the paddle (thickness 2 mm) at the same time as the average absolute value of 40 cm/sec while performing the plating. mobile. Defects can be observed on the bumps formed on the entire surface of the substrate. The bump shown in Fig. 25 was formed by moving the stirring paddle (thickness 4 mm) of the plating solution while moving at a speed of an average absolute value of 40 cm/sec. The bumps formed on the entire surface of the substrate are defective and have an irregular shape. As can be seen from Figs. 24 and 25, it is not sufficient to increase the thickness of the stirring paddle only.

The bump shown in Fig. 26 was formed by moving the stirring paddle (thickness 4 mm) of the plating solution while moving at a speed of an average absolute value of 67 cm/sec. Defects can be observed on the bumps formed on the entire surface of the substrate. The bump shown in Fig. 27 was formed by moving the stirring paddle (thickness 4 mm) of the plating solution while moving at a speed of an average absolute value of 83 cm/sec. The bumps formed on the entire surface of the substrate are excellent bumps without defects. We believe that the reason for the difference between the bumps in Figure 26 and the bumps in Figure 27 is that when the paddle is moving at a low speed, the supply of copper ions will be insufficient under high current density conditions to cause bump defects. When the paddle is moved at a high speed, a sufficient amount of copper ions can be supplied to form a defect-free bump. When the plating paddle (thickness 3 mm) which agitates the plating solution under the same high current density condition is moved at a speed of an average absolute value of 83 cm/sec, it is observed that it is formed on the entire surface of the substrate. The bumps are free of defects, as shown in Figure 28. As can be seen from the comparison of Fig. 27 and Fig. 28, the use of a paddle system having a thickness of 3 mm produces a relatively rounded bump at the top as compared with the use of a paddle having a thickness of 4 mm.

Figure 29 is a diagram showing the height distribution of the bumps formed on the substrate by plating using a plating tank without a shield plate under the separation plate, and Figure 30 is a view showing the use of a shield under the separation plate. The plating of the plate is used to perform the plating to form a height distribution of the bumps on the substrate. The unit of the value listed in the note is "micron (μm)". As shown in Fig. 29, when the shielding plate is not used, the plating thickness (bump height) of the edge portion of the substrate near the bottom of the plating tank is larger than the central portion, however, as shown in Fig. 30, when used When the shield is shielded, the plating thickness of the edge portion of the substrate near the bottom of the plating tank is reduced to approximately the same extent as the plating thickness of the central portion.

The graphs of Figures 31 and 32 illustrate the in-plane uniformity of the height of the bumps formed on the substrate by different plating methods on the substrate, the methods being used with different shapes and disposed on the substrate. There are adjustment plates at different distances, and the paddles are used to agitate the bath with different moving speeds. The X-axis and the Y-axis shown in Figs. 31 and 32 are orthogonal axes in Fig. 33. Specifically, Fig. 31 illustrates the in-plane uniformity of the height of the bumps formed in such a manner that the plating forming the bumps has an opening and a flangeless portion in the center, and is 35 mm apart from the substrate. The 5 mm thick flat adjustment plate while the stirring paddle stirring the plating solution was moved at an average absolute value of 20 cm/sec. The distribution of the bump height (plating thickness) is a W-shaped distribution curve. Figure 32 illustrates the in-plane uniformity of the height of the bumps formed in such a manner that the plating forming the bumps uses an adjustment plate 15 mm apart from the substrate as shown in Fig. 7, while stirring the plating solution The paddle was moved at an average absolute value of 83 cm/sec. The distribution curve of the bump height (plating thickness) is flatter than that shown in Fig. 31, which indicates that the in-plane uniformity of the bump of Fig. 32 is improved.

Figure 34 is another embodiment of the plating apparatus of the present invention. The plating apparatus of this embodiment uses a shield plate 82 that extends vertically downward from the lower surface of the separator plate 80 and reaches the bottom wall of the plating tank 10 at the lower end. Therefore, the plating solution distribution chamber 86 formed under the separation plate 80 is completely separated by the shield plate 82 into the anode side solution distribution chamber 110 and the cathode side solution distribution chamber 112. The lower end surface of the shield plate 82 is fixed to the bottom wall of the plating tank 10 by, for example, welding.

The plating solution supply route 16 is provided with a main valve 114 and a flow meter 116 between the thermostatic unit 20 and the filter 22. Downstream of the filter 22, the bath supply route 16 branches into two bifurcation routes 16a, 16b, and the bifurcation routes 16a, 16b are each connected to the anode side solution distribution chamber 110 and the cathode side solution distribution chamber 112. The branching paths 16a, 16b are each provided with valves 118a, 118b.

By completely separating the plating solution distribution chamber 86 into the anode side solution distribution chamber 110 and the cathode side solution distribution chamber 112 by the shield plate 82 in this manner, the potential line generated by the anode 26 can be reliably prevented from passing through the plating solution distribution chamber. The plating solution of 86 leaked into the cathode (substrate) side. Further, the plating solution may be individually supplied to the anode side solution distribution chamber 110 and the cathode side solution distribution chamber 112 through the plating solution supply route 16.

FIGS. 35 and 36 illustrate another drive mechanism for the paddle 32 and the plating tank 10. In this embodiment, the upper end of the agitating paddle 32 is attached to the agitating paddle holding member 120. The shaft 38 projecting from the paddle drive member 42 is divided into three parts: a right end and a left end shaft 38a, 38b supported by the shaft holder 40, respectively, and an intermediate shaft between the end shafts 38a, 38b. Rod 38c. The intermediate shaft 38c passes through the agitating paddle holding member 120 to expose both ends. The intermediate shaft 38c has one end connected to the end shaft 38a by a coupling 122a and the other end connected to the end shaft 38b by a coupling 122b. In this particular embodiment, the couplers 122a, 122b are screw type couplers. However, any coupling can be used, such as a so-called quick coupler.

For example, when the agitating paddle 32 is replaced, the agitating paddle 32, the paddle holding member 120, and the intermediate shaft 38c can be removed by the plating device through the couplings 122a, 122b without having to remove the shaft holder by the plating device. 40. Therefore, the replacement of the stirring paddle 32 can be completed quickly and easily. Further, when the agitating paddle 32 is reinstalled in the plating apparatus, the agitating paddle 32 can be mounted at a predetermined position with good reproducibility. Further, the removal and reinstallation of the adjustment plate 34 can be easily accomplished by temporarily removing the paddle 32 from the plating apparatus.

Figure 37 illustrates another adjustment plate with another adjustment plate moving mechanism and another plating tank. The plating tank 10 of this embodiment includes an inner tank 130 and an outer tank 132 surrounding the outer circumference of the inner tank 130. The adjustment plate 134 is composed of a rectangular plate-like main body portion 138 having a cylindrical portion 136, and a clamping portion 140 which is wider than the main body portion 138 and integrally formed with the top portion of the main body portion 138. In this embodiment, the positioning of the adjustment plate 134 in the lateral (horizontal) direction parallel to the substrate W is accomplished by the adjustment plate moving mechanism 142 via the clamping portion 140.

The adjustment plate moving mechanism 142 includes: an adjustment plate bracket 144 configured to span the opening above the plating tank 10; a pair of brackets 146 vertically mounted on the outer peripheral end of the adjustment plate bracket 144; each formed by each of the brackets The female thread of the frame 146 is engaged with a horizontally movable lateral press bolt 148; and each of the laterally extending bolts 150 are formed to penetrate the unloaded holes of each of the brackets 146 and extend horizontally. When the holding portion 140 of the adjusting plate 134 is placed on the adjusting plate bracket 144 to set the adjusting plate 134 to a predetermined position, the position of the lateral pressing bolt 148 and the lateral fixing bolt 150 may be on the outer periphery of the holding portion 140. Opposite the end surface. At a position opposite to the lateral fixing bolt 150 in each of the outer peripheral end surfaces of the grip portion 140, female threads each being threadedly engaged with the lateral fixing bolt 150 are formed. The lateral pressing bolt 148 is in contact with the outer peripheral end surface of the clamping portion 140, and is pressed inwardly into the regulating plate 134 when being tightened.

Therefore, after the clamping portion 140 of the adjusting plate 134 is placed on the adjusting plate bracket 144 and the adjusting plate 134 is set at a predetermined position, the adjusting plate 134 can be completed in the lateral direction parallel to the substrate W by laterally pressing the bolt 148. Positioning, and the adjustment plate 134 can be secured with a lateral fixing bolt 150. The positioning of the adjustment plate 134 by laterally pressing the bolts 148 and the lateral fixing bolts 150 can be accomplished without the other portions of the adjustment plate 134 via the clamping portion 140. The lateral (horizontal) moving distance of the regulating plate 134 can be easily adjusted by controlling the number of revolutions of each of the lateral pressing bolts 148 having a predetermined pitch. When the lateral pressing bolt 148 is not in contact with the outer peripheral end surface of the grip portion 140 without pressing the regulating plate 134, each of the lateral fixing bolts 150 functions as a draw bolt.

In order to move the regulating plate 134 in the lateral direction parallel to the substrate W, a gap is formed between the circumferential surface of the main body portion 138 of the regulating plate 134 and the inner circumferential surface of the inner groove 130 of the plating tank 10. In this embodiment, a guide member 152 having a groove-shaped recess 152a that opens inward is provided at a position opposite to the circumferential surface of the main body portion 138 of the adjustment plate 134 in the inner groove 130, and The outer peripheral end portion of the main body portion 138 of the adjusting plate 134 is inserted into the recess 152a of the guiding member 152. The guiding member 152 is such that the regulating plate 134 can be moved laterally (horizontally) in parallel with the substrate W using the guiding member 152 as a guide while keeping the distance of the regulating plate 134 from the substrate W constant. Further, the insertion of the outer peripheral end portion of the main body portion 138 of the adjusting plate 134 into the recess 152a of the guiding member 152 prevents the electric field from being leaked from the periphery of the regulating plate 134.

As shown in Fig. 38, a movement gap t1 is provided between the bottom of the groove 152a of the guiding member 152 and the peripheral surface of the main body portion 138 of the regulating plate 134. For example, the moving gap t1 is 1 mm to 5 mm, and preferably 1 mm to 2 mm. For the reason of construction, a gap t2 is generally formed between the guiding member 152 and the inner circumferential surface of the inner groove 130. In this embodiment, in order to prevent the potential line from leaking out of the gap t2, the electric field shielding member 158 (for example, composed of a rubber seal) is fixed to the guiding member 152 by the sealing holding member 154 and the plurality of fixing bolts 156. Wherein the free end of the electric field shielding member 158 is in pressure contact with the inner peripheral surface of the inner tank 130. Although in this embodiment, the electric field shielding member 158 is disposed on the anode side of the guiding member 152, it may be disposed on the cathode (substrate) side or both sides of the guiding member 152.

Although in this embodiment, the adjustment plate moving mechanism 142 is used to laterally move the adjustment plate 134 in parallel with the substrate W, the adjustment plate 134 may be horizontally and vertically moved in parallel with the substrate W. Fig. 39 illustrates an adjustment plate moving mechanism 160 designed to move the adjustment plate 134 horizontally and vertically in parallel with the substrate W. The adjustment plate moving mechanism 160 is different from the adjustment plate moving mechanism 142 of FIG. 37 in that a vertically penetrating spiral coil female thread is provided in each of the outwardly protruding portions of the clamping portion 140 of the adjustment plate 134 (heli) -sert female thread), and the lower end of the vertical press-in bolt 162 (which is threadedly engaged with the female thread) is in contact with the top surface of the adjustment plate bracket 144, and the outwardly protruding portions of the clamping portion 140 The end portion is provided with a slit extending in the width direction of the plating tank 10, and the vertical fixing bolt 164 is inserted into the slit, and the lower portion of the vertical fixing bolt 164 is engaged with the female thread provided on the adjusting plate bracket 144. This embodiment does not use lateral fixing bolts.

According to this embodiment, when the vertical pressing bolt 162 is rotated in the fastening direction, the tip end of the bolt 162 comes into contact with the top surface of the adjusting plate bracket 144 by the reaction force with respect to the contact pressure acting on the top surface. The adjustment plate 134 is moved upward. On the contrary, when the vertical pressing bolt 162 is rotated in the loosening direction, the regulating plate 134 is moved downward. After the horizontal and vertical positioning of the adjustment plate 134 with respect to the substrate W is completed, the lower portion of the vertical fixing bolt 164 is engaged with the female screw provided on the adjustment plate holder 144 to fix the adjustment plate 134.

Instead of the press-in bolts 148, 162, a cylinder, a servo motor or the like can be used. Further, the long adjustment plate moving mechanism 142 shown in Fig. 37 and the adjustment plate moving mechanism 160 shown in Fig. 39 can be used in combination to adjust the vertical and horizontal positions of the adjustment plate 134. In this case, a vertically extending slit for insertion of the lateral fixing bolt 150 may be provided to the bracket 146, whereby the adjusting plate 134 may be fixed by the lateral fixing bolt 150 regardless of the vertical displacement position of the adjusting plate 134. It is also possible to omit the lateral pressing bolt 148 of the adjusting plate moving mechanism 160 shown in Fig. 39 to perform only the vertical positioning of the regulating plate 134 with respect to the substrate W.

The coating formed on the surface of the substrate W can be improved by fine-tuning the horizontal position of the adjustment plate 134 with respect to the substrate W by the adjustment plate moving mechanism 142 or fine-tuning the horizontal and vertical positions of the adjustment plate 134 with respect to the substrate W by the adjustment plate moving mechanism 160. The in-plane uniformity of the thickness. In particular, since the adjustment plate 134 is disposed at a position close to the substrate W, the vertical or horizontal position of the fine adjustment plate 134 with respect to the substrate W is important for improving the in-plane uniformity of the thickness of the plating film formed on the surface of the substrate W. .

The other adjustment plate shown in Fig. 40 and Fig. 41 is an adjustment plate 134 having the following structure shown in Fig. 37. The auxiliary adjustment plate mounting member for mounting the auxiliary adjustment plate 170 is provided on the anode side surface of the main body portion 138 of the adjustment plate 134. The auxiliary adjustment plate mounting member is a pair of side hooks 172a fixed at a position corresponding to a peripheral side portion of the auxiliary adjustment plate 170, and a pair of bottoms fixed to a bottom corner corresponding to the auxiliary adjustment plate 170. The hook 172b is constructed. By placing the auxiliary adjustment plate 170 on the auxiliary adjustment plate mounting member of the adjustment plate 134 (consisting of the pair of side hooks 172a and the pair of bottom hooks 172b), the auxiliary adjustment plate 170 can be placed to be predetermined with respect to the adjustment plate 134. Location.

In this embodiment, an adjustment plate (8 吋 wafer conditioning plate) having an opening 134a for 8 turns of wafer is used as the conditioning plate 134, and an auxiliary conditioning plate having an opening 170a for the 6-inch wafer. (6 吋 wafer conditioning plate) is used as the auxiliary adjustment plate 170. With this configuration, when the substrate W is changed from 8 吋 wafer to 6 吋 wafer, the auxiliary adjustment plate (6 吋 wafer conditioning plate) 170 can be attached to the adjustment plate (8 吋 wafer adjustment plate) 134. Cope with this change without replacing the adjustment plate. The clamping opening 170b is provided at the top of the auxiliary adjustment plate 170.

The lateral dimension t3, t4 and the lower vertical dimension t5 of the overlap between the adjustment plate 134 and the auxiliary adjustment plate 170 are generally not less than 5 mm, preferably not less than 10 mm, and the auxiliary adjustment plate 170 is attached to the adjustment. At the time of the plate 134, this prevents the power line of the anode 26 from passing through the gap of the adjustment plate 134 and the auxiliary adjustment plate 170 and then passing through the opening 134a of the adjustment plate 134 without passing through the opening 170a of the auxiliary adjustment plate 170.

Although this embodiment uses a combination of an 8-inch wafer conditioning plate and a 6-inch wafer conditioning plate, it is possible to use a combination of any two adjustment plates (first and second conditioning plates). For example, the first adjustment plate can be used in the usual case, and the second adjustment plate combined with the first adjustment plate can be used when it is necessary to adjust the electric field distribution depending on the type of substrate (plating object) used.

Figures 42 and 43 show the main parts of another embodiment of the plating apparatus of the present invention. The plating apparatus of this embodiment differs from the plating apparatus shown in Fig. 1 in that the former uses an anode holder 28 having a wide clamping portion 180 at the top (as shown in Fig. 43) and has a width. The adjustment plate 134 of the clamping portion 140 (as shown in FIG. 37), and the anode holder 28, the adjustment plate 134, and the substrate holder 24 are each passed through the clamping portion 180, the clamping portion 140, and the holder arm. The portion 64 (please refer to FIG. 9) is disposed on a single positioning/holding member 182 that spans the top opening of the plating tank 10. Therefore, the holding portion 180 of the anode holder 28, the holding portion 140 of the regulating plate 134, and the holder arm portion 64 of the substrate holder 24 are placed and set on the positioning/holding member 182 composed of a single member. This makes it possible to firmly match the central axis of the anode 26 fixed by the anode holder 28, the central axis of the cylindrical portion 136 of the regulating plate 134, and the central axis of the substrate W fixed by the substrate holder 24 to each other.

Although in this embodiment, the holding portion 180 of the anode holder 28, the holding portion 140 of the regulating plate 134, and the holder of the substrate holder 24 are disposed on the positioning/holding member 182 composed of a single member. The arm portion 64, however, it is also possible to position the anode holder 28, the adjustment plate 134, and other portions of the substrate holder 24 on the positioning/holding member 182 as long as the anode holder 28 can be adjusted with the positioning/holding member 182 as a reference. Vertical positioning of the plate 134 and the substrate holder 24.

Figures 44 and 45 illustrate another adjustment plate. The adjustment plate is added to the adjustment plate 134 as shown in Fig. 7 by the following structure. A diaphragm 188 is fixed to the anode side surface of the main body portion 138 of the adjustment plate 134 by a fixing plate 184 and a fixing bolt 186 so that the diaphragm 188 can cover the entire central opening 134a, and the diaphragm 188 is It is composed of a cation exchanger through which metal ions can pass through and an additive cannot penetrate, or a functional membrane (neutral filter membrane). By covering the opening 134a of the regulating plate 134 with the diaphragm 188 in this manner, the additive contained in the plating solution can be prevented from being decomposed and consumed on the surface of the anode 26.

Figures 46 to 48 show another embodiment of the plating apparatus of the present invention. The plating apparatus of this embodiment differs from the plating apparatus of Fig. 1 in that an adjustment plate holder 200 for detachably fixing the regulating plate 34 composed of the cylindrical portion 50 and the rectangular flange portion 52 is provided. It is installed at a predetermined position on the inner circumferential surface of the plating tank 10. The adjustment plate holder 200 is composed of a fixed holder 202 and a movable holder 204 each having a shape similar to a rectangular frame which is slightly larger than the flange portion 52 of the adjustment plate 34. The fixed holder 202 has a protruding portion 202a that protrudes toward the movable holder 204 at its bottom and both side ends. The height of the protruding portion 202a is approximately the same as the thickness of the flange portion 52 of the adjustment plate 34.

The fixed holder 202 is fixed to the inner peripheral surface of the plating tank 10 at its bottom and both side ends, and the movable holder 204 is rotatably supported at the lower end thereof via a hinge pin 206 to the plating tank 10 on. When the movable holder 204 is rotated toward the fixed holder 202, the bottom and both side ends of the movable holder 204 are in contact with the top of the protruding portion 202a of the stationary holder 202, whereby the stationary holder 202 is in the stationary holder 202. An upwardly open space in which the adjustment plate 34 is to be placed may be formed with the movable holder 204, the thickness of which is approximately the same as the thickness of the flange portion 52 of the adjustment plate 34.

An electric field shielding member 208 (for example, composed of a rubber sheet) whose lower end is in elastic contact with the bottom of the plating tank 10 is attached to the lower end of the movable holder 204 to prevent electric field from leaking between the movable holder 204 and the bottom of the plating tank 10. Out.

According to this embodiment, the adjustment plate 34 can be fixed to the adjustment plate holder 200 by placing the adjustment plate 34 between the fixed holder 202 and the movable holder 204, and the movable holder 204 is provided. The outer peripheral end of the regulating plate 34 is sandwiched between the fixed holder 202 and the movable holder 204 by rotating the stationary holder 202 and fixing the movable holder 204 with a holder (not shown), for example. Holding the adjustment plate 34 in the adjustment plate holder 200 in this manner prevents an electric field from leaking between the fixed holder 202 and the movable holder 204.

The adjustment plate 34 can be released from the adjustment plate holder 200 by first loosening the movable holder 204 and then rotating the movable holder 204 away from the fixed holder 202, as shown in Fig. 48, and then The adjustment plate 34 is pulled upward by the movable holder 204.

By installing the adjustment plate holder 200 that detachably holds the adjustment plate 34 at a predetermined position of the plating tank 10, the replacement of the adjustment plate 34 can be completed simply and quickly.

While the invention has been described in terms of specific embodiments, it is understood that the invention is not limited to the specific embodiments described above, but is intended to cover modifications that fall within the inventive concept.

10. . . Plating tank

10a. . . Side panel

12. . . Overflow trough

14. . . Pump

16. . . Plating solution supply route

16a, 16b. . . Bifurcation route

18. . . Plating solution supply inlet

20. . . Thermostatic unit

twenty two. . . filter

twenty four. . . Substrate holder

26. . . anode

28. . . Anode holder

30. . . Plating power supply

32. . . mixer

32a. . . Slit

32b. . . Strip

34,134. . . Adjustment board

36. . . Clip

38. . . Shaft

38a, 38b. . . Right and left shafts

38c. . . Intermediate shaft

40. . . Shaft retainer

42. . . Stirring paddle drive unit

44. . . motor

46. . . Control unit

50. . . Cylindrical part

50a. . . Part

52. . . Rectangular flange

60. . . Holder clamp

62. . . Holder bracket

62a. . . Grooved opening

64. . . Holder arm

66. . . Arm side contact

68. . . Bracket side joint

70. . . Arm side magnet

72. . . Bracket side magnet

80. . . Separation plate

80a. . . Plating liquid passage hole

82. . . Shield

82a. . . Semicircular opening

84. . . Substrate processing chamber

86. . . Plating solution distribution room

90. . . Separation plate bracket

92. . . pad

94,100. . . Electric field shielding member

96. . . Adjusting plate fixing slit plate

96a, 96b. . . Slit

98. . . Fixing screw

110. . . Anode side solution distribution chamber

112. . . Cathode side solution distribution chamber

114. . . Main valve

116. . . Flow meter

118a, 118b. . . valve

120. . . Stirring paddle retaining member

122a, 122b. . . Coupling

130. . . Inner slot

132. . . Outer slot

134a, 170a. . . Opening

136. . . Cylindrical part

138. . . Rectangular plate body part

140. . . Clamping part

142,160. . . Adjustment plate moving mechanism

144. . . Adjustment plate bracket

146. . . bracket

148. . . Lateral press-in bolt

150. . . Lateral fixing bolt

152. . . Guide member

152a. . . Grooved groove

154. . . Seal holding member

156. . . Fixing bolts

158. . . Electric field shielding member

162. . . Press the bolt vertically

164. . . Vertical fixing bolt

170. . . Auxiliary adjustment board

170b. . . Clamping opening

172a. . . Side hook

172b. . . Bottom hook

180. . . Wide clamping part

182. . . Positioning/holding part

184. . . Fixed plate

186. . . Fixing bolts

188. . . Diaphragm

200. . . Adjustment plate holder

202. . . Fixed holder

202a. . . Prominent part

204. . . Movable retainer

206. . . Hinge pin

208. . . Electric field shielding member

B. . . width

H. . . Lateral length

L ₁ , L ₂ . . . Vertical length

Q. . . Plating solution

W. . . Substrate (plated object)

St. . . Reciprocating distance

t. . . Thickness (thickness)

θ. . . Tilt angle

T1. . . Moving gap

T2. . . gap

T3, t4. . . Horizontal size

T5. . . Lower vertical dimension

1 is a vertical cross-sectional elevation view of one embodiment of a plating apparatus of the present invention;

Figure 2 is a plan view of a stirring paddle used in the plating apparatus of Figure 1;

Figure 3 is a cross-sectional view taken along line A-A of Figure 2;

4A and 4B each illustrate a stirring paddle variant corresponding to FIG. 3;

Figure 5 is a schematic view showing the paddle drive mechanism and plating tank of the plating apparatus of Figure 1;

The plan view of Fig. 6 is a diagram showing the stroke end of the stirring paddle;

Figure 7 is a perspective view of an adjustment plate used in the plating apparatus of Figure 1;

Figure 8 is a side view of another adjustment plate;

Figure 9 is a view showing the relationship between the substrate holder of the plating apparatus of Fig. 1 and the holder holder of the plating tank;

10 is an enlarged perspective view showing the retainer arm portion of the plating apparatus of FIG. 1 and its vicinity;

Figure 11 is a cross-sectional view showing the holder arm and the holder bracket that are in contact with each other;

Figure 12 is a right side view of Figure 11;

Figure 13 is a perspective view of another retainer bracket;

Figure 14 is a plan view of a separating plate used in the plating apparatus of Figure 1;

Figure 15 is a plan view showing a variation of one of the separation plates;

Figure 16 is a cross-sectional view showing the side plate of the plating tank in which the separating plate is mounted in the plating apparatus of Figure 1;

Figure 17 is a perspective view showing the relationship between the separating plate, the shielding plate and the bottom of the plating tank in the plating apparatus of Figure 1;

Figure 18 is a perspective view showing another relationship of the separating plate, the shielding plate and the bottom of the plating tank;

Figure 19 is a cross-sectional view showing the relationship between the flange portion of the adjusting plate in the plating apparatus of Figure 1 and the separating plate;

The top view of the plating tank of FIG. 20 illustrates a specific embodiment in which the adjusting plate is mounted on the plating tank by adjusting the distance between the adjusting plate and the substrate;

Figure 21 is a flow chart of a copper plating process for forming bumps;

Figure 22 illustrates a bump shape formed by plating at a current density of 8 ASD while agitating the plating solution by moving the stirring paddle at a speed of an average absolute value equal to 20 cm/sec;

Figure 23 illustrates a bump shape formed by plating at a current density of 8 ASD while agitating the plating solution by moving the stirring paddle at a speed of an average absolute value equal to 83 cm/sec;

Figure 24 is a photomicrograph of a bump formed by moving a 2 mm thick paddle at a speed of an average absolute value of 40 cm/sec to agitate the plating solution;

Figure 25 is a photomicrograph of a bump formed by moving a 4 mm thick paddle at a speed of an average absolute value of 40 cm/sec to agitate the plating solution;

Figure 26 is a photomicrograph of a bump formed by moving a 4 mm thick paddle at a speed of an average absolute value equal to 67 cm/sec to agitate the plating solution;

Figure 27 is a photomicrograph of a bump formed by moving a 4 mm thick paddle at a speed of an average absolute value equal to 83 cm/sec to agitate the plating solution;

Figure 28 is a photomicrograph of a bump formed by moving a 3 mm thick paddle at a speed of an average absolute value of 83 cm/sec to agitate the plating solution;

Figure 29 is a distribution diagram of the height of the bump formed in the following manner on the substrate: plating is performed using a plating tank which is not provided with a shield plate under the separation plate;

Figure 30 is a distribution diagram of the height of the bump formed in the following manner on the substrate: plating is performed using a plating tank provided with a shield plate under the separation plate;

The graph of Fig. 31 shows the in-plane uniformity of the bump height formed in the following manner by using a 5 mm thick flat adjustment plate having an opening at the center and 35 mm from the substrate while stirring The paddle is moved at an average absolute value equal to 20 cm/sec to agitate the plating solution;

The graph of Fig. 32 shows the in-plane uniformity of the height of the bump formed in the following manner by using the adjustment plate shown in Fig. 7 which is 15 mm apart from the substrate, while averaging the stirring paddle The absolute value is equal to 83 cm / sec to move the stirring solution;

Figure 33 illustrates the X-axis and Y-axis indicated in Figures 31 and 32;

Figure 34 is a vertical sectional elevational view of another embodiment of the plating apparatus of the present invention;

Figure 35 is a plan view showing another paddle drive mechanism and a plating tank;

Figure 36 is a vertical sectional front view of Figure 35;

Figure 37 is a vertical sectional side view showing another adjustment plate and another plating tank provided with an adjustment plate moving mechanism;

Figure 38 is a cross-sectional view taken along line B-B of Figure 37;

Figure 39 illustrates a major portion of an adjustment plate provided with another adjustment plate moving mechanism;

Figure 40 is a front view of another adjustment plate;

Figure 41 is a plan view of Figure 40;

Figure 42 is a vertical sectional elevational view of another embodiment of the plating apparatus of the present invention;

The front view of Fig. 43 illustrates the anode holder and the positioning/holding member used in the plating apparatus shown in Fig. 42;

Figure 44 is a front view of another adjustment plate;

Figure 45 is a cross-sectional view taken along line C-C of Figure 44;

Figure 46 is a vertical sectional elevational view of another embodiment of the plating apparatus of the present invention;

Figure 47 is a cross-sectional view showing the adjustment plate holder and the adjustment plate of the plating apparatus shown in Figure 46;

The cross-sectional view of Fig. 48 illustrates the adjustment plate holder when the adjustment plate is released by the adjustment plate holder.

10. . . Plating tank

12. . . Overflow trough

14. . . Pump

16. . . Plating solution supply route

18. . . Plating solution supply inlet

20. . . Thermostatic unit

twenty two. . . filter

twenty four. . . Substrate holder

26. . . anode

28. . . Anode holder

30. . . Plating power supply

32. . . mixer

34. . . Adjustment board

50. . . Cylindrical part

52. . . Rectangular flange

80. . . Separation plate

82. . . Shield

84. . . Substrate processing chamber

86. . . Plating solution distribution room

Q. . . Plating solution

W. . . Substrate (plated object)

Claims (63)

A plating apparatus for plating an article comprising: a plating tank for containing a plating solution; an anode to be immersed in the plating solution in the plating tank; and a holder for holding a plated article and a position of the plated article opposite to the anode; a paddle disposed between the anode and the plated article held by the holder, and the plated article Reciprocatingly moving in parallel to agitate the plating solution, the agitating paddle includes a plate-like member having a plurality of strip portions; and an adjustment plate disposed between the anode and the agitating paddle and made of a dielectric material, a uniform potential distribution for the entire surface of the plated article; a paddle drive member for driving the paddle; and a control member for controlling the paddle drive member such that the paddle at the end of one stroke The strip portion does not overlap the strip portion of the paddle at the end of the other stroke. A plating apparatus according to claim 1, wherein the control member controls the stirring blade driving member such that the stirring blade moves at an average absolute value of 70 cm/sec to 100 cm/sec. A plating apparatus according to claim 2, wherein the plate member has a thickness of from 3 mm to 5 mm. The plating apparatus of claim 2, wherein each strip portion of the stirring paddle is opposite to a vertical plane parallel to the plated article Tilt from 30 degrees to 60 degrees. The plating apparatus of claim 2, wherein each of the strip portions has a width of 2 mm to 8 mm. The plating apparatus of claim 1, wherein the agitating paddle is at a distance of 5 mm to 11 mm from the plated article. The plating apparatus of claim 1, wherein the adjusting plate disposed between the anode and the stirring paddle and made of a dielectric material comprises: a cylindrical portion having an inner diameter matching a contour of the plated object And a flange portion connected to the outer peripheral end of the anode side of the cylindrical portion for adjusting an electric field formed between the anode and the plated article. The plating apparatus of claim 7, wherein a distance between the plated article and a side of the plated article of the cylindrical portion of the adjustment plate is 8 mm to 25 mm. The plating apparatus of claim 1, wherein the holder has an outwardly protruding retainer arm, and the plating tank has a contact for contacting the retainer arm to suspend and support the retainer The upper holder bracket is provided with a fixing member for fixing the holder arm to the holder bracket in a contact area of the holder arm and the holder holder. The plating apparatus of claim 9, wherein the fixing member is a magnet mounted on at least one of the holder arm portion and the holder holder. A plating apparatus according to claim 9 wherein the holder arm And the retainer bracket having contacts at least in a portion of the contact area thereof, the contacts being in contact with each other and closed when the retainer is suspended and supported on the plating tank, and When the contacts are closed, power is allowed to be supplied to the plated article. A plating method for plating an object, comprising: arranging an anode and a plating object opposite to each other in a plating solution of a plating tank; and disposing a stirring paddle on the anode and the plating object held by the holder The agitating paddle comprises a plate-like member having a plurality of strip portions; an adjusting plate is disposed between the anode and the agitating paddle, the adjusting plate being made of a dielectric material for allowing the entire surface of the plated article Having a uniform potential distribution; and reciprocating the agitating paddle in a manner parallel to the plated article such that the strip portion of the paddle at the end of one stroke does not overlap the paddle at the end of the other stroke The strips partially overlap while a voltage is applied between the anode and the plated article. The plating method of claim 12, wherein the reciprocating stirring paddle has an average absolute value of 70 cm/sec to 100 cm/sec. The plating method of claim 12, wherein the plate member has a thickness of from 3 mm to 5 mm. The plating method of claim 12, wherein the distance between the stirring paddle and the plated article is 5 mm to 11 mm. The plating method of claim 12, wherein each strip portion of the stirring paddle is perpendicular to a plane parallel to the plated article The surface is tilted from 30 degrees to 60 degrees. The plating method of claim 12, wherein each of the strip portions has a width of 2 mm to 8 mm. The plating method of claim 12, wherein an adjusting plate made of a dielectric material is disposed between the anode and the stirring pad, the adjusting plate comprising: a cylindrical shape having an inner diameter matching the contour of the plated object a portion; and a flange portion connected to the outer peripheral end of the anode portion of the cylindrical portion for adjusting an electric field formed between the anode and the plated article. The plating method of claim 18, wherein the distance between the plated article and the side end portion of the cylindrical portion of the adjusting plate is 8 mm to 25 mm. A plating apparatus for plating an article comprising: a plating tank for containing a plating solution; an anode to be immersed in the plating solution in the plating tank; and a holder for holding a plated article and a position of the plated article opposite the anode; a paddle configured to be between the anode and the plated article held by the holder, and the plating The article reciprocates in parallel to agitate the plating solution; and a control member for controlling a paddle driving member for driving the paddle; wherein the plating tank is a separator plate having a plurality of plating liquid passage holes Separating into a plating object processing chamber and a plating solution distribution chamber; Wherein, the plating liquid distribution chamber is provided with a shielding plate for adjusting the electric field while ensuring the dispersed flow of the plating solution. The plating apparatus of claim 20, further comprising: an adjustment plate disposed between the anode and the holder and made of a dielectric material, the adjustment plate comprising: an inner peripheral shape corresponding to the plated object a cylindrical portion having a peripheral shape; and a flange portion connected to an outer peripheral end of the anode portion of the cylindrical portion for adjusting an electric field formed between the anode and the plated article; and an electric field shielding member The separation plate is contacted and attached to the lower end of the flange portion. The plating apparatus of claim 20, wherein the plating liquid distribution chamber is partitioned into an anode side solution distribution chamber and a cathode side solution distribution chamber by the shielding plate, and a plating liquid supply route is provided to supply the plating solution to the An anode side solution distribution chamber and the cathode side solution distribution chamber. The plating apparatus of claim 1, wherein the agitating paddle is coupled to a shaft extending from the agitating paddle driving member via a coupling. The plating apparatus of claim 20, further comprising a stirring paddle between the anode and the holder for stirring the plating solution. The plating apparatus of claim 24, wherein the stirring paddle has a plurality of vertically extending strip portions, the plating apparatus further comprising: a stirring blade driving part for moving the stirring paddle; and controlling a device for controlling the paddle drive member to The surface of the plated article moves the paddle plate in a reciprocating manner such that when the paddle pad is at the rightmost position, the strip portion does not cover when the paddle pad is at the leftmost position. The surface of the plated article is covered by the same portion of the strip portion. The plating apparatus of claim 20, further comprising an adjustment plate between the anode and the holder, the adjustment plate comprising a cylindrical portion having an inner peripheral shape corresponding to a peripheral shape of the object to be plated. The plating apparatus of claim 26, wherein the adjustment plate further comprises a flange portion, the cylindrical portion extending through the flange portion. A plating apparatus according to claim 20, wherein the holder is movable to convey the coated article. A plating apparatus for plating an article comprising: a plating tank for containing a plating solution; an anode to be immersed in the plating solution in the plating tank; and a holder for holding a plated article and the plated article disposed at a position opposite to the anode; a stirring paddle disposed between the anode and the plated article held by the holder, and the plated article Reciprocatingly moving in parallel to agitate the plating solution; an adjustment plate disposed between the anode and the agitating paddle and having an opening to limit an electric field widening; a guiding member having a groove-shaped groove forming an opening inward and being disposed Positioning in the plating tank opposite to the peripheral end portion of the adjusting plate for inserting the peripheral end portion of the adjusting plate into the groove thereof to guide the Adjusting the movement of the plate; and adjusting the plate moving mechanism for moving the adjusting plate vertically or in parallel with the plated article, the adjusting plate moving mechanism comprising: an adjusting plate bracket for supporting the An adjustment plate on the surface of the plating solution, and a press-in member for pressing the adjustment plate supported by the adjustment plate holder to vertically or horizontally move the adjustment plate while maintaining the adjustment plate and The constant distance between the coated objects. The plating apparatus of claim 29, wherein the guiding member is provided on an inner circumferential surface of the plating tank. The plating apparatus of claim 29, wherein the adjustment plate is provided with a mounting member for mounting an auxiliary adjustment plate for adjusting an electric field. A plating apparatus according to claim 29, further comprising positioning/holding means for positioning and holding the holder, the regulating plate, and the anode holder holding the anode. The plating apparatus of claim 29, wherein an electric field shielding member is disposed on an anode side of the guiding member to prevent current from leaking between the plating tank and the guiding member. The plating apparatus of claim 29, wherein the adjustment plate comprises: a cylindrical portion having an inner diameter matching the contour of the plated article; and a flange portion connected to the anode side peripheral end of the cylindrical portion . The coating device of claim 29, wherein the adjustment plate package The flange portion is formed by the opening; the diaphragm is composed of a cation exchanger or a functional membrane through which metal ions can pass through but the additive is impermeable; and a fixing plate for fixing the diaphragm to The anode side surface of the flange portion is such that the diaphragm covers the entire opening of the flange portion. The plating apparatus of claim 29, wherein the adjustment plate comprises: a flange portion having the opening; and a mounting member for mounting an auxiliary adjustment plate on an anode side surface of the flange portion, the auxiliary The opening of the adjustment plate has a diameter smaller than the diameter of the opening of the flange portion, and is mounted such that the flange portion and the opening central axis of the auxiliary adjustment plate coincide with each other. An electroplating apparatus for electroplating articles, comprising: a plating tank for accommodating a plating solution containing an additive; an anode to be immersed in the plating solution in the plating tank; an anode holder, The substrate holder is configured to hold the substrate, and the substrate holder is configured to be held by the substrate holder when the substrate is held by the substrate holder. The surface will be immersed in the plating solution and will be located in the plating tank at a position opposite to the anode; an adjustment plate is disposed between the anode and the substrate held by the substrate holder, the adjustment plate having an opening To adjust the potential distribution; a positioning/holding member comprising a single member detachably holding the anode holder, the substrate holder, and the adjustment plate, such that a central axis of the anode held by the anode holder and the substrate holder are held The central axis of the substrate and the central axis of the opening of the adjustment plate are coaxial. The electroplating apparatus of claim 37, further comprising a diaphragm covering the entire opening of the adjusting plate. The electroplating apparatus of claim 37, further comprising a stirring paddle between the adjusting plate and the substrate holder for stirring the plating solution. The plating apparatus of claim 39, wherein the stirring paddle has a plurality of vertically extending strip portions, the plating apparatus further comprising: a stirring paddle driving part for moving the stirring paddle; and a controller And controlling the paddle drive member to move the paddle plate in a reciprocating manner along the surface of the substrate such that the bar portion does not when the paddle pad is at the rightmost position Covering the same portion of the surface of the substrate that is covered by the strip portion when the paddle is at the leftmost position. The plating apparatus of claim 37, wherein the adjustment plate comprises a cylindrical portion having a shape of an inner circumference corresponding to a shape of an outer circumference of the substrate. The electroplating apparatus of claim 41, wherein the adjustment plate further comprises a flange portion, the cylindrical portion extending through the flange portion. An electroplating apparatus according to claim 37, wherein the substrate is held The device is movable to transport the substrate. An electroplating apparatus for electroplating articles, comprising: a plating tank for accommodating a plating solution containing an additive, the plating tank having a processing chamber having a bottom surface; and an anode to be immersed in the plating In the plating solution in the tank; a substrate holder for holding the substrate, the substrate holder being configured to hold the substrate held by the substrate holder when the substrate is held by the substrate holder The surface will be immersed in the plating solution and will be located in the plating tank at a position opposite to the anode; an adjustment plate is disposed between the anode and the substrate held by the substrate holder, the adjustment plate having Opening to adjust a potential distribution; and an elastic electric field shielding member located at a lower end of the adjusting plate facing the anode side of the adjusting plate such that a lower end of the electric field shielding member elastically contacts the bottom surface of the processing chamber of the plating tank, the electric field The shielding member is configured to avoid current leakage between the conditioning plate and the bottom surface of the processing chamber of the plating bath. The electroplating apparatus of claim 44, further comprising a diaphragm covering the entire opening of the adjusting plate. The electroplating apparatus of claim 44, further comprising a stirring paddle between the adjusting plate and the substrate holder for stirring the plating solution. The electroplating apparatus of claim 46, wherein the stirring paddle has a plurality of vertically extending strip portions, and the electroplating apparatus further comprises: a paddle drive member for moving the paddle; and a controller for controlling the paddle drive member to reciprocally move the paddle along the surface of the substrate such that the paddle When the plate is at the rightmost position, the strip portion does not cover the same portion of the surface of the substrate that is covered by the strip portion when the paddle is at the leftmost position. The plating apparatus of claim 44, wherein the adjustment plate comprises a cylindrical portion having a shape of an inner circumference corresponding to a shape of an outer circumference of the substrate. The electroplating apparatus of claim 48, wherein the adjustment plate further comprises a flange portion, the cylindrical portion extending through the flange portion. A plating apparatus according to claim 44, wherein the substrate holder is movable to transport the substrate. The electroplating apparatus of claim 44, wherein the electric field shielding member comprises a rubber sheet. A plating apparatus for plating an object, comprising: a plating tank for accommodating a plating solution; an anode to be immersed in the plating solution in the plating tank; and a retainer for use And maintaining the plated article and the plated article at a position opposite to the anode; the paddle is disposed between the anode and the plated article held by the holder, and is plated The covering member reciprocates in parallel to agitate the plating solution; the pair of adjusting plate fixing slit plates are mounted on the side of the plating tank a position of the wall between the anode and the agitating paddle, each of the pair of adjusting plate fixing slit plates having a plurality of vertical portions arranged at a predetermined interval along each of the side walls of the plating tank a slit; and an adjustment plate having an opening to limit an electric field widening, each of the plurality of vertical slits being configured to receive a side end of the adjustment plate so as to be inserted into each side end of the adjustment plate One of the plurality of vertical slits of each of the pair of adjustment plate fixing slit plates is adjustably attached to the plating tank. The plating apparatus of claim 52, further comprising an electric field shielding member disposed at an anode side lower end of the adjusting plate to prevent current from leaking between the plating tank and the adjusting plate. The plating apparatus of claim 52, further comprising an electric field shielding member disposed on an anode side of the adjusting plate to prevent current from at least one of the adjusting plate and the pair of adjusting plate fixing slit plates Leak between. The plating apparatus of claim 52, wherein the adjustment plate comprises: a cylindrical portion having an inner diameter matching a contour of the plated article; and a flange portion connected to an outer peripheral end of the anode portion of the cylindrical portion . The plating apparatus of claim 52, wherein the adjusting plate comprises: a flange portion having the opening; and a diaphragm, a cation exchanger through which metal ions can penetrate but the additive is impenetrable, or a function Membranes; and a fixing plate for fixing the diaphragm to the anode side surface of the flange portion such that the diaphragm covers the entire opening of the flange portion. The plating apparatus of claim 52, wherein the adjustment plate comprises: a flange portion having the opening; and a mounting member for mounting an auxiliary adjustment plate on an anode side surface of the flange portion, The opening of the auxiliary adjustment plate has a diameter smaller than a diameter of the opening of the flange portion, and is installed such that the flange portion and the opening central axis of the auxiliary adjustment plate coincide with each other. A plating apparatus for plating an object, comprising: a plating tank for accommodating a plating solution; an anode to be immersed in the plating solution in the plating tank; and a retainer for use And maintaining the plated article and the plated article at a position opposite to the anode; the paddle is disposed between the anode and the plated article held by the holder, and is plated The covering member reciprocates in parallel to agitate the plating solution; the adjusting plate has an opening to limit the electric field widening; and the adjusting plate holder is disposed between the anode and the stirring paddle and can separately hold each of the adjusting plates The adjustment plate holder includes: a fixed holder fixed to the plating tank; and a movable holder rotatably supported on the plating tank through the hinge pin; wherein the adjustment plate holder is Configured to clamp the adjustment plate The adjustment plate is held between the fixed display holder and the movable holder. The plating apparatus of claim 58, wherein an electric field shielding member is disposed at a lower end of the movable holder to prevent an electric field from leaking between the movable holder and the plating tank. The apparatus of claim 58, wherein the adjustment plate comprises: a cylindrical portion having an inner diameter matching the contour of the plated article; and a flange portion connected to the anode side peripheral end of the cylindrical portion. The plating apparatus of claim 58, wherein the adjusting plate comprises: a flange portion having the opening; and the diaphragm is a cation exchanger or a functional film which is permeable to metal ions but impermeable to the additive And a fixing plate for fixing the diaphragm to the anode side surface of the flange portion such that the diaphragm covers the entire opening of the flange portion. The plating apparatus of claim 58, wherein the adjustment plate comprises: a flange portion having the opening; and a mounting member for mounting an auxiliary adjustment plate on an anode side surface of the flange portion, the auxiliary The opening of the adjusting plate has a diameter smaller than a diameter of the opening of the flange portion, and is installed such that the flange portion and the opening central axis of the auxiliary adjusting plate coincide with each other A plating method for plating an article, comprising: arranging an anode and a plating object opposite to each other in a plating solution of a plating tank; Configuring a stirring paddle between the anode and the plated article held by the holder, the agitating paddle comprising a plate-like member having a plurality of strip portions; and an adjustment plate disposed between the anode and the paddle Having a uniform potential distribution across the entire surface of the plated article, and the conditioning plate is made of a dielectric material; and reciprocating the paddle in a manner parallel to the plated article such that the strip portion of the paddle is not An electric field shadow is formed on the substrate.