200928689 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱器，特別涉及一種用於為 電子元件進行散熱之相變化散熱器。 【先前技術】 電子元件在運行過程中通常產生大量之熱 量，為確保電子元件正常運行，這些熱量需要及時BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink, and more particularly to a phase change heat sink for dissipating heat from an electronic component. [Prior Art] Electronic components usually generate a large amount of heat during operation. To ensure proper operation of electronic components, these heats need to be timely.
散熱出去，該電子元件上通常加裝一散熱器為其散 熱。該散熱器通常包括一吸熱板及設置於該吸熱板 上之散熱鰭片。該吸熱板由銅、鋁等熱傳導性良好 之金屬材料製成，但金屬板受制於材料本身有限之 熱傳導〖生’若對咼發熱1之電子元件，會產生明顯 之熱阻而無法達到良好散熱，影響電子元件之運行 穩定性。 為提升散熱器之效率，業界亦採用在吸熱板設 ϋ置一腔體，該腔體内封入水、乙醇等工作流體，利 用工作流體之相變化來提高傳熱速度。工作時，工 作流體在吸熱板之吸熱區吸熱氣化到達吸熱板之 放熱區’而後冷卻液化。為使液化後之工作流體能 更快回流至吸熱板之吸熱區，該吸熱板於腔體周邊 5又置一種毛細結構。毛細結_構一般分為粉末燒結毛 細結構、網線毛細結構、溝槽毛細結構三種。液化 後之工作流體在毛細結構中回流至發熱區參與相 變化循環。惟，在電子元件小型化及高熱流量趨勢 200928689 下，為之散熱之散熱器亦隨之需要小型化及高效率 散熱性能，而内部設置普通毛細結構之散熱器難以 達到預期散熱效果。為滿足日益小型化及高熱流量 電子元件之散熱需求，該散熱器需進一步優化。 【發明内容】 有鑒·於此，實有必要提供一種散熱效率高之相 變化散熱器。 一種散熱器，包括一吸熱體及設於該吸熱體上 ®之散熱體，該吸熱體包括一吸熱板及與該散熱體相 接之蓋板，該吸熱板與蓋板之間具有一腔體，該腔 體内填充有工作流體，所述吸熱板結合有第一毛細 結構層，所述蓋板結合有第二毛細結構層，該吸熱 板和蓋板之間設置有複數脈管連通該第一毛細結 構層和第二毛細結構層。 與習知技術相比，所述吸熱體内設置脈管位於其吸 &熱板和蓋板之間且連通位於該蓋板之第二毛細結 構層及位於該吸熱板之第一毛細結構層，從而使在 蓋板處冷凝液化之工作流體迅速回流至吸熱板處 參與相變化循環。 【實施方式】 如圖1至圖3所示，本發明散熱器包括一吸熱 體10及設於該吸熱體10上之複數散熱鰭片30。 該吸熱體10内設置有四脈管170。 所述吸熱體10包括一箱體110及密封蓋置於 7 200928689 該箱體110開口上之蓋板15 0。請同時參閱圖4和 圖5,該箱體110包括一矩形容槽111及從容槽111 • 四上周緣向外延伸之折邊112。該容槽111具有一 矩形吸熱板11 3及從該吸熱板11 3四周緣向上延伸 之首尾連接之四側壁114。所述蓋板15 0之周緣部 分密封貼置該折邊11 2，從而在吸熱板10内形成 一密閉腔體180。該腔體180内填充有一定量之工 作流體。 ❹ 所述容槽111設有一第一毛細結構層116。該 第一毛細結構層11 6覆蓋該容槽111之吸熱板11 3 及四側壁114。該第一毛細結構層116由金屬粉末 燒結而成，可以理解地，該第一毛細結構層116亦 • 可由金屬網線編制而成或由在吸熱板 113及側壁 114上刻溝槽而成。 所述蓋板150上設有一第二毛細結構層156。 D該第二毛細結構層1 5 6覆蓋所述蓋板15 0對應該腔 體180部分。該第二毛細結構層156由金屬網線製 成，可以理解地，該第二毛細結構層15 6亦可由金 屬粉末燒結而成或由在該蓋板 15 0上刻溝槽而 成。本發明中，第一毛細結構層116可與第二毛細 結構層 15 6相同，亦可不同。該第二毛細結構層 15 6緊貼至該蓋板1 5 0之下表面。該第二毛細結構 層156與所述第一毛細結構層116相接，且該二毛 細結構層之毛細結構相連通，工作流體可以從第二 8 200928689 毛細結構層] 、 進入第一毛細結構層11 6。 所述 129 1 1Λ 述吸熱板H 1 S 置於所述腔體180内而位於所 ^ 3和蓋板150之間。該四狀管170在該 腔體180内 ^ 網線或纖維n』x狀排布。該脈管170由金屬 ,|寻材料編制而成，.其管壁（未標示） 上形成複备,，， ， j 一=小孔隙’内部形成一中心通孔（未檁 厂、“脈管17〇之橫截面為圓環形，其外徑之大 ❹ 小大致與所诚楚》 这第一、第二毛細結構層116、15 6間 之距離相當’從而使得脈管170沿垂直方向分別與 該第、第二毛細結構層116、156相接觸，且其 毛細結構相連通’工作流體可以在該脈管170、第 一毛細結構層116及第二毛細結構層156之間流 通。每一脈管170彎折呈L形，其具有位於該吸熱 板113中部之第一毛細段（未標示）及從該第一毛 細段向外延伸之第二毛細段（未標示），該第二毛 〇細段位於該吸熱板113之側部。其中二脈管170之 第一毛細段在一條直線上而平行於另外二脈管17 0 之第一毛細結構段。其中二脈管170之第二毛細段 在一條直線上而平行於另外二脈管 17〇之第二毛 細結構段。可以理解地’該四臉管17 0之第一毛細 段均相互平行，該四脈管1 7 0之第二毛細段均相互 平行。 所述每一鰭片3 0之底部形成有一折邊，複數 鰭片30之折邊形成結合所述蓋板150之接觸面。 200928689 使用時，所述箱體110容槽111之吸 緊貼發熱電子元件吸熱’腔體180内之工 該吸熱板113吸熱氣化為蒸汽而上升至蓋 工作流體在該蓋板150處遇冷放出熱量 液態’該熱量進而傳遞至鰭片30散發出 之工作流體通過第-一毛細結構層1 5 6、第 構層116及脈管170流向吸熱板113進行 環。 Θ 與習知技術相比，所述吸熱體10内 170位於其吸熱板113和蓋板150之間且 該蓋板15 0之第二毛細結構層15 6及位於 11 3之第一毛細結構層116，從而使在蓋 冷凝液化之工作流體迅速回流至吸熱板 與相變化循環。另外，該脈管170之第一 於該吸熱板 11 3之中部而其第二毛細段 ❹熱板11 3之侧部，從而使處於吸熱板113 作流體通過該脈管170更快地向該吸熱板 部匯集’利於該吸熱板11 3從電子元件吸 通過工作流體之相變化循環更快地傳遞注 綜上所述，本發明符合發明專利要件 提出專利申請。惟，以上所述者僅為本發 實施例’舉凡熟悉本案技藝之人士，在爰 精神所作之等效修飾或變化，皆應涵蓋於 凊專利範圍内。 .熱板11 3 作流體從 L 板 15 0, 而冷卻為 去。液態 一毛細結 相變化循 設置脈管 連通位於 該吸熱板 板150處 113處參 毛細段處 處於該吸 侧部之工 113之中 枚之熱量 !去。 ’羑依法 曰月之較佳 依本發明 以下之申 200928689 【圖式簡單說明】 圖1係本發明散熱器之立體分解圖。 圖2係本發明散熱器之立體組裝圖。 圖3係圖2之倒置圖。 圖4係圖2中散熱器沿iv -IV線之剖視圖。 圖5係圖4中圈V部分之放大示意圖。 【主要元件符號說明】 〇 °及熱體 10 箱體 谷槽 in 折邊 ϋ及熱板 113 側壁 第一毛細結構層 116 蓋板 第二毛細結構層 156 脈管 腔體 180 縛片 110 112 114 150 170 30 11To dissipate heat, a heat sink is usually added to the electronic component to dissipate heat. The heat sink generally includes a heat absorbing plate and heat sink fins disposed on the heat absorbing plate. The heat absorbing plate is made of a metal material having good thermal conductivity such as copper or aluminum, but the metal plate is subject to the limited heat conduction of the material itself. If the electronic component of the heat 1 is generated, the heat resistance is generated and the heat dissipation is not achieved. , affect the operational stability of electronic components. In order to improve the efficiency of the heat sink, the industry also adopts a cavity in the heat absorbing plate. The cavity is filled with working fluid such as water and ethanol, and the phase change of the working fluid is used to increase the heat transfer speed. During operation, the working fluid is vaporized by heat in the endothermic zone of the heat absorbing plate to the heat release zone of the heat absorbing plate and then cooled and liquefied. In order to allow the liquefied working fluid to flow back to the heat absorbing zone of the heat absorbing plate more quickly, the heat absorbing plate is further provided with a capillary structure around the periphery of the cavity. The capillary structure is generally divided into three types: powder sintered capillary structure, mesh capillary structure, and groove capillary structure. The liquefied working fluid is returned to the heat generating zone in the capillary structure to participate in the phase change cycle. However, under the trend of miniaturization of electronic components and high heat flux trend 200928689, the heat sink for heat dissipation also needs to be miniaturized and highly efficient, and the heat sink with a common capillary structure inside is difficult to achieve the desired heat dissipation effect. To meet the cooling needs of increasingly miniaturized and high heat flow electronic components, the heatsink needs to be further optimized. SUMMARY OF THE INVENTION It is necessary to provide a phase change heat sink with high heat dissipation efficiency. A heat sink includes a heat absorbing body and a heat dissipating body disposed on the heat absorbing body, the heat absorbing body includes a heat absorbing plate and a cover plate connected to the heat radiating body, and a cavity between the heat absorbing plate and the cover plate The cavity is filled with a working fluid, the heat absorbing plate is combined with a first capillary structure layer, the cover plate is combined with a second capillary structure layer, and a plurality of vessels are connected between the heat absorbing plate and the cover plate to connect the first a capillary structure layer and a second capillary structure layer. Compared with the prior art, the heat collecting body is disposed between the suction and the hot plate and the cover plate and communicates with the second capillary structure layer of the cover plate and the first capillary structure layer of the heat absorption plate. Therefore, the working fluid condensed and liquefied at the cover plate is quickly returned to the heat absorbing plate to participate in the phase change cycle. [Embodiment] As shown in FIG. 1 to FIG. 3, the heat sink of the present invention comprises a heat absorbing body 10 and a plurality of heat dissipating fins 30 disposed on the heat absorbing body 10. A four-pulse 170 is disposed in the heat absorbing body 10. The heat absorbing body 10 includes a box body 110 and a cover plate 150 that is sealed on the opening of the box body 110. Referring to FIG. 4 and FIG. 5 at the same time, the housing 110 includes a rectangular receiving slot 111 and a flange 112 extending from the receiving slot 111. The pocket 111 has a rectangular heat absorbing plate 11 3 and four side walls 114 extending from the periphery of the heat absorbing plate 11 3 . The peripheral portion of the cover plate 150 is sealingly attached to the flange 11 2 to form a closed cavity 180 in the heat absorbing plate 10. The chamber 180 is filled with a quantity of working fluid.容 The cavity 111 is provided with a first capillary structure layer 116. The first capillary structure layer 116 covers the heat absorbing plate 11 3 and the four side walls 114 of the cavity 111. The first capillary structure layer 116 is formed by sintering a metal powder. It can be understood that the first capillary structure layer 116 can also be made of a metal mesh wire or grooved on the heat absorption plate 113 and the side wall 114. A second capillary structure layer 156 is disposed on the cover plate 150. D. The second capillary structure layer 156 covers the cover plate 150 corresponding to the cavity 180 portion. The second capillary structure layer 156 is made of a metal mesh. It is to be understood that the second capillary structure layer 16 can also be sintered from a metal powder or grooved in the cover plate 150. In the present invention, the first capillary structure layer 116 may be the same as or different from the second capillary structure layer 156. The second capillary structure layer 156 is in close contact with the lower surface of the cover plate 150. The second capillary structure layer 156 is in contact with the first capillary structure layer 116, and the capillary structure of the two capillary structure layers is in communication, and the working fluid can enter the first capillary structure layer from the second 8 200928689 capillary structure layer] 11 6. The 129 1 1 heat absorbing plate H 1 S is placed in the cavity 180 between the ^ 3 and the cover plate 150. The quadruple tube 170 is arranged in the cavity 180 in the form of a mesh or fiber. The vessel 170 is made of metal, | looking for material, and its wall (not labeled) is formed on the wall, and, j, = small pores, a central through hole is formed inside (unsinked, "vehicle" The cross section of the 17 为 is a circular ring, and the outer diameter of the outer diameter is substantially smaller than the distance between the first and second capillary structure layers 116 and 156, so that the vascular tube 170 is vertically oriented. The first and second capillary structure layers 116, 156 are in contact with each other, and the capillary structure is in communication with each other. 'The working fluid can flow between the vessel 170, the first capillary structure layer 116 and the second capillary structure layer 156. The vessel 170 is bent in an L shape, having a first capillary section (not labeled) located in the middle of the heat absorbing plate 113 and a second capillary section (not labeled) extending outward from the first capillary section, the second hair The thin section is located at a side of the heat absorbing plate 113. The first capillary section of the two vessels 170 is in a straight line and parallel to the first capillary structure of the other two vessels 170. The second of the two vessels 170 The capillary section is in a straight line and parallel to the second capillary structure of the other two vessels 17〇 It can be understood that the first capillary segments of the four face tubes 170 are parallel to each other, and the second capillary segments of the four vessels 170 are parallel to each other. The bottom of each of the fins 30 has a folded edge. The folded edge of the plurality of fins 30 forms a contact surface that is combined with the cover plate 150. In use, the housing 110 is accommodated in the heat sink of the heat sink. The heat is vaporized into steam and rises to the cover working fluid. At the cover plate 150, the heat is released by the cold liquid. The heat is transferred to the working fluid of the fin 30 to pass through the first capillary structure layer 156. 116 and the vessel 170 flow to the heat absorbing plate 113 for ringing. Θ Compared with the prior art, the heat absorbing body 10 170 is located between the heat absorbing plate 113 and the cover plate 150 and the second capillary structure layer of the cover plate 150. 15 6 and the first capillary structure layer 116 located at 11 3 , so that the working fluid condensed and liquefied in the cover is quickly returned to the heat absorption plate and the phase change cycle. In addition, the first portion of the pulse tube 170 is in the middle of the heat absorption plate 11 3 . And the second capillary section is on the side of the hot plate 11 3, thereby making it The present invention is described in which the heat absorbing plate 113 is fluidly collected through the vascular tube 170 to the heat absorbing plate portion to facilitate the faster transfer of the phase change cycle of the heat absorbing plate 11 from the electronic component through the working fluid. Patent applications are filed in accordance with the requirements of the invention patents. However, the above description is only for the embodiments of the present invention. Those who are familiar with the art of the present invention should be included in the scope of the patent. The plate 11 3 acts as a fluid from the L plate 150 and is cooled to go. The liquid-capillary phase change is set to the vascular communication at the 113 of the heat absorbing plate 150 at the pilating section at the suction side 113 The heat of the piece! Go. According to the present invention, the following claims are applied. 200928689 [Simplified Schematic] FIG. 1 is an exploded perspective view of a heat sink of the present invention. 2 is a perspective assembled view of the heat sink of the present invention. Figure 3 is an inverted view of Figure 2. Figure 4 is a cross-sectional view of the heat sink of Figure 2 taken along line iv - IV. Fig. 5 is an enlarged schematic view showing a portion V of the circle in Fig. 4. [Main component symbol description] 〇° and hot body 10 box groove in the hem and hot plate 113 side wall first capillary structure layer 116 cover second capillary structure layer 156 vascular cavity 180 ligature 110 112 114 150 170 30 11